JP6406922B2 - Circuit board storage device - Google Patents
Circuit board storage device Download PDFInfo
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- JP6406922B2 JP6406922B2 JP2014169326A JP2014169326A JP6406922B2 JP 6406922 B2 JP6406922 B2 JP 6406922B2 JP 2014169326 A JP2014169326 A JP 2014169326A JP 2014169326 A JP2014169326 A JP 2014169326A JP 6406922 B2 JP6406922 B2 JP 6406922B2
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- liquid
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- 229910000679 solder Inorganic materials 0.000 claims description 45
- 239000007788 liquid Substances 0.000 claims description 29
- 230000004308 accommodation Effects 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 238000009434 installation Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 235000013361 beverage Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003204 osmotic effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
本発明は、電子部品が実装された回路基板収容装置に関するものである。 The present invention relates to a circuit board housing device on which electronic components are mounted.
電子部品が実装された回路基板収容装置は、例えば、車載用カメラ装置や車両組み込み型車載器等として広く利用されている（例えば特許文献１，特許文献２）。 A circuit board housing device on which electronic components are mounted is widely used, for example, as an in-vehicle camera device or a vehicle-mounted in-vehicle device (for example, Patent Document 1 and Patent Document 2).
このような回路基板収容装置には、万が一、回路基板収容装置に水分がかかった際に、水分を筐体の内部に侵入させない機能が実装されている。例えば、特許文献１に記載された車載用カメラ装置にあっては、筐体からケーブルを引き出す部位に、弾性材からなる防水パッキンを備えている。 Such a circuit board housing device is provided with a function of preventing moisture from entering the inside of the housing when the circuit board housing device is wet. For example, in the in-vehicle camera device described in Patent Document 1, a waterproof packing made of an elastic material is provided at a site where a cable is drawn from a housing.
また、万が一、回路基板収容装置に水分が侵入してしまったときに、侵入した水分を排水する機能を備えたものも提案されている。例えば、特許文献２に記載された車両組み込み型車載器にあっては、筐体に排水用開口部を設けて、筐体に侵入した水分をこの開口部から排水している。 In addition, there has been proposed a device having a function of draining the intruded moisture when the moisture has entered the circuit board housing device. For example, in the vehicle built-in vehicle-mounted device described in Patent Document 2, an opening for drainage is provided in the casing, and moisture that has entered the casing is drained from the opening.
しかしながら、特許文献１の車載用カメラ装置にあっては、水分の侵入を防止するために防水パッキンを設置する必要があり、必要な部品点数が増加してコストの上昇を招いていた。また、特許文献２の車両組み込み型車載器にあっては、筐体内部に侵入した水を、筐体に形成した開口部から排水する構造であるため、開口部が下方に位置するように筐体を設置する必要があった。即ち、筐体の設置位置に制約があった。 However, in the in-vehicle camera device of Patent Document 1, it is necessary to install a waterproof packing in order to prevent moisture from entering, which increases the number of necessary components and causes an increase in cost. In addition, the vehicle-mounted in-vehicle device of Patent Document 2 has a structure in which water that has entered the inside of the housing is drained from an opening formed in the housing, so that the housing is positioned so that the opening is positioned below. I needed to set up my body. That is, there is a restriction on the installation position of the housing.
回路基板を保護する筐体内部への液体の侵入に対する措置には、散水や噴流のように高い圧力の液体に晒されることに対する措置のみでなく、浸透圧によって、液体が部品の隙間から染み込むことに対する措置が必要である。そして、例えば、車室内に設置される、電子部品が実装された回路基板を収容した筐体には、散水や噴流の侵入を防ぐ措置を講じる必要性は低く、結露で生じた水滴や、乗員がこぼした飲料等の染み込みを防止することができれば十分である。そして、このような液体の染み込みを防止する措置は、コストの上昇や、筐体の設置方向に制約を与えることなく行えるのが望ましい。 Measures against the intrusion of liquid into the housing that protects the circuit board include not only measures against exposure to high pressure liquids such as water sprays and jets, but also penetration of liquids through the gaps between components due to osmotic pressure. Measures are needed. And, for example, it is not necessary to take measures to prevent intrusion of water or jets in a housing that houses a circuit board mounted with electronic components installed in a passenger compartment. It is sufficient if it is possible to prevent infiltration of spilled beverages and the like. And it is desirable that such measures for preventing the liquid from permeating can be performed without increasing the cost and restricting the installation direction of the housing.
本発明は、このような従来の問題点に鑑みなされたもので、回路基板を保護する筐体内部に染み込んだ液体が、回路素子に到達するのを防止する回路基板収容装置を提供することを目的としている。 The present invention has been made in view of such conventional problems, and it is intended to provide a circuit board housing device that prevents a liquid soaked in a housing protecting a circuit board from reaching a circuit element. It is aimed.
前記課題を解決するために、本発明は、密閉状態に固定される上部筐体と下部筐体と、前記上部筐体と前記下部筐体との間に、回路素子が実装された回路基板を挟んで固定する挟持部と、を有する回路基板収容装置において、前記回路基板の表面に、前記挟持部の近傍位置に、前記挟持部に沿った閉形状をなす半田堰止め部を形成し、前記半田堰止め部は、先細形状をなす半田盛りで形成され、前記近傍位置とは、前記半田盛りが液体を引き寄せる力が、前記挟持部から前記回路基板に染み込んだ液体の表面張力よりも小さくなる位置であることを特徴とする。 In order to solve the above problems, the present invention provides an upper housing and a lower housing fixed in a sealed state, and a circuit board on which a circuit element is mounted between the upper housing and the lower housing. sandwiched therebetween the circuit board accommodating apparatus having a clamping portion, the for fixing, to the surface of the circuit board, in the vicinity of the clamping portion to form a solder dam stop portion forming a closed shape along the clamping portion, the The solder damming portion is formed of a taper-shaped solder heap, and the vicinity position is that the force by which the solder heap draws the liquid is smaller than the surface tension of the liquid that has penetrated the circuit board from the clamping portion. It is a position .
本発明に係る回路基板収容装置によれば、回路基板収容装置の内部に染み込んだ液体を半田堰止め部が堰き止めるため、簡単な構造で、回路基板収容装置の内部に染み込んだ液体による電子回路の短絡の発生を防止して、回路素子を保護することができる。 According to the circuit board housing device of the present invention, since the solder damming unit dams the liquid soaked into the circuit board housing device, the electronic circuit with the liquid soaked into the circuit board housing device has a simple structure. The occurrence of a short circuit can be prevented, and the circuit element can be protected.
以下、本発明の回路基板収容装置の具体的な実施形態について、図面を参照して説明する。 Hereinafter, specific embodiments of a circuit board housing device of the present invention will be described with reference to the drawings.
まず、図１、および、図２（ａ），（ｂ）を用いて、回路基板収容装置１０の全体構成について説明する。図１は、本発明の一実施形態である回路基板収容装置１０の分解斜視図である。図２（ａ）は、回路基板収容装置１０の内部構造を示す、図１のＡ−Ａ断面図である。図２（ｂ）は、回路基板収容装置１０の内部構造を示す、図１のＢ−Ｂ断面図である。図２（ｃ）は、回路基板収容装置１０に収容された回路基板２０の平面図である。
［全体構成の説明］
First, the overall configuration of the circuit board housing device 10 will be described with reference to FIG. 1 and FIGS. 2 (a) and 2 (b). FIG. 1 is an exploded perspective view of a circuit board housing device 10 according to an embodiment of the present invention. FIG. 2A is a cross-sectional view taken along the line AA of FIG. 1 showing the internal structure of the circuit board housing device 10. FIG. 2B is a cross-sectional view taken along the line BB in FIG. 1, showing the internal structure of the circuit board housing device 10. FIG. 2C is a plan view of the circuit board 20 accommodated in the circuit board accommodation apparatus 10.
[Description of overall configuration]
回路基板収容装置１０は、図１に示すように、上部筐体１２と下部筐体１４と回路基板２０とからなる。上部筐体１２は樹脂等で成形された中空の箱状体であり、下部筐体１４は樹脂等で成形された板状体である。また、回路基板２０は、一般的に使用されているプリント基板である。 As shown in FIG. 1, the circuit board housing apparatus 10 includes an upper housing 12, a lower housing 14, and a circuit board 20. The upper housing 12 is a hollow box-shaped body formed of resin or the like, and the lower housing 14 is a plate-shaped body formed of resin or the like. The circuit board 20 is a commonly used printed board.
回路基板２０の表面には、電子回路を形成する複数の回路素子２２ａが実装されている。そして、回路基板２０の表面には、回路基板２０の周囲に亘る閉形状をなして、高さ方向に向かって先細形状を呈する半田盛り２４ａが形成されている。そして、半田盛り２４ａの内側に、複数の回路素子２２ａが実装されている。半田盛り２４ａの作用については後述する。なお、後述するように、回路基板２０は両面基板であり、裏面側にも回路基板２０の周囲に亘る閉形状をなす半田盛り２４ｂ（図２（ｂ））が形成されて、この半田盛り２４ｂの内側に、回路素子２２ｂ（図２（ｂ））が実装されている。 A plurality of circuit elements 22 a forming an electronic circuit are mounted on the surface of the circuit board 20. On the surface of the circuit board 20, a solder pile 24 a is formed that has a closed shape extending around the circuit board 20 and has a tapered shape in the height direction. A plurality of circuit elements 22a are mounted inside the solder pile 24a. The operation of the solder pile 24a will be described later. As will be described later, the circuit board 20 is a double-sided board, and a solder pile 24b (FIG. 2B) having a closed shape is formed around the circuit board 20 on the back side, and this solder pile 24b. The circuit element 22b (FIG. 2B) is mounted on the inner side.
上部筐体１２の下端には回路基板２０の外縁が嵌め込まれる。そして、回路基板２０は、さらに下部筐体１４の外縁によって挟み込まれる。すなわち、上部筐体１２の下端と下部筐体１４の外縁とは挟持部１６を形成しており、回路基板２０は、この挟持部１６によって挟み込まれる。 The outer edge of the circuit board 20 is fitted into the lower end of the upper housing 12. The circuit board 20 is further sandwiched between the outer edges of the lower housing 14. That is, the lower end of the upper housing 12 and the outer edge of the lower housing 14 form a sandwiching portion 16, and the circuit board 20 is sandwiched by the sandwiching portion 16.
そして、下部筐体１４の四隅は、それぞれビス１８によって上部筐体１２と螺合される。この螺合によって、回路基板２０は挟持部１６に保持固定される。
［回路基板の構造の説明］
Then, the four corners of the lower housing 14 are screwed to the upper housing 12 by screws 18 respectively. The circuit board 20 is held and fixed to the clamping unit 16 by this screwing.
[Description of circuit board structure]
次に、図２（ａ）から図２（ｃ）を用いて、回路基板２０の構造について説明する。回路基板２０には、図２（ｂ）に示すように、複数の回路素子２２ａ，２２ｂが実装されて、所定の機能を実現する電子回路が形成されている。 Next, the structure of the circuit board 20 will be described with reference to FIGS. On the circuit board 20, as shown in FIG. 2B, a plurality of circuit elements 22a and 22b are mounted to form an electronic circuit that realizes a predetermined function.
また、図２（ａ），（ｂ）に示すように、回路基板２０の外縁は、全周に亘って挟持部１６に挟まれて固定されている。 As shown in FIGS. 2A and 2B, the outer edge of the circuit board 20 is sandwiched and fixed by the sandwiching portion 16 over the entire circumference.
なお、回路素子２２ａは、図２（ｃ）に示すように、回路基板２０の表面に形成された半田盛り２４ａの内側の領域に実装されている。また、回路基板２０の裏面に形成された半田盛り２４ｂ（図２（ｂ））の内側の領域には、回路素子２２ｂ（図２（ｂ））が実装されている。
［実施例１の作用の説明］
As shown in FIG. 2C, the circuit element 22a is mounted in a region inside the solder pile 24a formed on the surface of the circuit board 20. A circuit element 22b (FIG. 2B) is mounted in a region inside the solder pile 24b (FIG. 2B) formed on the back surface of the circuit board 20.
[Description of Operation of Example 1]
次に、図３を用いて、実施例１の作用について説明する。図３は、回路基板収容装置１０における回路基板２０の固定構造を示す詳細図であり、図２（ｂ）に示した断面図をより詳細に描いたものである。この図３は、上部筐体１２または下部筐体１４の外面に付着した水３０（液体）が、挟持部１６と回路基板２０の間に生じた隙間３２ａ，３２ｂから、回路基板収容装置１０の内部に侵入する様子を示している。 Next, the effect | action of Example 1 is demonstrated using FIG. FIG. 3 is a detailed view showing the fixing structure of the circuit board 20 in the circuit board housing apparatus 10, and is a more detailed drawing of the cross-sectional view shown in FIG. 3 shows that the water 30 (liquid) adhering to the outer surface of the upper housing 12 or the lower housing 14 is formed from the gaps 32a and 32b formed between the sandwiching portion 16 and the circuit board 20 in the circuit board housing device 10. It shows a state of intrusion inside.
図３において、上部筐体１２または下部筐体１４の表面に付着した水３０（液体）は、水３０の表面張力によって生じる毛細管現象によって、挟持部１６と回路基板２０の間に生じた微小な隙間３２ａ，３２ｂの内部に染み込み、回路基板２０の表面および裏面に沿って移動する。即ち、図３に示す矢印ａ，矢印ｂ，矢印ｄ，矢印ｆに沿って、回路基板２０の表面を移動する。また、矢印ａ，矢印ｂ，矢印ｃ，矢印ｅに沿って、回路基板２０の裏面を移動する。そして、水３０は、隙間３２ａ，３２ｂを通過した後、さらに、回路素子２２ａ，２２ｂに向かって移動する。 In FIG. 3, the water 30 (liquid) adhering to the surface of the upper housing 12 or the lower housing 14 is a minute amount generated between the sandwiching portion 16 and the circuit board 20 due to capillary action caused by the surface tension of the water 30. It penetrates into the gaps 32a and 32b and moves along the front and back surfaces of the circuit board 20. That is, the surface of the circuit board 20 is moved along the arrows a, b, d, and f shown in FIG. Further, the rear surface of the circuit board 20 is moved along the arrows a, b, c, and e. Then, after passing through the gaps 32a and 32b, the water 30 further moves toward the circuit elements 22a and 22b.
このようにして移動した水３０（液体）は、挟持部１６の近傍位置Ｐａ，Ｐｂに形成された、高さ方向に向かって先細形状を呈する半田盛り２４ａ，２４ｂに突き当たり、この半田盛り２４ａ，２４ｂよって堰き止められる。これによって、水３０の回路素子２２ａ，２２ｂへの到達が防止される。 The water 30 (liquid) thus moved hits the solder piles 24a and 24b which are formed in the vicinity of the sandwiching portion 16 at the positions Pa and Pb and have a tapered shape in the height direction. It is blocked by 24b. This prevents the water 30 from reaching the circuit elements 22a and 22b.
なお、図３において、半田盛り２４ａ，２４ｂが形成される挟持部１６の近傍位置Ｐａ，Ｐｂは、ともに、上部筐体１２または下部筐体１４の内面から距離ｍの位置に設定される。この距離ｍは、隙間３２ａ，３２ｂに染み込んだ水３０（液体）の表面張力よりも、半田盛り２４ａ，２４ｂが水３０（液体）を引き寄せる力の方が小さくなる位置に設定される。半田盛り２４ａ，２４ｂの位置をこのように設定することによって、挟持部１６から回路基板２０に染み込んだ水３０（液体）は、半田盛り２４ａ，２４ｂに引き込まれにくくなる。なお、水３０（液体）の表面張力は、隙間３２ａ，３２ｂの大きさに依存するため、予め、実際に使用する上部筐体１２，下部筐体１４によって回路基板２０を挟持して、実験等により適切な距離ｍの設定値を求めておく。 In FIG. 3, the positions Pa and Pb in the vicinity of the sandwiching portion 16 where the solder bumps 24 a and 24 b are formed are both set at a distance m from the inner surface of the upper housing 12 or the lower housing 14. This distance m is set at a position where the force of the solder heaps 24a and 24b attracting the water 30 (liquid) becomes smaller than the surface tension of the water 30 (liquid) soaked into the gaps 32a and 32b. By setting the positions of the solder heaps 24a and 24b in this way, the water 30 (liquid) that has soaked into the circuit board 20 from the sandwiching portion 16 is less likely to be drawn into the solder heaps 24a and 24b. Since the surface tension of the water 30 (liquid) depends on the size of the gaps 32a and 32b, the circuit board 20 is sandwiched between the upper casing 12 and the lower casing 14 that are actually used in advance, and experiments are performed. Thus, an appropriate set value of the distance m is obtained.
なお、半田盛り２４ａ，２４ｂの高さＨは、隙間３２ａ，３２ｂの高さｈと比べて、Ｈ＞ｈとなるように形成されている。したがって、挟持部１６に生じた隙間３２ａ，３２ｂを通過して染み出した水３０（液体）を、半田盛り２４ａ（２４ｂ）で確実に堰き止めることができる。 In addition, the height H of the solder piles 24a and 24b is formed so that H> h as compared with the height h of the gaps 32a and 32b. Therefore, the water 30 (liquid) that has oozed out through the gaps 32a and 32b generated in the sandwiching portion 16 can be reliably dammed by the solder heap 24a (24b).
ここで、半田盛り２４ａ，２４ｂは、回路基板２０に形成された電子回路のグランド（ＧＮＤ）を兼ねる構成としてもよい。 Here, the solder piles 24a and 24b may be configured to also serve as the ground (GND) of the electronic circuit formed on the circuit board 20.
以上説明したように、実施例１に係る回路基板収容装置１０は、密閉状態に固定される上部筐体１２と下部筐体１４と、上部筐体１２と下部筐体１４との間に、回路素子２２ａ，２２ｂが実装された回路基板２０を挟んで固定する挟持部１６と、を有して、回路基板２０の表面に、挟持部１６の近傍位置Ｐａに、挟持部１６に沿った閉形状をなす半田堰止め部２４ａを形成するため、回路基板収容装置１０の外部から内部へ染み込んだ（浸透した）水３０（液体）を半田堰止め部２４ａで堰き止めることができる。したがって、簡単な構造で、染み込んだ水３０（液体）が回路素子２２ａ，２２ｂに到達するのを防止することができる。 As described above, the circuit board housing device 10 according to the first embodiment includes a circuit between the upper housing 12 and the lower housing 14 that are fixed in a sealed state, and the upper housing 12 and the lower housing 14. And a sandwiching portion 16 that sandwiches and fixes the circuit board 20 on which the elements 22a and 22b are mounted, and has a closed shape along the sandwiching section 16 at a position Pa in the vicinity of the sandwiching section 16 on the surface of the circuit board 20. In order to form the solder damming portion 24a, the water 30 (liquid) that has penetrated (infiltrated) from the outside to the inside of the circuit board housing device 10 can be dammed by the solder damming portion 24a. Therefore, it is possible to prevent the soaked water 30 (liquid) from reaching the circuit elements 22a and 22b with a simple structure.
また、実施例１に係る回路基板収容装置１０によれば、半田堰止め部２４ａは、先細形状をなす半田盛り２４ａで形成されるため、半田堰止め部２４ａが壁状に形成されることによって、染み込んだ水３０（液体）を効果的に堰き止めることができる。なお、半田に熱を加えると、溶融して、半田自身の表面張力により、先端が先細形状に形成されるため、先細形状を形成するために特別な操作を行う必要はない。 Further, according to the circuit board housing device 10 according to the first embodiment, the solder damming portion 24a is formed by the taper-shaped solder heap 24a, so that the solder damming portion 24a is formed in a wall shape. The soaked water 30 (liquid) can be effectively dammed up. When heat is applied to the solder, it melts and the tip is formed into a tapered shape due to the surface tension of the solder itself, so that no special operation is required to form the tapered shape.
そして、実施例１に係る回路基板収容装置１０によれば、近傍位置Ｐａ（Ｐｂ）は、半田盛り２４ａ（２４ｂ）が水３０（液体）を引き寄せる力が、挟持部１６から回路基板２０に染み込んだ水３０（液体）の表面張力よりも小さくなる位置であるため、回路基板２０に染み込んだ水３０（液体）が半田盛り２４ａ（２４ｂ）に吸い寄せられにくくなるため、水３０（液体）の染み込み（浸透）が促進されるのを防止することができる。 According to the circuit board housing device 10 according to the first embodiment, the vicinity position Pa (Pb) is soaked into the circuit board 20 from the clamping part 16 by the force that the solder heap 24a (24b) draws the water 30 (liquid). Since the position is smaller than the surface tension of the water 30 (liquid), it is difficult for the water 30 (liquid) soaked into the circuit board 20 to be sucked into the solder pile 24a (24b). It is possible to prevent (penetration) from being promoted.
さらに、実施例１に係る回路基板収容装置１０によれば、半田盛り２４ａ（２４ｂ）は、回路基板２０の両面に形成するため、回路基板２０の表面側のみならず、裏面側に染み込んだ水３０（液体）も堰き止めることができる。 Furthermore, according to the circuit board housing device 10 according to the first embodiment, the solder piles 24a (24b) are formed on both surfaces of the circuit board 20, so that water soaked not only on the front surface side of the circuit board 20 but also on the back surface side. 30 (liquid) can also be dammed up.
また、実施例１に係る回路基板収容装置１０によれば、半田盛り２４ａ（２４ｂ）の高さＨは、挟持部１６に生じる、上部筐体１２と回路基板２０との隙間３２ａの高さｈ、および下部筐体１４と回路基板２０との隙間３２ｂの高さｈ、よりも高く形成されるため、挟持部１６から回路基板２０に染み込んだ水３０（液体）を、半田盛り２４ａ（２４ｂ）で確実に堰き止めることができる。 Further, according to the circuit board housing device 10 according to the first embodiment, the height H of the solder pile 24a (24b) is the height h of the gap 32a between the upper housing 12 and the circuit board 20 generated in the sandwiching portion 16. And the height 30 of the gap 32b between the lower housing 14 and the circuit board 20 is formed to be higher than the height h, so that the water 30 (liquid) soaked into the circuit board 20 from the clamping part 16 is poured into the solder piles 24a (24b). Can be surely dammed.
そして、実施例１に係る回路基板収容装置１０によれば、回路素子２２ａ（２２ｂ）は、閉形状に形成された半田盛り２４ａ（２４ｂ）の内側に実装されるため、回路素子２２ａ（２２ｂ）の実装範囲を半田盛り２４ａ（２４ｂ）の内側の範囲を上限として拡大することができるため、回路素子２２ａ（２２ｂ）のレイアウトの自由度が向上する。 And according to the circuit board accommodating apparatus 10 which concerns on Example 1, since the circuit element 22a (22b) is mounted inside the solder pile 24a (24b) formed in the closed shape, the circuit element 22a (22b) The mounting range of the circuit element 22a (22b) can be expanded with the inner range of the solder pile 24a (24b) as the upper limit, and the degree of freedom of layout of the circuit element 22a (22b) is improved.
さらに、実施例１に係る回路基板収容装置１０によれば、回路基板２０に実装された電子回路のグランド（ＧＮＤ）を兼ねるため、半田盛り２４ａ（２４ｂ）を、染み込んだ水３０（液体）の堰き止めのみならず、回路基板２０に実装された電子回路の構成要素として兼用することができる。 Furthermore, according to the circuit board housing apparatus 10 according to the first embodiment, the solder pile 24a (24b) is soaked in the water 30 (liquid) soaked with the solder pile 24a (24b) in order to double as the ground (GND) of the electronic circuit mounted on the circuit board 20. In addition to damming, it can also be used as a component of an electronic circuit mounted on the circuit board 20.
なお、実施例１においては、図１に示すように、上部筐体１２と下部筐体１４は、四隅をビス１８によって螺合したが、このビス１８は、回路基板２０を貫通させて、上部筐体１２と下部筐体１４とを螺合する構造にしてもよい。 In the first embodiment, as shown in FIG. 1, the upper housing 12 and the lower housing 14 are screwed at the four corners with screws 18. The housing 12 and the lower housing 14 may be screwed together.
以上、この発明の実施例を図面により詳述してきたが、実施例はこの発明の例示にしか過ぎないものであるため、この発明は実施例の構成にのみ限定されるものではなく、この発明の要旨を逸脱しない範囲の設計の変更等があってもこの発明に含まれることは勿論である。 Although the embodiments of the present invention have been described in detail with reference to the drawings, the embodiments are only examples of the present invention, and the present invention is not limited to the configurations of the embodiments. Needless to say, design changes and the like within a range not departing from the gist of the invention are included in the present invention.
１０ 回路基板収容装置
１２ 上部筐体
１４ 下部筐体
１６ 挟持部
２０ 回路基板
２２ａ，２２ｂ 回路素子
２４ａ，２４ｂ 半田盛り
３０ 水（液体）
３２ａ，３２ｂ 隙間
Ｐａ，Ｐｂ 近傍位置
DESCRIPTION OF SYMBOLS 10 Circuit board accommodation apparatus 12 Upper housing | casing 14 Lower housing | casing 16 Clamping part 20 Circuit board 22a, 22b Circuit element 24a, 24b Solder pile 30 Water (liquid)
32a, 32b Clearance Pa, Pb nearby position
Claims (5)
前記回路基板の表面に、前記挟持部の近傍位置に、前記挟持部に沿った閉形状をなす半田堰止め部を形成し、
前記半田堰止め部は、先細形状をなす半田盛りで形成され、
前記近傍位置とは、前記半田盛りが液体を引き寄せる力が、前記挟持部から前記回路基板に染み込んだ液体の表面張力よりも小さくなる位置であることを特徴とする回路基板収容装置。 A circuit board having an upper casing and a lower casing fixed in a hermetically sealed state, and a sandwiching portion that fixes the circuit board on which a circuit element is mounted between the upper casing and the lower casing. In the containment device,
On the surface of the circuit board, a solder damming portion that forms a closed shape along the clamping portion is formed at a position near the clamping portion ,
The solder damming portion is formed of a taper-shaped solder pile,
The vicinity position is a position where the force that attracts the liquid from the solder pile is smaller than the surface tension of the liquid that has soaked into the circuit board from the clamping portion .
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