JP6342896B2 - タイヤパッチにおける圧電素子のための1アップ1ダウン接続構造体 - Google Patents
タイヤパッチにおける圧電素子のための1アップ1ダウン接続構造体 Download PDFInfo
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- JP6342896B2 JP6342896B2 JP2015528448A JP2015528448A JP6342896B2 JP 6342896 B2 JP6342896 B2 JP 6342896B2 JP 2015528448 A JP2015528448 A JP 2015528448A JP 2015528448 A JP2015528448 A JP 2015528448A JP 6342896 B2 JP6342896 B2 JP 6342896B2
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- 239000000758 substrate Substances 0.000 claims description 101
- 229910000679 solder Inorganic materials 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 21
- 229920001971 elastomer Polymers 0.000 claims description 9
- 239000000806 elastomer Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 description 15
- 238000007906 compression Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 239000013536 elastomeric material Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
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- 230000007935 neutral effect Effects 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
- B60C23/041—Means for supplying power to the signal- transmitting means on the wheel
- B60C23/0411—Piezoelectric generators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C73/00—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D
- B29C73/04—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D using preformed elements
- B29C73/10—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D using preformed elements using patches sealing on the surface of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C19/00—Tyre parts or constructions not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0491—Constructional details of means for attaching the control device
- B60C23/0493—Constructional details of means for attaching the control device for attachment on the tyre
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2030/00—Pneumatic or solid tyres or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Measuring Fluid Pressure (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Claims (12)
- 基板を含むタイヤ取り付け可能装置であって、前記基板が:
前記基板の第1絶縁層と前記基板の第2絶縁層との間に配置された第1圧電部品であって、第1および第2導電層、ならびに前記第1および第2導電層間に配置されている第1圧電層を含む第1圧電部品と;
前記基板の第1絶縁層と前記基板の第2絶縁層との間に配置された第2圧電部品であって、第3および第4導電層、ならびに前記第3および第4導電層間に配置されている第2圧電層を含む第2圧電部品と;
前記第1および第3導電層に設けられた第1絶縁層ならびに前記第2および第4導電層に設けられた第2絶縁層であって、前記第1及び第2の圧電部品が、前記基板において前記第1絶縁層と前記第2絶縁層との間に配置されるようになっている、前記第1絶縁層ならびに前記第2絶縁層と;
前記第1導電層に電気的に結合された第1導電端子と、前記第2導電層に電気的に結合された第2導電端子と、前記第3導電層に電気的に結合された第3導電端子と、前記第4導電層に電気的に結合された第4導電端子と、を含む複数の導電端子を含む導電端子構造体と
を含み、
前記第1導電端子が前記基板の前記第1絶縁層において露出しており、前記第2導電端子が前記基板の前記第2絶縁層において露出しており、
前記第3導電端子は、前記基板の前記第1絶縁層において露出しており、前記第4導電端子は、前記基板の前記第2絶縁層において露出しており、
前記第1導電端子と前記第2導電端子とは前記基板の対向側に互い違いに露出しており、前記第3導電端子と前記第4導電端子とは前記基板の対向側に互い違いに露出している、前記タイヤ取り付け可能装置。 - 第1半田溜が前記第1導電端子に付随して前記第1絶縁層に形成され、第2半田溜が前記第2導電端子に付随して前記第2絶縁層に形成されている、請求項1に記載のタイヤ取り付け可能装置。
- 前記複数の導電端子が、略直線関係で配置されている、請求項1に記載のタイヤ取り付け可能装置。
- 第3半田溜が前記第3導電端子に付随して前記第1絶縁層に形成され、第4半田溜が前記第4導電端子に付随して前記第2絶縁層に形成されている、請求項1に記載のタイヤ取り付け可能装置。
- 前記複数の導電端子が、それぞれ、導電環帯を含む、請求項1に記載のタイヤ取り付け可能装置。
- 前記第1および第2絶縁層が、FR4から形成されている、請求項1に記載のタイヤ取り付け可能装置。
- タイヤ取り付け可能装置を製造する方法であって:
第1支持棒を基板に整列させて、前記第1支持棒に配置された複数の電気コネクタのそれぞれを、基板に形成された複数の導電端子のそれぞれと整列させる工程を含み、
前記基板が、第1絶縁層および第2絶縁層の間に配置された第1圧電部品と、前記第1絶縁層および前記第2絶縁層の間に配置された第2圧電部品とを含み、
前記第1圧電部材は、第1および第2導電層、ならびに前記第1および第2導電層間に配置されている第1圧電層を含み、
前記第2圧電部品は、第3および第4導電層ならびに前記第3および第4導電層間に配置された第2圧電層を含み、
前記第1および第3の絶縁層は前記第1導電層に設けられ、前記第2および第4の絶縁層は前記第2導電層に設けられ、
前記複数の導電端子が、前記基板の前記第1絶縁層において露出している第1導電層に結合された第1導電端子と、前記基板の前記第2絶縁層において露出している第2導電層に結合された第2導電端子と、前記第1絶縁層において露出している第3導電層に結合された第3導電端子と、前記第2絶縁層において露出している第4導電層に結合された第4導電端子と、を含み、
前記第1導電端子と前記第2導電端子とは前記基板の対向側に互い違いに露出しており、前記第3導電端子と前記第4導電端子とは前記基板の対向側に互い違いに露出しており、
さらに、
前記基板の前記第2絶縁層に形成された、前記第2導電端子に付随する第2半田溜に半田を付与する工程と;
前記第1支持棒に位置する複数の電気コネクタのそれぞれを前記第2導電端子と共に半田付けする工程とを含む方法。 - 前記基板をエラストマー部材に固定する工程であって、前記エラストマー部材がベース部およびメサ部を含み、前記基板を、前記第1支持棒が前記エラストマー部材に埋め込まれるように前記エラストマー部材の前記メサ部に固定する工程をさらに含む、請求項7に記載の方法。
- 前記基板の前記第1絶縁層に形成された、前記第1導電端子に付随する第1半田溜に半田を付与する工程と;
前記第1支持棒に位置する複数の電気コネクタのそれぞれを前記第1導電端子と共に半田付けする工程と
をさらに含む、請求項7に記載の方法。 - 前記第1導電端子に半田付けされた前記電気コネクタに第1導電ポストを固定する工程と;
前記第2導電端子に半田付けされた前記電気コネクタに第2導電ポストを固定する工程と
をさらに含む、請求項9に記載の方法。 - 前記第1および第2導電ポストが第2支持棒を通って延在するように、前記第2支持棒を前記複数の導電端子の上方に位置付けする工程を含む、請求項10に記載の方法。
- プリント回路板が前記第1および第2導電端子と電気的に接続されるように、かつ、前記プリント回路板が前記第1および第2導電ポストによって機械的に支持されるように、前記プリント回路板を前記第1および第2導電ポストに固定する工程を含む、請求項11に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2012/065259 WO2014077816A2 (en) | 2012-11-15 | 2012-11-15 | One up, one down connection structure for piezoelectric device in tire patch |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015533700A JP2015533700A (ja) | 2015-11-26 |
JP6342896B2 true JP6342896B2 (ja) | 2018-06-13 |
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JP2015528448A Expired - Fee Related JP6342896B2 (ja) | 2012-11-15 | 2012-11-15 | タイヤパッチにおける圧電素子のための1アップ1ダウン接続構造体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9780287B2 (ja) |
EP (1) | EP2920009B1 (ja) |
JP (1) | JP6342896B2 (ja) |
KR (1) | KR101696631B1 (ja) |
CN (1) | CN104903125B (ja) |
WO (1) | WO2014077816A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016053347A1 (en) | 2014-10-03 | 2016-04-07 | Compagnie Generale Des Etablissements Michelin | Durable electrical signal connector to isolate mechanical and electrical function |
EP3201014A1 (en) | 2014-10-03 | 2017-08-09 | Compagnie Générale des Etablissements Michelin | Profiled element for durable electrical signal connector |
US11951783B2 (en) * | 2019-08-05 | 2024-04-09 | Bridgestone Americas Tire Operations, Llc | Daisy tire electronics assembly |
CN114340915A (zh) * | 2019-08-05 | 2022-04-12 | 普利司通美国轮胎运营有限责任公司 | 轮胎电子装置组件 |
US11852561B2 (en) | 2021-04-30 | 2023-12-26 | Tekscan, Inc. | Portable tire contact sensors |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000007834A2 (en) | 1998-08-03 | 2000-02-17 | The Goodyear Tire & Rubber Company | Mounting transponders in pneumatic tires |
US7446458B2 (en) * | 2003-09-04 | 2008-11-04 | Nec Corporation | Piezoelectric ceramic element and portable device |
US20050076982A1 (en) | 2003-10-09 | 2005-04-14 | Metcalf Arthur Richard | Post patch assembly for mounting devices in a tire interior |
JP2005331070A (ja) * | 2004-05-21 | 2005-12-02 | Toyota Motor Corp | 制振用圧電素子の取付方法及び圧電式制振装置 |
US20090084480A1 (en) * | 2004-11-12 | 2009-04-02 | Michelin Recherche Et Technique S.A. | Mesa Mount Patch for Mounting A Rigid Structure in a Tire |
CN102077332B (zh) * | 2008-06-26 | 2014-05-14 | 米其林研究和技术股份有限公司 | 具有整体式铜电极的夹层式压电设备 |
WO2010024819A1 (en) * | 2008-08-29 | 2010-03-04 | Societe De Technologie Michelin | 1-d tire apparatus |
US8742265B2 (en) * | 2008-08-29 | 2014-06-03 | Compagnie Generale Des Etablissements Michelin | 1-D tire patch apparatus and methodology |
DE112010001649B4 (de) | 2009-04-15 | 2018-02-08 | Murata Manufacturing Co., Ltd. | Piezoelektrischer Stromerzeuger |
JP2011071389A (ja) | 2009-09-28 | 2011-04-07 | Fujifilm Corp | タイヤ内電力発生装置及び該装置を用いたタイヤモニタリングシステム |
JP5984523B2 (ja) * | 2012-06-15 | 2016-09-06 | キヤノン株式会社 | 振動波駆動装置 |
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2012
- 2012-11-15 JP JP2015528448A patent/JP6342896B2/ja not_active Expired - Fee Related
- 2012-11-15 WO PCT/US2012/065259 patent/WO2014077816A2/en active Application Filing
- 2012-11-15 CN CN201280075506.8A patent/CN104903125B/zh active Active
- 2012-11-15 EP EP12888379.0A patent/EP2920009B1/en active Active
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EP2920009A4 (en) | 2016-08-24 |
KR101696631B1 (ko) | 2017-01-16 |
CN104903125B (zh) | 2018-02-02 |
EP2920009B1 (en) | 2018-01-03 |
WO2014077816A2 (en) | 2014-05-22 |
JP2015533700A (ja) | 2015-11-26 |
CN104903125A (zh) | 2015-09-09 |
US9780287B2 (en) | 2017-10-03 |
US20150249198A1 (en) | 2015-09-03 |
WO2014077816A3 (en) | 2015-08-06 |
KR20150070289A (ko) | 2015-06-24 |
EP2920009A2 (en) | 2015-09-23 |
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