JP6308413B1 - Adhesive, laminate for blister pack and blister pack using the same - Google Patents
Adhesive, laminate for blister pack and blister pack using the same Download PDFInfo
- Publication number
- JP6308413B1 JP6308413B1 JP2017561023A JP2017561023A JP6308413B1 JP 6308413 B1 JP6308413 B1 JP 6308413B1 JP 2017561023 A JP2017561023 A JP 2017561023A JP 2017561023 A JP2017561023 A JP 2017561023A JP 6308413 B1 JP6308413 B1 JP 6308413B1
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- blister pack
- acid
- polyol
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 60
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 60
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 68
- 229920005862 polyol Polymers 0.000 claims abstract description 45
- 150000003077 polyols Chemical class 0.000 claims abstract description 44
- 239000007787 solid Substances 0.000 claims abstract description 36
- 239000004593 Epoxy Substances 0.000 claims abstract description 35
- -1 isocyanate compound Chemical class 0.000 claims abstract description 35
- 239000011888 foil Substances 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 150000001875 compounds Chemical class 0.000 claims abstract description 27
- 239000012948 isocyanate Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 33
- 229920002647 polyamide Polymers 0.000 claims description 22
- 239000004952 Polyamide Substances 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- 239000010410 layer Substances 0.000 abstract description 43
- 239000012790 adhesive layer Substances 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 36
- 238000004519 manufacturing process Methods 0.000 description 26
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 24
- 239000005056 polyisocyanate Substances 0.000 description 17
- 229920001228 polyisocyanate Polymers 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 229920005906 polyester polyol Polymers 0.000 description 16
- 238000000465 moulding Methods 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 239000004677 Nylon Substances 0.000 description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- 229920001778 nylon Polymers 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 10
- 229920002302 Nylon 6,6 Polymers 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- 239000004814 polyurethane Substances 0.000 description 9
- 229920002635 polyurethane Polymers 0.000 description 9
- 229940126062 Compound A Drugs 0.000 description 8
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 8
- 229920002292 Nylon 6 Polymers 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 238000007865 diluting Methods 0.000 description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 235000011007 phosphoric acid Nutrition 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- 238000007667 floating Methods 0.000 description 7
- 235000013305 food Nutrition 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 229920000570 polyether Polymers 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 239000000539 dimer Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920001469 poly(aryloxy)thionylphosphazene Polymers 0.000 description 6
- 150000007519 polyprotic acids Polymers 0.000 description 6
- 229920000915 polyvinyl chloride Polymers 0.000 description 6
- 239000004800 polyvinyl chloride Substances 0.000 description 6
- 150000005846 sugar alcohols Polymers 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 229920000092 linear low density polyethylene Polymers 0.000 description 5
- 239000004707 linear low-density polyethylene Substances 0.000 description 5
- 229920001684 low density polyethylene Polymers 0.000 description 5
- 239000004702 low-density polyethylene Substances 0.000 description 5
- 150000003016 phosphoric acids Chemical class 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical group 0.000 description 4
- 150000002334 glycols Chemical class 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- 239000004708 Very-low-density polyethylene Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 239000002075 main ingredient Substances 0.000 description 3
- 229920001179 medium density polyethylene Polymers 0.000 description 3
- 239000004701 medium-density polyethylene Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- DJZKNOVUNYPPEE-UHFFFAOYSA-N tetradecane-1,4,11,14-tetracarboxamide Chemical compound NC(=O)CCCC(C(N)=O)CCCCCCC(C(N)=O)CCCC(N)=O DJZKNOVUNYPPEE-UHFFFAOYSA-N 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- 229920001866 very low density polyethylene Polymers 0.000 description 3
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- AIFLGMNWQFPTAJ-UHFFFAOYSA-J 2-hydroxypropanoate;titanium(4+) Chemical compound [Ti+4].CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O.CC(O)C([O-])=O AIFLGMNWQFPTAJ-UHFFFAOYSA-J 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004716 Ethylene/acrylic acid copolymer Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- 229920001007 Nylon 4 Polymers 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 2
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 2
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 229920000151 polyglycol Polymers 0.000 description 2
- 239000010695 polyglycol Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000012429 reaction media Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- UFFAFBPZFGAMJJ-UHFFFAOYSA-N (2-methoxy-4,6-dimethylphenyl)boronic acid Chemical compound COC1=CC(C)=CC(C)=C1B(O)O UFFAFBPZFGAMJJ-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- CFQZKFWQLAHGSL-FNTYJUCDSA-N (3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e)-octadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoic acid Chemical compound OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C CFQZKFWQLAHGSL-FNTYJUCDSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- IFPMZBBHBZQTOV-UHFFFAOYSA-N 1,3,5-trinitro-2-(2,4,6-trinitrophenyl)-4-[2,4,6-trinitro-3-(2,4,6-trinitrophenyl)phenyl]benzene Chemical compound [O-][N+](=O)C1=CC([N+](=O)[O-])=CC([N+]([O-])=O)=C1C1=C([N+]([O-])=O)C=C([N+]([O-])=O)C(C=2C(=C(C=3C(=CC(=CC=3[N+]([O-])=O)[N+]([O-])=O)[N+]([O-])=O)C(=CC=2[N+]([O-])=O)[N+]([O-])=O)[N+]([O-])=O)=C1[N+]([O-])=O IFPMZBBHBZQTOV-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- XAUQWYHSQICPAZ-UHFFFAOYSA-N 10-amino-decanoic acid Chemical compound NCCCCCCCCCC(O)=O XAUQWYHSQICPAZ-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- BLDFSDCBQJUWFG-UHFFFAOYSA-N 2-(methylamino)-1,2-diphenylethanol Chemical compound C=1C=CC=CC=1C(NC)C(O)C1=CC=CC=C1 BLDFSDCBQJUWFG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- IAXFZZHBFXRZMT-UHFFFAOYSA-N 2-[3-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=CC(OCCO)=C1 IAXFZZHBFXRZMT-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 description 1
- YIKVZDICBNEEOZ-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphite Chemical compound CCCCC(CC)COP(O)O YIKVZDICBNEEOZ-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- FQLAJSQGBDYBAL-UHFFFAOYSA-N 3-(azepane-1-carbonyl)benzamide Chemical compound NC(=O)C1=CC=CC(C(=O)N2CCCCCC2)=C1 FQLAJSQGBDYBAL-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- CZBUAXFTIJHYCN-UHFFFAOYSA-N 3-[methoxy-[(2-methylpropan-2-yl)oxy]silyl]propan-1-amine Chemical compound NCCC[SiH](OC(C)(C)C)OC CZBUAXFTIJHYCN-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- TUZMHNASXCXMBO-UHFFFAOYSA-N 3-methylpentane-2,2-diol Chemical compound CCC(C)C(C)(O)O TUZMHNASXCXMBO-UHFFFAOYSA-N 0.000 description 1
- HSSYVKMJJLDTKZ-UHFFFAOYSA-N 3-phenylphthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C=CC=CC=2)=C1C(O)=O HSSYVKMJJLDTKZ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- QLIQIXIBZLTPGQ-UHFFFAOYSA-N 4-(2-hydroxyethoxy)benzoic acid Chemical compound OCCOC1=CC=C(C(O)=O)C=C1 QLIQIXIBZLTPGQ-UHFFFAOYSA-N 0.000 description 1
- PGGROMGHWHXWJL-UHFFFAOYSA-N 4-(azepane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCC1 PGGROMGHWHXWJL-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- YHTLGFCVBKENTE-UHFFFAOYSA-N 4-methyloxan-2-one Chemical compound CC1CCOC(=O)C1 YHTLGFCVBKENTE-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- XDOLZJYETYVRKV-UHFFFAOYSA-N 7-Aminoheptanoic acid Chemical compound NCCCCCCC(O)=O XDOLZJYETYVRKV-UHFFFAOYSA-N 0.000 description 1
- UQXNEWQGGVUVQA-UHFFFAOYSA-N 8-aminooctanoic acid Chemical compound NCCCCCCCC(O)=O UQXNEWQGGVUVQA-UHFFFAOYSA-N 0.000 description 1
- JXGAUFIBOJVEJJ-UHFFFAOYSA-N 9-(azepan-1-yl)-9-oxononanamide Chemical compound NC(=O)CCCCCCCC(=O)N1CCCCCC1 JXGAUFIBOJVEJJ-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- AMOKUAKXKXBFIW-WJDWOHSUSA-N 9-[(z)-non-3-enyl]-10-octylnonadecanedioic acid Chemical compound OC(=O)CCCCCCCCC(CCCCCCCC)C(CCCCCCCC(O)=O)CC\C=C/CCCCC AMOKUAKXKXBFIW-WJDWOHSUSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 1
- 241000282472 Canis lupus familiaris Species 0.000 description 1
- 101000856236 Clostridium acetobutylicum (strain ATCC 824 / DSM 792 / JCM 1419 / LMG 5710 / VKM B-1787) Butyrate-acetoacetate CoA-transferase subunit B Proteins 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 1
- 238000005698 Diels-Alder reaction Methods 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-N Diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(O)OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 1
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-N Metaphosphoric acid Chemical compound OP(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- DRNPGEPMHMPIQU-UHFFFAOYSA-N O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO Chemical compound O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO DRNPGEPMHMPIQU-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- QMHAHUAQAJVBIW-UHFFFAOYSA-N [methyl(sulfamoyl)amino]methane Chemical compound CN(C)S(N)(=O)=O QMHAHUAQAJVBIW-UHFFFAOYSA-N 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- ZLMKQJQJURXYLC-UHFFFAOYSA-N bis(2-ethylhexoxy)-oxophosphanium Chemical compound CCCCC(CC)CO[P+](=O)OCC(CC)CCCC ZLMKQJQJURXYLC-UHFFFAOYSA-N 0.000 description 1
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
- NIDWMNWHRMHRSQ-UHFFFAOYSA-N butane-1,3-diol;propane-1,3-diol Chemical compound OCCCO.CC(O)CCO NIDWMNWHRMHRSQ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- CERDIVAFXRCORQ-UHFFFAOYSA-O butoxy-hydroxy-oxophosphanium Chemical compound CCCCO[P+](O)=O CERDIVAFXRCORQ-UHFFFAOYSA-O 0.000 description 1
- BNMJSBUIDQYHIN-UHFFFAOYSA-N butyl dihydrogen phosphate Chemical compound CCCCOP(O)(O)=O BNMJSBUIDQYHIN-UHFFFAOYSA-N 0.000 description 1
- MMCOUVMKNAHQOY-UHFFFAOYSA-N carbonoperoxoic acid Chemical class OOC(O)=O MMCOUVMKNAHQOY-UHFFFAOYSA-N 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- LNGJOYPCXLOTKL-UHFFFAOYSA-N cyclopentane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C1 LNGJOYPCXLOTKL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- LXCYSACZTOKNNS-UHFFFAOYSA-N diethoxy(oxo)phosphanium Chemical compound CCO[P+](=O)OCC LXCYSACZTOKNNS-UHFFFAOYSA-N 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- CZHYKKAKFWLGJO-UHFFFAOYSA-N dimethyl phosphite Chemical compound COP([O-])OC CZHYKKAKFWLGJO-UHFFFAOYSA-N 0.000 description 1
- KUMNEOGIHFCNQW-UHFFFAOYSA-N diphenyl phosphite Chemical compound C=1C=CC=CC=1OP([O-])OC1=CC=CC=C1 KUMNEOGIHFCNQW-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- ZUNGGJHBMLMRFJ-UHFFFAOYSA-O ethoxy-hydroxy-oxophosphanium Chemical compound CCO[P+](O)=O ZUNGGJHBMLMRFJ-UHFFFAOYSA-O 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229960003692 gamma aminobutyric acid Drugs 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- SAMYCKUDTNLASP-UHFFFAOYSA-N hexane-2,2-diol Chemical compound CCCCC(C)(O)O SAMYCKUDTNLASP-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- XAKRTGZVYPZHCO-UHFFFAOYSA-O hydroxy-methoxy-oxophosphanium Chemical compound CO[P+](O)=O XAKRTGZVYPZHCO-UHFFFAOYSA-O 0.000 description 1
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- FJXWKBZRTWEWBJ-UHFFFAOYSA-N nonanediamide Chemical compound NC(=O)CCCCCCCC(N)=O FJXWKBZRTWEWBJ-UHFFFAOYSA-N 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- KQJBQMSCFSJABN-UHFFFAOYSA-N octadecan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-] KQJBQMSCFSJABN-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N oxalic acid Substances OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000009512 pharmaceutical packaging Methods 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- VCAFTIGPOYBOIC-UHFFFAOYSA-N phenyl dihydrogen phosphite Chemical compound OP(O)OC1=CC=CC=C1 VCAFTIGPOYBOIC-UHFFFAOYSA-N 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006115 poly(dodecamethylene terephthalamide) Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- MHZDONKZSXBOGL-UHFFFAOYSA-N propyl dihydrogen phosphate Chemical compound CCCOP(O)(O)=O MHZDONKZSXBOGL-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UIERETOOQGIECD-ONEGZZNKSA-N tiglic acid Chemical compound C\C=C(/C)C(O)=O UIERETOOQGIECD-ONEGZZNKSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Laminated Bodies (AREA)
- Wrappers (AREA)
- Packages (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
ポリオール及びエポキシ化合物を含有する主剤と、イソシアネート化合物を含有する硬化剤とを有し、前記主剤中のポリオールとエポキシ化合物の固形分質量比が１００／２０〜１００／６０である接着剤、基材層と金属箔が前記記載の接着剤層を介して積層されたブリスターパック用積層体、及び前記ブリスターパック用積層体を用いたブリスターパック。前記イソシアネート化合物と、前記ポリオールとの固形分質量比は１〜３０の範囲であることが好ましい。An adhesive and a substrate having a main agent containing a polyol and an epoxy compound, and a curing agent containing an isocyanate compound, wherein the solid content mass ratio of the polyol and the epoxy compound in the main agent is 100/20 to 100/60 A blister pack laminate in which a layer and a metal foil are laminated via the adhesive layer described above, and a blister pack using the blister pack laminate. The solid content mass ratio between the isocyanate compound and the polyol is preferably in the range of 1-30.
Description
本発明は、成形加工を施される医薬包装用途などに好適に使用できるブリスターパック用積層体、それに使用する接着剤に関する。 The present invention relates to a laminate for blister packs that can be suitably used for pharmaceutical packaging applications that are subjected to molding processing, and an adhesive used therefor.
従来、錠剤やカプセル製剤等の薬品や食品等の収納物を包装する容器として、ブリスターパックに代表される成形加工が施された容器が知られている。ブリスターパック（プレススルーパッケージやＰＴＰとも称されることがある。）は、収納物を収容する複数のポケット部を形成した樹脂フィルムの片面にアルミニウム箔等の金属箔を備えた蓋材が接合されることにより、各ポケット部が密封状態にシールされた構成とされ、ポケット部の裏側を押すことにより、ポケット部内の収納物が金属箔を突き破って内容物をポケット部から取り出すことができるようになっている（例えば特許文献１、２参照）。金属が有する高い遮光性と防湿性を利用して、収納物は長期保存を期待される前期薬品や食品の他、犬猫用の飼料、化粧品、医療機器、電子部品等、さまざまなものに使用されている。また最近では、ポケット部が透明で視認性を有するブリスターパックのほか、より高い遮光性と防湿性を期待して、ポケット部にも金属箔を備えたブリスターパックも知られている（例えば特許文献３参照）。
またブリスターパック用積層体とは、収納物が封入される前のブリスターパックの成形に用いられるフィルム又はシート材料である。2. Description of the Related Art Conventionally, containers that have been subjected to molding processing typified by blister packs are known as containers for packaging stored items such as drugs and foods such as tablets and capsule preparations. Blister packs (sometimes referred to as press-through packages or PTPs) have a lid provided with a metal foil, such as an aluminum foil, on one side of a resin film in which a plurality of pockets for accommodating stored items are formed. By doing so, each pocket part is sealed and sealed, and by pressing the back side of the pocket part, the contents in the pocket part can break through the metal foil and take out the contents from the pocket part. (For example, see Patent Documents 1 and 2). Utilizing the high light-shielding and moisture-proofing properties of metals, the stored items can be used for various things such as feeds for dogs and cats, cosmetics, medical equipment, electronic parts, etc. in addition to chemicals and foods that are expected to be stored for a long period of time. Has been. Recently, in addition to blister packs with transparent pockets and visibility, there are also known blister packs with metal foil in the pockets in the hope of higher light shielding and moisture resistance (for example, Patent Documents). 3).
Moreover, the laminated body for blister packs is the film or sheet material used for shaping | molding the blister pack before a stored item is enclosed.
ポケット部にも金属箔を備えたブリスターパックは、金属箔とプラスチックフィルム等の基材とを接着剤で積層させたブリスターパック用積層体を成形加工して得る。しかしながら該成形加工時に、金属箔層や積層体と接着剤層との間に剥離が生じ積層体が破断する場合があった。 A blister pack having a metal foil also in the pocket is obtained by molding a blister pack laminate in which a metal foil and a base material such as a plastic film are laminated with an adhesive. However, at the time of the forming process, peeling may occur between the metal foil layer or the laminate and the adhesive layer, and the laminate may be broken.
金属箔とプラスチックフィルム等の基材とを接着剤で積層させた成形加工を要する積層体としては、電池用積層体が知られており、例えば特許文献４には、基材層とバリア層とシーラント層とが接着剤層を介してこの順で積層された積層体であって、前記バリア層が金属箔からなり、前記バリア層とシーラント層との間の接着剤層が、主剤としてポリエステルポリオールとエポキシ化合物とを含み、硬化剤としてポリイソシアネートとを含むウレタン系接着剤からなり、 前記主剤と前記硬化剤との比が、固形分質量比で１０：１．２６９〜１０：２．８８５である積層体が記載されており、該積層体は、アルコールを高濃度で含む液状物を包装するのに適した包装容器に使用される包装体に用いられることが記載されている。 As a laminate requiring a forming process in which a metal foil and a base material such as a plastic film are laminated with an adhesive, a battery laminate is known. For example, Patent Document 4 discloses a base material layer and a barrier layer. A laminate in which a sealant layer is laminated in this order via an adhesive layer, the barrier layer is made of a metal foil, and the adhesive layer between the barrier layer and the sealant layer is a polyester polyol as a main agent. And an epoxy compound, and a urethane-based adhesive containing polyisocyanate as a curing agent, and the ratio of the main agent to the curing agent is 10: 1.269 to 10: 2.885 in terms of solid content mass ratio. A certain laminated body is described, and this laminated body is described that it is used for the packaging body used for the packaging container suitable for packaging the liquid substance which contains alcohol in high concentration.
また特許文献５には、主剤と硬化剤を含有する電池用包装材用ポリウレタン接着剤であって、前記主剤が、数平均分子量が１０,０００〜１００，０００であり、かつ、水酸基価が１〜１００ｍｇＫＯＨ／ｇであるアクリルポリオール（Ａ）を含み、 前記アクリルポリオール（Ａ）由来のヒドロキシル基に対する、硬化剤中に含まれる芳香族ポリイソシアネート（Ｂ）由来のイソシアネート基の当量比［ＮＣＯ］／［ＯＨ］が１０〜３０であることが記載されており、該接着剤はＰＴＰ包装の接着剤として利用が可能であることが記載されている。 Patent Document 5 discloses a polyurethane adhesive for battery packaging materials containing a main agent and a curing agent, wherein the main agent has a number average molecular weight of 10,000 to 100,000 and a hydroxyl value of 1. The equivalent ratio of the isocyanate group derived from the aromatic polyisocyanate (B) contained in the curing agent to the hydroxyl group derived from the acrylic polyol (A) [NCO] / It is described that [OH] is 10 to 30, and that the adhesive can be used as an adhesive for PTP packaging.
また特許文献６には、外層側樹脂フィルム層、外層側接着剤層、金属箔層、内層側接着剤層およびヒートシール層が順次積層されてなる電池用包装材において、前記外層側接着剤層が、ポリオール成分（Ａ）を含有する主剤と、ポリイソシアネート成分（Ｂ）を含有する硬化剤とを含有するポリウレタン接着剤から形成されたものであり、前記ポリオール成分（Ａ）が、ポリエステルポリオール（Ａ１）：８５〜９９重量％、３官能以上のアルコール成分（Ａ２）：１〜１５重量％を含有し（但し、前記（Ａ１）と（Ａ２）の合計を１００重量％とする）、前記ポリエステルポリオール（Ａ１）が、多塩基酸成分と多価アルコール成分とから構成される数平均分子量５０００〜５００００ポリエステルポリオールであって、前記多塩基酸成分１００モル％中、芳香族多塩基酸成分を４５〜９５モル％含み、前記主剤中に含まれるポリオール（Ａ）由来のヒドロキシル基とカルボキシル基の合計に対する硬化剤中に含まれるイソシアネート基の当量比［ＮＣＯ］／（［ＯＨ］＋［ＣＯＯＨ］）が０．５〜１０である電池用包装材が記載されており、該接着剤はＰＴＰ包装の接着剤として利用が可能であることが記載されている。 Patent Document 6 discloses a battery packaging material in which an outer layer side resin film layer, an outer layer side adhesive layer, a metal foil layer, an inner layer side adhesive layer, and a heat seal layer are sequentially laminated. Is formed from a polyurethane adhesive containing a main component containing a polyol component (A) and a curing agent containing a polyisocyanate component (B), and the polyol component (A) is a polyester polyol ( A1): 85 to 99% by weight, trifunctional or higher-functional alcohol component (A2): 1 to 15% by weight (provided that the total of (A1) and (A2) is 100% by weight), and the polyester Polyol (A1) is a number average molecular weight 5000 to 50000 polyester polyol composed of a polybasic acid component and a polyhydric alcohol component, wherein the polybasic acid component The equivalent ratio of the isocyanate groups contained in the curing agent to the total of the hydroxyl groups and carboxyl groups derived from the polyol (A) contained in the main agent, containing 45 to 95 mol% of the aromatic polybasic acid component in 00 mol% A battery packaging material having [NCO] / ([OH] + [COOH]) of 0.5 to 10 is described, and it is described that the adhesive can be used as an adhesive for PTP packaging. ing.
しかしながらいずれも、ＰＴＰ即ちブリスターパックとして具体的な評価はなされておらず、特にプラスチックフィルムとしてポリアミドを使用した場合のブリスターパック積層体の適用についてはなんら知見を得られていない。 However, none of them has been specifically evaluated as a PTP, that is, a blister pack, and no knowledge has been obtained about the application of a blister pack laminate particularly when polyamide is used as a plastic film.
本発明の課題は、ブリスターパックとして利用が可能なブリスターパック用積層体として、成型加工時に金属箔層の破断や基材層の浮き上がりを低減できる特定の組成である接着剤層を有する積層体を提供することを目的とする。 An object of the present invention is to provide a laminate having an adhesive layer having a specific composition capable of reducing breakage of a metal foil layer and lifting of a base material layer during molding as a laminate for a blister pack that can be used as a blister pack. The purpose is to provide.
本発明者らは、ポリオール及びエポキシ化合物を含有する主剤と、イソシアネート化合物を含有する硬化剤とを有し、前記主剤中のポリオールとエポキシ化合物の固形分質量比を特定の範囲とすることで、上記課題を解決できることを見いだした。 The present inventors have a main agent containing a polyol and an epoxy compound, and a curing agent containing an isocyanate compound, and by setting the solid content mass ratio of the polyol and the epoxy compound in the main agent to a specific range, We found that the above problems could be solved.
即ち本発明は、ポリオール及びエポキシ化合物を含有する主剤と、イソシアネート化合物を含有する硬化剤とを有し、前記主剤中のポリオールとエポキシ化合物の固形分質量比が１００/２０〜１００/６０である接着剤を提供する。 That is, this invention has the main ingredient containing a polyol and an epoxy compound, and the hardening | curing agent containing an isocyanate compound, The solid content mass ratio of the polyol in the said main ingredient and an epoxy compound is 100 / 20-100 / 60. Provide adhesive.
また本発明は、基材層と金属箔が前記記載の接着剤層を介して積層されたブリスターパック用積層体を提供する。 Moreover, this invention provides the laminated body for blister packs in which the base material layer and the metal foil were laminated | stacked through the said adhesive bond layer.
また本発明は、前記記載のブリスターパック用積層体を用いた医療用ブリスターパックを提供する。 Moreover, this invention provides the medical blister pack using the laminated body for blister packs of the said description.
本発明の接着剤をブリスターパック用積層体用の接着剤として使用することで、成型加工時に金属箔層の破断や基材層の浮き上がりが低減されたブリスターパックを提供することができる。 By using the adhesive of the present invention as an adhesive for a laminated body for blister packs, it is possible to provide a blister pack in which breakage of the metal foil layer and lifting of the base material layer are reduced during molding.
（用語の定義）
本発明において「ブリスターパック」とは、背景技術に示すとおり、特許文献１〜３に開示されたような主に錠剤やカプセル製剤等の薬品や食品等の収納物を包装する容器（ここでは視認性の有無を問わない）を意味する。なおプレススルーパッケージやＰＴＰとも称されることがあるが、本発明においてはブリスターパックと称することとする。(Definition of terms)
In the present invention, as shown in the background art, the “blister pack” is a container for packaging stored items such as drugs and foods such as tablets and capsule preparations as disclosed in Patent Documents 1 to 3 (here, visually recognized). Whether or not there is sex. In addition, although it may also be called a press through package or PTP, in this invention, it shall call a blister pack.
（主剤）
本発明で使用する主剤は、ポリオール及びエポキシ化合物を含有する。(Main agent)
The main agent used in the present invention contains a polyol and an epoxy compound.
（ポリオール）
本発明で使用するポリオールは、特に限定なく接着剤分野で使用されるポリオールをいずれも使用することができる。例えばポリエチレングリコール、ポリプロピレングリコール等のポリアルキレンポリオール、ポリエーテルポリオール、ポリエステルポリオール、ポリウレタンポリオール、ポリエステルポリウレタンポリオール、ポリエーテルポリウレタンポリオール、更に前述のポリオール等のブレンド物等を使用することができる。(Polyol)
As the polyol used in the present invention, any polyol used in the adhesive field can be used without any particular limitation. For example, polyalkylene polyols such as polyethylene glycol and polypropylene glycol, polyether polyols, polyester polyols, polyurethane polyols, polyester polyurethane polyols, polyether polyurethane polyols, and blends of the aforementioned polyols can be used.
ポリエーテルポリオールとしては、例えばエチレンオキシド、プロピレンオキシド、ブチレンオキシド、テトラヒドロフラン等のオキシラン化合物を、例えば水、エチレングリコール、プロピレングリコール、トリメチロールプロパン、グリセリン等の低分子量ポリオールを開始剤として重合して得られるポリエーテルポリオールが挙げられる。 The polyether polyol can be obtained, for example, by polymerizing an oxirane compound such as ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran and the like, for example, by using a low molecular weight polyol such as water, ethylene glycol, propylene glycol, trimethylolpropane, glycerin or the like as an initiator. A polyether polyol is mentioned.
ポリエステルポリオールは多塩基酸と多価アルコールを反応させて得られる。前記多塩基酸は、公知であればいずれの原料も使用することができる。例えばダイマー酸が使用できる。ダイマー酸とはオレイン酸、リノール酸などのＣ１８の不飽和脂肪酸のディールスアルダー型２量化反応による生成物であり、不飽和結合に水素を添加し飽和させたものなど種々のものが市販されている。代表的なものは、Ｃ１８のモノカルボン酸０〜５重量％、Ｃ３６のダイマー酸７０〜９８％およびＣ５４のトリマー酸０〜３０重量％からなるものである。また、ダイマージオールとは上記で説明したダイマー酸を還元させて得られるものである。また例えば、コハク酸、アジピン酸、アゼライン酸、セバシン酸、ドデカンジカルボン酸、無水マレイン酸、フマル酸、１，３−シクロペンタンジカルボン酸、１，４−シクロヘキサンジカルボン酸、テレフタル酸、イソフタル酸、フタル酸、１，４−ナフタレンジカルボン酸、２，５−ナフタレンジカルボン酸、２，６−ナフタレンジカルボン酸、ナフタル酸、ビフェニルジカルボン酸、１，２−ビス（フェノキシ）エタン−ｐ，ｐ’−ジカルボン酸及びこれらジカルボン酸の無水物あるいはエステル形成性誘導体；ｐ−ヒドロキシ安息香酸、ｐ−（２−ヒドロキシエトキシ）安息香酸及びこれらのジヒドロキシカルボン酸のエステル形成性誘導体、ダイマー酸等の多塩基酸を単独であるいは二種以上の混合物で使用することができる。 The polyester polyol is obtained by reacting a polybasic acid and a polyhydric alcohol. Any known raw material can be used as the polybasic acid. For example, dimer acid can be used. Dimer acid is a product obtained by Diels-Alder dimerization of C18 unsaturated fatty acids such as oleic acid and linoleic acid, and various products such as those obtained by adding hydrogen to saturated bonds and saturating them are commercially available. . A typical one is composed of 0 to 5% by weight of C18 monocarboxylic acid, 70 to 98% of C36 dimer acid and 0 to 30% by weight of C54 trimer acid. The dimer diol is obtained by reducing the dimer acid described above. Also, for example, succinic acid, adipic acid, azelaic acid, sebacic acid, dodecanedicarboxylic acid, maleic anhydride, fumaric acid, 1,3-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, phthalate Acid, 1,4-naphthalenedicarboxylic acid, 2,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, naphthalic acid, biphenyldicarboxylic acid, 1,2-bis (phenoxy) ethane-p, p'-dicarboxylic acid And anhydrides or ester-forming derivatives of these dicarboxylic acids; p-hydroxybenzoic acid, p- (2-hydroxyethoxy) benzoic acid, ester-forming derivatives of these dihydroxycarboxylic acids, and polybasic acids such as dimer acid alone Or in a mixture of two or more.
また前記多価アルコールは、公知であればいずれの原料も使用することができる。例えばエチレングリコール、プロピレングリコール、１，３−プロパンジオール、１，４−ブタンジオール、１，５−ペンタンジオール、３−メチル−１，５−ペンタンジオール、１，６−ヘキサンジオール、ネオペンチルグリコール、メチルペンタンジオール、ジメチルブタンジオール、ブチルエチルプロパンジオール、ジエチレングリコール、トリエチレングリコール、テトラエチレングリコール、ジプロピレングリコール、トリプロピレングリコール、ビスヒドロキシエトキシベンゼン、１，４−シクロヘキサンジオール、１，４−シクロヘキサンジメタノール、トリエチレングリコール、ポリカプロラクトンジオール、ダイマージオール、ビスフェノールＡ、水素添加ビスフェノールＡ等のグリコール類、プロピオラクトン、ブチロラクトン、ε−カプロラクトン、δ−バレロラクトン、β−メチル−δ−バレロラクトン等の環状エステル化合物の開環重合反応によって得られるポリエステル類、エチレングリコール、ジエチレングリコール、トリエチレングリコール、プロピレングリコール、トリメチレングリコール、１，３−ブタンジオール、１，４−ブタンジオール、１，６−ヘキサンジオール、ネオペンチルグリコール等の活性水素原子を２個有する化合物の１種または２種以上を開始剤としてエチレンオキサイド、プロピレンオキサイド、ブチレンオキサイド、スチレンオキサイド、エピクロルヒドリン、テトラヒドロフラン、シクロヘキシレン、等のモノマーの１種または２種以上を常法により付加重合したポリエーテル類等の多価アルコール成分を単独であるいは二種以上の混合物として使用できる。 As the polyhydric alcohol, any raw material can be used as long as it is known. For example, ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, Methylpentanediol, dimethylbutanediol, butylethylpropanediol, diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, tripropylene glycol, bishydroxyethoxybenzene, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol , Glycols such as triethylene glycol, polycaprolactone diol, dimer diol, bisphenol A, hydrogenated bisphenol A, propiolactone, butyro Polyesters obtained by ring-opening polymerization reaction of cyclic ester compounds such as kuton, ε-caprolactone, δ-valerolactone, β-methyl-δ-valerolactone, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, trimethylene glycol 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, ethylene oxide, propylene using one or more compounds having two active hydrogen atoms such as neopentyl glycol as an initiator Polyhydric alcohol components such as polyethers obtained by addition polymerization of one or more monomers such as oxide, butylene oxide, styrene oxide, epichlorohydrin, tetrahydrofuran, cyclohexylene and the like by a conventional method are used. Can be used as a mixture of two or more.
ポリウレタンポリオールは前記多価アルコールとイソシアネートと反応させて得られる。反応即ちウレタン化に用いられるイソシアネートとしては、芳香族ジイソシアネート（ジフェニルメタンジイソシアネート、キシリレンジイソシアネート、テトラメチルキシリレンジイソシアネート、トリレンジイソシアネート、低分子グリコール類と前記芳香族ジイソシアネートとのプレポリマー等）；脂肪族ジイソシアネート（１，６−ヘキサメチレンジイソシアネート、２，２，４−トリメチルヘキサメチレンジイソシアネート、リジンジイソシアネート、エチレングリコール、プロピレングリコール等の低分子グリコール類と前記脂肪族ジイソシアネートとのプレポリマー等）；脂環族ジイソシアネート（イソホロンジイソシアネート、水添化４，４’−ジフェニルメタンジイソシアネート、メチルシクロヘキシレンジイソシアネート、イソプロピリデンジシクロヘキシルー４，４’−ジイソシアネート、低分子グリコール類と前記脂環族ジイソシアネートとのプレポリマー等）；及びこれらの二種以上の混合物が挙げられる。また前述のポリアルキレンポリオール、ポリエーテルポリオール、ポリエステルポリオールと反応させてもよく、この場合前記多価アルコールと併用してもよく併用しなくてもよい。反応させたものはポリエステルポリウレタンポリオールやポリエーテルポリウレタンポリオールと称される。 A polyurethane polyol is obtained by reacting the polyhydric alcohol and an isocyanate. Isocyanates used in the reaction, ie, urethanization, include aromatic diisocyanates (diphenylmethane diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, tolylene diisocyanate, prepolymers of low molecular glycols and the above aromatic diisocyanates, etc.) aliphatic Diisocyanates (1,6-hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, lysine diisocyanate, prepolymers of the above-mentioned aliphatic diisocyanates with low molecular weight glycols such as ethylene glycol and propylene glycol); Diisocyanate (isophorone diisocyanate, hydrogenated 4,4′-diphenylmethane diisocyanate, methylcyclohexylene diisocyanate , Isopropylidene dicyclohexyl over 4,4'-diisocyanate, low molecular glycols and the prepolymer an alicyclic diisocyanate); and mixtures of two or more thereof. Moreover, you may make it react with the above-mentioned polyalkylene polyol, polyether polyol, and polyester polyol, In this case, it may be used together with the said polyhydric alcohol, and it is not necessary to use it together. What was made to react is called polyester polyurethane polyol or polyether polyurethane polyol.
この中で、ポリエステルポリオールやポリエステルポリウレタンポリオール等のエステル骨格を有するポリオールが柔軟性や成型性に優れることから好ましく使用される。 Among these, a polyol having an ester skeleton such as polyester polyol and polyester polyurethane polyol is preferably used because of its excellent flexibility and moldability.
（エポキシ化合物）
本発明で使用するエポキシ化合物としては、一般的に市販されているエピ−ビス型、ノボラック型、β−メチルエピクロ型、環状オキシラン型、グリシジルエーテル型、グリシジルエステル型、ポリグリコールエーテル型、グリコールエーテル型、エポキシ化脂肪酸エステル型、多価カルボン酸エステル型、アミノグリシジル型、レゾルシン型等の各種エポキシ樹脂が挙げられる。
エポキシ樹脂としては、一般的に市販されているビスフェノール型エポキシ樹脂、のぼらック型エポキシ樹脂、環状オキシラン型樹脂、グリシジルエーテル型樹脂、グリシジルエステル型樹脂、ポリグリコールエーテル型エポキシ樹脂、グリコールエーテル型エポキシ樹脂、エポキシ化脂肪酸エステル型樹脂、多価カルボン酸エステル型エポキシ樹脂、グリシジルアミン型樹脂、レゾルシン型エポキシ樹脂等の各種エポキシ樹脂が挙げられる。中でも、ビスフェノール型エポキシ樹脂が、成型性に優れることから好ましく使用される。(Epoxy compound)
As an epoxy compound used in the present invention, commercially available epi-bis type, novolak type, β-methyl epichloro type, cyclic oxirane type, glycidyl ether type, glycidyl ester type, polyglycol ether type, glycol ether type And various epoxy resins such as epoxidized fatty acid ester type, polycarboxylic acid ester type, aminoglycidyl type, and resorcin type.
Epoxy resins include commercially available bisphenol-type epoxy resins, rag-type epoxy resins, cyclic oxirane-type resins, glycidyl ether-type resins, glycidyl ester-type resins, polyglycol ether-type epoxy resins, glycol ether-type epoxy resins. Various epoxy resins such as resin, epoxidized fatty acid ester type resin, polyvalent carboxylic acid ester type epoxy resin, glycidyl amine type resin, resorcin type epoxy resin and the like can be mentioned. Of these, bisphenol-type epoxy resins are preferably used because of their excellent moldability.
前記ポリオール及びエポキシ化合物を含有する主剤中、ポリオールとエポキシ化合物の固形分質量比は１００/２０〜１００/６０であることが特徴である。この範囲において、成型加工時に金属箔層の破断や基材層の浮き上がりが生じにくい接着剤層を有する積層体を得ることができる。前記固形分質量比は中でも１００/２０〜１００/４０であることが好ましく１００/２０〜１００/３０であることが最も好ましい。 In the main ingredient containing the polyol and the epoxy compound, the solid content mass ratio of the polyol and the epoxy compound is 100/20 to 100/60. Within this range, it is possible to obtain a laminate having an adhesive layer that is less prone to breakage of the metal foil layer and lifting of the base material layer during molding. The solid content mass ratio is preferably 100/20 to 100/40, and most preferably 100/20 to 100/30.
（イソシアネート化合物を含有する硬化剤）
本発明で使用するイソシアネート化合物は、公知慣用のものを使用することができる。
例えば、トリレンジイソシアネート、キシリレンジイソシアネート、ジフェニルメタンジイソシアネート、１，６−ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、４，４’−メチレンビス（シクロヘキシルイソシアネート）、リジンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、１，３−（イソシアナートメチル）シクロヘキサン、１，５−ナフタレンジイソシアネート、トリフェニルメタントリイソシアネートなどのポリイソシアネート；これらのポリイソシアネートのアダクト体、これらのポリイソシアネートのビュレット体、または、これらのポリイソシアネートのイソシアヌレート体などのポリイソシアネートの誘導体（変性物）などが挙げられる。
ポリイソシアネートに限定はないが、脂肪族系より芳香族系のものの方が剥離強度、成形性において好成績である。(Curing agent containing isocyanate compound)
As the isocyanate compound used in the present invention, known and commonly used isocyanate compounds can be used.
For example, tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, 1,6-hexamethylene diisocyanate, isophorone diisocyanate, 4,4′-methylenebis (cyclohexyl isocyanate), lysine diisocyanate, trimethylhexamethylene diisocyanate, 1,3- (isocyanate) Polyisocyanates such as methyl) cyclohexane, 1,5-naphthalene diisocyanate, triphenylmethane triisocyanate; adducts of these polyisocyanates, burettes of these polyisocyanates, or isocyanurates of these polyisocyanates Examples include isocyanate derivatives (modified products).
The polyisocyanate is not limited, but the aromatic type is better than the aliphatic type in terms of peel strength and moldability.
本発明において、ポリオール由来の水酸基（ＯＨ）とポリイソシアネート化合物由来のイソシアネート基（ＮＣＯ）の当量比（ＮＣＯ/ＯＨ）は、特に限定はないが１〜３０の範囲で使用することが好ましい。この範囲内であると、耐湿熱性（６５℃−９０％／７２時間で深さ６．５ｍｍ成形フランジ部と側壁部の境界部付近に浮きが無いこと）、ヒートシール性（１９０℃／３秒で深さ６．５ｍｍ成形フランジ部と側壁部の境界部付近に浮きが無いこと）のバランスが最も良い。一方１より小さい場合、剥離強度、耐湿熱性が悪くなるおそれがあり、３０より多い時、剥離強度やヒートシール性が悪くなるおそれがある
さらに好ましくは２〜１０であり、より好ましくは４〜１０であり、４〜７の範囲が最も好ましい。In the present invention, the equivalent ratio (NCO / OH) of the hydroxyl group (OH) derived from the polyol and the isocyanate group (NCO) derived from the polyisocyanate compound is not particularly limited, but is preferably in the range of 1-30. Within this range, moisture and heat resistance (65 ° C-90% / 72 hours in depth 6.5 mm deep and no floating near the boundary between the molded flange portion and the side wall portion), heat sealability (190 ° C / 3 seconds) The balance of the fact that there is no float near the boundary between the molded flange portion and the side wall portion with a depth of 6.5 mm is the best. On the other hand, if it is smaller than 1, the peel strength and heat-and-moisture resistance may be deteriorated, and if it is more than 30, the peel strength and heat sealability may be further deteriorated, more preferably 2 to 10, and more preferably 4 to 10 And the range of 4-7 is most preferred.
また、本発明の接着剤はケトン樹脂を含有することもできる。
本発明で用いられるケトン樹脂は公知慣用のものを挙げることができるが、ホルムアルデヒド樹脂、シクロヘキサノン・ホルムアルデヒド樹脂また、ケトンアルデヒド縮合樹脂等を好適に用いることができる。The adhesive of the present invention can also contain a ketone resin.
Examples of the ketone resin used in the present invention include known and commonly used ones, and formaldehyde resins, cyclohexanone / formaldehyde resins, ketone aldehyde condensation resins, and the like can be preferably used.
本発明の接着剤は、溶剤型又は無溶剤型のいずれの形態であってもよい。溶剤型の場合、溶剤は主剤及び硬化剤の製造時に反応媒体として使用され、更に塗装時に希釈剤として使用される。使用できる溶剤としては例えば酢酸エチル、酢酸ブチル、セロソルブアセテート等のエステル類、アセトン、メチルエチルケトン、イソブチルケトン、シクロヘキサノン等のケトン類、テトラヒドロフラン、ジオキサン等のエーテル類、トルエン、キシレン等の芳香族炭化水素類、メチレンクロリド、エチレンクロリド等のハロゲン化炭化水素類、ジメチルスルホキシド、ジメチルスルホアミド等が挙げられる。これらのうち通常は酢酸エチル又はメチルエチルケトンを単独又は混合して使用するのが好ましい。一方、本発明において無溶剤型とは、前述の主剤及び硬化剤の製造時に反応媒体として使用され、更に塗装時に希釈剤として使用されるような、例えば酢酸エチル、酢酸ブチル、セロソルブアセテート等のエステル類、アセトン、メチルエチルケトン、イソブチルケトン、シクロヘキサノン等のケトン類、テトラヒドロフラン、ジオキサン等のエーテル類、トルエン、キシレン等の芳香族炭化水素類、メチレンクロリド、エチレンクロリド等のハロゲン化炭化水素類、ジメチルスルホキシド、ジメチルスルホアミド等が挙げられる。これらのうち通常は酢酸エチル又はメチルエチルケトンを含まない形態を指す。 The adhesive of the present invention may be either a solvent type or a solventless type. In the case of the solvent type, the solvent is used as a reaction medium during production of the main agent and the curing agent, and is further used as a diluent during coating. Examples of solvents that can be used include esters such as ethyl acetate, butyl acetate and cellosolve acetate, ketones such as acetone, methyl ethyl ketone, isobutyl ketone and cyclohexanone, ethers such as tetrahydrofuran and dioxane, and aromatic hydrocarbons such as toluene and xylene. , Halogenated hydrocarbons such as methylene chloride and ethylene chloride, dimethyl sulfoxide, dimethyl sulfoamide and the like. Of these, it is usually preferred to use ethyl acetate or methyl ethyl ketone alone or in combination. On the other hand, the solvent-free type in the present invention is an ester such as ethyl acetate, butyl acetate, cellosolve acetate, etc., which is used as a reaction medium during the production of the above main agent and curing agent, and further used as a diluent during coating. , Ketones such as acetone, methyl ethyl ketone, isobutyl ketone, cyclohexanone, ethers such as tetrahydrofuran and dioxane, aromatic hydrocarbons such as toluene and xylene, halogenated hydrocarbons such as methylene chloride and ethylene chloride, dimethyl sulfoxide, Examples thereof include dimethylsulfamide. Of these, it usually refers to a form containing no ethyl acetate or methyl ethyl ketone.
本発明の接着剤において、更に別の良好な態様として、公知のリン酸類又はその誘導体が併用できる。これによって、接着剤の初期接着性が更に向上し、トンネリング等のトラブルを解消することができる。 In the adhesive of the present invention, as another preferred embodiment, known phosphoric acids or derivatives thereof can be used in combination. Thereby, the initial adhesiveness of the adhesive is further improved, and troubles such as tunneling can be solved.
ここで使用されるリン酸類又はその誘導体としては、例えば次亜リン酸、亜リン酸、オルトリン酸、次リン酸等のリン酸類、例えばメタリン酸、ピロリン酸、トリポリリン酸、ポリリン酸、ウルトラリン酸等の縮合リン酸類、例えばオルトリン酸モノメチル、オルトリン酸モノエチル、オルトリン酸モノプロピル、オルトリン酸モノブチル、オルトリン酸モノ−２−エチルヘキシル、オルトリン酸モノフェニル、亜リン酸モノメチル、亜リン酸モノエチル、亜リン酸モノプロピル、亜リン酸モノブチル、亜リン酸モノ−２−エチルヘキシル、亜リン酸モノフェニル、オルトリン酸ジ−２−エチルヘキシル、オルトリン酸ジフェニル亜リン酸ジメチル、亜リン酸ジエチル、亜リン酸ジプロピル、亜リン酸ジブチル、亜リン酸ジ−２−エチルヘキシル、亜リン酸ジフェニル等のモノ、ジエステル化物、縮合リン酸とアルコール類とからのモノ、ジエステル化物、例えば前記のリン酸類に、例えばエチレンオキシド、プロピレンオキシド等のエポキシ化合物を付加させたもの、例えば脂肪族又は芳香族のジグリシジルエーテルに前記のリン酸類を付加させて得られるエポキシリン酸エステル類等が挙げられる。 Examples of phosphoric acids or derivatives thereof used herein include phosphoric acids such as hypophosphorous acid, phosphorous acid, orthophosphoric acid, and hypophosphoric acid, such as metaphosphoric acid, pyrophosphoric acid, tripolyphosphoric acid, polyphosphoric acid, and ultraphosphoric acid. Condensed phosphoric acids such as monomethyl orthophosphate, monoethyl orthophosphate, monopropyl orthophosphate, monobutyl orthophosphate, mono-2-ethylhexyl orthophosphate, monophenyl orthophosphate, monomethyl phosphite, monoethyl phosphite, phosphorous acid Monopropyl, monobutyl phosphite, mono-2-ethylhexyl phosphite, monophenyl phosphite, di-2-ethylhexyl orthophosphate, diphenyl orthophosphate, dimethyl phosphite, diethyl phosphite, dipropyl phosphite, Dibutyl phosphate, di-2-ethylhexyl phosphite Mono-, diesterified products such as diphenyl phosphite, mono- and diesterified products from condensed phosphoric acid and alcohols, for example, those obtained by adding an epoxy compound such as ethylene oxide, propylene oxide, etc. Examples thereof include epoxy phosphate esters obtained by adding the above phosphoric acid to an aliphatic or aromatic diglycidyl ether.
上記のリン酸類又はその誘導体は一種又は二種以上用いてもよい。含有させる方法としては単に混ぜ込むだけでよい。 One or more of the above phosphoric acids or derivatives thereof may be used. As a method of inclusion, it may be simply mixed.
また、本発明の接着剤において、接着促進剤を用いることもできる。接着促進剤にはシランカップリング剤、チタネート系カップリング剤、アルミニウム系等のカップリング剤、エポキシ樹脂等が挙げられる。 In the adhesive of the present invention, an adhesion promoter can be used. Examples of the adhesion promoter include silane coupling agents, titanate coupling agents, aluminum coupling agents, epoxy resins, and the like.
シランカップリング剤としては、例えば、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルトリメトキシシラン、Ｎ−β（アミノエチル）−γ−アミノプロピルトリメトキシシラン、Ｎ−β（アミノエチル）−γ−アミノプロピルトリメチルジメトキシシラン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン等のアミノシラン；β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン等のエポキシシラン；ビニルトリス（β−メトキシエトキシ）シラン、ビニルトリエトキシシラン、ビニルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン等のビニルシラン；ヘキサメチルジシラザン、γ−メルカプトプロピルトリメトキシシラン等を挙げることが出来る。 Examples of the silane coupling agent include γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β (aminoethyl) -γ. Amino silanes such as aminopropyltrimethyldimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane; β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycine Epoxy silanes such as Sidoxypropyltriethoxysilane; Vinylsilanes such as Vinyltris (β-methoxyethoxy) silane, Vinyltriethoxysilane, Vinyltrimethoxysilane, γ-Methacryloxypropyltrimethoxysilane; Hexamethyldisilazane, γ-Mel Hept trimethoxysilane and the like.
チタネート系カップリング剤としては、例えば、テトライソプロポキシチタン、テトラ−ｎ−ブトキシチタン、ブチルチタネートダイマー、テトラステアリルチタネート、チタンアセチルアセトネート、チタンラクテート、テトラオクチレングリコールチタネート、チタンラクテート、テトラステアロキシチタン等を挙げることが出来る。 Examples of titanate coupling agents include tetraisopropoxy titanium, tetra-n-butoxy titanium, butyl titanate dimer, tetrastearyl titanate, titanium acetylacetonate, titanium lactate, tetraoctylene glycol titanate, titanium lactate, tetrastearoxy Titanium etc. can be mentioned.
また、アルミニウム系カップリング剤としては、例えば、アセトアルコキシアルミニウムジイソプロピレート等が挙げることが出来る。 Moreover, as an aluminum coupling agent, acetoalkoxy aluminum diisopropylate etc. can be mentioned, for example.
本発明の接着剤は、公知であればいずれの塗工方法で塗布されても差し支えないが、一般的にはグラビアロール塗工方式で塗布される。本接着剤の塗布量は、固形分で１．５〜５ｇ／ｍ２、好ましくは、２〜４ｇ／ｍ２の塗工条件で使用される。通常、溶剤型では塗布量を約１．０〜４．０ｇ／ｍ２、無溶剤型では約０．５〜３．０ｇ／ｍ２程度で使用するとよい。The adhesive of the present invention may be applied by any coating method as long as it is known, but is generally applied by a gravure roll coating method. The coating amount of the adhesive is 1.5 to 5 g / m 2 in terms of solid content, preferably used in coating conditions of 2 to 4 g / m 2. Usually, about 1.0~4.0g / m 2 coating weight with a solvent type, a solventless type may be used in about 0.5 to 3.0 g / m 2.
本発明のブリスターパック用積層体は、基材層と金属箔が前記接着剤層を介して積層されていることに特徴を有する。前述の通り本願においてブリスターパック用積層体とは、収納物が封入される前のブリスターパックの成形に用いられるフィルム又はシート材料であるが、その際用いられる基材は、ブリスターパック（プレススルーパッケージ、ＰＴＰ）、食品用パック、餌料用パックに通常使用されるプラスチック基材を挙げることができる。
また本発明のブリスターパック用積層体の構成は、基材層が金属箔の片面のみに接着されていても、基材層が金属箔の両面に接着されていてもよい。また、基材層は複数の貼り合わせでもよい。The laminate for blister packs of the present invention is characterized in that a base material layer and a metal foil are laminated via the adhesive layer. As described above, the blister pack laminate in the present application is a film or sheet material used for forming a blister pack before the stored items are enclosed. The base material used in this case is a blister pack (press-through package). , PTP), food packs, and feed packs that are commonly used in food packs.
Moreover, the structure of the laminated body for blister packs of this invention WHEREIN: Even if the base material layer is adhere | attached only on the single side | surface of metal foil, the base material layer may be adhere | attached on both surfaces of metal foil. Moreover, a base material layer may be bonded together.
前記金属箔としては、純アルミニウム箔またはアルミニウム合金箔であることが好ましい。また、金属箔は半硬材または軟質材が好ましい。 The metal foil is preferably a pure aluminum foil or an aluminum alloy foil. The metal foil is preferably a semi-hard material or a soft material.
また基材層として使用されるプラスチック基材としては、例えばポリアミド、ポリエステル、ポリオレフィン等が挙げられる。 Examples of the plastic substrate used as the substrate layer include polyamide, polyester, and polyolefin.
前記ポリアミドとしては、例えばポリアミドホモポリマーまたは共重合体が挙げられる。ポリアミドホモポリマーとしては、ポリ（４−アミノ酪酸）〔ナイロン４〕、ポリ（６−アミノヘキサン酸）〔ナイロン６、またポリ（カプロラクタム）〕、ポリ（７−アミノヘプタン酸）〔ナイロン７〕、ポリ（８−アミノオクタン酸）〔ナイロン８〕、ポリ（９−アミノノナン酸）〔ナイロン９〕、ポリ（１０−アミノデカン酸）〔ナイロン１０〕、ポリ（１１−アミノウンデカン酸）〔ナイロン１１〕、ポリ（１２−アミノドデカン酸）〔ナイロン１２〕等が挙げられる。ポリアミド共重合体としては、ナイロン４，６、ポリ（ヘキサメチレンアジポアミド）〔ナイロン６，６〕、ポリ（ヘキサメチレンセバカミド）〔ナイロン６，１０〕、ポリ（ヘプタメチレンピメルアミド）〔ナイロン７，７〕、ポリ（オクタメチレンスベラミド）〔ナイロン８，８〕、ポリ（ヘキサメチレンアゼラミド）〔ナイロン６，９〕、ポリ（ノナメチレンアゼラミド）〔ナイロン９，９〕、ポリ（デカメチレンアゼラミド）〔ナイロン１０，９〕、ポリ（テトラメチレンジアミン−ｃｏ−シュウ酸）〔ナイロン４，２〕、ｎ−ドデカンジオン酸及びヘキサメチレンジアミンのポリアミド〔ナイロン６，１２〕、ドデカメチレンジアミン及びｎ−ドデカンジオン酸のポリアミド〔ナイロン１２，１２〕等が挙げられる。他の有用なポリアミド共重合体としては、カプロラクタム／ヘキサメチレンアジポアミド共重合体〔ナイロン６，６／６〕、ヘキサメチレンアジポアミド／カプロラクタム共重合体〔ナイロン６／６，６〕、トリメチレンアジポアミド／ヘキサメチレンアゼライアミド共重合体〔ナイロントリメチル６，２／６，２〕、ヘキサメチレンアジポアミド−ヘキサメチレン−アゼライアミドカプロラクタム共重合体〔ナイロン６，６／６，９／６〕、ポリ（テトラメチレンジアミン−ｃｏ−イソフタル酸）〔ナイロン４，Ｉ〕、ポリヘキサメチレンイソフタルアミド〔ナイロン６，１〕、ヘキサメチレンアジポアミド／ヘキサメチレン−イソフタルアミド〔ナイロン６，６／６Ｉ〕、ヘキサメチレンアジポアミド／ヘキサメチレンテレフタルアミド〔ナイロン６，６／６Ｔ〕、ポリ（２，２，２−トリメチルヘキサメチレンテレフタルアミド）、ポリ（ｍ−キシリレンアジポアミド）〔ＭＸＤ６〕、ポリ（ｐ−キシリレンアジポアミド）、ポリ（ヘキサメチレンテレフタルアミド）、ポリ（ドデカメチレンテレフタルアミド）、ポリアミド６Ｔ／６Ｉ、ポリアミド６／ＭＸＤＴ／Ｉ、ポリアミドＭＸＤＩ等が挙げられる。 Examples of the polyamide include polyamide homopolymers and copolymers. Polyamide homopolymers include poly (4-aminobutyric acid) [nylon 4], poly (6-aminohexanoic acid) [nylon 6, or poly (caprolactam)], poly (7-aminoheptanoic acid) [nylon 7], Poly (8-aminooctanoic acid) [nylon 8], poly (9-aminononanoic acid) [nylon 9], poly (10-aminodecanoic acid) [nylon 10], poly (11-aminoundecanoic acid) [nylon 11], And poly (12-aminododecanoic acid) [nylon 12]. Polyamide copolymers include nylon 4,6, poly (hexamethylene adipamide) [nylon 6,6], poly (hexamethylene sebacamide) [nylon 6,10], poly (heptamethylene pimelamide) [Nylon 7,7], poly (octamethylene suberamide) [nylon 8, 8], poly (hexamethylene azelamide) [nylon 6, 9], poly (nonamethylene azelamide) [nylon 9, 9], poly (Decamethylene Azelamide) [Nylon 10,9], Poly (tetramethylenediamine-co-oxalic acid) [Nylon 4,2], n-dodecanedioic acid and hexamethylenediamine polyamide [Nylon 6,12], Dodeca Examples include methylenediamine and polyamide of n-dodecanedioic acid [nylon 12, 12]. Other useful polyamide copolymers include caprolactam / hexamethylene adipamide copolymer [nylon 6,6 / 6], hexamethylene adipamide / caprolactam copolymer [nylon 6 / 6,6], Methylene adipamide / hexamethylene azelaamide copolymer [nylon trimethyl 6, 2/6, 2], hexamethylene adipamide-hexamethylene-azelayamide caprolactam copolymer [nylon 6, 6/6, 9 / 6], poly (tetramethylenediamine-co-isophthalic acid) [nylon 4, I], polyhexamethylene isophthalamide [nylon 6,1], hexamethylene adipamide / hexamethylene-isophthalamide [nylon 6, 6 / 6I], hexamethylene adipamide / hexamethylene terephthalamide Nylon 6,6 / 6T], poly (2,2,2-trimethylhexamethylene terephthalamide), poly (m-xylylene adipamide) [MXD6], poly (p-xylylene adipamide), poly ( Hexamethylene terephthalamide), poly (dodecamethylene terephthalamide), polyamide 6T / 6I, polyamide 6 / MXDT / I, polyamide MXDI, and the like.
また本明細書において特に説明しない他のポリアミド、並びに本明細書において説明するものの組合せであってもよい。これらの中で、ポリアミドとしては、ナイロン６、ナイロン６，６、ナイロン６／６，６又はその混合物がより好ましく、ナイロン６が更に好ましい。 Further, other polyamides that are not particularly described in the present specification, and combinations described in the present specification may be used. Among these, as polyamide, nylon 6, nylon 6,6, nylon 6 / 6,6 or a mixture thereof is more preferable, and nylon 6 is still more preferable.
前記ポリエステルとしては、ポリエチレンテレフタレート〔ＰＥＴ〕やグリコール変性ポリエチレンテレフタレート〔ＰＥＴＧ〕が挙げられる。環状オレフィン共重合体〔ＣＯＣ〕は、エチレン及びノルボルネンの共重合体が好ましい。 Examples of the polyester include polyethylene terephthalate [PET] and glycol-modified polyethylene terephthalate [PETG]. The cyclic olefin copolymer [COC] is preferably a copolymer of ethylene and norbornene.
前記ポリオレフィンとしては、ポリエチレン〔ＰＥ〕、ポリプロピレン〔ＰＰ〕、ポリ塩化ビニル〔ＰＶＣ〕、ポリ塩化ビニリデン〔ＰＶｄＣ〕、環状オレフィン共重合体〔ＣＯＣ〕、ポリスチレン〔ＰＳ〕、アクリル樹脂から群から選択される材料を含むことが好ましく、ポリエチレン〔ＰＥ〕、ポリエステル、ポリ塩化ビニル〔ＰＶＣ〕が好ましい。前記ポリエチレンとしては、低密度ポリエチレン〔ＬＤＰＥ〕、線状低密度ポリエチレン〔ＬＬＤＰＥ〕、線状中密度ポリエチレン〔ＬＭＤＰＥ〕、線状で非常に低密度のポリエチレン〔ＶＬＤＰＥ〕、線状超低密度ポリエチレン〔ＵＬＤＰＥ〕、高密度ポリエチレン〔ＨＤＰＥ〕が挙げられ、低密度ポリエチレンが好ましい。 The polyolefin is selected from the group consisting of polyethylene [PE], polypropylene [PP], polyvinyl chloride [PVC], polyvinylidene chloride [PVdC], cyclic olefin copolymer [COC], polystyrene [PS], and acrylic resin. In particular, polyethylene [PE], polyester, and polyvinyl chloride [PVC] are preferable. Examples of the polyethylene include low density polyethylene [LDPE], linear low density polyethylene [LLDPE], linear medium density polyethylene [LMDPE], linear and very low density polyethylene [VLDPE], and linear very low density polyethylene [ ULDPE] and high-density polyethylene [HDPE], and low-density polyethylene is preferred.
（ブリスターパック）
本発明のブリスターパックは、本発明のブリスターパック用積層体に蓋材を備えており、本発明のブリスターパック用積層体（底材）へ所定数の凹部を成形し、次に成形された各凹部へ錠剤等の内容物を収容し、ブリスターパック包装用の成形充填シール機を使用して底材であるブリスターパック用積層体のフランジ部へ蓋材をヒートシールすることにより、製造することができる。 (Blister pack)
The blister pack of the present invention is provided with a lid on the blister pack laminate of the present invention, and a predetermined number of recesses are formed on the blister pack laminate (bottom material) of the present invention, and then each molded It can be manufactured by storing the contents such as tablets in the recess and heat-sealing the lid material to the flange part of the laminated body for blister packs, which is the bottom material, using a molding filling sealing machine for blister pack packaging. it can.
前記蓋材としては、ヒートシールによって、収容された内容物を密封できることから、ヒートシール性樹脂層を有するものが好ましい。ヒートシール性樹脂層とは、ヒートシールの際に、内容物が収容された底材の表面と融着する層である限り特に限定されないが、たとえば、低密度ポリエチレン〔ＬＤＰＥ〕、中密度ポリエチレン〔ＭＤＰＥ〕、高密度ポリエチレン〔ＨＤＰＥ〕、線状低密度ポリエチレン〔ＬＬＤＰＥ〕、エチレン酢酸ビニル共重合体〔ＥＶＡ〕、ポリプロピレン〔ＰＰ〕、エチレン・アクリル酸共重合体〔ＥＡＡ〕、エチレン・メタアクリル酸共重合体〔ＥＭＡ〕、エチレン・メチルアクリレート共重合体〔ＥＭＡＡ〕、エチレン・エチルアクリレート共重合体〔ＥＥＡ〕、エチレン・メチルメタアクリル酸共重合体〔ＥＭＭＡ〕、アイオノマー〔ＩＯ〕などを、１種または２種以上含む層が挙げられる。また、蓋材は、低水蒸気透過性が良好である点から、アルミニウム層などの金属蒸着膜層や金属箔層等の金属層を含むことが好ましく、アルミニウム箔層を含むことがより好ましい。 As the lid member, one having a heat-sealable resin layer is preferable because the contained contents can be sealed by heat sealing. The heat-sealable resin layer is not particularly limited as long as the heat-sealing resin layer is a layer that is fused to the surface of the bottom material in which the contents are accommodated. For example, low-density polyethylene [LDPE], medium-density polyethylene [ MDPE], high density polyethylene [HDPE], linear low density polyethylene [LLDPE], ethylene vinyl acetate copolymer [EVA], polypropylene [PP], ethylene / acrylic acid copolymer [EAA], ethylene / methacrylic acid Copolymer [EMA], ethylene / methyl acrylate copolymer [EMAA], ethylene / ethyl acrylate copolymer [EEA], ethylene / methyl methacrylic acid copolymer [EMMA], ionomer [IO], etc. Examples include a seed or a layer containing two or more. Moreover, it is preferable that a lid | cover material contains metal layers, such as metal vapor deposition film layers, such as an aluminum layer, and a metal foil layer, from the point that low water vapor permeability is favorable, and it is more preferable that an aluminum foil layer is included.
さらに、遮光性と防湿性に優れることから、本発明のブリスターパック用積層体及び接着した蓋材共に、金属箔層を有する両面金属箔層（アルミニウム箔層）を有する構成が特に好ましい。 Furthermore, since it is excellent in light-shielding property and moisture-proof property, the structure which has a double-sided metal foil layer (aluminum foil layer) which has a metal foil layer is especially preferable for the laminated body for blister packs and the bonded lid | cover material of this invention.
本発明のブリスターパック用積層体及びブリスターパックは、医療用はもちろんのこと、食品用、或いはペット餌料用パックとしても使用することができる。また長期耐久性試験後においても層間の接着強度の低下がなく、層間の浮きなどの外観不良を発生することがないことから、電池電解液封止フィルムまたは電池電極部保護フィルムとして用いた電池、及び二次電池電解液封止フィルムまたは二次電池電極部保護フィルムとして用いた二次電池としても有用に使用することができる。 The laminated body for blister packs and blister packs of the present invention can be used not only for medical purposes, but also for foods or pet food packs. In addition, there is no decrease in adhesion strength between layers even after a long-term durability test, and since there is no appearance defect such as floating between layers, a battery used as a battery electrolyte sealing film or a battery electrode part protective film, And it can be usefully used also as a secondary battery used as a secondary battery electrolyte solution sealing film or a secondary battery electrode part protective film.
以下、実施例によりさらに本発明を詳細に説明する。表記「部」は、質量部を示す。 Hereinafter, the present invention will be described in more detail with reference to examples. The notation “parts” indicates parts by mass.
（製造例１）接着剤（１）の作製
ディックドライＬＸ−９０６（ポリエステルポリオール、ＤＩＣ社製）とＥＰＩＣＬＯＮ−１０５０（エポキシ化合物、ＤＩＣ社製）の固形分質量比を１００／４０（ポリオール／エポキシ化合物）で混合し、酢酸エチルで希釈する事により固形分６０％の主剤Ａを調製した。主剤Ａに硬化剤ＫＷ−７５（ポリイソシアネート、ＤＩＣ社製）を主剤／硬化剤比率＝１０：１．６（ＮＣＯ／ＯＨ比（ｍｏｌ／ｍｏｌ）に換算し５．２）で混合し、酢酸エチルで希釈する事により配合液として固形分３５％の接着剤（１）を得た。Production Example 1 Production of Adhesive (1) Dick Dry LX-906 (polyester polyol, manufactured by DIC) and EPICLON-1050 (epoxy compound, manufactured by DIC) had a solid content mass ratio of 100/40 (polyol / epoxy). Compound A) and diluted with ethyl acetate to prepare main agent A having a solid content of 60%. Curing agent KW-75 (polyisocyanate, manufactured by DIC) was mixed with main agent A at a main agent / curing agent ratio = 10: 1.6 (5.2 converted to NCO / OH ratio (mol / mol)), and acetic acid was mixed. By diluting with ethyl, an adhesive (1) having a solid content of 35% was obtained as a blended solution.
（製造例２）接着剤（２）の作製
ディックドライＬＸ−９０６（ポリエステルポリオール、ＤＩＣ社製）とＥＰＩＣＬＯＮ−１０５０（エポキシ化合物、ＤＩＣ社製）の固形分質量比を１００／２５（ポリオール／エポキシ化合物）で混合し、酢酸エチルで希釈する事により固形分６０％の主剤Ａを調製した。主剤Ａに硬化剤ＫＷ−７５（ポリイソシアネート、ＤＩＣ社製）を主剤／硬化剤比率＝１０：１．６（ＮＣＯ／ＯＨ比（ｍｏｌ／ｍｏｌ）に換算し４．６）で混合し、酢酸エチルで希釈する事により配合液として固形分３５％の接着剤（２）を得た。(Production Example 2) Production of Adhesive (2) The solid mass ratio of Dick Dry LX-906 (polyester polyol, manufactured by DIC) and EPICLON-1050 (epoxy compound, manufactured by DIC) was 100/25 (polyol / epoxy). Compound A) and diluted with ethyl acetate to prepare main agent A having a solid content of 60%. Curing agent KW-75 (polyisocyanate, manufactured by DIC) was mixed with main agent A at a main agent / curing agent ratio = 10: 1.6 (4.6 in terms of NCO / OH ratio (mol / mol)), and acetic acid was mixed. By diluting with ethyl, an adhesive (2) having a solid content of 35% was obtained as a blended solution.
（製造例３）接着剤（３）の作製
ディックドライＬＸ−９０６（ポリエステルポリオール、ＤＩＣ社製）とＥＰＩＣＬＯＮ−１０５０（エポキシ化合物、ＤＩＣ社製）の固形分質量比を１００／６０（ポリオール／エポキシ化合物）で混合し、酢酸エチルで希釈する事により固形分６０％の主剤Ａを調製した。主剤Ａに硬化剤ＫＷ−７５（ポリイソシアネート、ＤＩＣ社製）を主剤／硬化剤比率＝１０：１．６（ＮＣＯ／ＯＨ比（ｍｏｌ／ｍｏｌ）に換算し５．９）で混合し、酢酸エチルで希釈する事により配合液として固形分３５％の接着剤（３）を得た。(Production Example 3) Production of Adhesive (3) The solid mass ratio of Dick Dry LX-906 (polyester polyol, manufactured by DIC) and EPICLON-1050 (epoxy compound, manufactured by DIC) was 100/60 (polyol / epoxy). Compound A) and diluted with ethyl acetate to prepare main agent A having a solid content of 60%. The main agent A was mixed with a curing agent KW-75 (polyisocyanate, manufactured by DIC) at a main agent / curing agent ratio = 10: 1.6 (5.9 converted to NCO / OH ratio (mol / mol)), and acetic acid was mixed. By diluting with ethyl, an adhesive (3) having a solid content of 35% was obtained as a blended solution.
（製造例４）接着剤（４）の作製
ディックドライＬＸ−９０６（ポリエステルポリオール、ＤＩＣ社製）とＥＰＩＣＬＯＮ−１０５０（エポキシ化合物、ＤＩＣ社製）の固形分質量比を１００／４０（ポリオール／エポキシ化合物）で混合し、酢酸エチルで希釈する事により固形分６０％の主剤Ａを調製した。主剤Ａに硬化剤ＫＷ−７５（ポリイソシアネート、ＤＩＣ社製）を主剤／硬化剤比率＝１０：１．４（ＮＣＯ／ＯＨ比（ｍｏｌ／ｍｏｌ）に換算し４．５）で混合し、酢酸エチルで希釈する事により配合液として固形分３５％の接着剤（４）を得た。(Production Example 4) Production of Adhesive (4) The solid mass ratio of Dick Dry LX-906 (polyester polyol, manufactured by DIC) and EPICLON-1050 (epoxy compound, manufactured by DIC) was 100/40 (polyol / epoxy). Compound A) and diluted with ethyl acetate to prepare main agent A having a solid content of 60%. The main agent A is mixed with a curing agent KW-75 (polyisocyanate, manufactured by DIC) at a ratio of main agent / curing agent = 10: 1.4 (4.5 in terms of NCO / OH ratio (mol / mol)) and acetic acid. By diluting with ethyl, an adhesive (4) having a solid content of 35% was obtained as a blended solution.
（製造例５）接着剤（５）の作製
ディックドライＬＸ−９０６（ポリエステルポリオール、ＤＩＣ社製）とＥＰＩＣＬＯＮ−１０５０（エポキシ化合物、ＤＩＣ社製）の固形分質量比を１００／４０（ポリオール／エポキシ化合物）で混合し、酢酸エチルで希釈する事により固形分６０％の主剤Ａを調製した。主剤Ａに硬化剤ＫＷ−７５（ポリイソシアネート、ＤＩＣ社製）を主剤／硬化剤比率＝１０：１．８（ＮＣＯ／ＯＨ比（ｍｏｌ／ｍｏｌ）に換算し５．８）で混合し、酢酸エチルで希釈する事により配合液として固形分３５％の接着剤（５）を得た。(Production Example 5) Production of Adhesive (5) The solid mass ratio of Dick Dry LX-906 (polyester polyol, manufactured by DIC) and EPICLON-1050 (epoxy compound, manufactured by DIC) was 100/40 (polyol / epoxy). Compound A) and diluted with ethyl acetate to prepare main agent A having a solid content of 60%. The main agent A is mixed with a curing agent KW-75 (polyisocyanate, manufactured by DIC) at a ratio of main agent / curing agent = 10: 1.8 (5.8 in terms of NCO / OH ratio (mol / mol)) and acetic acid. By diluting with ethyl, an adhesive (5) having a solid content of 35% was obtained as a blended solution.
（製造例６）接着剤（６）の作製
ディックドライＬＸ−９０６（ポリエステルポリオール、ＤＩＣ社製）とＥＰＩＣＬＯＮ−１０５０（エポキシ化合物、ＤＩＣ社製）の固形分質量比を１００／４０（ポリオール／エポキシ化合物）で混合し、酢酸エチルで希釈する事により固形分６０％の主剤Ａを調製した。主剤Ａに硬化剤ＫＷ−７５（ポリイソシアネート、ＤＩＣ社製）を主剤／硬化剤比率＝１０：２．０（ＮＣＯ／ＯＨ比（ｍｏｌ／ｍｏｌ）に換算し６．５）で混合し、酢酸エチルで希釈する事により配合液として固形分３５％の接着剤（６）を得た。(Production Example 6) Production of Adhesive (6) The solid mass ratio of Dick Dry LX-906 (polyester polyol, manufactured by DIC) and EPICLON-1050 (epoxy compound, manufactured by DIC) was 100/40 (polyol / epoxy). Compound A) and diluted with ethyl acetate to prepare main agent A having a solid content of 60%. The main agent A was mixed with a curing agent KW-75 (polyisocyanate, manufactured by DIC) at a ratio of main agent / curing agent = 10: 2.0 (6.5 in terms of NCO / OH ratio (mol / mol)), and acetic acid. By diluting with ethyl, an adhesive (6) having a solid content of 35% was obtained as a blended solution.
（製造例Ｈ１）接着剤（Ｈ１）の作製
ディックドライＬＸ−９０６（ポリエステルポリオール、ＤＩＣ社製）とＥＰＩＣＬＯＮ−１０５０（エポキシ化合物、ＤＩＣ社製）の固形分質量比を１００／１０（ポリオール／エポキシ化合物）で混合し、酢酸エチルで希釈する事により固形分６０％の主剤Ａを調製した。主剤Ａに硬化剤ＫＷ−７５（ポリイソシアネート、ＤＩＣ社製）を主剤／硬化剤比率＝１０：１．６（ＮＣＯ／ＯＨ比（ｍｏｌ／ｍｏｌ）に換算し４．１）で混合し、酢酸エチルで希釈する事により配合液として固形分３５％の接着剤（Ｈ１）を得た。(Production Example H1) Production of Adhesive (H1) The solid mass ratio of Dick Dry LX-906 (polyester polyol, manufactured by DIC) and EPICLON-1050 (epoxy compound, manufactured by DIC) was 100/10 (polyol / epoxy). Compound A) and diluted with ethyl acetate to prepare main agent A having a solid content of 60%. The main agent A was mixed with a curing agent KW-75 (polyisocyanate, manufactured by DIC) at a main agent / curing agent ratio = 10: 1.6 (4.1 in terms of NCO / OH ratio (mol / mol)), and acetic acid. By diluting with ethyl, an adhesive (H1) having a solid content of 35% was obtained as a blended solution.
（製造例Ｈ２）接着剤（Ｈ２）の作製
ディックドライＬＸ−９０６（ポリエステルポリオール、ＤＩＣ社製）とＥＰＩＣＬＯＮ−１０５０（エポキシ化合物、ＤＩＣ社製）の固形分質量比を１００／７０（ポリオール／エポキシ化合物）で混合し、酢酸エチルで希釈する事により固形分６０％の主剤Ａを調製した。主剤Ａに硬化剤ＫＷ−７５（ポリイソシアネート、ＤＩＣ社製）を主剤／硬化剤比率＝１０：１．６（ＮＣＯ／ＯＨ比（ｍｏｌ／ｍｏｌ）に換算し６．３）で混合し、酢酸エチルで希釈する事により配合液として固形分３５％の接着剤（Ｈ２）を得た。(Production Example H2) Production of Adhesive (H2) The solid mass ratio of Dick Dry LX-906 (polyester polyol, manufactured by DIC) and EPICLON-1050 (epoxy compound, manufactured by DIC) was 100/70 (polyol / epoxy). Compound A) and diluted with ethyl acetate to prepare main agent A having a solid content of 60%. The main agent A was mixed with a curing agent KW-75 (polyisocyanate, manufactured by DIC) at a ratio of main agent / curing agent = 10: 1.6 (6.3 converted to NCO / OH ratio (mol / mol)), and acetic acid was mixed. By diluting with ethyl, an adhesive (H2) having a solid content of 35% was obtained as a blended solution.
（実施例１）接着剤（１）を用いたブリスターパック用積層体（１）の作製
軟質アルミニウム箔（厚さ４５μｍ）に接着剤（１）を固形分３．０ｇの塗布量でドライラミネーターによって塗布し、溶剤を揮散させた後、ＰＶＣ（厚さ６０μｍ）と貼り合わせて積層体を得た。次いで、二軸延伸ポリアミドフィルム（厚さ２５μｍ）に接着剤（１）を固形分３．０ｇの塗布量でドライラミネーターによって塗布し、溶剤を揮散させた後、前記積層体のアルミニウム面と貼り合わせ、４０℃で９６時間保温して接着剤を硬化させてブリスターパック用積層体（１）を得た。Example 1 Production of Blister Pack Laminate (1) Using Adhesive (1) Adhesive (1) was applied to a soft aluminum foil (thickness: 45 μm) with a dry laminator at a solid content of 3.0 g. After apply | coating and volatilizing a solvent, it bonded together with PVC (thickness 60 micrometers), and obtained the laminated body. Next, the adhesive (1) was applied to a biaxially stretched polyamide film (thickness 25 μm) with a dry laminator at a coating amount of solid content of 3.0 g, and the solvent was stripped, and then bonded to the aluminum surface of the laminate. The adhesive was cured by incubating at 40 ° C. for 96 hours to obtain a blister pack laminate (1).
（実施例２〜６）
接着剤（１）の代わりに接着剤（２）〜（６）を使用した以外は実施例１と同様にして、ブリスターパック用積層体（２）〜（６）を得た。(Examples 2 to 6)
Blister pack laminates (2) to (6) were obtained in the same manner as in Example 1 except that adhesives (2) to (6) were used in place of adhesive (1).
（比較例１）接着剤（Ｈ１）を用いたブリスターパック用積層体（２）の作製
接着剤（１）の代わりに製造例２で作製した接着剤（Ｈ１）を用いた他は積層体（１）と同様にしてブリスターパック用積層体（Ｈ１）を作製した。(Comparative Example 1) Production of Blister Pack Laminate (2) Using Adhesive (H1) Laminate (2) Other than using adhesive (H1) produced in Production Example 2 instead of adhesive (1) A blister pack laminate (H1) was prepared in the same manner as in 1).
（比較例２）接着剤（Ｈ２）を用いたブリスターパック用積層体の作製
接着剤（１）の代わりに製造例３で作製した接着剤（Ｈ２）を用いた他は積層体（１）と同様にしてブリスターパック用積層体（Ｈ２）を作製した。(Comparative Example 2) Preparation of Blister Pack Laminate Using Adhesive (H2) Laminate (1) except for using adhesive (H2) produced in Production Example 3 instead of adhesive (1) In the same manner, a blister pack laminate (H2) was produced.
（底材（１）の作製）
実施例（１）で得たブリスターパック用積層体（１）を縦横６０ｍｍに切断した。これを縦横各３０ｍｍの正方形金型で精密プレス機を用いてラミネート物に対して垂直方向に深さ６．０ｍｍにプレス成型を行い、底材（１）を得た。
なお、使用した金型のポンチ形状は、一辺３０ｍｍの正方形、コーナーＲ２ｍｍ、ポンチ肩Ｒ１ｍｍ。使用した金型のダイス孔形状は一片３４ｍｍの正方形、ダイス孔コーナーＲ２ｍｍ、ダイス孔肩Ｒ：１ｍｍであり、ポンチとダイス孔とのクリアランスは片側０．３ｍｍ。前記クリアランスにより成型高さに応じた傾斜が発生する。(Production of bottom material (1))
The blister pack laminate (1) obtained in Example (1) was cut into 60 mm length and width. This was press-molded to a depth of 6.0 mm in a vertical direction with respect to the laminate using a precision die machine with square molds of 30 mm in length and breadth to obtain a bottom material (1).
The punch shape of the mold used was a square with a side of 30 mm, a corner R2 mm, and a punch shoulder R1 mm. The die hole shape of the die used is a square of 34 mm per piece, a die hole corner R2 mm, a die hole shoulder R: 1 mm, and the clearance between the punch and the die hole is 0.3 mm on one side. An inclination corresponding to the molding height is generated by the clearance.
（底材（２）〜（６）、底材（Ｈ１）〜（Ｈ２）の作製）
ブリスターパック用積層体（１）の代わりにブリスターパック用積層体（２）〜（６）、（Ｈ１）〜（Ｈ２）を使用した以外は（底材（１）の作製）と同様にして、底材（２）〜（６）、底材（Ｈ１）〜（Ｈ２）を得た。(Production of bottom materials (2) to (6), bottom materials (H1) to (H2))
Except for using the blister pack laminate (2) to (6), (H1) to (H2) instead of the blister pack laminate (1), Bottom materials (2) to (6) and bottom materials (H1) to (H2) were obtained.
＜成型性の評価＞
底材（１）〜（６）、底材（Ｈ１）〜（Ｈ２）に対し、ポリアミド側を凸側としてプレス機で３ｃｍ四方、深さ６ｍｍの成型加工を行い成形物（１）〜（６）、成形物（Ｈ１）〜（Ｈ２）を得た。<Evaluation of moldability>
For the bottom materials (1) to (6) and the bottom materials (H1) to (H2), the polyamide side is the convex side, and a molding is performed with a pressing machine of 3 cm square and a depth of 6 mm. ) And molded products (H1) to (H2) were obtained.
（浮き面積）
得られた成型物の角部分について、ポリアミドがアルミ面から浮き上がる箇所の個数と面積を比較評価した。
ポリアミド浮き面積が５ｍｍ未満のもの：小
ポリアミド浮き面積が５ｍｍ以上１０ｍｍ未満：中
ポリアミド浮き面積が１０ｍｍ以上：大
とした。(Floating area)
About the corner | angular part of the obtained molding, the number and area of the location where polyamide floats from an aluminum surface were compared and evaluated.
Polyamide floating area of less than 5 mm: Small polyamide floating area of 5 mm or more and less than 10 mm: Medium polyamide floating area of 10 mm or more: Large.
（金属破断の個数）
得られた成型物について、アルミニウムが破断する箇所の個数を比較評価した。(Number of metal breaks)
About the obtained molding, the number of the location where aluminum fractures was compared and evaluated.
結果を表1に示す。 The results are shown in Table 1.
＜耐熱性の評価＞
（ブリスターパックの作製）
成型物（１）〜（６）、成型物（Ｈ１）〜（Ｈ２）に収納物を充填し、ヒートシール剤を塗布したアルミニウム箔（厚さ２５μm)を蓋材として、１８０℃２秒間の加熱により貼り合わせる事でブリスターパックを作製した。蓋材を貼り合わせるヒートシール工程後に成型物の角部分のポリアミドがアルミ面から浮き上がる箇所の個数と面積を比較評価した。<Evaluation of heat resistance>
(Production of blister pack)
Heating at 180 ° C. for 2 seconds using aluminum foil (thickness: 25 μm) filled with molded products (1) to (6) and molded products (H1) to (H2) filled with heat sealant. A blister pack was prepared by pasting together. After the heat sealing process for bonding the lid material, the number and area of the places where the polyamide at the corner of the molded product floats from the aluminum surface were compared and evaluated.
この結果、実施例の接着剤を使用したブリスターパック積層体は、成形後あるいはブリスターパック製造後も、ポリアミドとアルミ面との間の浮きがなく良好であった。一方比較例の接着剤を使用したブリスターパック積層体は、浮きが生じてしまった。 As a result, the blister pack laminates using the adhesives of the examples were good with no float between the polyamide and the aluminum surface even after molding or after manufacture of the blister pack. On the other hand, in the blister pack laminate using the adhesive of the comparative example, floating occurred.
Ａ：ＯＰコート
Ｂ：インキ
Ｃ：アルミニウム箔
Ｄ：ヒートシール性樹脂層
Ｅ：ポリ塩化ビニル(又は無延伸ポリプロピレン)
Ｆ：接着剤
Ｇ：アルミニウム箔
Ｈ：接着剤
Ｉ：ポリアミド(又はポリエチレンテレフタラート)
Ｊ：内容物
Ｋ：蓋材
Ｌ：底材A: OP coat B: Ink C: Aluminum foil D: Heat-sealable resin layer E: Polyvinyl chloride (or unstretched polypropylene)
F: Adhesive G: Aluminum foil H: Adhesive I: Polyamide (or polyethylene terephthalate)
J: Contents K: Lid L: Bottom material
Claims (7)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016173657 | 2016-09-06 | ||
| JP2016173657 | 2016-09-06 | ||
| PCT/JP2017/030887 WO2018047672A1 (en) | 2016-09-06 | 2017-08-29 | Adhesive, blister pack laminate and blister pack using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6308413B1 true JP6308413B1 (en) | 2018-04-11 |
| JPWO2018047672A1 JPWO2018047672A1 (en) | 2018-09-06 |
Family
ID=61562276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017561023A Active JP6308413B1 (en) | 2016-09-06 | 2017-08-29 | Adhesive, laminate for blister pack and blister pack using the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6308413B1 (en) |
| CN (1) | CN109642141A (en) |
| WO (1) | WO2018047672A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102246481B1 (en) * | 2020-10-08 | 2021-05-03 | 디아이씨 주식회사 | Plastic Sheet for Blister Packaging of Drugs and Process of Manufacturing the Sheet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0711225A (en) * | 1993-04-26 | 1995-01-13 | Takeda Chem Ind Ltd | Polyurethane adhesive composition |
| JP2010043238A (en) * | 2008-07-16 | 2010-02-25 | Toyo Ink Mfg Co Ltd | Polyurethane adhesive for outdoor use |
| WO2012029737A1 (en) * | 2010-08-31 | 2012-03-08 | Dic株式会社 | Adhesive composition for two-pack type laminate |
| JP2015003950A (en) * | 2013-06-19 | 2015-01-08 | Dic株式会社 | Novel polyester polyurethane polyol, polyol agent for two-liquid type laminate adhesive, resin composition, curable resin composition, adhesive for two-liquid type laminate and back sheet for solar cell |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122977A (en) * | 1982-01-18 | 1983-07-21 | Takeda Chem Ind Ltd | Composition for polyurethane adhesive |
| JP5294387B2 (en) * | 2008-02-29 | 2013-09-18 | コニシ株式会社 | Two-component curable composition |
| JP5267718B1 (en) * | 2012-11-01 | 2013-08-21 | 東洋インキＳｃホールディングス株式会社 | Polyurethane adhesive for battery packaging material, battery packaging material, battery container and battery |
| JP5382256B1 (en) * | 2013-07-19 | 2014-01-08 | 東洋インキＳｃホールディングス株式会社 | Battery packaging material, battery container and battery |
| JP6515809B2 (en) * | 2013-12-09 | 2019-05-22 | 東洋紡株式会社 | Polyester resin composition and adhesive composition |
| JP6478137B2 (en) * | 2014-02-21 | 2019-03-06 | 大日本印刷株式会社 | Laminated body and package using the same |
| CN104559903B (en) * | 2015-02-09 | 2018-03-20 | 北京高盟新材料股份有限公司 | It is cold to use adhesive and preparation method thereof into aluminium is compound |
| JP6384622B2 (en) * | 2016-07-26 | 2018-09-05 | Dic株式会社 | Resin composition and laminate |
-
2017
- 2017-08-29 WO PCT/JP2017/030887 patent/WO2018047672A1/en active Application Filing
- 2017-08-29 CN CN201780051060.8A patent/CN109642141A/en not_active Withdrawn
- 2017-08-29 JP JP2017561023A patent/JP6308413B1/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0711225A (en) * | 1993-04-26 | 1995-01-13 | Takeda Chem Ind Ltd | Polyurethane adhesive composition |
| JP2010043238A (en) * | 2008-07-16 | 2010-02-25 | Toyo Ink Mfg Co Ltd | Polyurethane adhesive for outdoor use |
| WO2012029737A1 (en) * | 2010-08-31 | 2012-03-08 | Dic株式会社 | Adhesive composition for two-pack type laminate |
| JP2015003950A (en) * | 2013-06-19 | 2015-01-08 | Dic株式会社 | Novel polyester polyurethane polyol, polyol agent for two-liquid type laminate adhesive, resin composition, curable resin composition, adhesive for two-liquid type laminate and back sheet for solar cell |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102246481B1 (en) * | 2020-10-08 | 2021-05-03 | 디아이씨 주식회사 | Plastic Sheet for Blister Packaging of Drugs and Process of Manufacturing the Sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018047672A1 (en) | 2018-09-06 |
| CN109642141A (en) | 2019-04-16 |
| WO2018047672A1 (en) | 2018-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104228210B (en) | Molding packaging material | |
| JP6612147B2 (en) | Adhesive composition, packaging material using the composition, battery exterior material, molded case, and electricity storage device | |
| JP6279973B2 (en) | Molding packaging material and molding case | |
| JP7033414B2 (en) | Packaging materials for molding, exterior cases for power storage devices and power storage devices | |
| KR20070046893A (en) | Formable film for cold-form, blister-type pharmaceutical packaging | |
| EP1647587A1 (en) | Laminating adhesives containing microencapsulated catalysts | |
| JP2015157363A (en) | Laminate and package using the same | |
| CN104828382B (en) | Packaging material is used in molding | |
| JP6308413B1 (en) | Adhesive, laminate for blister pack and blister pack using the same | |
| JP2021109706A (en) | Packaging material for molding | |
| JP6892036B1 (en) | Two-component adhesive, laminate, molded body, packaging material | |
| JP6384622B2 (en) | Resin composition and laminate | |
| KR20190079500A (en) | Exterior material for electricity storage device and electricity storage device | |
| JP2021102485A (en) | Packaging material and packaging container | |
| JP2000290631A (en) | Adhesive composition for laminate | |
| WO2019146756A1 (en) | Two-component curable solvent-free adhesive and laminate film | |
| JP2013039938A (en) | Paper container for liquid | |
| JPWO2020246243A1 (en) | Adhesives, battery packaging adhesives, laminates, battery packaging, battery containers and batteries | |
| JP2021102487A (en) | Packaging material and packaging container | |
| JP2017141057A (en) | Partition material film and multistage package | |
| WO2022130992A1 (en) | Multilayer body for blister packs, and blister pack | |
| CN111836866B (en) | Reactive adhesive, laminated film and packaging material | |
| JP7380842B2 (en) | Adhesives, laminates, packaging materials | |
| JP2019210413A (en) | Adhesive, laminate and method for producing laminate | |
| JP2023073648A (en) | Multilayer film using solventless type adhesive, method for producing the same, and packaging container |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171122 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171122 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20171122 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20171211 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180215 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180228 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 6308413 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| R157 | Certificate of patent or utility model (correction) |
Free format text: JAPANESE INTERMEDIATE CODE: R157 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |