JP6302303B2 - 半導体発光素子 - Google Patents
半導体発光素子 Download PDFInfo
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- JP6302303B2 JP6302303B2 JP2014054157A JP2014054157A JP6302303B2 JP 6302303 B2 JP6302303 B2 JP 6302303B2 JP 2014054157 A JP2014054157 A JP 2014054157A JP 2014054157 A JP2014054157 A JP 2014054157A JP 6302303 B2 JP6302303 B2 JP 6302303B2
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- 239000004065 semiconductor Substances 0.000 title claims description 159
- 150000004767 nitrides Chemical class 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 239000010931 gold Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H01—ELECTRIC ELEMENTS
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
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Description
なお、図面は模式的または概念的なものであり、各部分の厚みと幅との関係、部分間の大きさの比率などは、必ずしも現実のものと同一とは限らない。また、同じ部分を表す場合であっても、図面により互いの寸法や比率が異なって表される場合もある。
なお、本願明細書と各図において、既出の図に関して前述したものと同様の要素には同一の符号を付して詳細な説明は適宜省略する。
図2は、実施形態に係る半導体発光素子を例示する模式的平面図である。
図1は、図2のA1−A2線断面を例示している。
図1及び図2に表したように、実施形態に係る半導体発光素子110は、第1電極51と、第1半導体層10と、発光層30と、第2半導体層20と、第2電極62と、第1絶縁部41と、第1導電層55と、を含む。
図3に表したように、半導体発光素子110において、第1導電層55は、接触部分55cに加えて導電膜55fをさらに含む。導電膜55fは、接触部分55cと第1領域R1との間に設けられる。
図4(a)〜図4(c)、及び、図5(a)及び図5(b)は、実施形態に係る半導体発光素子の製造方法を例示する工程順模式的断面図である。
これにより、半導体発光素子110が形成される。
図6に表したように、本実施形態に係る半導体発光素子111においては、第1半導体層10において、凹凸15pが設けられた部分と、凹凸15pが設けられていない部分と、が設けられている。
図7は、第1界面IF1が(0001)面である場合と、(000−1)面である場合と、(11−22)面である場合と、におけるコンタクト抵抗Rc1の実験結果を例示している。横軸は、熱処理の温度Tn(℃)である。縦軸は、コンタクト抵抗Rc1(Ω・cm2)である。
図8は、p側の電極(第2電極62)におけるコンタクト抵抗Rc2と、熱処理の温度と、の関係を示す。横軸は、熱処理の温度Tnである。縦軸は、コンタクト抵抗Rc2である。
図9に表したように、発光層30は、複数の障壁層31と、複数の障壁層31どうしの間に設けられた井戸層32と、を含む。例えば、複数の障壁層31と、複数の井戸層32と、がZ軸に沿って交互に積層される。
この例では、半導体発光素子110が用いられているが、半導体発光素子111または、それらの変形を用いても良い。
Claims (14)
- 第1領域と、第1方向において前記第1領域と並ぶ第2領域と、を含む第1電極と、
前記第1方向と交差する第2方向において前記第1領域と離間する第1半導体層であって、第1部分と、前記第2方向と交差する方向において前記第1部分と並ぶ第2部分と、を含む第1導電形の第1半導体層と、
前記第2部分と前記第1領域との間に設けられた発光層と、
前記発光層と前記第1領域との間に設けられた第2導電形の第2半導体層と、
前記第1領域と前記第2半導体層との間に設けられ前記第2半導体層と接する第2電極と、
前記第1領域と前記第2電極との間に設けられた第1絶縁部と、
前記第1部分と前記第1領域との間に設けられ、前記第1部分と接する接触部分を有し前記第1領域と電気的に接続された第1導電層と、
を備え、
前記第1部分と前記接触部分との間の第1界面は、前記第2半導体層と前記第2電極との間の第2界面に対して傾斜しており、
前記第1半導体層は、窒化物半導体を含み、
前記第2半導体層は、窒化物半導体を含み、
前記第2界面と、前記第1半導体層のc面と、の間の角度の絶対値は、5度以下であり、
前記第1界面と、前記第1半導体層のc面と、の間の角度の絶対値は、50度以上70度以下である、半導体発光素子。 - 前記第1界面と、前記第1半導体層のc面と、の間の角度の絶対値は、52.5度以上56.5度以下である請求項1記載の半導体発光素子。
- 前記第1界面と、前記第1半導体層のc面と、の間の角度の絶対値は、60度以上64度以下である請求項1記載の半導体発光素子。
- 前記接触部分は、アルミニウムを含む請求項1〜3のいずれか1つに記載の半導体発光素子。
- 前記第1導電層は、前記接触部分と前記第1領域との間に設けられた導電膜をさらに含む請求項1〜4のいずれか1つに記載の半導体発光素子。
- 前記第2電極は、銀を含む請求項1〜5のいずれか1つに記載の半導体発光素子。
- 前記第2方向と交差する平面に投影したときに前記第2領域と重なる第3電極と、
前記第2電極と前記第3電極とを電気的に接続する第2導電層と、
前記第2導電層と前記第2領域との間に設けられた第2絶縁部と、
をさらに備えた請求項1〜6のいずれか1つに記載の半導体発光素子。 - 前記第1絶縁部は、前記第2電極の側面を覆う請求項1〜7のいずれか1つに記載の半導体発光素子。
- 前記第1絶縁部は、前記第2半導体層の側面と前記第1電極との間、及び、前記発光層の側面と前記第1電極との間に延在する請求項1〜8のいずれか1つに記載の半導体発光素子。
- 前記第1絶縁部は、前記第1部分の一部と前記第1領域との間に延在する請求項1〜9のいずれか1つに記載の半導体発光素子。
- 前記第1半導体層と前記第2半導体層と前記発光層とを含む積層部の側面は、前記第2界面に対して傾斜している請求項1〜10のいずれか1つに記載の半導体発光素子。
- 基部をさらに備え、
前記基部と前記第1絶縁部との間に前記第1電極が配置される請求項1〜11のいずれか1つに記載の半導体発光素子。 - 前記基部は、金属または半導体である請求項12記載の半導体発光素子。
- 前記第1界面の前記第2方向に沿った長さは、0.1μm以上10μm以下である請求項1〜13のいずれか1つに記載の半導体発光素子。
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JP2014054157A JP6302303B2 (ja) | 2014-03-17 | 2014-03-17 | 半導体発光素子 |
US14/632,131 US20150263223A1 (en) | 2014-03-17 | 2015-02-26 | Semiconductor light emitting element |
TW104106325A TW201547055A (zh) | 2014-03-17 | 2015-02-26 | 半導體發光元件 |
EP15156997.7A EP2922102A1 (en) | 2014-03-17 | 2015-02-27 | Semiconductor light emitting element |
KR1020150031582A KR20150108315A (ko) | 2014-03-17 | 2015-03-06 | 반도체 발광 소자 |
CN201510107845.5A CN104934511A (zh) | 2014-03-17 | 2015-03-12 | 半导体发光元件 |
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JP2014054157A JP6302303B2 (ja) | 2014-03-17 | 2014-03-17 | 半導体発光素子 |
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JP2015177135A5 JP2015177135A5 (ja) | 2017-03-02 |
JP6302303B2 true JP6302303B2 (ja) | 2018-03-28 |
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KR (1) | KR20150108315A (ja) |
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TW (1) | TW201547055A (ja) |
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KR20140007348A (ko) * | 2010-12-28 | 2014-01-17 | 도와 일렉트로닉스 가부시키가이샤 | 반도체 장치 및 그 제조 방법 |
TWI435477B (zh) * | 2010-12-29 | 2014-04-21 | Lextar Electronics Corp | 高亮度發光二極體 |
JP5050109B2 (ja) * | 2011-03-14 | 2012-10-17 | 株式会社東芝 | 半導体発光素子 |
KR101827975B1 (ko) * | 2011-10-10 | 2018-03-29 | 엘지이노텍 주식회사 | 발광소자 |
JP5983125B2 (ja) * | 2012-07-18 | 2016-08-31 | 日亜化学工業株式会社 | 半導体発光素子の製造方法 |
JP6052962B2 (ja) * | 2012-08-03 | 2016-12-27 | スタンレー電気株式会社 | 半導体発光装置 |
JP6287317B2 (ja) * | 2013-02-28 | 2018-03-07 | 日亜化学工業株式会社 | 半導体発光素子 |
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- 2015-02-27 EP EP15156997.7A patent/EP2922102A1/en not_active Withdrawn
- 2015-03-06 KR KR1020150031582A patent/KR20150108315A/ko not_active Application Discontinuation
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TW201547055A (zh) | 2015-12-16 |
JP2015177135A (ja) | 2015-10-05 |
CN104934511A (zh) | 2015-09-23 |
EP2922102A1 (en) | 2015-09-23 |
KR20150108315A (ko) | 2015-09-25 |
US20150263223A1 (en) | 2015-09-17 |
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