JP6289421B2 - 電子機器ケース - Google Patents
電子機器ケース Download PDFInfo
- Publication number
- JP6289421B2 JP6289421B2 JP2015152327A JP2015152327A JP6289421B2 JP 6289421 B2 JP6289421 B2 JP 6289421B2 JP 2015152327 A JP2015152327 A JP 2015152327A JP 2015152327 A JP2015152327 A JP 2015152327A JP 6289421 B2 JP6289421 B2 JP 6289421B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- device case
- screw
- mounting
- screw receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 238000009434 installation Methods 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 10
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connection Or Junction Boxes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015152327A JP6289421B2 (ja) | 2015-07-31 | 2015-07-31 | 電子機器ケース |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015152327A JP6289421B2 (ja) | 2015-07-31 | 2015-07-31 | 電子機器ケース |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017033755A JP2017033755A (ja) | 2017-02-09 |
JP2017033755A5 JP2017033755A5 (ko) | 2018-01-11 |
JP6289421B2 true JP6289421B2 (ja) | 2018-03-07 |
Family
ID=57988595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015152327A Active JP6289421B2 (ja) | 2015-07-31 | 2015-07-31 | 電子機器ケース |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6289421B2 (ko) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS643325U (ko) * | 1987-06-25 | 1989-01-10 | ||
US5194019A (en) * | 1992-04-23 | 1993-03-16 | Amp Incorporated | Multiply orientable mounting arrangement |
JP4516829B2 (ja) * | 2004-11-24 | 2010-08-04 | マスプロ電工株式会社 | 分岐及び分配器 |
-
2015
- 2015-07-31 JP JP2015152327A patent/JP6289421B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017033755A (ja) | 2017-02-09 |
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