JP6288491B2 - キャリア箔付き金属箔、樹脂付き金属箔及び金属箔張り積層体 - Google Patents
キャリア箔付き金属箔、樹脂付き金属箔及び金属箔張り積層体 Download PDFInfo
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- JP6288491B2 JP6288491B2 JP2013192928A JP2013192928A JP6288491B2 JP 6288491 B2 JP6288491 B2 JP 6288491B2 JP 2013192928 A JP2013192928 A JP 2013192928A JP 2013192928 A JP2013192928 A JP 2013192928A JP 6288491 B2 JP6288491 B2 JP 6288491B2
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- Prior art keywords
- foil
- metal foil
- carrier
- metal
- copper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011888 foil Substances 0.000 title claims description 269
- 229910052751 metal Inorganic materials 0.000 title claims description 172
- 239000002184 metal Substances 0.000 title claims description 172
- 229920005989 resin Polymers 0.000 title claims description 33
- 239000011347 resin Substances 0.000 title claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 58
- 239000011889 copper foil Substances 0.000 claims description 39
- 239000004840 adhesive resin Substances 0.000 claims description 9
- 229920006223 adhesive resin Polymers 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 26
- 239000010410 layer Substances 0.000 description 25
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- 238000007747 plating Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910000457 iridium oxide Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- RWVGQQGBQSJDQV-UHFFFAOYSA-M sodium;3-[[4-[(e)-[4-(4-ethoxyanilino)phenyl]-[4-[ethyl-[(3-sulfonatophenyl)methyl]azaniumylidene]-2-methylcyclohexa-2,5-dien-1-ylidene]methyl]-n-ethyl-3-methylanilino]methyl]benzenesulfonate Chemical compound [Na+].C1=CC(OCC)=CC=C1NC1=CC=C(C(=C2C(=CC(C=C2)=[N+](CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C=2C(=CC(=CC=2)N(CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C=C1 RWVGQQGBQSJDQV-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical class NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 description 1
- 239000003984 copper intrauterine device Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- ZLBCIBZQSOEJSC-UHFFFAOYSA-N n-[2-(4-methylphenyl)propan-2-yl]-2-(propylamino)acetamide Chemical compound CCCNCC(=O)NC(C)(C)C1=CC=C(C)C=C1 ZLBCIBZQSOEJSC-UHFFFAOYSA-N 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
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- Production Of Multi-Layered Print Wiring Board (AREA)
Description
1. 金属箔と、この金属箔から物理的に剥離可能なキャリア箔とを有するキャリア箔付き金属箔であって、前記金属箔とキャリア箔とを合わせた厚みが12μm以下であり、前記キャリア箔が引張強さ600MPa以上の銅箔で、金属箔と反対側のキャリア箔表面に粗化層が設けられた、キャリア箔と金属箔を貫通し非貫通穴を形成するダイレクトレーザ加工用キャリア箔付き金属箔。
2. 項1において、キャリア箔の厚みが6〜11μmであるダイレクトレーザ加工用キャリア箔付き金属箔。
3. 項1又は2のダイレクトレーザ加工用キャリア箔付き金属箔の金属箔のキャリア箔と反対側の面に、接着用の樹脂を配置した樹脂付き金属箔。
4. 項1又は2のダイレクトレーザ加工用キャリア箔付き金属箔の金属箔のキャリア箔との反対側に絶縁樹脂と導体とを配置した金属箔張り積層体。
本発明の一実施形態のキャリア箔付き金属箔を、図1を用いて、以下に説明する。
本発明の一実施形態の樹脂付き金属箔を、図2を用いて、以下に説明する。
本発明の一実施形態の金属箔張り積層体を、図3を用いて、以下に説明する。
図1に示すように、金属箔3bと、この金属箔3bから物理的に剥離可能なキャリア箔3aとを有するキャリア箔付き金属箔3であって、金属箔3bとキャリア箔3aとを合わせた厚みが12μmであるキャリア箔付き金属箔3を作製した。
参考例1と同様に、図1に示すようなキャリア箔付き金属箔3を作製した。
(比較例)
参考例1と同様に、図1に示すようなキャリア箔付き金属箔3を作製した。
2:絶縁樹脂
3:キャリア箔付き金属箔
3a:キャリア箔
3b:金属箔
4:粗化層
5:非貫通孔
6:飛散した銅
7:層間接続銅めっき層又はめっき
8:樹脂付き金属箔
9:金属箔張り積層体
10:配線板
Claims (4)
- 金属箔と、この金属箔から物理的に剥離可能なキャリア箔とを有するキャリア箔付き金属箔であって、前記金属箔とキャリア箔とを合わせた厚みが12μm以下であり、前記キャリア箔が引張強さ600MPa以上の銅箔で、金属箔と反対側のキャリア箔表面に粗化層が設けられた、キャリア箔と金属箔を貫通し非貫通穴を形成するダイレクトレーザ加工用キャリア箔付き金属箔。
- 請求項1において、キャリア箔の厚みが6〜11μmであるダイレクトレーザ加工用キャリア箔付き金属箔。
- 請求項1又は2のダイレクトレーザ加工用キャリア箔付き金属箔の金属箔のキャリア箔と反対側の面に、接着用の樹脂を配置した樹脂付き金属箔。
- 請求項1又は2のダイレクトレーザ加工用キャリア箔付き金属箔の金属箔のキャリア箔との反対側に絶縁樹脂と導体とを配置した金属箔張り積層体。
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JP2013192928A JP6288491B2 (ja) | 2013-09-18 | 2013-09-18 | キャリア箔付き金属箔、樹脂付き金属箔及び金属箔張り積層体 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2013192928A JP6288491B2 (ja) | 2013-09-18 | 2013-09-18 | キャリア箔付き金属箔、樹脂付き金属箔及び金属箔張り積層体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015060913A JP2015060913A (ja) | 2015-03-30 |
JP6288491B2 true JP6288491B2 (ja) | 2018-03-07 |
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JP2013192928A Active JP6288491B2 (ja) | 2013-09-18 | 2013-09-18 | キャリア箔付き金属箔、樹脂付き金属箔及び金属箔張り積層体 |
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Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4300870B2 (ja) * | 2003-05-08 | 2009-07-22 | 日立化成工業株式会社 | プリント配線板の製造方法 |
JP2008251941A (ja) * | 2007-03-30 | 2008-10-16 | Nippon Steel Chem Co Ltd | キャリア銅箔付極薄銅箔を用いたフレキシブル銅張積層板の製造方法 |
JP2009164492A (ja) * | 2008-01-09 | 2009-07-23 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
MY149431A (en) * | 2008-03-26 | 2013-08-30 | Sumitomo Bakelite Co | Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device |
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