JP6280244B2 - 構成可能/制御可能等価直列抵抗を有する埋込みパッケージ基板キャパシタ - Google Patents
構成可能/制御可能等価直列抵抗を有する埋込みパッケージ基板キャパシタ Download PDFInfo
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- JP6280244B2 JP6280244B2 JP2016565648A JP2016565648A JP6280244B2 JP 6280244 B2 JP6280244 B2 JP 6280244B2 JP 2016565648 A JP2016565648 A JP 2016565648A JP 2016565648 A JP2016565648 A JP 2016565648A JP 6280244 B2 JP6280244 B2 JP 6280244B2
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- 239000003990 capacitor Substances 0.000 title claims description 187
- 239000000758 substrate Substances 0.000 title description 79
- 229910052751 metal Inorganic materials 0.000 claims description 106
- 239000002184 metal Substances 0.000 claims description 106
- 239000010410 layer Substances 0.000 description 187
- 238000000034 method Methods 0.000 description 67
- 230000008569 process Effects 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 27
- 230000008878 coupling Effects 0.000 description 10
- 238000010168 coupling process Methods 0.000 description 10
- 238000005859 coupling reaction Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000012212 insulator Substances 0.000 description 7
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000012792 core layer Substances 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MECHNRXZTMCUDQ-RKHKHRCZSA-N vitamin D2 Chemical compound C1(/[C@@H]2CC[C@@H]([C@]2(CCC1)C)[C@H](C)/C=C/[C@H](C)C(C)C)=C\C=C1\C[C@@H](O)CCC1=C MECHNRXZTMCUDQ-RKHKHRCZSA-N 0.000 description 1
- 235000001892 vitamin D2 Nutrition 0.000 description 1
- 239000011653 vitamin D2 Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/106—Fixing the capacitor in a housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Ceramic Capacitors (AREA)
Description
本出願は、参照によりその内容全体が本明細書に組み込まれる、2014年5月7日に米国特許商標庁に出願された米国非仮特許出願第14/272356号の優先権および利益を主張するものである。
概説
埋込みパッケージ基板キャパシタを有する例示的パッケージング基板
EPSキャパシタを製造するための例示的シーケンス
構成可能/制御可能ESRキャパシタを製造するための例示的流れ図
パッケージ基板の中にESRキャパシタを製造するための例示的シーケンス
埋込み構成可能/制御可能ESRキャパシタを有するパッケージ基板を製作するための方法の例示的流れ図
例示的電子デバイス
102、802、1112 基板
104、814、1104c、1106 誘電体層
106、108、110、112、803 導電層
114、116、804 埋込みパッケージ基板(EPS)キャパシタ
118a、118b、120a、120b、122a、122b、124a、124b、806、809、1318、1320、1368、1370、1372、1374 ビア
300 従来のキャパシタ
302 外部電極
304 内部電極
306 高抵抗材料
402、406 極板
404、408 縁
410 実効面積
412、414 終端ペースト
800 パッケージング基板
805 非導電性誘電体層
807 絶縁性薄膜材料
810 等価直列抵抗(ESR)制御構造
812、1110 金属層
816 金属ピラー
1100 キャリア
1100a キャリアの上部表面
1100b キャリアの下部表面
1102、1308 キャビティ
1104 キャパシタ
1104a 第1の電極
1104b 第2の電極
1105 キャリアの部分図
1108 孔
1114 キャパシタパッド
1115 キャリアの単体化された部分(キャパシタ)
1116 構成可能/制御可能ESRキャパシタ
1300、1326、1330、1336、1340、1350、1360 中間製造ステージ
1302 第1の絶縁体層(コア層)
1304 第1の内部金属層
1305 第2の絶縁体層
1306 第2の内部金属層
1307 第3の絶縁体層
1310、1312、1314、1316 トレース
1322、1324 金属ビア
1328 粘着テープ
1332、1338、1362、1364 誘電体
1334 ビア孔
1342、1344、1346、1348 金属充填領域
1352、1354、1356、1358 拡張パッド
1366 最終製造ステージ
1500 集積デバイス
1502 モバイル電話
1504 ラップトップコンピュータ
1506 固定位置端末
Claims (4)
- 第1の表面及び反対側の第2の表面を備える第1の電極と、
第3の表面及び反対側の第4の表面を備える第2の電極と、
前記第1の電極及び前記第2の電極に結合され、且つ、前記第1の電極及び前記第2の電極を分離する第1の誘電体層と、
前記第1の電極に結合され、且つ、第1の等価直列抵抗値を有する第1の等価直列抵抗制御構造体であって、
前記第1の電極の前記第1の表面に結合された第2の誘電体層と、
前記第2の誘電体層の第1の表面に結合された第1の金属層と、
前記第2の誘電体層の中に埋め込まれ、且つ、前記第1の電極と前記第1の金属層との間に延在する第1の組のピラーと、
を備える第1の等価直列抵抗制御構造体と、
前記第1の電極に結合され、且つ、前記第1の等価直列抵抗値とは異なる第2の等価直列抵抗値を有する第2の等価直列抵抗制御構造体であって、
前記第1の電極の前記第2の表面に結合された第3の誘電体層と、
前記第3の誘電体層の第1の表面に結合された第2の金属層と、
前記第3の誘電体層の中に埋め込まれ、且つ、前記第1の電極と前記第2の金属層との間に延在する第2の組のピラーと、
を備えるキャパシタ構造体。 - 前記第1の電極の前記第1の表面が上部表面であり、前記第1の電極の前記第2の表面が下部表面である、請求項1に記載のキャパシタ構造体。
- 前記第1の組のピラーのピラー総数が前記第2の組のピラーのピラー総数と同じである、請求項1に記載のキャパシタ構造体。
- 前記第1の組のピラーのピラー総数が前記第2の組のピラーのピラー総数と異なる、請求項1に記載のキャパシタ構造体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/272,356 | 2014-05-07 | ||
US14/272,356 US9449762B2 (en) | 2014-05-07 | 2014-05-07 | Embedded package substrate capacitor with configurable/controllable equivalent series resistance |
PCT/US2015/026199 WO2015171284A2 (en) | 2014-05-07 | 2015-04-16 | Embedded package substrate capacitor with configurable/controllable equivalent series resistance |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017194913A Division JP2018006778A (ja) | 2014-05-07 | 2017-10-05 | 構成可能/制御可能等価直列抵抗を有する埋込みパッケージ基板キャパシタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017519355A JP2017519355A (ja) | 2017-07-13 |
JP6280244B2 true JP6280244B2 (ja) | 2018-02-14 |
Family
ID=53015956
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016565648A Expired - Fee Related JP6280244B2 (ja) | 2014-05-07 | 2015-04-16 | 構成可能/制御可能等価直列抵抗を有する埋込みパッケージ基板キャパシタ |
JP2017194913A Pending JP2018006778A (ja) | 2014-05-07 | 2017-10-05 | 構成可能/制御可能等価直列抵抗を有する埋込みパッケージ基板キャパシタ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017194913A Pending JP2018006778A (ja) | 2014-05-07 | 2017-10-05 | 構成可能/制御可能等価直列抵抗を有する埋込みパッケージ基板キャパシタ |
Country Status (5)
Country | Link |
---|---|
US (1) | US9449762B2 (ja) |
EP (1) | EP3140839B1 (ja) |
JP (2) | JP6280244B2 (ja) |
CN (1) | CN106463261A (ja) |
WO (1) | WO2015171284A2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160055976A1 (en) * | 2014-08-25 | 2016-02-25 | Qualcomm Incorporated | Package substrates including embedded capacitors |
KR102037264B1 (ko) * | 2014-12-15 | 2019-10-29 | 삼성전기주식회사 | 기판 내장용 소자, 그 제조 방법 및 소자 내장 인쇄회로기판 |
US9872392B2 (en) * | 2016-06-08 | 2018-01-16 | International Business Machines Corporation | Power decoupling attachment |
JP7019946B2 (ja) * | 2016-12-05 | 2022-02-16 | 株式会社村田製作所 | 積層コンデンサ内蔵基板 |
WO2018125097A1 (en) * | 2016-12-28 | 2018-07-05 | Xu Yi Elyn | Embedded component and methods of making the same |
US11091825B2 (en) | 2017-04-19 | 2021-08-17 | Daido Steel Co., Ltd. | Prehardened steel material, mold, and mold component |
DE112021001168B4 (de) * | 2020-03-19 | 2023-10-12 | Rohm Co., Ltd. | Halbleiterbauteil |
CN117560860A (zh) * | 2022-08-04 | 2024-02-13 | 辉达公司 | 堆叠多个印刷电路板的方法和配置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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US5541442A (en) | 1994-08-31 | 1996-07-30 | International Business Machines Corporation | Integrated compact capacitor-resistor/inductor configuration |
US5946567A (en) | 1998-03-20 | 1999-08-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for making metal capacitors for deep submicrometer processes for semiconductor integrated circuits |
JP4641589B2 (ja) * | 2000-05-19 | 2011-03-02 | イビデン株式会社 | コンデンサおよび多層プリント配線板 |
JP4863546B2 (ja) * | 2000-07-21 | 2012-01-25 | イビデン株式会社 | コンデンサ内蔵プリント配線板及びコンデンサ内蔵プリント配線板の製造方法 |
US6545346B2 (en) * | 2001-03-23 | 2003-04-08 | Intel Corporation | Integrated circuit package with a capacitor |
JP2004152796A (ja) * | 2002-10-28 | 2004-05-27 | Toshiba Corp | 半導体装置及びその製造方法 |
JP4499548B2 (ja) * | 2004-12-24 | 2010-07-07 | 新光電気工業株式会社 | キャパシタ部品 |
US20070054420A1 (en) | 2005-09-06 | 2007-03-08 | Agency For Science, Technology And Research | Substrate structure and method for wideband power decoupling |
WO2007046173A1 (ja) | 2005-10-18 | 2007-04-26 | Murata Manufacturing Co., Ltd. | 薄膜キャパシタ |
JP2007311539A (ja) * | 2006-05-18 | 2007-11-29 | Nec Electronics Corp | 半導体装置 |
KR100992286B1 (ko) | 2008-10-10 | 2010-11-05 | 삼성전기주식회사 | 적층형 칩 커패시터 |
US8264816B2 (en) | 2009-08-24 | 2012-09-11 | Kemet Electronics Corporation | Externally fused and resistively loaded safety capacitor |
JP5246207B2 (ja) * | 2010-06-04 | 2013-07-24 | 株式会社村田製作所 | チップ型電子部品 |
US8410579B2 (en) * | 2010-12-07 | 2013-04-02 | Xilinx, Inc. | Power distribution network |
US9153504B2 (en) * | 2013-10-11 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal insulator metal capacitor and method for making the same |
-
2014
- 2014-05-07 US US14/272,356 patent/US9449762B2/en active Active
-
2015
- 2015-04-16 EP EP15719383.0A patent/EP3140839B1/en not_active Not-in-force
- 2015-04-16 CN CN201580022851.9A patent/CN106463261A/zh active Pending
- 2015-04-16 JP JP2016565648A patent/JP6280244B2/ja not_active Expired - Fee Related
- 2015-04-16 WO PCT/US2015/026199 patent/WO2015171284A2/en active Application Filing
-
2017
- 2017-10-05 JP JP2017194913A patent/JP2018006778A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN106463261A (zh) | 2017-02-22 |
US9449762B2 (en) | 2016-09-20 |
WO2015171284A3 (en) | 2015-12-30 |
EP3140839B1 (en) | 2018-05-23 |
JP2018006778A (ja) | 2018-01-11 |
WO2015171284A2 (en) | 2015-11-12 |
US20150325375A1 (en) | 2015-11-12 |
JP2017519355A (ja) | 2017-07-13 |
EP3140839A2 (en) | 2017-03-15 |
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