JP6272472B2 - 流路部材およびこれを用いた熱交換器ならびに半導体モジュール - Google Patents
流路部材およびこれを用いた熱交換器ならびに半導体モジュール Download PDFInfo
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- JP6272472B2 JP6272472B2 JP2016523485A JP2016523485A JP6272472B2 JP 6272472 B2 JP6272472 B2 JP 6272472B2 JP 2016523485 A JP2016523485 A JP 2016523485A JP 2016523485 A JP2016523485 A JP 2016523485A JP 6272472 B2 JP6272472 B2 JP 6272472B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/05316—Assemblies of conduits connected to common headers, e.g. core type radiators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/04—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
- F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05358—Assemblies of conduits connected side by side or with individual headers, e.g. section type radiators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
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- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
また、内部に流路を備えるセラミックスの基体と、該基体の外表面に備えられた複数の突起とを有し、該突起を備える前記基体の外表面を突起面としたとき、前記突起が前記突起面のうち前記流路と対応する領域外の領域のみに存在することを特徴とする。
また、内部に流路を備えるセラミックスの基体および該基体の外表面に備えられた複数の突起を有する流路部材と、該流路部材の前記突起を備える突起面に設けられた金属層と、該金属層上に搭載された半導体素子とを備えることを特徴とする。
2:突起
3:流路
4:ベース部
5:導入口
6:導出口
7:流体導入部材
8:流体導出部材
9:入側流路
11:出側流路
12:金属層
13:半導体素子
10、20、30、100:流路部材
40:熱交換器
50:半導体モジュール
Claims (11)
- 内部に流路を備える炭化珪素質焼結体の基体と、該基体の外表面に備えられた複数の突起とを有し、該突起の半数以上が単独の炭化珪素粒子からなることを特徴とする流路部材。
- 内部に流路を備えるセラミックスの基体と、該基体の外表面に備えられた複数の突起とを有し、該突起を備える前記基体の外表面を突起面としたとき、前記突起が前記突起面のうち前記流路と対応する領域外の領域のみに存在することを特徴とする流路部材。
- 前記セラミックスが炭化珪素質焼結体であり、前記突起が炭化珪素粒子を含むことを特徴とする請求項2に記載の流路部材。
- 前記突起の半数以上が単独の炭化珪素粒子からなることを特徴とする請求項3に記載の流路部材。
- 前記単独の炭化珪素粒子の平均粒径が、前記炭化珪素質焼結体における炭化珪素結晶の平均結晶粒径よりも大きいことを特徴とする請求項1または請求項4に記載の流路部材。
- 前記突起を備える前記基体の外表面を突起面としたとき、前記突起面における粗さ曲線の最大高さが20μm以上40μm以下であることを特徴とする請求項1乃至請求項5のいずれかに記載の流路部材。
- 前記突起が前記流路を流れる流体の流れ方向に沿って列状をなしていることを特徴とする請求項1乃至請求項6のいずれかに記載の流路部材。
- 請求項1乃至請求項7のいずれかに記載の流路部材の複数個と、それぞれの前記流路部材における前記流路の流入口と連通するように前記流路部材間に配置された流体導入部材と、それぞれの前記流路部材における前記流路の流出口と連通するように前記流路部材間に配置された流体導出部材と、を備えていることを特徴とする熱交換器。
- 前記流体導入部材および前記流体導出部材が、前記流路部材の複数の突起を備えている部分において接合されていることを特徴とする請求項8に記載の熱交換器。
- 請求項1乃至請求項7のいずれかに記載の流路部材と、該流路部材の前記突起を備える
突起面に設けられた金属層と、該金属層上に搭載された半導体素子とを備えることを特徴とする半導体モジュール。 - 内部に流路を備えるセラミックスの基体および該基体の外表面に備えられた複数の突起を有する流路部材と、該流路部材の前記突起を備える突起面に設けられた金属層と、該金属層上に搭載された半導体素子とを備えることを特徴とする半導体モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014110307 | 2014-05-28 | ||
JP2014110307 | 2014-05-28 | ||
PCT/JP2015/064924 WO2015182553A1 (ja) | 2014-05-28 | 2015-05-25 | 流路部材およびこれを用いた熱交換器ならびに半導体モジュール |
Publications (2)
Publication Number | Publication Date |
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JPWO2015182553A1 JPWO2015182553A1 (ja) | 2017-04-20 |
JP6272472B2 true JP6272472B2 (ja) | 2018-01-31 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016523485A Active JP6272472B2 (ja) | 2014-05-28 | 2015-05-25 | 流路部材およびこれを用いた熱交換器ならびに半導体モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US9953898B2 (ja) |
EP (1) | EP3150955B1 (ja) |
JP (1) | JP6272472B2 (ja) |
WO (1) | WO2015182553A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016017697A1 (ja) * | 2014-07-29 | 2016-02-04 | 京セラ株式会社 | 熱交換器 |
JP2018048789A (ja) * | 2016-09-23 | 2018-03-29 | 大同メタル工業株式会社 | 熱交換体 |
EP3575722B1 (en) * | 2017-01-30 | 2023-04-12 | KYOCERA Corporation | Heat exchanger |
DE102018211593A1 (de) | 2018-07-12 | 2019-07-25 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines Cordierit-Körpers und Cordierit-Körper |
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JPS58190364U (ja) * | 1982-06-14 | 1983-12-17 | 東洋ラジエーター株式会社 | 冷媒蒸発器用の偏平チユ−ブ |
JPS60165498A (ja) * | 1984-02-09 | 1985-08-28 | Ngk Insulators Ltd | 熱交換器 |
JPS63189793A (ja) * | 1987-02-02 | 1988-08-05 | Mitsubishi Electric Corp | 蒸発・凝縮用伝熱管 |
JPH0271094A (ja) * | 1988-09-05 | 1990-03-09 | Bando Chem Ind Ltd | 樹脂製熱交換管 |
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JP2001221581A (ja) * | 2000-01-07 | 2001-08-17 | Renzmann & Gruenewald Gmbh | 螺線状熱交換器 |
JP2001324289A (ja) * | 2000-05-16 | 2001-11-22 | Toshiba Ceramics Co Ltd | 高温用熱交換器 |
JP2002329938A (ja) * | 2001-04-27 | 2002-11-15 | Kyocera Corp | セラミック回路基板 |
JP2003065630A (ja) * | 2001-08-21 | 2003-03-05 | Mitsubishi Heavy Ind Ltd | 吸収冷凍機の吸収器チューブ |
JP2005213081A (ja) * | 2004-01-28 | 2005-08-11 | Kyocera Corp | 窒化珪素質焼結体およびこれを用いた金属溶湯用部材 |
JP2006064294A (ja) * | 2004-08-27 | 2006-03-09 | Showa Denko Kk | 熱交換器用チューブおよびその製造方法 |
US7128139B2 (en) * | 2004-10-14 | 2006-10-31 | Nova Chemicals (International) S.A. | External ribbed furnace tubes |
US8356658B2 (en) * | 2006-07-27 | 2013-01-22 | General Electric Company | Heat transfer enhancing system and method for fabricating heat transfer device |
JP2010173873A (ja) | 2009-01-28 | 2010-08-12 | Kyocera Corp | セラミック接合体およびこれを用いた支持部材 |
DE102009003144A1 (de) * | 2009-05-15 | 2010-11-18 | Robert Bosch Gmbh | Wärmeübertrager und Verfahren zur Umwandlung von thermischer Energie eines Fluids in elektrische Energie |
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EP2623917B1 (en) * | 2010-09-29 | 2018-12-12 | NGK Insulators, Ltd. | Heat exchanger element |
JP6005930B2 (ja) * | 2011-07-28 | 2016-10-12 | 京セラ株式会社 | 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置 |
JP2013092289A (ja) * | 2011-10-25 | 2013-05-16 | Kagawa Univ | 超撥水撥油性熱交換部材とその製造方法並びにそれらを用いた熱交換器 |
EP2833396B1 (en) * | 2012-03-29 | 2021-06-09 | Kyocera Corporation | Flow channel member, heat exchanger provided with flow channel member, and semiconductor manufacturing apparatus provided with flow channel member |
JP2014088978A (ja) * | 2012-10-29 | 2014-05-15 | Toshiba Corp | 伝熱部材製造方法、伝熱部品製造方法、伝熱部材および伝熱部品 |
US9897398B2 (en) * | 2013-05-07 | 2018-02-20 | United Technologies Corporation | Extreme environment heat exchanger |
JP5700726B2 (ja) * | 2013-11-01 | 2015-04-15 | 株式会社Uacj | 熱交換器用アルミニウムフィン材及びそれを用いた熱交換器 |
EP3075447B1 (en) * | 2013-11-28 | 2021-03-24 | Kyocera Corporation | Duct member |
-
2015
- 2015-05-25 JP JP2016523485A patent/JP6272472B2/ja active Active
- 2015-05-25 EP EP15799009.4A patent/EP3150955B1/en active Active
- 2015-05-25 WO PCT/JP2015/064924 patent/WO2015182553A1/ja active Application Filing
- 2015-05-25 US US15/313,021 patent/US9953898B2/en active Active
Also Published As
Publication number | Publication date |
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WO2015182553A1 (ja) | 2015-12-03 |
US20170200668A1 (en) | 2017-07-13 |
JPWO2015182553A1 (ja) | 2017-04-20 |
EP3150955A4 (en) | 2018-02-14 |
EP3150955A1 (en) | 2017-04-05 |
US9953898B2 (en) | 2018-04-24 |
EP3150955B1 (en) | 2019-11-27 |
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