JP6263841B2 - 携帯情報端末 - Google Patents
携帯情報端末 Download PDFInfo
- Publication number
- JP6263841B2 JP6263841B2 JP2013033448A JP2013033448A JP6263841B2 JP 6263841 B2 JP6263841 B2 JP 6263841B2 JP 2013033448 A JP2013033448 A JP 2013033448A JP 2013033448 A JP2013033448 A JP 2013033448A JP 6263841 B2 JP6263841 B2 JP 6263841B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- ultrafine
- information terminal
- portable information
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Telephone Set Structure (AREA)
Description
11 グルーブ
12 銅管
13 作動液
16 受熱部
17 放熱部
21 曲げ部
25 潰し部(扁平部)
31 携帯情報端末
32 構造体(筐体,金属体)
33 ディスプレイ(表示体)
34 CPU(発熱部)
37 電池パック(電池)
39 溝
51 受熱プレート(熱伝導体)
Claims (3)
- 発熱体とヒートパイプと電池パックとを内部に備える携帯情報端末であって、前記ヒートパイプの受熱部は前記発熱体と熱接続され、前記ヒートパイプの放熱部は前記電池パックと構造体の外周部との間の前記構造体に設けた断面形状が略U字状の溝に嵌合され、前記構造体の裏側を覆うように裏蓋を設け、該裏蓋は前記溝の開口を覆って前記ヒートパイプの放熱部と熱接続されることを特徴とする携帯情報端末。
- 前記ヒートパイプの内面に形成したグルーブがねじれていることを特徴とする請求項1記載の携帯情報端末。
- 前記ヒートパイプの放熱部を、金属体と熱接続させ、前記金属体に付着する霜を除去する除霜手段として設けたことを特徴とする請求項1または2記載の携帯情報端末。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013033448A JP6263841B2 (ja) | 2013-02-22 | 2013-02-22 | 携帯情報端末 |
PCT/JP2013/078165 WO2014077081A1 (ja) | 2012-11-15 | 2013-10-17 | ヒートパイプ、スマートフォン、タブレット端末または携帯情報端末 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013033448A JP6263841B2 (ja) | 2013-02-22 | 2013-02-22 | 携帯情報端末 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014165596A JP2014165596A (ja) | 2014-09-08 |
JP6263841B2 true JP6263841B2 (ja) | 2018-01-24 |
Family
ID=51615855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013033448A Active JP6263841B2 (ja) | 2012-11-15 | 2013-02-22 | 携帯情報端末 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6263841B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5945047B1 (ja) * | 2015-08-19 | 2016-07-05 | 株式会社フジクラ | 携帯型電子機器用熱拡散板 |
JP6515748B2 (ja) | 2015-09-02 | 2019-05-22 | Tdk株式会社 | 電子デバイスシート |
JP6557112B2 (ja) * | 2015-10-22 | 2019-08-07 | 株式会社フジクラ | 携帯型情報機器の放熱装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3362596B2 (ja) * | 1996-03-29 | 2003-01-07 | 富士電機株式会社 | 冷却器の除霜装置 |
JP2001230578A (ja) * | 2000-02-17 | 2001-08-24 | Nec Corp | 携帯型通信端末の放熱構造 |
JP2006253171A (ja) * | 2005-03-08 | 2006-09-21 | Nec Corp | 電子機器及びその放熱構造 |
JP2006284020A (ja) * | 2005-03-31 | 2006-10-19 | Toshiba Home Technology Corp | ヒートパイプ |
JP2007122132A (ja) * | 2005-10-25 | 2007-05-17 | Sony Corp | 可搬型電子機器 |
JP4878317B2 (ja) * | 2007-03-22 | 2012-02-15 | 株式会社コベルコ マテリアル銅管 | 銅または銅合金からなる銅管 |
JP2012154569A (ja) * | 2011-01-27 | 2012-08-16 | National Institute Of Advanced Industrial Science & Technology | 薄型ヒートパイプ及びその加工方法 |
JP2013026229A (ja) * | 2011-07-14 | 2013-02-04 | Panasonic Corp | 電子機器 |
JP5927539B2 (ja) * | 2011-07-25 | 2016-06-01 | パナソニックIpマネジメント株式会社 | 電子機器 |
-
2013
- 2013-02-22 JP JP2013033448A patent/JP6263841B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014165596A (ja) | 2014-09-08 |
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