JP6261627B2 - 照射サブシステム - Google Patents
照射サブシステム Download PDFInfo
- Publication number
- JP6261627B2 JP6261627B2 JP2016008429A JP2016008429A JP6261627B2 JP 6261627 B2 JP6261627 B2 JP 6261627B2 JP 2016008429 A JP2016008429 A JP 2016008429A JP 2016008429 A JP2016008429 A JP 2016008429A JP 6261627 B2 JP6261627 B2 JP 6261627B2
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- JP
- Japan
- Prior art keywords
- doe
- light beams
- lens array
- illumination
- refractive lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005286 illumination Methods 0.000 claims description 79
- 230000003287 optical effect Effects 0.000 claims description 32
- 238000007689 inspection Methods 0.000 claims description 27
- 239000011295 pitch Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 239000006185 dispersion Substances 0.000 description 9
- 210000001747 pupil Anatomy 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/008—Combination of two or more successive refractors along an optical axis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Description
本出願は、「Multi−Spot Illumination Using Broadband Lasers」という名称の、2010年7月30日に出願された米国特許出願番号第61/369,638号に対して優先権を主張し、参照によりその全体が本明細書に組み込まれる。
M0の反射率は以下から得られる。
Claims (2)
- ウエハ検査用照射を提供するように構成された照射サブシステムであって、
照射光ビームを複数の光ビームに分離するように構成された回折光学素子と、
前記複数の光ビームの通路に配置された屈折レンズアレイであって、前記屈折レンズアレイの後焦点面における前記複数の光ビームの径は、
- 前記屈折レンズアレイ内の前記レンズは、前記屈折レンズアレイにおける前記複数の光ビームの径より大きい開口を有する、請求項1に記載の照射サブシステム。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36963810P | 2010-07-30 | 2010-07-30 | |
US61/369,638 | 2010-07-30 | ||
US13/187,375 US8462329B2 (en) | 2010-07-30 | 2011-07-20 | Multi-spot illumination for wafer inspection |
US13/187,375 | 2011-07-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011165590A Division JP5875793B2 (ja) | 2010-07-30 | 2011-07-28 | ウエハ検査用マルチスポット照射 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017219850A Division JP6440804B2 (ja) | 2010-07-30 | 2017-11-15 | 照射サブシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016085228A JP2016085228A (ja) | 2016-05-19 |
JP6261627B2 true JP6261627B2 (ja) | 2018-01-17 |
Family
ID=45526421
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011165590A Active JP5875793B2 (ja) | 2010-07-30 | 2011-07-28 | ウエハ検査用マルチスポット照射 |
JP2016008429A Active JP6261627B2 (ja) | 2010-07-30 | 2016-01-20 | 照射サブシステム |
JP2017219850A Active JP6440804B2 (ja) | 2010-07-30 | 2017-11-15 | 照射サブシステム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011165590A Active JP5875793B2 (ja) | 2010-07-30 | 2011-07-28 | ウエハ検査用マルチスポット照射 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017219850A Active JP6440804B2 (ja) | 2010-07-30 | 2017-11-15 | 照射サブシステム |
Country Status (2)
Country | Link |
---|---|
US (2) | US8462329B2 (ja) |
JP (3) | JP5875793B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9945792B2 (en) * | 2012-12-19 | 2018-04-17 | Kla-Tencor Corporation | Generating an array of spots on inclined surfaces |
US9182358B2 (en) | 2013-03-15 | 2015-11-10 | Kla-Tencor Corporation | Multi-spot defect inspection system |
US9546962B2 (en) * | 2014-02-12 | 2017-01-17 | Kla-Tencor Corporation | Multi-spot scanning collection optics |
US9885671B2 (en) | 2014-06-09 | 2018-02-06 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
US9645097B2 (en) * | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
US9606069B2 (en) * | 2014-06-25 | 2017-03-28 | Kla-Tencor Corporation | Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate |
WO2016015734A1 (en) * | 2014-08-01 | 2016-02-04 | Dfm A/S | A scatterometer apparatus |
US9891175B2 (en) * | 2015-05-08 | 2018-02-13 | Kla-Tencor Corporation | System and method for oblique incidence scanning with 2D array of spots |
US10380728B2 (en) * | 2015-08-31 | 2019-08-13 | Kla-Tencor Corporation | Model-based metrology using images |
WO2017079051A1 (en) * | 2015-11-03 | 2017-05-11 | Materion Corporation | Filter array with reduced stray focused light |
EP3847446A4 (en) * | 2018-09-06 | 2022-06-01 | Orbotech Ltd. | MULTIMODAL MULTIPLEXED LIGHTING FOR OPTICAL INSPECTION SYSTEMS |
KR20210044955A (ko) * | 2019-10-15 | 2021-04-26 | 삼성디스플레이 주식회사 | 전자장치 |
EP4160623A1 (en) * | 2021-10-01 | 2023-04-05 | Deutsches Elektronen-Synchrotron DESY | Multi beam splitting and redirecting apparatus for a tomoscopic inspection apparatus, tomoscopic inspection apparatus and method for creating a three dimensional tomoscopic image of a sample |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5248031B2 (ja) * | 1974-05-13 | 1977-12-07 | ||
US4435041A (en) * | 1982-05-28 | 1984-03-06 | Sperry Corporation | Chromatic aberration correction in a multiwavelength light beam deflection system |
JPS59129854A (ja) * | 1983-01-18 | 1984-07-26 | Dainippon Screen Mfg Co Ltd | 画像走査記録時における光量補正方法 |
JPS6378011A (ja) * | 1986-09-20 | 1988-04-08 | Fujitsu Ltd | パタ−ン検査装置 |
JP3623250B2 (ja) * | 1993-06-23 | 2005-02-23 | オリンパス株式会社 | 映像表示装置 |
US5930045A (en) * | 1995-07-26 | 1999-07-27 | Fujitsu, Ltd. | Optical apparatus which uses a virtually imaged phased array to produce chromatic dispersion |
JP3411780B2 (ja) * | 1997-04-07 | 2003-06-03 | レーザーテック株式会社 | レーザ顕微鏡及びこのレーザ顕微鏡を用いたパターン検査装置 |
US6208411B1 (en) * | 1998-09-28 | 2001-03-27 | Kla-Tencor Corporation | Massively parallel inspection and imaging system |
JP3965504B2 (ja) * | 1999-06-11 | 2007-08-29 | 株式会社オーク製作所 | マルチビーム光学系 |
US6795199B2 (en) * | 2001-07-18 | 2004-09-21 | Avraham Suhami | Method and apparatus for dispersion compensated reflected time-of-flight tomography |
JP2003057192A (ja) * | 2001-08-10 | 2003-02-26 | Dainippon Screen Mfg Co Ltd | 画像取得装置 |
US7359045B2 (en) * | 2002-05-06 | 2008-04-15 | Applied Materials, Israel, Ltd. | High speed laser scanning inspection system |
JP2004222870A (ja) * | 2003-01-21 | 2004-08-12 | Pentax Corp | 内視鏡用プローブ |
US7319229B2 (en) * | 2003-12-29 | 2008-01-15 | Kla-Tencor Technologies Corporation | Illumination apparatus and methods |
JP2006258739A (ja) * | 2005-03-18 | 2006-09-28 | Fujinon Corp | 光束分岐出力装置および複数光束出力型の測定装置 |
JP5172162B2 (ja) * | 2006-08-25 | 2013-03-27 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置 |
JP4965275B2 (ja) * | 2007-02-13 | 2012-07-04 | 株式会社リコー | ホログラム光学素子の製造方法 |
JP5628038B2 (ja) * | 2007-10-16 | 2014-11-19 | コーニンクレッカ フィリップス エヌ ヴェ | コンパクトな照射スキームの生成及び一体化に対する装置、システム及び方法 |
-
2011
- 2011-07-20 US US13/187,375 patent/US8462329B2/en active Active
- 2011-07-28 JP JP2011165590A patent/JP5875793B2/ja active Active
-
2013
- 2013-05-21 US US13/898,470 patent/US8879056B2/en active Active
-
2016
- 2016-01-20 JP JP2016008429A patent/JP6261627B2/ja active Active
-
2017
- 2017-11-15 JP JP2017219850A patent/JP6440804B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012068232A (ja) | 2012-04-05 |
JP5875793B2 (ja) | 2016-03-02 |
US8462329B2 (en) | 2013-06-11 |
US20130250582A1 (en) | 2013-09-26 |
JP6440804B2 (ja) | 2018-12-19 |
US20120026489A1 (en) | 2012-02-02 |
JP2016085228A (ja) | 2016-05-19 |
US8879056B2 (en) | 2014-11-04 |
JP2018066743A (ja) | 2018-04-26 |
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