JP6254859B2 - Breaking element, breaking element circuit, - Google Patents

Breaking element, breaking element circuit, Download PDF

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JP6254859B2
JP6254859B2 JP2014011808A JP2014011808A JP6254859B2 JP 6254859 B2 JP6254859 B2 JP 6254859B2 JP 2014011808 A JP2014011808 A JP 2014011808A JP 2014011808 A JP2014011808 A JP 2014011808A JP 6254859 B2 JP6254859 B2 JP 6254859B2
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electrode
electrodes
terminal
melting point
soluble
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JP2015138767A5 (en
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吉弘 米田
吉弘 米田
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Dexerials Corp
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Priority to TW104102497A priority patent/TWI656554B/en
Priority to KR1020167018858A priority patent/KR102263795B1/en
Priority to PCT/JP2015/051774 priority patent/WO2015111683A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/572—Means for preventing undesired use or discharge
    • H01M50/574—Devices or arrangements for the interruption of current
    • H01M50/581—Devices or arrangements for the interruption of current in response to temperature
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/20—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess voltage
    • H02H3/202—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess voltage for dc systems
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00302—Overcharge protection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00306—Overdischarge protection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/0031—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits using battery or load disconnect circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combustion & Propulsion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Fuses (AREA)
  • Protection Of Static Devices (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Battery Mounting, Suspending (AREA)

Description

本発明は、電源ラインや信号ラインを遮断する遮断素子、及び遮断素子回路に関し、小型化、高定格化に優れる遮断素子、及び遮断素子回路に関する。   The present invention relates to a cutoff element and a cutoff element circuit that cut off a power supply line and a signal line, and relates to a cutoff element and a cutoff element circuit that are excellent in miniaturization and high rating.

充電して繰り返し利用することのできる二次電池の多くは、バッテリパックに加工されてユーザに提供される。特に重量エネルギー密度の高いリチウムイオン二次電池においては、ユーザ及び電子機器の安全を確保するために、一般的に、過充電保護、過放電保護等のいくつもの保護回路をバッテリパックに内蔵し、所定の場合にバッテリパックの出力を遮断する機能を有している。   Many secondary batteries that can be charged and used repeatedly are processed into battery packs and provided to users. Particularly in lithium ion secondary batteries with high weight energy density, in order to ensure the safety of users and electronic devices, in general, a battery pack incorporates a number of protection circuits such as overcharge protection and overdischarge protection, It has a function of shutting off the output of the battery pack in a predetermined case.

この種の遮断素子には、バッテリパックに内蔵されたＦＥＴスイッチを用いて出力のＯＮ／ＯＦＦを行うことにより、バッテリパックの過充電保護又は過放電保護動作を行うものがある。しかしながら、何らかの原因でＦＥＴスイッチが短絡破壊した場合、雷サージ等が印加されて瞬間的な大電流が流れた場合、あるいはバッテリセルの寿命によって出力電圧が異常に低下したり、逆に過大な異常電圧を出力したり、直列接続バッテリセルの各々の電圧ばらつきが大きくなったりした場合であっても、バッテリパックや電子機器は、発火等の事故から保護されなければならない。そこで、このような想定し得るいかなる異常状態においても、バッテリセルの出力を安全に遮断するために、外部からの信号によって電流経路を遮断する機能を有するヒューズ素子からなる遮断素子が用いられている。   Some of these types of shut-off elements perform an overcharge protection or overdischarge protection operation of the battery pack by turning on / off the output using an FET switch built in the battery pack. However, when the FET switch is short-circuited for some reason, a lightning surge or the like is applied and an instantaneous large current flows, or the output voltage drops abnormally due to the life of the battery cell, or excessively abnormal Even when the voltage is output or the voltage variation of each of the battery cells connected in series increases, the battery pack and the electronic device must be protected from accidents such as ignition. Therefore, in order to safely shut off the output of the battery cell in any possible abnormal state, a shut-off element made of a fuse element having a function of shutting off the current path by an external signal is used. .

リチウムイオン二次電池等向けの保護回路の遮断素子としては、図２７に示すように、電流経路上の第１の電極９１，発熱体引出電極９５，第２の電極９２間に亘って可溶導体９３を接続して電流経路の一部をなし、この電流経路上の可溶導体９３を、過電流による自己発熱、あるいは遮断素子内部に設けた発熱体９４によって溶断するものがある（特許文献１参照）。このような遮断素子９０では、溶融した液体状の可溶導体９３を発熱体９４に繋がる発熱体引出電極９５、及び第１、第２の電極９１，９２上に集めることにより第１、第２の電極９１，９２間を分離し電流経路を遮断する。   As a shut-off element of a protection circuit for a lithium ion secondary battery or the like, as shown in FIG. 27, it is soluble over the first electrode 91, the heating element extraction electrode 95, and the second electrode 92 on the current path. Some conductors 93 are connected to form a part of a current path, and the fusible conductor 93 on the current path is melted by a self-heating due to overcurrent or by a heating element 94 provided in the interruption element (Patent Document). 1). In such a blocking element 90, the molten liquid soluble conductor 93 is collected on the heating element extraction electrode 95 connected to the heating element 94, and the first and second electrodes 91, 92, thereby collecting the first and second electrodes. The electrodes 91 and 92 are separated from each other to interrupt the current path.

特開２０１０−００３６６５号公報JP 2010-003665 A 特開２００１−０７６６１０号公報Japanese Patent Laid-Open No. 2001-076610

図２７に示すように、従来の遮断素子９０では、電流経路上に接続される第１の電極９１と第２の電極９２との間に、発熱体９４と接続された発熱体引出電極９５が介在され、可溶導体９３によって第１の電極９１と発熱体引出電極９５との間、及び第２の電極９２と発熱体引出電極９５との間を接続しているため、可溶導体９３が大型化して広面積を占有することにより素子のサイズが大型化している。また、従来の遮断素子９０では、可溶導体９３の大型化により導通抵抗が高くなり、電流定格の向上が困難となってしまう。   As shown in FIG. 27, in the conventional interruption element 90, the heating element extraction electrode 95 connected to the heating element 94 is provided between the first electrode 91 and the second electrode 92 connected on the current path. The fusible conductor 93 is interposed between the first electrode 91 and the heating element extraction electrode 95 and between the second electrode 92 and the heating element extraction electrode 95 by the soluble conductor 93. The size of the device is increased by increasing the size and occupying a large area. Moreover, in the conventional interruption | blocking element 90, conduction resistance becomes high by the enlargement of the soluble conductor 93, and it will become difficult to improve a current rating.

そこで、本発明は、素子の小型化を図るとともに、電流定格を向上することができる遮断素子、及び遮断素子回路を提供することを目的とする。   Therefore, an object of the present invention is to provide a breaker element and a breaker element circuit capable of reducing the size of the element and improving the current rating.

上述した課題を解決するために、本発明に係る遮断素子は、絶縁基板と、上記絶縁基板に形成された第１〜第４の電極と、上記第３の電極と上記第４の電極との間に接続された発熱体と、上記第１の電極、上記第２の電極及び上記第３の電極との間に接続されることにより、上記第１の電極と上記第２の電極間を接続する第１の接続部と、上記第１の電極及び上記第２の電極と上記第３の電極とを接続する第２の接続部を有する第１の可溶導体とを備え、上記第１の電極又は上記第２の電極から上記第１の可溶導体及び上記第３の電極を介して上記発熱体に電流を流す給電経路を有し、上記発熱体の発熱により上記第１の可溶導体を溶融させることにより、上記第１の接続部を溶断し、次いで上記第２の接続部を溶断するものである。   In order to solve the above-described problems, a blocking element according to the present invention includes an insulating substrate, first to fourth electrodes formed on the insulating substrate, the third electrode, and the fourth electrode. A heating element connected between the first electrode, the second electrode, and the third electrode is connected between the first electrode and the second electrode. And a first fusible conductor having a second connecting portion for connecting the first electrode, the second electrode, and the third electrode, and the first connecting portion. A power supply path through which current flows from the electrode or the second electrode to the heating element via the first soluble conductor and the third electrode, and the first soluble conductor is generated by the heat generated by the heating element; Is melted to melt the first connecting portion, and then the second connecting portion is melted.

また、本発明に係る遮断素子は、絶縁基板と、上記絶縁基板に形成された第１〜第４の電極と、上記第３の電極と上記第４の電極との間に接続された発熱体と、上記第１の電極と第２の電極との間に接続された第２の可溶導体と、上記第１の電極及び第２の電極と上記第３の電極との間に接続された第３の可溶導体とを備え、上記第１の電極又は上記第２の電極から上記第２及び第３の可溶導体及び上記第３の電極を介して上記発熱体に電流を流す給電経路を有し、上記発熱体の発熱により上記第２の可溶導体を溶断させることにより、上記第１〜第２の電極間を遮断し、次いで上記第３の可溶導体を溶断させることにより、上記第１の電極又は上記第２の電極〜上記第３の電極間を遮断するものである。   The interrupting element according to the present invention includes an insulating substrate, first to fourth electrodes formed on the insulating substrate, and a heating element connected between the third electrode and the fourth electrode. And a second soluble conductor connected between the first electrode and the second electrode, and a connection between the first electrode and the second electrode and the third electrode. And a third fusible conductor, and a current feeding path through which current flows from the first electrode or the second electrode to the heating element via the second and third fusible conductors and the third electrode By cutting off the second soluble conductor by the heat generation of the heating element, the gap between the first and second electrodes is cut off, and then the third soluble conductor is blown out. The first electrode or the second electrode to the third electrode are blocked.

また、本発明に係る遮断素子回路は、外部回路に接続される第１の端子と第２の端子と、発熱抵抗と、上記発熱体と接続された第３の端子と、上記第１の端子と上記第２の端子との間に接続され、上記外部回路に直列に接続される第１のヒューズと、上記第１、第２の端子と上記第３の端子との間に接続された第２のヒューズとを備え、上記第１又は第２の端子、上記第１、第２のヒューズ及び上記第３の端子を介して上記発熱抵抗に電流を流し、上記発熱抵抗が発熱した熱により、上記第１のヒューズを溶融させ、上記第１の端子と上記第２の端子との間を遮断した後に、上記第２のヒューズを溶融させ、上記第１及び第２の端子と上記第３の端子との間を遮断するものである。   Further, the interrupting element circuit according to the present invention includes a first terminal and a second terminal connected to an external circuit, a heating resistor, a third terminal connected to the heating element, and the first terminal. And a second fuse connected between the first and second terminals and the third terminal, and a first fuse connected in series with the external circuit, and a first fuse connected between the first and second terminals and the third terminal. Two fuses, current is passed through the heating resistor through the first or second terminal, the first, second fuse and the third terminal, and the heat generated by the heating resistor After the first fuse is melted and the first terminal and the second terminal are disconnected, the second fuse is melted, and the first and second terminals and the third terminal are melted. This is to disconnect between the terminals.

また、本発明に係る遮断素子回路は、外部回路に接続される第１の端子と第２の端子と、発熱抵抗と、上記発熱抵抗と接続された第３の端子と、上記第１の端子と上記第２の端子との間に接続され、上記外部回路に直列に接続される第３のヒューズと、上記第１及び／又は第２の端子と上記第３の端子との間に接続された第４のヒューズとを備え、上記第１又は第２の端子、上記第３、第４のヒューズ及び上記第３の端子を介して上記発熱抵抗に電流を流し、上記発熱抵抗が発熱した熱により、上記第３のヒューズを溶融させ、上記第１の端子と上記第２の端子との間を遮断した後に、上記第４のヒューズを溶融させ、上記第１及び第２の端子と上記第３の端子との間を遮断するものである。   Further, the interrupting element circuit according to the present invention includes a first terminal and a second terminal connected to an external circuit, a heating resistor, a third terminal connected to the heating resistor, and the first terminal. And a second fuse connected in series to the external circuit, and connected between the first and / or second terminal and the third terminal. A fourth fuse, and a current is passed through the heating resistor through the first or second terminal, the third and fourth fuses, and the third terminal, and heat generated by the heating resistor. The third fuse is melted and the first terminal and the second terminal are disconnected, and then the fourth fuse is melted, and the first and second terminals and the second terminal are melted. 3 is disconnected.

本発明によれば、第１の電極と第２の電極とを対向配置させ、可溶導体を第１、第２の電極間にわたって搭載しているため、第１、第２の電極の間に発熱体引出電極を介在させている従来の構成に比べて、可溶導体の抵抗を小さくでき定格の向上を図るとともに、素子全体の小型化を図ることができる。   According to the present invention, the first electrode and the second electrode are disposed to face each other, and the soluble conductor is mounted between the first and second electrodes. Compared to the conventional configuration in which the heating element extraction electrode is interposed, the resistance of the fusible conductor can be reduced, the rating can be improved, and the entire element can be downsized.

図１（Ａ）は、遮断素子１のカバー部材を省略して示す平面図であり、図１（Ｂ）は、図１（Ａ）のＡ−Ａ‘断面図、図１（Ｃ）は、図１（Ａ）のＢ−Ｂ’断面図である。FIG. 1A is a plan view in which the cover member of the blocking element 1 is omitted, FIG. 1B is a cross-sectional view taken along the line AA ′ in FIG. 1A, and FIG. It is BB 'sectional drawing of FIG. 1 (A). 図２は、遮断素子が組み込まれたバッテリパックの回路図である。FIG. 2 is a circuit diagram of a battery pack in which a blocking element is incorporated. 図３は、遮断素子の回路図であり、（Ａ）は作動前、（Ｂ）は発熱体が発熱し、第１、第２の電極間が遮断された状態、（Ｃ）は発熱体の給電経路が遮断された状態を示す。3A and 3B are circuit diagrams of the interrupting element. FIG. 3A shows a state before the operation, FIG. 3B shows a state where the heating element generates heat and the first and second electrodes are shut off, and FIG. 3C shows the heating element. The state where the power feeding path is interrupted is shown. 図４は、発熱体を絶縁層の内部に設けた遮断素子を示す平面図である。FIG. 4 is a plan view showing a blocking element in which a heating element is provided inside the insulating layer. 図５は、発熱体を絶縁基板の裏面に設けた遮断素子を示す平面図である。FIG. 5 is a plan view showing a blocking element in which a heating element is provided on the back surface of the insulating substrate. 図６は、発熱体を絶縁基板の内部に設けた遮断素子を示す平面図である。FIG. 6 is a plan view showing a blocking element in which a heating element is provided inside an insulating substrate. 図７は、発熱体を第１〜第３の電極と重畳させた遮断素子を示す平面図である。FIG. 7 is a plan view showing a blocking element in which a heating element is superposed on the first to third electrodes. 図８は、発熱体を第１〜第４の電極と並んで設けた遮断素子を示す平面図である。FIG. 8 is a plan view showing a blocking element in which a heating element is provided side by side with the first to fourth electrodes. 図９は、発熱体の発熱中心を第２の電極側に偏倚させた遮断素子を示す図であり、（Ａ）は、遮断素子１のカバー部材を省略して示す平面図であり、（Ｂ）は、図９（Ａ）のＡ−Ａ‘断面図、（Ｃ）は、図９（Ａ）のＢ−Ｂ’断面図である。FIG. 9 is a diagram showing a blocking element in which the heat generation center of the heating element is biased toward the second electrode, and FIG. 9A is a plan view in which the cover member of the blocking element 1 is omitted. ) Is an AA ′ cross-sectional view of FIG. 9A, and FIG. 9C is a BB ′ cross-sectional view of FIG. 9A. 図１０は、図９に示す遮断素子において第１、第２の電極間が遮断された状態を示す図であり、（Ａ）は平面図、（Ｂ）は図１０（Ａ）のＢ−Ｂ’断面図、（Ｃ）は回路図である。10A and 10B are diagrams illustrating a state where the first and second electrodes are blocked in the blocking element illustrated in FIG. 9. FIG. 10A is a plan view, and FIG. 10B is a cross-sectional view taken along line BB in FIG. 'Cross sectional view, (C) is a circuit diagram. 図１１は、図９に示す遮断素子において第１、第３の電極間が遮断された状態を示す図であり、（Ａ）は平面図、（Ｂ）は図１１（Ａ）のＢ−Ｂ’断面図、（Ｃ）は回路図である。11A and 11B are diagrams illustrating a state where the first and third electrodes are blocked in the blocking element illustrated in FIG. 9. FIG. 11A is a plan view, and FIG. 11B is a cross-sectional view taken along line BB in FIG. 'Cross sectional view, (C) is a circuit diagram. 図１２は、通電経路を構成する第２の可溶導体と、発熱体への給電経路を構成する第３の可溶導体を用いた遮断素子を示す平面図である。FIG. 12 is a plan view showing a blocking element using the second soluble conductor constituting the energization path and the third soluble conductor constituting the power feeding path to the heating element. 図１３は、図１２に示す遮断素子の回路図であり、（Ａ）は作動前、（Ｂ）は発熱体が発熱し、第１、第２の電極間が遮断された状態、（Ｃ）は発熱体の給電経路が遮断された状態を示す。FIG. 13 is a circuit diagram of the shut-off element shown in FIG. 12, (A) is before operation, (B) is a state in which the heating element generates heat and the first and second electrodes are shut off, (C) Indicates a state in which the power feeding path of the heating element is interrupted. 図１４は、通電経路を構成する第２の可溶導体と、発熱体への給電経路を構成する第４、第５の可溶導体を用いた遮断素子を示す平面図である。FIG. 14 is a plan view showing a blocking element using the second soluble conductor constituting the energization path and the fourth and fifth soluble conductors constituting the power feeding path to the heating element. 図１５（Ａ）は通電経路を構成する第２の可溶導体と、発熱体への給電経路を構成する第４の可溶導体を用いた遮断素子を示す平面図であり、図１５（Ｂ）はその遮断素子回路を示す回路図である。FIG. 15A is a plan view showing a blocking element using the second soluble conductor constituting the energization path and the fourth soluble conductor constituting the power feeding path to the heating element, and FIG. ) Is a circuit diagram showing the interruption element circuit. 図１６（Ａ）は通電経路を構成する第２の可溶導体と、発熱体への給電経路を構成する第５の可溶導体を用いた遮断素子を示す平面図であり、図１６（Ｂ）はその遮断素子回路を示す回路図である。FIG. 16A is a plan view showing a blocking element using the second soluble conductor constituting the energization path and the fifth soluble conductor constituting the power feeding path to the heating element, and FIG. ) Is a circuit diagram showing the interruption element circuit. 図１７は、高融点金属層と低融点金属層を有し、被覆構造を備える可溶導体を示す斜視図であり、（Ａ）は高融点金属層を内層とし低融点金属層で被覆した構造を示し、（Ｂ）は低融点金属層を内層とし高融点金属層で被覆した構造を示す。FIG. 17 is a perspective view showing a soluble conductor having a high-melting-point metal layer and a low-melting-point metal layer and having a coating structure. FIG. 17A shows a structure in which the high-melting-point metal layer is an inner layer and is covered with a low-melting-point metal layer. (B) shows a structure in which a low melting point metal layer is used as an inner layer and is covered with a high melting point metal layer. 図１８は、高融点金属層と低融点金属層の積層構造を備える可溶導体を示す斜視図であり、（Ａ）は上下２層構造、（Ｂ）は内層及び外層の３層構造を示す。FIG. 18 is a perspective view showing a soluble conductor having a laminated structure of a high-melting point metal layer and a low-melting point metal layer, where (A) shows a two-layer structure of upper and lower layers, and (B) shows a three-layer structure of an inner layer and an outer layer. . 図１９は、高融点金属層と低融点金属層の多層構造を備える可溶導体を示す断面図である。FIG. 19 is a cross-sectional view showing a soluble conductor having a multilayer structure of a high melting point metal layer and a low melting point metal layer. 図２０は、高融点金属層の表面に線状の開口部が形成され低融点金属層が露出されている可溶導体を示す平面図であり、（Ａ）は長手方向に沿って開口部が形成されたもの、（Ｂ）は幅方向に沿って開口部が形成されたものである。FIG. 20 is a plan view showing a soluble conductor in which a linear opening is formed on the surface of the refractory metal layer and the low melting point metal layer is exposed. FIG. 20A shows the opening along the longitudinal direction. The formed part (B) has an opening formed in the width direction. 図２１は、高融点金属層の表面に円形の開口部が形成され低融点金属層が露出されている可溶導体を示す平面図である。FIG. 21 is a plan view showing a soluble conductor in which a circular opening is formed on the surface of the high melting point metal layer and the low melting point metal layer is exposed. 図２２は、高融点金属層に円形の開口部が形成され、内部に低融点金属が充填された可溶導体を示す平面図である。FIG. 22 is a plan view showing a soluble conductor in which a circular opening is formed in a refractory metal layer and a low melting point metal is filled therein. 図２３は、高融点金属に被覆され肉厚な第１の側縁部と、低融点金属が露出する第２の側縁部が設けられた可溶導体を示す平面図である。FIG. 23 is a plan view showing a soluble conductor provided with a thick first side edge portion covered with a high melting point metal and a second side edge portion where the low melting point metal is exposed. 図２４は、第１の可溶導体として、高融点金属に被覆され肉厚な第１の側縁部と、低融点金属が露出する第２の側縁部が設けられた可溶導体を用いた遮断素子を示す平面図である。FIG. 24 uses a soluble conductor provided with a thick first side edge coated with a high melting point metal and a second side edge exposed from the low melting point metal as the first soluble conductor. FIG. 図２５は、第２、第３の可溶導体として、高融点金属に被覆され肉厚な第１の側縁部と、低融点金属が露出する第２の側縁部が設けられた可溶導体を用いた遮断素子を示す平面図である。FIG. 25 shows a soluble first and second soluble conductors which are provided with a thick first side edge coated with a high melting point metal and a second side edge where the low melting point metal is exposed. It is a top view which shows the interruption | blocking element using a conductor. 図２６は、第２、第４、第５の可溶導体として、高融点金属に被覆され肉厚な第１の側縁部と、低融点金属が露出する第２の側縁部が設けられた可溶導体を用いた遮断素子を示す平面図である。In FIG. 26, as the second, fourth and fifth fusible conductors, a thick first side edge covered with a high melting point metal and a second side edge where the low melting point metal is exposed are provided. It is a top view which shows the interruption | blocking element using the fusible conductor. 図２７は、従来の遮断素子の構成を示す平面図である。FIG. 27 is a plan view showing a configuration of a conventional blocking element.

以下、本発明が適用された遮断素子、及び遮断素子回路について、図面を参照しながら詳細に説明する。なお、本発明は、以下の実施形態のみに限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更が可能であることは勿論である。また、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることがある。具体的な寸法等は以下の説明を参酌して判断すべきものである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。   Hereinafter, a shut-off element and a shut-off element circuit to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

本発明が適用された遮断素子１を図１に示す。図１（Ａ）は、遮断素子１のカバー部材を省略して示す平面図であり、図１（Ｂ）は、図１（Ａ）のＡ−Ａ‘断面図、図１（Ｃ）は、図１（Ａ）のＢ−Ｂ’断面図である。遮断素子１は、図１（Ａ）（Ｂ）（Ｃ）に示すように、絶縁基板１０と、絶縁基板１０に形成された第１〜第４の電極１１〜１４と、第３の電極１３と第４の電極１４との間に接続された発熱体１５と、第１の電極１１〜第３の電極１３との間に接続されることにより、第１の電極１１と第２の電極１２間を接続する第１の接続部２１ａと、第１の電極１１及び第２の電極１２と第３の電極１３とを接続する第２の接続部２１ｂを有する第１の可溶導体２１とを備える。   A blocking element 1 to which the present invention is applied is shown in FIG. FIG. 1A is a plan view in which the cover member of the blocking element 1 is omitted, FIG. 1B is a cross-sectional view taken along the line AA ′ in FIG. 1A, and FIG. It is BB 'sectional drawing of FIG. 1 (A). As shown in FIGS. 1A, 1 </ b> B, and 1 </ b> C, the blocking element 1 includes an insulating substrate 10, first to fourth electrodes 11 to 14 formed on the insulating substrate 10, and a third electrode 13. The first electrode 11 and the second electrode 12 are connected between the heating element 15 connected between the first electrode 11 and the fourth electrode 14, and the first electrode 11 to the third electrode 13. A first connecting portion 21a that connects the first electrode 11 and the first fusible conductor 21 having a second connecting portion 21b that connects the second electrode 12 and the third electrode 13 to each other. Prepare.

［絶縁基板］
絶縁基板１０は、たとえば、アルミナ、ガラスセラミックス、ムライト、ジルコニアなどの絶縁性を有する部材を用いて略方形状に形成されている。絶縁基板１０は、その他にも、ガラスエポキシ基板、フェノール基板等のプリント配線基板に用いられる材料を用いてもよいが、第１の可溶導体２１の溶断時の温度に留意する必要がある。 [Insulated substrate]
The insulating substrate 10 is formed in a substantially square shape using an insulating member such as alumina, glass ceramics, mullite, zirconia, and the like. In addition, the insulating substrate 10 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board, but it is necessary to pay attention to the temperature at which the first fusible conductor 21 is melted.

［発熱体］
発熱体１５は、比較的抵抗値が高く通電すると発熱する導電性を有する部材であって、たとえばＷ、Ｍｏ、Ｒｕ等からなる。これらの合金あるいは組成物、化合物の粉状体を樹脂バインダ等と混合して、ペースト状にしたものをスクリーン印刷技術を用いてパターン形成して、焼成する等によって形成する。 [Heating element]
The heating element 15 is a conductive member that has a relatively high resistance value and generates heat when energized, and is made of, for example, W, Mo, Ru, or the like. These alloys, compositions, or compound powders are mixed with a resin binder or the like to form a paste using a screen printing technique and then fired.

発熱体１５は、絶縁基板１０の表面１０ａ上において絶縁層１７に被覆されている。絶縁層１７は、発熱体１５の保護及び絶縁を図るとともに、発熱体１５の熱を効率よく第１、第２の電極１１，１２へ伝えるために設けられ、例えばガラス層からなる。第１、第２の電極１１，１２は、発熱体１５によって加熱されることにより、第１の可溶導体２１の溶融導体を凝集しやすくすることができる。絶縁層１７上には、第１〜第４の電極１１〜１４の各一部が形成される。   The heating element 15 is covered with an insulating layer 17 on the surface 10 a of the insulating substrate 10. The insulating layer 17 is provided to protect and insulate the heating element 15 and efficiently transmit the heat of the heating element 15 to the first and second electrodes 11 and 12, and is made of, for example, a glass layer. The first and second electrodes 11 and 12 can be made to easily aggregate the molten conductor of the first soluble conductor 21 by being heated by the heating element 15. A part of each of the first to fourth electrodes 11 to 14 is formed on the insulating layer 17.

発熱体１５は、一端が第３の電極１３の下層部１３ｂと接続され、他端が第４の電極１４の下層部１４ｂと接続されている。第３の電極１３の下層部１３ｂは、絶縁基板１０の表面１０ａに形成されるとともに絶縁層１７に被覆され、絶縁基板１０の一端側において第３の電極１３の上層部１３ａと接続されている。発熱体１５は、第３の電極１３の上層部１３ａを介して第１の可溶導体２１と接続される。また、第４の電極の下層部１４ｂは、絶縁基板１０の表面１０ａに形成されるとともに絶縁層１７に被覆され、絶縁基板１０の他端側において第４の電極１４の上層部１４ａと接続されている。第４の電極１４の上層部１４ａは、後述するカバー部材１９を搭載するために第３の電極１３の上層部１３ａと同じ高さに形成されている。発熱体１５は、第４の電極１４を介して外部回路と接続される。   The heating element 15 has one end connected to the lower layer part 13 b of the third electrode 13 and the other end connected to the lower layer part 14 b of the fourth electrode 14. The lower layer portion 13 b of the third electrode 13 is formed on the surface 10 a of the insulating substrate 10 and is covered with the insulating layer 17, and is connected to the upper layer portion 13 a of the third electrode 13 on one end side of the insulating substrate 10. . The heating element 15 is connected to the first soluble conductor 21 via the upper layer portion 13 a of the third electrode 13. The lower layer portion 14b of the fourth electrode is formed on the surface 10a of the insulating substrate 10 and covered with the insulating layer 17, and is connected to the upper layer portion 14a of the fourth electrode 14 on the other end side of the insulating substrate 10. ing. The upper layer portion 14a of the fourth electrode 14 is formed at the same height as the upper layer portion 13a of the third electrode 13 in order to mount a cover member 19 described later. The heating element 15 is connected to an external circuit through the fourth electrode 14.

[第１〜第４の電極]
第１、第２の電極１１，１２は、絶縁基板１０の相対向する一対の側縁にそれぞれ形成されるとともに、スルーホールを介して絶縁基板１０の裏面１０ｂ側に形成された外部接続電極１１ａ，１２ａと連続され、この外部接続電極１１ａ，１２ａを介して外部回路に接続されている。また、第１、第２の電極１１，１２は、絶縁基板１０の表面１０ａから絶縁層１７上にかけて形成され、絶縁層１７上において、所定の間隔Ｇ１を隔てて対向されている。そして、第１、第２の電極１１，１２は、後述する第１の可溶導体２１が搭載されることにより、第１の可溶導体２１を介して電気的に接続されている。 [First to fourth electrodes]
The first and second electrodes 11 and 12 are formed on a pair of opposite side edges of the insulating substrate 10 and external connection electrodes 11a formed on the back surface 10b side of the insulating substrate 10 through through holes. , 12a and connected to an external circuit via the external connection electrodes 11a, 12a. The first and second electrodes 11 and 12 are formed from the surface 10a of the insulating substrate 10 to the insulating layer 17, and are opposed to each other with a predetermined gap G1 on the insulating layer 17. And the 1st, 2nd electrodes 11 and 12 are electrically connected through the 1st soluble conductor 21 by mounting the 1st soluble conductor 21 mentioned later.

これにより、遮断素子１は、回路基板上に実装されると、第１の電極１１〜第１の可溶導体２１〜第２の電極１２に至る電流経路が当該外部回路の一部に直列に接続される。第１、第２の電極１１，１２が組み込まれる外部回路としては、遮断素子１が実装される電子機器の電流ラインであり、例えばリチウムイオン二次電池のバッテリパックにおける充放電回路、各種電子機器の電源回路、あるいは、デジタル信号回路等、電流の強弱に関わらず物理的な電流経路の遮断が求められるあらゆる回路に適用することができる。   Thereby, when the interruption | blocking element 1 is mounted on a circuit board, the electric current path from the 1st electrode 11-the 1st soluble conductor 21-the 2nd electrode 12 will be in series with a part of the said external circuit. Connected. The external circuit into which the first and second electrodes 11 and 12 are incorporated is a current line of an electronic device in which the blocking element 1 is mounted. For example, a charge / discharge circuit in a battery pack of a lithium ion secondary battery, various electronic devices The present invention can be applied to any circuit that requires a physical current path to be cut off regardless of current intensity, such as a power supply circuit or a digital signal circuit.

第３、第４の電極１３，１４は、絶縁基板１０の第１、第２の電極１１，１２が設けられた一対の側縁と直交する一対の側縁にそれぞれ形成されている。第４の電極１４は、スルーホールを介して絶縁基板１０の裏面１０ｂ側に形成された外部接続電極１４ｃと連続され、この外部接続電極１４ｃを介して外部回路に接続されている。第３、第４の電極１３，１４は、絶縁基板１０の表面１０ａに形成されるとともに絶縁層１７に被覆された下層部１３ｂ，１４ｂと、絶縁層１７上に形成された上層部１３ａ，１４ａとを有する。下層部１３ｂは、上層部１３ａと連続するとともに、発熱体１５の一端と接続され、下層部１４ｂは、上層部１４ａと連続するとともに、発熱体１５の他端と接続されている。   The third and fourth electrodes 13 and 14 are respectively formed on a pair of side edges orthogonal to the pair of side edges on which the first and second electrodes 11 and 12 of the insulating substrate 10 are provided. The fourth electrode 14 is continuous with the external connection electrode 14c formed on the back surface 10b side of the insulating substrate 10 through the through hole, and is connected to an external circuit through the external connection electrode 14c. The third and fourth electrodes 13 and 14 are formed on the surface 10 a of the insulating substrate 10 and covered with the insulating layer 17, and the upper layer portions 13 a and 14 a formed on the insulating layer 17. And have. The lower layer portion 13b is continuous with the upper layer portion 13a and connected to one end of the heat generating element 15, and the lower layer portion 14b is connected to the other end of the heat generating element 15 while being continuous with the upper layer portion 14a.

また、第３の電極１３は、上層部１３ａが第１、第２の電極１１，１２と所定の間隙Ｇ２を隔てて対向されている。そして、第３の電極１３は、上層部１３ａに第１の可溶導体２１が搭載される。これにより、遮断素子１は、第１の電極１１又は第２の電極１２から第１の可溶導体２１及び第３の電極１３を介して発熱体１５に電流を流す給電経路２が形成される（図３（Ａ）参照）。   The third electrode 13 has the upper layer portion 13a opposed to the first and second electrodes 11 and 12 with a predetermined gap G2. And the 3rd electrode 13 mounts the 1st soluble conductor 21 in the upper layer part 13a. As a result, in the blocking element 1, a power supply path 2 is formed in which a current flows from the first electrode 11 or the second electrode 12 to the heating element 15 via the first soluble conductor 21 and the third electrode 13. (See FIG. 3A).

［電極コーティング処理］
ここで、第１〜第４の電極１１〜１４は、ＣｕやＡｇ等の一般的な電極材料を用いて形成することができる。また、第１〜第３の電極１１〜１３は、遮断素子１の動作時において、発熱体１５の熱によって第１の可溶導体２１が溶融することにより、第１の可溶導体２１を構成する低融点金属によって溶食（ハンダ食われ）させるようにしてもよい。これにより、遮断素子１は、第１の電極１１と第２の電極１２との間隔Ｇ１や、第１、第２の電極１１，１２と第３の電極１３との間隔Ｇ２が広がり、より絶縁性、遮断性を向上させることができる。 [Electrode coating treatment]
Here, the 1st-4th electrodes 11-14 can be formed using common electrode materials, such as Cu and Ag. The first to third electrodes 11 to 13 constitute the first soluble conductor 21 by melting the first soluble conductor 21 by the heat of the heating element 15 during the operation of the blocking element 1. The low melting point metal may be eroded (soldered). As a result, the blocking element 1 is further insulated by increasing the gap G1 between the first electrode 11 and the second electrode 12 and the gap G2 between the first and second electrodes 11 and 12 and the third electrode 13. And barrier properties can be improved.

なお、第１〜第３の電極１１〜１３の表面上には、Ｎｉ／Ａｕメッキ、Ｎｉ／Ｐｄメッキ、Ｎｉ／Ｐｄ／Ａｕメッキ等の被膜を、メッキ処理等の公知の手法によりコーティングしてもよい。これにより、遮断素子１は、第１〜第３の電極１１〜１３の酸化を防止し、第１の可溶導体２１を確実に保持させることができる。また、遮断素子１をリフロー実装する場合に、第１の可溶導体２１を接続する接続用ハンダあるいは第１の可溶導体２１の外層を形成する低融点金属が溶融することにより第１〜第３の電極１１〜１３を溶食するのを防ぐことができる。   The first to third electrodes 11 to 13 are coated with a coating such as Ni / Au plating, Ni / Pd plating, or Ni / Pd / Au plating by a known method such as plating. Also good. Thereby, the interruption | blocking element 1 can prevent the oxidation of the 1st-3rd electrodes 11-13, and can hold | maintain the 1st soluble conductor 21 reliably. Further, when the interrupting element 1 is reflow-mounted, the connecting solder connecting the first soluble conductor 21 or the low melting point metal forming the outer layer of the first soluble conductor 21 is melted to melt the first to first elements. It is possible to prevent the three electrodes 11 to 13 from being eroded.

[第１の可溶導体]
第１の可溶導体２１は、発熱体１５の発熱により速やかに溶断されるいずれの金属を用いることができ、例えば、ハンダや、Ｓｎを主成分とするＰｂフリーハンダ等の低融点金属を好適に用いることができる。 [First soluble conductor]
The first fusible conductor 21 can be made of any metal that is quickly melted by the heat generated by the heating element 15. For example, a low melting point metal such as solder or Pb-free solder containing Sn as a main component is suitable. Can be used.

また、第１の可溶導体２１は、低融点金属と高融点金属とを含有してもよい。低融点金属としては、ハンダや、Ｓｎを主成分とするＰｂフリーハンダなどを用いることが好ましく、高融点金属としては、Ａｇ、Ｃｕ又はこれらを主成分とする合金などを用いることが好ましい。高融点金属と低融点金属とを含有することによって、遮断素子１をリフロー実装する場合に、リフロー温度が低融点金属の溶融温度を超えて、低融点金属が溶融しても、内層の低融点金属の外部への流出を抑制し、第１の可溶導体２１の形状を維持することができる。また、溶断時も、低融点金属が溶融することにより、高融点金属を溶食（ハンダ食われ）することで、高融点金属の融点以下の温度で速やかに溶断することができる。なお、第１の可溶導体２１は、後に説明するように、様々な構成によって形成することができる。   The first soluble conductor 21 may contain a low melting point metal and a high melting point metal. As the low melting point metal, it is preferable to use solder, Pb-free solder containing Sn as a main component, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as main components. By including the high melting point metal and the low melting point metal, even when the reflow temperature exceeds the melting temperature of the low melting point metal and the low melting point metal melts when the blocking element 1 is reflow mounted, the low melting point of the inner layer The outflow of the metal to the outside can be suppressed, and the shape of the first soluble conductor 21 can be maintained. In addition, even when fusing, the low melting point metal melts, and the high melting point metal is eroded (soldered), so that the fusing can be quickly performed at a temperature lower than the melting point of the high melting point metal. In addition, the 1st soluble conductor 21 can be formed by various structures so that it may demonstrate later.

第１の可溶導体２１は、略矩形状に形成され、接続用ハンダ等により、第１、第２の電極１１，１２間にわたって搭載されるとともに、第３の電極１３の上層部１３ａ上に搭載されている。これにより、第１の可溶導体２１は、第１、第２の電極１１，１２間を接続する第１の接続部２１ａと、第１、第２の電極１１，１２と第３の電極１３とを接続する第２の接続部２１ｂとを有する。また、第１の可溶導体２１は、第１、第２の電極１１，１２から第３の電極１３を介して発熱体１５及び第４の電極１４に至る発熱体１５への給電経路２を構成する。   The first fusible conductor 21 is formed in a substantially rectangular shape and is mounted between the first and second electrodes 11 and 12 by connection solder or the like, and on the upper layer portion 13a of the third electrode 13. It is installed. As a result, the first soluble conductor 21 includes the first connecting portion 21 a that connects the first and second electrodes 11, 12, the first, second electrodes 11, 12, and the third electrode 13. And a second connection portion 21b for connecting the two. The first fusible conductor 21 has a power supply path 2 from the first and second electrodes 11 and 12 to the heating element 15 and the fourth electrode 14 via the third electrode 13. Configure.

なお、第１の可溶導体２１は、酸化防止、及び溶断時の濡れ性の向上等のため、フラックス１８が塗布されていることが好ましい。   The first soluble conductor 21 is preferably coated with a flux 18 for the purpose of preventing oxidation and improving wettability during fusing.

また、遮断素子１は、第１〜第４の電極１１〜１４に、溶融した第１の可溶導体２１の流出を防止する保護壁１６が形成されている。保護壁１６は、絶縁性を有する材料を用いて形成され、例えばガラス層からなる。保護壁１６を設けることにより、第１の可溶導体２１の溶融導体が第１、第２の電極１１，１２を伝って外部接続電極１１ａ，１２ａに流れ込み、回路基板の接続電極を溶食することや、第３の電極１３上の接続用ハンダの過剰な広がりを防止することができる。   In the blocking element 1, a protective wall 16 is formed on the first to fourth electrodes 11 to 14 to prevent the melted first soluble conductor 21 from flowing out. The protective wall 16 is formed using an insulating material and is made of, for example, a glass layer. By providing the protective wall 16, the molten conductor of the first fusible conductor 21 flows into the external connection electrodes 11a and 12a through the first and second electrodes 11 and 12, and erodes the connection electrodes of the circuit board. In addition, excessive spreading of the connecting solder on the third electrode 13 can be prevented.

また、遮断素子１は、絶縁基板１０がカバー部材１９に覆われることによりその内部が保護されている。カバー部材１９は、上記絶縁基板１０と同様に、たとえば、熱可塑性プラスチック，セラミックス，ガラスエポキシ基板等の絶縁性を有する部材を用いて形成されている。   Further, the inside of the blocking element 1 is protected by the insulating substrate 10 being covered with the cover member 19. The cover member 19 is formed by using an insulating member such as a thermoplastic plastic, a ceramic, a glass epoxy substrate, etc., similarly to the insulating substrate 10.

[遮断素子の回路構成]
このような遮断素子１は、図２に示すように、例えばリチウムイオン二次電池のバッテリパック３０内の回路に組み込まれて用いられる。バッテリパック３０は、例えば、合計４個のリチウムイオン二次電池のバッテリセル３１〜３４からなるバッテリスタック３５を有する。 [Circuit configuration of interrupting element]
As shown in FIG. 2, such a blocking element 1 is used by being incorporated in a circuit in a battery pack 30 of a lithium ion secondary battery, for example. The battery pack 30 includes, for example, a battery stack 35 including battery cells 31 to 34 of a total of four lithium ion secondary batteries.

バッテリパック３０は、バッテリスタック３５と、バッテリスタック３５の充放電を制御する充放電制御回路４０と、バッテリスタック３５の異常時に充電を遮断する本発明が適用された遮断素子１と、各バッテリセル３１〜３４の電圧を検出する検出回路３６と、検出回路３６の検出結果に応じて遮断素子１の動作を制御するスイッチ素子となる電流制御素子３７とを備える。   The battery pack 30 includes a battery stack 35, a charge / discharge control circuit 40 that controls charging / discharging of the battery stack 35, a blocking element 1 to which the present invention that blocks charging when the battery stack 35 is abnormal, and each battery cell A detection circuit 36 for detecting voltages 31 to 34 and a current control element 37 serving as a switch element for controlling the operation of the cutoff element 1 according to the detection result of the detection circuit 36 are provided.

バッテリスタック３５は、過充電及び過放電状態から保護するための制御を要するバッテリセル３１〜３４が直列接続されたものであり、バッテリパック３０の正極端子３０ａ、負極端子３０ｂを介して、着脱可能に充電装置４５に接続され、充電装置４５からの充電電圧が印加される。充電装置４５により充電されたバッテリパック３０の正極端子３０ａ、負極端子３０ｂをバッテリで動作する電子機器に接続することによって、この電子機器を動作させることができる。   The battery stack 35 is formed by connecting battery cells 31 to 34 that need to be controlled for protection from overcharge and overdischarge states, and is detachable via the positive electrode terminal 30a and the negative electrode terminal 30b of the battery pack 30. Are connected to the charging device 45, and a charging voltage from the charging device 45 is applied thereto. The electronic device can be operated by connecting the positive electrode terminal 30a and the negative electrode terminal 30b of the battery pack 30 charged by the charging device 45 to an electronic device operating with a battery.

充放電制御回路４０は、バッテリスタック３５から充電装置４５に流れる電流経路に直列接続された２つの電流制御素子４１、４２と、これらの電流制御素子４１、４２の動作を制御する制御部４３とを備える。電流制御素子４１、４２は、たとえば電界効果トランジスタ（以下、ＦＥＴという。）により構成され、制御部４３によりゲート電圧を制御することによって、バッテリスタック３５の電流経路の導通と遮断とを制御する。制御部４３は、充電装置４５から電力供給を受けて動作し、検出回路３６による検出結果に応じて、バッテリスタック３５が過放電又は過充電であるとき、電流経路を遮断するように、電流制御素子４１、４２の動作を制御する。   The charge / discharge control circuit 40 includes two current control elements 41 and 42 connected in series to a current path flowing from the battery stack 35 to the charging device 45, and a control unit 43 that controls the operation of these current control elements 41 and 42. Is provided. The current control elements 41 and 42 are configured by, for example, field effect transistors (hereinafter referred to as FETs), and control the gate voltage by the control unit 43 to control conduction and interruption of the current path of the battery stack 35. The control unit 43 operates by receiving power supply from the charging device 45, and controls the current so as to cut off the current path when the battery stack 35 is overdischarged or overcharged according to the detection result by the detection circuit 36. The operation of the elements 41 and 42 is controlled.

遮断素子１は、例えば、バッテリスタック３５と充放電制御回路４０との間の充放電電流経路上に接続され、その動作が電流制御素子３７によって制御される。   The interruption element 1 is connected, for example, on a charge / discharge current path between the battery stack 35 and the charge / discharge control circuit 40, and its operation is controlled by the current control element 37.

検出回路３６は、各バッテリセル３１〜３４と接続され、各バッテリセル３１〜３４の電圧値を検出して、各電圧値を充放電制御回路４０の制御部４３に供給する。また、検出回路３６は、いずれか１つのバッテリセル３１〜３４が過充電電圧又は過放電電圧になったときに電流制御素子３７を制御する制御信号を出力する。   The detection circuit 36 is connected to each of the battery cells 31 to 34, detects the voltage value of each of the battery cells 31 to 34, and supplies each voltage value to the control unit 43 of the charge / discharge control circuit 40. The detection circuit 36 outputs a control signal for controlling the current control element 37 when any one of the battery cells 31 to 34 becomes an overcharge voltage or an overdischarge voltage.

電流制御素子３７は、たとえばＦＥＴにより構成され、検出回路３６から出力される検出信号によって、バッテリセル３１〜３４の電圧値が所定の過放電又は過充電状態を超える電圧になったとき、遮断素子１を動作させて、バッテリスタック３５の充放電電流経路を電流制御素子４１、４２のスイッチ動作によらず遮断するように制御する。   The current control element 37 is composed of, for example, an FET, and when the voltage value of the battery cells 31 to 34 exceeds a predetermined overdischarge or overcharge state by a detection signal output from the detection circuit 36, the interruption element 1 is operated to control the charge / discharge current path of the battery stack 35 to be cut off regardless of the switching operation of the current control elements 41 and 42.

以上のような構成からなるバッテリパック３０に用いられる、本発明が適用された遮断素子１は、図３（Ａ）に示すような回路構成を有する。すなわち、遮断素子回路７０は、第１のヒューズ７１（第１の可溶導体２１の第１の接続部２１ａ）を介して第１の端子７２（第１の電極１１）、第２の端子７３（第２の電極１２）が接続され、また、第２のヒューズ７４（第１の可溶導体２１の第２の接続部２１ｂ）を介して第１、第２の端子７２，７３と第３の端子７５（第３の電極１３）、発熱抵抗７６（発熱体１５）及び第４の端子７７（第４の電極１４）とが連続する給電経路２が形成される。   The blocking element 1 to which the present invention is applied, which is used in the battery pack 30 having the above configuration, has a circuit configuration as shown in FIG. In other words, the breaker circuit 70 includes the first terminal 72 (first electrode 11) and the second terminal 73 via the first fuse 71 (first connection portion 21a of the first fusible conductor 21). (Second electrode 12) is connected, and the first and second terminals 72, 73 and the third are connected via a second fuse 74 (second connecting portion 21b of the first fusible conductor 21). The power supply path 2 is formed in which the terminal 75 (third electrode 13), the heating resistor 76 (heating element 15), and the fourth terminal 77 (fourth electrode 14) are continuous.

遮断素子１は、バッテリパック３０の回路に実装されることにより、第１の可溶導体２１の一端が搭載される第１の電極１１が、外部接続電極１１ａを介して充放電電流経路の一端と接続され、第１の可溶導体２１の他端が搭載される第２の電極１２が、外部接続電極１２ａを介して充放電電流経路の他端と接続される。これにより、第１の可溶導体２１は、第１、第２の電極１１，１２の各外部接続電極１１ａ，１２ａを介して、充放電電流経路上に直列接続される。また、第４の電極１４が、外部接続電極１４ａを介して、電流制御素子３７と接続される。これにより、発熱体１５は、一端を第３の電極１３を介して第１の可溶導体２１と接続され、他端を第４の電極１４を介して電流制御素子３７と接続され、発熱体１５への給電経路２は、第４の電極１４に接続された電流制御素子３７によって通電が制御されている。   When the breaker element 1 is mounted on the circuit of the battery pack 30, the first electrode 11 on which one end of the first soluble conductor 21 is mounted is connected to one end of the charge / discharge current path via the external connection electrode 11a. The second electrode 12 on which the other end of the first fusible conductor 21 is mounted is connected to the other end of the charge / discharge current path via the external connection electrode 12a. Thus, the first soluble conductor 21 is connected in series on the charge / discharge current path via the external connection electrodes 11a and 12a of the first and second electrodes 11 and 12. The fourth electrode 14 is connected to the current control element 37 via the external connection electrode 14a. Thus, the heating element 15 has one end connected to the first soluble conductor 21 via the third electrode 13 and the other end connected to the current control element 37 via the fourth electrode 14. In the power supply path 2 to 15, energization is controlled by a current control element 37 connected to the fourth electrode 14.

検出回路３６がバッテリセル３１〜３４のいずれかの異常電圧を検出すると、電流制御素子３７へ遮断信号を出力する。すると、電流制御素子３７は、発熱体１５に通電するよう電流を制御する。給電経路２には、バッテリスタック３５から、第１の電極１１、第１の可溶導体２１及び第３の電極１３を介して電流が流れ、これにより発熱体１５が発熱を開始する。遮断素子１は、発熱体１５の発熱により第１の可溶導体２１を溶断する。   When the detection circuit 36 detects any abnormal voltage in the battery cells 31 to 34, it outputs a cutoff signal to the current control element 37. Then, the current control element 37 controls the current so that the heating element 15 is energized. A current flows from the battery stack 35 to the power supply path 2 via the first electrode 11, the first soluble conductor 21, and the third electrode 13, whereby the heating element 15 starts to generate heat. The blocking element 1 blows off the first soluble conductor 21 by the heat generated by the heating element 15.

このとき、遮断素子１は、図３（Ｂ）に示すように、第１、第２の端子７２，７３（第１、第２の電極１１，１２）間を接続する第１のヒューズ７１（第１の接続部２１ａ）が溶断することによりバッテリパック３０の充放電電流経路を遮断し、次いで、図３（Ｃ）に示すように、第１、第２の端子７２，７３と第３の端子７５（第３の電極１３）とを接続する第２のヒューズ７４（第２の接続部２１ｂ）が溶断することにより、発熱抵抗７６（発熱体１５）への給電経路２を遮断する。   At this time, as shown in FIG. 3 (B), the blocking element 1 includes a first fuse 71 (first and second electrodes 11 and 12) that connect the first and second terminals 72 and 73 (first and second electrodes 11 and 12). When the first connecting portion 21a) is melted, the charging / discharging current path of the battery pack 30 is cut off. Then, as shown in FIG. 3 (C), the first and second terminals 72 and 73 and the third When the second fuse 74 (second connection portion 21b) that connects the terminal 75 (third electrode 13) is melted, the power supply path 2 to the heating resistor 76 (heating element 15) is cut off.

なお、本発明の遮断素子は、リチウムイオン二次電池のバッテリパックに用いる場合に限らず、電気信号による電流経路の遮断を必要とする様々な用途にももちろん応用可能である。   In addition, the interruption | blocking element of this invention is applicable not only to the case where it uses for the battery pack of a lithium ion secondary battery but various applications which require interruption | blocking of the electric current path by an electric signal.

このような遮断素子１によれば、第１の電極１１と第２の電極１２とを対向配置させ、第１の可溶導体２１を第１、第２の電極１１，１２間にわたって搭載しているため、発熱体引出電極を介して第１、第２の電極を対向させている従来の構成に比べて、可溶導体の抵抗を小さくでき定格の向上を図るとともに、素子全体の小型化を図ることができる。   According to such a blocking element 1, the first electrode 11 and the second electrode 12 are arranged to face each other, and the first soluble conductor 21 is mounted between the first and second electrodes 11 and 12. Therefore, compared with the conventional configuration in which the first and second electrodes are opposed to each other via the heating element extraction electrode, the resistance of the fusible conductor can be reduced, the rating can be improved, and the entire element can be reduced in size. Can be planned.

すなわち、従来の素子では、第１、第２の電極の間に発熱体引出電極を介在させ、発熱体電極と第１の電極の間、及び発熱体電極と第２の電極の間に可溶導体を搭載しているため、可溶導体の抵抗値が大きくなり、そのため素子の定格を上げることができなかった。また、第１、第２の電極間に発熱体引出電極を設けることで、第１、第２の電極の間隔が広がり、素子全体のサイズも大きくなっていた。   That is, in the conventional element, a heating element extraction electrode is interposed between the first and second electrodes, and the element is soluble between the heating element electrode and the first electrode and between the heating element electrode and the second electrode. Since the conductor is mounted, the resistance value of the fusible conductor is increased, and the rating of the element cannot be increased. Further, by providing the heating element extraction electrode between the first and second electrodes, the distance between the first and second electrodes is widened, and the size of the entire element is also increased.

この点、遮断素子１では、第１、第２の電極１１，１２を直接対向させ、第１の可溶導体２１を第１、第２の電極１１，１２及び第３の電極１３にわたって搭載している。これにより、遮断素子１は、第１の可溶導体２１が通電方向に短くなり、小型化に伴う低抵抗化を図り、素子の定格を向上することができる。また、遮断素子１は、第１、第２の電極１１，１２を直接対向させたことで、素子全体の小型化を図ることができ、小型化、高定格化を図ることができる。   In this regard, in the blocking element 1, the first and second electrodes 11 and 12 are directly opposed to each other, and the first soluble conductor 21 is mounted over the first, second electrodes 11, 12 and the third electrode 13. ing. Thereby, the interruption | blocking element 1 can shorten the 1st soluble conductor 21 to an electricity supply direction, can aim at the low resistance accompanying size reduction, and can improve the rating of an element. In addition, the blocking element 1 can directly reduce the size of the entire element by making the first and second electrodes 11 and 12 directly face each other, and can achieve a reduction in size and an increase in rating.

なお、遮断素子１は、発熱体１５の発熱により第１の可溶導体２１が溶断する他、外部回路が過電流となった場合に、第１の可溶導体２１が自己発熱（ジュール熱）により溶断することで、外部回路を遮断することができる。   The interrupting element 1 causes the first fusible conductor 21 to self-heat (Joule heat) when the first fusible conductor 21 is melted by the heat generated by the heating element 15 and the external circuit becomes overcurrent. By fusing, the external circuit can be shut off.

[接続部Ｗ２＜接続部Ｗ１]
また、第１の可溶導体２１は、第１、第２の電極１１，１２と第３の電極１３との間にわたって搭載されている第２の接続部２１ｂの幅Ｗ２が、第１、第２の電極１１，１２間わたって搭載されている第１の接続部２１ａの幅Ｗ１よりも狭い。第１の可溶導体２１は、外部回路の電流経路に直列に接続されることから、第１、第２の電極１１，１２の幅方向に亘って搭載される第１の接続部２１ａの幅Ｗ１は第１の可溶導体２１の低抵抗化、及び遮断素子１の高定格化を図るために幅広に設けることが好ましい。一方、第３の電極１３に搭載される第２の接続部２１ｂは、発熱体１５への給電経路２を遮断できればよく、第１、第２の電極１１，１２の間隔Ｇ１よりも幅広であれば、これ以上に広げる必要もない。 [Connection W2 <Connection W1]
The first fusible conductor 21 has a width W2 of the second connecting portion 21b mounted between the first and second electrodes 11 and 12 and the third electrode 13, so that the first and second electrodes It is narrower than the width W1 of the first connection portion 21a mounted between the two electrodes 11 and 12. Since the first fusible conductor 21 is connected in series to the current path of the external circuit, the width of the first connecting portion 21a mounted across the width direction of the first and second electrodes 11 and 12 is used. W1 is preferably provided in a wide width in order to reduce the resistance of the first fusible conductor 21 and to increase the rating of the blocking element 1. On the other hand, the second connecting portion 21b mounted on the third electrode 13 only needs to be able to block the power supply path 2 to the heating element 15, and may be wider than the gap G1 between the first and second electrodes 11 and 12. If so, there is no need to expand beyond that.

[発熱体の発熱中心Ｃ]
ここで、遮断素子１は、第１の可溶導体２１の第１の接続部２１ａが、第２の接続部２１ｂよりも先に溶断するように形成されている。第１の接続部２１ａよりも先に第２の接続部２１ｂが溶断すると、発熱体１５への給電が停止され、第１の可溶導体２１を溶断することができなくなるからである。 [Heat generation center C of the heating element]
Here, the interruption | blocking element 1 is formed so that the 1st connection part 21a of the 1st soluble conductor 21 may be blown ahead of the 2nd connection part 21b. This is because if the second connection portion 21b is blown before the first connection portion 21a, the power supply to the heating element 15 is stopped, and the first soluble conductor 21 cannot be blown.

そこで、遮断素子１は、発熱体１５が発熱すると、第１の接続部２１ａが第２の接続部２１ｂよりも先に溶断するように形成されている。具体的に、遮断素子１の第１の可溶導体２１は、第１の接続部２１ａが第２の接続部２１ｂよりも、発熱体１５の発熱中心Ｃに近い位置に搭載されている。   Therefore, the blocking element 1 is formed such that when the heating element 15 generates heat, the first connection portion 21a is fused before the second connection portion 21b. Specifically, the first fusible conductor 21 of the blocking element 1 is mounted at a position where the first connection portion 21a is closer to the heat generation center C of the heating element 15 than the second connection portion 21b.

ここで、発熱体１５の発熱中心Ｃとは、発熱体１５が発熱することにより発現する熱分布のうち、発熱初期の段階で最も高温となる領域をいう。発熱体１５より発せられる熱は絶縁基板１０からの放熱量が最も多く、絶縁基板１０を、耐熱衝撃性に優れるが熱伝導率も高いセラミックス材料により形成した場合などには、絶縁基板１０に熱が拡散してしまう。そのため、発熱体１５は通電が開始された発熱初期の段階では、絶縁基板１０と接する外縁から最も遠い中心が最も熱く、絶縁基板１０と接する外縁に向かうにつれて放熱されて温度が上がりにくくなる。   Here, the heat generation center C of the heat generating body 15 refers to a region where the temperature becomes the highest in the initial stage of heat generation in the heat distribution generated by the heat generation of the heat generating body 15. The heat generated from the heating element 15 has the largest amount of heat dissipated from the insulating substrate 10. When the insulating substrate 10 is formed of a ceramic material having excellent thermal shock resistance but high thermal conductivity, the insulating substrate 10 is heated. Will spread. Therefore, in the initial stage of heat generation when energization is started, the heating element 15 is most heated at the center farthest from the outer edge in contact with the insulating substrate 10 and is radiated toward the outer edge in contact with the insulating substrate 10, so that the temperature hardly rises.

そこで、遮断素子１は、第１の接続部２１ａが第２の接続部２１ｂよりも、発熱体１５の発熱初期において最も高温となる発熱中心Ｃに近くなるように、発熱体１５、第１及び第２の電極１１，１２、並びに第１の可溶導体２１を配置する。これにより、第１の可溶導体２１は、第１の接続部２１ａに第２の接続部２１ｂよりも早く熱が伝わり、溶断し、外部回路の電流経路が遮断される前に発熱体１５への給電経路２が遮断される事態を防止することができる。第２の接続部２１ｂは、第１の接続部２１ａより遅れて加熱されるため、第１の接続部２１ａが溶断した後に溶断され、発熱体１５への給電が停止される。   Therefore, the blocking element 1 includes the heating element 15, the first and second heating elements 15, 1, and 21 so that the first connection portion 21 a is closer to the heat generation center C that is the highest temperature in the early stage of heat generation of the heating element 15 than the second connection portion 21 b. The second electrodes 11 and 12 and the first soluble conductor 21 are disposed. As a result, the first fusible conductor 21 is transferred to the first connecting portion 21a faster than the second connecting portion 21b, so that the first fusible conductor 21 is melted and blown to the heating element 15 before the current path of the external circuit is interrupted. It is possible to prevent a situation where the power supply path 2 is interrupted. Since the second connecting portion 21b is heated later than the first connecting portion 21a, the second connecting portion 21b is melted after the first connecting portion 21a is melted, and power supply to the heating element 15 is stopped.

[間隔Ｇ２＜間隔Ｇ１]
また、遮断素子１は、第１の電極１１及び第２の電極１２と第３の電極１３との間隔Ｇ２が、第１の電極１１と第２の電極１２との間隔Ｇ１よりも短くしてもよい。第１の可溶導体２１は、電極間の間隔が長いほど、溶融導体の張力が強く働き溶断しやすくなる。したがって、第１電極１１と第２の電極１２の間隔Ｇ１が、第１、第２の電極１１，１２と第３の電極１３との間隔Ｇ２より長くすることにより、第１の接続部２１ａが第２の接続部２１ｂよりも先に溶断する。これにより、遮断素子１は、外部回路の電流経路が遮断される前に発熱体１５への給電経路２が遮断される事態を防止することができる。 [Gap G2 <Gap G1]
Further, the blocking element 1 has a gap G2 between the first electrode 11 and the second electrode 12 and the third electrode 13 shorter than a gap G1 between the first electrode 11 and the second electrode 12. Also good. As the distance between the electrodes is longer, the first soluble conductor 21 is more easily melted due to the stronger tension of the molten conductor. Therefore, the distance G1 between the first electrode 11 and the second electrode 12 is longer than the distance G2 between the first and second electrodes 11, 12 and the third electrode 13, so that the first connection portion 21a is Fusing before the second connection portion 21b. Thereby, the interruption | blocking element 1 can prevent the situation where the electric power feeding path | route 2 to the heat generating body 15 is interrupted | blocked before the electric current path of an external circuit is interrupted | blocked.

［発熱体の配置］
また、遮断素子１は、発熱体１５を絶縁基板１０の表面１０ａに形成する他に、図４に示すように、絶縁基板１０の表面１０ａに形成された絶縁層１７の内部に形成してもよい。この場合、発熱体１５と接続される第３、第４の電極１３，１４の各下層部１３ｂ，１４ｂも、絶縁基板１０の表面１０ａから絶縁層１７の内部にかけて形成される。また、発熱体１５を絶縁層１７の内部に形成した場合にも、第１の可溶導体２１は、第１の接続部２１ａが第２の接続部２１ｂよりも発熱体１５の発熱中心Ｃに近い位置に配置されることが好ましい。 [Arrangement of heating element]
In addition to forming the heating element 15 on the surface 10a of the insulating substrate 10, the blocking element 1 may be formed inside the insulating layer 17 formed on the surface 10a of the insulating substrate 10, as shown in FIG. Good. In this case, the lower layer portions 13 b and 14 b of the third and fourth electrodes 13 and 14 connected to the heating element 15 are also formed from the surface 10 a of the insulating substrate 10 to the inside of the insulating layer 17. Even when the heating element 15 is formed inside the insulating layer 17, the first fusible conductor 21 has the first connecting portion 21a closer to the heating center C of the heating element 15 than the second connecting portion 21b. It is preferable to arrange at a close position.

また、遮断素子１は、図５に示すように、発熱体１５を絶縁基板１０の裏面１０ｂに形成してもよい。この場合、発熱体１５は、絶縁基板１０の裏面１０ｂにおいて絶縁層１７に被覆されている。また、発熱体１５と接続される第３、第４の電極１３，１４の各下層部１３ｂ，１４ｂも同様に絶縁基板１０の裏面１０ｂに形成され、導電スルーホールを介して絶縁基板１０の表面１０ａに形成された上層部１３ａ，１４ａと連続されている。   Moreover, the interruption | blocking element 1 may form the heat generating body 15 in the back surface 10b of the insulated substrate 10, as shown in FIG. In this case, the heating element 15 is covered with the insulating layer 17 on the back surface 10 b of the insulating substrate 10. Similarly, the lower layer portions 13b and 14b of the third and fourth electrodes 13 and 14 connected to the heating element 15 are also formed on the back surface 10b of the insulating substrate 10, and the surface of the insulating substrate 10 through the conductive through holes. It is continuous with the upper layer portions 13a and 14a formed in 10a.

遮断素子１は、発熱体１５が絶縁基板１０の裏面１０ｂに形成されることにより、絶縁基板１０の表面１０ａが平坦化され、これにより、第１、第２の電極１１，１２や第３、第４の電極１３，１４の各上層部１３ａ，１４ａを表面１０ａ上に印刷等により一括して形成することができる。したがって、遮断素子１は、第１〜第４の電極１１〜１４の製造工程を簡略化することができるとともに、低背化を図ることができる。   In the blocking element 1, the heating element 15 is formed on the back surface 10 b of the insulating substrate 10, thereby flattening the front surface 10 a of the insulating substrate 10, whereby the first and second electrodes 11, 12 and the third, The upper layer portions 13a and 14a of the fourth electrodes 13 and 14 can be collectively formed on the surface 10a by printing or the like. Therefore, the interruption | blocking element 1 can aim at low height while being able to simplify the manufacturing process of the 1st-4th electrodes 11-14.

遮断素子１は、発熱体１５を絶縁基板１０の裏面１０ｂに形成した場合にも、絶縁基板１０の材料としてファインセラミック等の熱伝導性に優れた材料を用いることにより、発熱体１５によって、絶縁基板１０の表面１０ａ上に形成した場合と同等に第１の可溶導体２１を加熱、溶断することができる。また、発熱体１５を絶縁基板１０の裏面１０ｂに形成した場合にも、第１の可溶導体２１は、第１の接続部２１ａが第２の接続部２１ｂよりも発熱体１５の発熱中心Ｃに近い位置に配置されることが好ましい。   Even when the heating element 15 is formed on the back surface 10b of the insulating substrate 10, the blocking element 1 is insulated by the heating element 15 by using a material having excellent thermal conductivity such as fine ceramic as the material of the insulating substrate 10. The first soluble conductor 21 can be heated and melted in the same manner as when formed on the surface 10 a of the substrate 10. Further, even when the heating element 15 is formed on the back surface 10b of the insulating substrate 10, the first fusible conductor 21 has a heating center C of the heating element 15 in which the first connecting portion 21a is more than the second connecting portion 21b. It is preferable to be arranged at a position close to.

また、遮断素子１は、図６に示すように、発熱体１５を絶縁基板１０の内部に形成してもよい。この場合、発熱体１５を被覆する絶縁層１７は設ける必要がない。また、発熱体１５と接続される第３、第４の電極１３，１４の各下層部１３ｂ，１４ｂは、絶縁基板１０の内部まで形成され、導電スルーホールを介して絶縁基板１０の表面１０ａに形成された上層部１３ａ，１４ａと接続される。   Moreover, the interruption | blocking element 1 may form the heat generating body 15 in the inside of the insulated substrate 10, as shown in FIG. In this case, it is not necessary to provide the insulating layer 17 that covers the heating element 15. The lower layer portions 13b and 14b of the third and fourth electrodes 13 and 14 connected to the heating element 15 are formed up to the inside of the insulating substrate 10 and are formed on the surface 10a of the insulating substrate 10 through conductive through holes. It connects with the formed upper layer parts 13a and 14a.

発熱体１５を絶縁基板１０の内部に形成することにより、遮断素子１は、絶縁基板１０の表面１０ａが平坦化され、これにより、第１、第２の電極１１，１２や第３、第４の電極１３，１４の各上層部１３ａ，１４ａを表面１０ａ上に印刷等により一括して形成することができる。したがって、遮断素子１は、第１〜第４の電極１１〜１４の製造工程を簡略化することができるとともに、低背化を図ることができる。   By forming the heating element 15 inside the insulating substrate 10, the surface 10 a of the insulating substrate 10 is flattened in the blocking element 1, whereby the first and second electrodes 11, 12 and the third and fourth electrodes are formed. The upper layer portions 13a and 14a of the electrodes 13 and 14 can be collectively formed on the surface 10a by printing or the like. Therefore, the interruption | blocking element 1 can aim at low height while being able to simplify the manufacturing process of the 1st-4th electrodes 11-14.

遮断素子１は、発熱体１５を絶縁基板１０の内部に形成した場合にも、絶縁基板１０の材料としてファインセラミック等の熱伝導性に優れた材料を用いることにより、発熱体１５によって、絶縁基板１０の表面１０ａ上に形成した場合と同等に第１の可溶導体２１を加熱、溶断することができる。また、発熱体１５を絶縁基板１０の内部に形成した場合にも、第１の可溶導体２１は、第１の接続部２１ａが第２の接続部２１ｂよりも発熱体１５の発熱中心Ｃに近い位置に配置されることが好ましい。   Even when the heating element 15 is formed inside the insulating substrate 10, the blocking element 1 uses the material having excellent thermal conductivity, such as fine ceramic, as the material of the insulating substrate 10. The first fusible conductor 21 can be heated and melted in the same manner as when formed on the surface 10a of the tenth surface. Even when the heating element 15 is formed inside the insulating substrate 10, the first fusible conductor 21 has the first connecting portion 21a closer to the heating center C of the heating element 15 than the second connecting portion 21b. It is preferable to arrange at a close position.

［発熱体と第１〜第３の電極との重畳］
また、遮断素子１は、発熱体１５を絶縁基板１０の表面１０ａに形成するとともに絶縁層１７で被覆する場合（図１）、発熱体１５を絶縁層１７の内部に形成する場合（図４）、発熱体１５を絶縁基板１０の裏面１０ｂに形成する場合（図５）、発熱体１５を絶縁基板１０の内部に形成する場合（図６）のいずれの場合にも、発熱体１５と第１、第２の電極１１，１２とが重畳することが好ましい。 [Superposition of heating element and first to third electrodes]
Further, in the interrupting element 1, when the heating element 15 is formed on the surface 10a of the insulating substrate 10 and covered with the insulating layer 17 (FIG. 1), the heating element 15 is formed inside the insulating layer 17 (FIG. 4). When the heating element 15 is formed on the back surface 10b of the insulating substrate 10 (FIG. 5) and when the heating element 15 is formed inside the insulating substrate 10 (FIG. 6), the heating element 15 and the first It is preferable that the second electrodes 11 and 12 overlap.

発熱体１５と重畳されることにより、第１、第２の電極１１，１２に発熱体１５の熱が効率よく伝達され、第１、第２の電極１１，１２間に搭載される第１の可溶導体２１の第１の接続部２１ａを第２の接続部２１ｂよりも先に溶断させることができる。また、第１、第２の電極１１，１２が効率良く加熱されることにより、溶融導体による第１、第２の電極１１，１２溶食を促進させ、第１、第２の電極１１，１２間の絶縁性を向上させることができる。   By superimposing the heating element 15, the heat of the heating element 15 is efficiently transferred to the first and second electrodes 11 and 12, and the first and second electrodes 11 and 12 are mounted between the first and second electrodes 11 and 12. The 1st connection part 21a of the soluble conductor 21 can be blown ahead of the 2nd connection part 21b. Further, the first and second electrodes 11 and 12 are efficiently heated to promote the corrosion of the first and second electrodes 11 and 12 by the molten conductor, and the first and second electrodes 11 and 12 are promoted. Insulating properties can be improved.

また、図７に示すように、遮断素子１は、発熱体１５と第１〜第３の電極１１〜１３を重畳させてもよい。この場合、第１、第２の電極１１，１２は発熱体１５の発熱中心Ｃ付近と重畳され、第３の電極１３は発熱体１５の端部と重畳される。これにより、第１、第２の電極１１，１２が第３の電極１３よりも先に高温に加熱され、第１の可溶導体２１は、第１の接続部２１ａを第２の接続部２１ｂよりも先に溶断させることができる。また、第１、第２の電極１１，１２に加え、第３の電極１３も効率よく加熱されるため、第１〜第３の電極１１〜１３のそれぞれに溶融導体が保持され、第１の電極１１と第２の電極１２との絶縁性に加え、第１、第２の電極１１，１２と第３の電極１３との絶縁性も向上させることができる。   Moreover, as shown in FIG. 7, the interruption | blocking element 1 may make the heat generating body 15 and the 1st-3rd electrodes 11-13 overlap. In this case, the first and second electrodes 11 and 12 are overlapped with the vicinity of the heat generation center C of the heating element 15, and the third electrode 13 is overlapped with the end of the heating element 15. Thereby, the 1st, 2nd electrodes 11 and 12 are heated to high temperature before the 3rd electrode 13, and the 1st soluble conductor 21 makes the 1st connection part 21a the 2nd connection part 21b. Can be blown earlier. In addition to the first and second electrodes 11 and 12, the third electrode 13 is also efficiently heated, so that the molten conductor is held in each of the first to third electrodes 11 to 13, and the first electrode In addition to the insulation between the electrode 11 and the second electrode 12, the insulation between the first and second electrodes 11, 12 and the third electrode 13 can be improved.

［発熱体と第１〜第４の電極とを並設］
また、遮断素子１は、図８に示すように、発熱体１５を絶縁基板１０の表面１０ａ上において、第１〜第４の電極１１〜１４と並んで形成してもよい。この場合、発熱体１５は、絶縁基板１０の表面１０ａ上に設けられるとともに、絶縁層１７によって被覆されている。また、この場合も、第１の可溶導体２１は、第１の接続部２１ａが第２の接続部２１ｂよりも、発熱体１５の発熱中心Ｃの近くに配置されることが好ましい。 [Parallel heating element and first to fourth electrodes]
Moreover, the interruption | blocking element 1 may form the heat generating body 15 along with the 1st-4th electrodes 11-14 on the surface 10a of the insulated substrate 10, as shown in FIG. In this case, the heating element 15 is provided on the surface 10 a of the insulating substrate 10 and is covered with the insulating layer 17. Also in this case, the first fusible conductor 21 is preferably arranged such that the first connecting portion 21a is closer to the heating center C of the heating element 15 than the second connecting portion 21b.

［発熱中心オフセット］
また、遮断素子１は、図９（Ａ）（Ｂ）（Ｃ）に示すように、発熱体１５と第１、第２の電極１１，１２の相対的な配置として、発熱体１５の発熱中心Ｃが、第１の電極１１又は第２の電極１２の第１の可溶導体２１が搭載された部位と重畳するようにしてもよい。例えば、遮断素子１は、第１、第２の電極１１，１２が絶縁基板１０の表面１０ａに均等に配置された場合、発熱体１５をやや第２の電極１２側にオフセットした位置に形成する。これにより、遮断素子１は、発熱体１５の熱が第２の電極１２を介して効率よく第１の可溶導体２１の第１の接続部２１ａに伝わり、速やかに外部回路の電流経路を遮断できる。 [Heat center offset]
Further, as shown in FIGS. 9A, 9B, and 9C, the blocking element 1 has a heating element 15 and a heating center of the heating element 15 as a relative arrangement of the first and second electrodes 11 and 12. C may be overlapped with a portion of the first electrode 11 or the second electrode 12 where the first soluble conductor 21 is mounted. For example, when the first and second electrodes 11, 12 are evenly arranged on the surface 10 a of the insulating substrate 10, the blocking element 1 forms the heating element 15 at a position slightly offset toward the second electrode 12. . Thereby, the interruption | blocking element 1 transmits the heat | fever of the heat generating body 15 efficiently to the 1st connection part 21a of the 1st soluble conductor 21 via the 2nd electrode 12, and interrupts | blocks the electric current path of an external circuit rapidly. it can.

また、遮断素子１は、発熱体１５の発熱中心Ｃを、第１の電極１１又は第２の電極１２の第１の可溶導体２１が搭載された部位と重畳させることにより、発熱体１５の過熱による損傷を防止することができる。すなわち、発熱体１５の発熱中心Ｃ上に第１の電極１１又は第２の電極１２が配置されることにより、発熱体１５の熱を第１の電極１１又は第２の電極１２に効率よく伝搬させることができる。したがって、発熱体１５は、発生した熱が伝搬されることで、自身に蓄積されることなく、過熱による損傷が防止される。   Moreover, the interruption | blocking element 1 overlaps the heat | fever center C of the heat generating body 15 with the site | part in which the 1st soluble conductor 21 of the 1st electrode 11 or the 2nd electrode 12 is mounted, Damage due to overheating can be prevented. That is, by arranging the first electrode 11 or the second electrode 12 on the heating center C of the heating element 15, the heat of the heating element 15 is efficiently propagated to the first electrode 11 or the second electrode 12. Can be made. Therefore, the heat generating body 15 is prevented from being damaged by overheating without being accumulated in itself due to propagation of generated heat.

一方、発熱体１５の発熱中心Ｃ上に第１の電極１１又は第２の電極１２が重畳されず、空隙となっている場合、発熱体１５の発熱による熱が効率よく第１、第２の電極１１，１２及び第１の可溶導体２１に伝搬されず、第１の可溶導体２１を速やかに溶断することができない。   On the other hand, when the first electrode 11 or the second electrode 12 is not superimposed on the heating center C of the heating element 15 and is a gap, the heat generated by the heating element 15 is efficiently generated by the first and second heat. It is not propagated to the electrodes 11, 12 and the first soluble conductor 21, and the first soluble conductor 21 cannot be blown quickly.

そこで、遮断素子１は、発熱体１５の発熱中心Ｃが、第１の電極１１又は第２の電極１２の第１の可溶導体２１が搭載された部位と重畳するような配置とすることで、第１の可溶導体２１の速溶断と、発熱体１５の過熱を防止することができる。   Therefore, the interruption element 1 is arranged so that the heat generation center C of the heating element 15 overlaps with the portion where the first soluble conductor 21 of the first electrode 11 or the second electrode 12 is mounted. The fast fusing of the first soluble conductor 21 and the overheating of the heating element 15 can be prevented.

発熱体１５の発熱中心Ｃを、第２の電極１２の第１の可溶導体２１が搭載された部位と重畳させた遮断素子１は、発熱体１５が発熱すると、発熱中心Ｃと重畳する第２の電極１２側が効率よく加熱され、第１の可溶導体２１が第２の電極１２に搭載されている側から溶融する。これにより、遮断素子１は、図１０（Ａ）〜（Ｃ）に示すように、先ず、第１の可溶導体２１の第１の接続部２１ａが溶断し、第１、第２の電極１１，１２間が遮断される。このとき、第１の可溶導体２１は、発熱体１５の発熱中心Ｃから遠い第２の接続部２１ｂは溶断せず、発熱体１５への給電経路２は遮断されていない。したがって、遮断素子１は、第１の可溶導体２１の第１の接続部２１ａを溶断し、第１、第２の電極１１，１２間を遮断させるまで、確実に発熱体１５を発熱させ続けることができる。   The blocking element 1 in which the heat generation center C of the heat generating body 15 is overlapped with the portion where the first soluble conductor 21 of the second electrode 12 is mounted overlaps the heat generation center C when the heat generating body 15 generates heat. The second electrode 12 side is efficiently heated, and the first soluble conductor 21 is melted from the side on which the second electrode 12 is mounted. Thereby, as shown in FIGS. 10 (A) to 10 (C), first, the first connecting portion 21a of the first fusible conductor 21 is melted and the first and second electrodes 11 are cut off. , 12 are cut off. At this time, the first fusible conductor 21 does not melt the second connecting portion 21b far from the heat generation center C of the heating element 15, and the power supply path 2 to the heating element 15 is not blocked. Therefore, the blocking element 1 reliably keeps the heating element 15 heated until the first connecting portion 21a of the first fusible conductor 21 is melted and the first and second electrodes 11 and 12 are blocked. be able to.

その後、遮断素子１は、発熱体１５が発熱を続けることにより、図１１（Ａ）〜（Ｃ）に示すように、第１の可溶導体２１の第２の接続部２１ｂも溶断し、第１、第３の電極１１，１３間が遮断され、発熱体１５への給電が停止される。   Thereafter, when the heating element 15 continues to generate heat, the blocking element 1 also melts the second connecting portion 21b of the first soluble conductor 21 as shown in FIGS. The first and third electrodes 11 and 13 are disconnected, and power supply to the heating element 15 is stopped.

［変形例］
次いで、遮断素子の他の実施の形態について説明する。なお、以下の説明において、上述した遮断素子１及び遮断素子回路７０と同じ部材については、同一の符号を付してその詳細を省略する。図１２に示すように、遮断素子２０は、絶縁基板１０と、絶縁基板１０に形成された第１〜第４の電極１１〜１４と、第３の電極１３と第４の電極１４との間に接続された発熱体１５と、第１の電極１１と第２の電極１２との間に接続された第２の可溶導体２２と、第１の電極１１及び第２の電極１２と第３の電極１３との間に接続された第３の可溶導体２３とを備える。 [Modification]
Next, another embodiment of the blocking element will be described. In the following description, the same members as those of the blocking element 1 and the blocking element circuit 70 described above are denoted by the same reference numerals and their details are omitted. As shown in FIG. 12, the blocking element 20 includes the insulating substrate 10, the first to fourth electrodes 11 to 14 formed on the insulating substrate 10, and the third electrode 13 and the fourth electrode 14. , The second soluble conductor 22 connected between the first electrode 11 and the second electrode 12, the first electrode 11, the second electrode 12, and the third A third fusible conductor 23 connected between the first electrode 13 and the third electrode 13.

遮断素子１と遮断素子２０との相違点は、第１〜第３の電極１１〜１３にわたって搭載する可溶導体が、遮断素子１では第１の可溶導体２１の一つであったのに対して、遮断素子２０では複数の可溶導体を用いている点である。すなわち、遮断素子２０は、第１の電極１１と第２の電極１２との間にわたって第２の可溶導体２２が搭載され、第１の電極１１及び第２の電極１２と第３の電極１３との間にわたって第３の可溶導体２３が搭載されている。   The difference between the blocking element 1 and the blocking element 20 is that the soluble conductor mounted over the first to third electrodes 11 to 13 is one of the first soluble conductors 21 in the blocking element 1. On the other hand, the interruption element 20 uses a plurality of soluble conductors. That is, the interrupting element 20 includes the second soluble conductor 22 mounted between the first electrode 11 and the second electrode 12, and the first electrode 11, the second electrode 12, and the third electrode 13. The third soluble conductor 23 is mounted between the two.

第２、第３の可溶導体２２，２３は、上述した第１の可溶導体２１と同じものを用いることができ、また、第１の可溶導体２１と同様に、後述する種々の形態を採用することができる。第２の可溶導体２２は、第１、第２の電極１１，１２間を電気的に接続するとともに、遮断素子２０が実装される外部回路の電流経路の一部に直列に接続される。第３の可溶導体２３は、第１、第２の電極１１，１２から第３の電極１３を介して発熱体１５及び第４の電極１４に至る発熱体１５への給電経路２７を構成する（図１３参照）。   The second and third fusible conductors 22 and 23 can be the same as the first fusible conductor 21 described above, and, similarly to the first fusible conductor 21, various forms described later. Can be adopted. The second fusible conductor 22 is electrically connected between the first and second electrodes 11 and 12 and is connected in series to a part of a current path of an external circuit on which the blocking element 20 is mounted. The third soluble conductor 23 constitutes a power feeding path 27 from the first and second electrodes 11 and 12 to the heating element 15 and the fourth electrode 14 via the third electrode 13. (See FIG. 13).

また、遮断素子２０は、第２の可溶導体２２が第３の可溶導体２３よりも発熱体１５の発熱中心Ｃの近傍に配置されることにより、発熱体１５が発熱すると、先ず第２の可溶導体２２が溶断して第１、第２の電極１１，１２間を遮断し、次いで第３の可溶導体２３が溶断することにより、第１、第２の電極１１，１２と第３の電極１３との間を遮断する。   In addition, when the second fusible conductor 22 is disposed nearer to the heat generation center C of the heat generating element 15 than the third fusible conductor 23, the interrupting element 20 is first second when the heat generating element 15 generates heat. The fusible conductor 22 is melted and the first and second electrodes 11 and 12 are cut off, and then the third fusible conductor 23 is blown, so that the first and second electrodes 11 and 12 and the first and second electrodes 11 and 12 are fused. 3 between the three electrodes 13 is cut off.

このような遮断素子２０は、図１３（Ａ）に示すような回路構成を有する。すなわち、遮断素子回路８０は、第３のヒューズ８１（第２の可溶導体２２）を介して第１、第２の端子７１，７２（第１、第２の電極１１，１２）が接続され、また、第４のヒューズ８２（第３の可溶導体２３）を介して第１、第２の端子７１，７２と第３の端子７５（第３の電極１３）、発熱抵抗７６（発熱体１５）及び第４の端子７７（第４の電極１４）とが連続する給電経路２７が形成される。給電経路２７は、第４の端子７７に接続された電流制御素子によって通電が制御されている。   Such a blocking element 20 has a circuit configuration as shown in FIG. In other words, the breaking element circuit 80 is connected to the first and second terminals 71 and 72 (first and second electrodes 11 and 12) via the third fuse 81 (second fusible conductor 22). The first and second terminals 71 and 72, the third terminal 75 (third electrode 13), and the heating resistor 76 (heating element) are connected via the fourth fuse 82 (third fusible conductor 23). 15) and the fourth terminal 77 (fourth electrode 14) are formed, and a power feeding path 27 is formed. Energization of the power feeding path 27 is controlled by a current control element connected to the fourth terminal 77.

そして、遮断素子２０が実装される外部回路の電流経路を遮断する必要が生じた場合には、電流制御素子によって給電経路２７に通電可能とされ、第１の端子７２又は第２の端子７３から第３、第４のヒューズ８１，８２、第３の端子７５を介して発熱抵抗７６に電流が流れる。発熱抵抗７６が通電により発熱すると、遮断素子回路８０は、図１３（Ｂ）に示すように、第１、第２の端子７２，７３間を接続する第３のヒューズ８１が溶断することにより外部回路の電流経路を遮断し、次いで、図１３（Ｃ）に示すように、第１、第２の端子７２，７３と第３の端子７５とを接続する第４のヒューズ８２が溶断することにより、発熱抵抗７６への給電経路２７を遮断する。   And when it becomes necessary to interrupt the current path of the external circuit on which the interrupting element 20 is mounted, the current control element can energize the power feeding path 27, and from the first terminal 72 or the second terminal 73. A current flows through the heat generating resistor 76 via the third and fourth fuses 81 and 82 and the third terminal 75. When the heat generating resistor 76 generates heat by energization, the breaking element circuit 80 is externally connected by blowing the third fuse 81 connecting the first and second terminals 72 and 73 as shown in FIG. The current path of the circuit is interrupted, and then the fourth fuse 82 connecting the first and second terminals 72 and 73 and the third terminal 75 is blown as shown in FIG. The power supply path 27 to the heating resistor 76 is blocked.

このような遮断素子２０によっても、遮断素子１と同様に、第１の電極１１と第２の電極１２とを直接、対向配置させ、第２の可溶導体２２を第１、第２の電極１１，１２間にわたって搭載しているため、第１、第２の電極の間に発熱体引出電極を介在させている従来の構成に比べて、可溶導体の抵抗を小さくでき定格の向上を図るとともに、素子全体の小型化を図ることができる。   Even with such a blocking element 20, as in the blocking element 1, the first electrode 11 and the second electrode 12 are disposed directly opposite to each other, and the second soluble conductor 22 is replaced with the first and second electrodes. 11 and 12, the resistance of the fusible conductor can be reduced and the rating can be improved as compared with the conventional configuration in which the heating element extraction electrode is interposed between the first and second electrodes. In addition, the entire element can be reduced in size.

［幅Ｗ２＜幅Ｗ１］
なお、遮断素子２０は、第３の可溶導体２３の幅Ｗ２が、第２の可溶導体２２の幅Ｗ１よりも狭い。第２の可溶導体２２は遮断素子１の第１の可溶導体２１における第１の接続部２１ａと同様に機能し、第３の可溶導体２３は、遮断素子１の第１の可溶導体２１における第２の接続部２１ｂと同様に機能する。したがって、第１、第２の電極１１，１２の幅方向に亘って搭載される第２の可溶導体２２の幅Ｗ１は、低抵抗化、及び遮断素子２０の高定格化を図るために幅広に設けることが好ましい。一方、第３の電極１３に搭載される第３の可溶導体２３は、発熱体１５への給電経路２７を遮断できればよく、第１、第２の電極１１，１２の間隔Ｇ１よりも幅広であれば、これ以上に広げる必要もない。 [Width W2 <Width W1]
In the blocking element 20, the width W <b> 2 of the third fusible conductor 23 is narrower than the width W <b> 1 of the second fusible conductor 22. The second fusible conductor 22 functions in the same manner as the first connecting portion 21 a in the first fusible conductor 21 of the breaking element 1, and the third fusible conductor 23 is the first fusible conductor 21 of the breaking element 1. It functions in the same manner as the second connection portion 21 b in the conductor 21. Accordingly, the width W1 of the second fusible conductor 22 mounted across the width direction of the first and second electrodes 11 and 12 is wide in order to reduce the resistance and increase the rating of the blocking element 20. It is preferable to provide in. On the other hand, the third fusible conductor 23 mounted on the third electrode 13 only needs to be able to block the power supply path 27 to the heating element 15, and is wider than the gap G1 between the first and second electrodes 11 and 12. If there is, there is no need to expand further.

［第２の可溶導体の融点＜第３の可溶導体の融点］
また、遮断素子２０は、第２の可溶導体２２と第３の可溶導体２３の材料を異ならせることにより、第２の可溶導体２２の融点を、第３の可溶導体２３の融点よりも低くしてもよい。これにより、遮断素子２０は、第１、第２の電極１１，１２間わたって搭載されている第２の可溶導体２２を、第１、第２の電極１１，１２と第３の電極１３との間にわたって搭載されている第３の可溶導体２３よりも先に溶融させることができる。したがって、遮断素子２０は、外部回路の電流経路が遮断される前に発熱体１５への給電経路２７が遮断される事態を防止することができる。 [Melting point of second soluble conductor <Melting point of third soluble conductor]
Moreover, the interruption | blocking element 20 makes the melting | fusing point of the 2nd soluble conductor 22 the melting | fusing point of the 3rd soluble conductor 23 by making the material of the 2nd soluble conductor 22 and the 3rd soluble conductor 23 different. It may be lower. Thereby, the interruption | blocking element 20 makes the 1st, 2nd electrode 11 and 12 and the 3rd electrode 13 connect the 2nd soluble conductor 22 mounted ranging between the 1st, 2nd electrodes 11 and 12. FIG. Can be melted before the third fusible conductor 23 mounted between them. Therefore, the interruption | blocking element 20 can prevent the situation where the electric power feeding path | route 27 to the heat generating body 15 is interrupted | blocked before the electric current path | route of an external circuit is interrupted | blocked.

この他、遮断素子２０は、第３の可溶導体２３の高融点金属のメッキ厚を第２の可溶導体２２の高融点金属のメッキ厚よりも厚くする等、第２、第３の可溶導体２２，２３の層構造を変えることにより融点に差を設け、相対的に第２の可溶導体２２を第３の可溶導体２３よりも溶断しやすくしてもよい。   In addition, the blocking element 20 has a second and third possible conductors such as a higher melting point metal plating thickness of the third soluble conductor 23 than a higher melting point metal plating thickness of the second soluble conductor 22. A difference in melting point may be provided by changing the layer structure of the molten conductors 22 and 23 so that the second fusible conductor 22 is relatively easier to blow than the third fusible conductor 23.

［第４、第５の可溶導体］
また、遮断素子２０は、第１、第２の電極１１，１２と第３の電極１３との間にわたって搭載されている第３の可溶導体２３に代えて、図１４に示すように、第１の電極１１と第３の電極１３とを接続する第４の可溶導体２４、及び第２の電極１２と第３の電極１３とを接続する第５の可溶導体２５を備えてもよい。第４、第５の可溶導体３４，３５は、上述した第１の可溶導体２１と同じものを用いることができ、また、第１の可溶導体２１と同様に、後述する種々の形態を採用することができる。 [Fourth and fifth soluble conductors]
Further, as shown in FIG. 14, the blocking element 20 is replaced with a third soluble conductor 23 mounted between the first and second electrodes 11, 12 and the third electrode 13. A fourth soluble conductor 24 that connects the first electrode 11 and the third electrode 13 and a fifth soluble conductor 25 that connects the second electrode 12 and the third electrode 13 may be provided. . The fourth and fifth fusible conductors 34 and 35 can be the same as the first fusible conductor 21 described above, and in the same manner as the first fusible conductor 21, various modes described later. Can be adopted.

また、遮断素子２０は、第４の可溶導体２４又は第５の可溶導体２５のいずれか一方のみを設けてもよい。図１５（Ａ）は、第４の可溶導体２４のみを第１の電極１１と第３の電極１３との間に設けた遮断素子２０の平面図であり、図１５（Ｂ）は、その遮断素子回路８０の回路図である。図１６（Ａ）は、第５の可溶導体２５のみを第２の電極１２と第３の電極１３との間に設けた遮断素子２０の平面図であり、図１６（Ｂ）は、その遮断素子回路８０の回路図である。   Moreover, the interruption | blocking element 20 may provide only either the 4th soluble conductor 24 or the 5th soluble conductor 25. FIG. FIG. 15A is a plan view of the blocking element 20 in which only the fourth soluble conductor 24 is provided between the first electrode 11 and the third electrode 13, and FIG. FIG. 4 is a circuit diagram of a blocking element circuit 80. FIG. 16A is a plan view of the blocking element 20 in which only the fifth fusible conductor 25 is provided between the second electrode 12 and the third electrode 13, and FIG. FIG. 4 is a circuit diagram of a blocking element circuit 80.

図１５（Ｂ）に示す遮断素子回路８０は、第３のヒューズ８１（第２の可溶導体２２）を介して第１、第２の端子７２，７３（第１、第２の電極１１，１２）が接続され、また、第５のヒューズ８３（第４の可溶導体２４）を介して第１、第２の端子７２，７３と第３の端子７５（第３の電極１３）、発熱抵抗７６（発熱体１５）及び第４の端子７７（第４の電極１４）とが連続する給電経路２７が形成される。給電経路２７は、第４の端子７７に接続された電流制御素子によって通電が制御されている。   The interrupting element circuit 80 shown in FIG. 15B includes first and second terminals 72 and 73 (first and second electrodes 11 and 2 through a third fuse 81 (second fusible conductor 22). 12) is connected, and the first and second terminals 72 and 73 and the third terminal 75 (third electrode 13) are heated via the fifth fuse 83 (fourth fusible conductor 24). A power feeding path 27 is formed in which the resistor 76 (heating element 15) and the fourth terminal 77 (fourth electrode 14) are continuous. Energization of the power feeding path 27 is controlled by a current control element connected to the fourth terminal 77.

図１６（Ｂ）に示す遮断素子回路８０は、第３のヒューズ８１（第２の可溶導体２２）を介して第１、第２の端子７２，７３（第１、第２の電極１１，１２）が接続され、また、第６のヒューズ８４（第５の可溶導体２５）を介して第１、第２の端子７２，７３と第３の端子７５（第３の電極１３）、発熱抵抗７６（発熱体１５）及び第４の端子７７（第４の電極１４）とが連続する給電経路２７が形成される。給電経路２７は、第４の端子７７に接続された電流制御素子によって通電が制御されている。   The breaking element circuit 80 shown in FIG. 16 (B) includes first and second terminals 72 and 73 (first and second electrodes 11 and 2) via a third fuse 81 (second fusible conductor 22). 12), and the first and second terminals 72 and 73 and the third terminal 75 (third electrode 13) via the sixth fuse 84 (the fifth fusible conductor 25), heat generation A power feeding path 27 is formed in which the resistor 76 (heating element 15) and the fourth terminal 77 (fourth electrode 14) are continuous. Energization of the power feeding path 27 is controlled by a current control element connected to the fourth terminal 77.

その他にも、遮断素子２０は、遮断素子１と同様に、第１の電極１１及び第２の電極１２と第３の電極１３との間隔Ｇ２が、第１の電極１１と第２の電極１２との間隔Ｇ１よりも短くしてもよい。   In addition, as in the blocking element 1, the blocking element 20 has a gap G <b> 2 between the first electrode 11 and the second electrode 12 and the third electrode 13 such that the first electrode 11 and the second electrode 12. It may be shorter than the interval G1.

また、遮断素子２０は、遮断素子１と同様に、発熱体１５を絶縁基板１０の表面１０ａに形成するとともに絶縁層１７で被覆してもよく（図１２）、あるいは、発熱体１５を、絶縁層１７の内部や、絶縁基板１０の裏面１０ｂ、絶縁基板１０の内部に形成してもよい。いずれの場合にも、遮断素子２０は、遮断素子１と同様に、発熱体１５と第１、第２の電極１１，１２とを重畳させ、あるいは発熱体１５と第１〜第３の電極１１〜１３を重畳させてもよい。   Further, in the same way as the blocking element 1, the blocking element 20 may be formed by forming the heating element 15 on the surface 10 a of the insulating substrate 10 and covering with the insulating layer 17 (FIG. 12), or insulating the heating element 15. You may form in the inside of the layer 17, the back surface 10b of the insulated substrate 10, and the inside of the insulated substrate 10. FIG. In any case, the blocking element 20 is similar to the blocking element 1 in that the heating element 15 and the first and second electrodes 11 and 12 are overlapped, or the heating element 15 and the first to third electrodes 11. ˜13 may be superimposed.

また、遮断素子２０は、遮断素子１と同様に、発熱体１５を絶縁基板１０の表面１０ａ上において、第１〜第４の電極１１〜１４と並んで形成してもよい。   Further, similarly to the blocking element 1, the blocking element 20 may form the heating element 15 along with the first to fourth electrodes 11 to 14 on the surface 10 a of the insulating substrate 10.

また、遮断素子２０は、遮断素子１と同様に、発熱体１５と第１、第２の電極１１，１２の相対的な配置として、発熱体１５の発熱中心Ｃが、第１の電極１１又は第２の電極１２の第１の可溶導体２１が搭載された部位と重畳するようにしてもよい。   Similarly to the blocking element 1, the blocking element 20 is a relative arrangement of the heating element 15 and the first and second electrodes 11 and 12, and the heating center C of the heating element 15 is connected to the first electrode 11 or You may make it overlap with the site | part in which the 1st soluble conductor 21 of the 2nd electrode 12 is mounted.

［可溶導体の構成］
上述したように、第１〜第５の可溶導体２１〜２５は、低融点金属と高融点金属とを含有してもよい。低融点金属としては、Ｓｎを主成分とするＰｂフリーハンダなどのハンダを用いることが好ましく、高融点金属としては、Ａｇ、Ｃｕ又はこれらを主成分とする合金などを用いることが好ましい。このとき、第１〜第５の可溶導体２１〜２５は、図１７（Ａ）に示すように、内層として高融点金属層６０が設けられ、外層として低融点金属層６１が設けられた可溶導体を用いてもよい。この場合、第１〜第５の可溶導体２１〜２５は、高融点金属層６０の全面が低融点金属層６１によって被覆された構造としてもよく、相対向する一対の側面を除き被覆された構造であってもよい。高融点金属層６０や低融点金属層６１による被覆構造は、メッキ等の公知の成膜技術を用いて形成することができる。 [Configuration of soluble conductor]
As described above, the first to fifth soluble conductors 21 to 25 may contain a low melting point metal and a high melting point metal. As the low melting point metal, it is preferable to use solder such as Pb-free solder containing Sn as a main component, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy containing these as main components. At this time, as shown in FIG. 17A, the first to fifth fusible conductors 21 to 25 may be provided with a high melting point metal layer 60 as an inner layer and a low melting point metal layer 61 as an outer layer. A molten conductor may be used. In this case, the first to fifth soluble conductors 21 to 25 may have a structure in which the entire surface of the high melting point metal layer 60 is covered with the low melting point metal layer 61 and is covered except for a pair of opposite side surfaces. It may be a structure. The covering structure with the high melting point metal layer 60 and the low melting point metal layer 61 can be formed using a known film forming technique such as plating.

また、図１７（Ｂ）に示すように、第１〜第５の可溶導体２１〜２５は、内層として低融点金属層６１が設けられ、外層として高融点金属層６０が設けられた可溶導体を用いてもよい。この場合も、第１〜第５の可溶導体２１〜２５は、低融点金属層６１の全面が高融点金属層６０によって被覆された構造としてもよく、相対向する一対の側面を除き被覆された構造であってもよい。   In addition, as shown in FIG. 17B, the first to fifth soluble conductors 21 to 25 are soluble in which a low melting point metal layer 61 is provided as an inner layer and a high melting point metal layer 60 is provided as an outer layer. A conductor may be used. Also in this case, the first to fifth fusible conductors 21 to 25 may have a structure in which the entire surface of the low melting point metal layer 61 is covered with the refractory metal layer 60 and is covered except for a pair of opposite side surfaces. The structure may be different.

また、第１〜第５の可溶導体２１〜２５は、図１８に示すように、高融点金属層６０と低融点金属層６１とが積層された積層構造としてもよい。   Moreover, the 1st-5th soluble conductors 21-25 are good also as a laminated structure by which the high melting metal layer 60 and the low melting metal layer 61 were laminated | stacked, as shown in FIG.

この場合、第１〜第５の可溶導体２１〜２５は、図１８（Ａ）に示すように、第１〜第３の電極１１〜１３に接続される下層と、下層の上に積層される上層からなる２層構造として形成され、下層となる高融点金属層６０の上面に上層となる低融点金属層６１を積層してもよく、反対に下層となる低融点金属層６１の上面に上層となる高融点金属層６０を積層してもよい。あるいは、第１〜第５の可溶導体２１〜２５は、図１８（Ｂ）に示すように、内層と内層の上下面に積層される外層とからなる３層構造として形成してもよく、内層となる高融点金属層６０の上下面に外層となる低融点金属層６１を積層してもよく、反対に内層となる低融点金属層６１の上下面に外層となる高融点金属層６０を積層してもよい。   In this case, the 1st-5th soluble conductors 21-25 are laminated | stacked on the lower layer connected to the 1st-3rd electrodes 11-13, and a lower layer, as shown to FIG. 18 (A). The lower melting point metal layer 61 may be laminated on the upper surface of the lower refractory metal layer 60, and on the contrary, the lower melting point metal layer 61 may be laminated on the upper surface. The upper refractory metal layer 60 may be laminated. Alternatively, the first to fifth soluble conductors 21 to 25 may be formed as a three-layer structure including an inner layer and an outer layer laminated on the upper and lower surfaces of the inner layer, as shown in FIG. The low melting point metal layer 61 serving as the outer layer may be laminated on the upper and lower surfaces of the refractory metal layer 60 serving as the inner layer. Conversely, the refractory metal layer 60 serving as the outer layer may be disposed on the upper and lower surfaces of the low melting point metal layer 61 serving as the inner layer. You may laminate.

また、第１〜第５の可溶導体２１〜２５は、図１９に示すように、高融点金属層６０と低融点金属層６１とが交互に積層された４層以上の多層構造としてもよい。この場合、第１〜第５の可溶導体２１〜２５は、最外層を構成する金属層によって、全面又は相対向する一対の側面を除き被覆された構造としてもよい。   Moreover, the 1st-5th soluble conductors 21-25 are good also as a multilayered structure of four or more layers by which the high melting metal layer 60 and the low melting metal layer 61 were laminated | stacked alternately, as shown in FIG. . In this case, the 1st-5th soluble conductors 21-25 are good also as a structure coat | covered by the metal layer which comprises outermost layer except the whole surface or a pair of side surface which opposes.

また、第１〜第５の可溶導体２１〜２５は、内層を構成する低融点金属層６１の表面に高融点金属層６０をストライプ状に部分的に積層させてもよい。図２０は、第１〜第５の可溶導体２１〜２５の平面図である。   Moreover, the 1st-5th soluble conductors 21-25 may laminate | stack the high melting point metal layer 60 partially on the surface of the low melting point metal layer 61 which comprises an inner layer at stripe form. FIG. 20 is a plan view of the first to fifth soluble conductors 21 to 25.

図２０（Ａ）に示す第１〜第５の可溶導体２１〜２５は、低融点金属層６１の表面に、幅方向に所定間隔で、線状の高融点金属層６０が長手方向に複数形成されることにより、長手方向に沿って線状の開口部６２が形成され、この開口部６２から低融点金属層６１が露出されている。第１〜第５の可溶導体２１〜２５は、低融点金属層６１が開口部６２より露出することにより、溶融した低融点金属と高融点金属との接触面積が増え、高融点金属層６０の浸食作用をより促進させて溶断性を向上させることができる。開口部６２は、例えば、低融点金属層６１に高融点金属層６０を構成する金属の部分メッキを施すことにより形成することができる。   The first to fifth soluble conductors 21 to 25 shown in FIG. 20A have a plurality of linear refractory metal layers 60 in the longitudinal direction on the surface of the low melting point metal layer 61 at predetermined intervals in the width direction. By being formed, a linear opening 62 is formed along the longitudinal direction, and the low melting point metal layer 61 is exposed from the opening 62. In the first to fifth soluble conductors 21 to 25, when the low melting point metal layer 61 is exposed from the opening 62, the contact area between the molten low melting point metal and the high melting point metal increases, and the high melting point metal layer 60. It is possible to improve the fusing property by further promoting the erosion action. The opening 62 can be formed, for example, by subjecting the low melting point metal layer 61 to partial plating of a metal constituting the high melting point metal layer 60.

また、第１〜第５の可溶導体２１〜２５は、図２０（Ｂ）に示すように、低融点金属層６１の表面に、長手方向に所定間隔で、線状の高融点金属層６０を幅方向に複数形成することにより、幅方向に沿って線状の開口部６２を形成してもよい。   Further, as shown in FIG. 20B, the first to fifth fusible conductors 21 to 25 are formed on the surface of the low melting point metal layer 61 at a predetermined interval in the longitudinal direction at the linear refractory metal layer 60. By forming a plurality of holes in the width direction, the linear openings 62 may be formed along the width direction.

また、第１〜第５の可溶導体２１〜２５は、図２１に示すように、低融点金属層６１の表面に高融点金属層６０を形成するとともに、高融点金属層６０の全面に亘って円形の開口部６３が形成され、この開口部６３から低融点金属層６１を露出させてもよい。開口部６３は、例えば、低融点金属層６１に高融点金属層６０を構成する金属の部分メッキを施すことにより形成することができる。   In addition, as shown in FIG. 21, the first to fifth fusible conductors 21 to 25 form the refractory metal layer 60 on the surface of the low melting point metal layer 61 and extend over the entire surface of the refractory metal layer 60. A circular opening 63 may be formed, and the low melting point metal layer 61 may be exposed from the opening 63. The opening 63 can be formed, for example, by subjecting the low melting point metal layer 61 to partial plating of a metal constituting the high melting point metal layer 60.

第１〜第５の可溶導体２１〜２５は、低融点金属層６１が開口部６３より露出することにより、溶融した低融点金属と高融点金属との接触面積が増え、高融点金属の浸食作用をより促進させて溶断性を向上させることができる。   In the first to fifth fusible conductors 21 to 25, when the low melting point metal layer 61 is exposed from the opening 63, the contact area between the melted low melting point metal and the high melting point metal increases, and the high melting point metal is eroded. The action can be further promoted to improve the fusing property.

また、第１〜第５の可溶導体２１〜２５は、図２２に示すように、内層となる高融点金属層６０に多数の開口部６４を形成し、この高融点金属層６０に、メッキ技術等を用いて低融点金属層６１を成膜し、開口部６４内に充填してもよい。これにより、第１〜第５の可溶導体２１〜２５は、溶融する低融点金属が高融点金属に接する面積が増大するので、より短時間で低融点金属が高融点金属を溶食することができるようになる。   Further, as shown in FIG. 22, the first to fifth soluble conductors 21 to 25 are formed with a large number of openings 64 in the refractory metal layer 60 serving as an inner layer, and the refractory metal layer 60 is plated. The low melting point metal layer 61 may be formed using a technique or the like and filled in the opening 64. As a result, in the first to fifth soluble conductors 21 to 25, since the area where the low melting point metal to be in contact with the high melting point metal increases, the low melting point metal erodes the high melting point metal in a shorter time. Will be able to.

また、第１〜第５の可溶導体２１〜２５は、低融点金属層６１の体積を、高融点金属層６０の体積よりも多く形成することが好ましい。第１〜第５の可溶導体２１〜２５は、発熱体１５の発熱によって加熱され、低融点金属が溶融することにより高融点金属を溶食し、これにより速やかに溶融、溶断することができる。したがって、第１〜第５の可溶導体２１〜２５は、低融点金属層６１の体積を高融点金属層６０の体積よりも多く形成することにより、この溶食作用を促進し、速やかに第１、第２の電極１１，１２間を短絡することができる。   Moreover, it is preferable that the 1st-5th soluble conductors 21-25 form the volume of the low melting metal layer 61 more than the volume of the high melting metal layer 60. The 1st-5th soluble conductors 21-25 are heated by the heat_generation | fever of the heat generating body 15, and when a low melting-point metal melt | dissolves, a high melting-point metal is eroded and can melt | dissolve rapidly by this. Therefore, the first to fifth soluble conductors 21 to 25 promote the erosion action by forming the volume of the low melting point metal layer 61 larger than the volume of the high melting point metal layer 60, and quickly 1 and the 2nd electrodes 11 and 12 can be short-circuited.

また、第１〜第５の可溶導体２１〜２５は、図２３に示すように、略矩形板状に形成され、外層を構成する高融点金属によって被覆され主面部５１よりも肉厚に形成された相対向する一対の第１の側縁部５２と、内層を構成する低融点金属が露出され第１の側縁部５２よりも薄い厚さに形成された相対向する一対の第２の側縁部５３とを有してもよい。   Moreover, as shown in FIG. 23, the 1st-5th soluble conductors 21-25 are formed in a substantially rectangular plate shape, and are covered with the high melting point metal which comprises an outer layer, and are thicker than the main surface part 51. A pair of first side edges 52 opposed to each other and a pair of second side edges opposed to each other formed by exposing the low melting point metal constituting the inner layer to a thickness thinner than that of the first side edges 52 You may have the side edge part 53. FIG.

第１の側縁部５２は、側面が高融点金属層６０によって被覆されるとともに、これにより第１〜第５の可溶導体２１〜２５の主面部５１よりも肉厚に形成されている。第２の側縁部５３は、側面に、外周を高融点金属層６０によって囲繞された低融点金属層６１が露出されている。第２の側縁部５３は、第１の側縁部５２と隣接する両端部を除き主面部５１と同じ厚さに形成されている。   The side surface of the first side edge portion 52 is covered with the refractory metal layer 60, and is thereby formed thicker than the main surface portion 51 of the first to fifth soluble conductors 21 to 25. As for the 2nd side edge part 53, the low melting metal layer 61 by which the outer periphery was enclosed by the high melting metal layer 60 is exposed to the side surface. The second side edge portion 53 is formed to have the same thickness as the main surface portion 51 except for both end portions adjacent to the first side edge portion 52.

遮断素子１においては、図２４に示すように、第１の可溶導体２１は、第１の側縁部５２が第１、第２の電極１１，１２の幅方向に沿って搭載されるとともに、第１、第３の電極１１，１３間、及び第２、第３の電極１２，１３間に跨って接続され、第２の側縁部５３が、通電方向の両側端となる向きで、第１、第２の電極１１，１２間に跨って接続されている。   In the blocking element 1, as shown in FIG. 24, the first fusible conductor 21 has the first side edge portion 52 mounted along the width direction of the first and second electrodes 11 and 12. , Connected between the first and third electrodes 11 and 13 and between the second and third electrodes 12 and 13, the second side edge 53 in the direction to be the both ends of the energization direction, The first and second electrodes 11 and 12 are connected across.

これにより、遮断素子１は、第１の可溶導体２１の第１の接続部２１ａが速やかに溶断し、外部回路の電流経路を遮断するとともに、第２の接続部２１ｂの溶断を遅らせて発熱体１５の発熱を維持し、確実に第１、第２の電極１１，１２間を遮断させることができる。   As a result, the breaking element 1 generates heat by quickly melting the first connecting portion 21a of the first fusible conductor 21 to cut off the current path of the external circuit and delaying the fusing of the second connecting portion 21b. The heat generation of the body 15 can be maintained, and the first and second electrodes 11 and 12 can be reliably blocked.

すなわち、第２の側縁部５３は、第１の側縁部５２よりも相対的に薄肉に形成されている。また、第２の側縁部５３の側面は、内層を構成する低融点金属層６１が露出されている。これにより、第２の側縁部５３は、低融点金属層６１による高融点金属層６０の溶食作用が働き、かつ、溶食される高融点金属層６０の厚さも第１の側縁部５２に比して薄く形成されていることにより、高融点金属層６０によって肉厚に形成されている第１の側縁部５２に比して、少ない熱エネルギーで速やかに溶融させることができる。これに対し、第１の側縁部５２は、高融点金属層６０によって肉厚に被覆され、第２の側縁部５３に比して溶断するまでに多くの熱エネルギーを要する。   That is, the second side edge portion 53 is formed to be relatively thinner than the first side edge portion 52. Further, the low melting point metal layer 61 constituting the inner layer is exposed on the side surface of the second side edge portion 53. As a result, the second side edge portion 53 works to cause the erosion action of the refractory metal layer 60 by the low melting point metal layer 61 and the thickness of the refractory metal layer 60 to be eroded is also the first side edge portion. By being formed thinner than 52, it can be rapidly melted with less heat energy than the first side edge 52 formed thick by the refractory metal layer 60. On the other hand, the first side edge portion 52 is covered with the refractory metal layer 60 to have a large thickness, and requires a lot of heat energy to blow out as compared with the second side edge portion 53.

したがって、遮断素子１は、発熱体１５が発熱することにより、先ず、第２の側縁部５３がわたされている第１の電極１１と第２の電極１２との間が溶断する。これにより、遮断素子１は、第１、第２の電極１１，１２間が遮断する。次いで、第１の側縁部５２がわたされている第１、第２の電極１１，１２と第３の電極１３との間が溶断し、発熱体１５への給電経路２が遮断され、発熱体１５の発熱が停止される。すなわち、遮断素子１は、第１、第２の電極１１，１２間が遮断する前に第１、第２の電極１１，１２と第３の電極１３との間が遮断され、発熱体１５への給電が停止することによって第１、第２の電極１１，１２間が遮断不能となる事態を防止することができる。   Therefore, in the interrupting element 1, when the heating element 15 generates heat, first, the first electrode 11 and the second electrode 12 where the second side edge portion 53 is passed are fused. Thereby, the interruption | blocking element 1 interrupts | blocks between the 1st, 2nd electrodes 11 and 12. FIG. Next, the first and second electrodes 11, 12 and the third electrode 13, to which the first side edge portion 52 is passed, melts, the power supply path 2 to the heating element 15 is cut off, and heat is generated. Heat generation of the body 15 is stopped. In other words, the blocking element 1 is disconnected between the first and second electrodes 11 and 12 and the third electrode 13 before the first and second electrodes 11 and 12 are blocked, and is connected to the heating element 15. As a result, the situation where the first and second electrodes 11 and 12 cannot be blocked can be prevented.

遮断素子２０においても、図２５に示すように、第２の可溶導体２２は、肉厚に形成された第１の側縁部５２が第１、第２の電極１１，１２の幅方向に沿って搭載され、第２の側縁部５３が通電方向の両側端となる向きで、第１、第２の電極１１，１２間に跨って接続されている。また、第３の可溶導体２３は、肉厚に形成された第１の側縁部５２が第１、第３の電極１１，１３間、及び第２、第３の電極１２，１３間に跨って接続され、第２の側縁部５３が第３の電極１３の幅方向及び第１、第２の電極１１，１２間に跨って接続されている。   Also in the interruption element 20, as shown in FIG. 25, the second fusible conductor 22 has a first side edge portion 52 formed thick in the width direction of the first and second electrodes 11 and 12. The second side edge portion 53 is connected across the first and second electrodes 11 and 12 in such a direction that the second side edge portion 53 becomes both ends in the energization direction. The third fusible conductor 23 has a thick first side edge 52 between the first and third electrodes 11 and 13 and between the second and third electrodes 12 and 13. The second side edge 53 is connected across the width direction of the third electrode 13 and between the first and second electrodes 11 and 12.

これにより、遮断素子２０は、第２の可溶導体２２及び第３の可溶導体２３の各第２の側縁部５３が速やかに溶融し、第１、第２の電極１１，１２間が遮断することにより外部回路の電流経路を遮断するとともに、第３の可溶導体２３の第１の側縁部５２の溶断を遅らせて発熱体１５の発熱を維持し、確実に第１、第２の電極１１，１２間を遮断させることができる。   Thereby, the interruption | blocking element 20 melt | dissolves each 2nd side edge part 53 of the 2nd soluble conductor 22 and the 3rd soluble conductor 23 rapidly, and between 1st, 2nd electrodes 11 and 12 is carried out. By interrupting, the current path of the external circuit is interrupted, and the fusing of the first side edge 52 of the third fusible conductor 23 is delayed to maintain the heat generation of the heating element 15, and the first and second are surely made. Between the electrodes 11 and 12 can be interrupted.

また、図２６に示すように、第３の可溶導体２３に代えて第４、第５の可溶導体２４，２５を用いた場合にも、同様に、第４、第５の可溶導体２４，２５は、肉厚に形成された第１の側縁部５２が第１、第３の電極１１，１３間、及び第２、第３の電極１２，１３間に跨って接続されている。   In addition, as shown in FIG. 26, when the fourth and fifth soluble conductors 24 and 25 are used instead of the third soluble conductor 23, similarly, the fourth and fifth soluble conductors are used. 24 and 25, the 1st side edge part 52 formed thickly is connected ranging between the 1st, 3rd electrodes 11, 13 and between the 2nd, 3rd electrodes 12, 13. .

これにより、遮断素子２０は、第２の可溶導体２２の第２の側縁部５３が速やかに溶融し、第１、第２の電極１１，１２間が遮断することにより外部回路の電流経路を遮断するとともに、第４、第５の可溶導体２４，２５の第１の側縁部５２の溶断を遅らせて発熱体１５の発熱を維持し、確実に第１、第２の電極１１，１２間を遮断させることができる。   As a result, the breaking element 20 quickly melts the second side edge 53 of the second fusible conductor 22, and the current path of the external circuit is cut off between the first and second electrodes 11 and 12. And the fusing of the first side edge portion 52 of the fourth and fifth fusible conductors 24, 25 is delayed to maintain the heat generation of the heating element 15, and the first and second electrodes 11, 12 can be blocked.

このような構成を有する第１〜第５の可溶導体２１〜２５は、低融点金属層６１を構成するハンダ箔等の低融点金属箔を、高融点金属層６０を構成するＡｇ等の金属で被覆することにより製造される。低融点金属層箔を高融点金属被覆する工法としては、長尺状の低融点金属箔に連続して高融点金属メッキを施すことができる電解メッキ法が、作業効率上、製造コスト上、有利となる。   The first to fifth soluble conductors 21 to 25 having such a configuration are made of a low melting point metal foil such as a solder foil constituting the low melting point metal layer 61 and a metal such as Ag constituting the high melting point metal layer 60. It is manufactured by coating with. As a method for coating a low melting point metal layer foil with a high melting point metal, an electrolytic plating method capable of continuously applying a high melting point metal plating to a long low melting point metal foil is advantageous in terms of work efficiency and manufacturing cost. It becomes.

電解メッキによって高融点金属メッキを施すと、長尺状の低融点金属箔のエッジ部分、すなわち、側縁部において電界強度が相対的に強まり、高融点金属層６０が厚くメッキされる（図２３参照）。これにより、側縁部が高融点金属層によって肉厚に形成された長尺状の導体リボン５０が形成される。次いで、この導体リボン５０を長手方向と直交する幅方向（図２３中Ｃ−Ｃ’方向）に、所定長さに切断することにより、第１〜第５の可溶導体２１〜２５が製造される。これにより、第１〜第５の可溶導体２１〜２５は、導体リボン５０の側縁部が第１の側縁部５２となり、導体リボン５０の切断面が第２の側縁部５３となる。また、第１の側縁部５２は、高融点金属によって被覆され、第２の側縁部５３は、端面（導体リボン５０の切断面）に上下一対の高融点金属層６０と高融点金属層６０によって挟持された低融点金属層６１が外方に露出されている。   When refractory metal plating is performed by electrolytic plating, the electric field strength is relatively strong at the edge portion of the long low melting point metal foil, that is, the side edge portion, and the refractory metal layer 60 is thickly plated (FIG. 23). reference). Thereby, the elongate conductor ribbon 50 by which the side edge part was formed thickly by the high melting-point metal layer is formed. Next, the first to fifth fusible conductors 21 to 25 are manufactured by cutting the conductor ribbon 50 into a predetermined length in a width direction (CC ′ direction in FIG. 23) orthogonal to the longitudinal direction. The Thereby, as for the 1st-5th soluble conductors 21-25, the side edge part of the conductor ribbon 50 becomes the 1st side edge part 52, and the cut surface of the conductor ribbon 50 becomes the 2nd side edge part 53. . The first side edge portion 52 is covered with a refractory metal, and the second side edge portion 53 has a pair of upper and lower refractory metal layers 60 and a refractory metal layer on an end surface (cut surface of the conductor ribbon 50). The low melting point metal layer 61 sandwiched by 60 is exposed to the outside.

１，２０ 遮断素子、２，２７ 給電経路、１０ 絶縁基板、１０ａ 表面、１０ｂ 裏面、１１ 第１の電極、１２ 第２の電極、１３ 第３の電極、１４ 第４の電極、１５ 発熱体、１６ 絶縁層、１７ 絶縁層、１８ フラックス、１９ カバー部材、２１ 第１の可溶導体、２２ 第２の可溶導体、２３ 第３の可溶導体、２４ 第４の可溶導体、２５ 第５の可溶導体、３０ バッテリパック、３１〜３４ バッテリセル、３６ 検出回路、３７ 電流制御素子、４０ 充放電制御回路、４１，４２ 電流制御素子、４３ 制御部、４５ 充電装置、５０ 導体リボン DESCRIPTION OF SYMBOLS 1,20 Interrupting element, 2,27 Feeding path, 10 Insulating substrate, 10a surface, 10b back surface, 11 1st electrode, 12 2nd electrode, 13 3rd electrode, 14 4th electrode, 15 Heating body, 16 Insulating layer, 17 Insulating layer, 18 Flux, 19 Cover member, 21 First soluble conductor, 22 Second soluble conductor, 23 Third soluble conductor, 24 Fourth soluble conductor, 25 5th Soluble conductor, 30 battery pack, 31-34 battery cell, 36 detection circuit, 37 current control element, 40 charge / discharge control circuit, 41, 42 current control element, 43 control unit, 45 charging device, 50 conductor ribbon

Claims (32)

絶縁基板と、
上記絶縁基板に形成された第１〜第４の電極と、
上記第３の電極と上記第４の電極との間に接続された発熱体と、
上記第１の電極、上記第２の電極及び上記第３の電極との間に接続されることにより、上記第１の電極と上記第２の電極間を接続する第１の接続部と、上記第１の電極及び上記第２の電極と上記第３の電極とを接続する第２の接続部を有する第１の可溶導体とを備え、
上記第１の電極又は上記第２の電極から上記第１の可溶導体及び上記第３の電極を介して上記発熱体に電流を流す給電経路を有し、
上記発熱体の発熱により上記第１の可溶導体を溶融させることにより、上記第１の接続部を溶断し、次いで上記第２の接続部を溶断する遮断素子。 An insulating substrate;
First to fourth electrodes formed on the insulating substrate;
A heating element connected between the third electrode and the fourth electrode;
A first connecting portion connecting the first electrode and the second electrode by being connected between the first electrode, the second electrode, and the third electrode; and A first fusible conductor having a first connecting portion and a second connecting portion for connecting the second electrode and the third electrode;
A power supply path through which current flows from the first electrode or the second electrode to the heating element via the first soluble conductor and the third electrode;
A breaker element that melts the first soluble conductor by heat generation of the heating element, thereby fusing the first connecting portion and then fusing the second connecting portion. 上記第１の可溶導体は、上記第１の接続部が上記第２の接続部よりも、上記発熱体の発熱中心に近い位置に搭載されている請求項１に記載の遮断素子。   2. The interruption element according to claim 1, wherein the first fusible conductor is mounted such that the first connection portion is closer to the heat generation center of the heating element than the second connection portion. 上記第２の接続部の幅Ｗ２は、上記第１の接続部の幅Ｗ１よりも狭い請求項１又は請求項２に記載の遮断素子。   The blocking element according to claim 1 or 2, wherein a width W2 of the second connection portion is narrower than a width W1 of the first connection portion. 絶縁基板と、
上記絶縁基板に形成された第１〜第４の電極と、
上記第３の電極と上記第４の電極との間に接続された発熱体と、
上記第１の電極と第２の電極との間に接続された第２の可溶導体と、
上記第１の電極及び第２の電極と上記第３の電極との間に接続された第３の可溶導体とを備え、
上記第１の電極又は上記第２の電極から上記第２及び第３の可溶導体及び上記第３の電極を介して上記発熱体に電流を流す給電経路を有し、
上記発熱体の発熱により上記第２の可溶導体を溶断させることにより、上記第１〜第２の電極間を遮断し、次いで上記第３の可溶導体を溶断させることにより、上記第１の電極又は上記第２の電極〜上記第３の電極間を遮断する遮断素子。 An insulating substrate;
First to fourth electrodes formed on the insulating substrate;
A heating element connected between the third electrode and the fourth electrode;
A second soluble conductor connected between the first electrode and the second electrode;
A third fusible conductor connected between the first and second electrodes and the third electrode;
A power supply path for passing a current from the first electrode or the second electrode to the heating element via the second and third soluble conductors and the third electrode;
By cutting off the second soluble conductor by the heat generated by the heating element, the first and second electrodes are cut off, and then the third soluble conductor is blown off, A blocking element that blocks between the electrode or the second electrode to the third electrode. 上記第２の可溶導体は、上記第３の可溶導体よりも、上記発熱体の発熱中心に近い位置に搭載されている請求項４に記載の遮断素子。   The interruption | blocking element of Claim 4 with which the said 2nd soluble conductor is mounted in the position near the heat_generation | fever center of the said heat generating body rather than the said 3rd soluble conductor. 上記第３の可溶導体の幅Ｗ２は、上記第２の可溶導体の幅Ｗ１よりも狭い請求項４又は請求項５に記載の遮断素子。   6. The blocking element according to claim 4, wherein a width W2 of the third soluble conductor is narrower than a width W1 of the second soluble conductor. 上記第２の可溶導体の融点が上記第３の可溶導体の融点よりも低い請求項４〜請求項６のいずれか１項に記載の遮断素子。   The breaking element according to any one of claims 4 to 6, wherein the melting point of the second soluble conductor is lower than the melting point of the third soluble conductor. 上記第３の可溶導体に代えて、上記第１の電極と上記第３の電極とを接続する第４の可溶導体及び／又は上記第２の電極と上記第３の電極とを接続する第５の可溶導体を備える請求項４〜請求項７のいずれか１項に記載の遮断素子。   Instead of the third soluble conductor, the fourth soluble conductor connecting the first electrode and the third electrode and / or the second electrode and the third electrode are connected. The interruption | blocking element of any one of Claims 4-7 provided with a 5th soluble conductor. 上記第１の電極及び上記第２の電極と上記第３の電極との間隔Ｇ２が、上記第１の電極と上記第２の電極との間隔Ｇ１よりも短い請求項１〜８のいずれか１項に記載の遮断素子。   The gap G2 between the first electrode and the second electrode and the third electrode is shorter than the gap G1 between the first electrode and the second electrode. The interruption | blocking element of description. 上記絶縁基板の上記第１〜第４の電極が形成されている表面に絶縁層を備え、
上記発熱体は、上記絶縁基板と上記絶縁層との間、又は上記絶縁層の内部に形成されている請求項１〜９のいずれか１項に記載の遮断素子。 An insulating layer is provided on the surface of the insulating substrate on which the first to fourth electrodes are formed,
The interrupting element according to claim 1, wherein the heating element is formed between the insulating substrate and the insulating layer or inside the insulating layer. 上記発熱体は、上記絶縁基板の上記第１〜第３の電極が形成されている表面と反対側の裏面に形成されている請求項１〜９のいずれか１項に記載の遮断素子。 The interruption element according to any one of claims 1 to 9, wherein the heating element is formed on a back surface of the insulating substrate opposite to a surface on which the first to third electrodes are formed. 上記発熱体は、上記絶縁基板の内部に形成されている請求項１〜９のいずれか１項に記載の遮断素子。   The interrupting element according to claim 1, wherein the heating element is formed inside the insulating substrate. 上記発熱体と上記第１及び第２の電極が重畳する請求項１０〜１２のいずれか１項に記載の遮断素子。   The interruption | blocking element of any one of Claims 10-12 with which the said heat generating body and the said 1st and 2nd electrode overlap. 上記発熱体と上記第３の電極が重畳する請求項１３記載の遮断素子。   The interruption | blocking element of Claim 13 with which the said heat generating body and the said 3rd electrode overlap. 上記絶縁基板の上記第１〜第４の電極が形成されている表面に絶縁層を備え、
上記発熱体は、上記絶縁基板と上記絶縁層との間に形成されるとともに、上記第１〜第４の電極と並んで形成されている請求項１〜９のいずれか１項に記載の遮断素子。 An insulating layer is provided on the surface of the insulating substrate on which the first to fourth electrodes are formed,
The interruption according to any one of claims 1 to 9, wherein the heating element is formed between the insulating substrate and the insulating layer, and is formed side by side with the first to fourth electrodes. element. 上記発熱体の発熱中心が、上記第１の電極又は上記第２の電極の上記第１の可溶導体が搭載された部位と重畳する請求項１〜１４のいずれか１項に記載の遮断素子。   The interruption | blocking element of any one of Claims 1-14 with which the heat_generation | fever center of the said heat generating body overlaps with the site | part in which the said 1st soluble conductor of the said 1st electrode or the said 2nd electrode is mounted. . 上記第１〜第５の可溶導体の少なくとも一つは、ハンダである請求項１〜１６のいずれか１項に記載の遮断素子。   The interrupting device according to any one of claims 1 to 16, wherein at least one of the first to fifth soluble conductors is solder. 上記第１〜第５の可溶導体の少なくとも一つは、低融点金属と高融点金属とを含有し、
上記低融点金属が上記発熱体からの加熱により溶融し、上記高融点金属を溶食する請求項１〜１６のいずれか１項に記載の遮断素子。 At least one of the first to fifth soluble conductors contains a low melting point metal and a high melting point metal,
The interruption | blocking element of any one of Claims 1-16 which the said low melting metal melt | dissolves by the heating from the said heat generating body, and corrodes the said high melting metal. 上記低融点金属はハンダであり、
上記高融点金属は、Ａｇ、Ｃｕ又はＡｇ若しくはＣｕを主成分とする合金である請求項１８記載の遮断素子。 The low melting point metal is solder,
The blocking element according to claim 18, wherein the refractory metal is Ag, Cu, or an alloy containing Ag or Cu as a main component. 上記第１〜第５の可溶導体の少なくとも一つは、内層が高融点金属であり、外層が低融点金属の被覆構造である請求項１８又は請求項１９に記載の遮断素子。   The interrupting element according to claim 18 or 19, wherein at least one of the first to fifth soluble conductors has an inner layer made of a refractory metal and an outer layer covered with a low-melting metal. 上記第１〜第５の可溶導体の少なくとも一つは、内層が低融点金属であり、外層が高融点金属の被覆構造である請求項１８又は請求項１９に記載の遮断素子。   The interrupting element according to claim 18 or 19, wherein at least one of the first to fifth soluble conductors has an inner layer made of a low melting point metal and an outer layer made of a high melting point metal. 上記第１〜第５の可溶導体の少なくとも一つは、低融点金属と、高融点金属とが積層された積層構造である請求項１８又は請求項１９に記載の遮断素子。   The interrupting device according to claim 18 or 19, wherein at least one of the first to fifth soluble conductors has a laminated structure in which a low melting point metal and a high melting point metal are laminated. 上記第１〜第５の可溶導体の少なくとも一つは、低融点金属と、高融点金属とが交互に積層された４層以上の多層構造である請求項１８又は請求項１９に記載の遮断素子。   20. The barrier according to claim 18, wherein at least one of the first to fifth soluble conductors has a multilayer structure of four or more layers in which a low melting point metal and a high melting point metal are alternately laminated. element. 上記第１〜第５の可溶導体の少なくとも一つは、内層を構成する低融点金属の表面に形成された高融点金属に、開口部が設けられている請求項１８又は請求項１９に記載の遮断素子。   The at least one of said 1st-5th soluble conductor is provided with the opening part in the high melting metal formed in the surface of the low melting metal which comprises an inner layer. Breaking element. 上記第１〜第５の可溶導体の少なくとも一つは、多数の開口部を有する高融点金属層と、上記高融点金属層上に形成された低融点金属層とを有し、上記開口部に低融点金属が充填されている請求項１８又は請求項１９に記載の遮断素子。   At least one of the first to fifth soluble conductors has a refractory metal layer having a large number of openings, and a low melting point metal layer formed on the refractory metal layer, and the openings The interruption | blocking element of Claim 18 or Claim 19 with which low melting | fusing point metal is filled. 上記第１の可溶導体は、低融点金属の体積が、高融点金属の体積よりも多い請求項１８〜２５のいずれか１項に記載の遮断素子。   The breaking element according to any one of claims 18 to 25, wherein the first soluble conductor has a volume of a low melting point metal larger than a volume of a high melting point metal. 上記第１、第３〜第５の可溶導体の少なくとも一つは、外層を構成する上記高融点金属によって被覆され主面部よりも肉厚に形成された相対向する一対の第１の側縁部と、内層を構成する上記低融点金属が露出され上記第１の側面部よりも薄い厚さに形成された相対向する一対の第２の側縁部とを有し、
上記第１の側縁部が上記発熱体への通電方向の両側端となる向きで、上記第１及び第３の電極間もしくは上記第１及び第３の電極間と上記第２及び第３の電極間の両方にわたって接続されている請求項２１〜２４のいずれか１項に記載の遮断素子。 At least one of the first, third to fifth soluble conductors is a pair of opposing first side edges that are covered with the refractory metal constituting the outer layer and formed thicker than the main surface portion. And a pair of second side edge portions facing each other, the exposed low-melting point metal constituting the inner layer being exposed and having a thickness thinner than the first side surface portion,
In the direction in which the first side edge portion becomes both ends of the energization direction to the heating element, between the first and third electrodes or between the first and third electrodes and the second and third The interruption | blocking element of any one of Claims 21-24 connected across both between electrodes. 上記第１の可溶導体及び第２の可溶導体の少なくとも一つは、外層を構成する上記高融点金属によって被覆され主面部よりも肉厚に形成された相対向する一対の第１の側縁部と、内層を構成する上記低融点金属が露出され上記第１の側面部よりも薄い厚さに形成された相対向する一対の第２の側縁部とを有し、
上記第２の側縁部が通電方向の両側端となる向きで、上記第１及び第２の電極間にわたって接続されている請求項２１〜２４のいずれか１項に記載の遮断素子。 At least one of the first fusible conductor and the second fusible conductor is covered with the refractory metal constituting the outer layer and is formed to be thicker than the main surface portion. An edge portion and a pair of second side edge portions opposed to each other, wherein the low melting point metal constituting the inner layer is exposed and formed to be thinner than the first side surface portion;
The interruption | blocking element of any one of Claims 21-24 connected across the said 1st and 2nd electrode in the direction which becomes a both-sides end of an electricity supply direction in the said 2nd side edge part. 外部回路に接続される第１の端子と第２の端子と、
発熱抵抗と、
上記発熱体と接続された第３の端子と、
上記第１の端子と上記第２の端子との間に接続され、上記外部回路に直列に接続される第１のヒューズと、上記第１、第２の端子と上記第３の端子との間に接続された第２のヒューズとを備え、
上記第１又は第２の端子、上記第１、第２のヒューズ及び上記第３の端子を介して上記発熱抵抗に電流を流し、上記発熱抵抗が発熱した熱により、上記第１のヒューズを溶融させ、上記第１の端子と上記第２の端子との間を遮断した後に、上記第２のヒューズを溶融させ、上記第１及び第２の端子と上記第３の端子との間を遮断する遮断素子回路。 A first terminal and a second terminal connected to an external circuit;
Heating resistance,
A third terminal connected to the heating element;
A first fuse connected between the first terminal and the second terminal and connected in series to the external circuit, and between the first, second terminal, and the third terminal. And a second fuse connected to
A current is passed through the heating resistor through the first or second terminal, the first and second fuses, and the third terminal, and the first fuse is melted by the heat generated by the heating resistor. And disconnecting between the first terminal and the second terminal, melting the second fuse, and disconnecting between the first and second terminals and the third terminal. Breaking element circuit. 上記第１のヒューズが電源ラインに直列に接続され、上記発熱抵抗の開放端をスイッチ素子を介して上記電源ラインの反対極に接続され、
上記スイッチ素子を駆動させることにより上記発熱抵抗に電流が流れる請求項２９記載の遮断素子回路。 The first fuse is connected in series to a power supply line, the open end of the heating resistor is connected to the opposite pole of the power supply line via a switch element;
30. The interruption element circuit according to claim 29, wherein a current flows through the heating resistor by driving the switch element. 外部回路に接続される第１の端子と第２の端子と、
発熱抵抗と、
上記発熱抵抗と接続された第３の端子と、
上記第１の端子と上記第２の端子との間に接続され、上記外部回路に直列に接続される第３のヒューズと、
上記第１及び／又は第２の端子と上記第３の端子との間に接続された第４のヒューズとを備え、
上記第１又は第２の端子、上記第３、第４のヒューズ及び上記第３の端子を介して上記発熱抵抗に電流を流し、上記発熱抵抗が発熱した熱により、上記第３のヒューズを溶融させ、上記第１の端子と上記第２の端子との間を遮断した後に、上記第４のヒューズを溶融させ、上記第１及び第２の端子と上記第３の端子との間を遮断する遮断素子回路。 A first terminal and a second terminal connected to an external circuit;
Heating resistance,
A third terminal connected to the heating resistor;
A third fuse connected between the first terminal and the second terminal and connected in series to the external circuit;
A fourth fuse connected between the first and / or second terminal and the third terminal;
A current is passed through the heating resistor through the first or second terminal, the third and fourth fuses, and the third terminal, and the third fuse is melted by the heat generated by the heating resistor. And disconnecting between the first terminal and the second terminal, melting the fourth fuse, and disconnecting between the first and second terminals and the third terminal. Breaking element circuit. 上記第３のヒューズが電源ラインに直列に接続され、上記発熱抵抗の開放端をスイッチ素子を介して上記電源ラインの反対極に接続され、
上記スイッチ素子を駆動させることにより上記発熱抵抗に電流が流れる請求項３１記載の遮断素子回路。 The third fuse is connected in series to the power supply line, and the open end of the heating resistor is connected to the opposite pole of the power supply line via a switch element;
32. The interruption element circuit according to claim 31, wherein a current flows through the heating resistor by driving the switch element.
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