JP6120764B2 - インダクタ素子及びその製造方法 - Google Patents
インダクタ素子及びその製造方法 Download PDFInfo
- Publication number
- JP6120764B2 JP6120764B2 JP2013262916A JP2013262916A JP6120764B2 JP 6120764 B2 JP6120764 B2 JP 6120764B2 JP 2013262916 A JP2013262916 A JP 2013262916A JP 2013262916 A JP2013262916 A JP 2013262916A JP 6120764 B2 JP6120764 B2 JP 6120764B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- opening
- inductor element
- internal electrode
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title description 13
- 238000007747 plating Methods 0.000 claims description 116
- 238000000034 method Methods 0.000 description 38
- 230000008569 process Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 239000000654 additive Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
110 内部電極
111 第1めっき層
112 第2めっき層
120、121 絶縁層
Claims (5)
- コイル状の第1めっき層及び第2めっき層を備える内部電極が内設されたインダクタ素子であって、
支持部材上に形成された第1めっき層と、
前記第1めっき層を覆うとともに、前記第1めっき層の上面を露出させる開口部が形成された絶縁層と、
前記開口部に充填され、一部が前記開口部の外部に突出して形成された第2めっき層と、含み、
前記第1めっき層の厚さは第2めっき層の厚さより厚く、
前記第2めっき層の突出幅は前記開口部に充填された前記第2めっき層の幅より大きく、前記第1めっき層の幅より小さい、インダクタ素子。 - 前記第2めっき層の幅は第1めっき層の幅より小さい、請求項1に記載のインダクタ素子。
- 前記開口部の外部に突出形成された前記第2めっき層の突出部位は半球形状を有する、請求項1または2に記載のインダクタ素子。
- 前記第2めっき層を覆う絶縁層をさらに含む、請求項1から3のいずれか1項に記載のインダクタ素子。
- 前記内部電極は、
前記第2めっき層の上に形成され、前記第2めっき層を覆う絶縁層の開口部に充填された第3めっき層と、をさらに含む、請求項4に記載のインダクタ素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130096645A KR101483876B1 (ko) | 2013-08-14 | 2013-08-14 | 인덕터 소자 및 이의 제조방법 |
KR10-2013-0096645 | 2013-08-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015037179A JP2015037179A (ja) | 2015-02-23 |
JP6120764B2 true JP6120764B2 (ja) | 2017-04-26 |
Family
ID=52466441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013262916A Active JP6120764B2 (ja) | 2013-08-14 | 2013-12-19 | インダクタ素子及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150048920A1 (ja) |
JP (1) | JP6120764B2 (ja) |
KR (1) | KR101483876B1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6447368B2 (ja) * | 2015-05-29 | 2019-01-09 | Tdk株式会社 | コイル部品 |
KR20170112522A (ko) * | 2016-03-31 | 2017-10-12 | 주식회사 모다이노칩 | 코일 패턴 및 그 형성 방법, 이를 구비하는 칩 소자 |
JP6767274B2 (ja) | 2017-02-01 | 2020-10-14 | 新光電気工業株式会社 | インダクタ装置及びその製造方法 |
KR102016494B1 (ko) | 2017-10-23 | 2019-09-02 | 삼성전기주식회사 | 코일 부품 |
KR102511870B1 (ko) * | 2017-12-15 | 2023-03-20 | 삼성전기주식회사 | 인덕터 |
KR102069632B1 (ko) * | 2018-02-22 | 2020-01-23 | 삼성전기주식회사 | 인덕터 |
KR102029586B1 (ko) * | 2018-05-28 | 2019-10-07 | 삼성전기주식회사 | 코일 전자부품 |
KR20200069803A (ko) * | 2018-12-07 | 2020-06-17 | 삼성전기주식회사 | 코일 전자 부품 |
KR20240101082A (ko) | 2022-12-23 | 2024-07-02 | 삼성전기주식회사 | 코일 부품 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10241983A (ja) * | 1997-02-26 | 1998-09-11 | Toshiba Corp | 平面インダクタ素子とその製造方法 |
US6245670B1 (en) * | 1999-02-19 | 2001-06-12 | Advanced Micro Devices, Inc. | Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failure |
KR100324209B1 (ko) * | 2000-01-28 | 2002-02-16 | 오길록 | 은을 이용한 인덕터 제조 방법 |
JP2002324962A (ja) | 2001-02-21 | 2002-11-08 | Toppan Printing Co Ltd | インダクタ内蔵のプリント配線板及びその製造方法 |
KR100440810B1 (ko) * | 2001-09-04 | 2004-07-21 | 한국전기연구원 | 저손실 박막 인덕터의 제조방법 |
US7394043B2 (en) * | 2002-04-24 | 2008-07-01 | Sumitomo Electric Industries, Ltd. | Ceramic susceptor |
JP2003318053A (ja) | 2002-04-25 | 2003-11-07 | Jfe Steel Kk | 平面磁気素子の製造方法 |
JP3874268B2 (ja) * | 2002-07-24 | 2007-01-31 | Tdk株式会社 | パターン化薄膜およびその形成方法 |
JP4191506B2 (ja) * | 2003-02-21 | 2008-12-03 | Tdk株式会社 | 高密度インダクタおよびその製造方法 |
US6903644B2 (en) * | 2003-07-28 | 2005-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Inductor device having improved quality factor |
KR100547360B1 (ko) * | 2003-09-16 | 2006-01-26 | 삼성전기주식회사 | 권선 코일이 일체화된 보빈, 이를 채용한 광픽업액추에이터 및 그 제조 방법 |
KR100689665B1 (ko) * | 2003-11-06 | 2007-03-08 | 삼성전자주식회사 | 시스템 온 칩용 인덕터의 제조 방법 |
JP2005191408A (ja) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | コイル導電体とその製造方法およびこれを用いた電子部品 |
KR100688744B1 (ko) * | 2004-11-15 | 2007-02-28 | 삼성전기주식회사 | 고밀도 인쇄회로기판 및 이의 제조방법 |
JP2006253372A (ja) | 2005-03-10 | 2006-09-21 | Matsushita Electric Ind Co Ltd | 多層プリント配線基板とその製造方法 |
JP4518013B2 (ja) * | 2005-12-14 | 2010-08-04 | Tdk株式会社 | 電子部品 |
JP4806265B2 (ja) * | 2006-01-27 | 2011-11-02 | 株式会社沖データ | 交換ユニット及び画像形成装置 |
JP2008010783A (ja) * | 2006-06-30 | 2008-01-17 | Tdk Corp | 薄膜デバイス |
-
2013
- 2013-08-14 KR KR20130096645A patent/KR101483876B1/ko active IP Right Grant
- 2013-12-19 JP JP2013262916A patent/JP6120764B2/ja active Active
-
2014
- 2014-08-14 US US14/459,963 patent/US20150048920A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2015037179A (ja) | 2015-02-23 |
KR101483876B1 (ko) | 2015-01-16 |
US20150048920A1 (en) | 2015-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6120764B2 (ja) | インダクタ素子及びその製造方法 | |
US11605484B2 (en) | Multilayer seed pattern inductor and manufacturing method thereof | |
JP6102420B2 (ja) | コイル部品 | |
KR101503144B1 (ko) | 박막 인덕터 소자 및 이의 제조방법 | |
US9490062B2 (en) | Chip electronic component | |
KR101751117B1 (ko) | 코일 전자 부품 및 그 제조방법 | |
US8564393B2 (en) | Coil component and method of manufacturing the same | |
JP5874199B2 (ja) | コイル部品及びその製造方法 | |
WO2012053439A1 (ja) | コイル部品及びその製造方法 | |
KR101565700B1 (ko) | 칩 전자부품, 이의 제조방법 및 그 실장기판 | |
US10541083B2 (en) | Coil unit for power inductor | |
KR102004238B1 (ko) | 칩 전자부품 및 그 제조방법 | |
JP5932916B2 (ja) | インダクター及びその製造方法 | |
JP2013251541A (ja) | チップインダクタ | |
JP2005210010A (ja) | コイル基板及びその製造方法並びに表面実装型コイル素子 | |
JP2009117546A (ja) | 平面コイル及びその製造方法 | |
KR20170133140A (ko) | 코일 전자 부품 및 그 제조방법 | |
JP2013135232A (ja) | インダクタの製造方法 | |
KR102442383B1 (ko) | 코일 부품 및 그 제조방법 | |
KR20170079093A (ko) | 코일 전자 부품 및 그 제조방법 | |
JP5126338B2 (ja) | トランス部品 | |
JP2017147321A (ja) | コイル部品、コイル部品を内蔵した回路基板、並びに、コイル部品を備える電源回路 | |
JP2005026384A (ja) | インダクタ素子、それを含む電子部品及び製造方法 | |
KR101823297B1 (ko) | 코일 전자 부품 및 그 제조방법 | |
JP2003133136A (ja) | 磁性部品およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150317 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150617 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20151215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160303 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20160314 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20160506 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170328 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6120764 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |