JP6110159B2 - Composite member and manufacturing method thereof - Google Patents
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- JP6110159B2 JP6110159B2 JP2013033473A JP2013033473A JP6110159B2 JP 6110159 B2 JP6110159 B2 JP 6110159B2 JP 2013033473 A JP2013033473 A JP 2013033473A JP 2013033473 A JP2013033473 A JP 2013033473A JP 6110159 B2 JP6110159 B2 JP 6110159B2
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- 239000002131 composite material Substances 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000853 adhesive Substances 0.000 claims description 109
- 230000001070 adhesive effect Effects 0.000 claims description 102
- 239000000919 ceramic Substances 0.000 claims description 66
- 239000012790 adhesive layer Substances 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 47
- 229920001187 thermosetting polymer Polymers 0.000 claims description 44
- 239000010410 layer Substances 0.000 claims description 36
- 238000005304 joining Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 20
- 238000001179 sorption measurement Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 239000002156 adsorbate Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- 239000000112 cooling gas Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920002050 silicone resin Polymers 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 2
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
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- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229940035339 tri-chlor Drugs 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
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- Jigs For Machine Tools (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本発明は、異なる材料の部材からなる複合部材及びその製造方法に関し、例えば、半導体ウェハの固定、半導体ウェハの平面度の矯正などに用いられる静電チャック等に適用可能な複合部材及びその製造方法に関するものである。 The present invention relates to a composite member composed of members of different materials and a method for manufacturing the same, and for example, a composite member applicable to an electrostatic chuck used for fixing a semiconductor wafer, correcting the flatness of a semiconductor wafer, and the like, and a method for manufacturing the same. It is about.
従来より、半導体製造装置では、半導体ウェハ（例えばシリコンウェハ）に対して、ドライエッチング（例えばプラズマエッチング）等の処理が行われている。このドライエッチングの精度を高めるためには、半導体ウェハを確実に固定しておく必要があるので、半導体ウェハを固定する固定手段として、静電引力によって半導体ウェハを固定する静電チャックが提案されている（例えば特許文献１参照）。 Conventionally, in a semiconductor manufacturing apparatus, a process such as dry etching (for example, plasma etching) is performed on a semiconductor wafer (for example, a silicon wafer). In order to increase the accuracy of this dry etching, it is necessary to securely fix the semiconductor wafer. Therefore, an electrostatic chuck for fixing the semiconductor wafer by electrostatic attraction has been proposed as a fixing means for fixing the semiconductor wafer. (For example, refer to Patent Document 1).
具体的には、特許文献１に記載の静電チャックでは、セラミック絶縁板の内部に吸着電極を有しており、その吸着電極に電圧を印加させた際に生じる静電引力を用いて、半導体ウェハをセラミック絶縁板の上面（吸着面）に吸着させるようになっている。 Specifically, the electrostatic chuck described in Patent Document 1 has a suction electrode inside a ceramic insulating plate, and a semiconductor using an electrostatic attraction generated when a voltage is applied to the suction electrode. The wafer is adsorbed on the upper surface (adsorption surface) of the ceramic insulating plate.
また、この種の静電チャックとしては、セラミック絶縁板の下面（接合面）に、例えば樹脂材料や金属材料からなる接着剤層（ボンディング層）を介して、クーリングプレートとして機能する金属ベースが接合されたものが知られている。 In this type of electrostatic chuck, a metal base that functions as a cooling plate is bonded to the lower surface (bonding surface) of a ceramic insulating plate via an adhesive layer (bonding layer) made of, for example, a resin material or a metal material. Is known.
上述した接着剤層の材料としては、例えばシリコーン樹脂等からなる熱硬化型接着剤が使用されている。この熱硬化型接着剤を使用してセラミック絶縁板と金属ベースとを接合する場合には、例えば図１０（ａ）に例示するように、金属ベースＰ１の上面（接合面）に、粘性を有する熱硬化型接着剤Ｐ２を塗布し、その上に（端子Ｐ３を穴部Ｐ４に嵌めるようにして）セラミック絶縁板Ｐ５を被せ、圧力を加えながら加熱して熱硬化型接着剤Ｐ２を硬化させて、セラミック絶縁板Ｐ５と金属ベースＰ１とを接合していた。 As the material for the adhesive layer described above, for example, a thermosetting adhesive made of a silicone resin or the like is used. When the ceramic insulating plate and the metal base are bonded using the thermosetting adhesive, the upper surface (bonding surface) of the metal base P1 has viscosity as illustrated in FIG. 10A, for example. A thermosetting adhesive P2 is applied, and a ceramic insulating plate P5 is placed thereon (so that the terminal P3 fits into the hole P4) and heated while applying pressure to cure the thermosetting adhesive P2. The ceramic insulating plate P5 and the metal base P1 were joined.
しかしながら、上述した接合に用いられる熱硬化型接着剤Ｐ２は、通常では、加熱によって粘度が下がって流動性が上がり、その後、更に加熱することによって硬化するという特性があるので、図１０（ｂ）に示すように、圧力をかけて加熱する作業の途中で、粘度が下がった熱硬化型接着剤Ｐ２が、金属ベースＰ１の外周部や穴部Ｐ４に流れ出し、その結果、熱硬化型接着剤Ｐ２が充填されない未充填部Ｐ６が発生するという問題があった。 However, since the thermosetting adhesive P2 used for the above-mentioned bonding usually has a characteristic that the viscosity is lowered by heating and the fluidity is increased, and thereafter, it is cured by further heating. As shown in FIG. 4, during the operation of heating by applying pressure, the thermosetting adhesive P2 having a reduced viscosity flows out to the outer peripheral portion or the hole P4 of the metal base P1, and as a result, the thermosetting adhesive P2 There is a problem that an unfilled portion P6 that is not filled is generated.
そして、このような未充填部Ｐ６が発生すると、熱伝導性にムラが生じ、静電チャックの吸着面における均熱性が低下するので、吸着面に保持された半導体ウェハの加工に支障が生じる恐れがある。その結果、例えばエッチング加工を行う場合に、加工速度にムラが生じる恐れがある。 When such an unfilled portion P6 occurs, the thermal conductivity becomes uneven, and the thermal uniformity on the suction surface of the electrostatic chuck is lowered, which may cause trouble in the processing of the semiconductor wafer held on the suction surface. There is. As a result, for example, when etching is performed, the processing speed may be uneven.
この対策として、図示しないが、例えば穴部の周囲にスペーサ部（ダム）を配置する方法（特許文献２参照）も考えられるが、静電チャックには、端子が通されたり冷却用ガスの流路となる複数の穴部が設けられているので、ダムの形成を簡単な作業で且つ精度良く行うことは容易ではない。 As a countermeasure, although not shown, for example, a method of arranging a spacer portion (dam) around the hole portion (see Patent Document 2) is also conceivable, but a terminal is passed through the electrostatic chuck or the flow of cooling gas. Since a plurality of holes serving as paths are provided, it is not easy to form a dam with a simple operation and with high accuracy.
本発明は、前記課題に鑑みてなされたものであり、その目的は、例えばセラミック絶縁板と金属ベースとを接合した静電チャックのように、第１の部材と第２の部材との間を接着剤で接合する複合部材において、接着剤が流出しないようなダムを容易に形成することができる複合部材及びその製造方法を提供することにある。 The present invention has been made in view of the above problems, and its purpose is to provide a gap between the first member and the second member, such as an electrostatic chuck in which a ceramic insulating plate and a metal base are joined. An object of the present invention is to provide a composite member capable of easily forming a dam that does not allow the adhesive to flow out of the composite member joined with an adhesive, and a method for manufacturing the composite member.
（１）本発明（複合部材）は、第１態様として、 第１の部材と、該第１の部材とは異なる材料からなる第２の部材とが、互いの接合面の間に配置された接着剤からなる接着剤層によって接合されている複合部材において、前記第１の部材と前記第２の部材との接合面の間に、前記接着剤層の外周に沿って、該接着剤層を囲むように形成されたダムを備えるとともに、前記ダムは、該ダムとなる材料が硬化したものであって、前記第１の部材又は前記第２の部材の接合面上に形成されており、さらに、前記ダムの材料及び前記接着剤層の材料は、同種の接着剤であることを特徴とする複合部材。 (1) In the present invention (composite member), as a first aspect, the first member and the second member made of a material different from the first member are disposed between the joint surfaces. In the composite member joined by the adhesive layer made of an adhesive, the adhesive layer is disposed along the outer periphery of the adhesive layer between the joining surfaces of the first member and the second member. A dam formed so as to surround, and the dam is formed by curing a material to be the dam, and is formed on a joint surface of the first member or the second member ; The material for the dam and the material for the adhesive layer are the same type of adhesive .
本第１態様では、接着剤層の周囲（接着剤層が広がる平面方向における周囲）にダムが形成されており（即ちダムの内側に接着剤層が形成されており）、このダムは、ダムとなる材料が硬化したものであって、第１の部材や第２の部材の接合面上に形成されている。 In the first embodiment, the periphery of the adhesive layer (which is the adhesive layer is formed that is inside the dam) and the dam is formed (around the direction of a plane adhesive layer spreads), the dam, the dam be one that become the material has cured, it is made form on the bonding surface of the first member and the second member.
従って、第１の部材や第２の部材に微小で複数の穴部が形成されている場合のように、ダムの平面形状（ダムパターン）が複雑な場合や微小な場合でも、容易に且つ精度良くダムを形成することができる。 Therefore, it is easy and accurate even when the planar shape (dam pattern) of the dam is complicated or minute, as in the case where a plurality of minute holes are formed in the first member or the second member. A dam can be formed well.
また、この様にダムが形成されているので、（接合時に）接着剤が各部材の周囲や穴部に流出しないようにできる。よって、接着剤の未充填部が生じ難いので、平面方向における熱伝導性のムラが少ない（即ち均熱性が高い）という利点がある。 Further, since the dam is formed in this way, it is possible to prevent the adhesive from flowing out to the periphery or hole of each member (at the time of joining). Therefore, since an unfilled portion of the adhesive is hardly generated, there is an advantage that unevenness of thermal conductivity in the plane direction is small (that is, heat uniformity is high).
また、本第１態様では、ダムと接着剤層の材料として同種の材料を用いるので、ダムの部分と接着剤層の部分の特性（例えば熱的、機械的特性）を揃えることができる。従って、複合部材の平面方向（接合面が広がる方向）における特性を揃えることができる。例えば平面方向における均熱性を高めることができる。
なお、ここで同種とは、同一の組成（同種の樹脂構造）であることを示している。
（２）本発明は、第２態様として、第１の部材と、該第１の部材とは異なる材料からなる第２の部材とが、互いの接合面の間に配置された接着剤からなる接着剤層によって接合されている複合部材において、前記第１の部材と前記第２の部材との接合面の間に、前記接着剤層の外周に沿って、該接着剤層を囲むように形成されたダムを備えるとともに、前記ダムは、該ダムとなる材料が硬化したものであって、前記第１の部材又は前記第２の部材の接合面上に形成されており、さらに、前記ダムの熱伝導率と前記接着剤層の熱伝導率とが異なることを特徴とする。
本第２態様では、接着剤層の周囲（接着剤層が広がる平面方向における周囲）にダムが形成されており（即ちダムの内側に接着剤層が形成されており）、このダムは、ダムとなる材料が硬化したものであって、第１の部材や第２の部材の接合面上に形成されている。
従って、第１の部材や第２の部材に微小で複数の穴部が形成されている場合のように、ダムの平面形状（ダムパターン）が複雑な場合や微小な場合でも、容易に且つ精度良くダムを形成することができる。
また、この様にダムが形成されているので、（接合時に）接着剤が各部材の周囲や穴部に流出しないようにできる。よって、接着剤の未充填部が生じ難いので、平面方向における熱伝導性のムラが少ない（即ち均熱性が高い）という利点がある。
また、本第２態様では、ダムと接着剤層との熱伝導率が異なるので、ダムの部分と接着剤層の部分とにおける熱的特性を任意に変更することができる。第１の部材や第２の部材に微小で複数の穴部が形成されている場合には、穴部近傍が熱的に特異領域になるときがあるが、これによって、熱的な特異領域を調整することができるという利点がある。
（３）本発明は、第３態様として、前記ダムと、該ダムに対向する接合面との間に、前記接着剤からなるオーバーフロー層を備えたことを特徴とする。
本第３態様では、オーバーフロー層を備えているので、ダムの高さに多少ばらつきがあった場合でも、第１の部材と第２の部材との密着性（従って接着性）が高いという利点がある。
In the first aspect, since the same kind of material is used as the material of the dam and the adhesive layer, the characteristics (for example, thermal and mechanical characteristics) of the dam portion and the adhesive layer portion can be made uniform. Therefore, the characteristics of the composite member in the planar direction (direction in which the joint surface spreads) can be made uniform. For example, the heat uniformity in the planar direction can be improved.
Here, the same kind indicates that they have the same composition (same kind of resin structure).
(2) In the present invention, as a second aspect, the first member and the second member made of a material different from the first member are made of an adhesive disposed between the joint surfaces. In the composite member joined by the adhesive layer, it is formed between the joint surfaces of the first member and the second member so as to surround the adhesive layer along the outer periphery of the adhesive layer. The dam is formed by hardening the material to be the dam, and is formed on the joint surface of the first member or the second member. The thermal conductivity is different from the thermal conductivity of the adhesive layer.
In the second aspect, a dam is formed around the adhesive layer (periphery in the planar direction in which the adhesive layer spreads) (that is, the adhesive layer is formed inside the dam). The material to be cured is formed on the joint surface of the first member or the second member.
Therefore, it is easy and accurate even when the planar shape (dam pattern) of the dam is complicated or minute, as in the case where a plurality of minute holes are formed in the first member or the second member. A dam can be formed well.
Further, since the dam is formed in this way, it is possible to prevent the adhesive from flowing out to the periphery or hole of each member (at the time of joining). Therefore, since an unfilled portion of the adhesive is hardly generated, there is an advantage that unevenness of thermal conductivity in the plane direction is small (that is, heat uniformity is high).
Moreover, in this 2nd aspect, since the thermal conductivity of a dam and an adhesive bond layer differs, the thermal characteristic in the part of a dam and the part of an adhesive bond layer can be changed arbitrarily. When a plurality of minute holes are formed in the first member or the second member, the vicinity of the hole may become a thermal singular region. There is an advantage that it can be adjusted.
( 3 ) The present invention is characterized in that, as a third aspect, an overflow layer made of the adhesive is provided between the dam and a joint surface facing the dam.
In the third aspect, since the overflow layer is provided, even if there is some variation in the height of the dam, there is an advantage that the adhesiveness (and hence the adhesiveness) between the first member and the second member is high. is there.
なお、このオーバーフロー層は、接合時に、ダムの内側の接着剤がダムを乗り越えるように移動し、その後硬化することにより形成することができる。
（４）本発明は、第４態様として、前記ダムは、押圧によって変形可能な弾性を有することを特徴とする。
The overflow layer can be formed by moving the adhesive inside the dam so as to get over the dam and then curing.
( 4 ) The present invention is characterized in that, as a fourth aspect, the dam has elasticity that can be deformed by pressing.
本第４態様では、ダムは、押圧によって変形可能な弾性（例えばヤング率が１０ＭＰａ以下）を有するので、接合時に、第１の部材と第２の部材とが押圧されると、その押圧力によってダムも柔軟に変形して、ダムの先端側が相手部材に密着する。よって、第１の部材と第２の部材との接着性が高いという利点がある。 In the fourth aspect, since the dam has elasticity that can be deformed by pressing (for example, Young's modulus is 10 MPa or less), when the first member and the second member are pressed at the time of joining, The dam is also deformed flexibly and the tip side of the dam is in close contact with the mating member. Therefore, there exists an advantage that the adhesiveness of a 1st member and a 2nd member is high.
（５）本発明は、第５態様として、前記ダムの材料及び前記接着剤層の材料は、熱硬化型接着剤であることを特徴とする。
本第５態様は、ダムや接着剤層の好ましい材料を例示している。つまり、熱硬化型接着剤を用いることにより、ダムの形成を容易にできるとともに、第１の部材と第２の部材との接合を容易に行うことができる。
( 5 ) As a fifth aspect, the present invention is characterized in that the material of the dam and the material of the adhesive layer are thermosetting adhesives.
The fifth aspect illustrates preferred materials for dams and adhesive layers. That is, by using the thermosetting adhesive, the dam can be easily formed and the first member and the second member can be easily joined.
（６）本発明は、第６態様として、前記ダムが形成される接合面には開口部が形成されており、該開口部の周囲を囲むように第１のダムが形成されるとともに、前記接合面の外縁部には該接合面を囲むように第２のダムが形成されていることを特徴とする。 ( 6 ) As a sixth aspect of the present invention, an opening is formed in the joint surface where the dam is formed, and the first dam is formed so as to surround the periphery of the opening. A second dam is formed at the outer edge of the joint surface so as to surround the joint surface.
本第６態様では、第１の部材や第２の部材の接合面に開口部がある場合のダムの形成状態を例示したものである。ここでは、開口部の周囲に第１のダムを形成するとともに接合面を囲むように第２のダムを形成することにより、両ダムによって平面方向において閉ざされた領域ができる。よって、接合時には、この第１のダムと第２のダムで囲まれた領域に接着剤を塗布することにより、開口部（穴部）や外周部に接着剤が流出することを防止できる。 In the sixth aspect, the dam formation state in the case where there is an opening on the joint surface of the first member or the second member is illustrated. Here, by forming the first dam around the opening and forming the second dam so as to surround the joint surface, a region closed in the plane direction by both dams is formed. Therefore, at the time of joining, it can prevent that an adhesive agent flows out into an opening part (hole part) and an outer peripheral part by apply | coating an adhesive agent to the area | region enclosed by this 1st dam and 2nd dam.
（７）本発明は、第７態様として、前記第１の部材は、板状のセラミック部材であり、前記第２の部材は、板状の金属部材であることを特徴とする。
本第７態様は、第１の部材や第２の部材として、好ましい態様を例示している。なお、この場合には、複合部材も板状の部材（板材）となる。
( 7 ) As a seventh aspect of the present invention, the first member is a plate-shaped ceramic member, and the second member is a plate-shaped metal member.
The seventh aspect illustrates a preferable aspect as the first member or the second member. In this case, the composite member is also a plate-like member (plate material).
（８）本発明は、第８態様として、前記複合部材は、前記第１の部材が電気絶縁材性料からなるとともに、該第１の部材に吸着電極を有し、前記吸着電極に電圧を印加させた際に生じる静電引力を用いて被吸着物を吸着させる静電チャックであることを特徴とする。 ( 8 ) In the eighth aspect of the present invention, as the eighth aspect, in the composite member, the first member is made of an electrically insulating material, the first member has an adsorption electrode, and a voltage is applied to the adsorption electrode. It is an electrostatic chuck that attracts an object to be attracted using an electrostatic attractive force generated when it is applied.
本第８態様では、複合部材の好ましい態様を例示している。
（９）本発明（複合部材の製造方法）は、第９態様として、第１の部材と、該第１の部材とは異なる材料からなる第２の部材とを、互いの接合面の間に配置した接着剤によって接合する複合部材の製造方法において、前記接合の際に流動性を有する前記接着剤の流出を阻止するダムを形成するために、前記第１の部材又は前記第２の部材の接合面上にて、前記接着剤を塗布する領域を囲むように、ダム形成用材料を塗布して塗布部を形成する第１工程と、前記ダム形成用材料からなる前記塗布部を硬化させて、前記ダムを形成する第２工程と、前記ダムに囲まれた領域に、前記流動性を有する接着剤を塗布する第３工程と、前記接着剤を挟むように前記第１の部材と前記第２の部材とを配置して、前記接着剤を硬化させることにより、前記第１の部材と前記第２の部材とを接合する第４工程と、を有し、さらに、前記ダム形成用材料の粘度は、前記流動性を有する接着剤の粘度より大であることを特徴とする。
In the eighth aspect, a preferable aspect of the composite member is illustrated.
( 9 ) The present invention (manufacturing method of the composite member) includes, as a ninth aspect, a first member and a second member made of a material different from the first member between the joint surfaces. In the manufacturing method of the composite member to be joined by the arranged adhesive, the first member or the second member may be formed in order to form a dam that prevents outflow of the adhesive having fluidity during the joining. A first step of applying a dam forming material to form an application portion so as to surround a region where the adhesive is applied on the joint surface, and curing the application portion made of the dam forming material. A second step of forming the dam, a third step of applying the fluid adhesive to a region surrounded by the dam, and the first member and the first so as to sandwich the adhesive. 2 and arranging the member to cure the adhesive, Possess a fourth step of joining the first member and said second member, and further, the viscosity of the dam-forming material, and wherein a larger than the viscosity of the adhesive having fluidity To do.
本第９態様では、第１の部材又は第２の部材の接合面上にて、接着剤を塗布する領域
を囲むように、ダム形成用材料を塗布して塗布部を形成した後に、塗布部を硬化させて、ダムを形成し、その後、ダムに囲まれた領域に、流動性を有する接着剤を塗布した後に、接着剤を挟むように第１の部材と第２の部材とを配置し、接着剤を硬化させることにより、第１の部材と第２の部材とを接合する。
In the ninth aspect, the application portion is formed after applying the dam forming material so as to surround the region where the adhesive is applied on the bonding surface of the first member or the second member. The first member and the second member are arranged so that the adhesive is sandwiched between the regions surrounded by the dam and then applying a fluid adhesive to the region surrounded by the dam. The first member and the second member are joined by curing the adhesive.
これにより、第１の部材や第２の部材の（ダムを形成した箇所の）外側に接着剤を流出させることなく、しかも、接着剤の未充填部を生じさせることなく、第１の部材と第２の部材とを確実に接合することができる。また、例えばスクリーン印刷等によって、ダムを精度良く形成することができるという利点がある。 Accordingly, the first member and the second member can be formed without causing the adhesive to flow to the outside of the first member or the second member (where the dam is formed), and without causing an unfilled portion of the adhesive. The second member can be reliably bonded. Further, there is an advantage that the dam can be formed with high accuracy by, for example, screen printing.
なお、ここで、流動性とは、外力が加わらない状態で流動性を有する場合だけでなく、外力によって流動する特性（例えばペースト状など）も含むものである。
また、本第９態様では、ダム形成用材料の粘度は、（ダムに囲まれた領域に塗布される）流動性を有する接着剤の粘度より大であるので、ダム形成用材料の塗布部の形状を保ち易く、よって、精度良くダムを形成することができる。
（１０）本発明は、第１０態様として、前記ダムの高さよりも前記塗布する接着剤の高さを高くし、その後、前記第１の部材と前記第２の部材とを圧着することにより、前記接着剤を前記ダムの先端側に溢れさせてオーバーフロー層を形成することを特徴とする。
Here, the fluidity includes not only the case where the fluidity is provided in the state where no external force is applied, but also the property of fluidization due to the external force (such as a paste).
Further, in the ninth aspect, the viscosity of the dam forming material is larger than the viscosity of the fluid adhesive (applied to the region surrounded by the dam). The shape can be easily maintained, and therefore the dam can be formed with high accuracy.
( 10 ) The present invention, as a tenth aspect, by increasing the height of the adhesive to be applied than the height of the dam, and then crimping the first member and the second member, The adhesive is overflowed to the tip side of the dam to form an overflow layer.
本第１０態様は、上述したオーバーフロー層の好適な形成方法を例示している。これによって、ダムの先端と相手部材との隙間を無くして、接合性を高めることができる。
（１１）本発明は、第１１態様として、前記ダムを形成する接合面に開口部を有する場合には、前記開口部の周囲を囲むように、第１のダムを形成するとともに、前記接合面の外縁部に沿って該接合面を囲むように第２のダムを形成し、その後、前記第１のダムと前記第２のダムとの間に、前記流動性を有する接着剤を塗布することを特徴とする。
The tenth aspect illustrates a preferred method for forming the overflow layer described above. As a result, the gap between the tip of the dam and the mating member can be eliminated and the bondability can be improved.
( 11 ) In the present invention, as an eleventh aspect, in the case where the joint surface forming the dam has an opening, the first dam is formed so as to surround the opening, and the joint surface is formed. Forming a second dam so as to surround the joint surface along the outer edge of the first dam, and then applying the fluid adhesive between the first dam and the second dam. It is characterized by.
本第１１態様は、第１の部材や第２の部材の接合面に開口部が形成されている場合に、ダムや接着剤層の好適な形成方法を例示している。これによって、接合面に開口部がある場合でも、開口部内に接着剤を流出させることなく、好適に接着を行うことができる。 The eleventh aspect exemplifies a preferable method for forming a dam or an adhesive layer when an opening is formed on the joint surface of the first member or the second member. As a result, even when there is an opening on the joint surface, the bonding can be suitably performed without causing the adhesive to flow into the opening.
以下に、本発明を実施するための形態について説明する。
［実施形態］
・複合部材の第１の部材としては、セラミック材料からなるセラミック絶縁板を採用でき、このセラミック材料としては、アルミナ、イットリア（酸化イットリウム）、窒化アルミニウム、窒化ホウ素、炭化珪素、窒化珪素などといった高温焼成セラミックを主成分とする焼結体などが挙げられる。
Below, the form for implementing this invention is demonstrated.
[Embodiment]
A ceramic insulating plate made of a ceramic material can be adopted as the first member of the composite member, and the ceramic material can be a high temperature such as alumina, yttria (yttrium oxide), aluminum nitride, boron nitride, silicon carbide, silicon nitride, etc. Examples thereof include a sintered body mainly composed of a fired ceramic.
また、用途に応じて、ホウケイ酸系ガラスやホウケイ酸鉛系ガラスにアルミナ等の無機セラミックフィラーを添加したガラスセラミックのような低温焼成セラミックを主成分とする焼結体を選択してもよいし、チタン酸バリウム、チタン酸鉛、チタン酸ストロンチウムなどの誘電体セラミックを主成分とする焼結体を選択してもよい。 Depending on the application, a sintered body mainly composed of a low-temperature fired ceramic such as a glass ceramic obtained by adding an inorganic ceramic filler such as alumina to a borosilicate glass or a lead borosilicate glass may be selected. Alternatively, a sintered body mainly composed of a dielectric ceramic such as barium titanate, lead titanate, or strontium titanate may be selected.
更に、セラミック以外に、例えばＰＥＥＫやポリイミドなどの耐熱性樹脂や熱分散材などに用いるカーボンや金属を採用することもできる。
なお、半導体製造におけるドライエッチングなどの各処理においては、プラズマを用いた技術が種々採用され、プラズマを用いた処理においては、ハロゲンガスなどの腐食性ガスが多用されている。このため、腐食性ガスやプラズマに晒される静電チャックには、高い耐食性が要求される。従って、前記セラミック絶縁板は、腐食性ガスやプラズマに対する耐食性がある材料、例えば、アルミナやイットリアを主成分とする材料からなることが好ましい。
Furthermore, in addition to ceramics, for example, carbon or metal used for heat-resistant resins such as PEEK and polyimide, heat dispersion materials, and the like can be used.
In each process such as dry etching in semiconductor manufacturing, various techniques using plasma are employed, and in processes using plasma, corrosive gas such as halogen gas is frequently used. For this reason, high corrosion resistance is required for the electrostatic chuck exposed to corrosive gas or plasma. Therefore, the ceramic insulating plate is preferably made of a material having corrosion resistance against corrosive gas or plasma, for example, a material mainly composed of alumina or yttria.
・複合部材の第２の部材としては、金属やその合金からなる金属板を採用でき、金属としては、銅、アルミニウム、鉄、チタンなどを用いることができる。
・ダムや接着剤層を構成する材料としては、第１の部材（例えばセラミック絶縁板）と第２の部材（例えば金属板）とを接合させる力が大きい接着剤の材料（例えば熱硬化型接着剤など）であることが好ましい。
-As a 2nd member of a composite member, the metal plate which consists of a metal or its alloy can be employ | adopted, and copper, aluminum, iron, titanium, etc. can be used as a metal.
-As a material constituting the dam or the adhesive layer, an adhesive material having a large force for joining the first member (for example, a ceramic insulating plate) and the second member (for example, a metal plate) (for example, thermosetting adhesion) And the like.
例えば、シリコーン樹脂、アクリル樹脂、エポキシ樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、ポリアミド樹脂などの樹脂材料、或いは、インジウムなどの金属材料を含む接着剤を選択することができる。なお、例えば、第１の部材と第２の部材との熱膨張係数の差が大きい場合には、ダムや接着剤層は、緩衝材としての機能の高い弾性変形可能な樹脂材料（例えばシリコーン樹脂）からなることが特に好ましい。 For example, an adhesive including a resin material such as a silicone resin, an acrylic resin, an epoxy resin, a polyimide resin, a polyamideimide resin, and a polyamide resin, or a metal material such as indium can be selected. For example, when the difference in the thermal expansion coefficient between the first member and the second member is large, the dam or the adhesive layer is an elastically deformable resin material having a high function as a cushioning material (for example, a silicone resin). It is particularly preferable to consist of
以下に、本発明を実施するための実施例について説明する。 Examples for carrying out the present invention will be described below.
ここでは、複合部材として、例えば半導体ウェハを吸着保持できる静電チャックを例に挙げる。
ａ）まず、本実施例の静電チャックの構造について説明する。
Here, for example, an electrostatic chuck capable of attracting and holding a semiconductor wafer is taken as an example of the composite member.
a) First, the structure of the electrostatic chuck of this embodiment will be described.
図１に示す様に、本実施例の静電チャック１は、図１の上側にて半導体ウェハ３を吸着する装置であり、第１主面（吸着面）５及び第２主面（接合面）７を有する（例えば直径３００ｍｍ×厚み３ｍｍの）円盤状のセラミック絶縁板９と、第１主面（接合面）１１及び第２主面（裏面）１３を有する（例えば直径３４０ｍｍ×厚み２０ｍｍの）円盤状の金属ベース（クーリングプレート）１５とを、２重構造の複合接着剤層１７を介して接合したものである。 As shown in FIG. 1, the electrostatic chuck 1 of this embodiment is a device that sucks the semiconductor wafer 3 on the upper side of FIG. 1, and includes a first main surface (suction surface) 5 and a second main surface (bonding surface). ) 7 (for example, diameter 300 mm × thickness 3 mm), disk-shaped ceramic insulating plate 9, first main surface (joint surface) 11 and second main surface (back surface) 13 (for example, diameter 340 mm × thickness 20 mm) ) A disk-shaped metal base (cooling plate) 15 is joined via a double-layer composite adhesive layer 17.
以下、各構成について説明する。
前記セラミック絶縁板９は、後述するように複数のセラミック層が積層されたものであり、アルミナを主成分とするアルミナ質焼結体である。このセラミック絶縁板９の内部には、半導体ウェハ３を冷却するヘリウム等の冷却用ガスを供給するトンネルである冷却用ガス供給路１９が設けられ、吸着面５には、冷却用ガス供給路１９が開口する複数の冷却用開口部２１や、冷却用開口部２１から供給された冷却用ガスが吸着面５全体に広がるように設けられた環状の冷却用溝２３が設けられている。
Each configuration will be described below.
As will be described later, the ceramic insulating plate 9 is formed by laminating a plurality of ceramic layers, and is an alumina sintered body mainly composed of alumina. Inside the ceramic insulating plate 9, there is provided a cooling gas supply path 19 that is a tunnel for supplying a cooling gas such as helium for cooling the semiconductor wafer 3, and the adsorption surface 5 has a cooling gas supply path 19. Are provided with a plurality of cooling openings 21 and annular cooling grooves 23 provided so that the cooling gas supplied from the cooling openings 21 spreads over the entire adsorption surface 5.
なお、冷却用ガス供給路１９は、静電チャック１を厚み方向（図２の上下方向）に貫いて、冷却用開口部２１に開口するガス用貫通孔２０を有している。
一方、前記金属ベース１５は、例えばアルミニウム又はアルミニウム合金からなり、その内部には、セラミック絶縁板９を冷却する冷却用液体（例えばフッ素化液又は純水）が充填される冷却用空間２５が設けられている。
The cooling gas supply path 19 has a gas through hole 20 that penetrates the electrostatic chuck 1 in the thickness direction (vertical direction in FIG. 2) and opens in the cooling opening 21.
On the other hand, the metal base 15 is made of, for example, aluminum or an aluminum alloy, and a cooling space 25 filled with a cooling liquid (for example, a fluorinated liquid or pure water) for cooling the ceramic insulating plate 9 is provided therein. It has been.
更に、図２に詳細に示すように、前記セラミック絶縁板９においては、複数層（例えば６層）第１〜第６セラミック層２７、２９、３１、３３、３５、３７が積層されている。なお、ここでは、６層のセラミック層２７〜３７を示しているが、各セラミック層２７〜３７が、更に複数のセラミック層から構成されていてもよい。 Furthermore, as shown in detail in FIG. 2, in the ceramic insulating plate 9, a plurality of layers (for example, six layers) first to sixth ceramic layers 27, 29, 31, 33, 35, and 37 are laminated. Here, although six ceramic layers 27 to 37 are shown, each ceramic layer 27 to 37 may be further composed of a plurality of ceramic layers.
前記セラミック絶縁板９の構成は、基本的に従来とほぼ同様であり、その内部において、吸着面５の（図２）下方には、例えば平面形状が半円状の一対の吸着電極４１、４３（図１参照）が形成されている。 The configuration of the ceramic insulating plate 9 is basically the same as that of the prior art. Inside the ceramic insulating plate 9, a pair of suction electrodes 41, 43 having a semicircular planar shape, for example, are provided below the suction surface 5 (FIG. 2). (See FIG. 1) is formed.
この吸着電極４１、４３とは、静電チャック１を使用する場合には、両吸着電極４１、４３の間に、直流高電圧を印加し、これにより、半導体ウェハ３を吸着する静電引力（吸着力）を発生させ、この吸着力を用いて半導体ウェハ３を吸着して固定するものである。 When the electrostatic chuck 1 is used, the attracting electrodes 41 and 43 apply a high DC voltage between the attracting electrodes 41 and 43, thereby attracting the semiconductor wafer 3 by an electrostatic attractive force ( (Suction force) is generated, and the semiconductor wafer 3 is suctioned and fixed by using this suction force.
また、吸着電極４１、４３の（図２）下方には、従来と同様に、例えば同一平面にて軸中心を回るように螺旋状に巻き回されたヒータ（発熱体）４５が形成されている。
そして、後に詳述する様に、セラミック絶縁板９と金属ベース１５とは、互いの接合面７、１１の間に配置された硬化型接着剤からなる２重構造の複合接着剤層１７により接合されている。
Also, a heater (heating element) 45 that is spirally wound around the axis center in the same plane, for example, is formed below the attracting electrodes 41 and 43 (FIG. 2). .
As will be described in detail later, the ceramic insulating plate 9 and the metal base 15 are joined by a double-layer composite adhesive layer 17 made of a curable adhesive disposed between the joining surfaces 7 and 11. Has been.
ｂ）次に、本実施例の静電チャック１の電気的な構成について説明する。
図３に示すように、静電チャック１の吸着電極４１、４３やヒータ４５には、それぞれを作動させるために電源回路が接続されている。
b) Next, the electrical configuration of the electrostatic chuck 1 of the present embodiment will be described.
As shown in FIG. 3, a power circuit is connected to the suction electrodes 41 and 43 and the heater 45 of the electrostatic chuck 1 in order to operate them.
具体的には、吸着電極４１、４３には第１電源回路５１が接続され、ヒータ４５には第２電源回路５３が接続されており、それらの動作は、マイコンを含む電子制御装置５５によって制御される。 Specifically, a first power supply circuit 51 is connected to the adsorption electrodes 41 and 43, and a second power supply circuit 53 is connected to the heater 45, and their operations are controlled by an electronic control unit 55 including a microcomputer. Is done.
また、図４に一部を示すように、吸着電極４１、４３やヒータ４５と、各電源回路５１、５５との接続は、接続端子（端子ピン）６１、６３、６５、６７（図５（ａ）参照）を利用して行うことができる。なお、図４では、接続端子６１〜６７の一部のみを例示している。 As shown in part in FIG. 4, the connection between the suction electrodes 41 and 43 and the heater 45 and the power supply circuits 51 and 55 is made by connecting terminals (terminal pins) 61, 63, 65 and 67 (FIG. 5 ( a))). FIG. 4 illustrates only a part of the connection terminals 61 to 67.
つまり、吸着電極４１、４３やヒータ４５は、ビア６９、７１や内部導電層７３などを介して、同図下方に開口する内部孔７５、７７のメタライズ層７９、８１に導通しており、このメタライズ層７９、８１にそれぞれ端子金具８３、８５が接合され、この端子金具８３、８５にそれぞれ接続端子６１〜６７が取り付けられている。 That is, the adsorption electrodes 41 and 43 and the heater 45 are electrically connected to the metallized layers 79 and 81 of the internal holes 75 and 77 opened downward in the figure through the vias 69 and 71 and the internal conductive layer 73. Terminal metal fittings 83 and 85 are joined to the metallized layers 79 and 81, respectively, and connection terminals 61 to 67 are attached to the terminal metal fittings 83 and 85, respectively.
従って、接続端子６１〜６７を介して、吸着電極４１、４３やヒータ４５に電力を供給することができる。
ｃ）次に、本実施例の静電チャック１の要部について説明する。
Therefore, power can be supplied to the adsorption electrodes 41 and 43 and the heater 45 via the connection terminals 61 to 67.
c) Next, the main part of the electrostatic chuck 1 of the present embodiment will be described.
図５（ａ）にセラミック絶縁板９の接合面７を示すように、セラミック絶縁板９には、その厚み方向に貫くように、冷却用ガス供給路１９（詳しくはガス用貫通孔２０の上部側を構成する上貫通孔８６）が設けられている。 As shown in FIG. 5A, the bonding surface 7 of the ceramic insulating plate 9, the cooling gas supply passage 19 (specifically, the upper portion of the gas through-hole 20 is provided in the ceramic insulating plate 9 so as to penetrate in the thickness direction thereof. An upper through-hole 86) constituting the side is provided.
ここでは６個のガス用貫通孔２０を例示しているが、通常は、このガス用貫通孔２０には、吸着された半導体ウェハ３を吸着面５から分離するために、リフトピン（図示せず）が挿通される。 Here, six gas through holes 20 are illustrated, but normally, in the gas through holes 20, lift pins (not shown) are used in order to separate the adsorbed semiconductor wafer 3 from the adsorption surface 5. ) Is inserted.
また、セラミック絶縁板９の接合面７には、上述した接続端子６１〜６７が、同図の手前に向かって立設されている。
同様に、図５（ｂ）に金属ベース１５の接合面１１側を示すように、金属ベース１５にも、その厚み方向に貫くように、冷却用ガス供給路１９（詳しくガス用貫通孔２０の下部側を構成する下貫通孔８７）が設けられている。更に、この金属ベース１５には、厚み方向に貫くように、接続端子６１〜６７が挿通される端子用貫通孔８８が、４箇所に設けられている。
Further, the connection terminals 61 to 67 described above are erected on the joining surface 7 of the ceramic insulating plate 9 toward the front of the figure.
Similarly, as shown in FIG. 5B on the side of the joint surface 11 of the metal base 15, the cooling gas supply passage 19 (specifically, the gas through-hole 20 of the gas through-hole 20 is also penetrated to the metal base 15 in the thickness direction. A lower through hole 87) constituting the lower side is provided. Further, the metal base 15 is provided with four terminal through holes 88 through which the connection terminals 61 to 67 are inserted so as to penetrate in the thickness direction.
特に本実施例では、図６に金属ベース１５の接合面１１を示すように、セラミック絶縁板９が重ね合わされる外周円８９に沿って、その内側に、全周にわたって所定幅（例えば２ｍｍ）で所定厚み（例えば２５０μｍ）の円環状の外部ダム９１が形成されている。 Particularly, in this embodiment, as shown in FIG. 6 showing the joining surface 11 of the metal base 15, along the outer circumferential circle 89 on which the ceramic insulating plate 9 is overlaid, on the inner side, with a predetermined width (for example, 2 mm). An annular external dam 91 having a predetermined thickness (for example, 250 μm) is formed.
また、下貫通孔８７の開口部８７ａを囲むように、所定幅（例えば２ｍｍ）で所定厚み（例えば２５０μｍ）の円環状の第１内部ダム９３が形成され、更に、端子用貫通孔８８の開口部８８ａを囲むように、所定幅（例えば２ｍｍ）で所定厚み（例えば２５０μｍ）の円環状の第２内部ダム９５が形成されている。 Further, an annular first internal dam 93 having a predetermined width (for example, 2 mm) and a predetermined thickness (for example, 250 μm) is formed so as to surround the opening 87 a of the lower through hole 87, and the opening of the terminal through hole 88 is further formed. An annular second internal dam 95 having a predetermined width (for example, 2 mm) and a predetermined thickness (for example, 250 μm) is formed so as to surround the portion 88a.
そして、これらの各ダム９１〜９５は、熱硬化型接着剤である例えばシリコーン接着剤（例えば信越化学製ＫＥ−１８２０）よって構成されている。
更に、外部ダム９１と第１、第２内部ダム９３、９５とで囲まれた領域Ｓ、すなわち、（接合面１１の平面方向において）外部ダム９１の内側と第１、第２内部ダム９３、９５の外側との間の閉鎖された領域Ｓには、各ダム９１〜９５と同様な熱硬化型接着剤からなる接着剤層９７が構成されている。
And each of these dams 91-95 is comprised by the silicone adhesive (for example, KE-1820 by Shin-Etsu Chemical) which is a thermosetting adhesive.
Further, a region S surrounded by the external dam 91 and the first and second internal dams 93 and 95, that is, the inside of the external dam 91 (in the plane direction of the joint surface 11) and the first and second internal dams 93, An adhesive layer 97 made of a thermosetting adhesive similar to that of each of the dams 91 to 95 is formed in the closed region S between the outer sides of the dams 95.
つまり、セラミック絶縁板９と金属ベース１５との間の複合接着剤層１７は、外部ダム９１及び第１、第２内部ダム９３、９５と接着剤層９７とから構成されている。即ち、複合接着剤層１７は、環状の各ダム９１〜９５とそれらの間の領域Ｓの接着剤層９７との２重構造となっている。 That is, the composite adhesive layer 17 between the ceramic insulating plate 9 and the metal base 15 includes the external dam 91, the first and second internal dams 93 and 95, and the adhesive layer 97. That is, the composite adhesive layer 17 has a double structure of the annular dams 91 to 95 and the adhesive layer 97 in the region S therebetween.
ｄ）次に、本実施例の静電チャック１の製造方法について説明する。
＜セラミック絶縁板９の製造方法＞
(1)図示しないが、原料としては、主成分であるＡｌ2Ｏ3：９２重量％、ＭｇＯ：１重量％、ＣａＯ：１重量％、ＳｉＯ2：６重量％の各粉末を混合して、ボールミルで、５０〜８０時間湿式粉砕した後、脱水乾燥する。
d) Next, a method for manufacturing the electrostatic chuck 1 of this embodiment will be described.
<Method for Manufacturing Ceramic Insulating Plate 9>
(1) Although not shown in the figure, as raw materials, Al 2 O 3 : 92% by weight, MgO: 1% by weight, CaO: 1% by weight, SiO 2 : 6% by weight of the main ingredients are mixed, After wet grinding with a ball mill for 50 to 80 hours, dehydration drying is performed.
(2)次に、この粉末に、メタクリル酸イソブチルエステル：３重量％、ブチルエステル：３重量％、ニトロセルロース：１重量％、ジオクチルフタレート：０．５重量％を加え、更に溶剤として、トリクロール−エチレン、ｎ−ブタノールを加え、ボールミルで混合して、流動性のあるスラリーとする。 (2) Next, methacrylic acid isobutyl ester: 3% by weight, butyl ester: 3% by weight, nitrocellulose: 1% by weight, dioctyl phthalate: 0.5% by weight were added to this powder, and trichlor was further added as a solvent. -Add ethylene and n-butanol and mix with a ball mill to form a fluid slurry.
(3)次に、このスラリーを、減圧脱泡後平板状に流し出して徐冷し、溶剤を発散させて、（第１〜第６セラミック層２７〜３７に対応する）第１〜第６アルミナグリーンシートを形成する。 (3) Next, this slurry is defoamed under reduced pressure and then poured into a flat plate and gradually cooled to emit the solvent, and the first to sixth (corresponding to the first to sixth ceramic layers 27 to 37). An alumina green sheet is formed.
そして、この第１〜第６アルミナグリーンシートに対して、冷却用ガス供給路１９など冷却ガスの流路となる空間や貫通孔、内部孔７５、７７となる空間、更にはビア６９、７１となるスルーホールを、必要箇所に開ける。 Then, with respect to the first to sixth alumina green sheets, a space serving as a cooling gas flow path such as the cooling gas supply path 19, a space serving as a through hole, an internal hole 75, 77, and vias 69, 71, Open the through hole at the required location.
(4)また、前記アルミナグリーンシート用の原料粉末中にタングステン粉末を混ぜて、前記と同様な方法によりスラリー状にして、メタライズインクとする。
(5)そして、吸着電極４１、４３、ヒータ４５、内部導電層７３を形成するために、前記メタライズインクを用いて、それぞれの電極やヒータの形成箇所に対応したアルミナグリーンシート上に、通常のスクリーン印刷法により、各パターンを印刷する。なお、ビア６９、７１を形成するために、スルーホールに対して、メタライズインクを充填する。
(4) Further, a tungsten powder is mixed into the raw material powder for the alumina green sheet, and is made into a slurry by the same method as described above to obtain a metallized ink.
(5) Then, in order to form the adsorption electrodes 41 and 43, the heater 45, and the internal conductive layer 73, using the metallized ink, on the alumina green sheet corresponding to the location where each electrode or heater is formed, Each pattern is printed by the screen printing method. In addition, in order to form the vias 69 and 71, the metalized ink is filled in the through holes.
(6)次に、前記第１〜第６アルミナグリーンシートを、冷却ガスの流路などが形成されるように位置合わせして、熱圧着し、積層シートを形成する。
(7)次に、熱圧着した積層シートを、所定の円板形状（例えば８インチサイズの円板形状）にカットする。
(6) Next, the first to sixth alumina green sheets are aligned so as to form a cooling gas flow path and the like, and thermocompression-bonded to form a laminated sheet.
(7) Next, the thermocompression-bonded laminated sheet is cut into a predetermined disc shape (for example, an 8-inch size disc shape).
(8)次に、カットしたシートを、還元雰囲気にて、１４００〜１６００℃の範囲（例えば１５９０℃）にて５時間焼成（本焼成）し、アルミナ質焼結体（セラミック絶縁板９）を作製する。 (8) Next, the cut sheet is fired (main firing) in a reducing atmosphere in the range of 1400 to 1600 ° C. (for example, 1590 ° C.) for 5 hours to obtain an alumina sintered body (ceramic insulating plate 9). Make it.
(9)次に、セラミック絶縁板９に、メタライズ層７９、８１を形成し、このメタライズ層７９、８１上に端子金具８３、８５を接合する。
(10)次に、端子金具８３、８５に接続端子６１〜６７を嵌め込んで接続し、接続端子６１〜６７付きセラミック絶縁板９を完成する。
(9) Next, metallized layers 79 and 81 are formed on the ceramic insulating plate 9, and terminal fittings 83 and 85 are joined onto the metallized layers 79 and 81.
(10) Next, the connection terminals 61 to 67 are fitted and connected to the terminal fittings 83 and 85 to complete the ceramic insulating plate 9 with the connection terminals 61 to 67.
＜セラミック絶縁板９と金属ベース１５との接合方法＞
(1)図７（ａ）に模式的に示すように、上述した各ダム（外部ダム９１、第１、第２内部ダム９３、９５）の平面形状（ダムパターン）に対応した開口部８７ａ、８８ａを有するスクリーンマスクを用い、金属ベース１５の接合面１１に、所定の粘度を有するペースト状の前記熱硬化型接着剤をスクリーン印刷する。なお、この粘度は、塗布後に自身の形状を保持することができる程度の粘度（例えば１５０Ｐａ・ｓ）である。
<Method of joining ceramic insulating plate 9 and metal base 15>
(1) As schematically shown in FIG. 7 (a), openings 87a corresponding to the planar shape (dam pattern) of each dam (external dam 91, first and second internal dams 93, 95) described above, The paste-like thermosetting adhesive having a predetermined viscosity is screen-printed on the joint surface 11 of the metal base 15 using a screen mask having 88a. In addition, this viscosity is a viscosity (for example, 150 Pa * s) of the grade which can hold | maintain an own shape after application | coating.
これにより、外部ダム９１、第１、第２内部ダム９３、９５の形成位置に、複数の環状のダムパターンの塗布部９１ａ、９３ａ、９５ａ（図８（ａ）の濃いグレー部分参照）が形成される。即ち、外部ダム９１、第１、第２内部ダム９３、９５の形成位置に、塗布部９１ａ、９３ａ、９５ａが形成される。 As a result, a plurality of annular dam pattern application portions 91a, 93a, and 95a (see dark gray portions in FIG. 8A) are formed at the positions where the external dam 91 and the first and second internal dams 93 and 95 are formed. Is done. That is, the application portions 91a, 93a, and 95a are formed at the positions where the external dam 91 and the first and second internal dams 93 and 95 are formed.
(2)次に、図７（ｂ）に示す様に、この塗布部９１ａ、９３ａ、９５ａを、１００℃程度で乾燥させて硬化させる。これにより、外部ダム９１、第１、第２内部ダム９３、９５（図８（ｂ）参照）が形成される。 (2) Next, as shown in FIG. 7B, the coating portions 91a, 93a, and 95a are dried at about 100 ° C. and cured. Thereby, the external dam 91 and the first and second internal dams 93 and 95 (see FIG. 8B) are formed.
(3)次に、図７（ｃ）に示すように、外部ダム９１、第１、第２内部ダム９３、９５で囲まれた領域Ｓ（即ち接着剤層９７の形成部位）に、その領域Ｓに対応した開口部を有するスクリーンマスクを用いて、前記各ダム９１〜９５の形成に用いた材料と同様なペースト状の熱硬化型接着剤をスクリーン印刷する。 (3) Next, as shown in FIG. 7 (c), in the region S surrounded by the external dam 91, the first and second internal dams 93, 95 (that is, the portion where the adhesive layer 97 is formed), the region Using a screen mask having an opening corresponding to S, a paste-like thermosetting adhesive similar to the material used for forming the dams 91 to 95 is screen-printed.
これにより、領域Ｓに、領域塗布部Ｓａ（図８（ｂ）の薄いグレー部分参照）が形成される。
この接着剤層形成用の熱硬化型接着剤としては、ダム形成用の熱硬化型接着剤と同じもの（硬化後に同一組成のもの）を用いることができ、また、その塗布の際の粘度も同じものを用いることができるが、本実施例では、ダムの成形性を高めるために、塗布の際の粘度としては、ダム形成用の熱硬化型接着剤の粘度の方が高いものを用いる。
As a result, a region application portion Sa (see the thin gray portion in FIG. 8B) is formed in the region S.
As the thermosetting adhesive for forming the adhesive layer, the same one as the thermosetting adhesive for forming the dam (having the same composition after curing) can be used, and the viscosity at the time of application is also set. Although the same can be used, in this example, in order to improve the moldability of the dam, the viscosity at the time of application is higher than that of the thermosetting adhesive for forming the dam.
また、本実施例では、図９（ａ）に示すように、金属ベース１５の接合面１１の領域Ｓに、熱硬化型接着剤をスクリーン印刷して領域塗布部Ｓａを形成する場合には、その厚みを、各ダム９１、９３、９５の厚みよりも大きくする（例えば５０μｍ程度厚くする）。 Further, in this embodiment, as shown in FIG. 9A, when the region application portion Sa is formed by screen printing a thermosetting adhesive on the region S of the joint surface 11 of the metal base 15, The thickness is made larger than the thickness of each dam 91, 93, 95 (for example, about 50 μm thick).
(4)次に、図７（ｄ）に示すように、金属ベース１５の接合面１１側（同図上方）から、セラミック絶縁板９を押し当てるようにする。
具体的には、セラミック絶縁板９の接合面７側（同図下方）から下方に延びる接続端子６１〜６７を、金属ベース１５の各端子用貫通孔８８に嵌めるようにして、セラミック絶縁板９を下方に移動させる。
(4) Next, as shown in FIG. 7 (d), the ceramic insulating plate 9 is pressed from the joining surface 11 side of the metal base 15 (upper side in the figure).
Specifically, the connection terminals 61 to 67 extending downward from the joint surface 7 side (lower side in the figure) of the ceramic insulating plate 9 are fitted into the terminal through holes 88 of the metal base 15, so that the ceramic insulating plate 9. Is moved downward.
(5)次に、図７（ｅ）に示すように、セラミック絶縁板９の接合面７にて、熱硬化型接着剤を上方より押圧する。
具体的には、セラミック絶縁板９に（例えば錘によって）荷重をかけて、大気雰囲気にて１００℃程度に加熱し、熱硬化型接着剤を乾燥硬化させて、接着剤層９７を形成する。
(5) Next, as shown in FIG. 7 (e), the thermosetting adhesive is pressed from above on the joint surface 7 of the ceramic insulating plate 9.
Specifically, a load (for example, with a weight) is applied to the ceramic insulating plate 9 and heated to about 100 ° C. in an air atmosphere, and the thermosetting adhesive is dried and cured to form the adhesive layer 97.
なお、熱硬化型接着剤をセラミック絶縁板９で押圧する際に、領域塗布部Ｓａの厚さが各ダム９１、９３、９５の厚さよりも大きいので、余剰の熱硬化型接着剤が僅かに各ダム９１、９３、９５の上部（先端）を乗り超えて、図９（ｂ）に示すようなオーバーフロー層１０１が形成される。 When the thermosetting adhesive is pressed by the ceramic insulating plate 9, the thickness of the region application part Sa is larger than the thickness of each dam 91, 93, 95, so that the excess thermosetting adhesive is slightly Overflowing the top (tip) of each dam 91, 93, 95, an overflow layer 101 as shown in FIG. 9B is formed.
これによって、セラミック絶縁板９と金属ベース１５とが熱硬化型接着剤によって接合されて、静電チャック１が完成する。
ｅ）次に、本実施例の効果について説明する。
Thereby, the ceramic insulating plate 9 and the metal base 15 are joined by the thermosetting adhesive, and the electrostatic chuck 1 is completed.
e) Next, the effect of the present embodiment will be described.
・本実施例の静電チャック１では、接着剤層９７を囲むように各ダム９１〜９５が形成されており、このダム９１〜９５は、金属ベース１５の接合面１１上に、ダム９１〜９５となるペースト状の熱硬化型接着剤が塗布された後に硬化することによって形成されたものである。 In the electrostatic chuck 1 of this embodiment, the dams 91 to 95 are formed so as to surround the adhesive layer 97, and the dams 91 to 95 are formed on the bonding surface 11 of the metal base 15. The paste-like thermosetting adhesive that becomes 95 is applied and then cured.
従って、セラミック絶縁板９や金属ベース１５に複数の細径の（端子用貫通孔８８等の）開口部８７ａ、８８ａが形成されている場合でも、容易に且つ精度良くダム９１〜９５を形成することができる。 Therefore, even when a plurality of small-diameter openings 87a and 88a (such as the terminal through holes 88) are formed in the ceramic insulating plate 9 and the metal base 15, the dams 91 to 95 are easily and accurately formed. be able to.
また、この様にダム９１〜９５が形成されているので、（接合時に）熱硬化型接着剤がセラミック絶縁板９の外周側や開口部８７ａ、８８ａに流出しないようにできる。よって、熱硬化型接着剤の未充填部が生じ難いので、平面方向における熱伝導性のムラが少ない（従って吸着面５における均熱性が高い）という利点がある。 Further, since the dams 91 to 95 are formed in this manner, the thermosetting adhesive can be prevented from flowing out to the outer peripheral side of the ceramic insulating plate 9 and the openings 87a and 88a (during bonding). Therefore, since the unfilled portion of the thermosetting adhesive is unlikely to occur, there is an advantage that the thermal conductivity unevenness in the plane direction is small (thus, the heat uniformity on the adsorption surface 5 is high).
・本実施例では、ダム９１〜９５の先端と対向する接合面７との間に、熱硬化型接着剤からなるオーバーフロー層１０１が形成されているので、セラミック絶縁板９と金属ベース１５との密着性（従って接着性）が高いという利点がある。 In the present embodiment, since the overflow layer 101 made of a thermosetting adhesive is formed between the tip of the dams 91 to 95 and the joint surface 7 facing the dam 91 to 95, the ceramic insulating plate 9 and the metal base 15 There is an advantage that adhesion (and hence adhesion) is high.
・本実施例では、ダム９１〜９５は、例えばシリコーン樹脂からなり、押圧によって変形可能な弾性（例えばヤング率が１．５ＭＰａ）を有しているので、接合時に、セラミック絶縁板９が押圧されると、その押圧力によってダム９１〜９５も柔軟に変形して、ダム９１〜９５の先端の相手側の接合面７と密着する。よって、セラミック絶縁板９と金属ベース１５との接着性が高いという利点がある。 In this embodiment, the dams 91 to 95 are made of, for example, a silicone resin and have elasticity that can be deformed by pressing (for example, Young's modulus is 1.5 MPa), so that the ceramic insulating plate 9 is pressed at the time of joining. Then, the dams 91 to 95 are also flexibly deformed by the pressing force, and come into close contact with the mating joint surface 7 at the tip of the dams 91 to 95. Therefore, there is an advantage that the adhesiveness between the ceramic insulating plate 9 and the metal base 15 is high.
・本実施例では、ダム９１〜９５の材料及び接着剤層９７の材料は、熱硬化型接着剤であるので、ダム９１〜９５を容易に形成できるとともに、セラミック絶縁板９と金属ベース１５との接合を容易に行うことができる。 In this embodiment, since the material of the dams 91 to 95 and the material of the adhesive layer 97 are thermosetting adhesives, the dams 91 to 95 can be easily formed, and the ceramic insulating plate 9 and the metal base 15 Can be easily joined.
しかも、ダム９１〜９５の材料及び接着剤層９７の材料は、同一の熱硬化型接着剤であるので、ダム９１〜９５と接着剤層９７の特性（例えば熱的、機械的特性）が揃っている。従って、静電チャック１の吸着面５における均熱性を高めることができる。 Moreover, since the materials of the dams 91 to 95 and the material of the adhesive layer 97 are the same thermosetting adhesive, the characteristics (for example, thermal and mechanical characteristics) of the dams 91 to 95 and the adhesive layer 97 are uniform. ing. Therefore, it is possible to improve the heat uniformity on the suction surface 5 of the electrostatic chuck 1.
・本実施例の静電チャック１の製造方法では、金属ベース１５の接合面１１上にて、領域Ｓを囲むように、熱硬化型接着剤を塗布して塗布部９１ａ、９３ａ、９５ａを形成した後に、その熱硬化型接着剤を加熱し硬化させて、ダム９１〜９５を形成し、その後、領域Ｓに同様な熱硬化型接着剤を塗布した後に、熱硬化型接着剤を挟むようにセラミック絶縁板９と金属ベース１５とを押圧して加熱し、熱硬化型接着剤を硬化させることにより、セラミック絶縁板９と金属ベース１５とを接合している。 In the manufacturing method of the electrostatic chuck 1 of the present embodiment, the thermosetting adhesive is applied so as to surround the region S on the bonding surface 11 of the metal base 15 to form the application portions 91a, 93a, and 95a. After that, the thermosetting adhesive is heated and cured to form dams 91 to 95, and after applying the same thermosetting adhesive to the region S, the thermosetting adhesive is sandwiched between the dams 91 to 95. The ceramic insulating plate 9 and the metal base 15 are joined by pressing and heating the ceramic insulating plate 9 and the metal base 15 to cure the thermosetting adhesive.
これにより、セラミック絶縁板９の周囲などに熱硬化型接着剤を流出させることなく、しかも、熱硬化型接着剤の未充填部を生じさせることなく、セラミック絶縁板９と金属ベース１５とを確実に接合することができる。また、スクリーン印刷によって、ダム９１〜９５を精度良く形成することができる。 Thus, the ceramic insulating plate 9 and the metal base 15 can be securely connected without causing the thermosetting adhesive to flow around the ceramic insulating plate 9 and without causing an unfilled portion of the thermosetting adhesive. Can be joined. Further, the dams 91 to 95 can be formed with high accuracy by screen printing.
・特に本実施例では、セラミック絶縁板９や金属ベース１５の接合面７、１１には、開口部８７ａ、８８ａが形成されているが、セラミック絶縁板９と金属ベース１５との接合の際には、開口部８７ａ、８８ａの周囲を囲むように、ダム（第１、第２内部ダム）９３、９５を形成するので、接着剤層９７を形成するための熱硬化型接着剤が開口部８７ａ、８８ａ内に流入することがない。 In particular, in this embodiment, openings 87a and 88a are formed in the joining surfaces 7 and 11 of the ceramic insulating plate 9 and the metal base 15, but when the ceramic insulating plate 9 and the metal base 15 are joined, Since the dams (first and second internal dams) 93 and 95 are formed so as to surround the openings 87a and 88a, the thermosetting adhesive for forming the adhesive layer 97 is formed by the openings 87a. , 88a.
・また、本実施例では、ダム９１〜９５の熱硬化型接着剤の塗布の際の粘度は、接着剤層９７の熱硬化型接着剤の塗布の際の粘度より大であるので、（ダム９１〜９５の）塗布部９１ａ、９３ａ、９５ａの形状を保ち易く、よって、精度良くダム９１〜９５を形成することができる。
［特許請求の範囲と実施例との関係］
セラミック絶縁板９が第１の部材に、金属ベース１５が第２の部材に、外部ダム９１が第２のダムに、第１、第２内部ダム９３、９５が第１のダムに該当する。
In this embodiment, the viscosity of the dams 91 to 95 when the thermosetting adhesive is applied is larger than the viscosity of the adhesive layer 97 when the thermosetting adhesive is applied. The shapes of the application portions 91a, 93a, and 95a (91 to 95) can be easily maintained, so that the dams 91 to 95 can be formed with high accuracy.
[Relationship between Claims and Examples]
The ceramic insulating plate 9 corresponds to the first member, the metal base 15 corresponds to the second member, the external dam 91 corresponds to the second dam, and the first and second internal dams 93 and 95 correspond to the first dam.
尚、本発明は前記実施形態や実施例になんら限定されるものではなく、本発明を逸脱しない範囲において種々の態様で実施しうることはいうまでもない。
（１）例えば、前記実施例では、金属ベース側にダムや接着剤層を設けたが、セラミック絶縁板側に接着剤を設けてよく、或いは、金属ベースとセラミック絶縁板側の両方に設けてよい。
In addition, this invention is not limited to the said embodiment and Example at all, and it cannot be overemphasized that it can implement with a various aspect in the range which does not deviate from this invention.
(1) For example, in the above embodiment, a dam or an adhesive layer is provided on the metal base side, but an adhesive may be provided on the ceramic insulating plate side, or provided on both the metal base and the ceramic insulating plate side. Good.
（２）また、前記実施例では、複合部材として静電チャックを挙げたが、本発明は、それ以外に、ＣＶＤ用ヒータ、ＰＶＤ用ヒータ、シャワーヘッドなどに適用できる。
（３）また、前記実施例では、ダムを構成する接着剤として、シリコーン樹脂を例に挙げたが、シリコーン樹脂に限らず、塗布によってダムを形成できる各種の熱硬化型接着剤等の接着剤を使用できる。また、熱硬化型樹脂に限らず、塗布によってダムを形成できる例えば湿気（水分）硬化型樹脂などの接着剤を利用できる。
(2) In the above embodiment, the electrostatic chuck is used as the composite member. However, the present invention can be applied to a heater for CVD, a heater for PVD, a shower head, and the like.
(3) Moreover, in the said Example, although the silicone resin was mentioned as an example as an adhesive agent which comprises a dam, it is not restricted to a silicone resin, Adhesives, such as various thermosetting adhesives which can form a dam by application | coating Can be used. Moreover, not only thermosetting resin but adhesives, such as moisture (water | moisture) curable resin which can form a dam by application | coating, can be utilized.
同様に、前記実施例では、接着剤層を構成する接着剤として、シリコーン樹脂を例に挙げたが、シリコーン樹脂に限らず、各種の熱硬化型接着剤等の接着剤を使用できる。また、熱硬化型樹脂に限らず、例えば湿気（水分）硬化型樹脂などの接着剤を利用できる。 Similarly, in the said Example, although silicone resin was mentioned as an example as an adhesive agent which comprises an adhesive bond layer, not only a silicone resin but adhesives, such as various thermosetting adhesives, can be used. Further, not only the thermosetting resin but also an adhesive such as a moisture (moisture) curable resin can be used.
（４）前記ダムや接着剤層を構成する接着剤としては、同じ熱的特性（例えば熱伝導率）や機械的特性（例えばヤング率）などの特性を有する同種の接着剤を使用できるが、それらの特性が異なる別種の接着剤を使用してもよい。 (4) As an adhesive constituting the dam or the adhesive layer, the same kind of adhesive having the same thermal characteristics (for example, thermal conductivity) and mechanical characteristics (for example, Young's modulus) can be used. Different types of adhesives having different properties may be used.
具体的には、例えばダムの材料として、信越化学製KE-1867を用い、接着剤層の材料として信越化学製KE-1820を用いてもよい。
また、ダムの熱伝導率と接着剤層の熱伝導率とが異なるように、異なる材料（接着剤）を用いてよい。つまり、ダムと接着剤層の熱伝導率が異なるようにすることによって、吸着面における熱的特性を任意に変更することができる。これによって、接合面の開口部に、セラミック絶縁体の外周部や端子部などにより熱的に特異領域となる場合であっても、熱的な特異領域を調整できるという利点がある。
Specifically, for example, KE-1867 manufactured by Shin-Etsu Chemical may be used as the material for the dam, and KE-1820 manufactured by Shin-Etsu Chemical may be used as the material for the adhesive layer.
Further, different materials (adhesives) may be used so that the thermal conductivity of the dam and the thermal conductivity of the adhesive layer are different. That is, by making the thermal conductivity of the dam and the adhesive layer different, the thermal characteristics on the adsorption surface can be arbitrarily changed. Accordingly, there is an advantage that the thermal singularity region can be adjusted even when the opening portion of the joint surface becomes a thermal singularity region due to the outer peripheral portion or the terminal portion of the ceramic insulator.
（５）前記実施例では、領域Ｓに塗布する接着剤の厚みをダムの高さより大きくしてオーパーフロー層を形成したが、オーパーフロー層を形成しないように、領域Ｓに塗布する接着剤の厚みを設定してもよい。 (5) Although the overflow layer is formed by making the thickness of the adhesive applied to the region S larger than the height of the dam in the above embodiment, the adhesive applied to the region S is not formed so as not to form the overflow layer. The thickness may be set.
１…静電チャック
３…半導体ウェハ
５…吸着面
７、１１…接合面
９…セラミック絶縁板
１５…金属ベース
１７…複合接着剤層
８７ａ、８８ａ…開口部
９１、９３、９５…ダム
９１ａ、９３ａ、９５ａ…塗布部
９７…接着剤層
１０１…オーバーフロー層
DESCRIPTION OF SYMBOLS 1 ... Electrostatic chuck 3 ... Semiconductor wafer 5 ... Adsorption surface 7, 11 ... Bonding surface 9 ... Ceramic insulating board 15 ... Metal base 17 ... Composite adhesive layer 87a, 88a ... Openings 91, 93, 95 ... Dam 91a, 93a 95a ... coating part 97 ... adhesive layer 101 ... overflow layer
Claims (11)
前記第１の部材と前記第２の部材との接合面の間に、前記接着剤層の外周に沿って、該接着剤層を囲むように形成されたダムを備えるとともに、
前記ダムは、該ダムとなる材料が硬化したものであって、前記第１の部材又は前記第２の部材の接合面上に形成されており、
さらに、前記ダムの材料及び前記接着剤層の材料は、同種の接着剤であることを特徴とする複合部材。 In the composite member in which the first member and the second member made of a material different from the first member are joined by an adhesive layer made of an adhesive disposed between the joining surfaces of the first member and the first member,
Between the bonding surface of the first member and the second member, a dam formed so as to surround the adhesive layer along the outer periphery of the adhesive layer,
The dam is a cured material of the dam, and is formed on the joint surface of the first member or the second member ,
Furthermore, the material of the said dam and the material of the said adhesive bond layer are the same kind of adhesive agents, The composite member characterized by the above-mentioned.
前記第１の部材と前記第２の部材との接合面の間に、前記接着剤層の外周に沿って、該接着剤層を囲むように形成されたダムを備えるとともに、 Between the bonding surface of the first member and the second member, a dam formed so as to surround the adhesive layer along the outer periphery of the adhesive layer,
前記ダムは、該ダムとなる材料が硬化したものであって、前記第１の部材又は前記第２の部材の接合面上に形成されており、 The dam is a cured material of the dam, and is formed on the joint surface of the first member or the second member,
さらに、前記ダムの熱伝導率と前記接着剤層の熱伝導率とが異なることを特徴とする複合部材。 Furthermore, the thermal conductivity of the said dam and the thermal conductivity of the said adhesive bond layer differ, The composite member characterized by the above-mentioned.
前記接合の際に流動性を有する前記接着剤の流出を阻止するダムを形成するために、前記第１の部材又は前記第２の部材の接合面上にて、前記接着剤を塗布する領域を囲むように、ダム形成用材料を塗布して塗布部を形成する第１工程と、
前記ダム形成用材料からなる前記塗布部を硬化させて、前記ダムを形成する第２工程と、
前記ダムに囲まれた領域に、前記流動性を有する接着剤を塗布する第３工程と、
前記接着剤を挟むように前記第１の部材と前記第２の部材とを配置して、前記接着剤を硬化させることにより、前記第１の部材と前記第２の部材とを接合する第４工程と、
を有し、
さらに、前記ダム形成用材料の粘度は、前記流動性を有する接着剤の粘度より大であることを特徴とする複合部材の製造方法。 In the method for manufacturing a composite member, in which the first member and the second member made of a material different from the first member are joined by an adhesive disposed between the joining surfaces of the first member and the first member,
In order to form a dam that prevents outflow of the adhesive having fluidity during the joining, a region where the adhesive is applied is formed on the joining surface of the first member or the second member. A first step of applying a dam forming material to form an application portion so as to surround;
A second step of curing the application portion made of the dam forming material to form the dam;
A third step of applying the fluid adhesive to the region surrounded by the dam;
4th which joins the 1st member and the 2nd member by arranging the 1st member and the 2nd member so that the adhesive may be inserted, and hardening the adhesive. Process,
I have a,
Furthermore, the viscosity of the said dam formation material is larger than the viscosity of the adhesive agent which has the said fluidity | liquidity , The manufacturing method of the composite member characterized by the above-mentioned .
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| JP2014165267A (en) | 2014-09-08 |
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