JP6071857B2 - Dissolution removal composition - Google Patents
Dissolution removal composition Download PDFInfo
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- JP6071857B2 JP6071857B2 JP2013248061A JP2013248061A JP6071857B2 JP 6071857 B2 JP6071857 B2 JP 6071857B2 JP 2013248061 A JP2013248061 A JP 2013248061A JP 2013248061 A JP2013248061 A JP 2013248061A JP 6071857 B2 JP6071857 B2 JP 6071857B2
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- JP
- Japan
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- group
- dissolution
- mass
- removal composition
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- Prior art date
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- 238000004090 dissolution Methods 0.000 title claims description 169
- 239000000203 mixture Substances 0.000 title claims description 123
- 239000002280 amphoteric surfactant Substances 0.000 claims description 50
- 239000002736 nonionic surfactant Substances 0.000 claims description 43
- 239000003795 chemical substances by application Substances 0.000 claims description 34
- -1 fatty acid esters Chemical class 0.000 claims description 27
- 239000003638 chemical reducing agent Substances 0.000 claims description 23
- 229910052717 sulfur Inorganic materials 0.000 claims description 23
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 22
- 239000011593 sulfur Substances 0.000 claims description 22
- 229910044991 metal oxide Inorganic materials 0.000 claims description 21
- 150000004706 metal oxides Chemical class 0.000 claims description 21
- 150000003585 thioureas Chemical class 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 18
- 239000002738 chelating agent Substances 0.000 claims description 15
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 15
- 229930195729 fatty acid Natural products 0.000 claims description 15
- 239000000194 fatty acid Substances 0.000 claims description 15
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims description 14
- 150000003839 salts Chemical class 0.000 claims description 13
- RYYXDZDBXNUPOG-UHFFFAOYSA-N 4,5,6,7-tetrahydro-1,3-benzothiazole-2,6-diamine;dihydrochloride Chemical compound Cl.Cl.C1C(N)CCC2=C1SC(N)=N2 RYYXDZDBXNUPOG-UHFFFAOYSA-N 0.000 claims description 12
- 150000005215 alkyl ethers Chemical class 0.000 claims description 12
- 125000003342 alkenyl group Chemical group 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 10
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 9
- 125000000304 alkynyl group Chemical group 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 9
- 125000000623 heterocyclic group Chemical group 0.000 claims description 9
- 229960003237 betaine Drugs 0.000 claims description 7
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 150000003009 phosphonic acids Chemical class 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- OKGXJRGLYVRVNE-UHFFFAOYSA-N diaminomethylidenethiourea Chemical compound NC(N)=NC(N)=S OKGXJRGLYVRVNE-UHFFFAOYSA-N 0.000 claims description 4
- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 claims description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical class OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 3
- 150000004764 thiosulfuric acid derivatives Chemical class 0.000 claims description 3
- 150000001413 amino acids Chemical class 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 55
- 239000002184 metal Substances 0.000 description 55
- 238000005260 corrosion Methods 0.000 description 49
- 230000007797 corrosion Effects 0.000 description 49
- 239000002585 base Substances 0.000 description 35
- 239000000463 material Substances 0.000 description 35
- 238000011156 evaluation Methods 0.000 description 30
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 23
- 238000002156 mixing Methods 0.000 description 21
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 20
- 230000004580 weight loss Effects 0.000 description 18
- 230000002401 inhibitory effect Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 8
- 230000005764 inhibitory process Effects 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 6
- 150000007524 organic acids Chemical class 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- 229940093915 gynecological organic acid Drugs 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 235000005985 organic acids Nutrition 0.000 description 4
- 230000001603 reducing effect Effects 0.000 description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 3
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000010323 ascorbic acid Nutrition 0.000 description 2
- 229960005070 ascorbic acid Drugs 0.000 description 2
- 239000011668 ascorbic acid Substances 0.000 description 2
- UJMDYLWCYJJYMO-UHFFFAOYSA-N benzene-1,2,3-tricarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1C(O)=O UJMDYLWCYJJYMO-UHFFFAOYSA-N 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- 235000015165 citric acid Nutrition 0.000 description 2
- 238000011978 dissolution method Methods 0.000 description 2
- RDYMFSUJUZBWLH-UHFFFAOYSA-N endosulfan Chemical compound C12COS(=O)OCC2C2(Cl)C(Cl)=C(Cl)C1(Cl)C2(Cl)Cl RDYMFSUJUZBWLH-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- YDSWCNNOKPMOTP-UHFFFAOYSA-N mellitic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(O)=O)=C(C(O)=O)C(C(O)=O)=C1C(O)=O YDSWCNNOKPMOTP-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- KHPXUQMNIQBQEV-UHFFFAOYSA-N oxaloacetic acid Chemical class OC(=O)CC(=O)C(O)=O KHPXUQMNIQBQEV-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- KQTIIICEAUMSDG-UHFFFAOYSA-N tricarballylic acid Chemical compound OC(=O)CC(C(O)=O)CC(O)=O KQTIIICEAUMSDG-UHFFFAOYSA-N 0.000 description 2
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- CIOXZGOUEYHNBF-UHFFFAOYSA-N (carboxymethoxy)succinic acid Chemical class OC(=O)COC(C(O)=O)CC(O)=O CIOXZGOUEYHNBF-UHFFFAOYSA-N 0.000 description 1
- TVHNLHDFHIHBRL-UHFFFAOYSA-N 1,1,3,3-tetracyclohexylthiourea Chemical compound C1CCCCC1N(C1CCCCC1)C(=S)N(C1CCCCC1)C1CCCCC1 TVHNLHDFHIHBRL-UHFFFAOYSA-N 0.000 description 1
- ZSPQVOFATJEJMT-UHFFFAOYSA-N 1,1,3,3-tetraethylthiourea Chemical compound CCN(CC)C(=S)N(CC)CC ZSPQVOFATJEJMT-UHFFFAOYSA-N 0.000 description 1
- MZRATIPJHWLMQH-UHFFFAOYSA-N 1,1,3-tricyclohexylthiourea Chemical compound C1CCCCC1N(C1CCCCC1)C(=S)NC1CCCCC1 MZRATIPJHWLMQH-UHFFFAOYSA-N 0.000 description 1
- HXMRAWVFMYZQMG-UHFFFAOYSA-N 1,1,3-triethylthiourea Chemical compound CCNC(=S)N(CC)CC HXMRAWVFMYZQMG-UHFFFAOYSA-N 0.000 description 1
- JAEZSIYNWDWMMN-UHFFFAOYSA-N 1,1,3-trimethylthiourea Chemical compound CNC(=S)N(C)C JAEZSIYNWDWMMN-UHFFFAOYSA-N 0.000 description 1
- VDUTWHBYCATQBI-UHFFFAOYSA-N 1,1,3-tripropylthiourea Chemical compound CCCNC(=S)N(CCC)CCC VDUTWHBYCATQBI-UHFFFAOYSA-N 0.000 description 1
- KAJICSGLHKRDLN-UHFFFAOYSA-N 1,3-dicyclohexylthiourea Chemical compound C1CCCCC1NC(=S)NC1CCCCC1 KAJICSGLHKRDLN-UHFFFAOYSA-N 0.000 description 1
- AUXGIIVHLRLBSG-UHFFFAOYSA-N 1,3-dipropylthiourea Chemical compound CCCNC(=S)NCCC AUXGIIVHLRLBSG-UHFFFAOYSA-N 0.000 description 1
- AOSFMYBATFLTAQ-UHFFFAOYSA-N 1-amino-3-(benzimidazol-1-yl)propan-2-ol Chemical compound C1=CC=C2N(CC(O)CN)C=NC2=C1 AOSFMYBATFLTAQ-UHFFFAOYSA-N 0.000 description 1
- CMCBDXRRFKYBDG-UHFFFAOYSA-N 1-dodecoxydodecane Chemical compound CCCCCCCCCCCCOCCCCCCCCCCCC CMCBDXRRFKYBDG-UHFFFAOYSA-N 0.000 description 1
- ZQIHYCWJAUSBQV-UHFFFAOYSA-N 1-hydroxyethane-1,1,2-tricarboxylic acid Chemical class OC(=O)CC(O)(C(O)=O)C(O)=O ZQIHYCWJAUSBQV-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HBXWUCXDUUJDRB-UHFFFAOYSA-N 1-octadecoxyoctadecane Chemical compound CCCCCCCCCCCCCCCCCCOCCCCCCCCCCCCCCCCCC HBXWUCXDUUJDRB-UHFFFAOYSA-N 0.000 description 1
- CFPOJWPDQWJEMO-UHFFFAOYSA-N 2-(1,2-dicarboxyethoxy)butanedioic acid Chemical class OC(=O)CC(C(O)=O)OC(C(O)=O)CC(O)=O CFPOJWPDQWJEMO-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 description 1
- MUHFRORXWCGZGE-KTKRTIGZSA-N 2-hydroxyethyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCO MUHFRORXWCGZGE-KTKRTIGZSA-N 0.000 description 1
- RFVNOJDQRGSOEL-UHFFFAOYSA-N 2-hydroxyethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCO RFVNOJDQRGSOEL-UHFFFAOYSA-N 0.000 description 1
- WOZHZOLFFPSEAM-UHFFFAOYSA-N 3-butene-1,2,3-tricarboxylic acid Chemical compound OC(=O)CC(C(O)=O)C(=C)C(O)=O WOZHZOLFFPSEAM-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical class OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910002588 FeOOH Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- VLCDUOXHFNUCKK-UHFFFAOYSA-N N,N'-Dimethylthiourea Chemical compound CNC(=S)NC VLCDUOXHFNUCKK-UHFFFAOYSA-N 0.000 description 1
- FLVIGYVXZHLUHP-UHFFFAOYSA-N N,N'-diethylthiourea Chemical compound CCNC(=S)NCC FLVIGYVXZHLUHP-UHFFFAOYSA-N 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- KQJQICVXLJTWQD-UHFFFAOYSA-N N-Methylthiourea Chemical compound CNC(N)=S KQJQICVXLJTWQD-UHFFFAOYSA-N 0.000 description 1
- GMEHFXXZSWDEDB-UHFFFAOYSA-N N-ethylthiourea Chemical compound CCNC(N)=S GMEHFXXZSWDEDB-UHFFFAOYSA-N 0.000 description 1
- 241000047703 Nonion Species 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical class OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- MNOILHPDHOHILI-UHFFFAOYSA-N Tetramethylthiourea Chemical compound CN(C)C(=S)N(C)C MNOILHPDHOHILI-UHFFFAOYSA-N 0.000 description 1
- CUPCBVUMRUSXIU-UHFFFAOYSA-N [Fe].OOO Chemical compound [Fe].OOO CUPCBVUMRUSXIU-UHFFFAOYSA-N 0.000 description 1
- GOCUDLIKGMZULG-UHFFFAOYSA-M [Na+].[SH-].OS(=O)S(O)=O Chemical compound [Na+].[SH-].OS(=O)S(O)=O GOCUDLIKGMZULG-UHFFFAOYSA-M 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- LGVFJHCENRNEOH-UHFFFAOYSA-N [O-]C(CC[N+]1(CCO)C=NCC1)=O Chemical compound [O-]C(CC[N+]1(CCO)C=NCC1)=O LGVFJHCENRNEOH-UHFFFAOYSA-N 0.000 description 1
- XFKQXANXMAWSKE-UHFFFAOYSA-N [S].NC(N)=S Chemical compound [S].NC(N)=S XFKQXANXMAWSKE-UHFFFAOYSA-N 0.000 description 1
- DPRMFUAMSRXGDE-UHFFFAOYSA-N ac1o530g Chemical compound NCCN.NCCN DPRMFUAMSRXGDE-UHFFFAOYSA-N 0.000 description 1
- RUSUZAGBORAKPY-UHFFFAOYSA-N acetic acid;n'-[2-(2-aminoethylamino)ethyl]ethane-1,2-diamine Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.NCCNCCNCCN RUSUZAGBORAKPY-UHFFFAOYSA-N 0.000 description 1
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- 235000011037 adipic acid Nutrition 0.000 description 1
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- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GGAUUQHSCNMCAU-UHFFFAOYSA-N butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)CC(C(O)=O)C(C(O)=O)CC(O)=O GGAUUQHSCNMCAU-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- GBAOBIBJACZTNA-UHFFFAOYSA-L calcium sulfite Chemical compound [Ca+2].[O-]S([O-])=O GBAOBIBJACZTNA-UHFFFAOYSA-L 0.000 description 1
- 235000010261 calcium sulphite Nutrition 0.000 description 1
- XEVRDFDBXJMZFG-UHFFFAOYSA-N carbonyl dihydrazine Chemical compound NNC(=O)NN XEVRDFDBXJMZFG-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
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- 238000004737 colorimetric analysis Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 1
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- 238000001514 detection method Methods 0.000 description 1
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- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 description 1
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- 229940075933 dithionate Drugs 0.000 description 1
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- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 1
- HFKBPAKZRASAGX-UHFFFAOYSA-N ethane-1,1,1,2-tetracarboxylic acid Chemical compound OC(=O)CC(C(O)=O)(C(O)=O)C(O)=O HFKBPAKZRASAGX-UHFFFAOYSA-N 0.000 description 1
- AIJZIRPGCQPZSL-UHFFFAOYSA-N ethylenetetracarboxylic acid Chemical compound OC(=O)C(C(O)=O)=C(C(O)=O)C(O)=O AIJZIRPGCQPZSL-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
- 229910021519 iron(III) oxide-hydroxide Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229940055577 oleyl alcohol Drugs 0.000 description 1
- XMLQWXUVTXCDDL-UHFFFAOYSA-N oleyl alcohol Natural products CCCCCCC=CCCCCCCCCCCO XMLQWXUVTXCDDL-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- DJEHXEMURTVAOE-UHFFFAOYSA-M potassium bisulfite Chemical compound [K+].OS([O-])=O DJEHXEMURTVAOE-UHFFFAOYSA-M 0.000 description 1
- 229940099427 potassium bisulfite Drugs 0.000 description 1
- 235000010259 potassium hydrogen sulphite Nutrition 0.000 description 1
- RWPGFSMJFRPDDP-UHFFFAOYSA-L potassium metabisulfite Chemical compound [K+].[K+].[O-]S(=O)S([O-])(=O)=O RWPGFSMJFRPDDP-UHFFFAOYSA-L 0.000 description 1
- 235000010263 potassium metabisulphite Nutrition 0.000 description 1
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 1
- 235000019252 potassium sulphite Nutrition 0.000 description 1
- XYKIUTSFQGXHOW-UHFFFAOYSA-N propan-2-one;toluene Chemical compound CC(C)=O.CC1=CC=CC=C1 XYKIUTSFQGXHOW-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- HRZFUMHJMZEROT-UHFFFAOYSA-L sodium disulfite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])(=O)=O HRZFUMHJMZEROT-UHFFFAOYSA-L 0.000 description 1
- 229940079827 sodium hydrogen sulfite Drugs 0.000 description 1
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- 235000010262 sodium metabisulphite Nutrition 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical class OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- KRURGYOKPVLRHQ-UHFFFAOYSA-L trithionate(2-) Chemical compound [O-]S(=O)(=O)SS([O-])(=O)=O KRURGYOKPVLRHQ-UHFFFAOYSA-L 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- HSYFJDYGOJKZCL-UHFFFAOYSA-L zinc;sulfite Chemical compound [Zn+2].[O-]S([O-])=O HSYFJDYGOJKZCL-UHFFFAOYSA-L 0.000 description 1
Images
Landscapes
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Description
本発明は、金属酸化物を含む錆及びスケールなどの溶解除去組成物に関し、詳しくは、配管などの金属母材の腐食を抑制できる溶解除去組成物に関する。 The present invention relates to a dissolution / removal composition such as rust and scale containing a metal oxide, and more particularly to a dissolution / removal composition that can suppress corrosion of a metal base material such as piping.
従来、ホスホン酸などを主成分とする溶解除去剤を中性域で使用して、金属表面に付着した金属酸化物を含むスケールを除去するスケールの溶解方法が提案されている（例えば、特許文献１参照）。このスケールの溶解方法においては、洗浄液中に鉄粉などを混入させることにより、鉄粉が溶解し、Ｆｅ２＋が生成することにより、還元雰囲気が形成されるため、スケールを効率良く溶解除去することが可能となる。 Conventionally, a dissolution method for a scale has been proposed in which a scale containing a metal oxide attached to a metal surface is removed by using a dissolution remover mainly composed of phosphonic acid or the like in a neutral region (for example, Patent Documents). 1). In this scale dissolution method, iron powder etc. are mixed in the cleaning solution, and the iron powder is dissolved, and Fe 2+ is generated to form a reducing atmosphere, so the scale is dissolved and removed efficiently. Is possible.
しかしながら、特許文献１に記載のスケールの溶解除去方法においては、洗浄液に鉄の粉などを混入させる必要がある。また、従来のスケールの溶解除去方法においては、スケールの溶解速度が遅く、スケールの溶解開始時間に遅れが生じる場合があり、またスケールが付着した金属母材が大きく腐食する場合がある。 However, in the method for dissolving and removing the scale described in Patent Document 1, it is necessary to mix iron powder or the like into the cleaning liquid. Further, in the conventional method for dissolving and removing the scale, there is a case where the dissolution rate of the scale is slow, the start time of dissolution of the scale is delayed, and the metal base material to which the scale is attached may be greatly corroded.
本発明は、このような実情に鑑みてなされたものであり、スケールの溶解速度に優れ、しかも、スケールが付着した金属母材の腐食を低減できる溶解除去組成物を提供することを目的とする。 This invention is made | formed in view of such a situation, and it aims at providing the dissolution removal composition which is excellent in the melt | dissolution rate of a scale, and can reduce corrosion of the metal base material to which the scale adhered. .
本発明の溶解除去組成物は、（Ａ）アミノカルボン酸類及びそれらの塩、並びに、ホスホン酸類及びそれらの塩からなる群から選択された少なくとも１種のキレート剤を含み金属酸化物を含むスケールを溶解除去する溶解除去剤と、（Ｂ）下記式（１）で表される化合物、下記一般式（２）で表される化合物及び下記一般式（３）で表される化合物からなる群から選択された少なくとも１種を含む両性界面活性剤と、（Ｃ）ＨＬＢ値が３〜１８の脂肪酸エステル類及びポリオキシアルキレンアルキルエーテルからなる群から選択された少なくとも１種を含む非イオン界面活性剤と、（Ｄ）チオ尿素類、並びに、（Ｅ）亜硫酸類、亜硫酸水素類、ピロ亜硫酸類、チオ硫酸類、亜ジチオン酸類、チオン酸類、ポリチオン酸類及び二酸化チオ尿素からなる群から選択された少なくとも１種を含む硫黄系還元剤の少なくとも１種と、を含むことを特徴とする。
本発明の溶解除去組成物においては、（Ｃ）チオ尿素類が、アルキルチオ尿素及びグアニルチオ尿素からなる群から選択された少なくとも１種を含むことが好ましい。 In the dissolution removal composition of the present invention, it is preferable that (C) the thiourea contains at least one selected from the group consisting of alkylthiourea and guanylthiourea .
本発明の溶解除去組成物においては、（Ｅ）硫黄系還元剤が、亜ジチオン酸塩及び二酸化チオ尿素からなる群から選択された少なくとも１種を含むことが好ましい。 In the dissolution and removal composition of the present invention, (E) the sulfur-based reducing agent preferably contains at least one selected from the group consisting of dithionite and thiourea dioxide .
本発明の溶解除去組成物においては、（Ａ）溶解除去剤が、アミノカルボン酸類及びそれらの塩からなる群から選択された少なくとも１種のキレート剤を含むことが好ましい。 In the dissolution removal composition of the present invention, it is preferable that (A) the dissolution removal agent includes at least one chelating agent selected from the group consisting of aminocarboxylic acids and salts thereof.
本発明の溶解除去組成物においては、（Ａ）溶解除去剤が、ホスホン酸類及びそれらの塩からなる群から選択された少なくとも１種のキレート剤を含むことが好ましい。 In the dissolution removal composition of the present invention, it is preferable that (A) the dissolution removal agent includes at least one chelating agent selected from the group consisting of phosphonic acids and salts thereof.
本発明の溶解除去組成物においては、（Ｂ）両性界面活性剤が、２−アルキル−Ｎ−カルボキシメチル−Ｎ−ヒドロキシエチルイミダゾリニウムベタイン及び２−アルキル−Ｎ−カルボキシエチル−Ｎ−ヒドロキシエチルイミダゾリニウムベタインの少なくとも１種を含むことが好ましい。 In the dissolution and removal composition of the present invention, (B) the amphoteric surfactant comprises 2-alkyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine and 2-alkyl-N-carboxyethyl-N-hydroxyethyl. It is preferable to contain at least one imidazolinium betaine .
本発明の溶解除去組成物においては、（Ｃ）非イオン界面活性剤が、ポリオキシアルキレングリコール脂肪酸エステル類、ポリアルキレングリコール脂肪酸エステル類、及びポリオキシアルキレンアルキルエーテル類からなる群から選択された少なくとも１種を含むことが好ましい。 In the dissolution removal composition of the present invention, (C) the nonionic surfactant is at least selected from the group consisting of polyoxyalkylene glycol fatty acid esters, polyalkylene glycol fatty acid esters, and polyoxyalkylene alkyl ethers. It is preferable that 1 type is included.
本発明によれば、スケールの溶解速度に優れ、しかも、スケールが付着した金属母材の腐食を低減できる溶解除去組成物を実現できる。 ADVANTAGE OF THE INVENTION According to this invention, the melt | dissolution removal composition which is excellent in the melt | dissolution rate of a scale and can reduce corrosion of the metal base material to which the scale adhered can be implement | achieved.
以下、本発明の一実施の形態について、添付図面を参照して詳細に説明する。なお、また、本発明は、以下の各実施の形態に限定されるものではなく、適宜変更して実施可能である。 Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited to each following embodiment, It can implement by changing suitably.
＜溶解除去組成物＞
本発明に係る溶解除去組成物は、（Ａ）金属酸化物を含むスケールを除去する溶解除去剤、（Ｂ）両性界面活性剤、及び（Ｃ）非イオン界面活性剤、を含む。本発明に係る溶解除去組成物は、（Ａ）溶解除去剤、（Ｂ）両性界面活性剤、及び（Ｃ）非イオン界面活性剤を配管を流れる水などに順次添加することにより、配管など金属母材の腐食を防ぎつつ、配管内に発生したスケール及び錆を溶解除去することが可能となる。本発明に係る溶解除去組成物により上述した作用効果が得られる原理については必ずしも明らかではないが、以下のように推定される。
<Dissolution removal composition>
The dissolution removal composition according to the present invention includes (A) a dissolution removal agent that removes a scale containing a metal oxide, (B) an amphoteric surfactant, and (C) a nonionic surfactant. The dissolution / removal composition according to the present invention is obtained by sequentially adding (A) a dissolution / removal agent, (B) an amphoteric surfactant, and (C) a nonionic surfactant to water flowing through the pipe, thereby forming a metal such as a pipe. It is possible to dissolve and remove the scale and rust generated in the pipe while preventing the corrosion of the base material. The principle of obtaining the above-described effects by the dissolution and removal composition according to the present invention is not necessarily clear, but is estimated as follows.
図１Ａ〜図１Ｃは、本発明に係る溶解除去組成物による作用効果の概念図である。本発明に係る溶解除去組成物においては、金属配管１２上にスケール１３が付着した場合であっても、（Ｂ）成分の両性界面活性剤１１の極性基が金属配管１２などの金属母材に吸着して金属配管１２の表面に両性界面活性剤１１による被膜が形成される。一方で、（Ｂ）両性界面活性剤１３は、金属配管１２の内面に対して、スケール１３の表面には相対的に吸着されにくく、（Ａ）溶解除去剤１４によるスケール１３の除去性能を阻害することがない。したがって、本発明に係る溶解除去組成物においては、（Ｂ）成分の両性界面活性剤１１が金属母材の表面に吸着する一方、錆などのスケール１３の表面には、吸着しにくくなるので、錆などスケール１３を速やかに除去できる溶解除去性能が得られると共に、金属母材の防食性を高めることが可能になると考えられる。そして、本発明に係る溶解除去組成物においては、更に（Ｃ）成分の非イオン界面活性剤１５を含有するので、（Ｂ）成分の両性界面活性剤１１によって形成された金属母材の薄い保護被膜と金属母材との隙間に非イオン界面活性剤１５が入り、より強固な保護被膜が形成されるので、優れた錆及びスケール１３の溶解除去性能が得られると共に、金属母材の腐食を大幅に抑制することが可能となる。
FIG. 1A to FIG. 1C are conceptual diagrams of operational effects of the dissolution and removal composition according to the present invention. In the dissolution and removal composition according to the present invention, the polar group of the
図２は、本発明に係る溶解除去組成物の溶解鉄濃度と時間との関係を示す図であり、図３は、本発明に係る溶解除去組成物に浸漬した金属母材の腐食減量との関係を示す図である。なお、図２においては、（Ａ）成分〜（Ｃ）成分の各種配合量を変化させた４種類の本発明に係る溶解除去組成物にスケールが付着した配管を浸漬させた場合の溶解鉄濃度の変化（図２のＡ〜Ｄ参照）と従来のスケール除去組成物における溶解鉄濃度の変化（図２のＥ参照）とを対比して示している。また、図３においては、図２と同様に、（Ａ）成分〜（Ｃ）成分の各種配合量を変化させた４種類の本発明に係る溶解除去組成物にスケールが付着した配管を浸漬させた場合の配管の腐食減量（図３のＡ〜Ｄ参照）と従来のスケール除去組成物における配管の腐食減量の変化（図３のＥ参照）とを対比して示している。 FIG. 2 is a diagram showing the relationship between the dissolved iron concentration and time of the dissolution composition according to the present invention, and FIG. 3 shows the corrosion weight loss of the metal base material immersed in the dissolution composition according to the present invention. It is a figure which shows a relationship. In FIG. 2, the dissolved iron concentration when the pipe with the scale attached is immersed in the four types of dissolution removal compositions according to the present invention in which the various blending amounts of the components (A) to (C) are changed. 2 (see FIGS. 2A to 2D) and a change in dissolved iron concentration in a conventional descaling composition (see E in FIG. 2). Also, in FIG. 3, as in FIG. 2, pipes with scales attached are immersed in four types of dissolution and removal compositions according to the present invention in which various blending amounts of components (A) to (C) are changed. FIG. 3 shows a comparison between the corrosion weight loss of the pipe (see FIGS. 3A to 3D) and the change in the corrosion weight loss of the pipe in the conventional scale removal composition (see E in FIG. 3).
図２に示すように、本発明に係る溶解除去組成物においては、上述したように、スケールの表面に界面活性剤が付着することがないので、従来のスケール除去組成物と比較してスケールを速やかに除去することが可能となる。その結果、従来のスケール除去組成物と比較して、スケールが付着した配管を溶解除去組成物に浸漬した直後から速やかにスケールが溶解して溶解鉄濃度が上昇することが分かる。 As shown in FIG. 2, in the dissolution removal composition according to the present invention, as described above, the surfactant does not adhere to the surface of the scale, so the scale is reduced compared to the conventional scale removal composition. It can be quickly removed. As a result, as compared with the conventional scale removing composition, it can be seen that the scale is rapidly dissolved and the dissolved iron concentration is increased immediately after the pipe with the scale attached is immersed in the dissolving removal composition.
また、図３に示すように、本発明に係る溶解除去組成物においては、上述したように、配管などの金属母材のスケールが付着した領域以外の領域には、両性界面活性剤及び非イオン界面活性剤による被膜が形成されるので、金属母材を保護することが可能となる。その結果、従来のスケール除去組成物と比較して、金属母材の腐食減量を著しく低減することが可能となる。以下、本発明に係る溶解除去組成物の各種構成要素について詳細に説明する。 Further, as shown in FIG. 3, in the dissolution and removal composition according to the present invention, as described above, the amphoteric surfactant and the non-ion are present in the region other than the region where the scale of the metal base material such as piping is attached. Since the coating film by the surfactant is formed, the metal base material can be protected. As a result, it is possible to significantly reduce the corrosion weight loss of the metal base material as compared with the conventional descaling composition. Hereinafter, various components of the dissolution removal composition according to the present invention will be described in detail.
＜溶解除去剤＞
（Ａ）溶解除去剤としては、錆などの金属酸化物を含むスケールを除去できるものであれば特に制限はなく、各種溶解除去剤を用いることが可能である。（Ａ）成分としては、例えば、各種キレート剤及び有機酸などを用いることができる。なお、（Ａ）成分としては、水酸化カリウムなどの各種アルカリ金属の水酸化物を添加して用いてもよい。塩酸、硫酸それらの塩などの無機酸、無機酸塩を添加して用いてもよい。
<Dissolving agent>
(A) There is no restriction | limiting in particular as long as it can remove the scale containing metal oxides, such as rust, and various dissolution removal agents can be used as a dissolution removal agent. As the component (A), for example, various chelating agents and organic acids can be used. In addition, as (A) component, you may add and use the hydroxide of various alkali metals, such as potassium hydroxide. You may add and use inorganic acids, inorganic acid salts, such as hydrochloric acid and a sulfuric acid salt thereof.
キレート剤としては、例えば、ホスホン酸、アミノトリス（メチレンホスホン酸）、１−ヒドロキシエタン−１，１−ジホスホン酸、エチレンジアミンテトラキス（メチレンホスホン酸）、ヘキサメチレンジアミンテトラキス（メチレンホスホン酸）、ジエチレンテトラミンペンタキス（メチレンホスホン酸）、及び２-ホスホノブタン−１，２，４−トリカルボン酸などの各種ホスホン酸類、並びに、各種ホスホン酸類の塩、並びに、ニトリロ三酢酸、エチレンジアミン四酢酸、ジエチレントリアミン五酢酸、及びトリエチレンテトラミン六酢酸などの各種アミノカルボン酸類、並びに、各種アミノカルボン酸類の塩が挙げられる。これらのキレート剤としては、１種を単独で用いてもよく、２種以上を併用してもよい。 Examples of chelating agents include phosphonic acid, aminotris (methylenephosphonic acid), 1-hydroxyethane-1,1-diphosphonic acid, ethylenediaminetetrakis (methylenephosphonic acid), hexamethylenediaminetetrakis (methylenephosphonic acid), and diethylenetetramine. Various phosphonic acids such as pentakis (methylenephosphonic acid) and 2-phosphonobutane-1,2,4-tricarboxylic acid, and salts of various phosphonic acids, and nitrilotriacetic acid, ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic acid, and Examples include various aminocarboxylic acids such as triethylenetetramine hexaacetic acid, and salts of various aminocarboxylic acids. As these chelating agents, 1 type may be used independently and 2 or more types may be used together.
有機酸としては、例えば、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、デカン−１，１０−ジカルボン酸などのジカルボン酸、及び、ジカルボン酸の塩、ジグリコール酸、チオジグリコール酸、オキサル酢酸、オキシジコハク酸、カルボキシメチルオキシコハク酸、カルボキシメチルタルトロン酸、及びこれらの塩、リンゴ酸、酒石酸、クエン酸、イタコン酸、メチルコハク酸、３−メチルグルタル酸、２，２−ジメチルマロン酸、マレイン酸、フマール酸、１，２，３−プロパントリカルボン酸、アコニット酸、３−ブテン−１，２，３−トリカルボン酸、ブタン−１，２，３，４−テトラカルボン酸、エタンテトラカルボン酸、エテンテトラカルボン酸、ｎ−アルケニルアコニット酸、１，２，３，４−シクロペンタンテトラカルボン酸、フタル酸、トリメシン酸、ヘミメリット酸、ピロメリット酸、ベンゼンヘキサカルボン酸、テトラヒドロフラン−１，２，３，４−テトラカルボン酸、テトラヒドロフラン−２，２，５，５−テトラカルボン酸、及びこれらの塩が挙げられる。これらの有機酸としては、１種を単独で用いてもよく、２種以上を併用してもよい。 Examples of the organic acid include dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, decane-1,10-dicarboxylic acid, and salts of dicarboxylic acid , Diglycolic acid, thiodiglycolic acid, oxalacetic acid, oxydisuccinic acid, carboxymethyloxysuccinic acid, carboxymethyltartronic acid and their salts, malic acid, tartaric acid, citric acid, itaconic acid, methylsuccinic acid, 3-methyl Glutaric acid, 2,2-dimethylmalonic acid, maleic acid, fumaric acid, 1,2,3-propanetricarboxylic acid, aconitic acid, 3-butene-1,2,3-tricarboxylic acid, butane-1,2,3 , 4-tetracarboxylic acid, ethanetetracarboxylic acid, ethenetetracarboxylic acid, n-alkenylaconic Acid, 1,2,3,4-cyclopentanetetracarboxylic acid, phthalic acid, trimesic acid, hemimellitic acid, pyromellitic acid, benzenehexacarboxylic acid, tetrahydrofuran-1,2,3,4-tetracarboxylic acid, tetrahydrofuran Examples include -2,2,5,5-tetracarboxylic acid and salts thereof. As these organic acids, 1 type may be used independently and 2 or more types may be used together.
本発明に係る溶解除去組成物においては、（Ａ）成分としては、各種キレート剤及び各種有機酸からなる群から選択された少なくとも１種を含むことが好ましい。（Ａ）成分として各種キレート剤及び各種有機酸を含有することにより、キレート剤及び有機酸により錆及びスケールの除去性能が向上する。また、本発明の溶解除去組成物においては、（Ａ）溶解除去剤が、ホスホン酸系キレート剤を含むことがより好ましい。この構成によれば、ホスホン酸系キレート剤により錆などの金属酸化物を含むスケールの除去性能がより一層向上する。さらに、本発明に係る溶解除去組成物においては、（Ａ）溶解除去剤としては、錆などの金属酸化物を含むスケールの除去性能に優れる観点から、１−ヒドロキシエタン−１，１−ジホスホン酸を含有することが更に好ましい。 In the dissolution composition according to the present invention, the component (A) preferably includes at least one selected from the group consisting of various chelating agents and various organic acids. By including various chelating agents and various organic acids as the component (A), the removal performance of rust and scale is improved by the chelating agent and the organic acid. Moreover, in the dissolution removal composition of this invention, it is more preferable that (A) dissolution removal agent contains a phosphonic acid type chelating agent. According to this structure, the removal performance of the scale containing metal oxides such as rust is further improved by the phosphonic acid chelating agent. Furthermore, in the dissolution removal composition according to the present invention, as the dissolution removal agent (A), 1-hydroxyethane-1,1-diphosphonic acid is used from the viewpoint of excellent removal performance of scale containing a metal oxide such as rust. It is still more preferable to contain.
（Ｂ）両性界面活性剤
両性界面活性剤としては、本発明の効果を奏する範囲で各種両面界面活性剤を用いることができる。両性界面活性剤としては、例えば、下記式（１）で表される２−アルキル−Ｎ−カルボキシアルキル−Ｎ−ヒドキシアルキルイミダゾリニウムベタイン、下記一般式（２）で表されるβ-アルキルアミノカルボン酸のアルカリ金属塩及び下記一般式（３）で表されるアルキルジメチルベタインからなる群から選択された少なくとも１種を含むことが好ましい。
(B) Amphoteric surfactants As the amphoteric surfactants, various double-sided surfactants can be used within the scope of the effects of the present invention. Examples of the amphoteric surfactant include 2-alkyl-N-carboxyalkyl-N-hydroxyalkylimidazolinium betaine represented by the following formula (1) and β-alkyl represented by the following general formula (2). It is preferable to include at least one selected from the group consisting of an alkali metal salt of an aminocarboxylic acid and an alkyldimethylbetaine represented by the following general formula (3).
上記一般式（１）及び上記一般式（２）で表される両性界面活性剤としては、例えば、２−アルキル−Ｎ−カルボキシメチル−Ｎ−ヒドロキシエチルイミダゾリニウムベタイン及び２−アルキル−Ｎ−カルボキシエチル−Ｎ−ヒドロキシエチルイミダゾリニウムベタインが挙げられる。本発明においては、（Ｂ）両性界面活性剤としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、２−ヤシアルキル−１−カルボキシメチル−１−ヒドロキシエチル−４，５−ジヒドロイミダゾリニウムハイドロオキサイド及びβ−ヤシアルキルアミノプロピオン酸ナトリウムが好ましい。両性界面活性剤としては、１種を単独で用いてもよく、２種以上を併用してもよい。 Examples of the amphoteric surfactants represented by the general formula (1) and the general formula (2) include 2-alkyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine and 2-alkyl-N-. Carboxyethyl-N-hydroxyethyl imidazolinium betaine is mentioned. In the present invention, (B) the amphoteric surfactant is 2-cocoalkyl-1-carboxymethyl-1-hydroxyethyl-4, from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal matrix. 5-dihydroimidazolinium hydroxide and sodium β-coconut alkylaminopropionate are preferred. As an amphoteric surfactant, 1 type may be used independently and 2 or more types may be used together.
本発明の溶解除去組成物においては、（Ｂ）両性界面活性剤が、上記一般式（１）及び
上記一般式（２）で表される化合物の少なくとも１種を含むことが好ましい。この構成によれば、両性界面活性剤がカルボン酸基及び窒素原子を有するので、これらの置換基により両性界面活性剤が金属母材の表面に吸着する一方、錆及びスケールの表面には、吸着しにくくなるので、錆及びスケール溶解除去性能がより向上すると共に、金属母材の防食性をより一層高めることが可能になると考えられる。
In the dissolution and removal composition of the present invention, it is preferable that (B) the amphoteric surfactant contains at least one compound represented by the general formula (1) and the general formula (2). According to this configuration, since the amphoteric surfactant has a carboxylic acid group and a nitrogen atom, the amphoteric surfactant is adsorbed on the surface of the metal base material by these substituents, while it is adsorbed on the surface of rust and scale. Therefore, it is considered that the rust and scale dissolution removal performance is further improved, and the corrosion resistance of the metal base material can be further enhanced.
（Ｃ）非イオン界面活性剤
（Ｃ）成分としては、本発明の効果を奏する範囲で各種非イオン界面活性剤を用いることができる。（Ｃ）成分としては、例えば、ＨＬＢ値が３〜１８の脂肪酸エステル類及びポリオキシアルキレンアルキルエーテルが挙げられる。脂肪酸エステル類としては、例えば、下記一般式（４）で表されるポリオキシアルキレングリコールの脂肪酸エステルが挙げられる。また、ポリオキシアルキレンアルキルエーテルとしては、下記一般式（５）で表されるポリオキシアルキレンアルキルエーテルが挙げられる。
(C) Nonionic surfactant As the component (C), various nonionic surfactants can be used as long as the effects of the present invention are exhibited. Examples of the component (C) include fatty acid esters having a HLB value of 3 to 18 and polyoxyalkylene alkyl ethers. Examples of fatty acid esters include fatty acid esters of polyoxyalkylene glycol represented by the following general formula (4). Moreover, as a polyoxyalkylene alkyl ether, the polyoxyalkylene alkyl ether represented by following General formula (5) is mentioned.
上記一般式（４）で表されるポリオキシアルキレンアルコールの脂肪酸エステルとしては、例えば、ポリエチレングリコールモノオレイン酸エステル、ポリエチレングリコールモノラウリン酸エステル及びポリエチレングリコールモノステアリン酸エステルなどが挙げられる。 Examples of the fatty acid ester of the polyoxyalkylene alcohol represented by the general formula (4) include polyethylene glycol monooleate, polyethylene glycol monolaurate, and polyethylene glycol monostearate.
また、上記一般式（５）で表されるポリオキシアルキレンアルキルエーテルとしては、オレイルアルコール、ラウリルアルコール及びステアリルアルコールなどの高級アルコールにＥＯ（エチレンオキサイド）又はＰＯ（プロピレンオキサイド）又はＥＯ（エチレンオキサイド）とＰＯ（プロピレンオキサイド）両方が付加したものが挙げられる。上記一般式（５）で表されるポリオキシアルキレンアルキルエーテルとしては、例えば、ポリオキシアルキレンオレイルエーテル、ポリオキシアルキレンラウリルエーテル、及びポリオキシアルキレンステアリルエーテルなどが挙げられる。 The polyoxyalkylene alkyl ether represented by the general formula (5) includes higher alcohols such as oleyl alcohol, lauryl alcohol and stearyl alcohol, EO (ethylene oxide), PO (propylene oxide), or EO (ethylene oxide). And PO (propylene oxide) added. Examples of the polyoxyalkylene alkyl ether represented by the general formula (5) include polyoxyalkylene oleyl ether, polyoxyalkylene lauryl ether, and polyoxyalkylene stearyl ether.
本発明に係る溶解除去組成物においては、（Ｃ）非イオン界面活性剤としては、脂肪酸エステル類を含むことが好ましい。この構成により、（Ｃ）非イオン界面活性剤が、脂肪酸エステル構造及びアルキルエーテル構造を有するので、（Ｂ）成分と安定な被膜が形成され、高い防食性が得られると考えられる。 In the dissolution composition according to the present invention, (C) the nonionic surfactant preferably contains fatty acid esters. With this configuration, since the (C) nonionic surfactant has a fatty acid ester structure and an alkyl ether structure, it is considered that a stable film is formed with the component (B) and high anticorrosive properties are obtained.
また、本発明の溶解除去組成物においては、（Ｃ）非イオン界面活性剤が、ポリオキシアルキレングリコール脂肪酸エステル類、ポリアルキレングリコール脂肪酸エステル類、及びポリオキシアルキレンアルキルエーテル類からなる群から選択された少なくとも１種を含むことがより好ましい。この構成により、（Ｃ）非イオン界面活性剤が、脂肪酸エステル構造及びアルキルエーテル構造を有するので、（Ｂ）成分と安定な被膜が形成され、高い防食性が得られると考えられる。また、（Ｃ）非イオン界面活性剤としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、ポリエチレンアルキレングリコールモノオレイン酸エステル及びポリオキシアルキレンオレイルエーテルが更に好ましい。 In the dissolution composition of the present invention, (C) the nonionic surfactant is selected from the group consisting of polyoxyalkylene glycol fatty acid esters, polyalkylene glycol fatty acid esters, and polyoxyalkylene alkyl ethers. More preferably, at least one kind is included. With this configuration, since the (C) nonionic surfactant has a fatty acid ester structure and an alkyl ether structure, it is considered that a stable film is formed with the component (B) and high anticorrosive properties are obtained. In addition, as the nonionic surfactant (C), polyethylene alkylene glycol monooleate and polyoxyalkylene oleyl ether are more preferable from the viewpoints of removing scales containing metal oxides and inhibiting corrosion of the metal base material.
（Ｄ）チオ尿素類
本発明の溶解除去組成物においては、さらに、（Ｄ）チオ尿素類を含むことが好ましい。チオ尿素類を含むことにより、チオ尿素類に含まれる硫黄原子が金属に吸着し保護皮膜を強化するだけでなく、含硫黄化合物の還元性により金属母材の腐食をさらに抑制することが可能となる。
(D) Thioureas The dissolution removal composition of the present invention preferably further comprises (D) thioureas. By containing thioureas, sulfur atoms contained in thioureas are not only adsorbed on the metal and strengthens the protective film, but it is also possible to further suppress the corrosion of the metal matrix due to the reducing properties of the sulfur-containing compounds. Become.
チオ尿素類としては、チオ尿素、メチルチオ尿素、エチルチオ尿素、Ｎ，Ｎ’−ジメチルチオ尿素、Ｎ，Ｎ’−ジエチルチオ尿素、Ｎ，Ｎ’−ジ−ｎ−プロピルチオ尿素、ジシクロヘキシルチオ尿素、トリメチルチオ尿素、トリエチルチオ尿素、トリ−ｎ−プロピルチオ尿素、トリシクロヘキシルチオ尿素、テトラメチルチオ尿素、テトラエチルチオ尿素、テトラ−ｎ−プロピルチオ尿素、テトラシクロヘキシルチオ尿素及びグアニルチオ尿素などが挙げられる。これらのチオ尿素類としては、一種を単独で用いてもよく、２種以上を併用してもよい。これらの中でも、チオ尿素類としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、チオ尿素及びグアニルチオ尿素がより好ましい。 Examples of thioureas include thiourea, methylthiourea, ethylthiourea, N, N′-dimethylthiourea, N, N′-diethylthiourea, N, N′-di-n-propylthiourea, dicyclohexylthiourea, trimethylthiourea. , Triethylthiourea, tri-n-propylthiourea, tricyclohexylthiourea, tetramethylthiourea, tetraethylthiourea, tetra-n-propylthiourea, tetracyclohexylthiourea and guanylthiourea. As these thioureas, 1 type may be used independently and 2 or more types may be used together. Among these, as the thioureas, thiourea and guanylthiourea are more preferable from the viewpoint of removing scales containing metal oxides and suppressing corrosion of the metal base material.
（Ｅ）硫黄系還元剤
本発明の溶解除去組成物においては、さらに、（Ｅ）チオグリコール酸を除く硫黄系還元剤を含むことが好ましい。この構成によれば、硫黄系還元剤に含まれる硫黄原子が金属に吸着し保護皮膜を強化するだけでなく、硫黄系還元剤が有する還元性により金属母材の腐食をさらに抑制することが可能となる。すなわち、図１Ｂに示すように、一般的に、金属配管の表面に付着するスケール１３は、オキシ水酸化鉄（ＦｅＯＯＨ）、マグネタイト（Ｆｅ２Ｏ３）、及びヘマタイト（Ｆｅ２Ｏ３）を主成分とする。このスケール１２は、溶解性が低いＦｅ(III)化合物により表面が被覆されているので、従来の溶解除去組成物では十分な溶解速度が得られていないものと考えられる。
(E) Sulfur-based reducing agent The dissolution removal composition of the present invention preferably further includes (E) a sulfur-based reducing agent excluding thioglycolic acid. According to this configuration, not only the sulfur atom contained in the sulfur-based reducing agent is adsorbed on the metal and strengthens the protective film, but also the corrosion of the metal base material can be further suppressed by the reducing property of the sulfur-based reducing agent. It becomes. That is, as shown in FIG. 1B, generally, the
一方で、本発明においては、溶解除去組成物が硫黄系還元剤を含有するので、硫黄系還元剤からスケール１３の表面のＦｅ(III)化合物に電子（ｅ−）が供与される。これにより、スケール１３の表面のＦｅ(III)が還元され、Ｆｅ(III)対して相対的にホスホン酸キレート剤に対する溶解速度が高いＦｅ（II）が形成されると推定される。したがって、本発明に係る溶解除去組成物によれば、錆などのスケール１３の溶解除去速度を向上させることが可能となる。そして、硫黄系還元剤によるスケール１３の還元作用によってスケールを速やかに除去できるので、金属配管１２に対する腐食量も低減できるものと推定される。
On the other hand, in the present invention, since the dissolution removal composition contains a sulfur-based reducing agent, electrons (e − ) are donated from the sulfur-based reducing agent to the Fe (III) compound on the surface of the
硫黄系還元剤としては、本発明の効果を奏する範囲で各種含硫黄化合物を用いることができる。亜硫酸ナトリウム、亜硫酸カリウム、亜硫酸カルシウム、亜硫酸亜鉛、亜硫酸アンモニウムなどの亜硫酸塩、亜硫酸水素ナトリウム、亜硫酸水素カリウム、亜硫酸水素アンモニウムなどの亜硫酸水素塩、ピロ亜硫酸ナトリウム、ピロ亜硫酸カリウム、ピロ亜硫酸アンモニウムなどのピロ亜硫酸塩、チオ硫酸ナトリウム、チオ硫酸カリウム、チオ硫酸アンモニウムなどのチオ硫酸塩、亜ジチオン酸及び亜ジチオン酸塩、チオン酸及びチオン酸塩、三チオン酸、四チオン酸などのポリチオン酸及びポリチオン酸塩、二酸化チオ尿素が挙げられる。これらの中でも、硫黄系還元剤としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、亜ジチオン酸塩及び二酸化チオ尿素が好ましく、亜ジチオン酸ナトリウム及び二酸化チオ尿素が更に好ましい。 As the sulfur-based reducing agent, various sulfur-containing compounds can be used as long as the effects of the present invention are achieved. Sodium sulfite, potassium sulfite, calcium sulfite, zinc sulfite, ammonium sulfite and other sulfites, sodium hydrogen sulfite, potassium bisulfite, ammonium bisulfite and other bisulfites, sodium pyrosulfite, potassium pyrosulfite, pyro pyrosulfite and other pyrosulfites Thiosulfates such as sulfites, sodium thiosulfate, potassium thiosulfate, ammonium thiosulfate, dithionite and dithionite, thionate and thionate, trithionate, tetrathionate and other polythionate and polythionate And thiourea dioxide. Among these, as the sulfur-based reducing agent, dithionate and thiourea dioxide are preferable from the viewpoint of removing scales containing metal oxides and inhibiting the corrosion of the metal matrix, and sodium dithionite and thiourea dioxide are preferred. Further preferred.
（Ｆ）その他の成分
本発明に係る溶解除去組成物は、本発明の効果を奏する範囲内で上述した化合物以外のその他の成分を含有することが可能である。その他の成分としては、例えば、ピロガロール、ヒドラジン、カルボヒドラジドなどの洗浄液中に存在する酸素を除去するための還元剤、酸化しやすい金属（例えば、Ｆｅ、Ｓｎ、Ａｌ、Ｚｎ）、酸化しやすい金属イオン（例えば、Ｆｅ２＋、Ｓｎ２＋）、洗浄液を中性にする為のＰＨ調整剤などが挙げられる。
(F) Other components The dissolution / removal composition according to the present invention can contain other components other than the above-described compounds within the scope of the effects of the present invention. Other components include, for example, reducing agents for removing oxygen present in the cleaning liquid such as pyrogallol, hydrazine, carbohydrazide, metals that are easily oxidized (eg, Fe, Sn, Al, Zn), metals that are easily oxidized Examples include ions (for example, Fe 2+ , Sn 2+ ), pH adjusting agents for neutralizing the cleaning liquid, and the like.
本発明に係る溶解除去組成物においては、（Ｂ）両性界面活性剤の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、（Ａ）溶解除去剤１００質量部に対して、０．０１質量部以上が好ましく、０．０５質量部以上がより好ましく、０．１０質量部以上が更に好ましく、また（Ａ）溶解除去剤による錆及びスケール除去の洗浄阻害性の観点から、１０００質量部以下が好ましく、７５０質量部以下がより好ましく、５００質量部以下が更に好ましい。以上を考慮すると、（Ｂ）両性界面活性剤の配合量としては、（Ａ）溶解除去剤１００質量部に対して、０．０１質量部以上１０００質量部以下が好ましく、０．０５質量部以上７５０質量部以下がより好ましく、０．１０質量部以上５００質量部以下が更に好ましい。 In the dissolution removal composition according to the present invention, the blending amount of (B) the amphoteric surfactant is (A) dissolution removal agent 100 from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal base material. 0.01 parts by mass or more is preferable with respect to parts by mass, 0.05 parts by mass or more is more preferable, 0.10 parts by mass or more is further preferable, and (A) Rust and scale removal washing inhibition by (A) dissolution remover From a viewpoint of property, 1000 mass parts or less are preferable, 750 mass parts or less are more preferable, and 500 mass parts or less are still more preferable. Considering the above, the blending amount of the (B) amphoteric surfactant is preferably 0.01 parts by mass or more and 1000 parts by mass or less, and 0.05 parts by mass or more with respect to 100 parts by mass of the (A) dissolution remover. 750 mass parts or less are more preferable, and 0.10 mass parts or more and 500 mass parts or less are still more preferable.
本発明に係る溶解除去組成物においては、（Ｃ）非イオン界面活性剤の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、（Ａ）溶解除去剤１００質量部に対して、０．０１質量部以上が好ましく、０．０５質量部以上がより好ましく、０．１０質量部以上が更に好ましく、また（Ａ）溶解除去剤による錆及びスケール除去の洗浄阻害性の観点から、５００質量部以下が好ましく、４００質量部以下がより好ましく、３００質量部以下が更に好ましい。以上を考慮すると、（Ｃ）非イオン界面活性剤の配合量としては、（Ａ）溶解除去剤１００質量部に対して、０．０１質量部以上５００質量部以下が好ましく、０．０５質量部以上４００質量部以下がより好ましく、０．１０質量部以上３００質量部以下が更に好ましい。 In the dissolution / removal composition according to the present invention, the blending amount of (C) the nonionic surfactant is (A) the dissolution / removal agent from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal matrix. 0.01 parts by mass or more is preferable with respect to 100 parts by mass, 0.05 parts by mass or more is more preferable, 0.10 parts by mass or more is further preferable, and (A) Cleaning of rust and scale removal by dissolution remover From an inhibitory viewpoint, 500 mass parts or less are preferable, 400 mass parts or less are more preferable, and 300 mass parts or less are still more preferable. Considering the above, the blending amount of the (C) nonionic surfactant is preferably 0.01 parts by mass or more and 500 parts by mass or less, and 0.05 parts by mass with respect to 100 parts by mass of the (A) dissolution remover. It is more preferably 400 parts by mass or less, and still more preferably 0.10 parts by mass or more and 300 parts by mass or less.
本発明に係る溶解除去組成物においては、（Ｄ）チオ尿素類の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、（Ａ）溶解除去剤１００質量部に対して、０．０１質量部以上が好ましく、０．０５質量部以上がより好ましく、０．１０質量部以上が更に好ましく、また１０質量部以下が好ましく、７．５質量部以下がより好ましく、５質量部以下が更に好ましい。以上を考慮すると、（Ｄ）チオ尿素類の配合量としては、（Ａ）溶解除去剤１００質量部に対して、０．０１質量部以上１０質量部以下が好ましく、０．０５質量部以上７．５質量部以下がより好ましく、０．１０質量部以上５質量部以下が更に好ましい。 In the dissolution / removal composition according to the present invention, the blending amount of (D) thioureas is (A) 100% by mass of the dissolution / removal agent from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal base material. 0.01 parts by mass or more is preferable, 0.05 parts by mass or more is more preferable, 0.10 parts by mass or more is more preferable, 10 parts by mass or less is preferable, and 7.5 parts by mass or less is more preferable. Preferably, 5 parts by mass or less is more preferable. Considering the above, the blending amount of (D) thioureas is preferably 0.01 parts by weight or more and 10 parts by weight or less, and 0.05 parts by weight or more and 7 parts by weight or less with respect to 100 parts by weight of the (A) dissolution remover. The amount is more preferably 5 parts by mass or less, and still more preferably 0.10 parts by mass or more and 5 parts by mass or less.
本発明に係る溶解除去組成物においては、（Ｅ）硫黄系還元剤の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、（Ａ）溶解除去剤１００質量部に対して、０．０１質量部以上が好ましく、０．０５質量部以上がより好ましく、０．１０質量部以上が更に好ましく、また１０質量部以下が好ましく、７．５質量部以下がより好ましく、５質量部以下が更に好ましい。以上を考慮すると、（Ｅ）硫黄系還元剤の配合量としては、（Ａ）溶解除去剤１００質量部に対して、０．０１質量部以上１０質量部以下が好ましく、０．０５質量部以上７．５質量部以下がより好ましく、０．１０質量部以上５質量部以下が更に好ましい。 In the dissolution / removal composition according to the present invention, the blending amount of (E) the sulfur-based reducing agent is (A) the dissolution / removal agent 100 from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal base material. 0.01 parts by mass or more is preferable, 0.05 parts by mass or more is more preferable, 0.10 parts by mass or more is more preferable, 10 parts by mass or less is preferable, and 7.5 parts by mass or less is preferable with respect to parts by mass. More preferred is 5 parts by mass or less. Considering the above, the amount of (E) sulfur-based reducing agent is preferably 0.01 parts by mass or more and 10 parts by mass or less, and 0.05 parts by mass or more with respect to 100 parts by mass of the (A) dissolution remover. 7.5 mass parts or less are more preferable, and 0.10 mass part or more and 5 mass parts or less are still more preferable.
本発明に係る溶解除去組成物においては、（Ａ）溶解除去剤の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、溶解除去組成物の全質量に対して、０．１質量％以上が好ましく、０．５質量％以上がより好ましく、１質量％以上が更に好ましく、また４０質量％以下が好ましく、２０質量％以下がより好ましく、１０質量％以下が更に好ましい。以上を考慮すると、（Ａ）溶解除去剤の配合量としては、溶解除去組成物の全質量に対して、０．１質量％以上４０質量％以下が好ましく、０．５質量％以上２０質量％以下がより好ましく、１質量％以上１０質量％以下が更に好ましい。 In the dissolution / removal composition according to the present invention, the blending amount of the (A) dissolution / removal agent is the total mass of the dissolution / removal composition from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal base material. On the other hand, 0.1 mass% or more is preferable, 0.5 mass% or more is more preferable, 1 mass% or more is further more preferable, 40 mass% or less is preferable, 20 mass% or less is more preferable, and 10 mass% or less. Is more preferable. Considering the above, the blending amount of the (A) dissolution / removal agent is preferably 0.1% by mass or more and 40% by mass or less, and preferably 0.5% by mass or more and 20% by mass with respect to the total mass of the dissolution / removal composition. The following is more preferable, and 1 mass% or more and 10 mass% or less is still more preferable.
本発明に係る溶解除去組成物においては、（Ｂ）両性界面活性剤の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、溶解除去組成物の全質量に対して、０．００１質量％以上が好ましく、０．００５質量％以上がより好ましく、０．０１質量％以上が更に好ましく、また１０質量％以下が好ましく、５質量％以下がより好ましく、２質量％以下が更に好ましい。以上を考慮すると、（Ｂ）両性界面活性剤の配合量としては、溶解除去組成物の全質量に対して、０．００１質量％以上１０質量％以下が好ましく、０．００５質量％以上５質量％以下がより好ましく、０．０１質量％以上２質量％以下が更に好ましい。 In the dissolution / removal composition according to the present invention, the blending amount of the amphoteric surfactant (B) is the total mass of the dissolution / removal composition from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal matrix. Is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, further preferably 0.01% by mass or more, more preferably 10% by mass or less, and even more preferably 5% by mass or less. A mass% or less is more preferable. Considering the above, the blending amount of the (B) amphoteric surfactant is preferably 0.001% by mass or more and 10% by mass or less, and 0.005% by mass or more and 5% by mass with respect to the total mass of the dissolution and removal composition. % Or less is more preferable, and 0.01 mass% or more and 2 mass% or less is still more preferable.
本発明に係る溶解除去組成物においては、（Ｃ）非イオン界面活性剤の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、溶解除去組成物の全質量に対して、０．００１質量％以上が好ましく、０．００５質量％以上がより好ましく、０．０１質量％以上が更に好ましく、また１０質量％以下が好ましく、５質量％以下がより好ましく、２質量％以下が更に好ましい。以上を考慮すると、（Ｃ）非イオン界面活性剤の配合量としては、溶解除去組成物の全質量に対して、０．００１質量％以上１０質量％以下が好ましく、０．００５質量％以上５質量％以下がより好ましく、０．０１質量％以上２質量％以下が更に好ましい。 In the dissolution / removal composition according to the present invention, the blending amount of the (C) nonionic surfactant includes all of the dissolution / removal composition from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal base material. 0.001% by mass or more is preferable with respect to the mass, 0.005% by mass or more is more preferable, 0.01% by mass or more is more preferable, 10% by mass or less is preferable, and 5% by mass or less is more preferable. 2 mass% or less is still more preferable. Considering the above, the blending amount of the (C) nonionic surfactant is preferably 0.001% by mass or more and 10% by mass or less, and 0.005% by mass or more and 5% by mass or less with respect to the total mass of the dissolution composition. More preferably, it is 0.01% by mass or more and 2% by mass or less.
本発明に係る溶解除去組成物においては、（Ｄ）チオ尿素類の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、溶解除去組成物の全質量に対して、０．００１質量％以上が好ましく、０．０１質量％以上がより好ましく、０．０３質量％以上が更に好ましく、また２５質量％以下が好ましく、１０質量％以下がより好ましく、５質量％以下が更に好ましい。以上を考慮すると、（Ｄ）チオ尿素類の配合量としては、溶解除去組成物の全質量に対して、０．００１質量％以上２５質量％以下が好ましく、０．０１質量％以上１０質量％以下がより好ましく、０．０３質量％以上５質量％以下が更に好ましい。 In the dissolution / removal composition according to the present invention, the blending amount of (D) thioureas is the total mass of the dissolution / removal composition from the viewpoint of removing scales containing metal oxides and inhibiting corrosion of the metal base material. On the other hand, 0.001% by mass or more is preferable, 0.01% by mass or more is more preferable, 0.03% by mass or more is further preferable, 25% by mass or less is preferable, 10% by mass or less is more preferable, and 5% by mass. % Or less is more preferable. Considering the above, the blending amount of (D) thioureas is preferably 0.001% by mass or more and 25% by mass or less, and 0.01% by mass or more and 10% by mass with respect to the total mass of the dissolution composition. The following is more preferable, and 0.03 mass% or more and 5 mass% or less is still more preferable.
本発明に係る溶解除去組成物においては、（Ｅ）硫黄系還元剤の配合量としては、金属酸化物を含むスケールの除去及び金属母材の腐食抑制の観点から、溶解除去組成物の全質量に対して、０．０００１質量％以上が好ましく、０．０１質量％以上がより好ましく、０．０３質量％以上が更に好ましく、また２５質量％以下が好ましく、１０質量％以下がより好ましく、５質量％以下が更に好ましい。以上を考慮すると、（Ｅ）硫黄系還元剤の配合量としては、溶解除去組成物の全質量に対して、０．０００１質量％以上２５質量％以下が好ましく、０．０１質量％以上１０質量％以下がより好ましく、０．０３質量％以上５質量％以下が更に好ましい。 In the dissolution / removal composition according to the present invention, the total amount of the dissolution / removal composition is (E) from the viewpoint of removal of scales containing metal oxides and suppression of corrosion of the metal base material. Is preferably 0.0001% by mass or more, more preferably 0.01% by mass or more, still more preferably 0.03% by mass or more, more preferably 25% by mass or less, and even more preferably 10% by mass or less. A mass% or less is more preferable. Considering the above, the amount of (E) sulfur-based reducing agent is preferably 0.0001% by mass or more and 25% by mass or less, and 0.01% by mass or more and 10% by mass with respect to the total mass of the dissolution composition. % Or less is more preferable, and 0.03 mass% or more and 5 mass% or less is still more preferable.
（溶解除去組成物の製造方法）
次に、本発明に係る溶解除去組成物の製造方法について説明する。本発明に係る溶解除去組成物の製造方法に特に制限はない。上記溶解除去組成物の製造方法としては、例えば、純水又は蒸留水などの水に溶解除去剤、両性界面活性剤、及び非イオン界面活性剤などの各成分を室温にて順次添加して混合し、水酸化カリウムなどを添加してｐＨを例えば、３〜８の範囲に調整することにより製造することができる。また、本発明に係る溶解除去組成物は、ボイラに水を供給しながら、供給配管の一部に各成分を順次添加して混合することにより、調製することもできる。なお、本発明に係る溶解除去組成物は、窒素雰囲気下で用いることができ、大気雰囲気下で製造することもできる。
(Method for producing dissolved removal composition)
Next, the manufacturing method of the dissolution removal composition concerning this invention is demonstrated. There is no restriction | limiting in particular in the manufacturing method of the melt | dissolution removal composition which concerns on this invention. As a method for producing the dissolution removal composition, for example, components such as a dissolution removal agent, an amphoteric surfactant, and a nonionic surfactant are sequentially added to water such as pure water or distilled water and mixed at room temperature. And it can manufacture by adding potassium hydroxide etc. and adjusting pH to the range of 3-8, for example. Moreover, the dissolution removal composition according to the present invention can also be prepared by sequentially adding and mixing each component to a part of the supply pipe while supplying water to the boiler. In addition, the dissolution removal composition concerning this invention can be used in nitrogen atmosphere, and can also be manufactured under air atmosphere.
以上説明したように、本発明に係る溶解除去組成物によれば、（Ｂ）両性界面活性剤及び（Ｃ）非イオン界面活性剤を含有するので、スケールの表面への被膜の形成を防ぎつつ、配管などの金属母材に被膜を形成することが可能になるので、（Ａ）溶解除去剤によるスケールの除去性能の低下を防ぎつつ、金属母材の腐食を防ぐことが可能になると推定される。これにより、優れた錆及びスケールの溶解除去性能が得られると共に、金属母材の腐食を大幅に抑制することが可能となる。 As described above, according to the dissolution and removal composition according to the present invention, since it contains (B) an amphoteric surfactant and (C) a nonionic surfactant, it prevents formation of a film on the surface of the scale. Since it becomes possible to form a coating on a metal base material such as a pipe, it is estimated that (A) corrosion of the metal base material can be prevented while preventing a reduction in scale removal performance by the dissolution remover. The As a result, excellent rust and scale dissolution / removal performance can be obtained, and corrosion of the metal base material can be significantly suppressed.
また、本発明に係る溶解除去組成物によれば、（Ａ）溶解除去剤、（Ｂ）両性界面活性剤及び（Ｃ）非イオン界面活性剤を混合するだけでスケールなどの溶解除去性能に優れた溶解除去組成物を調整できるので、溶解除去組成物のハンドリングが容易になる。さらに、従来のスケール溶解組成物では、腐食量が大きい両性金属を金属母材とする配管などに用いる場合であっても、金属母材の腐食量を著しく低減できる。さらに、本発明に係る溶解除去組成物によれば、金属母材の腐食を低減できるので、水素ガスなどの発生を防ぐこともできる。また、本発明に係る溶解除去組成物によれば、金属鉄などの粉末などを共存させずにスケールを除去することが可能となる。 Moreover, according to the dissolution removal composition according to the present invention, it is excellent in dissolution removal performance such as scale by simply mixing (A) dissolution removal agent, (B) amphoteric surfactant and (C) nonionic surfactant. Since the dissolved and removed composition can be adjusted, the dissolved and removed composition can be easily handled. Furthermore, in the conventional scale-dissolving composition, the amount of corrosion of the metal base material can be remarkably reduced even when it is used for piping using an amphoteric metal having a large amount of corrosion as a metal base material. Furthermore, according to the dissolution and removal composition according to the present invention, the corrosion of the metal base material can be reduced, so that generation of hydrogen gas and the like can be prevented. Moreover, according to the dissolution removal composition according to the present invention, scale can be removed without coexisting powders such as metallic iron.
以下、本発明の効果を明確にするために行った実施例に基づいて本発明をより詳細に説明する。なお、本発明は、以下の実施例及び比較例によって何ら制限されるものではない。 Hereinafter, the present invention will be described in more detail based on examples made to clarify the effects of the present invention. In addition, this invention is not restrict | limited at all by the following Examples and Comparative Examples.
下記表１及び下記表２で用いた各成分について以下に示す。
溶解除去剤Ａ：１−ヒドロキシエタン−１，１−ジホスホン酸
溶解除去剤Ｂ：エチレンジアミン四酢酸
両性界面活性剤Ａ：２−ヤシアルキル−１−カルボキシメチル−１−ヒドロキシエチル−４，５−ジヒドロイミダゾリニウムハイドロオキサイド
両性界面活性剤Ｂ：β−ヤシアルキルアミノプロピオン酸ナトリウム
非イオン界面活性剤Ａ：ポリエチレンアルキレングリコールモノオレイン酸エステル
非イオン界面活性剤Ｂ：ポリオキシアルキレンオレイルエーテル
チオ尿素類Ａ：グアニルチオ尿素
チオ尿素類Ｂ：チオ尿素
硫黄系還元剤Ａ：亜ジチオン酸ナトリウム
硫黄系還元剤Ｂ：二酸化チオ尿素
添加剤：塩酸洗浄用インヒビター（イビットＮｏ．２Ｓ）
The components used in Table 1 and Table 2 below are shown below.
Dissolving agent A: 1-hydroxyethane-1,1-diphosphonic acid Dissolving agent B: ethylenediaminetetraacetic acid amphoteric surfactant A: 2-cocoalkyl-1-carboxymethyl-1-hydroxyethyl-4,5-dihydroimidazo Linium hydroxide Amphoteric surfactant B: Sodium β-coconut alkylaminopropionate Nonionic surfactant A: Polyethylene alkylene glycol monooleate Nonionic surfactant B: Polyoxyalkylene oleyl ether Thioureas A: Guanylthio Urea Thioureas B: Thiourea Sulfur-based reducing agent A: Sodium dithionite Sulfur-based reducing agent B: Thiourea dioxide Additive: Inhibitor for hydrochloric acid washing (Ibit No. 2S)
まず、本発明者らは、上記実施の形態に係る溶解除去組成物の各成分の配合を種々変更し、マグネタイトスケールの除去についての試験雰囲気、及び試験温度と腐食減量、及び洗浄阻害性との関係について調べた。なお、洗浄阻害性は、比較例１及び比較例２を基準として評価した。以下、本発明者らが調べた内容について詳細に説明する。 First, the present inventors variously changed the composition of each component of the dissolution and removal composition according to the above-described embodiment to determine the test atmosphere for removing the magnetite scale, the test temperature, the corrosion weight loss, and the cleaning inhibition property. I investigated the relationship. In addition, washing | cleaning inhibition property was evaluated on the basis of the comparative example 1 and the comparative example 2. FIG. Hereinafter, the contents investigated by the present inventors will be described in detail.
＜マグネタイト除去についての評価＞
セパラブルフラスコに撹拌子を入れた後、撹拌しながら蒸留水に、（Ａ）溶解除去剤、（Ｂ）両性界面活性剤、（Ｃ）非イオン界面活性剤、（Ｄ）チオ尿素、及び（Ｅ）硫黄系還元剤などを順次添加して混合した後、セパラブルフラスコを恒温水槽で所定温度に保持した状態でｐＨ調整剤を滴下してｐＨを６（ｐＨ４〜８であればよい）に調整して溶解除去組成物を調製した。次に、マグネタイト粉末１．５ｇを添加して所定時間後にスルホサリチル酸比色法により溶解鉄濃度を５０時間分析した。その後、残渣物をグラスフィルターで吸引濾過してデシケータ内で乾燥した後、残渣物の重量を測定し、マグネタイト粉末の残量を求めた。溶解開始時間は、溶解鉄濃度が検出下限を超えた時間とし、溶解完了時間は、溶解鉄濃度が３０００ｍｇ／Ｌを超えた時間とした。３０００ｍｇ（溶解完了時間−溶解開始時間）を溶解速度（ｍｇ ａｓ Ｆｅ／Ｌ／Ｈ）とした。
<Evaluation of magnetite removal>
After adding a stirring bar to the separable flask, (A) a dissolution remover, (B) an amphoteric surfactant, (C) a nonionic surfactant, (D) thiourea, and ( E) Sulfur-based reducing agent and the like are sequentially added and mixed, and then a pH adjuster is dropped while maintaining the separable flask at a predetermined temperature in a constant temperature water bath to adjust the pH to 6 (which may be pH 4 to 8). A dissolution removal composition was prepared by adjusting. Next, 1.5 g of magnetite powder was added, and the dissolved iron concentration was analyzed for 50 hours by a sulfosalicylic acid colorimetric method after a predetermined time. Thereafter, the residue was suction filtered through a glass filter and dried in a desiccator, and then the weight of the residue was measured to determine the remaining amount of magnetite powder. The dissolution start time was the time when the dissolved iron concentration exceeded the detection lower limit, and the dissolution completion time was the time when the dissolved iron concentration exceeded 3000 mg / L. 3000 mg (dissolution completion time-dissolution start time) was defined as the dissolution rate (mg as Fe / L / H).
（実施例１）
（Ａ）溶解除去剤として溶解除去剤Ａが３．６質量％、（Ｂ）両性界面活性剤として両性界面活性剤Ａが０．１質量％、（Ｃ）非イオン界面活性剤として非イオン界面活性剤Ａが０．１質量％、（Ｄ）チオ尿素類としてチオ尿素類Ａが０．０２質量％、（Ｅ）硫黄系還元剤として硫黄系還元剤Ａが０．０５質量％となるように各成分を配合して室温で１０分間撹拌して溶解除去組成物を調製した。その後、窒素雰囲気下、２５℃にて腐食減量を評価した。各成分の配合量及び評価結果を下記表１に示す。
Example 1
(A) 3.6% by mass of dissolution / removal agent A as the dissolution / removal agent, (B) 0.1% by mass of amphoteric surfactant A as the amphoteric surfactant, (C) nonionic interface as nonionic surfactant The activator A is 0.1% by mass, (D) the thioureas A is 0.02% by mass as the thioureas, and (E) the sulfur-based reducing agent A is 0.05% by mass as the sulfur-based reducing agent. Each component was blended and stirred at room temperature for 10 minutes to prepare a dissolution removal composition. Thereafter, corrosion weight loss was evaluated at 25 ° C. in a nitrogen atmosphere. Table 1 below shows the blending amount of each component and the evaluation results.
（実施例２）
窒素雰囲気下、５０℃にて腐食減量を評価したこと以外は、実施例１と同様にして溶解除去組成物を作製して評価した。各成分の配合量及び評価結果を下記表１に併記する。
(Example 2)
A dissolution removal composition was prepared and evaluated in the same manner as in Example 1 except that the corrosion weight loss was evaluated at 50 ° C. in a nitrogen atmosphere. The amount of each component and the evaluation results are also shown in Table 1 below.
（実施例３）
大気雰囲気下、５０℃にて腐食減量を評価したこと以外は、実施例２と同様にして溶解除去組成物を作製して評価した。各成分の配合量及び評価結果を下記表１に併記する。
(Example 3)
A dissolution removal composition was prepared and evaluated in the same manner as in Example 2 except that the corrosion weight loss was evaluated at 50 ° C. in an air atmosphere. The amount of each component and the evaluation results are also shown in Table 1 below.
（実施例４）
チオ尿素類Ａを用いなかったこと以外は実施例１と同様にして溶解除去組成物を作製して評価した。各成分の配合量及び評価結果を下記表１に併記する。
Example 4
A dissolution removal composition was prepared and evaluated in the same manner as in Example 1 except that thioureas A was not used. The amount of each component and the evaluation results are also shown in Table 1 below.
（実施例５）
両性界面活性剤Ａ及び非イオン界面活性剤Ａを０．０４質量％となるようにしたこと以外は、実施例４と同様にして溶解除去組成物を作製して評価した。各成分の配合量及び評価結果を下記表１に併記する。
(Example 5)
A dissolution removal composition was prepared and evaluated in the same manner as in Example 4 except that the amphoteric surfactant A and the nonionic surfactant A were 0.04% by mass. The amount of each component and the evaluation results are also shown in Table 1 below.
（実施例６）
５０℃にて腐食減量を評価したこと以外は、実施例４と同様にして溶解除去組成物を作製して評価した。各成分の配合量及び評価結果を下記表１に併記する。
(Example 6)
A dissolution removal composition was prepared and evaluated in the same manner as in Example 4 except that the corrosion weight loss was evaluated at 50 ° C. The amount of each component and the evaluation results are also shown in Table 1 below.
（実施例７）
大気雰囲気下にて腐食減量を評価したこと以外は、実施例４と同様にして溶解除去組成物を作製して評価した。各成分の配合量及び評価結果を下記表１に併記する。
(Example 7)
A dissolution removal composition was prepared and evaluated in the same manner as in Example 4 except that the corrosion weight loss was evaluated in an air atmosphere. The amount of each component and the evaluation results are also shown in Table 1 below.
（実施例８）
亜ジチオン酸ナトリウムに代えて二酸化チオ尿素を０．５質量％用いたこと以外は実施例７と同様にして溶解除去組成物を作製して評価した。各成分の配合量及び評価結果を下記表１に併記する。
(Example 8)
A dissolution removal composition was prepared and evaluated in the same manner as in Example 7 except that 0.5% by mass of thiourea dioxide was used in place of sodium dithionite. The amount of each component and the evaluation results are also shown in Table 1 below.
（比較例１）
両性界面活性剤Ａ及び非イオン界面活性剤Ａを用いなかったこと、イビットＮｏ．２Ｓを０．５質量％用いたこと、及び窒素雰囲気下にて腐食減量を評価したこと以外は実施例８と同様にして溶解除去組成物を作製して評価した。各成分の配合量及び評価結果を下記表１に併記する。
(Comparative Example 1)
Neither amphoteric surfactant A nor nonionic surfactant A was used. A dissolution removal composition was prepared and evaluated in the same manner as in Example 8 except that 0.5 mass% of 2S was used and corrosion weight loss was evaluated under a nitrogen atmosphere. The amount of each component and the evaluation results are also shown in Table 1 below.
（比較例２）
二酸化チオ尿素に代えて両性界面活性剤Ａを０．１質量％用いたこと、及びイビットＮｏ．２Ｓに代えてアスコルビン酸を０．５質量％用いたこと以外は比較例１と同様にして溶解除去組成物を作製して評価した。各成分お配合量及び評価結果を下記表１に併記する。
(Comparative Example 2)
0.1% by weight of amphoteric surfactant A was used instead of thiourea dioxide, and A dissolution removal composition was prepared and evaluated in the same manner as in Comparative Example 1 except that 0.5% by mass of ascorbic acid was used in place of 2S. The amount of each component and the evaluation results are also shown in Table 1 below.
（比較例３）
アスコルビン酸に代えて二酸化チオ尿素を０．５質量％用いたこと以外は比較例２と同様にして溶解除去組成物を作製して評価した。各成分お配合量及び評価結果を下記表１に併記する。
(Comparative Example 3)
A dissolution removal composition was prepared and evaluated in the same manner as in Comparative Example 2 except that 0.5% by mass of thiourea dioxide was used in place of ascorbic acid. The amount of each component and the evaluation results are also shown in Table 1 below.
（比較例４）
二酸化チオ尿素に代えて亜ジチオン酸ナトリウムを０．０５質量％用いたこと、及び腐食減量を５０℃にて評価したこと以外は比較例３と同様にして溶解除去組成物を作製して評価した。各成分お配合量及び評価結果を下記表１に併記する。
(Comparative Example 4)
A dissolution removal composition was prepared and evaluated in the same manner as in Comparative Example 3 except that 0.05% by mass of sodium dithionite was used in place of thiourea dioxide and the corrosion weight loss was evaluated at 50 ° C. . The amount of each component and the evaluation results are also shown in Table 1 below.
表１から分かるように、本発明に係る溶解除去組成物によれば、（Ａ）溶解除去剤、（Ｂ）両性界面活性剤、及び（Ｃ）非イオン界面活性剤を含むので、洗浄時間が短縮されると共に、マグネタイトスケールに対する洗浄阻害性が悪化することなく、金属母材の腐食減量を１００ｍｄｄ（ｍｇ／ｄｍ２／ｄａｙ）以下に低減することができる（実施例１〜実施例８）。これに対して、（Ｂ）両性界面活性剤及び（Ｃ）非イオン界面活性剤をいずれも含まない場合（比較例１）、（Ｃ）非イオン界面活性剤を含まない場合（比較例２〜比較例５）はいずれも腐食減量が著しく増大することが分かる。この結果は、上述したように、（Ｂ）両性界面活性剤及び（Ｃ）非イオン界面活性剤による金属母材の腐食抑制効果が十分に得られなかったためと考えられる。 As can be seen from Table 1, the dissolution and removal composition according to the present invention includes (A) a dissolution and removal agent, (B) an amphoteric surfactant, and (C) a nonionic surfactant. In addition to being shortened, the corrosion weight loss of the metal base material can be reduced to 100 mdd (mg / dm2 / day) or less without deteriorating the cleaning inhibition on the magnetite scale (Examples 1 to 8). On the other hand, when (B) an amphoteric surfactant and (C) a nonionic surfactant are not included (Comparative Example 1), (C) when a nonionic surfactant is not included (Comparative Examples 2 to 2) It can be seen that all of Comparative Examples 5) significantly increase the corrosion weight loss. This result is considered to be because the corrosion inhibiting effect of the metal base material by (B) amphoteric surfactant and (C) nonionic surfactant was not sufficiently obtained as described above.
次に、本発明者らは、上記実施の形態に係る溶解除去組成物の各成分の配合を種々変更し、錆除去ついての試験雰囲気、及び試験温度と腐食減量、及び洗浄阻害性との関係について調べた。以下、本発明者らが調べた内容について詳細に説明する。 Next, the present inventors variously changed the composition of each component of the dissolution removal composition according to the above embodiment, the test atmosphere for rust removal, and the relationship between test temperature and corrosion weight loss, and cleaning inhibition Investigated about. Hereinafter, the contents investigated by the present inventors will be described in detail.
＜錆除去評価＞
各成分を配合して調整した溶解除去組成物をガラス瓶に投入し、錆無テストピース（ＳＵＳ４００ ３５ｍｍ×４５ｍｍ×１．６ｍｍ ＃４００研磨後トルエンアセトン洗浄品）と錆有テストピース（錆無テストピースを屋外に３か月間放置して一定量の錆が放置したもの）を浸漬して錆有テストピースから錆が完全に除去されるまでの時間と、上述した評価方法に基づく錆有テストピースの腐食減量から錆洗浄阻害性及び腐食抑制性能を評価した。
<Rust removal evaluation>
The dissolution removal composition prepared by blending each component was put into a glass bottle, and a rust-free test piece (SUS400 35 mm × 45 mm × 1.6 mm # 400 polished tolueneacetone washed product) and a rust-free test piece (rust-free test piece) For a period of 3 months after standing for a certain amount of rust), the time until the rust is completely removed from the rusted test piece and the rusted test piece based on the evaluation method described above. Rust washing inhibition and corrosion inhibition performance were evaluated from corrosion weight loss.
（実施例１１）
（Ａ）溶解除去剤として溶解除去剤Ａが５質量％、（Ｂ）両性界面活性剤として両性界面活性剤Ａが０．１質量％、（Ｃ）非イオン界面活性剤として非イオン界面活性剤Ａが０．１質量％、（Ｄ）チオ尿素類としてチオ尿素類Ａが０．０２質量％となるように各成分を配合して、ｐＨ調整剤を滴下してｐＨを５．５（ｐＨ４〜８であればよい）に調整して室温で１０分間撹拌して溶解除去組成物を調製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 11)
(A) 5% by mass of the dissolution / removal agent A as the dissolution / removal agent, (B) 0.1% by mass of the amphoteric surfactant A as the amphoteric surfactant, (C) a nonionic surfactant as the nonionic surfactant Each component is blended so that A is 0.1% by mass, and (D) thioureas A is 0.02% by mass, and a pH adjuster is added dropwise to adjust the pH to 5.5 (pH 4). The dissolution removal composition was prepared by stirring at room temperature for 10 minutes. The amount of each component and the evaluation results are shown in Table 2 below.
（実施例１２）
チオ尿素類Ａに代えてチオ尿素類Ｂを０．１質量％用いたこと以外は実施例１１と同様にして溶解除去組成物を作製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 12)
A dissolution removal composition was prepared in the same manner as in Example 11 except that 0.1% by mass of thiourea B was used in place of thiourea A. The amount of each component and the evaluation results are shown in Table 2 below.
（実施例１３）
チオ尿素類Ａに代えてチオ尿素類Ｃを０．０２質量％用いたこと以外は実施例１１と同様にして溶解除去組成物を作製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 13)
A dissolution removal composition was prepared in the same manner as in Example 11 except that 0.02% by mass of thiourea C was used instead of thiourea A. The amount of each component and the evaluation results are shown in Table 2 below.
（実施例１４）
チオ尿素類Ａに代えて硫黄還元剤を０．１質量％用いたこと以外は実施例１１と同様にして溶解除去組成物を作製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 14)
A dissolution removal composition was prepared in the same manner as in Example 11 except that 0.1% by mass of the sulfur reducing agent was used in place of the thioureas A. The amount of each component and the evaluation results are shown in Table 2 below.
（実施例１５）
両性界面活性剤Ａに代えて両性界面活性剤Ｂを０．１質量％用いたこと以外は実施例１４と同様にして溶解除去組成物を作製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 15)
A dissolution removal composition was prepared in the same manner as in Example 14 except that 0.1% by mass of amphoteric surfactant B was used in place of amphoteric surfactant A. The amount of each component and the evaluation results are shown in Table 2 below.
（実施例１６）
両性界面活性剤Ａを２５質量％用いたこと以外は実施例１４と同様にして溶解除去組成物を作製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 16)
A dissolution removal composition was prepared in the same manner as in Example 14 except that 25% by mass of amphoteric surfactant A was used. The amount of each component and the evaluation results are shown in Table 2 below.
（実施例１７）
非イオン界面活性剤Ａを１５質量％用いたこと以外は実施例１４と同様にして溶解除去組成物を作製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 17)
A dissolution removal composition was prepared in the same manner as in Example 14 except that 15% by mass of nonionic surfactant A was used. The amount of each component and the evaluation results are shown in Table 2 below.
（実施例１８）
溶解除去剤Ａに代えて溶解除去剤Ｂを５質量％用いたこと以外は実施例１４と同様にして溶解除去組成物を作製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 18)
A dissolution / removal composition was prepared in the same manner as in Example 14 except that 5% by mass of the dissolution / removal agent B was used in place of the dissolution / removal agent A. The amount of each component and the evaluation results are shown in Table 2 below.
（実施例１９）
非イオン界面活性剤Ａに代えて非イオン界面活性剤Ｂを０．１質量％用いたこと以外は実施例１４同様にして溶解除去組成物を作製した。各成分の配合量及び評価結果を下記表２に示す。
(Example 19)
A dissolution removal composition was prepared in the same manner as in Example 14 except that 0.1% by mass of nonionic surfactant B was used in place of nonionic surfactant A. The amount of each component and the evaluation results are shown in Table 2 below.
（比較例１１）
両性界面活性剤Ａ、非イオン界面活性剤Ａ、及びチオ尿素類Ａを用いなかったこと以外は実施例１１と同様にして溶解除去組成物を調製した。各成分の配合量及び評価結果を下記表２に示す。
(Comparative Example 11)
A dissolution removal composition was prepared in the same manner as in Example 11 except that the amphoteric surfactant A, nonionic surfactant A, and thioureas A were not used. The amount of each component and the evaluation results are shown in Table 2 below.
（比較例１２）
溶解除去剤Ａに代えて溶解除去剤Ｂを５質量％用いたこと以外は、比較例１１と同様にして溶解除去組成物を調製した。各成分の配合量及び評価結果を下記表２に示す。
(Comparative Example 12)
A dissolution / removal composition was prepared in the same manner as in Comparative Example 11 except that 5% by mass of the dissolution / removal agent B was used in place of the dissolution / removal agent A. The amount of each component and the evaluation results are shown in Table 2 below.
（比較例１３）
クエン酸を３質量％及びチオグリコール酸を０．５質量％用いたこと以外は、比較例１１と同様にして溶解除去組成物を調製した。各成分の配合量及び評価結果を下記表２に示す。
(Comparative Example 13)
A dissolution removal composition was prepared in the same manner as in Comparative Example 11 except that 3% by mass of citric acid and 0.5% by mass of thioglycolic acid were used. The amount of each component and the evaluation results are shown in Table 2 below.
（比較例１４）
溶解除去剤Ａを用いなかったこと以外は、実施例１４と同様にして溶解除去組成物を調製した。各成分の配合量及び評価結果を下記表２に示す。
(Comparative Example 14)
A dissolution / removal composition was prepared in the same manner as in Example 14 except that the dissolution / removal agent A was not used. The amount of each component and the evaluation results are shown in Table 2 below.
（比較例１５）
両性界面活性剤Ａを用いなかったこと以外は、実施例１４と同様にして溶解除去組成物を調製した。各成分の配合量及び評価結果を下記表２に示す。
(Comparative Example 15)
A dissolution removal composition was prepared in the same manner as in Example 14 except that the amphoteric surfactant A was not used. The amount of each component and the evaluation results are shown in Table 2 below.
（比較例１６）
非イオン界面活性剤Ａを用いなかったこと以外は、実施例１４と同様にして溶解除去組成物を調製した。各成分の配合量及び評価結果を下記表２に示す。
(Comparative Example 16)
A dissolution removal composition was prepared in the same manner as in Example 14 except that the nonionic surfactant A was not used. The amount of each component and the evaluation results are shown in Table 2 below.
表２から分かるように、本発明に係る溶解除去組成物によれば、（Ａ）溶解除去剤、（Ｂ）両性界面活性剤、及び（Ｃ）非イオン界面活性剤を含むので、腐食減量を５０ｍｄｄ（ｍｇ／ｄｍ２／ｄａｙ）以下に低減することができる（実施例１１〜実施例１９）。これに対して、（Ｂ）両性界面活性剤及び（Ｃ）非イオン界面活性剤をいずれも含まない場合（比較例１１〜比較例１３）、（Ｂ）両性界面活性剤を含まない場合（比較例１５）及び（Ｃ）非イオン界面活性剤を含まない場合（比較例１６）には、腐食減量が著しく増大することが分かる。これらの結果は、上述したように、（Ｂ）両性界面活性剤及び（Ｃ）非イオン界面活性剤による金属母材の腐食抑制効果が十分に得られなかったためと考えられる。また、（Ａ）溶解除去剤を含まない場合には、洗浄効果が著しく減少することが分かる。 As can be seen from Table 2, the dissolution removal composition according to the present invention includes (A) a dissolution removal agent, (B) an amphoteric surfactant, and (C) a nonionic surfactant. It can be reduced to 50 mdd (mg / dm 2 / day) or less (Example 11 to Example 19). In contrast, when (B) the amphoteric surfactant and (C) the nonionic surfactant are not included (Comparative Examples 11 to 13), (B) when the amphoteric surfactant is not included (Comparison) It can be seen that the weight loss on corrosion increases significantly when Example 15) and (C) no ionic surfactant is included (Comparative Example 16). These results are considered to be because the corrosion inhibitory effect of the metal base material by (B) amphoteric surfactant and (C) nonionic surfactant was not sufficiently obtained as described above. It can also be seen that (A) when no dissolution remover is included, the cleaning effect is significantly reduced.
１１ 両性界面活性剤
１２ 金属配管
１３、１３ａ スケール
１４ 溶解除去剤
１５ 非イオン界面活性剤
11
Claims (7)
（Ｂ）下記式（１）で表される化合物、下記一般式（２）で表される化合物及び下記一般式（３）で表される化合物からなる群から選択された少なくとも１種を含む両性界面活性剤と、
（Ｃ）ＨＬＢ値が３〜１８の脂肪酸エステル類及びポリオキシアルキレンアルキルエーテルからなる群から選択された少なくとも１種を含む非イオン界面活性剤と、
（Ｄ）チオ尿素類、並びに、（Ｅ）亜硫酸類、亜硫酸水素類、ピロ亜硫酸類、チオ硫酸類、亜ジチオン酸類、チオン酸類、ポリチオン酸類及び二酸化チオ尿素からなる群から選択された少なくとも１種を含む硫黄系還元剤の少なくとも１種と、を含むことを特徴とする、溶解除去組成物。
(B) Amphoteric including at least one selected from the group consisting of a compound represented by the following formula (1), a compound represented by the following general formula (2) and a compound represented by the following general formula (3) A surfactant ,
(C) a nonionic surfactant containing at least one having an HLB value is selected from the group consisting of fatty acid esters and polyoxyalkylene alkyl ethers having 3 to 18,
(D) thioureas, and (E) at least one selected from the group consisting of sulfites, hydrogen sulfites, pyrosulfites, thiosulfates, dithionites, thionates, polythionates, and thiourea dioxide And a sulfur-based reducing agent containing at least one kind .
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