JP6064928B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6064928B2 JP6064928B2 JP2014024988A JP2014024988A JP6064928B2 JP 6064928 B2 JP6064928 B2 JP 6064928B2 JP 2014024988 A JP2014024988 A JP 2014024988A JP 2014024988 A JP2014024988 A JP 2014024988A JP 6064928 B2 JP6064928 B2 JP 6064928B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- insulating film
- coating
- semiconductor chip
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
11;第1絶縁膜
12;第2絶縁膜
13;第1被膜
14;第2被膜
15;接続膜
21;第1リードフレーム
22;第2リードフレーム
23;共通リードフレーム
31;第1半導体チップ
32;第2半導体チップ
40;封止樹脂
51;第2対向面
52;第2対向面
61;はんだ
62;スペーサー
71;端部
72;端部
73;中央部
74;中央部
81;離型剤
101;側面
102;上面
103;下面
106;側面
107;上面
108;下面
112;上面
113;下面
Claims (1)
- 隣り合う位置に配置された第1半導体チップ及び第2半導体チップと、
前記第1半導体チップの上に配置された第1リードフレームと、
前記第2半導体チップの上に配置され、前記第1リードフレームと隣り合う位置に配置された第2リードフレームと、
前記第2リードフレームと向かい合う前記第1リードフレームの側面を被覆する第1絶縁膜と、
前記第1リードフレームと向かい合う前記第2リードフレームの側面を被覆する第2絶縁膜と、
前記第1絶縁膜を被覆する第1被膜と、
前記第2絶縁膜を被覆する第2被膜と、
前記第1半導体チップおよび前記第2半導体チップを封止すると共に前記第1リードフレームと前記第2リードフレームの間に充填され、互いに向かい合う前記第1被膜及び前記第2被膜に密着する封止樹脂と、を備える、半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014024988A JP6064928B2 (ja) | 2014-02-13 | 2014-02-13 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014024988A JP6064928B2 (ja) | 2014-02-13 | 2014-02-13 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015153838A JP2015153838A (ja) | 2015-08-24 |
JP6064928B2 true JP6064928B2 (ja) | 2017-01-25 |
Family
ID=53895820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014024988A Expired - Fee Related JP6064928B2 (ja) | 2014-02-13 | 2014-02-13 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6064928B2 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06134802A (ja) * | 1992-10-28 | 1994-05-17 | Hitachi Cable Ltd | 射出成形品 |
US6368899B1 (en) * | 2000-03-08 | 2002-04-09 | Maxwell Electronic Components Group, Inc. | Electronic device packaging |
JP3807354B2 (ja) * | 2001-08-06 | 2006-08-09 | 株式会社デンソー | 半導体装置 |
JP5267021B2 (ja) * | 2008-09-30 | 2013-08-21 | 株式会社デンソー | 半導体装置およびそれを用いたインバータ回路 |
JP6127837B2 (ja) * | 2013-08-30 | 2017-05-17 | 株式会社デンソー | 半導体装置 |
-
2014
- 2014-02-13 JP JP2014024988A patent/JP6064928B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2015153838A (ja) | 2015-08-24 |
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