JP6053821B2 - 超伝導回路用の低温抵抗体 - Google Patents
超伝導回路用の低温抵抗体 Download PDFInfo
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- JP6053821B2 JP6053821B2 JP2014549171A JP2014549171A JP6053821B2 JP 6053821 B2 JP6053821 B2 JP 6053821B2 JP 2014549171 A JP2014549171 A JP 2014549171A JP 2014549171 A JP2014549171 A JP 2014549171A JP 6053821 B2 JP6053821 B2 JP 6053821B2
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- titanium
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- 239000000463 material Substances 0.000 claims description 75
- 239000000956 alloy Substances 0.000 claims description 31
- 229910045601 alloy Inorganic materials 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 24
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- 239000010937 tungsten Substances 0.000 claims description 14
- 239000010936 titanium Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 229910052723 transition metal Inorganic materials 0.000 claims description 12
- 150000003624 transition metals Chemical class 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 229910052721 tungsten Inorganic materials 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 7
- 238000001020 plasma etching Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- 229910001080 W alloy Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 239000010955 niobium Substances 0.000 claims description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 229910000687 transition metal group alloy Inorganic materials 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052702 rhenium Inorganic materials 0.000 claims description 3
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- -1 chlorine ions Chemical class 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000002887 superconductor Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910021387 carbon allotrope Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Semiconductor Integrated Circuits (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Description
Claims (13)
- 100ミリケルビン未満の温度で超伝導性である材料から形成された回路素子と、
前記回路素子に接続され、100ミリケルビン未満の温度で抵抗性である遷移金属の合
金から形成された抵抗体と、を備え、
前記合金を構成する前記遷移金属の原子比は、前記合金中の原子に対する価電子の数の
比が約5.35と約5.95の間であるように選択される、集積回路。 - 前記合金を構成する前記遷移金属は、チタン、バナジウム、ジルコニウム、ニオブ、モ
リブデン、ハフニウム、タングステン、タンタル、及びレニウムのうちの少なくとも2つ
から選択される、
請求項1に記載の集積回路。 - 前記合金はチタンとタングステンとの合金である、請求項2に記載の集積回路。
- 前記合金は、1のチタン原子に対して約5のタングステン原子の原子比を占める、
請求項3に記載の集積回路。 - 前記抵抗体は前記合金の薄膜として実装される、
請求項3に記載の集積回路。 - 絶縁基板上に100マイクロケルビン未満の温度で超伝導性である第1の材料層を堆積
する工程と、
遷移金属の合金から成る第2の材料層を堆積する工程と、
を含み、
前記合金は、100ミリケルビン未満の温度で抵抗性のままである、チタン、バナジウ
ム、ジルコニウム、ニオブ、モリブデン、ハフニウム、タングステン、タンタル、及びレ
ニウムのうちの少なくとも2つから成り、
前記第2の材料層は前記第1の材料層と接触しており、
前記合金を構成する前記遷移金属の原子比は、前記合金中の原子に対する価電子の数の比が約5.35と約5.95の間であるように選択される、超伝導回路の作成方法。 - 前記第1の材料層は前記第2の材料層に先だって堆積される、
請求項6に記載の方法。 - 前記第2の材料層は前記第1の材料層に先だって堆積される、
請求項6に記載の方法。 - 前記遷移金属の合金は、チタンの1原子に対してタングステンの約5原子の原子比を有
する、チタンとタングステンとの合金である、
請求項6に記載の方法 - さらに、アルゴンガス中で室温にて行われるスパッタリングプロセスによって前記第2
の材料層を堆積する工程を含む、
請求項6に記載の方法。 - さらに、フッ素系ガスでの反応性イオンエッチングプロセスによって前記第2の材料層
をエッチングする工程を含む、
請求項6に記載の方法。 - さらに、前記第1及び第2の材料層の上に絶縁材料層を堆積する工程を含む、
請求項6に記載の方法。 - 前記絶縁基板はシリコンウエハである、
請求項6に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/330,270 | 2011-12-19 | ||
US13/330,270 US8852959B2 (en) | 2011-12-19 | 2011-12-19 | Low temperature resistor for superconductor circuits |
PCT/US2012/070066 WO2013137959A2 (en) | 2011-12-19 | 2012-12-17 | Low temperature resistor for superconductor circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015506110A JP2015506110A (ja) | 2015-02-26 |
JP6053821B2 true JP6053821B2 (ja) | 2016-12-27 |
Family
ID=48610713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014549171A Active JP6053821B2 (ja) | 2011-12-19 | 2012-12-17 | 超伝導回路用の低温抵抗体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8852959B2 (ja) |
EP (1) | EP2795688B1 (ja) |
JP (1) | JP6053821B2 (ja) |
KR (1) | KR101696526B1 (ja) |
AU (1) | AU2012373211B2 (ja) |
CA (1) | CA2858087C (ja) |
WO (1) | WO2013137959A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7615385B2 (en) | 2006-09-20 | 2009-11-10 | Hypres, Inc | Double-masking technique for increasing fabrication yield in superconducting electronics |
US9745941B2 (en) | 2014-04-29 | 2017-08-29 | Ford Global Technologies, Llc | Tunable starter resistor |
US10468406B2 (en) | 2014-10-08 | 2019-11-05 | Northrop Grumman Systems Corporation | Integrated enhancement mode and depletion mode device structure and method of making the same |
EP3513434B1 (en) * | 2016-09-13 | 2022-04-13 | Google LLC | Reducing loss in stacked quantum devices |
US10936756B2 (en) * | 2017-01-20 | 2021-03-02 | Northrop Grumman Systems Corporation | Methodology for forming a resistive element in a superconducting structure |
US11522118B2 (en) * | 2020-01-09 | 2022-12-06 | Northrop Grumman Systems Corporation | Superconductor structure with normal metal connection to a resistor and method of making the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US3704391A (en) | 1970-11-10 | 1972-11-28 | Ite Imperial Corp | Cryogenic current limiting switch |
JPS59138390A (ja) | 1983-01-28 | 1984-08-08 | Hitachi Ltd | 超電導スイツチング装置 |
EP0282360B1 (en) | 1987-03-12 | 1995-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing components of superconducting ceramic oxide materials |
US5026682A (en) | 1987-04-13 | 1991-06-25 | International Business Machines Corporation | Devices using high Tc superconductors |
EP0303813B1 (en) | 1987-08-18 | 1994-10-12 | International Business Machines Corporation | High critical current superconductors |
NL8703039A (nl) | 1987-12-16 | 1989-07-17 | Philips Nv | Werkwijze voor het patroonmatig vervaardigen van een dunne laag uit een oxidisch supergeleidend materiaal. |
US5055158A (en) * | 1990-09-25 | 1991-10-08 | International Business Machines Corporation | Planarization of Josephson integrated circuit |
IT1249440B (it) | 1991-08-14 | 1995-02-23 | Ist Nazionale Fisica Nucleare | Metodo e dispositivo per la deposizione tramite spruzzamento catodico di films sottili superconduttori di niobio su cavita' risonanti a quarto d'onda in rame per l'accellerazione di ioni pesanti. |
US6051846A (en) * | 1993-04-01 | 2000-04-18 | The United States Of America As Represented By The Secretary Of The Navy | Monolithic integrated high-Tc superconductor-semiconductor structure |
JP2630240B2 (ja) * | 1993-12-28 | 1997-07-16 | 日本電気株式会社 | 超伝導集積回路用金属薄膜抵抗 |
JP3105746B2 (ja) * | 1994-09-12 | 2000-11-06 | 日本電気株式会社 | 超伝導集積回路の製造方法及び超伝導集積回路 |
US6468642B1 (en) | 1995-10-03 | 2002-10-22 | N.V. Bekaert S.A. | Fluorine-doped diamond-like coatings |
JPH09199484A (ja) * | 1996-01-19 | 1997-07-31 | Nippon Steel Corp | 半導体装置の製造方法 |
US5687112A (en) | 1996-04-19 | 1997-11-11 | Energy Conversion Devices, Inc. | Multibit single cell memory element having tapered contact |
US7075171B2 (en) | 2003-03-11 | 2006-07-11 | Fujitsu Limited | Superconducting system, superconducting circuit chip, and high-temperature superconducting junction device with a shunt resistor |
US7816303B2 (en) * | 2004-10-01 | 2010-10-19 | American Superconductor Corporation | Architecture for high temperature superconductor wire |
US7473999B2 (en) * | 2005-09-23 | 2009-01-06 | Megica Corporation | Semiconductor chip and process for forming the same |
US8852378B2 (en) | 2008-07-15 | 2014-10-07 | Corporation For National Research Initiatives | Tailorable titanium-tungsten alloy material thermally matched to semiconductor substrates and devices |
CN105914219B (zh) | 2009-02-27 | 2018-11-13 | D-波***公司 | 用于制造超导集成电路的***及方法 |
-
2011
- 2011-12-19 US US13/330,270 patent/US8852959B2/en active Active
-
2012
- 2012-12-17 JP JP2014549171A patent/JP6053821B2/ja active Active
- 2012-12-17 KR KR1020147020463A patent/KR101696526B1/ko active IP Right Grant
- 2012-12-17 EP EP12870932.6A patent/EP2795688B1/en active Active
- 2012-12-17 AU AU2012373211A patent/AU2012373211B2/en active Active
- 2012-12-17 CA CA2858087A patent/CA2858087C/en active Active
- 2012-12-17 WO PCT/US2012/070066 patent/WO2013137959A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2795688B1 (en) | 2017-06-14 |
WO2013137959A3 (en) | 2013-11-21 |
KR20140123498A (ko) | 2014-10-22 |
EP2795688A4 (en) | 2015-09-02 |
CA2858087A1 (en) | 2013-09-19 |
WO2013137959A2 (en) | 2013-09-19 |
EP2795688A2 (en) | 2014-10-29 |
AU2012373211A1 (en) | 2014-07-03 |
AU2012373211B2 (en) | 2015-05-28 |
KR101696526B1 (ko) | 2017-01-13 |
JP2015506110A (ja) | 2015-02-26 |
CA2858087C (en) | 2018-06-19 |
US8852959B2 (en) | 2014-10-07 |
US20130157864A1 (en) | 2013-06-20 |
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