JP6050782B2 - 低電力白熱ランプのledランプ交換 - Google Patents
低電力白熱ランプのledランプ交換 Download PDFInfo
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/006—Fastening of light sources or lamp holders of point-like light sources, e.g. incandescent or halogen lamps, with screw-threaded or bayonet base
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Microelectronics & Electronic Packaging (AREA)
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- Optics & Photonics (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Devices (AREA)
Description
1.低い最大LED接合部温度および熱散逸
LEDは、電圧降下VDと駆動電流IDとの積に等しい割合で熱を生成し、
発光効率は、光束(Lm)と印加電力(ワット)の比である。低電力白熱ランプの効率の典型的な値は次の通りである。
燃焼カンデラ 0.3
5W白熱 5
40W白熱 12
LEDの効率は過去数年にわたって改善されており、100Lm/Wを超えている。一
般に利用可能な電力LEDは85Lm/Wまで達することができる。しかし、これらの測定値は、25℃接合部温度および低減した駆動電流で取得されていることに留意されたい。
P=(I+K)×(V+ν)=(I+K)×V+(I+K)×ν
となることになり、ここで、第1項は電流のみの増加による電力の増加を表し、第2項は電流および電圧の増加による電力の増加を表す。
図4が示すように、LEDは半空間よりも少ない円錐で光を放出し、それが従来の「A」タイプランプで使用することを困難にしている。ヒートシンクに取り付けられ、球状シェルに配置される場合、光のうちのあるものはパッケージおよびレンズ材料によって吸収され、それによりシステム効率が低下することになる。LEDを「A」タイプランプで首尾よく実装するには、LEDを球体の中心まで持ち上げる必要があるが、これは熱散逸容量を低減する。
LEDは、定電流源電源を必要とする電流駆動デバイスである(図5)。図3が示すように、LEDによって反映される電圧は駆動電流の指数関数である。電源電圧がLED電圧と一致しなければならないので、LEDを電圧源によって駆動することができない。そうでなければ、電圧差を全回路抵抗で割ると、最大LED定格を容易に超え、デバイスを故障させることになる電流をもたらす。
5.調光能力
調光器はAC入力電圧を位相制御することによって光出力を制御する。しかし、定電流電源は、出力電流を一定に保つために入力電圧のいかなる変化も補償することになる。調光能力を可能にする特製電源がある。これらの電源は、RMS入力電圧に比例する出力電流を生成するように設計されている。そのような電源は、一般に、より複雑であり、より低い効率を示す。
未満の典型的な効率を有する。さらに、それらは、サージに出会う場合、故障しがちであり、特に、MOV(金属酸化物バリスタ)などのサージサプレッサが組み込まれていない場合、高電圧のスパイクがMOSFETスイッチを損傷することがある。
抵抗器の両端での電力消費は、PR=I2×R=2.6Wである。
システムの効率は、
明らかに、このシステムは利用できない。
別の解決策は、インダクタまたはコンデンサなどのエネルギーを消費しないインピーダンスでRを置き換えることである。コンデンサはインダクタよりもサイズおよび値において有効である。唯一の限定要因はコンデンサの両端の最大許容電圧降下である。しかし、この解決策では、LEDは調光することができず、回路基盤のサイズは、定格を線間電圧にマージンを加えたものにする必要があるACコンデンサの大きいサイズのために増大する。
新しい電力消費は、
PR=I2 LOADR=0.6W
である。
明らかに、これは十分に電源効率の許容範囲内にあり、それは浪費される電力のより多くを有用な電力に移すことによって達成される。
本発明の一形態では、ヒートシンクは基板の各側に少なくとも1つの伝導性ヒートアイランドを含み、第1の複数のLEDの各LEDは基板の一方の側のヒートアイランドに近接し、第2の複数のLEDの各LEDは基板の反対側のヒートアイランドに近接する。ヒートシンクは少なくとも1つの伝導性ヒートスプレッダをさらに含み、各ヒートアイランドはヒートスプレッダに接続される。ヒートスプレッダは基板内に配置され、基部まで延びる。好ましくは、第1および第2のヒートスプレッダがあり、基板の一方の側の各ヒートアイランドは第1のヒートスプレッダに接続され、反対側の各ヒートアイランドは第2のヒートスプレッダに接続される。ヒートスプレッダは互いに接続された一連の伝導性要素とすることができるが、各ヒートスプレッダは好ましくは単一構造体である。
・簡単で丈夫な電力変換器
・高いシステム発光効率
・調光可能
・効率的な360°光出力
・効率的な熱管理システム
・任意の低電力白熱ランプに対する直接置き換え
・製造しやすい設計
を生成する。
、LEDを高電圧AC LEDに変換するSeoul Semiconductorの「Acriche」 LEDとは異なる。直列にLEDを組み合わせることにより高電圧DC LEDがもたらされ、それは、AC電源で動作される場合整流器を必要とすることになる。利点は、平滑コンデンサを加えて電流リプルを低減し、ちらつきのない安定した光源を得る能力である。Acriche LEDは、整流処理がパッケージの内部にあるので平滑コンデンサを取り付けることができない。
一般に、ΔV=Vs−Vとし、ΔVは抵抗器20の両端の電圧である。所与の負荷電流Iでは、
R=ΔV/I および PR=I×ΔV
である。
I=(ΔV+δV)/R
となることになり、ここで、δVは正または負となることがある。δIが負荷電流の変化を表すとしよう。その場合、
δI=(ΔV+δV)/R−ΔV/R=δV/R
である。
入力が変化したとき出力の変化を最小にするために、変動率はできるだけ小さくされるべきである。しかし、変動率の値が低いということはΔVの値が大きいということであり
、それにより、前述のように、損失が増加し、効率が低下する。
を再表示しよう。
損失が最も低くなる比較的低い電流で駆動される場合LEDは最も効率的である。しかし、これは、全ルーメンが低いことも意味する。例えば、LEDが0.03Wで100Lm/Wの効率を有する場合、その出力は3ルーメンとなることになる。効率的なLEDは必ずしも明るいLEDを意味しない。見方を変えれば、最も効率的なLEDは非常に暗いので照度用の光源として使用不可能となることがある。
75Lmシステムでは、36個のLEDが直列に配置され、18個が回路基盤の両側で同一の場所に配置される。このシステムは図7に示され、10mAのLED電流で図9の概略図に従って駆動される。その電流でのLED当たりのルーメン出力は2ルーメンであり、1.2Wの全入力電力で合計75ルーメンが出力され、60Lm/Wの総合システム発光効率がもたらされる。
たとえ、回路ごとの多数のLEDが等しい電流分配を保証しているとしても、より高い出力に起因する損失の増加を分散することならびに電流分配を改善することに役立つように回路10ごとに直列抵抗器30が加えられる。信頼性を向上させるために表面実装MOVサージサプレッサ26およびヒューズ14を加えることもできる。
たはそれ以上のより高い電力を達成するために同じ原理を適用することができる。総合システム効率は、より多くのLEDを利用し、駆動電流を低減することによって向上させることができる。
Claims (17)
- a.基部と、
b.前記基部から離間した光源と、前記光源は、
i.直列に接続され、前記基部から離間している全体的に平坦な基板の一方の側のみに取り付けられた第1の複数のLEDと、
ii.前記第1の複数のLEDと数が等しく、単一の直列回路を形成するように互いに且つ前記第1の複数のLEDと直列に接続され、前記全体的に平坦な基板の反対側に取り付けられ、前記第1の複数のLEDと同じ位置に前記全体的に平坦な基板の対向する側のみに置かれている、第2の複数のLEDと、を備え、
c.前記基板内のヒートシンクであって、前記第1および第2の複数のLEDの各LEDは前記ヒートシンクに近接して取り付けられる、ヒートシンクと、
d.前記LED用駆動回路であって、前記基部に近接して配置され、前記基部に電気的に接続される、駆動回路と
を備えるLEDランプ。 - 前記基部がねじ込み型基部である、請求項1に記載のLEDランプ。
- 前記駆動回路が前記平坦な基板から延びる回路基盤に取り付けられ、前記回路基盤が前記基部に延びる、請求項1に記載のLEDランプ。
- 前記ヒートシンクが前記基板の各側に少なくとも1つの伝導性ヒートアイランドを含み、前記第1の複数のLEDの各LEDは前記一方の側のヒートアイランドに近接し、前記第2の複数のLEDの各LEDは前記反対側のヒートアイランドに近接する、請求項1に記載のLEDランプ。
- 前記ヒートシンクは少なくとも1つの伝導性ヒートスプレッダを含み、各ヒートアイランドが前記ヒートスプレッダに接続される、請求項4に記載のLEDランプ。
- 前記ヒートスプレッダが前記基板に配置され、前記ヒートスプレッダが前記基部まで延びる、請求項5に記載のLEDランプ。
- 第1および第2のヒートスプレッダを含み、前記基板の前記一方の側の各ヒートアイランドが前記第1のヒートスプレッダに接続され、前記反対側の各ヒートアイランドが前記第2のヒートスプレッダに接続される、請求項5に記載のLEDランプ。
- 前記ヒートスプレッダは単一体である、請求項7に記載のLEDランプ。
- 前記基部に接続される球状体を含む、請求項1に記載のLEDランプ。
- 前記第1および第2の複数のLEDは全体的に円弧に方向付けられる、請求項1に記載のLEDランプ。
- 前記駆動回路は、サージサプレッサ、整流器、平滑コンデンサ、および抵抗器を含み、前記第1の複数のLEDおよび前記第2の複数のLEDは前記抵抗器に直列に接続される、請求項1に記載のLEDランプ。
- 前記基板は前記基部から延びる線と平行に方向付けられる、請求項1に記載のLEDランプ。
- 前記基板は前記基部から延びる線に垂直に方向付けられる、請求項1に記載のLEDランプ。
- 前記ヒートシンクは、前記基部の近隣から前記基板まで延びる複数の伝導性ヒートスプレッダロッドを含む、請求項13に記載のLEDランプ。
- 前記ヒートシンクは前記基板の各側に少なくとも1つの伝導性ヒートアイランドを含み、前記第1の複数のLEDの各LEDは、前記一方の側のヒートアイランドに近接し、前記第2の複数のLEDの各LEDが前記反対側のヒートアイランドに近接する、請求項14に記載のLEDランプ。
- 前記基板は前記LEDランプの長軸に並列に方向付けられる、請求項1に記載のLEDランプ。
- 前記基板は前記LEDランプの長軸と同軸を有する、請求項1に記載のLEDランプ。
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CN101940061A (zh) | 2011-01-05 |
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US20160273715A1 (en) | 2016-09-22 |
WO2009089529A1 (en) | 2009-07-16 |
US10753547B2 (en) | 2020-08-25 |
US11262028B2 (en) | 2022-03-01 |
KR20100102643A (ko) | 2010-09-24 |
CA2710542C (en) | 2016-05-17 |
AU2009203998A1 (en) | 2009-07-16 |
US20220146056A1 (en) | 2022-05-12 |
US9016901B2 (en) | 2015-04-28 |
US8408748B2 (en) | 2013-04-02 |
US11703191B2 (en) | 2023-07-18 |
MX2010007552A (es) | 2011-02-23 |
US20130285547A1 (en) | 2013-10-31 |
US9267649B2 (en) | 2016-02-23 |
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