JP6021441B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6021441B2 JP6021441B2 JP2012120284A JP2012120284A JP6021441B2 JP 6021441 B2 JP6021441 B2 JP 6021441B2 JP 2012120284 A JP2012120284 A JP 2012120284A JP 2012120284 A JP2012120284 A JP 2012120284A JP 6021441 B2 JP6021441 B2 JP 6021441B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
一主面と前記一主面とは反対側の他の主面とを有する半導体基板と、
前記他の主面側に設けられた前記第1の導電層と、
前記一主面から前記他の主面まで前記半導体基板を厚さ方向に貫通して前記第1の導電層を露出する貫通孔と、
前記貫通孔の側面を被覆し、前記一主面まで延在すると共に、前記第1の導電層と接続される接続部が前記半導体基板の厚さ方向に対して垂直方向に突出する突起部を有する第2の導電層と、
を備える半導体装置が提供される。
図1−5(J)を参照すれば、本発明の好ましい第1の実施の形態の半導体装置1は、半導体シリコン基板10と、酸化シリコン膜12と、TiN膜14と、Al膜16と、貫通孔20と、CVD酸化膜22と、シードメタル層24と、Cuめっき層26と、Cuめっき層30と、ソルダーレジスト32とを備えている。
図6−4(I)を参照すれば、本発明の好ましい第2の実施の形態の半導体装置2は、半導体シリコン基板10と、酸化シリコン膜12と、TiN膜14と、Al膜16と、貫通孔20と、CVD酸化膜22と、シードメタル層24と、Cuめっき層30と、ソルダーレジスト32とを備えている。
12 酸化シリコン膜
14 TiN膜
16 Al膜
20 貫通孔
22 CVD酸化膜
24 シードメタル層
26 Cuめっき層
28 ドライフィルム
30 Cuめっき層
32 ソルダーレジスト
Claims (8)
- 一主面と前記一主面とは反対側の他の主面とを有する半導体基板と、
前記他の主面側に設けられた第1の導電層と、
前記一主面から前記他の主面まで前記半導体基板を厚さ方向に貫通して前記第1の導電層を露出する貫通孔と、
前記貫通孔の側面を被覆し、前記一主面まで延在すると共に、前記第1の導電層と接続される接続部が前記半導体基板の厚さ方向に対して垂直方向に突出する突起部を有する第2の導電層と、
を備える半導体装置。 - 前記突起部は、前記第1の導電層の前記他の面に対向する面に形成された凹部内に設けられている請求項1記載の半導体装置。
- 前記突起部は、前記第1の導電層に直接接続されている請求項1又は請求項2に記載の半導体装置。
- 前記第2の導電層は、第3の導電層を介して前記貫通孔の側面を被覆している請求項1〜3のいずれか一項に記載の半導体装置。
- 前記第2の導電層は、前記貫通孔の側面に形成された絶縁層と前記第3の導電層とを介して前記貫通孔の側面を被覆している請求項4記載の半導体装置。
- 前記第2の導電層と前記一主面とを被覆する保護層を更に備えた請求項1〜5のいずれか一項に記載の半導体装置。
- 前記突起部の厚さは、前記貫通孔の中心から外側方向へ離れるに従って減少し、
前記突起部の前記貫通孔の中心から最も離れた端部の断面は、鋭角形状に形成されている請求項1〜6のいずれか一項に記載の半導体装置。 - 前記第2の導電層の前記貫通孔の側面を被覆する膜厚は不均一である請求項1〜7のいずれか一項に記載の半導体装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012120284A JP6021441B2 (ja) | 2012-05-25 | 2012-05-25 | 半導体装置 |
US13/896,561 US9099536B2 (en) | 2012-05-25 | 2013-05-17 | Semiconductor device and method of producing semiconductor device |
CN201310196797.2A CN103426817B (zh) | 2012-05-25 | 2013-05-24 | 半导体装置及其制造方法 |
US14/748,537 US9892995B2 (en) | 2012-05-25 | 2015-06-24 | Semiconductor device |
US15/859,801 US10153228B2 (en) | 2012-05-25 | 2018-01-02 | Semiconductor device |
US16/185,169 US10580721B2 (en) | 2012-05-25 | 2018-11-09 | Semiconductor device |
Applications Claiming Priority (1)
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---|---|---|---|
JP2012120284A JP6021441B2 (ja) | 2012-05-25 | 2012-05-25 | 半導体装置 |
Related Child Applications (1)
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JP2016196192A Division JP6272431B2 (ja) | 2016-10-04 | 2016-10-04 | 半導体装置およびその製造方法 |
Publications (2)
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JP2013247254A JP2013247254A (ja) | 2013-12-09 |
JP6021441B2 true JP6021441B2 (ja) | 2016-11-09 |
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US (4) | US9099536B2 (ja) |
JP (1) | JP6021441B2 (ja) |
CN (1) | CN103426817B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6021441B2 (ja) * | 2012-05-25 | 2016-11-09 | ラピスセミコンダクタ株式会社 | 半導体装置 |
US10020222B2 (en) * | 2013-05-15 | 2018-07-10 | Canon, Inc. | Method for processing an inner wall surface of a micro vacancy |
JP6309243B2 (ja) | 2013-10-30 | 2018-04-11 | ラピスセミコンダクタ株式会社 | 半導体装置およびその製造方法 |
US20150179580A1 (en) * | 2013-12-24 | 2015-06-25 | United Microelectronics Corp. | Hybrid interconnect structure and method for fabricating the same |
JP6359444B2 (ja) * | 2014-12-25 | 2018-07-18 | 東京エレクトロン株式会社 | 配線層形成方法、配線層形成システムおよび記憶媒体 |
US9704784B1 (en) * | 2016-07-14 | 2017-07-11 | Nxp Usa, Inc. | Method of integrating a copper plating process in a through-substrate-via (TSV) on CMOS wafer |
JP6963396B2 (ja) | 2017-02-28 | 2021-11-10 | キヤノン株式会社 | 電子部品の製造方法 |
JP6951219B2 (ja) * | 2017-11-29 | 2021-10-20 | 新光電気工業株式会社 | 配線基板、半導体装置、及び配線基板の製造方法 |
EP3550600B1 (en) | 2018-04-04 | 2020-08-05 | ams AG | Method of forming a through-substrate via and semiconductor device comprising the through-substrate via |
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TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
JP3217319B2 (ja) | 1998-12-11 | 2001-10-09 | 松下電器産業株式会社 | 半導体装置の製造方法 |
JP3820329B2 (ja) | 1999-09-14 | 2006-09-13 | 株式会社ルネサステクノロジ | 半導体基板のめっき方法 |
TWI227050B (en) * | 2002-10-11 | 2005-01-21 | Sanyo Electric Co | Semiconductor device and method for manufacturing the same |
JP2005062525A (ja) | 2003-08-13 | 2005-03-10 | Canon Inc | 光学素子および光学系 |
JP2005235860A (ja) * | 2004-02-17 | 2005-09-02 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
JP2005294320A (ja) | 2004-03-31 | 2005-10-20 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
JP4650117B2 (ja) * | 2005-06-21 | 2011-03-16 | パナソニック電工株式会社 | 半導体装置の製造方法 |
JP5026025B2 (ja) | 2006-08-24 | 2012-09-12 | 株式会社フジクラ | 半導体装置 |
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JP5145000B2 (ja) | 2007-09-28 | 2013-02-13 | 株式会社フジクラ | 貫通配線基板、半導体パッケージ及び貫通配線基板の製造方法 |
JP5424675B2 (ja) | 2008-03-18 | 2014-02-26 | キヤノン株式会社 | 半導体装置の製造方法及び半導体装置 |
JP2010114201A (ja) | 2008-11-05 | 2010-05-20 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
JP2011003645A (ja) | 2009-06-17 | 2011-01-06 | Sharp Corp | 半導体装置およびその製造方法 |
JP5649805B2 (ja) * | 2009-08-12 | 2015-01-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2011054805A (ja) | 2009-09-02 | 2011-03-17 | Toshiba Corp | 半導体装置、及び半導体装置の製造方法 |
WO2011111308A1 (ja) * | 2010-03-09 | 2011-09-15 | パナソニック株式会社 | 半導体装置の製造方法及び半導体装置 |
JP2012099548A (ja) * | 2010-10-29 | 2012-05-24 | Fujikura Ltd | 貫通配線基板の製造方法及び貫通配線基板 |
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JP6021441B2 (ja) * | 2012-05-25 | 2016-11-09 | ラピスセミコンダクタ株式会社 | 半導体装置 |
US8901435B2 (en) * | 2012-08-14 | 2014-12-02 | Bridge Semiconductor Corporation | Hybrid wiring board with built-in stopper, interposer and build-up circuitry |
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2012
- 2012-05-25 JP JP2012120284A patent/JP6021441B2/ja active Active
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2013
- 2013-05-17 US US13/896,561 patent/US9099536B2/en active Active
- 2013-05-24 CN CN201310196797.2A patent/CN103426817B/zh active Active
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2015
- 2015-06-24 US US14/748,537 patent/US9892995B2/en active Active
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2018
- 2018-01-02 US US15/859,801 patent/US10153228B2/en active Active
- 2018-11-09 US US16/185,169 patent/US10580721B2/en active Active
Also Published As
Publication number | Publication date |
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CN103426817A (zh) | 2013-12-04 |
US9892995B2 (en) | 2018-02-13 |
US20150348875A1 (en) | 2015-12-03 |
US10153228B2 (en) | 2018-12-11 |
US20190080987A1 (en) | 2019-03-14 |
US20180151476A1 (en) | 2018-05-31 |
JP2013247254A (ja) | 2013-12-09 |
US9099536B2 (en) | 2015-08-04 |
CN103426817B (zh) | 2018-06-12 |
US20130313688A1 (en) | 2013-11-28 |
US10580721B2 (en) | 2020-03-03 |
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