JP6011487B2 - LED lamp manufacturing method and sealing material vertical apparatus - Google Patents

LED lamp manufacturing method and sealing material vertical apparatus Download PDF

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JP6011487B2
JP6011487B2 JP2013165973A JP2013165973A JP6011487B2 JP 6011487 B2 JP6011487 B2 JP 6011487B2 JP 2013165973 A JP2013165973 A JP 2013165973A JP 2013165973 A JP2013165973 A JP 2013165973A JP 6011487 B2 JP6011487 B2 JP 6011487B2
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sealing material
recess
led chip
saddle
led
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JP2015035512A (en
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加藤　英昭
英昭 加藤
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Toyoda Gosei Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Description

本発明は、ＬＥＤチップを封止材で封止したＬＥＤランプの製造方法、及び、それに使用する新規な封止材の枡型装置に関するものである。   The present invention relates to an LED lamp manufacturing method in which an LED chip is sealed with a sealing material, and a novel sealing material saddle-type device used therefor.

ＬＥＤ（発光ダイオード）チップは、樹脂等の封止材で封止するのが一般的である。封止の目的は、ＬＥＤチップの保護（大気中の水分やごみにより発光特性が低下しないように大気を遮断）、ボンディングワイヤの保護、光取出効率の向上（屈折率のマッチング）、波長変換（封止材中に分散させた蛍光体粒子による）等である。   LED (light emitting diode) chips are generally sealed with a sealing material such as resin. The purpose of sealing is to protect the LED chip (block the atmosphere so that light emission characteristics do not deteriorate due to moisture and dust in the atmosphere), protect the bonding wire, improve the light extraction efficiency (refractive index matching), wavelength conversion ( Etc.) by phosphor particles dispersed in a sealing material.

封止方法には、ＬＥＤチップに液状の封止材を塗布する方法、ＬＥＤチップにシートを被せる方法等がある。このうち、液状の封止材を塗布する方法としては、ノズルから吐出するポッティング法が一般的であるが（特許文献１）、静電気を利用する静電塗布法も提案されている（特許文献２、３）。   Examples of the sealing method include a method of applying a liquid sealing material to the LED chip, a method of covering the LED chip with a sheet, and the like. Among these, as a method of applying a liquid sealing material, a potting method of discharging from a nozzle is common (Patent Document 1), but an electrostatic coating method using static electricity has also been proposed (Patent Document 2). 3).

特許文献２の静電塗布法は、図９に示すように、凹部５３の内底部にＬＥＤチップ５１が実装されたＬＥＤパッケージ５２と、ニードル又はノズルの形態を有する樹脂吐出手段５４とに、電圧印加部５５から電圧を印加し、樹脂吐出手段５４から液状の封止樹脂を吐出してＬＥＤチップ５１を封止するというものである。樹脂吐出手段５４は、ＬＥＤパッケージ５２と約１００μｍ以内の距離で封止樹脂を塗布するとされている。このような至近距離だと、樹脂吐出手段５４のニードル又はノズルが、ＬＥＤチップ５１側のワイヤ５６に接触して、ワイヤ５６を切断する可能性が大きくなる。そこで、その対策が必要になり、特許文献２では接触を電気信号で感知する感知部５６を設けることを提案している。   As shown in FIG. 9, the electrostatic coating method of Patent Document 2 applies voltage to the LED package 52 in which the LED chip 51 is mounted on the inner bottom portion of the recess 53 and the resin discharge means 54 having a needle or nozzle form. The LED chip 51 is sealed by applying a voltage from the application section 55 and discharging a liquid sealing resin from the resin discharge means 54. The resin discharge means 54 is supposed to apply the sealing resin at a distance within about 100 μm from the LED package 52. At such a close distance, the needle or nozzle of the resin discharge means 54 comes into contact with the wire 56 on the LED chip 51 side and the possibility of cutting the wire 56 increases. Therefore, countermeasures are required, and Patent Document 2 proposes to provide a sensing unit 56 that senses contact with an electrical signal.

このような静電塗布法には、封止材を均一に塗布できるとか、導電体の選択的配置により封止材を選択的に付着させることもできるとかという利点があるが、次のような問題があった。   Such an electrostatic coating method has an advantage that the sealing material can be applied uniformly or the sealing material can be selectively attached by selective arrangement of the conductors. There was a problem.

１．封止材の塗布量の変動
封止材の塗布量（体積）は、印加電圧と印加時間の積で概ねきまるが、封止材の種類や粘度、混合される蛍光体や増粘材の混合量・種類・形状・粒度分布等により、常に一定量を塗布することはできない。
（ａ）封止材の塗布量が変動することで、封止面の高さも変動して発光量が変動する。封止材が多い方へ変動した場合には、凹部５３からあふれ出ることもあり、周囲の金属部材に封止材が付着し、半田付けができなくなり、製品としては不良品となる。
（ｂ）封止材の塗布量が安定しないことにより、蛍光体の量も変化するため、ＬＥＤ発光スペクトルが変化し、発光色度や演色性が変動する。変動量が目標変動域から外れることになりＬＥＤランプの工程歩留まりが低下し、コスト上昇の一因となる。 1. Variation in encapsulant application amount The encapsulant application volume (volume) is generally determined by the product of the applied voltage and the application time, but the type and viscosity of the encapsulant, and the mixture of phosphors and thickeners to be mixed. Depending on the amount, type, shape, particle size distribution, etc., a certain amount cannot always be applied.
(A) Since the application amount of the sealing material varies, the height of the sealing surface also varies and the light emission amount varies. When the sealing material is changed to a larger one, it may overflow from the concave portion 53, the sealing material adheres to the surrounding metal member, and soldering becomes impossible, resulting in a defective product.
(B) Since the coating amount of the sealing material is not stable, the amount of the phosphor is also changed, so that the LED emission spectrum is changed, and the emission chromaticity and color rendering are changed. The fluctuation amount deviates from the target fluctuation range, the process yield of the LED lamp is reduced, and the cost is increased.

２．封止に長時間必要
封止材に印加された電荷は、同電位電荷による斥力により、封止材を微粒化する。この微粒化した封止材は、異極間で発生する電界による引力により、ＬＥＤ側に引きつけられるが、その移動量は必要封止量に比較して少なく、必要量を移動させるためには、相当量の時間が必要になる。一般的な凹部内にＬＥＤチップを実装したＬＥＤランプにおける封止材の塗布量（体積）は、数千ナノリットル（例えば３０００×１０-9Ｌ）であり、それに対し、静電塗布における微粒子は、零点数ピコリットル（例えば０．３×１０-12Ｌ）であるから、一千万粒（１×１０7）の塗布が必要になる。それには１回２ミリ秒として５．５時間必要になるため、量産工程では用いることができない。 2. Necessary for sealing for a long time The electric charge applied to the sealing material atomizes the sealing material by repulsive force due to the same potential charge. This atomized sealing material is attracted to the LED side by the attractive force due to the electric field generated between the different electrodes, but the movement amount is small compared to the necessary sealing amount, and in order to move the necessary amount, A considerable amount of time is required. The application amount (volume) of the sealing material in the LED lamp in which the LED chip is mounted in a general recess is several thousand nanoliters (for example, 3000 × 10 −9 L), whereas the fine particles in electrostatic application are Since the number of zero points is picoliter (for example, 0.3 × 10 −12 L), it is necessary to apply 10 million grains (1 × 10 7 ). This requires 5.5 hours for 2 milliseconds at a time, so it cannot be used in a mass production process.

なお、蛍光体混合の封止材は、ＬＥＤチップの上面に薄く塗布する設計もある（特許文献３）。この場合は、蛍光体の混合濃度を増すことも加味して、必要封止量が上記の１／１００になると仮定できるかもしれないが、それでも２００秒必要になる。   In addition, there is a design in which the phosphor-mixed sealing material is applied thinly on the upper surface of the LED chip (Patent Document 3). In this case, it may be assumed that the required sealing amount is 1/100 of the above, taking into account the increase in the phosphor mixing concentration, but it still requires 200 seconds.

３．コンタミネーション（異物混入による汚染）
電界印加時は、斥力で微粒化した封止材以外に、周囲雰囲気から、非帯電や、別の要因で帯電した微粒子が引き寄せられて、ＬＥＤチップの封止材の内部や発光表面に異物として付着することがあり（コンタミネーション）、ＬＥＤチップから放射された発光成分を吸収し、総発光量が少なくなる。これを防止する策として、静電塗布装置を、真空もしくはこれに近い条件下にしたり、窒素等の不活性ガス（清浄ガス）を封入した条件下にしたりすることが考案されている。しかし、静電塗布装置をそのような条件下にできるように構成する必要があり、また、被塗布物を大気下から条件下へ移動させる必要もあるため、量産としては扱いにくい装置となる。 3. Contamination (contamination due to contamination)
When an electric field is applied, in addition to the encapsulating material atomized by repulsive force, non-charged or charged particles due to other factors are attracted from the surrounding atmosphere as foreign matter inside the LED chip encapsulating material or the light emitting surface. It may adhere (contamination), absorb the light emitting component emitted from the LED chip, and reduce the total light emission amount. In order to prevent this, it has been devised that the electrostatic coating apparatus is placed under a vacuum or a condition close thereto, or under a condition in which an inert gas (clean gas) such as nitrogen is enclosed. However, it is necessary to configure the electrostatic coating apparatus so that it can be used under such conditions, and it is also necessary to move the object to be coated from the atmosphere to the conditions, which makes it difficult to handle as mass production.

４．ワイヤの切断
前述のとおり、樹脂吐出手段５４のニードル又はノズルが、ＬＥＤパッケージ５２の至近距離で封止樹脂を吐出するため、ＬＥＤチップ５１側のワイヤ５６を切断する可能性があり、その対策が必要となる。 4). As described above, since the needle or nozzle of the resin discharge means 54 discharges the sealing resin at a close distance of the LED package 52, there is a possibility of cutting the wire 56 on the LED chip 51 side. Necessary.

特開２０１３−８４６４９号公報JP 2013-84649 A 特開２０１２−１１４４３０号公報JP 2012-114430 A 特開２０１３−６９９８０号公報JP 2013-69980 A

本発明の目的は、上述のような従来の静電塗布法における数々の問題を解消し、封止材の体積量を一定にし、封止時間を短縮し、コンタミネーションを防止し、また、ワイヤの切断が起こらないようにすることにある。   The object of the present invention is to eliminate the above-mentioned problems in the conventional electrostatic coating method, to keep the volume of the sealing material constant, to shorten the sealing time, to prevent contamination, and to The purpose is to prevent the disconnection.

１．ＬＥＤチップを封止材で封止したＬＥＤランプの製造に用いる封止材の枡型装置であって、1. A vertical device for a sealing material used for manufacturing an LED lamp in which an LED chip is sealed with a sealing material,
凹み形成枠の内側に上面が開口した凹みが形成され、該凹み内に供給する液状の封止材に接触可能で且つ外部の高電圧発生装置に接続可能な導電体を備えた枡型と、A bowl having a conductor formed with a recess whose upper surface is opened inside the recess forming frame, capable of contacting a liquid sealing material supplied into the recess and connectable to an external high voltage generator;
前記枡型を上下反転する上下反転装置とを備えた封止材の枡型装置。A sealing-type saddle-type device comprising an upside-down reversing device for vertically flipping the saddle-type.

上記１．の手段において、複数の枡型が水平方向に並ぶように配置されたものとすることができる。この場合、各枡型の導電体は、互いに導通するように連続していてもよいし、互いに導通しないように分離していてもよい。Above 1. In this means, a plurality of bowls can be arranged in the horizontal direction. In this case, the vertical conductors may be continuous so as to conduct each other or may be separated so as not to conduct each other.

２．上記１．の手段である封止材の枡型装置を使用して行うＬＥＤランプの製造方法であって、2. Above 1. A method of manufacturing an LED lamp using a vertical device of a sealing material which is a means of
前記凹み内に、液状の封止材を充填することにより計量して供給する計量ステップと、A metering step for metering and supplying by filling a liquid sealing material in the recess;
実装面上に実装されたＬＥＤチップの上方に、前記枡型を前記上下反転装置により上下反転して配置し、前記高電圧発生装置から電圧を印加するための電極を、前記導電体と前記ＬＥＤチップのリードとに当接させて接続し、凹み内の液状の封止材を静電塗布によりＬＥＤチップに移動させる移動ステップと、Above the LED chip mounted on the mounting surface, the saddle type is vertically inverted by the upside down device, and an electrode for applying a voltage from the high voltage generator is provided with the conductor and the LED. A moving step of contacting and connecting to the lead of the chip and moving the liquid sealing material in the recess to the LED chip by electrostatic application;
ＬＥＤチップに移動した液状の封止材を固化させる固化ステップとを含むことを特徴とするＬＥＤランプの製造方法。And a solidifying step of solidifying the liquid sealing material moved to the LED chip.

３．上記１．の手段である封止材の枡型装置を使用して行うＬＥＤランプの製造方法であって、3. Above 1. A method of manufacturing an LED lamp using a vertical device of a sealing material which is a means of
前記凹み内に、液状の封止材を充填することにより計量して供給する計量ステップと、A metering step for metering and supplying by filling a liquid sealing material in the recess;
実装面上に実装されたＬＥＤチップの上方に、前記枡型を前記上下反転装置により上下反転して配置し、凹み内の液状の封止材の一部を重力によりＬＥＤチップに移動させるとともに、前記高電圧発生装置から電圧を印加するための電極を、前記導電体と前記ＬＥＤチップのリードとに当接させて接続し、凹み内の液状の封止材の残部を静電塗布によりＬＥＤチップに移動させる移動ステップと、Above the LED chip mounted on the mounting surface, the saddle mold is inverted upside down by the upside down device, and a part of the liquid sealing material in the recess is moved to the LED chip by gravity, An electrode for applying a voltage from the high voltage generator is connected in contact with the conductor and the lead of the LED chip, and the remaining part of the liquid sealing material in the recess is electrostatically applied to the LED chip. A moving step to move to
ＬＥＤチップに移動した液状の封止材を固化させる固化ステップとを含むことを特徴とするＬＥＤランプの製造方法。And a solidifying step of solidifying the liquid sealing material moved to the LED chip.

上記２．又は３．の手段において、実装面上に実装されたＬＥＤチップの周囲に凹部形成枠が設けられ、前記移動ステップで枡型を上下反転して配置したときに、凹部形成枠と凹み形成枠とが突き合わされて密着することが好ましい。コンタミネーションを防止できるからである。2. Or 3. In this means, a recess forming frame is provided around the LED chip mounted on the mounting surface, and the recess forming frame and the recess forming frame are brought into contact with each other when the vertical shape is arranged upside down in the moving step. It is preferable to adhere closely. This is because contamination can be prevented.

本発明によれば、封止材の塗布量を一定にでき、封止時間を短縮でき、ワイヤの切断が起こらないようにすることができる。さらに、凹部形成枠と凹み形成枠とが突き合わされて密着するようにすれば、コンタミネーションを防止できる。   According to the present invention, the coating amount of the sealing material can be made constant, the sealing time can be shortened, and the wire can be prevented from being cut. Furthermore, contamination can be prevented if the recess forming frame and the recess forming frame are brought into contact with each other and brought into close contact with each other.

実施例１に用いるＬＥＤパッケージを示し、（ａ）は平面図、（ｂ）は側面図、（ｃ）はＩｃ−Ｉｃ断面図、（ｄ）はＩｄ−Ｉｄ断面図である。The LED package used for Example 1 is shown, (a) is a top view, (b) is a side view, (c) is Ic-Ic sectional drawing, (d) is Id-Id sectional drawing. 実施例１に用いる枡型を示し、（ａ）は平面図、（ｂ）は側面図、（ｃ）はＩＩｃ−ＩＩｃ断面図である。The saddle type used for Example 1 is shown, (a) is a top view, (b) is a side view, (c) is IIc-IIc sectional drawing. 実施例１における封止材の計量ステップを示し、（ａ）は側面図、（ｂ）は断面図である。The measurement step of the sealing material in Example 1 is shown, (a) is a side view, (b) is sectional drawing. （ａ）〜（ｅ）は実施例における封止材の移動ステップを示す断面図、（ｆ）は封止材の固化ステップを経て完成したＬＥＤランプを示す断面図である。(A)-(e) is sectional drawing which shows the movement step of the sealing material in an Example, (f) is sectional drawing which shows the LED lamp completed through the solidification step of a sealing material. 実施例２を示し、（ａ）はＬＥＤパッケージの平面図、（ｂ）は同じく側面図、（ｃ）はこれに凹み形成枠を配置したときの平面図、（ｄ）は同じく側面図、（ｅ）及び（ｆ）は封止材の移動ステップを示す断面図、（ｇ）は封止材の固化ステップを経て完成したＬＥＤランプを示す断面図である。Example 2 is shown, (a) is a plan view of the LED package, (b) is also a side view, (c) is a plan view when a recess forming frame is disposed on this, (d) is also a side view, (e) And (f) is sectional drawing which shows the movement step of a sealing material, (g) is sectional drawing which shows the LED lamp completed through the solidification step of a sealing material. 実施例３に用いるＬＥＤパッケージを示し、（ａ）は平面図、（ｂ）は側面図である。The LED package used for Example 3 is shown, (a) is a top view, (b) is a side view. 実施例３に用いる枡型を示し、（ａ）は平面図、（ｂ）は側面図である。The saddle type used for Example 3 is shown, (a) is a top view, (b) is a side view. 同枡型の変更例を示し、（ａ）は底面図、（ｂ）は側面図である。The example of a change of the same coffin type | mold is shown, (a) is a bottom view, (b) is a side view. 従来例の封止材の静電塗装方法を示す断面図である。It is sectional drawing which shows the electrostatic coating method of the sealing material of a prior art example.

上記の手段１．〜３．における各事項の態様等について、以下説明する。   The above means 1. ~ 3. A description will be given below of the aspects of each item.

１．ＬＥＤチップ
ＬＥＤチップは、特に限定されない。ＬＥＤチップの材料、層構造、実装タイプ、発光波長等は、どのようなものでもよい。 1. LED chip The LED chip is not particularly limited. The LED chip material, layer structure, mounting type, emission wavelength, etc. may be anything.

２．ＬＥＤパッケージ
実装面上に実装されたＬＥＤチップの周囲には、凹部形成枠が設けられていても設けられていなくてもよい。凹部形成枠が設けられていない場合には、凹部形成枠が移動ステップと固化ステップの間だけ一時的に設けられてもよい。 2. LED package Around the LED chip mounted on the mounting surface, a recess forming frame may or may not be provided. When the recess forming frame is not provided, the recess forming frame may be temporarily provided only between the moving step and the solidifying step.

３．封止材
封止材としては、塗布時に液状であって塗布後に固化可能なものであれば、特に限定されず、樹脂、ゾルゲル材等を例示できる。樹脂は、熱硬化性樹脂が好ましく、エポキシ樹脂、シリコーン樹脂、フッ素樹脂等を例示できる。ゾルゲル材としては、金属アルコキシド、金属ポリマー等を例示できる。 3. Sealing material The sealing material is not particularly limited as long as it is liquid at the time of application and can be solidified after application, and examples thereof include resins and sol-gel materials. The resin is preferably a thermosetting resin, and examples thereof include an epoxy resin, a silicone resin, and a fluororesin. Examples of the sol-gel material include metal alkoxide and metal polymer.

封止材は蛍光体（波長変換物質）を含有していてもよい。蛍光体は、ＬＥＤチップが発する所定波長の光により励起されて別の波長の蛍光を放出するものである。励起される光の波長、放出する蛍光の波長、蛍光体の種類等は、特に限定されない。   The sealing material may contain a phosphor (wavelength conversion substance). The phosphor is excited by light of a predetermined wavelength emitted from the LED chip and emits fluorescence of another wavelength. The wavelength of the excited light, the wavelength of the emitted fluorescence, the type of the phosphor, etc. are not particularly limited.

封止材は添加物を含有していてもよい。添加物としては、媒体の粘度を調整して蛍光体を分散させる分散材（散乱剤）、無色透明である樹脂を着色透明にするための染料や顔料、シリカ、シリコーン、ガラスビーズ、ガラス繊維等の透明フィラー、酸化チタン、チタン酸カリウム等の白色フィラー等を例示できる。   The sealing material may contain an additive. Additives include dispersion materials (scattering agents) that adjust the viscosity of the medium to disperse phosphors, dyes and pigments that make colorless and transparent resins colored and transparent, silica, silicone, glass beads, glass fibers, etc. Transparent fillers, white fillers such as titanium oxide and potassium titanate, and the like.

４．枡型
枡型の導電体以外の部分の材料は、特に限定されないが、樹脂、セラミック等の絶縁性材料が好ましい。導電体のみに通電するためである。樹脂は、熱可塑性樹脂、熱硬化性樹脂、反応硬化性樹脂のいずれでもよく、ＬＥＤチップの封止材に用いられるものでもよい。 4). The material of the portions other than the saddle-type conductor is not particularly limited, but an insulating material such as resin or ceramic is preferable. This is for energizing only the conductor. The resin may be any of a thermoplastic resin, a thermosetting resin, and a reaction curable resin, and may be one used for an LED chip sealing material.

導電体の材料は、銅、銅合金、鉄、ステンレス鋼、真鍮、タングステン等の金属製でもよいし、表面に金属メッキ処理が施されたものでもよい。
導電体は、凹みの内底部において液状の封止材に接触可能なように配置されたものが好ましい。封止材を効率的に帯電させられるからである。
導電体を外部の高電圧発生装置に接続可能とするには、枡型の開口以外の複数の面のうちいずれか１面もしくは複数面に、導電体に連通する孔もしくは接続された電極を設ける等すればよい。 The material of the conductor may be made of a metal such as copper, copper alloy, iron, stainless steel, brass, or tungsten, or may have a surface plated with metal.
The conductor is preferably arranged so as to be in contact with the liquid sealing material at the inner bottom of the recess. This is because the sealing material can be charged efficiently.
In order to connect the conductor to an external high voltage generator, a hole communicating with the conductor or a connected electrode is provided on one or a plurality of surfaces other than the bowl-shaped opening. And so on.

複数の枡型が水平方向に並ぶように配置されたものとする場合、各枡型の導電体は互いに導通するように線状、格子状又は面状に連続させることができ、連続させたものの一部を外部の高電圧発生装置に接続可能とすればよい。一方、各枡型の導電体を互いに導通しないように分離させるときは、各導電体を外部の高電圧発生装置に接続可能とする。   When a plurality of saddle types are arranged in a horizontal direction, the conductors of the saddle type can be continuous in a linear shape, a lattice shape, or a planar shape so as to conduct each other. It is only necessary that a part can be connected to an external high voltage generator. On the other hand, when separating the vertical conductors so as not to conduct each other, each conductor can be connected to an external high voltage generator.

５．計量ステップ
枡型の凹み内に液状の封止材を充填するには、例えば、凹みの内容積よりもやや多い封止材を滴下、注入等して凹み内に充填し、余分な封止材を掻き取って、充填上面が凹みの開口と面一になるように整える方法をとることができる。 5. Measuring step To fill the liquid sealant in the bowl-shaped dent, for example, dripping or injecting a slightly larger amount of the sealant than the inner volume of the dent to fill the dent, and then adding the extra sealant Can be scraped off and the filling upper surface can be adjusted to be flush with the recessed opening.

６．移動ステップ
静電塗布は、枡型の凹み内に供給した液状の封止材に電荷を与え、その電荷による斥力を利用して液状の封止材を微粒化し、且つ、ＬＥＤチップ側の金属部材に電界を印加し、その電界による引力により、前記微粒化した液状の封止材を飛翔させてＬＥＤチップに塗布する方法である。枡型の凹み内に供給する液状の封止材に電荷を与えるには、枡型に設置した導電体に電圧を印加する。ＬＥＤチップ側の金属部材としては、実装面（金属）、リードを例示できる。 6). Moving step The electrostatic coating gives a charge to the liquid encapsulant supplied in the bowl-shaped dent, atomizes the liquid encapsulant using the repulsive force due to the charge, and the metal member on the LED chip side This is a method in which an electric field is applied to the LED chip, and the atomized liquid sealing material is caused to fly by the attractive force of the electric field and applied to the LED chip. In order to give an electric charge to the liquid sealing material supplied into the bowl-shaped recess, a voltage is applied to a conductor provided in the bowl-shaped recess. Examples of the metal member on the LED chip side include a mounting surface (metal) and a lead.

印加極性は、封止の動作中一定とすることが好ましい。印加電圧は、一定であっても一定でなくてもよく、パルス状波形、階段波形、ノコギリ状波形等でもよい。但し、静電塗布中の温度上昇を低減するため、また急加速力発生のためには、パルス形状が好ましい。   The applied polarity is preferably constant during the sealing operation. The applied voltage may or may not be constant, and may be a pulse waveform, a staircase waveform, a sawtooth waveform, or the like. However, a pulse shape is preferable in order to reduce a temperature rise during electrostatic coating and to generate a rapid acceleration force.

７．固化ステップ
ＬＥＤチップに移動した液状の封止材は、その材料に応じた方法（例えば熱硬化、反応硬化）によって固化させればよい。 7). Solidification Step The liquid encapsulant moved to the LED chip may be solidified by a method (for example, heat curing or reaction curing) according to the material.

図１〜図４に示す実施例１のＬＥＤランプ及びその製造方法について説明する。製造するＬＥＤランプ１は、図４（ｆ）に示すように、ケース２、第１リード６、第２リード７、ＬＥＤチップ８、ボンディングワイヤ９及び封止材１１を備えたものである。このＬＥＤランプ１は、次のような方法で製造される。   The LED lamp of Example 1 shown in FIGS. 1-4 and its manufacturing method are demonstrated. The LED lamp 1 to be manufactured includes a case 2, a first lead 6, a second lead 7, an LED chip 8, a bonding wire 9 and a sealing material 11 as shown in FIG. 4 (f). The LED lamp 1 is manufactured by the following method.

［１］ＬＥＤパッケージの作製ステップ
図１に示すように、ケース２を備えたリード６，７の上面（実装面）に、ＬＥＤチップ８を実装し、ＬＥＤパッケージ１０を作製する。 [1] LED Package Manufacturing Step As shown in FIG. 1, the LED chip 8 is mounted on the upper surfaces (mounting surfaces) of the leads 6 and 7 including the case 2 to manufacture the LED package 10.

ケース２は、樹脂で一体形成された凹部形成枠３と底板４とからなり、凹部形成枠３の内側に上面が開口した凹部５を備える。第１リード６及び第２リード７は、金属板からなり、いずれか一方が正側とされ、他方が負側とされる。第１リード６及び第２リード７は、それらの上面が前記底板４の上面とともに凹部５の内底面を構成するようにして、ケース２と接合されている。第１リード６と第２リード７との間は、その間に底板４の一部が介在することにより、隔てられて電気的に絶縁されている。このようなケース２は、成形型（図示略）に第１リード６及び第２リード７をインサート材としてセットし、その成形型に樹脂を射出成形する等の方法により製造することができる。   The case 2 includes a recess forming frame 3 and a bottom plate 4 that are integrally formed of resin, and includes a recess 5 having an upper surface opened inside the recess forming frame 3. The first lead 6 and the second lead 7 are made of a metal plate, and one of them is a positive side and the other is a negative side. The first lead 6 and the second lead 7 are joined to the case 2 such that their upper surfaces constitute the inner bottom surface of the recess 5 together with the upper surface of the bottom plate 4. The first lead 6 and the second lead 7 are separated and electrically insulated by interposing a part of the bottom plate 4 therebetween. Such a case 2 can be manufactured by a method in which the first lead 6 and the second lead 7 are set as insert materials in a molding die (not shown), and resin is injection-molded into the molding die.

ＬＥＤチップ８を第１リード６（又は第２リード７）の上面にダイボンド材（図示略）にて固定するとともに、ＬＥＤチップ８のｐ電極及びｎ電極をそれぞれボンディングワイヤ９により第１リード６及び第２リード７に電気的に結合する。この実装により、ＬＥＤパッケージ１０が作製される。   The LED chip 8 is fixed to the upper surface of the first lead 6 (or the second lead 7) with a die bonding material (not shown), and the p-electrode and the n-electrode of the LED chip 8 are bonded to the first lead 6 and It is electrically coupled to the second lead 7. With this mounting, the LED package 10 is manufactured.

［２］封止材の計量ステップ
図２に示すような枡型１２の凹み内に、図３に示すように液状の封止材１１を充填することにより一定量を計量して供給する。 [2] Metering step of sealing material A predetermined amount is weighed and supplied by filling a liquid sealing material 11 as shown in FIG.

封止材１１は、例えばエポキシ樹脂であり、これに蛍光体粒子、フィラー等を混合してある。蛍光体粒子は、ＬＥＤランプが必要とする発光色に応じて濃度調整を行い、調合する。   The sealing material 11 is, for example, an epoxy resin, and phosphor particles, a filler, and the like are mixed therein. The phosphor particles are prepared by adjusting the concentration according to the emission color required by the LED lamp.

枡型１２は、絶縁材である樹脂で一体形成された凹み形成枠１３と底板１４とからなり、凹み形成枠１３の内側に液状の封止材を供給するための上面が開口した凹み１５を備える。底板１４の上には供給した液状の封止材に接触してこれを帯電させるための導電プレート１７が接合され、導電プレート１７の上面が凹み１５の内底面を構成している。凹み１５の内容積は、封止材１１の塗布量と同一に設定されている。従って、封止材１１が凹み１５内に充填され、その充填上面が凹み１５の開口と面一になると、一定量の封止材１１が正確に計量されることになる。底板１４の一部には、導電プレート１７に通電するための孔１６が形成されている。導電プレート１７は、このように枡型１２より突き出ていないことが好ましいが、突き出ていてもよい。   The saddle mold 12 includes a recess forming frame 13 and a bottom plate 14 that are integrally formed of a resin that is an insulating material, and a recess 15 having an open upper surface for supplying a liquid sealing material to the inside of the recess forming frame 13. Prepare. A conductive plate 17 for contacting and charging the supplied liquid sealing material is joined on the bottom plate 14, and the upper surface of the conductive plate 17 constitutes the inner bottom surface of the recess 15. The inner volume of the recess 15 is set to be the same as the application amount of the sealing material 11. Therefore, when the sealing material 11 is filled in the recess 15 and the upper surface of the filling is flush with the opening of the recess 15, a certain amount of the sealing material 11 is accurately measured. A hole 16 for energizing the conductive plate 17 is formed in a part of the bottom plate 14. The conductive plate 17 preferably does not protrude from the saddle 12 as described above, but may protrude.

図３に、枡型１２の凹み１５内に封止材１１を充填する方法の一例を示す。この例では、半田印刷のように、枡型１２の凹み形成枠１３の上にメタルマスク１８を配置し、メタルマスク１８の上に凹み１５の内容積よりもやや多い量の液状の封止材１１を滴下する。この封止材１１をスキージ１９の移動で凹み１５内に押し込む。このとき、気泡を取り除くため、真空引きを行ってもよいし、圧力を適宜印加してもよい。そして、封止材１１を凹み１５内に充填し、余分な封止材１１を掻き取って、充填上面が凹み１５の開口と面一になるように整えると、一定量の封止材１１が正確に計量される。   FIG. 3 shows an example of a method of filling the sealing material 11 in the recess 15 of the bowl 12. In this example, as in solder printing, a metal mask 18 is disposed on the recess forming frame 13 of the bowl 12, and a liquid sealing material having an amount slightly larger than the inner volume of the recess 15 on the metal mask 18. 11 is added dropwise. The sealing material 11 is pushed into the recess 15 by the movement of the squeegee 19. At this time, in order to remove bubbles, vacuuming may be performed, or pressure may be appropriately applied. Then, when the sealing material 11 is filled into the recess 15, the excess sealing material 11 is scraped off and the filling upper surface is aligned with the opening of the recess 15, a certain amount of the sealing material 11 is obtained. Accurately weighed.

他の方法として、凹み１５にノズル（図示略）を差し込み、凹み１５の内容積よりもやや多い量の液状の封止材１１を注入した後、上記と同様に余分な封止材１１を掻き取って、充填上面が凹み１５の開口と面一になるように整えることによっても、計量供給が可能である。   As another method, a nozzle (not shown) is inserted into the recess 15 and an amount of liquid sealing material 11 slightly larger than the inner volume of the recess 15 is injected, and then the excess sealing material 11 is scraped in the same manner as described above. It is also possible to supply the metering by arranging the filling upper surface to be flush with the opening of the recess 15.

一般的に、このような微少量の計量供給を高精度に行うには、高価なディスペンサ（液体定量吐出装置）が必要となるが、本発明によれば、上記のようにやや多い封止材１１を滴下、注入等してから余分を掻き取る方法をとることができるので、安価な設備で素早く計量供給することができる。   In general, an expensive dispenser (liquid dispensing device) is required to perform such a small amount of metering supply with high accuracy, but according to the present invention, a slightly larger amount of sealing material is used as described above. Since 11 can be dropped, injected, etc., the excess can be scraped off, so that it can be quickly metered with inexpensive equipment.

［４］封止材の移動ステップ
図４の（ａ）〜（ｅ）に示す手順によって、枡型１２の凹み１５内の液状の封止材１１を、ＬＥＤチップ８に移動させる。 [4] Moving Step of Sealing Material The liquid sealing material 11 in the recess 15 of the bowl 12 is moved to the LED chip 8 by the procedure shown in FIGS.

まず、同図（ａ）に示すように、上記［１］のＬＥＤパッケージ１０を天地逆にして上記［２］の枡型１２の上に載せ、凹部形成枠３と凹み形成枠１３とを突き合わせて密着させる。この密着により、向かい合わされた凹部５と凹み１５とが密閉されるため、以後のコンタミネーションが防止される。この状態のＬＥＤパッケージ１０と枡型１２は、上下反転装置２１によって、一緒に上下反転されるようになっている。   First, as shown in FIG. 2A, the LED package 10 of [1] is turned upside down and placed on the saddle 12 of [2], and the recess forming frame 3 and the recess forming frame 13 are brought into contact with each other. And make close contact. Due to this close contact, the concave portion 5 and the concave portion 15 which face each other are sealed, so that subsequent contamination is prevented. The LED package 10 and the bowl 12 in this state are turned upside down by the upside down device 21.

次に、同図（ｂ）に示すように、ＬＥＤパッケージ１０と枡型１２を上下反転装置２１によって一緒に上下反転させ、枡型１２についてみれば天地逆にする。この上下反転後に（又は上下反転前に）、高電圧発生装置２５から電圧を印加するための電極を接続する。電極は、第１リード６及び第２リード７の２ヶ所に正電極２６の先端を当接させて接続し、枡型１２の導電プレート１７に負電極２７の先端を当接させて接続する。ただし、この極性は逆でもよい。リード６，７に当接する電極の先端は、ＬＥＤランプ製品が加傷しないように、アール形状が好ましい。   Next, as shown in FIG. 2B, the LED package 10 and the saddle 12 are turned upside down together by the upside down device 21, and the upside down is seen for the saddle 12. After this upside down (or before upside down), an electrode for applying a voltage from the high voltage generator 25 is connected. The electrodes are connected by bringing the tip of the positive electrode 26 into contact with the two locations of the first lead 6 and the second lead 7 and contacting the tip of the negative electrode 27 with the conductive plate 17 of the saddle 12. However, this polarity may be reversed. The tip of the electrode in contact with the leads 6 and 7 is preferably rounded so that the LED lamp product is not damaged.

続いて、同図（ｃ）に示すように、リード６，７と導電プレート１７に電圧を印加する。印加極性は動作中一定とし、電圧はパルス形状とする。
・封止材１１は、その粘度が高い場合には、同図（ｂ）で枡型１２を天地逆にしただけでは枡型１２内に留まるため、この同図（ｃ）で印加した電圧によって初めて、次の同図（ｄ）のとおりＬＥＤ側に移動する。
・封止材１１は、その粘度が低い場合には、同図（ｂ）で枡型１２を天地逆にした時から、重力により一部がＬＥＤ側へ移動することもあり、その場合には、重力により移動しなかった凹み１５内の残部が、この同図（ｃ）で印加した電圧によって次の同図（ｄ）のとおりＬＥＤ側に移動する。 Subsequently, a voltage is applied to the leads 6 and 7 and the conductive plate 17 as shown in FIG. The applied polarity is constant during operation and the voltage is pulsed.
-When the viscosity of the sealing material 11 is high, it remains in the saddle 12 only by reversing the saddle 12 in FIG. 2B, so that the voltage applied in FIG. For the first time, it moves to the LED side as shown in FIG.
-If the viscosity of the sealing material 11 is low, a part of the sealing material 11 may move to the LED side due to gravity after the saddle mold 12 is turned upside down in FIG. The remaining part in the dent 15 that did not move due to gravity moves to the LED side as shown in FIG. 6D by the voltage applied in FIG.

同図（ｄ）に示すように、封止材１１は、導電プレート１７から印加した高電圧で帯電し、同電位電荷によるクーロン力（斥力）によって***し、微粒化する。微粒化した粒子は、今度はＬＥＤ側との異極間で発生する電界によるクーロン力（引力）によって、ＬＥＤ側に引き寄せられて飛翔し、ＬＥＤ側で積み上がる。電荷は、ＬＥＤ側に到達した瞬間、正電極２６に移動する。   As shown in FIG. 4D, the sealing material 11 is charged with a high voltage applied from the conductive plate 17, and is split and atomized by Coulomb force (repulsive force) due to the same potential charge. The atomized particles are attracted to the LED side and fly by the Coulomb force (attractive force) due to the electric field generated between the different polarity from the LED side, and accumulate on the LED side. The charge moves to the positive electrode 26 as soon as it reaches the LED side.

同図（ｅ）に、塗布最終時の状態を示す。封止材１１は、凹部５内のＬＥＤチップ８、底板４、第１リード６及び第２リード７に積み上がって塗布され、特にＬＥＤチップ８を覆うようにして封止する。塗布完了は、一般的に時間経過を監視し、設定時間経過後完了としてもよい。しかし、より好ましい形態は、電荷の移動に伴う電流量とそのピーク値をカウントし、カウント量の時間比、増加微分値が一定以下になれば終了とみなす制御をすれば、より確実に塗布完了を検知できる。   FIG. 5E shows a state at the final application time. The sealing material 11 is stacked and applied to the LED chip 8, the bottom plate 4, the first lead 6, and the second lead 7 in the recess 5, and seals the LED chip 8 in particular. The application completion may generally be monitored after a lapse of time and completed after the set time has elapsed. However, the more preferable form is to count the current amount accompanying the movement of the charge and its peak value, and complete the application more reliably if the time ratio of the count amount and the increase differential value are controlled to be regarded as the end when it is below a certain level. Can be detected.

［４］封止材の固化ステップ
ＬＥＤチップ８を覆った液状の封止材１１を反応硬化、熱硬化等により固化させ、適当な時点で枡型１２や電極を外せば、図４（ｆ）に示すようなＬＥＤランプ１が完成する。 [4] Solidification Step of Sealing Material If the liquid sealing material 11 covering the LED chip 8 is solidified by reaction curing, heat curing, etc., and the saddle 12 and the electrode are removed at an appropriate time, FIG. The LED lamp 1 as shown in FIG.

以上説明した本実施例の特徴は、封止材の計量と移動とを同時に行っていた従来の方法から、計量と移動とを分離した点である。従って、計量ステップと移動ステップが分離していれば、本実施例のような形態にとらわれることなく、別の形態も可能である。   The feature of the present embodiment described above is that the metering and movement are separated from the conventional method in which the sealing material is metered and moved simultaneously. Therefore, as long as the weighing step and the moving step are separated, other forms are possible without being limited to the form of the present embodiment.

本実施例によれば、次の作用・効果が得られる。
（ａ）予め、枡型１２の凹み１５内に液状の封止材１１を充填して計量することにより、ＬＥＤチップ８に塗布する封止材の塗布量を常に一定にできる。このため、封止面の高さが一定となり発光量が安定する。また、ＬＥＤ側の凹部５からあふれ出るおそれはなくなる。
（ｂ）封止材の塗布量が一定となることにより、蛍光体の量も一定となるため、ＬＥＤ発光スペクトル、発光色度、演色性等のバラツキが少なくなり、ＬＥＤランプの歩留まりが向上する。
（ｃ）枡型１２の凹み１５内で計量する際、圧力や真空が掛けられるので、気泡侵入が少なくなり、より安定に計量可能である。
（ｄ）移動ステップにおいて、凹み１５内の液状の封止材１１の一部を重力によりＬＥＤチップ８に移動させるとともに、凹み１５内の液状の封止材１１の残部を静電塗布によりＬＥＤチップ８に移動させる場合には、移動ステップに要する時間（塗布時間）を短縮することができる。前述のとおり、静電塗布には長時間を要するが、重力により移動した分だけ、静電塗布により移動させる量か減少するからである。
（ｅ）枡型１２とＬＥＤパッケージ１０とを密着させることができるので、塗布中の外部からのコンタミネーションが少なくなる。
（ｆ）枡型１２の凹み１５内に異物が入っても、洗浄することが可能であり、異物が次の使用時に引き継がれることはない。 According to the present embodiment, the following actions and effects can be obtained.
(A) By previously filling and measuring the liquid sealing material 11 in the recess 15 of the saddle 12, the coating amount of the sealing material applied to the LED chip 8 can always be made constant. For this reason, the height of the sealing surface becomes constant, and the light emission amount is stabilized. Moreover, there is no risk of overflowing from the LED-side recess 5.
(B) Since the coating amount of the sealing material is constant, the amount of the phosphor is also constant, so that variations in the LED emission spectrum, light emission chromaticity, color rendering, etc. are reduced, and the yield of the LED lamp is improved. .
(C) Since pressure or vacuum is applied when measuring in the recess 15 of the saddle 12, bubble intrusion is reduced and measurement can be performed more stably.
(D) In the moving step, a part of the liquid sealing material 11 in the recess 15 is moved to the LED chip 8 by gravity, and the remaining part of the liquid sealing material 11 in the recess 15 is electrostatically applied to the LED chip. In the case of moving to 8, the time required for the moving step (coating time) can be shortened. As described above, electrostatic coating takes a long time, but the amount moved by electrostatic coating decreases by the amount moved by gravity.
(E) Since the mold 12 and the LED package 10 can be brought into close contact with each other, contamination from the outside during application is reduced.
(F) Even if a foreign substance enters the recess 15 of the bowl 12, it can be cleaned, and the foreign substance is not taken over at the next use.

次に、図５に示す実施例２は、同図（ａ）（ｂ）に示すように、ＬＥＤパッケージ１０が底板４と一体の凹部形成枠を備えておらず、同図（ｃ）〜（ｆ）に示すように、封止材１１の移動ステップと固化ステップの間だけ一時的に凹部形成枠３’を取着して設ける点において実施例１と相違するものであり、その他は実施例１と同じである。凹部形成枠３’はリング状であり、リングは円形でも多角形でもよい。固化ステップが完了すると、凹部形成枠３’は取り外され、同図（ｇ）に示すようなＬＥＤランプ１が完成する。この実施例２によっても、実施例１と同様の作用効果が得られる。   Next, in Example 2 shown in FIG. 5, as shown in FIGS. 5A and 5B, the LED package 10 does not include a recess forming frame integrated with the bottom plate 4, and FIGS. As shown in f), this embodiment is different from the first embodiment in that the recess forming frame 3 ′ is temporarily attached and provided only between the moving step and the solidifying step of the sealing material 11, and the other embodiments are the same. Same as 1. The recess forming frame 3 ′ has a ring shape, and the ring may be circular or polygonal. When the solidification step is completed, the recess forming frame 3 'is removed, and the LED lamp 1 as shown in FIG. According to the second embodiment, the same effects as those of the first embodiment can be obtained.

次に、図６及び図７に示す実施例３は、図６に示すように、複数のＬＥＤパッケージ１０が水平方向に並ぶように配置されたものとされ、これに対応して、図７に示すように、複数の枡型１２が水平方向に並ぶように配置されたものとされ、封止材の計量ステップを複数の枡型１２において行い、封止材の移動ステップを複数の枡型１２及びＬＥＤパッケージ１０において行うことにおいて実施例１と相違するものであり、その他は実施例１と同じである。   Next, in Example 3 shown in FIGS. 6 and 7, as shown in FIG. 6, a plurality of LED packages 10 are arranged in a horizontal direction. As shown, the plurality of saddle molds 12 are arranged in a horizontal direction, the sealing material measuring step is performed in the plurality of saddle molds 12, and the sealing material moving step is performed in the plurality of saddle molds 12. And what is different from the first embodiment in what is performed in the LED package 10 is the same as the first embodiment.

図６に示すように、複数のＬＥＤパッケージ１０は、金属板を所望の形状に打ち抜くか若しくはエッチングで不必要部分を溶かし除去して形成されたリード６，７の複合体３０の周囲に、絶縁性の樹脂を金型内で射出成型、トランスファ成形等して形成された複数のケース２を相互に離間して備えることにより、全体が一体化されている。各ＬＥＤパッケージ１０の構成は実施例１と同じであり、凹部５の内底部においてＬＥＤチップ８が実装されている。   As shown in FIG. 6, a plurality of LED packages 10 are insulated around a composite 30 of leads 6 and 7 formed by punching a metal plate into a desired shape or melting and removing unnecessary portions by etching. The plurality of cases 2 formed by injection molding, transfer molding or the like in the mold are provided with a plurality of case 2 spaced apart from each other, so that the whole is integrated. The configuration of each LED package 10 is the same as that of the first embodiment, and the LED chip 8 is mounted on the inner bottom portion of the recess 5.

図７に示すように、複数の枡型１２は、金属板を所望の形状に打ち抜くか若しくはエッチングで不必要部分を溶かし除去して形成された導電プレート１７の複合体３１の周囲に、絶縁性の樹脂を金型内で射出成型、トランスファ成形等して形成された複数の枡型１２を連続的に備えることにより、全体が一体化されている。各枡型１２の構成は実施例１と同じであり、凹み１５の内底面に導電プレート１７の上面が露出しており、孔１６により導電プレート１７の下面の一部が露出している。   As shown in FIG. 7, the plurality of saddle molds 12 have insulating properties around the composite 31 of the conductive plate 17 formed by punching a metal plate into a desired shape or dissolving and removing unnecessary portions by etching. The resin is continuously provided with a plurality of saddle molds 12 formed by injection molding, transfer molding or the like in a mold. The configuration of each saddle mold 12 is the same as that of the first embodiment. The upper surface of the conductive plate 17 is exposed on the inner bottom surface of the recess 15, and a part of the lower surface of the conductive plate 17 is exposed through the hole 16.

また、図７の枡型の変更例を、図８（底面図）に示す。この変更例は、図７の枡型にさらに追加工したものである。すなわち、枡型１２の一つ一つに個別に電圧を印加できるようにするため、ダイサー（円状ノコギリ）等で、反開口側より、切れ目３２を、複合体３１の導電プレート１７相互間が切断（分割）される程度まで入れる。これにより各枡型１２の導電プレート１７は互いに導通しないように分離される。また、縦一列のみの分割も可能である。
なお、使用する封止材の樹脂が低粘度で、微粒化しやすい場合には、図７の枡型で足り、使用する封止材の樹脂が高粘度で、微粒化しにくい場合には、図８の変更例の枡型を用いて個別に電圧印加を制御することが好ましい。 FIG. 8 (bottom view) shows a modification of the saddle shape of FIG. This modified example is a further modification to the saddle shape of FIG. That is, in order to individually apply a voltage to each of the saddle molds 12, with a dicer (circular saw) or the like, the cut 32 is formed between the conductive plates 17 of the composite 31 from the side opposite to the opening. Insert until cut (divided). As a result, the conductive plates 17 of the saddle molds 12 are separated so as not to conduct each other. Further, it is possible to divide only one vertical column.
In addition, when the resin of the sealing material to be used is low viscosity and easily atomized, the saddle shape of FIG. 7 is sufficient, and when the resin of the sealing material to be used is high viscosity and difficult to atomize, FIG. It is preferable to individually control the voltage application using the saddle type of the modified example.

封止材の計量ステップでは、図７又は図８の複数の枡型１２の各凹み１５内に、液状の封止材を充填することにより計量して供給する。この計量供給は、凹み１５の一つ一つに順次行ってもよいし、複数又は全数の凹み１５に同時に行ってもよい。   In the sealing material measurement step, the liquid sealing material is measured and supplied by filling each recess 15 of the plurality of saddle molds 12 of FIG. 7 or FIG. This metering may be sequentially performed on each of the recesses 15 or may be performed simultaneously on a plurality or all of the recesses 15.

封止材の移動ステップでは、まず、図６の複数のＬＥＤパッケージ１０を一体で天地逆にして、図７又は図８の複数の枡型１２の上に載せ、凹部形成枠と凹み形成枠とを突き合わせて密着させ、次に、複数のＬＥＤパッケージ１０と複数の枡型１２とを一緒に上下反転させ、その後は、実施例１と同様の手順により電圧を印加して封止材をＬＥＤ側に移動させる。図７の枡型１２を用いる場合、電圧の印加は、各凹み１５内の封止材に対して同時に行うことになるため、移動ステップは一回の動作で完了する。図８の枡型１２を用いる場合には、電圧の印加は、各凹み１５内の封止材に対して同時に開始するが、時間経過もしくは電流検知を行い、封止が完了したものから印加を終了する。   In the step of moving the sealing material, first, the plurality of LED packages 10 of FIG. 6 are integrally turned upside down and placed on the plurality of saddle molds 12 of FIG. 7 or FIG. Next, the plurality of LED packages 10 and the plurality of saddle molds 12 are turned upside down together, and then a voltage is applied by the same procedure as in Example 1 so that the sealing material is placed on the LED side. Move to. When the saddle mold 12 of FIG. 7 is used, voltage application is performed simultaneously on the sealing material in each recess 15, so that the moving step is completed in one operation. When the saddle type 12 of FIG. 8 is used, the voltage application starts simultaneously with the sealing material in each recess 15, but the time elapses or the current is detected, and the application is performed after the sealing is completed. finish.

封止材の固化ステップは、実施例１と同様である。この実施例３によっても、実施例１と同様の作用効果が得られ、さらに枡型１２を複数配置することで、計量ステップや移動ステップを複数同時に実施でき、全体として所要時間が短縮され、量産工法として適している。   The solidification step of the sealing material is the same as that in the first embodiment. Also in this third embodiment, the same effect as in the first embodiment can be obtained. Furthermore, by arranging a plurality of saddle molds 12, a plurality of weighing steps and moving steps can be performed simultaneously, and the required time is shortened as a whole, and mass production is performed. Suitable as a construction method.

なお、本発明は前記実施例に限定されるものではなく、発明の趣旨から逸脱しない範囲で適宜変更して具体化することもできる。   In addition, this invention is not limited to the said Example, In the range which does not deviate from the meaning of invention, it can change suitably and can be actualized.

１ ＬＥＤランプ
２ ケース
３ 凹部形成枠
３’ 凹部形成枠
４ 底板
５ 凹部
６ 第１リード
７ 第２リード
８ ＬＥＤチップ
９ ボンディングワイヤ
１０ ＬＥＤパッケージ
１１ 封止材
１２ 枡型
１３ 凹み形成枠
１４ 底板
１５ 凹み
１６ 孔
１７ 導電プレート
１８ メタルマスク
１９ スキージ
２１ 上下反転装置
２５ 高電圧発生装置
２６ 正電極
２７ 負電極
３０ 複合体
３１ 複合体
３２ 切れ目 DESCRIPTION OF SYMBOLS 1 LED lamp 2 Case 3 Concave formation frame 3 'Concave formation frame 4 Bottom plate 5 Concave part 6 1st lead 7 2nd lead 8 LED chip 9 Bonding wire 10 LED package 11 Sealing material 12 Saddle type 13 Concave formation frame 14 Bottom plate 15 Concave 16 hole 17 conductive plate 18 metal mask 19 squeegee 21 upside down device 25 high voltage generator 26 positive electrode 27 negative electrode 30 composite 31 composite 32 break

Claims (5)

ＬＥＤチップを封止材で封止したＬＥＤランプの製造に用いる封止材の枡型装置であって、A vertical device for a sealing material used for manufacturing an LED lamp in which an LED chip is sealed with a sealing material,
凹み形成枠の内側に上面が開口した凹みが形成され、該凹み内に供給する液状の封止材に接触可能で且つ外部の高電圧発生装置に接続可能な導電体を備えた枡型と、A bowl having a conductor formed with a recess whose upper surface is opened inside the recess forming frame, capable of contacting a liquid sealing material supplied into the recess and connectable to an external high voltage generator;
前記枡型を上下反転する上下反転装置とを備えた封止材の枡型装置。A sealing-type saddle-type device comprising an upside-down reversing device for vertically flipping the saddle-type. 複数の枡型が水平方向に並ぶように配置されている請求項１記載の封止材の枡型装置。2. The sealing material scissor device according to claim 1, wherein a plurality of scissors are arranged in a horizontal direction. 請求項１又は２に記載の封止材の枡型装置を使用して行うＬＥＤランプの製造方法であって、A method for manufacturing an LED lamp using the vertical device for a sealing material according to claim 1,
前記凹み内に、液状の封止材を充填することにより計量して供給する計量ステップと、A metering step for metering and supplying by filling a liquid sealing material in the recess;
実装面上に実装されたＬＥＤチップの上方に、前記枡型を前記上下反転装置により上下反転して配置し、前記高電圧発生装置から電圧を印加するための電極を、前記ＬＥＤチップのリードと前記導電体とに当接させて接続し、凹み内の液状の封止材を静電塗布によりＬＥＤチップに移動させる移動ステップと、Above the LED chip mounted on the mounting surface, the saddle type is vertically inverted by the upside down device, and an electrode for applying a voltage from the high voltage generator is provided as the lead of the LED chip. A moving step of contacting and connecting the conductor and moving the liquid sealing material in the recess to the LED chip by electrostatic application;
ＬＥＤチップに移動した液状の封止材を固化させる固化ステップとを含むことを特徴とするＬＥＤランプの製造方法。And a solidifying step of solidifying the liquid sealing material moved to the LED chip. 請求項１又は２に記載の封止材の枡型装置を使用して行うＬＥＤランプの製造方法であって、A method for manufacturing an LED lamp using the vertical device for a sealing material according to claim 1,
前記凹み内に、液状の封止材を充填することにより計量して供給する計量ステップと、A metering step for metering and supplying by filling a liquid sealing material in the recess;
実装面上に実装されたＬＥＤチップの上方に、前記枡型を前記上下反転装置により上下反転して配置し、凹み内の液状の封止材の一部を重力によりＬＥＤチップに移動させるとともに、前記高電圧発生装置から電圧を印加するための電極を、前記ＬＥＤチップのリードと前記導電体とに当接させて接続し、凹み内の液状の封止材の残部を静電塗布によりＬＥＤチップに移動させる移動ステップと、Above the LED chip mounted on the mounting surface, the saddle mold is inverted upside down by the upside down device, and a part of the liquid sealing material in the recess is moved to the LED chip by gravity, An electrode for applying a voltage from the high voltage generator is connected in contact with the lead of the LED chip and the conductor, and the remainder of the liquid sealing material in the recess is electrostatically applied to the LED chip. A moving step to move to
ＬＥＤチップに移動した液状の封止材を固化させる固化ステップとを含むことを特徴とするＬＥＤランプの製造方法。And a solidifying step of solidifying the liquid sealing material moved to the LED chip. 実装面上に実装されたＬＥＤチップの周囲に凹部形成枠が設けられ、前記塗布ステップで枡型を上下反転して配置したときに、凹部形成枠と凹み形成枠とが突き合わされて密着する請求項３又は４記載のＬＥＤランプの製造方法。A recess-forming frame is provided around the LED chip mounted on the mounting surface, and the recess-forming frame and the recess-forming frame are abutted and closely contacted when the saddle mold is turned upside down in the application step. Item 5. A method for producing an LED lamp according to Item 3 or 4.
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