JP6010469B2 - Heat dissipating structure of heating element and electronic device having the same - Google Patents
Heat dissipating structure of heating element and electronic device having the same Download PDFInfo
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本発明は、撮像素子等の発熱体の放熱構造及びこれを具える撮像装置等の電子機器に関するものである。 The present invention relates to a heat dissipation structure for a heating element such as an image sensor and an electronic apparatus such as an image pickup apparatus including the heat dissipation structure.
デジタルカメラや携帯電話機、スマートフォン、ＰＤＡ(Personal Digital Assistant)等の撮像機能を有する機器(以下、適宜「撮像装置」と称する)には、レンズを収容したレンズ鏡筒に撮像素子ユニットを装着したレンズユニットが搭載されている。 In a device having an imaging function such as a digital camera, a mobile phone, a smartphone, or a PDA (Personal Digital Assistant) (hereinafter referred to as “imaging device” as appropriate), a lens in which an imaging element unit is mounted on a lens barrel containing a lens The unit is installed.
撮像素子ユニットは、レンズを通過した光線が入射する撮像素子を素子取付プレートに取り付けて構成され、撮像素子は、リジッド基板とフレキシブル基板を介して撮像装置の制御基板に電気的に接続される。 The image sensor unit is configured by attaching an image sensor on which a light beam having passed through a lens is incident to an element mounting plate, and the image sensor is electrically connected to a control board of the image pickup apparatus via a rigid board and a flexible board.
上記撮像素子ユニットは、素子取付プレートをレンズ鏡筒にネジ止め等することにより装着され、撮像装置に組み込まれる。 The imaging element unit is mounted by screwing the element mounting plate to the lens barrel and is incorporated in the imaging apparatus.
撮像装置の小型化及び薄型化に伴いレンズユニットにも小型化及び薄型化の要請がある。特に携帯電話機やスマートフォン、ＰＤＡなどの薄型の機器に搭載されるレンズユニットは、薄型化の要請が強い。 Along with the downsizing and thinning of the imaging device, there is also a demand for downsizing and thinning of the lens unit. In particular, a lens unit mounted on a thin device such as a mobile phone, a smartphone, or a PDA is strongly demanded to be thin.
このため、撮像素子ユニットも小型化や薄型化、幅狭化が求められている。 For this reason, the image sensor unit is also required to be reduced in size, thickness, and width.
撮像素子ユニットの小型化等を図るために、リジッド基板を撮像素子とほぼ同じ大きさとしたものも提案されている。 In order to reduce the size of the image sensor unit and the like, there has also been proposed a rigid substrate having the same size as the image sensor.
撮像素子として、ＣＣＤ(Charge Coupled Device)やＣＭＯＳ(Complementary Metal Oxide Semiconductor)が知られているが、これら撮像素子は、撮像、動画の撮像の際に、発熱する発熱体である。特に、動画撮像に用いられるＣＭＯＳは、消費電力が大きく、ＣＭＯＳ自身の発熱によって、撮像画質が劣化したり、動作保証温度外まで熱が上がると、動作不良を生じる虞がある。 CCDs (Charge Coupled Devices) and CMOSs (Complementary Metal Oxide Semiconductors) are known as imaging elements, and these imaging elements are heating elements that generate heat during imaging and moving image imaging. In particular, a CMOS used for moving image capturing consumes a large amount of power. If the image quality of the image deteriorates due to the heat generated by the CMOS itself, or if the heat rises outside the guaranteed operating temperature, there is a risk of malfunction.
撮像素子から発せられた熱は、一部がリジッド基板から放熱されるが、上記のとおり、撮像素子ユニットの小型化等を図るために、リジッド基板も小型化、幅狭化する必要があり、十分な放熱を図ることができない。 Part of the heat generated from the image sensor is dissipated from the rigid board, but as described above, the rigid board also needs to be downsized and narrowed in order to reduce the size of the image sensor unit. Sufficient heat dissipation cannot be achieved.
本発明の目的は、放熱特性にすぐれる発熱体の放熱構造及びこれを具えた電子機器を提供することである。 An object of the present invention is to provide a heat dissipating structure for a heating element having excellent heat dissipating characteristics, and an electronic apparatus including the heat dissipating structure.
本発明に係る発熱体の放熱構造は、
発熱体と、
該発熱体が間隔を存して嵌まる開口を有する第１の放熱板と、
を具え、
前記第１の放熱板の開口の周縁には、溝が凹設されており、該溝が前記発熱体と対向する溝端部は、前記開口の内縁よりも凹んだ凹部を具え、前記溝と前記凹部に熱伝導性にすぐれる樹脂を充填することで、前記発熱体と前記第１の放熱板を熱的に接続する。
The heat dissipating structure of the heating element according to the present invention is
A heating element;
A first heat radiating plate having an opening into which the heating element fits at an interval;
With
A groove is provided in a peripheral edge of the opening of the first heat radiating plate, and a groove end portion facing the heating element includes a recessed portion recessed from an inner edge of the opening. By filling the recess with resin having excellent thermal conductivity, the heating element and the first heat radiating plate are thermally connected.
上記発熱体の放熱構造は、電子機器に配備することができる。 The heat dissipating structure of the heating element can be provided in an electronic device.
前記発熱体は、撮像素子とすることができる。 The heating element may be an image sensor.
前記撮像素子は、撮像素子ユニットに組み込まれる。 The image sensor is incorporated in an image sensor unit.
前記撮像素子ユニットは、レンズを収容したレンズ鏡筒に取り付けてレンズユニットを構成する。 The image sensor unit is attached to a lens barrel that houses a lens to constitute a lens unit.
前記レンズユニットは、撮像装置に組み込まれる。 The lens unit is incorporated in an imaging device.
本発明に係る発熱体の放熱構造によれば、熱伝導性にすぐれる樹脂は、第１の放熱板の開口に発熱体を嵌めた状態で、溝と凹部に充填されることで、発熱体と第１の放熱板を熱的に接続する。この熱的な接続により、発熱体から発せられた熱は、熱伝導性にすぐれる樹脂を介して、第１の放熱板に伝導し、発熱体の温度上昇を抑えることができる。 According to the heat dissipation structure for a heating element according to the present invention, the resin having excellent thermal conductivity is filled in the groove and the recess while the heating element is fitted in the opening of the first heat dissipation plate. And the first heat sink are thermally connected. By this thermal connection, heat generated from the heating element is conducted to the first heat radiating plate through a resin having excellent thermal conductivity, and the temperature rise of the heating element can be suppressed.
以下、本発明の発熱体の放熱構造について、発熱体として撮像素子(20)、電子機器として、画像や動画を撮像するデジタルカメラ、携帯電話機、スマートフォン、ＰＤＡ等の撮像装置に適用した実施形態につき、図面に沿って説明する。 Hereinafter, with respect to the heat dissipation structure of the heating element of the present invention, the imaging element (20) as a heating element, and an embodiment applied to an imaging device such as a digital camera, a mobile phone, a smartphone, or a PDA that captures an image or a moving image as an electronic device This will be described with reference to the drawings.
図１は、撮像素子(20)を具える撮像素子ユニット(10)の分解斜視図である。図に示すように、撮像素子ユニット(10)は、撮像素子(20)の撮像面(21)の裏面側にリジッド基板(22)及びフレキシブル基板(23)を半田付け等により電気的に接続し、撮像素子(20)の周囲に素子取付プレート(30)、フレキシブル基板(23)の背面に放熱プレート(24)(第２の放熱板)を装着して構成することができる。 FIG. 1 is an exploded perspective view of an image sensor unit (10) including an image sensor (20). As shown in the figure, the image sensor unit (10) is electrically connected to the back side of the image pickup surface (21) of the image sensor (20) by, for example, soldering a rigid board (22) and a flexible board (23). The element mounting plate (30) can be mounted around the imaging element (20), and the heat radiating plate (24) (second heat radiating plate) can be mounted on the back surface of the flexible substrate (23).
撮像素子(20)として、ＣＣＤやＣＭＯＳなどのイメージセンサを例示することができる。撮像素子(20)は、図１に示すように、一方の面に撮像面(21)が形成され、背面側には図示省略する電気接点が配置される。 Examples of the image pickup device (20) include an image sensor such as a CCD or a CMOS. As shown in FIG. 1, the imaging element (20) has an imaging surface (21) formed on one surface, and electrical contacts (not shown) are arranged on the back side.
撮像素子(20)の背面の電気接点には、図３及び図４に示すように、リジッド基板(22)が半田付け(28)等により電気的に接続される。リジッド基板(22)は、撮像素子ユニット(10)の大型化、幅広化を防ぐために、撮像素子(20)と略同じ大きさとすることが望ましい。 As shown in FIGS. 3 and 4, a rigid substrate (22) is electrically connected to the electrical contacts on the back surface of the image pickup device (20) by soldering (28) or the like. The rigid substrate (22) is preferably approximately the same size as the image sensor (20) in order to prevent the image sensor unit (10) from becoming large and wide.
リジッド基板(22)には、図１、図３及び図４に示すように、リジッド基板(22)の背面にフレキシブル基板(23)が半田付け等により電気的に接続される。フレキシブル基板(23)は、撮像装置の制御系に電気的に接続される。なお、図１等では、フレキシブル基板(23)は、矩形で示しているが、実際は、制御系まで届く長さを有している。 As shown in FIGS. 1, 3 and 4, a flexible substrate (23) is electrically connected to the back surface of the rigid substrate (22) by soldering or the like. The flexible substrate (23) is electrically connected to the control system of the imaging apparatus. In FIG. 1 and the like, the flexible substrate (23) is shown as a rectangle, but actually has a length that reaches the control system.
撮像素子(20)には、上記要領にてリジッド基板(22)及びフレキシブル基板(23)が電気的に接続され、図１乃至図４に示すように、フレキシブル基板(23)の背面に第２の放熱板となる放熱プレート(24)が接着剤等を用いて装着される。放熱プレート(24)は、撮像素子(20)の撮像面(21)に対して、平行に取り付けられるように調整することが望ましい。この放熱プレート(24)には、撮像素子(20)から発せられる熱の一部が、リジッド基板(22)から、又は、リジッド基板(22)、フレキシブル基板(23)を介して伝導され、放熱されることとなるが、リジッド基板(22)、フレキシブル基板(23)は熱伝導性に劣るため、放熱プレート(24)による放熱効果は十分には期待できない。 The rigid substrate (22) and the flexible substrate (23) are electrically connected to the image pickup device (20) as described above. As shown in FIGS. 1 to 4, the second surface is placed on the back surface of the flexible substrate (23). A heat radiating plate (24) serving as a heat radiating plate is mounted using an adhesive or the like. The heat radiating plate (24) is preferably adjusted so as to be attached in parallel to the imaging surface (21) of the imaging device (20). A part of the heat generated from the image sensor (20) is conducted to the heat radiating plate (24) from the rigid board (22), or through the rigid board (22) and the flexible board (23), thereby radiating heat. However, since the rigid substrate (22) and the flexible substrate (23) are inferior in thermal conductivity, the heat radiation effect by the heat radiation plate (24) cannot be sufficiently expected.
撮像素子(20)に、基板(22)(23)を介して放熱プレート(24)を取り付けた撮像素子組立体(26)に対し、撮像素子(20)の側面を囲むように素子取付プレート(30)が装着される。この素子取付プレート(30)が、本発明における第１の放熱板となる。 For the image sensor assembly (26) in which the heat radiating plate (24) is attached to the image sensor (20) through the substrates (22) and (23), the element mounting plate ( 30) is installed. This element mounting plate (30) serves as the first heat sink in the present invention.
素子取付プレート(第１の放熱板)(30)は、金属板から構成することができ、中央に撮像素子(20)の外形よりも大きい開口(31)が開設されている。撮像素子(20)は、素子取付プレート(30)の開口(31)の内縁から間隔を存して嵌められる。開口(31)を撮像素子(20)よりも大きくすることで、撮像素子(20)を素子取付プレート(30)に取り付ける際に、撮像素子(20)と素子取付プレート(30)の平行度、回転角度を調整することができる。 The element mounting plate (first heat radiating plate) (30) can be made of a metal plate, and an opening (31) larger than the outer shape of the imaging element (20) is opened at the center. The image sensor (20) is fitted with a gap from the inner edge of the opening (31) of the element mounting plate (30). By making the aperture (31) larger than the image sensor (20), when the image sensor (20) is attached to the element mounting plate (30), the parallelism between the image sensor (20) and the element mounting plate (30), The rotation angle can be adjusted.
素子取付プレート(30)は、図１乃至図３に示すように、開口(31)の周縁に、背面側に向けて凹んだ溝(32)(32)が形成されている。図示の例では、溝(32)(32)は、開口(31)の内縁４辺のうち、一方の向かい合う内縁に対向するように夫々１つずつ形成しているが、溝(32)の数は限定されるものではなく、また、溝(32)は、４辺すべてに設けてもよいし、隣り合う内縁に形成することもできる。溝(32)(32)は、プレス加工や切削などにより形成することができる。 As shown in FIGS. 1 to 3, the element mounting plate (30) has grooves (32) and (32) that are recessed toward the back side at the periphery of the opening (31). In the illustrated example, the grooves (32) and (32) are formed one by one so as to face one of the four inner edges of the opening (31), but the number of grooves (32) is different. The groove (32) may be provided on all four sides, or may be formed on adjacent inner edges. The grooves (32) and (32) can be formed by pressing or cutting.
溝(32)(32)は、開口(31)の内縁側、即ち、撮像素子(20)と対向する溝端部は、開口(31)の内縁よりも凹んだ凹部(33)(33)が形成されている。凹部(33)(33)は、プレス加工や切削などにより形成することができる。 The grooves (32) and (32) are formed on the inner edge side of the opening (31), i.e., at the groove end facing the image pickup element (20), with a recess (33) and (33) recessed from the inner edge of the opening (31) Has been. The recesses (33) and (33) can be formed by pressing or cutting.
凹部(33)(33)は、後述する熱伝導性にすぐれる樹脂(50)を注入する際に、樹脂注入用のノズルの先端が、凹部(33)(33)と撮像素子(20)との間に形成される空隙(40)(40)に挿入できる程度の深さとすることが望ましい。少なくとも、熱伝導性にすぐれる樹脂(50)が前記空隙(40)(40)に流れ込むことができる深さとする。 When injecting resin (50) having excellent thermal conductivity, which will be described later, the recesses (33) and (33) are connected to the recesses (33) and (33) and the image sensor (20). It is desirable that the depth be such that it can be inserted into the gaps (40) (40) formed between them. At least the depth is such that the resin (50) having excellent thermal conductivity can flow into the voids (40) (40).
後述するとおり、撮像素子(20)と素子取付プレート(30)は、接着剤(51)により固定される。接着剤(51)は、撮像素子(20)と開口(31)との間に注入することができ、本実施例では、図１、図２及び図４に符号(41)(41)で示す接着剤注入部に注入する。この場合、接着剤(51)の流出を防止するために、図に示すように、接着剤注入部(41)(41)と対向する開口(31)の周縁に突条(34)(34)を形成し、接着剤溜まり(35)となるようにすることが望ましい。図示の実施例では、開口(31)の溝(32)(32)の形成されていない内縁の残りの２辺に、突条(34)(34)が、開口(31)の内縁から間隔を存し、素子取付プレート(30)の正面側に向けて突出するよう形成されており、突条(34)(34)の両端は、図１及び図２に示すように、開口(31)の角又はその近傍と交差するよう屈曲している。 As will be described later, the imaging element (20) and the element mounting plate (30) are fixed by an adhesive (51). The adhesive (51) can be injected between the imaging device (20) and the opening (31). In this embodiment, the adhesive (51) is indicated by reference numerals (41) and (41) in FIGS. Inject into the adhesive injection part. In this case, in order to prevent the adhesive (51) from flowing out, the protrusions (34) (34) are formed on the periphery of the opening (31) facing the adhesive injection part (41) (41) as shown in the figure. It is desirable to form an adhesive reservoir (35). In the illustrated embodiment, the protrusions (34) and (34) are spaced from the inner edge of the opening (31) on the remaining two sides of the inner edge where the grooves (32) and (32) of the opening (31) are not formed. And is formed so as to protrude toward the front side of the element mounting plate (30), and both ends of the ridges (34) and (34) are formed with openings (31) as shown in FIGS. It is bent so as to intersect the corner or its vicinity.
また、開口(31)の周囲には、レンズユニットのレンズ鏡筒への位置決め、取付けのための孔(36)が複数開設されている。 In addition, a plurality of holes (36) for positioning and attaching the lens unit to the lens barrel are formed around the opening (31).
上述した撮像素子組立体(26)は、図２乃至図４に示すように、撮像素子(20)が、上記構成の素子取付プレート(30)の開口(31)に嵌められ、撮像素子(20)と開口(31)との間に間隔を存した状態で、撮像面(21)と素子取付プレート(30)の平行度及び回転角度を調整する。 As shown in FIGS. 2 to 4, the image sensor assembly (26) is configured such that the image sensor (20) is fitted into the opening (31) of the element mounting plate (30) having the above-described configuration. ) And the opening (31), the parallelism and the rotation angle of the imaging surface (21) and the element mounting plate (30) are adjusted.
次に、接着剤(51)を接着剤注入部(41)(41)に注入する。接着剤(51)として、紫外線硬化型、熱硬化型、湿気硬化型のものを例示することができる。
なお、接着剤(51)は、図５及び図７に示すように、突条(34)により形成される接着剤溜まり(35)がほぼ満たされる状態まで充填することが望ましい。
Next, the adhesive (51) is injected into the adhesive injection portions (41) (41). Examples of the adhesive (51) include an ultraviolet curing type, a thermosetting type, and a moisture curing type.
As shown in FIGS. 5 and 7, it is desirable that the adhesive (51) is filled until the adhesive reservoir (35) formed by the protrusions (34) is substantially filled.
接着剤(51)が硬化し、撮像素子(20)が素子取付プレート(30)に固定されると、凹部(33)(33)と撮像素子(20)が対向する空隙(40)(40)に熱伝導性にすぐれる樹脂(50)を注入する。熱伝導性にすぐれる樹脂(50)として、アルミナを含有する樹脂を例示することができる。勿論、熱伝導性にすぐれる樹脂(50)は、これに限定されるものではない。 When the adhesive (51) is cured and the image sensor (20) is fixed to the element mounting plate (30), the gap (40) (40) where the recess (33) (33) and the image sensor (20) face each other. A resin (50) having excellent thermal conductivity is injected into the container. A resin containing alumina can be exemplified as the resin (50) having excellent thermal conductivity. Of course, the resin (50) having excellent thermal conductivity is not limited to this.
熱伝導性にすぐれる樹脂(50)は、樹脂注入用のノズルから送出することが望ましく、この場合、熱伝導性にすぐれる樹脂(50)の充填度を高めるために、凹部(33)(33)により広く形成された空隙(40)(40)にノズルの先端を挿入した状態から熱伝導性にすぐれる樹脂(50)の注入を開始することができる。 The resin (50) having excellent thermal conductivity is desirably delivered from a nozzle for injecting resin.In this case, in order to increase the filling degree of the resin (50) having excellent thermal conductivity, the concave portion (33) ( The injection of the resin (50) having excellent thermal conductivity can be started from the state in which the tip of the nozzle is inserted into the gap (40) (40) formed wider by 33).
熱伝導性にすぐれる樹脂(50)が、空隙(40)(40)に充填された後、図５及び図６に示すように、溝(32)(32)を埋める程度までさらに熱伝導性にすぐれる樹脂(50)を充填することで、熱伝導性にすぐれる樹脂(50)と素子取付プレート(30)との接触面積を大きくすることができ、放熱効果を高めることができる。 After the resin (50) having excellent thermal conductivity is filled in the gaps (40) and (40), as shown in FIGS. 5 and 6, the thermal conductivity is further increased to such an extent that the grooves (32) and (32) are filled. By filling the excellent resin (50), the contact area between the resin (50) excellent in thermal conductivity and the element mounting plate (30) can be increased, and the heat dissipation effect can be enhanced.
上記により、撮像素子(20)と素子取付プレート(30)は、熱伝導性にすぐれる樹脂(50)により、熱的に接続することができる。 As described above, the imaging element (20) and the element mounting plate (30) can be thermally connected by the resin (50) having excellent thermal conductivity.
なお、第２の放熱板である放熱プレート(24)も放熱性を有するから、熱伝導性にすぐれる樹脂(50)は、図５及び図６に示すように、放熱プレート(24)にまで到達し、放熱プレート(24)と当接するように注入することが望ましい。本発明の実施例では、撮像素子(20)とリジッド基板(22)を略同じ大きさとしており、素子取付プレート(30)に凹部(33)(33)を形成しているから空隙(40)(40)を広く採ることができ、熱伝導性にすぐれる樹脂(50)の粘性が高くても放熱プレート(24)まで熱伝導性にすぐれる樹脂(50)を到達させることができる。 Since the heat radiating plate (24), which is the second heat radiating plate, also has a heat radiating property, the resin (50) having excellent heat conductivity can reach the heat radiating plate (24) as shown in FIGS. It is desirable to inject so as to reach and contact the heat radiating plate (24). In the embodiment of the present invention, the image pickup device (20) and the rigid substrate (22) have substantially the same size, and the recess (33) (33) is formed in the device mounting plate (30), so that the gap (40) (40) can be widely used, and even if the viscosity of the resin (50) excellent in thermal conductivity is high, the resin (50) excellent in thermal conductivity can reach the heat radiating plate (24).
熱伝導性にすぐれる樹脂(50)を硬化させることで、上記により構成された放熱構造を有する撮像素子ユニット(10)の組立てが完了する。 By curing the resin (50) having excellent thermal conductivity, the assembly of the imaging element unit (10) having the heat dissipation structure configured as described above is completed.
撮像素子ユニット(10)を、レンズ鏡筒の取付面に位置決め及びネジ止め等することで、レンズユニットを作製することができる。また、作製されたレンズユニットは、撮像装置に組み込んで使用することができる。 The lens unit can be manufactured by positioning and screwing the imaging element unit (10) on the mounting surface of the lens barrel. Further, the manufactured lens unit can be used by being incorporated in an imaging apparatus.
本発明の撮像素子ユニット(10)によれば、撮像素子(20)と放熱性の高い素子取付プレート(30)とを、熱伝導性にすぐれる樹脂(50)により熱的に接続することができるから、撮像素子(20)の放熱効率を高め、撮像素子(20)の発熱による画質劣化を抑えることができる。また、撮像素子(20)の放熱効率が高いから、動作保証温度外まで撮像素子(20)の熱が上がってしまうことも抑制でき、これを原因とする動作不良の発生を低減できる。 According to the image sensor unit (10) of the present invention, the image sensor (20) and the element mounting plate (30) having high heat dissipation can be thermally connected by the resin (50) having excellent thermal conductivity. Therefore, the heat radiation efficiency of the image sensor (20) can be increased, and image quality deterioration due to heat generation of the image sensor (20) can be suppressed. Further, since the heat dissipation efficiency of the image sensor (20) is high, it is possible to suppress the heat of the image sensor (20) from rising outside the guaranteed operating temperature, and the occurrence of malfunction due to this can be reduced.
本発明の放熱構造を採用した撮像素子ユニット(10)は、撮像素子(20)から発せられた熱が、リジッド基板(22)から、又は、リジッド基板(22)、フレキシブル基板(23)を介して放熱プレート(24)から十分に放熱されなくても、熱伝導にすぐれる樹脂(50)を介して素子取付プレート(30)から効率的に放熱することができる。また、リジッド基板(22)の幅狭化、小型化を図ることで、撮像素子(20)と放熱プレート(24)を熱伝導性にすぐれる樹脂(50)により熱的に接続することができるから、放熱特性を可及的に高めることができる。リジッド基板(22)の幅狭化、小型化が達成できるから、撮像素子ユニット(10)の小型化、薄型化も達成することができる。これにより、レンズユニットや撮像装置の小型化、薄型化も達成できる。 The image sensor unit (10) adopting the heat dissipation structure of the present invention is configured such that heat generated from the image sensor (20) is generated from the rigid substrate (22) or via the rigid substrate (22) and the flexible substrate (23). Even if heat is not sufficiently radiated from the heat radiating plate (24), heat can be efficiently radiated from the element mounting plate (30) via the resin (50) having excellent heat conduction. In addition, by reducing the width and size of the rigid substrate (22), the image sensor (20) and the heat radiating plate (24) can be thermally connected by the resin (50) having excellent thermal conductivity. Therefore, the heat dissipation characteristics can be enhanced as much as possible. Since the rigid substrate (22) can be reduced in width and size, the imaging element unit (10) can also be reduced in size and thickness. Thereby, size reduction and thickness reduction of a lens unit and an imaging device can also be achieved.
本発明は、撮像素子(20)として、動画撮像に用いられるＣＭＯＳを採用することが特に好適である。比較のために、上記構成の放熱構造を具えた撮像素子ユニット(10)(ＣＭＯＳを使用：発明例)と、上記構成から熱伝導性にすぐれる樹脂を注入していない撮像素子ユニット(ＣＭＯＳを使用：比較例)を作製し、動画撮像時間と温度との関係を測定した。その結果、ＣＭＯＳの温度が３０℃上昇するまでに要する時間は、発明例が２０分、比較例が１３分であり、発明例は、比較例に比して１．５倍以上長くすることができた。 In the present invention, it is particularly preferable to employ a CMOS used for moving image capturing as the image sensor (20). For comparison, an image sensor unit (10) having a heat dissipation structure with the above configuration (using CMOS: invention example) and an image sensor unit (CMOS with no resin injected from the above configuration having excellent thermal conductivity). Use: Comparative example) was prepared, and the relationship between moving image capturing time and temperature was measured. As a result, the time required for the temperature of the CMOS to rise by 30 ° C. is 20 minutes for the inventive example and 13 minutes for the comparative example, and the inventive example may be 1.5 times longer than the comparative example. did it.
なお、本発明の各部構成は上記実施の形態に限らず、特許請求の範囲に記載の技術的範囲内で種々の変形が可能である。 In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim.
例えば、発熱体は、上記撮像素子(20)に限定されるものではなく、ＣＰＵ、バッテリ、抵抗素子、その他の発熱体であってもよい。 For example, the heating element is not limited to the imaging element (20), and may be a CPU, a battery, a resistance element, or other heating element.
また、電子機器も、本発明の放熱構造が採用されるものであれば、撮像装置に限定されるものではない。 Further, the electronic apparatus is not limited to the imaging device as long as the heat dissipation structure of the present invention is employed.
本発明は、放熱特性にすぐれる発熱体の放熱構造及びこれを具えた電子機器として有用である。 INDUSTRIAL APPLICABILITY The present invention is useful as a heat dissipating structure for a heating element having excellent heat dissipating characteristics and an electronic apparatus including the same.
(10) 撮像素子ユニット
(20) 撮像素子(発熱体)
(22) リジッド基板
(23) フレキシブル基板
(24) 放熱プレート(第２の放熱板)
(30) 素子取付プレート(第１の放熱板)
(31) 開口
(32) 溝
(33) 凹部
(40) 空隙
(50) 熱伝導性にすぐれる樹脂
(10) Image sensor unit
(20) Image sensor (heating element)
(22) Rigid board
(23) Flexible substrate
(24) Heat dissipation plate (second heat dissipation plate)
(30) Element mounting plate (first heat sink)
(31) Opening
(32) Groove
(33) Recess
(40) Air gap
(50) Resins with excellent thermal conductivity
Claims (7)
該発熱体が間隔を存して嵌まる開口を有する第１の放熱板と、
を具え、
前記第１の放熱板の開口の周縁には、溝が凹設されており、該溝が前記発熱体と対向する溝端部は、前記開口の内縁よりも凹んだ凹部を具え、前記溝と前記凹部に熱伝導性にすぐれる樹脂を充填することで、前記発熱体と前記第１の放熱板を熱的に接続する、ことを特徴とする発熱体の放熱構造。 A heating element;
A first heat radiating plate having an opening into which the heating element fits at an interval;
With
A groove is provided in a peripheral edge of the opening of the first heat radiating plate, and a groove end portion facing the heating element includes a recessed portion recessed from an inner edge of the opening. A heat dissipating structure for a heating element, wherein the heat generating element and the first heat radiating plate are thermally connected by filling a resin with excellent thermal conductivity in the recess.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180105346A (en) * | 2017-03-15 | 2018-09-28 | 삼성전자주식회사 | Electronic device having heat dissipation structure of camera |
| KR20200115172A (en) * | 2019-03-29 | 2020-10-07 | 니혼 덴산 산쿄 가부시키가이샤 | Optical unit |
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| CN106163209B (en) * | 2015-03-25 | 2019-04-16 | 小米科技有限责任公司 | Radiating subassembly and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000209474A (en) * | 1999-01-20 | 2000-07-28 | Fujitsu General Ltd | Ccd camera |
| JP2006251058A (en) * | 2005-03-08 | 2006-09-21 | Fuji Photo Film Co Ltd | Digital camera and lens unit |
| JP4560121B2 (en) * | 2008-12-17 | 2010-10-13 | 株式会社東芝 | Sensor fixing device and camera module |
| JP5203318B2 (en) * | 2009-08-07 | 2013-06-05 | 日東光学株式会社 | Imaging module and manufacturing method thereof |
| JP2013223164A (en) * | 2012-04-18 | 2013-10-28 | Olympus Corp | Imaging module |
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| KR20180105346A (en) * | 2017-03-15 | 2018-09-28 | 삼성전자주식회사 | Electronic device having heat dissipation structure of camera |
| KR102384532B1 (en) * | 2017-03-15 | 2022-04-08 | 삼성전자주식회사 | Electronic device having heat dissipation structure of camera |
| KR20200115172A (en) * | 2019-03-29 | 2020-10-07 | 니혼 덴산 산쿄 가부시키가이샤 | Optical unit |
| KR102401342B1 (en) * | 2019-03-29 | 2022-05-24 | 니혼 덴산 산쿄 가부시키가이샤 | Optical unit |
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