JP6006523B2 - 接続構造体、配線基板ユニット、電子回路部品ユニット、及び電子装置 - Google Patents
接続構造体、配線基板ユニット、電子回路部品ユニット、及び電子装置 Download PDFInfo
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- JP6006523B2 JP6006523B2 JP2012103130A JP2012103130A JP6006523B2 JP 6006523 B2 JP6006523 B2 JP 6006523B2 JP 2012103130 A JP2012103130 A JP 2012103130A JP 2012103130 A JP2012103130 A JP 2012103130A JP 6006523 B2 JP6006523 B2 JP 6006523B2
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- 229910000679 solder Inorganic materials 0.000 claims description 98
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 238000007747 plating Methods 0.000 description 18
- 239000000758 substrate Substances 0.000 description 16
- 238000002161 passivation Methods 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
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- 238000004088 simulation Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/381—Pitch distance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Manufacturing & Machinery (AREA)
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- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図1は、比較例の電子装置10を示す図である。図1(A)は比較例の電子装置10の断面構造を示し、図1(B)は、比較例の電子装置10の接続構造体40の断面構造を示し、図1(C)は比較例の電子装置10の接続構造体40を示す斜視図である。
図3は、実施の形態1の電子装置100の断面構造を示す図である。図3(A)は実施の形態1の電子装置100の断面構造を示し、図3(B)は、実施の形態1の電子装置100の接続構造体140の断面構造を示す図である。以下、比較例の電子装置10と同様の構成要素には同一符号を付し、その説明を省略する。
図5は、実施の形態2の電子装置200の断面構造を示す図である。図5において、図3に示す電子装置100と同様の構成要素には同一符号を付し、その説明を省略する。
図6は、実施の形態3の電子装置300を示す図であり、(A)は断面図、(B)は接続構造体240、340を示す図、(C)は変形例の接続構造体240Aを示す図である。
20 ICチップ
30 配線基板
121 パッド
123 ポスト
131 パッド
140、240、340 接続構造体
221 パッド
261 ビア
262 ポスト
264 ポスト
265 ビア
231 パッド
270 配線基板
362 ポスト
364 ポスト
Claims (4)
- 電子回路部品と、
配線基板と、
一端が前記電子回路部品に接続され、前記電子回路部品に形成される第1パッドと、
一端が前記第1パッドの他端に接続される第1柱状電極と、
一端が前記第1柱状電極の他端にはんだによって接続される第2柱状電極と、
一端が前記第2柱状電極の他端に接続され、他端が前記配線基板に接続され、前記配線基板に形成される第2パッドと、
一端が前記配線基板に接続され、前記配線基板に形成される第3パッドと、
一端が前記第3パッドの他端に接続される第3柱状電極と、
一端が前記第3柱状電極の他端にはんだによって接続される第4柱状電極と、
一端が前記第4柱状電極の他端に接続され、他端が前記電子回路部品に接続され、前記電子回路部品に形成される第4パッドと
を含み、前記第1柱状電極の高さは、前記第1パッドの幅以上であり、前記第3柱状電極の高さは、前記第3パッドの幅以上であり、
前記第1柱状電極の幅は、前記第2柱状電極の幅よりも広く、前記第3柱状電極の幅は、前記第4柱状電極の幅より広い、電子装置。 - 前記第1柱状電極、前記第2柱状電極、前記第3柱状電極、及び前記第4柱状電極には、前記一端側から前記他端側に電子が流れる、請求項1記載の電子装置。
- 前記第1柱状電極の高さは、前記第1パッドの幅の1.3倍以下である、請求項1又は2記載の電子装置。
- 前記第1パッドは、平面視で円形であり、第1パッドの幅は、平面視で円形の前記第1パッドの直径である、請求項1乃至3のいずれか一項記載の電子装置。
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JP2012103130A JP6006523B2 (ja) | 2012-04-27 | 2012-04-27 | 接続構造体、配線基板ユニット、電子回路部品ユニット、及び電子装置 |
US13/867,188 US9105989B2 (en) | 2012-04-27 | 2013-04-22 | Connection structure, wiring substrate unit, electronic circuit part unit, and electronic apparatus |
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WO2015017902A1 (en) | 2013-08-09 | 2015-02-12 | Weir Minerals Australia Ltd | Cyclone separator apparatus and methods of production |
JP2015072996A (ja) * | 2013-10-02 | 2015-04-16 | 新光電気工業株式会社 | 半導体装置 |
JP6282454B2 (ja) * | 2013-12-10 | 2018-02-21 | 新光電気工業株式会社 | 半導体パッケージの製造方法 |
DE102016107792B4 (de) * | 2016-04-27 | 2022-01-27 | Infineon Technologies Ag | Packung und halbfertiges Produkt mit vertikaler Verbindung zwischen Träger und Klammer sowie Verfahren zum Herstellen einer Packung und einer Charge von Packungen |
JP2017224736A (ja) * | 2016-06-15 | 2017-12-21 | 富士電機株式会社 | 半導体装置、製造方法、及び導電性ポスト |
JP6534700B2 (ja) * | 2017-04-28 | 2019-06-26 | アオイ電子株式会社 | 半導体装置の製造方法 |
CN111564414B (zh) * | 2019-12-12 | 2021-09-24 | 奥特斯(中国)有限公司 | 部件承载件及制造部件承载件的方法 |
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JPS58197857A (ja) * | 1982-05-14 | 1983-11-17 | Hitachi Ltd | 半導体装置とその製造方法 |
US5334804A (en) * | 1992-11-17 | 1994-08-02 | Fujitsu Limited | Wire interconnect structures for connecting an integrated circuit to a substrate |
JP3378334B2 (ja) * | 1994-01-26 | 2003-02-17 | 株式会社東芝 | 半導体装置実装構造体 |
JP3285294B2 (ja) | 1995-08-08 | 2002-05-27 | 太陽誘電株式会社 | 回路モジュールの製造方法 |
JP4119866B2 (ja) * | 2004-05-12 | 2008-07-16 | 富士通株式会社 | 半導体装置 |
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US7999379B2 (en) * | 2005-02-25 | 2011-08-16 | Tessera, Inc. | Microelectronic assemblies having compliancy |
US20060223313A1 (en) * | 2005-04-01 | 2006-10-05 | Agency For Science, Technology And Research | Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same |
US20080185705A1 (en) * | 2005-12-23 | 2008-08-07 | Tessera, Inc. | Microelectronic packages and methods therefor |
JP2008098210A (ja) * | 2006-10-06 | 2008-04-24 | Matsushita Electric Ind Co Ltd | 突起電極形成方法、並びに半導体装置の製造方法、および半導体装置 |
JP5043743B2 (ja) * | 2008-04-18 | 2012-10-10 | ラピスセミコンダクタ株式会社 | 半導体装置の製造方法 |
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