JP5964520B2 - Electronic component joining apparatus and electronic component joining method - Google Patents

Electronic component joining apparatus and electronic component joining method Download PDF

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JP5964520B2
JP5964520B2 JP2015553686A JP2015553686A JP5964520B2 JP 5964520 B2 JP5964520 B2 JP 5964520B2 JP 2015553686 A JP2015553686 A JP 2015553686A JP 2015553686 A JP2015553686 A JP 2015553686A JP 5964520 B2 JP5964520 B2 JP 5964520B2
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electronic component
electrode
substrate
load
signal
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JPWO2015146442A1 (en
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内藤　健治
健治 内藤
川上　茂明
茂明 川上
直人 上島
直人 上島
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Athlete FA Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/7592—Load or pressure adjusting means, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Operations Research (AREA)

Description

本発明は、電子部品を基板等に接合する電子部品接合装置および電子部品接合方法に関する。 The present invention relates to an electronic component bonding apparatus and an electronic component bonding method for bonding an electronic component to a substrate or the like.

たとえば、特許文献１に開示されるように、電子部品の電極と基板の電極とを熱溶融させた半田によって接合（実装）する装置が、従来より知られている。かかる装置は、電子部品保持部に保持した電子部品の電極を基板の電極に押圧するとともに、電子部品および基板を加熱して、電極に積層された半田を溶融させ、電極同士を半田接合する。この接合に当たって、電子部品の電極と基板の電極との間に過度の押圧力が掛かると、電極が傷つられてしまう虞もある。また、半田が溶融した後も押圧を続けると、溶融した半田が押し潰され流れ出てしまい、隣接する電極同士が流れ出た半田で短絡してしまう虞がある。そのため、電子部品の電極と基板の電極との間の押圧力を適正にすると共に、半田の溶融状態に合せて電子部品の基板への移動の制御が行われる。  For example, as disclosed in Patent Document 1, an apparatus that joins (mounts) an electrode of an electronic component and an electrode of a board with heat-melted solder is conventionally known. Such an apparatus presses the electrode of the electronic component held by the electronic component holding unit against the electrode of the substrate, heats the electronic component and the substrate, melts the solder laminated on the electrode, and solders the electrodes together. In this bonding, if an excessive pressing force is applied between the electrode of the electronic component and the electrode of the substrate, the electrode may be damaged. Further, if the pressing is continued even after the solder is melted, the melted solder is crushed and flows out, and there is a possibility that adjacent electrodes are short-circuited by the flowing out solder. Therefore, the pressing force between the electrode of the electronic component and the electrode of the substrate is made appropriate, and the movement of the electronic component to the substrate is controlled in accordance with the molten state of the solder.

特開２０１１−２５４０３２号JP 2011-254032 A

しかしながら、電極に積層される半田の厚さは数十μｍ程度であるため、電子部品接合装置は、電子部品保持部の押圧力および移動量の制御に高い精度を求められる。そこで、本発明は、電子部品保持部の押圧力と移動量を高い精度で制御できる電子部品接合装置を提供することを目的とする。  However, since the thickness of the solder laminated on the electrode is about several tens of μm, the electronic component bonding apparatus is required to have high accuracy in controlling the pressing force and the moving amount of the electronic component holding portion. Then, an object of this invention is to provide the electronic component joining apparatus which can control the pressing force and movement amount of an electronic component holding part with high precision.

上述の課題を解決するため、本発明の電子部品接合装置は、電子部品を保持する電子部品保持部を基板に向けて昇降移動する電子部品昇降機構を有し、電子部品を、基板から離間した位置から電子部品の電極と基板の電極とが接触する位置まで移動させ、電子部品の電極と基板の電極とを熱溶融可能な金属を介して接合し、電子部品昇降機構は、電子部品の電極と基板の電極との間の距離が所定の距離になるまで電子部品保持部を高い速度で移動させる高速移動機構と、電子部品の電極と基板の電極との間の距離が所定の距離になった後、高い速度よりも低い速度で移動させる低速移動機構とを有し、高速移動機構は、第１移動部を移動させ、低速移動機構は、第１移動部に対して上下方向に移動可能に取り付けられる第２移動部に取り付けられ、第２移動部は、付勢手段により下方に付勢された状態でロードセルを介して第１移動部に支持されており、低速移動機構の駆動源はピエゾ素子であることとする。 In order to solve the above-described problems, an electronic component bonding apparatus according to the present invention has an electronic component lifting mechanism that moves an electronic component holding portion that holds an electronic component up and down toward a substrate, and the electronic component is separated from the substrate. The electrode of the electronic component and the electrode of the substrate are moved from the position to a position where the electrode of the substrate contacts the electrode of the electronic component and the electrode of the substrate through a heat-meltable metal. The high-speed moving mechanism that moves the electronic component holding unit at a high speed until the distance between the electrode and the substrate electrode reaches a predetermined distance, and the distance between the electrode of the electronic component and the electrode of the substrate becomes the predetermined distance. And a low-speed moving mechanism that moves at a lower speed than a high speed, the high-speed moving mechanism moves the first moving unit, and the low-speed moving mechanism can move up and down with respect to the first moving unit. Attached to the second moving part attached to Is, the second moving unit is supported by the first moving portion via a load cell in a state of being biased downward by the biasing means, and it is a drive source of the slow-moving mechanism is a piezoelectric element.

また、他の発明は、電子部品保持部に保持された電子部品に対して、基板が配置される側から作用する荷重を検出する荷重センサと、荷重センサに作用するノイズを検出するノイズ検出センサと、ノイズ検出センサにより検出されるノイズ信号に基づき荷重センサにより検出される荷重信号からノイズを除去するノイズ信号除去手段とを有することとする。  According to another aspect of the invention, there is provided a load sensor that detects a load acting on an electronic component held by the electronic component holding portion from a side where the board is disposed, and a noise detection sensor that detects noise acting on the load sensor. And noise signal removing means for removing noise from the load signal detected by the load sensor based on the noise signal detected by the noise detection sensor.

また、他の発明は、ノイズ検出センサと、荷重センサと、低速移動機構とは、電子部品保持部の移動方向に沿って配列されていることとする。  In another aspect of the invention, the noise detection sensor, the load sensor, and the low-speed moving mechanism are arranged along the moving direction of the electronic component holding unit.

また、高速移動機構は、第１移動部を移動させ、低速移動機構は、第１移動部に対して上下方向に移動可能に取り付けられる第２移動部に取り付けられ、第２移動部は、付勢手段により下方に付勢された状態でロードセルを介して第１移動部に支持されていることとする。 Also, high-speed moving mechanism moves the first moving portion, the low-speed movement mechanism is mounted on the second moving part mounted movably in the vertical direction with respect to the first moving portion, the second moving portion Suppose that it is supported by the 1st moving part via a load cell in the state where it was urged below by urging means.

また、他の発明は、電子部品保持部に保持された電子部品に対して、基板が配置される側から作用する荷重を検出する荷重センサと、荷重センサにより検出される荷重信号から所定周波数の信号を除去する所定周波数信号除去手段とを有することとする。  In another aspect of the invention, a load sensor that detects a load acting on the electronic component held by the electronic component holding unit from the side on which the board is disposed, and a load signal detected by the load sensor has a predetermined frequency. And a predetermined frequency signal removing means for removing the signal.

上述の課題を解決するため、電子部品の電極と基板の電極とを熱溶融可能な金属を介して接合する電子部品接合方法において、上述の各発明の電子部品接合装置を用い、電子部品および基板を加熱すると共に、電子部品から基板に対して所定の荷重が一定に付加された状態で、電子部品の下方への移動量を検出することにより、金属の溶融の有無を判断することとする。 In order to solve the above-mentioned problems, in an electronic component bonding method for bonding an electrode of an electronic component and an electrode of a substrate via a heat-meltable metal , the electronic component and the substrate using the electronic component bonding apparatus according to each of the above inventions In addition, the presence or absence of metal melting is determined by detecting the amount of downward movement of the electronic component in a state where a predetermined load is constantly applied to the substrate from the electronic component.

本発明は、電子部品保持部の押圧力と移動量を高い精度で制御できる電子部品接合装置を提供することを目的とする。  An object of this invention is to provide the electronic component joining apparatus which can control the pressing force and movement amount of an electronic component holding part with high precision.

本発明の実施形態である電子部品接合装置の概略の構成を示す図である。It is a figure which shows the schematic structure of the electronic component joining apparatus which is embodiment of this invention. 電子部品接合装置の電気的な構成を概略的に示すブロック図である。It is a block diagram which shows roughly the electrical structure of an electronic component joining apparatus. 図１に示すＡ部分の拡大図である。It is an enlarged view of A part shown in FIG. 本発明の実施形態である電子部品接合装置の動作を示すフローチャートである。It is a flowchart which shows operation | movement of the electronic component joining apparatus which is embodiment of this invention. 本発明の実施形態である電子部品接合装置の動作中のピエゾ印加信号、荷重センサ信号、ノイズ信号、変位センサ信号、荷重補正信号の変化を示す説明図である。It is explanatory drawing which shows the change of the piezo application signal during operation of the electronic component joining apparatus which is embodiment of this invention, a load sensor signal, a noise signal, a displacement sensor signal, and a load correction signal. 電子部品保持部を所定位置まで高速下降動作させる際の該所定位置および電子部品と基板との間隔を示す図である。It is a figure which shows the space | interval of this predetermined position and electronic component, and a board | substrate at the time of carrying out the high-speed descent | fall operation | movement of an electronic component holding part to a predetermined position. 本発明の他の実施形態に係る電子部品接合装置の電気的な構成を概略的に示すブロック図である。It is a block diagram which shows roughly the electrical structure of the electronic component joining apparatus which concerns on other embodiment of this invention. 荷重センサ信号の例を示す図である。It is a figure which shows the example of a load sensor signal. 図８に示される荷重センサ信号の周波数成分を解析した結果を示す図である。It is a figure which shows the result of having analyzed the frequency component of the load sensor signal shown by FIG. 図８に示される荷重センサ信号から１３０Ｈｚおよび３３０Ｈｚの信号を除去した信号を示す図である。It is a figure which shows the signal which removed the signal of 130 Hz and 330 Hz from the load sensor signal shown by FIG. 図８に示される荷重センサ信号から１３０Ｈｚの信号を除去した荷重センサ信号を示す図である。It is a figure which shows the load sensor signal which removed the signal of 130 Hz from the load sensor signal shown by FIG. 図８に示される荷重センサ信号から３３０Ｈｚの信号を除去した荷重センサ信号を示す図である。It is a figure which shows the load sensor signal which removed the signal of 330 Hz from the load sensor signal shown by FIG.

（本実施形態の電子部品接合装置１）
以下、本発明の実施の形態にかかる電子部品接合装置１ついて図面を参照しながら説明する。以下の説明において、矢示Ｘ１方向を電子部品接合装置１の上方、矢示Ｘ２方向を下方とし、また、矢示Ｙ１方向を左方、矢示Ｙ２方向を右方として説明する。そして、図面に向かって手前側が、電子部品接合装置１を操作するオペレータの立ち位置となる前方として説明する。(Electronic component joining apparatus 1 of this embodiment)
Hereinafter, an electronic component joining apparatus 1 according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the arrow X1 direction will be described as being above the electronic component joining apparatus 1, the arrow X2 direction being downward, the arrow Y1 direction being left, and the arrow Y2 direction being right. Then, the front side toward the drawing will be described as the front where the operator who operates the electronic component joining apparatus 1 is standing.

（電子部品接合装置１の全体構成）
図１は、電子部品接合装置１の全体構成を概略的に示す図である。図２は、電子部品接合装置１の電気的な構成を概略的に示すブロック図である。図３は、図１に示すＡ部分の拡大図である。図１に示すように電子部品接合装置１は、電子部品昇降機構２と、基板載置部３とを有し、また、図２に示すように、制御部４を有する。図３に示すように、基板載置部３には基板Ｐが載置され、また、電子部品昇降機構２には基板Ｐに対して接合される電子部品Ｍが保持される。電子部品Ｍは、半導体チップ、トランジスタ、ダイオード等を含むものである。(Overall configuration of electronic component joining apparatus 1)
FIG. 1 is a diagram schematically showing an overall configuration of an electronic component bonding apparatus 1. FIG. 2 is a block diagram schematically showing an electrical configuration of the electronic component bonding apparatus 1. FIG. 3 is an enlarged view of a portion A shown in FIG. As shown in FIG. 1, the electronic component bonding apparatus 1 includes an electronic component lifting mechanism 2 and a substrate placement unit 3, and also includes a control unit 4 as illustrated in FIG. 2. As shown in FIG. 3, the substrate P is placed on the substrate platform 3, and the electronic component lifting mechanism 2 holds an electronic component M that is bonded to the substrate P. The electronic component M includes a semiconductor chip, a transistor, a diode, and the like.

（電子部品昇降機構２）
電子部品昇降機構２は、ベース板５と、高速移動機構６と、低速移動機構としてのピエゾ駆動部７と、電子部品保持部８とを有する。ベース板５は、床面等に設置される図示を省略するフレームあるいは筐体に対して取り付けられている。(Electronic component lifting mechanism 2)
The electronic component lifting mechanism 2 includes a base plate 5, a high speed moving mechanism 6, a piezo drive unit 7 as a low speed moving mechanism, and an electronic component holding unit 8. The base plate 5 is attached to a frame or casing (not shown) that is installed on the floor surface or the like.

（高速移動機構６）
高速移動機構６は、モータ９と、ボールねじ１０と、ボールねじナット１１とを有している。ボールねじ１０は、カップリング（連結部）１２を介してモータ９の出力軸１３に結合されている。ボールねじナット１１は、第１移動部１４に固定されている。また、ボールねじナット１１は、ボールねじ１０にねじ結合している。第１移動部１４は、ベース板５に固定される第１ガイド部１５を介してベース板５に取り付けられている。第１ガイド部１５は、第１移動部１４を上下方向に移動可能にガイドする。つまり、上述の構成を有する高速移動機構６は、モータ９の駆動により第１移動部１４を上下方向に移動することができる。(High-speed moving mechanism 6)
The high speed moving mechanism 6 includes a motor 9, a ball screw 10, and a ball screw nut 11. The ball screw 10 is coupled to the output shaft 13 of the motor 9 via a coupling (connecting portion) 12. The ball screw nut 11 is fixed to the first moving part 14. The ball screw nut 11 is screwed to the ball screw 10. The first moving unit 14 is attached to the base plate 5 via a first guide unit 15 fixed to the base plate 5. The 1st guide part 15 guides the 1st moving part 14 so that a movement to an up-down direction is possible. That is, the high-speed moving mechanism 6 having the above-described configuration can move the first moving unit 14 in the vertical direction by driving the motor 9.

高速移動機構６は、変位センサ１６を有し、第１移動部１４の上下方向の移動量、すなわち、高速移動機構６による電子部品保持部８の上下方向の移動量を検出することができる。変位センサ１６は、たとえば、リニアエンコーダーにより構成することができる。  The high speed moving mechanism 6 includes a displacement sensor 16 and can detect the amount of vertical movement of the first moving unit 14, that is, the amount of vertical movement of the electronic component holding unit 8 by the high speed moving mechanism 6. The displacement sensor 16 can be constituted by, for example, a linear encoder.

（第２移動部１８）
第１移動部１４には、ロードセル１７を介して第２移動部１８が支持されている。また、第１移動部１４と第２移動部１８との間には付勢手段としてのバネ３０が備えられている。バネ３０は、第１移動部１４に反力をとり、第２移動部１８を下方に付勢している。第２移動部１８は、第１移動部１４に固定される第２ガイド部１９を介して第１移動部１４に取り付けられている。第２ガイド部１９は、第２移動部１８を上下方向に移動可能にガイドする。つまり、第２移動部１８は、第２ガイド部１９を介して第１移動部１４に対して上下方向に移動可能に支持されている。第２ガイド部１９は、たとえば、クロスローラーガイドを用いる構成とすることができる。この構成とすることにより、第２移動部１８を第１移動部１４に対して高い剛性で保持させることができる。第２ガイド部１９は、エアスライドガイドを用いることもできる。この構成とした場合には、クロスローラーガイドを用いた場合に比べて、高精度かつ低い摺動抵抗で第２移動部１８を第１移動部１４に対して上下方向に移動可能に支持することができる。(Second moving unit 18)
A second moving unit 18 is supported on the first moving unit 14 via a load cell 17. In addition, a spring 30 as an urging unit is provided between the first moving unit 14 and the second moving unit 18. The spring 30 exerts a reaction force on the first moving part 14 and biases the second moving part 18 downward. The second moving part 18 is attached to the first moving part 14 via a second guide part 19 fixed to the first moving part 14. The 2nd guide part 19 guides the 2nd moving part 18 so that a movement to an up-down direction is possible. That is, the second moving unit 18 is supported so as to be movable in the vertical direction with respect to the first moving unit 14 via the second guide unit 19. The 2nd guide part 19 can be set as the structure which uses a cross roller guide, for example. With this configuration, the second moving unit 18 can be held with high rigidity with respect to the first moving unit 14. The second guide part 19 can also use an air slide guide. In the case of this configuration, the second moving portion 18 is supported so as to be movable in the vertical direction with respect to the first moving portion 14 with high accuracy and low sliding resistance as compared with the case where a cross roller guide is used. Can do.

第２移動部１８に下方から押し上げ力が作用すると、第２移動部１８は第１移動部１４に対して相対的に上方に変位し、ロードセル１７により、第２移動部１８に作用する押し上げ力を測定することができる。  When a pushing force is applied to the second moving unit 18 from below, the second moving unit 18 is displaced upward relative to the first moving unit 14, and the pushing force acting on the second moving unit 18 by the load cell 17. Can be measured.

第２移動部１８には、上方（第１移動部１４側）から順に、ノイズ検出センサ２０と、荷重センサ２２と、変位センサ２１と、ピエゾ駆動部７と、セラミックヒータ２３と、電子部品保持部８とが取り付けられている。また、ノイズ検出センサ２０と、荷重センサ２２と、ピエゾ駆動部７とは、電子部品保持部８の移動方向、すなわち上下方向に沿って配列されている。  The second moving unit 18 includes a noise detection sensor 20, a load sensor 22, a displacement sensor 21, a piezo driving unit 7, a ceramic heater 23, and an electronic component holding unit in order from above (on the first moving unit 14 side). Part 8 is attached. Further, the noise detection sensor 20, the load sensor 22, and the piezo drive unit 7 are arranged along the moving direction of the electronic component holding unit 8, that is, the vertical direction.

（ピエゾ駆動部７）
ピエゾ駆動部７は、図示を省略するピエゾ素子を有し、このピエゾ素子に印加されるピエゾ印加信号Ｖ１（図５参照）に応じて電子部品保持部８を下方に向けて移動する。ピエゾ駆動部７は、ピエゾ素子の変形量をそのまま電子部品保持部８に伝える構成であってもよいし、ピエゾ素子の変形量を変位量拡大機構を介して拡大して電子部品保持部８に伝える構成であってもよい。(Piezo Drive 7)
The piezo drive unit 7 includes a piezo element (not shown), and moves the electronic component holding unit 8 downward in accordance with a piezo application signal V1 (see FIG. 5) applied to the piezo element. The piezo drive unit 7 may be configured to transmit the deformation amount of the piezo element to the electronic component holding unit 8 as it is, or the piezo drive unit 7 may expand the deformation amount of the piezo element via the displacement amount enlargement mechanism to the electronic component holding unit 8. The structure which conveys may be sufficient.

（変位センサ２１）
変位センサ２１は、電子部品保持部８の変位量を検出するセンサである。検出精度は概ね０．０１μｍレベルであり、たとえば、静電容量式変位センサを用いることができる。静電容量式変位センサは、第２移動部１８に対して変位しない図示外の固定電極と、ピエゾ駆動部７により変位する電子部品保持部８の変位量に対応して変位する図示外の変位電極とが対向して備えられ、この２つの電極の相対的な動きに起因する静電容量の変化を利用して電子部品保持部８の変位量を計測するセンサである。(Displacement sensor 21)
The displacement sensor 21 is a sensor that detects the amount of displacement of the electronic component holding unit 8. The detection accuracy is approximately 0.01 μm level, and for example, a capacitive displacement sensor can be used. The capacitance type displacement sensor is a non-illustrated fixed electrode that is not displaced with respect to the second moving unit 18 and a non-illustrated displacement that is displaced according to the displacement amount of the electronic component holding unit 8 that is displaced by the piezo drive unit 7. The sensor is provided so as to face the electrode, and measures the amount of displacement of the electronic component holding unit 8 by using a change in capacitance caused by the relative movement of the two electrodes.

（荷重センサ２２、ノイズ検出センサ２０）
荷重センサ２２は、電子部品保持部８に対して下方から掛る荷重を検出するセンサである。検出精度は概ね０．０１〜５Ｎレベルであり、たとえば、ピエゾ素子を用いることができる。ノイズ検出センサ２０は、荷重センサ２２に作用するノイズを検出するセンサであり、検出精度は荷重センサ２２と同等であり、荷重センサ２２と同等のセンサを用いることが好ましい。(Load sensor 22, noise detection sensor 20)
The load sensor 22 is a sensor that detects a load applied to the electronic component holding unit 8 from below. The detection accuracy is about 0.01 to 5N level, and for example, a piezo element can be used. The noise detection sensor 20 is a sensor that detects noise acting on the load sensor 22. The detection accuracy is equivalent to that of the load sensor 22, and a sensor equivalent to the load sensor 22 is preferably used.

（電子部品保持部８）
電子部品保持部８は、電子部品Ｍを吸着することができる。つまり、電子部品保持部８の下面には、不図示の吸引機構により負圧とされる不図示の孔部が設けられ、この孔部に発生する負圧により電子部品Ｍを吸着できる構成となっている。(Electronic component holding part 8)
The electronic component holding unit 8 can suck the electronic component M. In other words, the lower surface of the electronic component holding portion 8 is provided with a hole (not shown) that is made negative by a suction mechanism (not shown), and the electronic component M can be sucked by the negative pressure generated in the hole. ing.

（セラミックヒータ２３）
セラミックヒータ２３は、電子部品保持部８に保持される電子部品Ｍの電極（以下、電子部品電極と記載する）Ｍ１（図６参照）を熱し、この電子部品電極Ｍ１に形成されている半田層（以下、部品側半田層と記載する）Ｍ２（図６参照）を溶融させることができる。(Ceramic heater 23)
The ceramic heater 23 heats an electrode (hereinafter referred to as an electronic component electrode) M1 (refer to FIG. 6) of the electronic component M held by the electronic component holding unit 8, and a solder layer formed on the electronic component electrode M1. M2 (see FIG. 6) (hereinafter referred to as a component-side solder layer) can be melted.

第２移動部１８には、モータ２４が備えられている。ノイズ検出センサ２０から下方の電子部品保持部８までの部材は一体的に移動される構成であり、モータ２４の駆動により、電子部品保持部８を水平面内で回転させることができる。  The second moving unit 18 is provided with a motor 24. The members from the noise detection sensor 20 to the lower electronic component holding unit 8 are configured to move integrally, and the electronic component holding unit 8 can be rotated in a horizontal plane by driving the motor 24.

（基板載置部３）
基板載置部３は、基板Ｐが載置されるステージ２５と、ステージ２５を介して基板Ｐの電極部（以下、基板電極と記載する）Ｐ１を加熱するヒータ２６とを有する。基板載置部３は、左右方向（Ｙ１−Ｙ２方向）および前後方向に移動させることができる図示を省略する可動ステージ機構を有し、ステージ２５およびヒータ２６は、この可動ステージ機構上に組み付けられている。つまり、ステージ２５およびヒータ２６は左右方向および前後方向に移動することができる。(Substrate placing part 3)
The substrate platform 3 includes a stage 25 on which the substrate P is placed, and a heater 26 that heats an electrode unit (hereinafter referred to as a substrate electrode) P1 of the substrate P via the stage 25. The substrate platform 3 has a movable stage mechanism (not shown) that can be moved in the left-right direction (Y1-Y2 direction) and the front-rear direction, and the stage 25 and the heater 26 are assembled on the movable stage mechanism. ing. That is, the stage 25 and the heater 26 can move in the left-right direction and the front-rear direction.

制御部４（図２参照）は、信号処理を行うＣＰＵおよびメモリ等を有するコンピュータである。メモリには、電子部品接合装置１の制御を行うための制御プログラムおよび制御データ等が記憶されている。図２に示すように、制御部４は、変位センサ１６、ロードセル１７、変位センサ２１、および荷重センサ２２等からの信号に基づき、モータ９、ピエゾ駆動部７、セラミックヒータ２３およびヒータ２６等の動作を制御する。  The control unit 4 (see FIG. 2) is a computer having a CPU that performs signal processing, a memory, and the like. The memory stores a control program and control data for controlling the electronic component bonding apparatus 1. As shown in FIG. 2, the control unit 4 determines the motor 9, the piezoelectric drive unit 7, the ceramic heater 23, the heater 26, and the like based on signals from the displacement sensor 16, the load cell 17, the displacement sensor 21, the load sensor 22, and the like. Control the behavior.

図６に示すように、電子部品保持部８の先端に保持される電子部品Ｍは、表面に部品側半田層Ｍ２が形成される複数の電子部品電極Ｍ１が設けられている。また、ステージ２５に載置される基板Ｐには、表面に半田層（以下、基板側半田層と記載する）Ｐ２が形成される複数の基板電極Ｐ１が設けられている。電子部品電極Ｍ１と基板電極Ｐ１とは、一対一で接続可能に配置されている。電子部品電極Ｍ１の部品側半田層Ｍ２の層厚および基板電極Ｐ１の基板側半田層Ｐ２の層厚は共に数十μｍ程度である。そのため、部品側半田層Ｍ２と基板側半田層Ｐ２とを溶融させ、電子部品電極Ｍ１と基板電極Ｐ１とを電気的に接続する際に、電子部品電極Ｍ１と基板電極Ｐ１とが接触し電子部品電極Ｍ１あるいは基板電極Ｐ１を傷つけたり、溶融した半田が隣接する電子部品電極Ｍ１の間、あるいは基板電極Ｐ１の間を短絡させないように、電子部品電極Ｍ１と基板電極Ｐ１との間隔を高い精度で管理する必要がある。  As shown in FIG. 6, the electronic component M held at the tip of the electronic component holding part 8 is provided with a plurality of electronic component electrodes M1 on which a component-side solder layer M2 is formed. The substrate P placed on the stage 25 is provided with a plurality of substrate electrodes P1 on the surface of which a solder layer (hereinafter referred to as a substrate-side solder layer) P2 is formed. The electronic component electrode M1 and the substrate electrode P1 are arranged so that they can be connected one to one. The thickness of the component-side solder layer M2 of the electronic component electrode M1 and the thickness of the substrate-side solder layer P2 of the substrate electrode P1 are both about several tens of μm. Therefore, when the component-side solder layer M2 and the substrate-side solder layer P2 are melted and the electronic component electrode M1 and the substrate electrode P1 are electrically connected, the electronic component electrode M1 and the substrate electrode P1 come into contact with each other. The interval between the electronic component electrode M1 and the substrate electrode P1 is highly accurate so that the electrode M1 or the substrate electrode P1 is not damaged, or the molten solder does not short-circuit between the adjacent electronic component electrodes M1 or between the substrate electrodes P1. Need to manage.

電子部品接合装置１は、上述の構成を備えると共に、図４，５を参照して説明する接合動作を行うことで、電子部品電極Ｍ１と基板電極Ｐ１との間隔を高い精度で管理することができる。図４は、電子部品接合装置１の動作のフローを示す図である。図５は、ピエゾ印加信号Ｖ１、荷重センサ信号Ｖ２、ノイズ信号Ｖ３、変位センサ信号Ｖ４および荷重補正信号Ｖ５の変化の状態を模式的に示す図である。  The electronic component bonding apparatus 1 has the above-described configuration and can manage the interval between the electronic component electrode M1 and the substrate electrode P1 with high accuracy by performing the bonding operation described with reference to FIGS. it can. FIG. 4 is a diagram illustrating an operation flow of the electronic component bonding apparatus 1. FIG. 5 is a diagram schematically showing changes in the piezo application signal V1, the load sensor signal V2, the noise signal V3, the displacement sensor signal V4, and the load correction signal V5.

ピエゾ印加信号Ｖ１は、ピエゾ駆動部７に印加される電圧信号である。荷重センサ信号Ｖ２は、荷重センサ２２に作用する荷重に応じて出力される電圧信号である。ノイズ信号Ｖ３は、ノイズ検出センサ２０に作用するノイズに応じて出力される電圧信号である。変位センサ信号Ｖ４は、変位センサ２１から、ピエゾ素子の変位量、すなわち、電子部品保持部８の変位量に応じて出力される電圧信号である。荷重補正信号Ｖ５は、荷重センサ信号Ｖ２をノイズ信号Ｖ３により補正した電圧信号である。すなわち、荷重補正信号Ｖ５は、荷重センサ信号Ｖ２からノイズ成分を除去した電圧信号である。  The piezo application signal V <b> 1 is a voltage signal applied to the piezo drive unit 7. The load sensor signal V <b> 2 is a voltage signal that is output according to the load that acts on the load sensor 22. The noise signal V <b> 3 is a voltage signal that is output according to noise that acts on the noise detection sensor 20. The displacement sensor signal V4 is a voltage signal output from the displacement sensor 21 according to the displacement amount of the piezoelectric element, that is, the displacement amount of the electronic component holding unit 8. The load correction signal V5 is a voltage signal obtained by correcting the load sensor signal V2 with the noise signal V3. That is, the load correction signal V5 is a voltage signal obtained by removing a noise component from the load sensor signal V2.

制御部４は、荷重センサ２２により検出された荷重センサ信号Ｖ２からノイズ検出センサ２０により検出されたノイズ信号Ｖ３に基づきノイズを除去した荷重補正信号Ｖ５を生成し、この荷重補正信号Ｖ５に基づき、電子部品保持部８に対して下方から作用する荷重を測定する。  The control unit 4 generates a load correction signal V5 from which noise has been removed based on the noise signal V3 detected by the noise detection sensor 20 from the load sensor signal V2 detected by the load sensor 22, and based on the load correction signal V5, A load acting on the electronic component holding unit 8 from below is measured.

（電子部品接合装置１の動作）
以下に電子部品接合装置１の動作について説明する。図１は、電子部品保持部８が、電子部品昇降機構２により下降を開始される前の待機位置に配置されている状態を示している。この状態において、電子部品Ｍの各電子部品電極Ｍ１と各基板Ｐの基板側半田層Ｐ２とは、それぞれ互いに前後および左右方向における位置合わせが行われた状態となっている。この位置合わせは、図示を省略する可動ステージによるステージ２５の前後左右への移動と、モータ２４による電子部品保持部８の水平面内の回転により行うことができる。(Operation of electronic component joining apparatus 1)
Below, operation | movement of the electronic component joining apparatus 1 is demonstrated. FIG. 1 shows a state in which the electronic component holding unit 8 is arranged at a standby position before the electronic component lifting mechanism 2 starts to descend. In this state, each electronic component electrode M1 of the electronic component M and the substrate-side solder layer P2 of each substrate P are aligned with each other in the front-rear and left-right directions. This alignment can be performed by moving the stage 25 forward and backward, left and right by a movable stage (not shown) and rotating the electronic component holding unit 8 in the horizontal plane by the motor 24.

（ステップＳ１０）
制御部４は、モータ９を駆動し、電子部品保持部８を図１に示す待機位置から下方に向けて高速で移動させる高速下降動作を実行する（ステップＳ１０）。モータ９の回転によりボールねじ１０が回転させられる。ボールねじ１０にねじ結合するボールねじナット１１が第１移動部１４に固定されている。そのため、ボールねじ１０の回転にボールねじナット１１がリードされ、第１移動部１４が下方向に移動し、電子部品保持部８も第１移動部１４の下降に併せて下降する。下降速度は、後述するピエゾ駆動部７による電子部品Ｍの下降速度に比べて高速であり、たとえば、５００ｍｍ／秒である。(Step S10)
The control unit 4 drives the motor 9 and executes a high-speed descent operation for moving the electronic component holding unit 8 at a high speed downward from the standby position shown in FIG. 1 (step S10). The ball screw 10 is rotated by the rotation of the motor 9. A ball screw nut 11 that is screw-coupled to the ball screw 10 is fixed to the first moving portion 14. For this reason, the ball screw nut 11 is led by the rotation of the ball screw 10, the first moving part 14 moves downward, and the electronic component holding part 8 is also lowered along with the lowering of the first moving part 14. The descending speed is higher than the descending speed of the electronic component M by the piezoelectric drive unit 7 described later, and is, for example, 500 mm / sec.

（ステップＳ２０，Ｓ３０）
制御部４は、変位センサ１６によって降下位置を検出し、電子部品保持部８を所定位置Ｓ（図６参照）まで下降させる（ステップＳ２０，Ｓ３０）。この所定位置Ｓは、電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板側半田層Ｐ２とが接触しない位置であって、できるだけ近い位置である。モータ９は、作業の効率を上げるため、電子部品Ｍをできるだけ高速で下降できるように高トルクで駆動される。そのため、高トルクで駆動されるモータ９により下降される電子部品Ｍの電子部品電極Ｍ１が、基板Ｐの基板電極Ｐ１に衝突すると、電子部品Ｍあるいは基板Ｐを損傷させてしまう虞がある。そこで、電子部品接合装置１は、電子部品保持部８を所定位置Ｓまでは高速で下降させ、所定位置Ｓからさらに電子部品保持部８を下降する動作は、後述するように、ピエゾ駆動部７の駆動力により低負荷で行うこととしている（ステップＳ４０，Ｓ５０）。(Steps S20 and S30)
The control unit 4 detects the lowered position by the displacement sensor 16 and lowers the electronic component holding unit 8 to a predetermined position S (see FIG. 6) (steps S20 and S30). The predetermined position S is a position where the electronic component electrode M1 of the electronic component M and the board-side solder layer P2 of the board P are not in contact with each other and are as close as possible. The motor 9 is driven with a high torque so that the electronic component M can be lowered as fast as possible in order to increase work efficiency. Therefore, when the electronic component electrode M1 of the electronic component M lowered by the motor 9 driven with high torque collides with the substrate electrode P1 of the substrate P, the electronic component M or the substrate P may be damaged. Therefore, the electronic component bonding apparatus 1 lowers the electronic component holding unit 8 at a high speed to the predetermined position S, and further lowers the electronic component holding unit 8 from the predetermined position S as described later. The driving force is set at a low load (steps S40 and S50).

図６に示すように、所定位置Ｓは、電子部品Ｍの電子部品電極Ｍ１が基板Ｐの基板電極Ｐ１よりも、距離Ｄ１（たとえば、１００μｍ）だけ上方に配置される位置である。この所定位置Ｓは、次のようにして接合動作の開始に先立って設定される。  As shown in FIG. 6, the predetermined position S is a position where the electronic component electrode M1 of the electronic component M is disposed above the substrate electrode P1 of the substrate P by a distance D1 (for example, 100 μm). The predetermined position S is set prior to the start of the joining operation as follows.

電子部品保持部８に電子部品Ｍを保持し、ステージ２５に載置された基板Ｐに向けて下降させ、電子部品電極Ｍ１を基板電極Ｐ１に接触させる。制御部４は、電子部品電極Ｍ１が基板電極Ｐ１に接触したか否かを、ロードセル１７の出力信号に基づき検出し、接触したときの位置を変位センサ１６により測定する。変位センサ１６により測定される接触位置は、電子部品Ｍを下降させる前の初期位置からの電子部品保持部８の移動距離、あるいは基板Ｐの基板電極Ｐ１のステージ２５からの高さとして検出することができる。そして、接触位置に基づき、それより距離Ｄ１だけ上方の位置を所定位置Ｓとして設定し、制御部４のメモリに記憶する。複数枚、たとえば、３，４枚の基板Ｐについて電子部品電極Ｍ１が基板電極Ｐ１に接触する位置を測定し、その平均値に基づいて所定位置Ｓを設定することが好ましい。  The electronic component M is held in the electronic component holding unit 8 and lowered toward the substrate P placed on the stage 25, and the electronic component electrode M1 is brought into contact with the substrate electrode P1. The control unit 4 detects whether or not the electronic component electrode M1 is in contact with the substrate electrode P1 based on the output signal of the load cell 17, and measures the position at the time of contact with the displacement sensor 16. The contact position measured by the displacement sensor 16 is detected as the moving distance of the electronic component holding unit 8 from the initial position before the electronic component M is lowered or the height of the substrate electrode P1 of the substrate P from the stage 25. Can do. Then, based on the contact position, a position above the distance D1 is set as the predetermined position S and stored in the memory of the control unit 4. It is preferable to measure the position where the electronic component electrode M1 contacts the substrate electrode P1 for a plurality of, for example, three or four substrates P, and set the predetermined position S based on the average value.

なお、バネ３０は、たとえば、５０ｋｇで第２移動部１８を下方に付勢している。したがって、電子部品電極Ｍ１を基板電極Ｐ１に確実に押圧させた状態で、電子部品電極Ｍ１の基板電極Ｐ１への接触をロードセル１７により検出することができる。バネ３０の付勢力は、ピエゾ駆動部７の駆動力に比べて極めて大きい。そのため、ピエゾ駆動部７の駆動力により低負荷で電子部品保持部８を下降させる際には、第２移動部１８は第１移動部１４に対して移動しない。したがって、変位センサ２１および荷重センサ２２による変位や荷重の検出精度の低下を防ぐことができる。  The spring 30 urges the second moving unit 18 downward, for example, at 50 kg. Therefore, the contact of the electronic component electrode M1 to the substrate electrode P1 can be detected by the load cell 17 in a state where the electronic component electrode M1 is reliably pressed against the substrate electrode P1. The biasing force of the spring 30 is extremely large compared to the driving force of the piezo driving unit 7. Therefore, the second moving unit 18 does not move relative to the first moving unit 14 when the electronic component holding unit 8 is lowered with a low load by the driving force of the piezo driving unit 7. Therefore, it is possible to prevent the displacement sensor 21 and the load sensor 22 from deteriorating the displacement and load detection accuracy.

ピエゾ駆動部７が電子部品電極Ｍ１を基板電極Ｐ１に押圧する押圧力に対してバネ３０が第２移動部１８を下方に付勢する押圧力は、たとえば、５００から１５００倍程度とすることで、電子部品電極Ｍ１を基板電極Ｐ１に確実に押圧させた状態で、ロードセル１７による電子部品電極Ｍ１の基板電極Ｐ１への接触を検出することができると共に、変位センサ２１および荷重センサ２２による変位や荷重の検出精度の低下を防ぐことができる。ピエゾ駆動部７が電子部品電極Ｍ１を基板電極Ｐ１に押圧する押圧力に対してバネ３０が第２移動部１８を下方に付勢する押圧力を、７００から１２００倍とすることで、より好適にロードセル１７による電子部品電極Ｍ１の基板電極Ｐ１への接触を検出することができると共に、変位センサ２１および荷重センサ２２による変位や荷重の検出精度の低下を防ぐことができる。  The pressing force with which the spring 30 urges the second moving unit 18 downward with respect to the pressing force with which the piezoelectric drive unit 7 presses the electronic component electrode M1 against the substrate electrode P1 is, for example, about 500 to 1500 times. The contact of the electronic component electrode M1 to the substrate electrode P1 by the load cell 17 can be detected in a state where the electronic component electrode M1 is securely pressed against the substrate electrode P1, and the displacement by the displacement sensor 21 and the load sensor 22 can be detected. A decrease in load detection accuracy can be prevented. It is more preferable that the pressing force with which the spring 30 urges the second moving unit 18 downward is 700 to 1200 times the pressing force with which the piezoelectric drive unit 7 presses the electronic component electrode M1 against the substrate electrode P1. In addition, it is possible to detect the contact of the electronic component electrode M1 to the substrate electrode P1 by the load cell 17 and to prevent the displacement sensor 21 and the load sensor 22 from degrading the displacement and the load detection accuracy.

制御部４は、電子部品保持部８を所定位置Ｓまで下降させ（ステップＳ２０においてＹｅｓ）、モータ９の駆動を停止する（ステップＳ３０）。なお、制御部４は、ＰＩＤ制御にて電子部品保持部８を所定位置Ｓまで下降させる。ＰＩＤ制御を行うことで、所定位置Ｓに電子部品保持部８を精度よく移動させることができる。電子部品保持部８が所定位置Ｓに下降された状態（ステップＳ３０）では、電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板電極Ｐ１とは、接触はしていないが、きわめて接近した距離として、上述のように、距離Ｄ１の間隔を開けて配置されている。  The control unit 4 lowers the electronic component holding unit 8 to the predetermined position S (Yes in Step S20), and stops driving the motor 9 (Step S30). The control unit 4 lowers the electronic component holding unit 8 to the predetermined position S by PID control. By performing PID control, the electronic component holding unit 8 can be accurately moved to the predetermined position S. In the state in which the electronic component holding unit 8 is lowered to the predetermined position S (step S30), the electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P are not in contact with each other, but are extremely close to each other. As described above, they are arranged with an interval of the distance D1.

電子部品保持部８が所定位置Ｓに配置されている状態から電子部品電極Ｍ１を基板電極Ｐ１に接触させる動作は、後述するようにピエゾ駆動部７による電子部品保持部８の微少な移動を低負荷で行う。したがって、距離Ｄ１は、電子部品電極Ｍ１が基板電極Ｐ１に接触しない範囲でできるだけ狭い方が、電子部品保持部８を所定位置Ｓから電子部品電極Ｍ１と基板電極Ｐ１とが接触する位置まで移動させるための工程時間を短縮できる。しかしながら、モータ９による電子部品保持部８の移動制御の精度、電子部品接合装置１の温度等の環境による公差の変化、および電子部品Ｍおよび基板Ｐの個体差等を考慮すると、距離Ｄ１が小さすぎると、モータ９による電子部品保持部８を下降させる際に、電子部品電極Ｍ１が基板電極Ｐ１に接触してしまう虞がある。したがって、距離Ｄ１は、小さい方が好ましいものの、上述の電子部品保持部８の移動制御の精度、電子部品接合装置１の公差の変化、および電子部品Ｍおよび基板Ｐの個体差等を踏まえて、電子部品電極Ｍ１と基板電極Ｐ１とが接触しない距離とすることが好ましい。  The operation of bringing the electronic component electrode M1 into contact with the substrate electrode P1 from the state where the electronic component holding unit 8 is disposed at the predetermined position S reduces the slight movement of the electronic component holding unit 8 by the piezo drive unit 7 as will be described later. Do with load. Therefore, the distance D1 is as narrow as possible within a range where the electronic component electrode M1 does not contact the substrate electrode P1, and the electronic component holding portion 8 is moved from the predetermined position S to a position where the electronic component electrode M1 and the substrate electrode P1 are in contact with each other. Process time can be shortened. However, the distance D1 is small considering the accuracy of movement control of the electronic component holding unit 8 by the motor 9, the change in tolerance due to the environment such as the temperature of the electronic component bonding apparatus 1, and the individual difference between the electronic component M and the substrate P. If it is too high, the electronic component electrode M1 may come into contact with the substrate electrode P1 when the electronic component holding portion 8 is lowered by the motor 9. Accordingly, although the distance D1 is preferably smaller, in consideration of the accuracy of movement control of the electronic component holding unit 8 described above, the change in tolerance of the electronic component bonding apparatus 1, the individual difference between the electronic component M and the substrate P, and the like, It is preferable that the distance is such that the electronic component electrode M1 and the substrate electrode P1 do not contact each other.

（ステップＳ４０，Ｓ５０）
続いて、制御部４は、図５の時間Ｔ＝０以降に示すように、ピエゾ駆動部７にピエゾ印加信号Ｖ１を印加し、電子部品電極Ｍ１が基板電極Ｐ１に接触する位置を検出するサーチ動作を実行する（ステップＳ４０，Ｓ５０）。ピエゾ印加信号Ｖ１の大きさに応じて電子部品保持部８が変位し、この変位量は変位センサ２１により変位センサ信号Ｖ４として検出される。(Steps S40 and S50)
Subsequently, as shown after time T = 0 in FIG. 5, the control unit 4 applies a piezo application signal V1 to the piezo drive unit 7 and detects a position where the electronic component electrode M1 contacts the substrate electrode P1. The operation is executed (steps S40 and S50). The electronic component holding part 8 is displaced according to the magnitude of the piezo application signal V1, and this displacement amount is detected by the displacement sensor 21 as a displacement sensor signal V4.

制御部４は、電子部品電極Ｍ１が基板電極Ｐ１に接触したか否かを、荷重補正信号Ｖ５に基づき判断する。荷重補正信号Ｖ５は、上述したように、荷重センサ２２の荷重センサ信号Ｖ２からノイズ検出センサ２０により検出されるノイズ信号Ｖ３を除去（キャンセル）した電圧信号である。つまり、荷重補正信号Ｖ５は、電子部品保持部８に下方から作用する荷重を示す信号である。  The control unit 4 determines whether or not the electronic component electrode M1 is in contact with the substrate electrode P1 based on the load correction signal V5. The load correction signal V5 is a voltage signal obtained by removing (cancelling) the noise signal V3 detected by the noise detection sensor 20 from the load sensor signal V2 of the load sensor 22 as described above. That is, the load correction signal V5 is a signal indicating a load acting on the electronic component holding unit 8 from below.

図５に示すように、時間Ｔ＝０からピエゾ印加信号Ｖ１の電圧を徐々に高くしていく。ピエゾ駆動部７は、ピエゾ印加信号Ｖ１の大きさに応じた変位量で電子部品保持部８を下方に移動させる。そして、電子部品電極Ｍ１が基板側半田層Ｐ２に接触すると、電子部品保持部８に下方から荷重が作用するため、時間Ｔ＝ｔ１に示すように荷重補正信号Ｖ５に立ち上がり部が発生する。制御部４は、荷重補正信号Ｖ５が所定の電圧ＶＡとなったときに、電子部品電極Ｍ１が基板電極Ｐ１に接触したと判断する（ステップＳ５０においてＹｅｓ）。なお、制御部４は、荷重補正信号Ｖ５が所定の電圧ＶＡとなるように、ＰＩＤ制御にて電子部品保持部８を移動させる。  As shown in FIG. 5, the voltage of the piezo application signal V1 is gradually increased from time T = 0. The piezo drive unit 7 moves the electronic component holding unit 8 downward by a displacement amount corresponding to the magnitude of the piezo application signal V1. When the electronic component electrode M1 comes into contact with the board-side solder layer P2, a load acts on the electronic component holding portion 8 from below, so that a rising portion is generated in the load correction signal V5 as shown at time T = t1. When the load correction signal V5 becomes the predetermined voltage VA, the control unit 4 determines that the electronic component electrode M1 is in contact with the substrate electrode P1 (Yes in Step S50). In addition, the control part 4 moves the electronic component holding part 8 by PID control so that the load correction signal V5 becomes the predetermined voltage VA.

（ステップＳ６０）
ここで、図５の時間Ｔ＝ｔ１に示すように、荷重補正信号Ｖ５が所定電圧ＶＡになったときの変位センサ信号Ｖ４の電圧ＶＢは、電子部品保持部８がモータ９の駆動により所定位置Ｓに下降された後、ピエゾ駆動部７によりさらに下方に移動された距離に対応する電圧である。この距離は、電子部品保持部８が所定位置Ｓに移動されたときの電子部品電極Ｍ１と基板電極Ｐ１との実際の間隔（距離）であり、サーチ動作（ステップＳ４０，Ｓ５０）において、電子部品保持部８が下降されるサーチ距離である。このサーチ距離に対応する変位センサ信号Ｖ４の電圧をサーチ距離対応電圧ＶＢとして制御部４に備えられるメモリに記憶する（ステップＳ６０）。(Step S60)
Here, as shown at time T = t1 in FIG. 5, the voltage VB of the displacement sensor signal V4 when the load correction signal V5 becomes the predetermined voltage VA is the predetermined position when the electronic component holding unit 8 is driven by the motor 9. The voltage corresponds to the distance moved further downward by the piezo drive unit 7 after being lowered to S. This distance is the actual distance (distance) between the electronic component electrode M1 and the substrate electrode P1 when the electronic component holding portion 8 is moved to the predetermined position S. In the search operation (steps S40 and S50), the electronic component A search distance by which the holding unit 8 is lowered. The voltage of the displacement sensor signal V4 corresponding to the search distance is stored as a search distance corresponding voltage VB in a memory provided in the control unit 4 (step S60).

そして、次回の電子部品Ｍと基板Ｐとを接合する際のサーチ動作（ステップＳ４０）においては、該サーチ距離の範囲で所定の距離まで電子部品保持部８の下降速度を速くする。すなわち、変位センサ信号Ｖ４が、サーチ距離対応電圧ＶＢに対して所定の電圧になるまでは、ピエゾ印加信号Ｖ１の増加速度を速くし、電子部品保持部８の下降速度を速くする。これにより、サーチ動作（ステップＳ４０，Ｓ５０）を行う時間の短縮を図ることができる。  Then, in the next search operation (step S40) when joining the electronic component M and the substrate P, the descending speed of the electronic component holding unit 8 is increased to a predetermined distance within the range of the search distance. That is, until the displacement sensor signal V4 becomes a predetermined voltage with respect to the search distance corresponding voltage VB, the increasing speed of the piezo application signal V1 is increased and the descending speed of the electronic component holding unit 8 is increased. Thereby, the time for performing the search operation (steps S40 and S50) can be shortened.

たとえば、変位センサ信号Ｖ４が、サーチ距離対応電圧ＶＢの４０％に到達するまでは、ピエゾ印加信号Ｖ１の増加速度を速くする。電子部品接合装置１の温度等による較差の変化や基板Ｐの湾曲等により、電子部品保持部８が所定位置Ｓに移動したときの電子部品電極Ｍ１と基板電極Ｐ１との実際の間隔は変化する。そのため、ピエゾ印加信号Ｖ１の増加速度を速くする該所定の距離をあまり長くすると、電子部品電極Ｍ１と基板電極Ｐ１とが衝突してしまう虞がある。該所定の電圧は、サーチ距離対応電圧ＶＢの３０％以上７０％以下とすることで、電子部品電極Ｍ１と基板電極Ｐ１とが衝突する可能性を十分低くすることができ、加えて、サーチ動作（ステップＳ４０）を行う時間の短縮を効果的に図ることができる。  For example, the increase rate of the piezo application signal V1 is increased until the displacement sensor signal V4 reaches 40% of the search distance corresponding voltage VB. The actual distance between the electronic component electrode M1 and the substrate electrode P1 when the electronic component holding portion 8 is moved to the predetermined position S changes due to a change in the difference due to the temperature of the electronic component bonding apparatus 1 or the curvature of the substrate P. . Therefore, if the predetermined distance that increases the increase rate of the piezo application signal V1 is made too long, the electronic component electrode M1 and the substrate electrode P1 may collide. By setting the predetermined voltage to 30% or more and 70% or less of the search distance corresponding voltage VB, it is possible to sufficiently reduce the possibility that the electronic component electrode M1 and the substrate electrode P1 collide with each other. The time for performing (Step S40) can be effectively shortened.

なお、該サーチ距離は、所定位置Ｓに反映させてもよい。つまり、接合動作の開始に先立って所定位置Ｓは設定されるが、電子部品接合装置１の公差の変化、および電子部品Ｍおよび基板Ｐの個体差等により、電子部品保持部８を所定位置Ｓに移動させたときの距離が距離Ｄ１にならない場合がある。  The search distance may be reflected in the predetermined position S. That is, the predetermined position S is set prior to the start of the bonding operation, but the electronic component holding unit 8 is moved to the predetermined position S due to a change in tolerance of the electronic component bonding apparatus 1 and individual differences between the electronic component M and the substrate P. The distance when moved to may not be the distance D1.

電子部品保持部８を所定位置Ｓに移動させたときの距離が距離Ｄ１よりも長くなっている場合は工程時間が長くなる点で好ましくなく、逆に短くなっている場合は、電子部品電極Ｍ１が基板電極Ｐ１に過剰な押圧力で接触し、電子部品Ｍあるいは基板Ｐを損傷させてしまう虞がある。これに対し、電子部品保持部８がモータ９の駆動により所定位置Ｓに下降させてからピエゾ駆動部７により移動された距離（該サーチ距離）に基づき、所定位置Ｓを更新することで、工程時間の短縮化あるいは電子部品電極Ｍ１の基板電極Ｐ１への過剰な押圧力での接触を防止できる。  If the distance when the electronic component holding unit 8 is moved to the predetermined position S is longer than the distance D1, it is not preferable in that the process time becomes long. Conversely, if the distance is shorter, the electronic component electrode M1 May come into contact with the substrate electrode P1 with an excessive pressing force and damage the electronic component M or the substrate P. On the other hand, by updating the predetermined position S based on the distance (the search distance) moved by the piezoelectric drive unit 7 after the electronic component holding unit 8 is lowered to the predetermined position S by driving the motor 9, It is possible to shorten the time or prevent the electronic component electrode M1 from contacting the substrate electrode P1 with an excessive pressing force.

荷重補正信号Ｖ５が所定の電圧ＶＡとなったとき、すなわち、電子部品電極Ｍ１が基板電極Ｐ１に接触したと判断されたとき、図５の時間Ｔ＝ｔ１〜ｔ２間に示すように、ピエゾ印加信号Ｖ１を一旦低下させる。これにより、電子部品電極Ｍ１が基板電極Ｐ１に接触した時に、電子部品保持部８のオーバーシュートが防止でき、電子部品電極Ｍ１および基板電極Ｐ１が損傷してしまうことを防止できる。  When the load correction signal V5 becomes a predetermined voltage VA, that is, when it is determined that the electronic component electrode M1 is in contact with the substrate electrode P1, piezo application is performed as shown between time T = t1 and t2 in FIG. The signal V1 is once lowered. Thereby, when the electronic component electrode M1 contacts the substrate electrode P1, the overshoot of the electronic component holding part 8 can be prevented, and the electronic component electrode M1 and the substrate electrode P1 can be prevented from being damaged.

（ステップＳ７０，Ｓ８０，Ｓ９０，Ｓ１００）
制御部４は、電子部品電極Ｍ１と基板電極Ｐ１との接触（ステップＳ５０においてＹｅｓ）に併せて、セラミックヒータ２３およびヒータ２６の加熱を開始する。そして、制御部４は、電子部品電極Ｍ１を基板電極Ｐ１に接触させた状態で、図５の時間Ｔ＝ｔ２〜ｔ３に示すようにピエゾ印加信号Ｖ１を徐々に大きくし、電子部品電極Ｍ１から基板電極Ｐ１に対して所定の荷重（たとえば、０．５Ｎ）を付加する（ステップ７０）。電子部品電極Ｍ１から基板電極Ｐ１に対して所定の荷重が付加されたか否かは、荷重補正信号Ｖ５に基づいて判断する。たとえば、荷重補正信号Ｖ５が電圧ＶＣになったときに、電子部品電極Ｍ１から基板電極Ｐ１に対して所定の荷重が付加されたと判断する。(Steps S70, S80, S90, S100)
The control unit 4 starts heating the ceramic heater 23 and the heater 26 in conjunction with the contact between the electronic component electrode M1 and the substrate electrode P1 (Yes in Step S50). Then, the controller 4 gradually increases the piezo application signal V1 as shown at time T = t2 to t3 in FIG. 5 in a state where the electronic component electrode M1 is in contact with the substrate electrode P1, and the electronic component electrode M1 A predetermined load (for example, 0.5 N) is applied to the substrate electrode P1 (step 70). Whether or not a predetermined load is applied from the electronic component electrode M1 to the substrate electrode P1 is determined based on the load correction signal V5. For example, when the load correction signal V5 becomes the voltage VC, it is determined that a predetermined load is applied from the electronic component electrode M1 to the substrate electrode P1.

この所定の荷重は、電子部品Ｍおよび基板Ｐに対して損傷を与えない大きさであると共に、後述するように、電子部品電極Ｍ１および基板電極Ｐ１が溶融したときに、この溶融を電子部品保持部８の下方への変位として変位センサ２１により検出できる大きさである。そして、制御部４は、電子部品電極Ｍ１の基板電極Ｐ１に対する荷重が所定の荷重（荷重補正信号Ｖ５が電圧ＶＣ）に到達したと判断したら（ステップＳ７０においてＹｅｓ）、図５の時間Ｔ＝ｔ３〜ｔ４に示すようにその所定の荷重が保持されるようにピエゾ印加信号Ｖ１を制御する（ステップＳ８０）。すなわち、荷重補正信号Ｖ５が電圧ＶＣに保持されるように、ピエゾ印加信号Ｖ１を制御する（ステップＳ８０）。これに合わせて、所定の荷重となったと判断されたときの電子部品保持部８の位置（以下、所定荷重時位置と記載する）における変位センサ信号Ｖ４の値を所定荷重時電圧ＶＤとしてメモリに記憶する（ステップＳ８０）。なお、制御部４は、荷重補正信号Ｖ５が電圧ＶＣとなるように、ＰＩＤ制御にて電子部品保持部８を移動させる。  The predetermined load has a magnitude that does not damage the electronic component M and the substrate P, and holds the electronic component when the electronic component electrode M1 and the substrate electrode P1 are melted, as will be described later. This is a size that can be detected by the displacement sensor 21 as a downward displacement of the portion 8. When the control unit 4 determines that the load on the substrate electrode P1 of the electronic component electrode M1 has reached a predetermined load (the load correction signal V5 is the voltage VC) (Yes in step S70), the time T = t3 in FIG. The piezoelectric application signal V1 is controlled so that the predetermined load is maintained as shown in t4 (step S80). That is, the piezo application signal V1 is controlled so that the load correction signal V5 is held at the voltage VC (step S80). In accordance with this, the value of the displacement sensor signal V4 at the position of the electronic component holding unit 8 when it is determined that the predetermined load is reached (hereinafter referred to as a predetermined load position) is stored in the memory as a predetermined load voltage VD. Store (step S80). In addition, the control part 4 moves the electronic component holding part 8 by PID control so that the load correction signal V5 becomes the voltage VC.

セラミックヒータ２３およびヒータ２６の発熱により、部品側半田層Ｍ２および基板側半田層Ｐ２が加熱され溶融が開始する。部品側半田層Ｍ２および基板側半田層Ｐ２が溶融すると、電子部品電極Ｍ１が基板電極Ｐ１を押圧する際の反力が低減する。一方、電子部品保持部８の押圧力は一定に保持されている（ステップＳ８０）。そのため、電子部品保持部８は下方に移動する（沈み込む）。部品側半田層Ｍ２および基板側半田層Ｐ２が溶融されたか否かは、押圧力が一定に保持（ステップＳ８０）された電子部品保持部８の下方への移動量（沈み込み量）が所定値（たとえば、１μｍ）を超えたか否かにより判断（ステップＳ１００）することができる。  Due to the heat generated by the ceramic heater 23 and the heater 26, the component-side solder layer M2 and the board-side solder layer P2 are heated to start melting. When the component-side solder layer M2 and the board-side solder layer P2 are melted, the reaction force when the electronic component electrode M1 presses the board electrode P1 is reduced. On the other hand, the pressing force of the electronic component holding unit 8 is held constant (step S80). Therefore, the electronic component holding part 8 moves downward (sinks). Whether or not the component-side solder layer M2 and the board-side solder layer P2 are melted is determined by a predetermined amount of movement (sinking amount) of the electronic component holding portion 8 in which the pressing force is held constant (step S80). A determination can be made based on whether or not (for example, 1 μm) is exceeded (step S100).

具体的には、制御部４は、荷重補正信号Ｖ５が電圧ＶＣに保持されるようにピエゾ印加信号Ｖ１を制御しながら、電子部品保持部８の所定荷重時位置（所定荷重時電圧ＶＤに対応する位置）から移動距離（電子部品保持部８の沈み込み量）を変位センサ信号Ｖ４の変化量に基づき測定する（ステップＳ９０）。そして、この移動距離（電子部品保持部８の沈み込み量）が所定距離（たとえば、１μｍ）に到達したか否かを判断する（ステップＳ１００）。この判断は、変位センサ信号Ｖ４が所定荷重時電圧ＶＤから所定の電位差ΔＶ４だけ増加し沈込電圧ＶＥになったときに、電子部品保持部８の沈み込み量が所定距離に到達したと判断する（ステップＳ１００においてＹｅｓ）。電位差ΔＶ４は、所定の沈み込み量に相当する電位差として予め設定され制御部４のメモリに記憶されている。  Specifically, the control unit 4 controls the piezo application signal V1 so that the load correction signal V5 is held at the voltage VC, while corresponding to the predetermined load position (corresponding to the predetermined load voltage VD) of the electronic component holding unit 8. The movement distance (the amount of sinking of the electronic component holding unit 8) from the position where the displacement is detected is measured based on the amount of change of the displacement sensor signal V4 (step S90). Then, it is determined whether or not the moving distance (the amount of sinking of the electronic component holding unit 8) has reached a predetermined distance (for example, 1 μm) (step S100). In this determination, when the displacement sensor signal V4 increases from the predetermined load voltage VD by the predetermined potential difference ΔV4 to become the sink voltage VE, it is determined that the sink amount of the electronic component holding unit 8 has reached the predetermined distance. (Yes in step S100). The potential difference ΔV4 is set in advance as a potential difference corresponding to a predetermined sinking amount and stored in the memory of the control unit 4.

（ステップＳ１１０）
部品側半田層Ｍ２および基板側半田層Ｐ２が溶融と判断された場合（ステップＳ１００においてＹｅｓ）には、制御部４は、図５の時間Ｔ＝ｔ４〜ｔ５に示すように電子部品保持部８の下降を停止しその位置（部品側半田層Ｍ２および基板側半田層Ｐ２が溶融したと判断されたときの電子部品保持部８の位置）を保持する（ステップＳ１１０）。つまり、部品側半田層Ｍ２および基板側半田層Ｐ２が溶融と判断されたた場合には（ステップＳ１００）、ピエゾ印加信号Ｖ１の電圧をその時の電圧に保持する（ステップＳ１１０）。(Step S110)
When it is determined that the component-side solder layer M2 and the board-side solder layer P2 are melted (Yes in step S100), the control unit 4 displays the electronic component holding unit 8 as shown at time T = t4 to t5 in FIG. And the position (the position of the electronic component holding unit 8 when it is determined that the component-side solder layer M2 and the board-side solder layer P2 are melted) is held (step S110). That is, when it is determined that the component-side solder layer M2 and the board-side solder layer P2 are melted (step S100), the voltage of the piezoelectric application signal V1 is held at the voltage at that time (step S110).

（ステップＳ１２０）
制御部４は、電子部品保持部８の下降を停止しその位置を保持（ステップＳ１１０）した状態で、溶融した部品側半田層Ｍ２および基板側半田層Ｐ２の冷却動作を開始する（ステップＳ１２０）。この冷却動作（ステップＳ１２０）は、セラミックヒータ２３およびヒータ２６への通電をオフとするとともに、ステージ２５に備えられる冷却パイプ２７に空気を流し電子部品Ｍおよび基板Ｐを冷却する。これにより、溶融した部品側半田層Ｍ２および基板側半田層Ｐ２が冷却され固化を開始する。(Step S120)
The controller 4 starts the cooling operation of the molten component-side solder layer M2 and substrate-side solder layer P2 in a state where the lowering of the electronic component holding unit 8 is stopped and the position thereof is held (step S110) (step S120). . In this cooling operation (step S120), energization to the ceramic heater 23 and the heater 26 is turned off, and air is passed through the cooling pipe 27 provided in the stage 25 to cool the electronic component M and the substrate P. Thereby, the melted component-side solder layer M2 and substrate-side solder layer P2 are cooled and solidified.

（ステップＳ１３０，Ｓ１４０）
ところで、溶融した半田は冷却する際に熱収縮する。そのため、電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板電極Ｐ１とが、熱収縮する半田に引っ張られ破損してしまう虞がある。そこで、制御部４は、冷却する半田の熱収縮に併せて電子部品保持部８が下降するようにピエゾ駆動部７を駆動し、電子部品保持部８を半田の熱収縮に追従させる熱収縮追従動作を行う（ステップＳ１４０）。熱収縮追従動作（ステップＳ１４０）は、荷重センサ２２により検出される荷重（荷重補正信号Ｖ５）が一定になるように、ピエゾ駆動部７を駆動し電子部品保持部８を移動させる。溶融した部品側半田層Ｍ２および基板側半田層Ｐ２は、冷却され熱収縮するので、ピエゾ駆動部７には、電子部品保持部８をやや下降させるようにピエゾ印加信号Ｖ１が印加される。(Steps S130 and S140)
By the way, when the molten solder is cooled, it thermally shrinks. Therefore, there is a possibility that the electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P are pulled by the heat-shrinkable solder and damaged. Therefore, the control unit 4 drives the piezo drive unit 7 so that the electronic component holding unit 8 descends in accordance with the thermal contraction of the solder to be cooled, and makes the electronic component holding unit 8 follow the thermal contraction of the solder. An operation is performed (step S140). In the thermal contraction following operation (step S140), the piezo driving unit 7 is driven and the electronic component holding unit 8 is moved so that the load (load correction signal V5) detected by the load sensor 22 is constant. Since the melted component-side solder layer M2 and substrate-side solder layer P2 are cooled and thermally contracted, the piezoelectric drive signal 7 is applied to the piezoelectric drive unit 7 so that the electronic component holding unit 8 is slightly lowered.

熱収縮追従動作（ステップＳ１４０）は、冷却動作（ステップＳ１２０）直後に実行せず、溶融した部品側半田層Ｍ２および基板側半田層Ｐ２が所定の温度に冷却されているか否かを判断し（ステップＳ１３０）、所定の温度に冷却された後（ステップＳ１３０においてＹｅｓ）に、実行することが好ましい。これは次の理由による。  The thermal contraction following operation (step S140) is not executed immediately after the cooling operation (step S120), and it is determined whether or not the melted component-side solder layer M2 and substrate-side solder layer P2 are cooled to a predetermined temperature ( Step S130) is preferably performed after cooling to a predetermined temperature (Yes in step S130). This is due to the following reason.

半田は溶融状態の場合、温度変化による熱収縮の割合が小さく、また、極めて微小な力で変形してしまう恐れがある。そのため、半田が溶融状態のときは、ピエゾ印加信号Ｖ１を一定に保持し（ステップＳ１１０）、電子部品保持部８が移動しないようにする。したがって、熱収縮追従動作（ステップＳ１４０）は、半田が固まり始める寸前のタイミングを捉えて行う。ステップＳ１３０における所定温度は、半田が固まり始める直前の温度であり、たとえば、２２０℃である。図５に示す時間Ｔ＝ｔ４〜ｔ５の間は、冷却動作が開始されても、熱収縮追従動作（ステップＳ１４０）は実行されない。  When the solder is in a molten state, the rate of thermal shrinkage due to temperature changes is small, and there is a risk that the solder will be deformed by a very small force. Therefore, when the solder is in a molten state, the piezo application signal V1 is held constant (step S110), and the electronic component holding unit 8 is prevented from moving. Therefore, the thermal contraction following operation (step S140) is performed by capturing the timing just before the solder starts to harden. The predetermined temperature in step S130 is a temperature immediately before the solder starts to harden, and is 220 ° C., for example. During the time T = t4 to t5 shown in FIG. 5, even if the cooling operation is started, the heat shrink follow-up operation (step S140) is not executed.

（ステップＳ１５０，Ｓ１６０）
そして、制御部４は、電子部品保持部８を熱収縮追従動作させながら部品側半田層Ｍ２および基板側半田層Ｐ２の半田の温度を検出する（ステップＳ１５０）。制御部４は、半田が十分に固まる温度になったことが検出されたら（ステップＳ１５０においてＹｅｓ）、電子部品保持部８の電子部品Ｍの吸引を解除し、モータ９を駆動し電子部品保持部８を上方に移動させる（ステップＳ１６０）。以上で接合動作を完了し、ステージ２５から電子部品Ｍが接合された基板Ｐを取り除く。(Steps S150 and S160)
Then, the control unit 4 detects the solder temperatures of the component-side solder layer M2 and the board-side solder layer P2 while causing the electronic component holding unit 8 to follow the heat shrinkage (step S150). When it is detected that the temperature of the solder is sufficiently solidified (Yes in step S150), the control unit 4 releases the suction of the electronic component M from the electronic component holding unit 8 and drives the motor 9 to drive the electronic component holding unit. 8 is moved upward (step S160). The joining operation is thus completed, and the substrate P to which the electronic component M is joined is removed from the stage 25.

なお、部品側半田層Ｍ２および基板側半田層Ｐ２の半田の温度は、図示外の温度検出センサにより、たとえば、電子部品保持部８の温度を検出し、この検出温度に基づき、半田の温度を推測することができる。また、半田の温度を検出（推測）する代わりに、冷却時間により熱収縮追従動作（ステップＳ１４０）の開始や、電子部品保持部８を上方に移動させる動作（ステップＳ１６０）の開始を行ってもよい。  Note that the solder temperatures of the component-side solder layer M2 and the board-side solder layer P2 are detected by, for example, the temperature of the electronic component holding unit 8 using a temperature detection sensor (not shown), and the temperature of the solder is determined based on the detected temperature. Can be guessed. Further, instead of detecting (estimating) the temperature of the solder, a heat shrink follow-up operation (step S140) or an operation of moving the electronic component holding unit 8 upward (step S160) depending on the cooling time may be performed. Good.

（本実施の形態の主な効果）
上述したように、電子部品接合装置１は、電子部品Ｍを保持する電子部品保持部８を基板Ｐに向けて昇降動する電子部品昇降機構２を有し、電子部品Ｍを、基板Ｐから離間した位置から電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板電極Ｐ１とが接触する位置まで移動させ、電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板電極Ｐ１とを熱溶融可能な金属としての半田を介して接合することができる。電子部品昇降機構２は、電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板電極Ｐ１との間の距離が、所定の距離Ｄ１になるまで電子部品昇降機構２を高い速度で移動させる高速移動機構６と、電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板電極Ｐ１との間の距離が所定の距離Ｄ１になった後、高い速度よりも低い速度で移動させる低速移動機構としてのピエゾ素子を駆動源とするピエゾ駆動部７とを有する。(Main effects of this embodiment)
As described above, the electronic component bonding apparatus 1 includes the electronic component lifting mechanism 2 that moves the electronic component holding portion 8 that holds the electronic component M up and down toward the substrate P, and separates the electronic component M from the substrate P. The electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P are moved to a position where the electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P are in contact with each other. It can be joined via solder. The electronic component lifting mechanism 2 is a high-speed moving mechanism that moves the electronic component lifting mechanism 2 at a high speed until the distance between the electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P reaches a predetermined distance D1. 6 and after the distance between the electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P reaches a predetermined distance D1, a piezo element as a low speed moving mechanism that moves at a lower speed than a high speed is provided. A piezo drive unit 7 serving as a drive source;

このように電子部品接合装置１を構成し、ピエゾ駆動部７を用いることで、電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板電極Ｐ１とが所定距離Ｄ１になった後の電子部品保持部８の移動量や荷重量の制御の精度を高いものとすることができる。  The electronic component holding apparatus 1 after the electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P have reached the predetermined distance D1 by configuring the electronic component bonding apparatus 1 and using the piezo drive unit 7 as described above. Therefore, it is possible to increase the accuracy of control of the movement amount and the load amount.

電子部品接合装置１は、電子部品保持部８に保持された電子部品Ｍに対して、基板Ｐが配置される側から作用する荷重を検出する荷重センサ２２と、この荷重センサ２２に作用するノイズを検出するノイズ検出センサ２０と、このノイズ検出センサ２０により検出されるノイズ信号Ｖ３に基づき荷重センサ２２により検出される荷重センサ信号Ｖ２からノイズを除去するノイズ信号除去手段としての制御部４とを有する。  The electronic component bonding apparatus 1 includes a load sensor 22 that detects a load acting on the electronic component M held by the electronic component holding unit 8 from the side on which the substrate P is disposed, and a noise that acts on the load sensor 22. And a control unit 4 as noise signal removing means for removing noise from the load sensor signal V2 detected by the load sensor 22 based on the noise signal V3 detected by the noise detection sensor 20. Have.

ピエゾ駆動部７を用いることで、電子部品保持部８の移動量や荷重量の制御の精度が高いものとなる一方で、荷重センサ２２がノイズの影響を受けることで、ピエゾ駆動部７の制御の精度が低下してしまう。そこで、ノイズ検出センサ２０を備え、このノイズ検出センサ２０により検出されるノイズ信号Ｖ３に基づき、荷重センサ２２により検出される荷重センサ信号Ｖ２からノイズを除去することで、ピエゾ駆動部７の制御の精度を向上させることができる。  The use of the piezo drive unit 7 increases the accuracy of control of the movement amount and load amount of the electronic component holding unit 8, while the load sensor 22 is affected by noise, thereby controlling the piezo drive unit 7. The accuracy of will decrease. Therefore, a noise detection sensor 20 is provided, and noise is removed from the load sensor signal V2 detected by the load sensor 22 based on the noise signal V3 detected by the noise detection sensor 20, thereby controlling the piezo drive unit 7. Accuracy can be improved.

ノイズ検出センサ２０と、荷重センサ２２と、ピエゾ駆動部７とは、電子部品保持部８の移動方向に沿って配列されている。  The noise detection sensor 20, the load sensor 22, and the piezo drive unit 7 are arranged along the moving direction of the electronic component holding unit 8.

ピエゾ駆動部７と荷重センサ２２とが電子部品保持部８の移動方向に沿って配列されていることで、電子部品保持部８に作用する荷重を検出する荷重センサ２２の検出精度を向上させることができる。たとえば、電子部品保持部８の移動方向に対して、ピエゾ駆動部７と荷重センサ２２との配列方向が斜めである場合には、電子部品保持部８に作用する荷重が荷重センサ２２に十分に伝わらない虞があり、荷重センサ２２の検出精度が低下する虞がある。これに対し、ピエゾ駆動部７と荷重センサ２２とを電子部品保持部８の移動方向に沿って配列されていることで、荷重センサ２２の検出精度を向上させることができる。  The detection accuracy of the load sensor 22 for detecting the load acting on the electronic component holding unit 8 is improved by arranging the piezo driving unit 7 and the load sensor 22 along the moving direction of the electronic component holding unit 8. Can do. For example, when the arrangement direction of the piezoelectric drive unit 7 and the load sensor 22 is oblique with respect to the moving direction of the electronic component holding unit 8, the load acting on the electronic component holding unit 8 is sufficiently applied to the load sensor 22. There is a possibility that it will not be transmitted, and the detection accuracy of the load sensor 22 may be reduced. On the other hand, the detection accuracy of the load sensor 22 can be improved by arranging the piezo drive unit 7 and the load sensor 22 along the moving direction of the electronic component holding unit 8.

荷重センサ２２は、電子部品保持部８の移動方向から作用する荷重を検出する。したがって、電子部品保持部８の移動方向から荷重センサ２２に加わるノイズをできるだけ除去することが好ましい。したがって、ノイズ検出センサ２０を荷重センサ２２に対して電子部品保持部８の移動方向に沿って配列することで、荷重センサ２２に作用するノイズに近いノイズをノイズ検出センサ２０により検出し易くなる。これにより、電子部品保持部８に作用する荷重を検出する荷重センサ２２の検出精度を向上させることができる。  The load sensor 22 detects a load acting from the moving direction of the electronic component holding unit 8. Therefore, it is preferable to remove as much as possible the noise applied to the load sensor 22 from the moving direction of the electronic component holding unit 8. Therefore, by arranging the noise detection sensor 20 along the moving direction of the electronic component holding unit 8 with respect to the load sensor 22, noise close to noise acting on the load sensor 22 can be easily detected by the noise detection sensor 20. Thereby, the detection accuracy of the load sensor 22 which detects the load which acts on the electronic component holding part 8 can be improved.

高速移動機構６は、第１移動部１４を移動させる。ピエゾ駆動部７は、第１移動部１４に対して上下方向に移動可能に取り付けられる第２移動部１８に取り付けられる。第２移動部１８は、付勢手段としてのバネ３０により下方に付勢された状態でロードセル１７を介して第１移動部１４に支持されている。  The high speed moving mechanism 6 moves the first moving unit 14. The piezo drive unit 7 is attached to a second moving unit 18 that is attached to the first moving unit 14 so as to be movable in the vertical direction. The second moving unit 18 is supported by the first moving unit 14 via the load cell 17 while being biased downward by a spring 30 as a biasing means.

バネ３０は、第２移動部１８を下方に、たとえば、５０ｋｇで押圧している。一方、ピエゾ駆動部７が電子部品電極Ｍ１を基板電極Ｐ１に押圧する押圧力は、たとえば、０．５Ｎ前後である。つまり、バネ３０が第２移動部１８を下方に押圧する押圧力は、ピエゾ駆動部７が電子部品電極Ｍ１を基板電極Ｐ１に押圧する押圧力に比べて極めて大きい。  The spring 30 presses the second moving part 18 downward, for example, with 50 kg. On the other hand, the pressing force with which the piezoelectric drive unit 7 presses the electronic component electrode M1 against the substrate electrode P1 is, for example, about 0.5N. That is, the pressing force with which the spring 30 presses the second moving portion 18 downward is extremely large compared to the pressing force with which the piezoelectric drive unit 7 presses the electronic component electrode M1 against the substrate electrode P1.

そのため、電子部品電極Ｍ１を基板電極Ｐ１に確実に押圧させた状態で、ロードセル１７による電子部品電極Ｍ１の基板電極Ｐ１への接触を検出することができると共に、変位センサ２１および荷重センサ２２による変位や荷重の検出精度の低下を防ぐことができる。バネ３０が、第２移動部１８を下方に付勢（押圧）する力の大きさは、ピエゾ駆動部７が電子部品電極Ｍ１を基板電極Ｐ１に押圧した場合でも、第２移動部１８が第１移動部１４に対して移動しない（不動とできる）大きさである。  Therefore, the contact of the electronic component electrode M1 to the substrate electrode P1 by the load cell 17 can be detected while the electronic component electrode M1 is reliably pressed against the substrate electrode P1, and the displacement by the displacement sensor 21 and the load sensor 22 is detected. And a decrease in load detection accuracy can be prevented. The magnitude of the force by which the spring 30 urges (presses) the second moving portion 18 downward is such that the second moving portion 18 does not move even when the piezoelectric drive unit 7 presses the electronic component electrode M1 against the substrate electrode P1. 1 is a size that does not move (can be immovable) relative to the moving unit 14.

電子部品接合装置１は、電子部品Ｍの電子部品電極Ｍ１と基板Ｐの基板電極Ｐ１とを熱溶融可能な金属である半田（部品側半田層Ｍ２，基板側半田層Ｐ２）を介して接合する電子部品接合方法において、電子部品Ｍおよび基板Ｐを加熱すると共に、電子部品Ｍから基板Ｐに対して所定の荷重が一定に付加された状態（ステップ８０）で、電子部品Ｍの下方への移動量を検出（ステップＳ９０，Ｓ１００）することにより、半田の溶融の有無を判断する。  The electronic component joining apparatus 1 joins the electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P via solder (component-side solder layer M2, substrate-side solder layer P2) that is a heat-meltable metal. In the electronic component joining method, the electronic component M and the substrate P are heated, and the electronic component M is moved downward in a state where a predetermined load is constantly applied from the electronic component M to the substrate P (step 80). By detecting the amount (steps S90 and S100), it is determined whether or not the solder is melted.

（他の実施の形態）
電子部品接合装置１は、図７に示すように所定周波数信号除去手段としてのバンドストップフィルタ４０を備え、荷重センサ２２から出力される荷重センサ信号から所定周波数の信号として電子部品接合装置１の固有振動の周波数の信号を除去する構成としてもよい。(Other embodiments)
As shown in FIG. 7, the electronic component bonding apparatus 1 includes a band stop filter 40 as a predetermined frequency signal removing unit, and the electronic component bonding apparatus 1 has a specific frequency as a signal of a predetermined frequency from the load sensor signal output from the load sensor 22. It is good also as a structure which removes the signal of the frequency of vibration.

本願発明の発明者は、解析により、荷重センサ信号のノイズ成分の多くが電子部品接合装置１の固有振動に起因するものであることをつきとめた。具体的には、図８に示される荷重センサ信号Ｖ２の周波数成分を解析した結果、図９に示される周波数成分が検出された。図９に示すように、荷重センサ信号Ｖ２（図８）には１３０Ｈｚおよび３３０Ｈｚの周波数成分が多い。一方、電子部品接合装置１の固有振動を解析したところ、１３０Ｈｚおよび３３０Ｈｚ付近に固有振動があることが判った。  The inventor of the present invention has found by analysis that most of the noise components of the load sensor signal are due to the natural vibration of the electronic component bonding apparatus 1. Specifically, as a result of analyzing the frequency component of the load sensor signal V2 shown in FIG. 8, the frequency component shown in FIG. 9 was detected. As shown in FIG. 9, the load sensor signal V2 (FIG. 8) has many frequency components of 130 Hz and 330 Hz. On the other hand, when the natural vibration of the electronic component bonding apparatus 1 was analyzed, it was found that there was natural vibration in the vicinity of 130 Hz and 330 Hz.

そこで、図７に示すようにバンドストップフィルタ４０を用いることにより、図８に示される荷重センサ信号Ｖ２から１３０Ｈｚおよび３３０Ｈｚの信号を除去したところ、図１０に示す荷重センサ信号Ｖ６のように、荷重センサ２２の実際の荷重に好適に沿った荷重センサ信号を得ることができた。図１１は、図８に示される荷重センサ信号Ｖ２から１３０Ｈｚの信号を除去した荷重センサ信号Ｖ２−１を示す図である。図１２は、図８に示される荷重センサ信号Ｖ２から３３０Ｈｚの信号を除去した荷重センサ信号Ｖ２−２を示す図である。なお、荷重センサ信号から除去される信号の周波数は、電子部品接合装置の構造や使用されるモータ等により異なり、上記の１３０Ｈｚおよび３３０Ｈｚは一例である。  Therefore, by using the band stop filter 40 as shown in FIG. 7, when the 130 Hz and 330 Hz signals are removed from the load sensor signal V2 shown in FIG. 8, the load sensor signal V6 shown in FIG. It was possible to obtain a load sensor signal that suitably matched the actual load of the sensor 22. FIG. 11 is a diagram showing a load sensor signal V2-1 obtained by removing a 130 Hz signal from the load sensor signal V2 shown in FIG. FIG. 12 is a diagram showing a load sensor signal V2-2 obtained by removing a 330 Hz signal from the load sensor signal V2 shown in FIG. Note that the frequency of the signal removed from the load sensor signal varies depending on the structure of the electronic component bonding apparatus, the motor used, and the like, and the above 130 Hz and 330 Hz are examples.

なお、バンドストップフィルタ４０にノッチフィルタを用いることで、電子部品接合装置１の固有振動の周波数である１３０Ｈｚおよび３３０Ｈｚだけを精度よく除去することができる。荷重センサ信号から除去する周波数の信号としては、上記のように、電子部品接合装置１の固有振動の周波数の信号の他、電子部品接合装置１が設置される環境で発生する固有振動の周波数の信号を対象とすることもできる。  In addition, by using a notch filter for the band stop filter 40, it is possible to accurately remove only 130 Hz and 330 Hz that are natural vibration frequencies of the electronic component bonding apparatus 1. As described above, the frequency signal to be removed from the load sensor signal includes the frequency of the natural vibration generated in the environment in which the electronic component bonding apparatus 1 is installed, in addition to the signal of the natural vibration frequency of the electronic component bonding apparatus 1. Signals can also be targeted.

１ … 電子部品接合装置
２ … 電子部品昇降機構
４ … 制御部（ノイズ信号除去手段）
６ … 高速移動機構
７ … ピエゾ駆動部（低速移動機構）
８ … 電子部品保持部
１４ … 第１移動部
１７ … ロードセル
１８ … 第２移動部
２０ … ノイズ検出センサ
２２ … 荷重センサ
３０ … バネ（付勢手段）
４０ … バンドストップフィルタ（所定周波数信号除去手段）
Ｖ２ … 荷重センサ信号（荷重信号）
Ｖ３ … ノイズ信号
Ｍ … 電子部品
Ｍ１ … 電子部品電極（電子部品の電極）
Ｍ２ … 部品側半田層
Ｐ … 基板
Ｐ１ … 基板電極（基板の電極）
Ｐ２ … 基板側半田層DESCRIPTION OF SYMBOLS 1 ... Electronic component joining apparatus 2 ... Electronic component raising / lowering mechanism 4 ... Control part (noise signal removal means)
6 ... High-speed movement mechanism 7 ... Piezo drive unit (low-speed movement mechanism)
DESCRIPTION OF SYMBOLS 8 ... Electronic component holding part 14 ... 1st moving part 17 ... Load cell 18 ... 2nd moving part 20 ... Noise detection sensor 22 ... Load sensor 30 ... Spring (biasing means)
40: Band stop filter (predetermined frequency signal removing means)
V2 ... Load sensor signal (load signal)
V3 ... Noise signal M ... Electronic component M1 ... Electronic component electrode (Electronic component electrode)
M2 ... Component side solder layer P ... Substrate P1 ... Substrate electrode (substrate electrode)
P2 ... Board side solder layer

Claims (5)

電子部品を保持する電子部品保持部を基板に向けて昇降移動する電子部品昇降機構を有し、前記電子部品を、基板から離間した位置から前記電子部品の電極と前記基板の電極とが接触する位置まで移動させ、前記電子部品の電極と前記基板の電極とを熱溶融可能な金属を介して接合する電子部品接合装置において、
前記電子部品昇降機構は、
前記電子部品の電極と前記基板の電極との間の距離が、所定の距離になるまで前記電子部品保持部を高い速度で移動させる高速移動機構と、
前記電子部品の電極と前記基板の電極との間の距離が前記所定の距離になった後、前記高い速度よりも低い速度で移動させる低速移動機構とを有し、
前記高速移動機構は、第１移動部を移動させ、
前記低速移動機構は、前記第１移動部に対して上下方向に移動可能に取り付けられる第２移動部に取り付けられ、
前記第２移動部は、付勢手段により下方に付勢された状態でロードセルを介して第１移動部に支持されており、
前記低速移動機構の駆動源はピエゾ素子である、
ことを特徴とする電子部品接合装置。 There is an electronic component lifting mechanism that moves the electronic component holding part that holds the electronic component up and down toward the substrate, and the electrode of the electronic component and the electrode of the substrate are in contact with each other from a position away from the substrate. In an electronic component joining apparatus that moves to a position and joins the electrode of the electronic component and the electrode of the substrate via a heat-meltable metal,
The electronic component lifting mechanism is
A high-speed movement mechanism that moves the electronic component holding part at a high speed until the distance between the electrode of the electronic component and the electrode of the substrate reaches a predetermined distance;
A low-speed moving mechanism that moves at a speed lower than the high speed after the distance between the electrode of the electronic component and the electrode of the substrate reaches the predetermined distance;
The high-speed moving mechanism moves the first moving unit,
The low-speed moving mechanism is attached to a second moving part that is attached to the first moving part so as to be movable in the vertical direction,
The second moving part is supported by the first moving part via the load cell in a state of being biased downward by the biasing means ,
The drive source of the low-speed moving mechanism is a piezo element,
An electronic component joining apparatus characterized by the above. 請求項１に記載の電子部品接合装置において、
前記電子部品保持部に保持された前記電子部品に対して、前記基板が配置される側から作用する荷重を検出する荷重センサと、
前記荷重センサに作用するノイズを検出するノイズ検出センサと、
前記ノイズ検出センサにより検出されるノイズ信号に基づき前記荷重センサにより検出される荷重信号からノイズを除去するノイズ信号除去手段と、
を有することを特徴とする電子部品接合装置。 The electronic component bonding apparatus according to claim 1,
A load sensor for detecting a load acting on the electronic component held by the electronic component holding unit from a side where the substrate is disposed;
A noise detection sensor for detecting noise acting on the load sensor;
Noise signal removal means for removing noise from the load signal detected by the load sensor based on the noise signal detected by the noise detection sensor;
An electronic component joining apparatus comprising: 請求項２に記載の電子部品接合装置において、
前記ノイズ検出センサと、前記荷重センサと、前記低速移動機構とは、前記電子部品保持部の移動方向に沿って配列されている、
ことを特徴とする電子部品接合装置。 In the electronic component joining apparatus according to claim 2,
The noise detection sensor, the load sensor, and the low-speed moving mechanism are arranged along the moving direction of the electronic component holding unit.
An electronic component joining apparatus characterized by the above. 請求項１から３のいずれか１項に記載の電子部品接合装置において、
前記電子部品保持部に保持された前記電子部品に対して、前記基板が配置される側から作用する荷重を検出する荷重センサと、
前記荷重センサにより検出される荷重信号から所定周波数の信号を除去する所定周波数信号除去手段と、
を有することを特徴とする電子部品接合装置。 In the electronic component joining apparatus according to any one of claims 1 to 3,
A load sensor for detecting a load acting on the electronic component held by the electronic component holding unit from a side where the substrate is disposed;
Predetermined frequency signal removing means for removing a signal of a predetermined frequency from the load signal detected by the load sensor;
An electronic component joining apparatus comprising: 電子部品の電極と基板の電極とを熱溶融可能な金属を介して接合する電子部品接合方法において、In an electronic component joining method for joining an electrode of an electronic component and an electrode of a substrate through a metal that can be thermally melted,
請求項１から４のいずれか１項に記載の電子部品接合装置を用い、前記電子部品および前記基板を加熱すると共に、前記電子部品から前記基板に対して所定の荷重が一定に付加された状態で、前記電子部品の下方への移動量を検出することにより、前記金属の溶融の有無を判断することを特徴とする電子部品接合方法。  A state in which the electronic component and the substrate are heated using the electronic component bonding apparatus according to any one of claims 1 to 4, and a predetermined load is constantly applied from the electronic component to the substrate. Then, the electronic component joining method is characterized by determining whether or not the metal is melted by detecting a downward movement amount of the electronic component.
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