JP5905092B2 - サーバ及びサーバの冷却方法 - Google Patents
サーバ及びサーバの冷却方法 Download PDFInfo
- Publication number
- JP5905092B2 JP5905092B2 JP2014523275A JP2014523275A JP5905092B2 JP 5905092 B2 JP5905092 B2 JP 5905092B2 JP 2014523275 A JP2014523275 A JP 2014523275A JP 2014523275 A JP2014523275 A JP 2014523275A JP 5905092 B2 JP5905092 B2 JP 5905092B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- server
- cooling element
- grating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
2 筐体
3 フロント面
4 リア面
5 第1の発熱部品
6 システムファン
7 空気の流れ
8 熱交換部
9 システムボード
10 更なる発熱部品
11 フィン
12 輸送媒体
13 冷却要素
Claims (6)
- 直方体の筐体と、フロント面に配置された第1の発熱部品と、後方に配置され、前記フロント面からリア面への空気の流れを生成するシステムファンと、前記空気の流れの流れ方向において前記システムファンの下流に配置される更なる発熱部品とを有するサーバであって、
熱交換部が前記更なる発熱部品の上流に配置され、
前記熱交換部は、熱伝導態様において当該サーバの前記筐体へ冷却要素を介して結合され、前記筐体を介して熱を消散させ、
前記冷却要素と前記筐体との間の接続は、大面積構造であり、
前記熱交換部は、冷却フィンを備える格子状のグレーチングとして設計され、
前記冷却要素は、前記空気の流れに対して垂直に配置される前記熱交換部の前記格子状のグレーチングから延在し、それにより、前記空気の流れは、前記筐体の壁面上の前記冷却要素に沿って前記熱交換部の前記格子状のグレーチングを通過することができ、
前記冷却要素は、前記システムファンの上流、後方、又は両側に熱伝導態様において前記筐体と接続される、ことを特徴とするサーバ。 - 前記熱交換部は平面であり、前記筐体の最大限の幅及び高さにわたって構成される、
ことを特徴とする請求項1に記載のサーバ。 - 前記熱交換部は、輸送媒体によって前記冷却要素へ接続される、
ことを特徴とする請求項1又は2に記載のサーバ。 - 前記輸送媒体は、気体、液体、ヒートパイプ、熱伝導金属、又は望ましくはグラファイトのホイルである、
ことを特徴とする請求項3に記載のサーバ。 - 前記筐体への前記冷却要素の接続は取り外し可能である、
ことを特徴とする請求項1乃至4のうちいずれか一項に記載のサーバ。 - 前記冷却要素は銅、アルミニウム、又はグラファイトを有する、
ことを特徴とする請求項1乃至5のうちいずれか一項に記載のサーバ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011109476.1A DE102011109476B9 (de) | 2011-08-04 | 2011-08-04 | Server sowie Verfahren zum Kühlen eines Servers |
DE102011109476.1 | 2011-08-04 | ||
PCT/EP2012/064216 WO2013017426A1 (de) | 2011-08-04 | 2012-07-19 | Server sowie verfahren zum kühlen eines servers |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014529120A JP2014529120A (ja) | 2014-10-30 |
JP5905092B2 true JP5905092B2 (ja) | 2016-04-20 |
Family
ID=46551545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014523275A Active JP5905092B2 (ja) | 2011-08-04 | 2012-07-19 | サーバ及びサーバの冷却方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9386728B2 (ja) |
JP (1) | JP5905092B2 (ja) |
DE (1) | DE102011109476B9 (ja) |
WO (1) | WO2013017426A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10506735B2 (en) | 2014-08-25 | 2019-12-10 | Hamilton Sundstrand Corporation | Heat exchange device in directed flow system |
DE102016204175A1 (de) | 2016-03-14 | 2017-09-14 | Thomas-Krenn.AG | System, vorzugsweise für eine Temperaturregulierung eines Volumens |
US9795055B1 (en) * | 2016-04-18 | 2017-10-17 | International Business Machines Corporation | Electronics cooling assembly with multi-position, airflow-blocking mechanism |
CN113301765B (zh) * | 2020-07-01 | 2023-04-14 | 阿里巴巴集团控股有限公司 | 服务器散热部件运行状态控制方法,服务器***和服务器 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS55130339A (en) | 1979-03-29 | 1980-10-09 | Mitsubishi Electric Corp | Bending method of metal plate of opposite polarity plasma arc |
JPS5753698U (ja) * | 1980-09-16 | 1982-03-29 | ||
JPS5753698A (en) | 1980-09-17 | 1982-03-30 | Daido Steel Co Ltd | Burnable waste gas processing method |
DE3436984A1 (de) | 1984-10-09 | 1986-04-17 | Erich H. Dipl.-Ing. 4950 Minden Woltermann | Maschine zum zubereiten heisser getraenke mit dosierter fluessigkeitsentnahme |
DE4445818A1 (de) | 1994-12-21 | 1995-06-14 | Bernhard Hilpert | Computergehäuse für den Industrie-Einsatz |
AU2001253251A1 (en) * | 2000-04-05 | 2001-10-23 | Einux, Inc. | Cooling system and method for high density electronics enclosure |
TW484721U (en) * | 2000-11-06 | 2002-04-21 | Giga Byte Tech Co Ltd | Improved airflow guiding structure of server |
DE20101154U1 (de) * | 2001-01-23 | 2001-08-09 | Inova Computers GmbH, 87600 Kaufbeuren | Kühlung |
JP2004047789A (ja) | 2002-07-12 | 2004-02-12 | Mitsubishi Alum Co Ltd | ヒートシンク |
DE10334798B4 (de) * | 2003-07-30 | 2005-06-23 | Fujitsu Siemens Computers Gmbh | Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten |
US7273088B2 (en) * | 2003-12-17 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | One or more heat exchanger components in major part operably locatable outside computer chassis |
US7068509B2 (en) * | 2004-02-03 | 2006-06-27 | Hewlett-Packard Development Company, L.P. | Small form factor cooling system |
US7327578B2 (en) | 2004-02-06 | 2008-02-05 | Sun Microsystems, Inc. | Cooling failure mitigation for an electronics enclosure |
US7345873B2 (en) | 2004-09-29 | 2008-03-18 | General Electric Company | System and method for cooling electronic systems |
JP4922943B2 (ja) | 2004-11-14 | 2012-04-25 | リーバート・コーポレイシヨン | 電子部品筐体冷却システムおよび方法 |
JP2006163663A (ja) | 2004-12-06 | 2006-06-22 | Hitachi Ltd | ディスクアレイ装置、及びディスクアレイ装置の筐体 |
JP3755535B2 (ja) | 2005-08-12 | 2006-03-15 | 株式会社日立製作所 | 熱輸送デバイス |
US20070125523A1 (en) | 2005-12-01 | 2007-06-07 | Bhatti Mohinder S | Low profile liquid cooled server heat sink |
US20070283716A1 (en) * | 2006-06-08 | 2007-12-13 | Joseph Marsala | Pumped refrigerant loop cooling system for cooling High thermal density heat loads |
DE202007001857U1 (de) * | 2006-10-17 | 2007-04-12 | Knuerr Ag | Arbeitsplatz-Anordnungen |
US7719839B2 (en) * | 2007-02-19 | 2010-05-18 | Dell Products L.P. | Heat conduction apparatus providing for selective configuration for heat conduction |
US7667967B1 (en) * | 2008-08-06 | 2010-02-23 | Sun Microsystems, Inc. | Liquid-cooled rack with optimized rack heat exchanger design for non-uniform power dissipation |
JP2011134802A (ja) | 2009-12-22 | 2011-07-07 | Chuo Electronics Co Ltd | 電子機器収納ラック装置及び方法 |
JP5471644B2 (ja) * | 2010-03-15 | 2014-04-16 | 富士通株式会社 | 情報機器 |
-
2011
- 2011-08-04 DE DE102011109476.1A patent/DE102011109476B9/de not_active Expired - Fee Related
-
2012
- 2012-07-19 WO PCT/EP2012/064216 patent/WO2013017426A1/de active Application Filing
- 2012-07-19 US US14/236,939 patent/US9386728B2/en active Active
- 2012-07-19 JP JP2014523275A patent/JP5905092B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
DE102011109476B3 (de) | 2013-01-31 |
JP2014529120A (ja) | 2014-10-30 |
WO2013017426A1 (de) | 2013-02-07 |
US9386728B2 (en) | 2016-07-05 |
DE102011109476B9 (de) | 2014-04-10 |
US20140233177A1 (en) | 2014-08-21 |
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