JP5897550B2 - アンテナデバイスおよびその製造方法 - Google Patents
アンテナデバイスおよびその製造方法 Download PDFInfo
- Publication number
- JP5897550B2 JP5897550B2 JP2013506455A JP2013506455A JP5897550B2 JP 5897550 B2 JP5897550 B2 JP 5897550B2 JP 2013506455 A JP2013506455 A JP 2013506455A JP 2013506455 A JP2013506455 A JP 2013506455A JP 5897550 B2 JP5897550 B2 JP 5897550B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal sheet
- plastic body
- chemical plating
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3456—Antennas, e.g. radomes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Chemically Coating (AREA)
- Telephone Set Structure (AREA)
- Details Of Aerials (AREA)
Description
(1)化学めっきによって形成される金属層と、プラスチック製外側筐体に露出している金属シートの表面との間の接着力が良好ではないため、堆積された金属層は、金属シートの表面から剥離するか、または外れて落ちる場合があり、その結果、金属粒子または粉末が電子製品の内部空間に散乱し、これらの金属粒子または粉末によって、電子製品の内側の回路基板のトレースは、短絡を形成する場合がある。
(2)上記の(1)の観点として、化学めっきによって形成される金属層と、金属シートの表面との間の接着力が良好ではないため、化学めっきによって形成される金属層は、しわの寄った、荒い、または剥離した表面を形成する場合があり、それによって、金属シートは、装飾の機能を失う。
1 筐体部材
10 プラスチック製本体
101 アンテナパターン
102 内面
103 外面
11 金属シート
12 金属層
20 回路基板
201 トレース
21 導体素子
30 電力供給
301 電極
302 ブラケット
40 化学めっき溶液
Claims (6)
- 金属シートの周囲にプラスチック製本体をインサート成形することによって、筐体部材を形成し、該筐体部材の形成が、前記金属シートの一部分を露出した状態のままにしておくことと、
前記プラスチック製本体上にアンテナパターンを形成することと、
露出している前記金属シートの前記一部分上に、正電圧を提供することと、
金属イオンを含有する化学めっき溶液を用いて、アンテナを形成するように、前記アンテナパターン上に金属層を提供することとを含む、方法であって、
前記化学めっき溶液が、前記金属シートの正に帯電した露出部分上に金属層を堆積させない、方法。 - 前記金属シートは、耐食金属から形成される、請求項1に記載の方法。
- 前記アンテナパターンは、レーザーダイレクトストラクチャリング(LDS)によって、前記プラスチック製本体上に形成される、請求項2に記載の方法。
- 前記プラスチック製本体は、ツーショット成形によって形成され、前記アンテナパターンは、第2のショットで提供される、請求項2に記載の方法。
- 前記化学めっき溶液中の前記金属イオンは、銅イオンであり、前記金属層は、銅層である、請求項1に記載の方法。
- 前記化学めっき溶液中の前記金属イオンは、ニッケルイオンであり、前記金属層は、ニッケル層である、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010163004.3 | 2010-04-30 | ||
CN201010163004.3A CN102237568B (zh) | 2010-04-30 | 2010-04-30 | 天线装置及其制作方法 |
PCT/CN2011/000760 WO2011134282A1 (zh) | 2010-04-30 | 2011-04-29 | 天线装置及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013527689A JP2013527689A (ja) | 2013-06-27 |
JP5897550B2 true JP5897550B2 (ja) | 2016-03-30 |
Family
ID=44860819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013506455A Expired - Fee Related JP5897550B2 (ja) | 2010-04-30 | 2011-04-29 | アンテナデバイスおよびその製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5897550B2 (ja) |
CN (1) | CN102237568B (ja) |
WO (1) | WO2011134282A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105307378B (zh) * | 2014-07-18 | 2018-10-19 | 启碁科技股份有限公司 | 基板结构的制造方法、基板结构以及金属构件 |
CN105463418A (zh) * | 2014-09-10 | 2016-04-06 | 启碁科技股份有限公司 | 金属图案的制造方法与基板结构 |
JP6338547B2 (ja) * | 2015-03-31 | 2018-06-06 | オリンパス株式会社 | 成形回路部品、成形回路部品の製造方法および回路モジュール |
CN104882671B (zh) * | 2015-05-11 | 2017-11-28 | 深圳天珑无线科技有限公司 | 一种内嵌金属的塑胶壳件实现化镀天线的方法 |
US20170075473A1 (en) | 2015-09-15 | 2017-03-16 | Hyundai Motor Company | Touch input device and method for manufacturing the same |
CN110499500A (zh) * | 2019-08-29 | 2019-11-26 | 讯创(天津)电子有限公司 | 一种无机非金属材料5g三维镭雕手机天线的制作方法 |
CN110819973B (zh) * | 2019-11-08 | 2021-11-16 | 上海安费诺永亿通讯电子有限公司 | 一种外置lds天线的外表面喷涂工艺及其化学抛光液 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59170291A (ja) * | 1983-03-16 | 1984-09-26 | Nec Corp | ph接合ウエハのp側へのメツキ方法 |
JPH0787288B2 (ja) * | 1987-03-23 | 1995-09-20 | 富士通テン株式会社 | 車載用スピーカ一体形アンテナの製造方法 |
US6486837B2 (en) * | 2001-04-09 | 2002-11-26 | Molex Incorporated | Antenna structures |
JP3880061B2 (ja) * | 2002-05-22 | 2007-02-14 | 日立マクセル株式会社 | 成形品の製造方法及び装置 |
JP2006166033A (ja) * | 2004-12-07 | 2006-06-22 | Nec Corp | 携帯電話機 |
TW200814426A (en) * | 2006-09-08 | 2008-03-16 | Hon Hai Prec Ind Co Ltd | Wireless communication devices |
DE102007037248A1 (de) * | 2006-09-15 | 2008-03-27 | Samsung Electro - Mechanics Co., Ltd., Suwon | Verfahren zur Herstellung eines eine Metallfilm-Leiterbahn bildenden Körpers |
CN101364661A (zh) * | 2007-08-10 | 2009-02-11 | 陈稚元 | 薄膜天线的制作方法 |
US8150484B2 (en) * | 2007-09-11 | 2012-04-03 | Nokia Corporation | Protective housings for wireless transmission apparatus and associated methods |
-
2010
- 2010-04-30 CN CN201010163004.3A patent/CN102237568B/zh not_active Expired - Fee Related
-
2011
- 2011-04-29 JP JP2013506455A patent/JP5897550B2/ja not_active Expired - Fee Related
- 2011-04-29 WO PCT/CN2011/000760 patent/WO2011134282A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2011134282A1 (zh) | 2011-11-03 |
JP2013527689A (ja) | 2013-06-27 |
CN102237568A (zh) | 2011-11-09 |
CN102237568B (zh) | 2015-09-23 |
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