JP5894612B2 - 熱伝導性emi抑制構造 - Google Patents
熱伝導性emi抑制構造 Download PDFInfo
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- JP5894612B2 JP5894612B2 JP2014006063A JP2014006063A JP5894612B2 JP 5894612 B2 JP5894612 B2 JP 5894612B2 JP 2014006063 A JP2014006063 A JP 2014006063A JP 2014006063 A JP2014006063 A JP 2014006063A JP 5894612 B2 JP5894612 B2 JP 5894612B2
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- interface
- interference suppression
- electromagnetic
- radiation
- electromagnetic interference
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- 230000001629 suppression Effects 0.000 title claims description 59
- 239000000463 material Substances 0.000 claims description 67
- 230000005855 radiation Effects 0.000 claims description 45
- 230000005670 electromagnetic radiation Effects 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 229920002367 Polyisobutene Polymers 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 229920001021 polysulfide Polymers 0.000 claims description 2
- 239000005077 polysulfide Substances 0.000 claims description 2
- 150000008117 polysulfides Polymers 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 230000009975 flexible effect Effects 0.000 description 8
- 239000011231 conductive filler Substances 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000002955 isolation Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910000640 Fe alloy Inorganic materials 0.000 description 3
- 229910017082 Fe-Si Inorganic materials 0.000 description 3
- 229910017133 Fe—Si Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000012777 electrically insulating material Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920002239 polyacrylonitrile Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004634 thermosetting polymer Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229910017061 Fe Co Inorganic materials 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910001004 magnetic alloy Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- AKJVMGQSGCSQBU-UHFFFAOYSA-N zinc azanidylidenezinc Chemical compound [Zn++].[N-]=[Zn].[N-]=[Zn] AKJVMGQSGCSQBU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
S=−20logTi/Io
ここで、Sはシールドの有効性であり、Tiは透過放射であり、Ioは入射放射である。
インタフェース・パッドの2つのサンプル・セットが用意され、第1のセットは1mmの厚さ寸法を有し(「薄い」サンプル)、第2のサンプルは3mmの厚さ寸法を有していた(「厚い」サンプル・セット)。2つのサンプル・セットは、他の点では組成が同一であり、インタフェース・パッドは以下の組成から用意された。
RL=20log10(Γ)
12、112、212 第1の側
14、114、214 第2の側
18、118 第1の部分
20、120 第2の部分
22、122 第3の部分
32 抑制材料
134 シールド部材
203 第1の層
204 第2の層
205、206 別個の部分
207 第3の層
222 干渉抑制部分
232 干渉抑制材料
310 インタフェース
320 端部部分
900 インタフェース
950 電子部品
952 第1の表面
954 側面表面
960 基板/回路基板
970 シールド/ヒートシンク
972 内側表面
Claims (8)
- 第1の表面および一般に対向する第2の表面を有し、前記第1の表面と前記第2の表面の間が厚さとなる本体からなる電磁干渉抑制装置であって、
前記本体が、
前記厚さを通して、少なくとも1W/m・Kの熱伝導度と、
20℃でショア00硬度10〜70の間の硬度と、
少なくとも108Ω・mの体積電気抵抗率と
を示し、
前記本体が第1の部分及び第2の部分を有し、
前記第1の部分は前記第1の表面及び前記第2の表面の少なくとも一方から離隔され、電磁放射抑制材料としてポリマー性母材内に分散されたMn−Zn粉末を含み、
前記電磁放射抑制材料は前記本体の前記第1の部分に閉じ込められる、電磁干渉抑制装置。 - 前記ポリマー性母材が、シリコーン、ポリエチレン、ポリブタジエン、アクリル、エポキシ、ウレタン、ポリスルフィド、ポリイソブチレン、ポリビニル又はポリオレフィン・ベースのポリマー、及びそれらの組合せから選択される、請求項1に記載の電磁干渉抑制装置。
- 前記第1の部分が、前記第1及び第2の表面の両方から離隔される、請求項2に記載の電磁干渉抑制装置。
- 基板に固定され、筐体を画定するシールド部材と、
前記筐体内で前記基板に載置された電子部品と、
1〜10GHzの間の波形周波数を有する放射を少なくとも1dB減衰させることができる請求項1に記載の本体である干渉抑制体と
を備え、
前記干渉抑制体は、前記筐体内で、前記電子部品と前記シールド部材との間に配置される、電磁干渉抑制装置。 - 前記干渉抑制体が、前記シールド部材及び前記電子部品の両方と物理的に接触する、請求項4に記載の電磁干渉抑制装置。
- 前記干渉抑制体が前記電子部品を実質的に封入する、請求項4に記載の電磁干渉抑制装置。
- 前記シールド部材が金属である、請求項4に記載の電磁干渉抑制装置。
- 前記基板がプリント回路基板である、請求項4に記載の電磁干渉抑制装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014006063A JP5894612B2 (ja) | 2014-01-16 | 2014-01-16 | 熱伝導性emi抑制構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014006063A JP5894612B2 (ja) | 2014-01-16 | 2014-01-16 | 熱伝導性emi抑制構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015135864A JP2015135864A (ja) | 2015-07-27 |
JP5894612B2 true JP5894612B2 (ja) | 2016-03-30 |
Family
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---|---|---|---|
JP2014006063A Active JP5894612B2 (ja) | 2014-01-16 | 2014-01-16 | 熱伝導性emi抑制構造 |
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Country | Link |
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JP (1) | JP5894612B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11145569B2 (en) | 2017-02-28 | 2021-10-12 | Murata Manufacturing Co., Ltd. | Module equipped with a heat dissipation member |
US11678470B2 (en) | 2015-02-06 | 2023-06-13 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100942786B1 (ko) * | 2007-10-01 | 2010-02-18 | 두성산업 주식회사 | 방열 특성과 전자파 및 충격 흡수 특성이 향상된 롤 타입의복합 시트 및 그 제조 방법 |
-
2014
- 2014-01-16 JP JP2014006063A patent/JP5894612B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11678470B2 (en) | 2015-02-06 | 2023-06-13 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide |
US11145569B2 (en) | 2017-02-28 | 2021-10-12 | Murata Manufacturing Co., Ltd. | Module equipped with a heat dissipation member |
Also Published As
Publication number | Publication date |
---|---|
JP2015135864A (ja) | 2015-07-27 |
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