JP5836830B2 - Manufacturing method of connecting body and connecting method - Google Patents

Manufacturing method of connecting body and connecting method Download PDF

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Publication number
JP5836830B2
JP5836830B2 JP2012029805A JP2012029805A JP5836830B2 JP 5836830 B2 JP5836830 B2 JP 5836830B2 JP 2012029805 A JP2012029805 A JP 2012029805A JP 2012029805 A JP2012029805 A JP 2012029805A JP 5836830 B2 JP5836830 B2 JP 5836830B2
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Prior art keywords
heating
liquid crystal
electronic component
substrate
temperature
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JP2012029805A
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JP2013168443A (en
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亮太 相崎
亮太 相崎
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Dexerials Corp
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Dexerials Corp
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Priority to JP2012029805A priority Critical patent/JP5836830B2/en
Priority to PCT/JP2013/051556 priority patent/WO2013121858A1/en
Priority to TW102103606A priority patent/TW201347058A/en
Publication of JP2013168443A publication Critical patent/JP2013168443A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H05K2201/10136—Liquid Crystal display [LCD]

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
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  • Liquid Crystal (AREA)

Description

本発明は、光硬化型の接着剤を用いて電子部品等が接続された接続体の製造方法、及び光硬化型の接着剤を用いて電子部品等を接続する接続方法に関し、特に、加熱加圧と光照射とを併用した接続体の製造方法及び接続方法に関する。   The present invention relates to a method for manufacturing a connection body in which electronic components and the like are connected using a photo-curable adhesive, and a connection method for connecting electronic components and the like using a photo-curable adhesive, and in particular, heating. The present invention relates to a connection body manufacturing method and connection method using pressure and light irradiation in combination.

従来から、テレビやＰＣモニタ、携帯電話、携帯型ゲーム機、タブレットＰＣあるいは車載用モニタ等の各種表示手段として、液晶表示装置が多く用いられている。近年、このような液晶表示装置においては、ファインピッチ化、軽量薄型化等の観点から、液晶駆動用ＩＣを直接液晶表示パネルの基板上に実装するいわゆるＣＯＧ（chip on glass）や、液晶駆動回路が形成されたフレキシブル基板を直接液晶表示パネルの基板上に実装するいわゆるＦＯＧ（film on glass）が採用されている。   Conventionally, a liquid crystal display device has been widely used as various display means such as a television, a PC monitor, a mobile phone, a portable game machine, a tablet PC, or an in-vehicle monitor. In recent years, in such liquid crystal display devices, so-called COG (chip on glass) in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel or a liquid crystal driving circuit from the viewpoints of fine pitch, light weight, and thinning. A so-called FOG (film on glass) that directly mounts the flexible substrate on which the substrate is formed on the substrate of the liquid crystal display panel is employed.

例えばＣＯＧ実装方式が採用された液晶表示装置１００は、図８に示すように、液晶表示のための主機能を果たす液晶表示パネル１０４を有しており、この液晶表示パネル１０４は、ガラス基板等からなる互いに対向する二枚の透明基板１０２，１０３を有している。そして、液晶表示パネル１０４は、これら両透明基板１０２，１０３が枠状のシール１０５によって互いに貼り合わされるとともに、両透明基板１０２，１０３およびシール１０５によって囲繞された空間内に液晶１０６が封入されたパネル表示部１０７が設けられている。   For example, as shown in FIG. 8, a liquid crystal display device 100 employing a COG mounting system has a liquid crystal display panel 104 that performs a main function for liquid crystal display. The liquid crystal display panel 104 includes a glass substrate or the like. And two transparent substrates 102 and 103 facing each other. In the liquid crystal display panel 104, the transparent substrates 102 and 103 are bonded to each other by a frame-shaped seal 105, and the liquid crystal 106 is sealed in a space surrounded by the transparent substrates 102 and 103 and the seal 105. A panel display unit 107 is provided.

透明基板１０２，１０３は、互いに対向する両内側表面に、ＩＴＯ（酸化インジウムスズ）等からなる縞状の一対の透明電極１０８，１０９が、互いに交差するように形成されている。そして、両透明基板１０２，１０３は、これら両透明電極１０８，１０９の当該交差部位によって液晶表示の最小単位としての画素が構成されるようになっている。   The transparent substrates 102 and 103 have a pair of striped transparent electrodes 108 and 109 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent substrates 102 and 103 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 108 and 109.

両透明基板１０２，１０３のうち、一方の透明基板１０３は、他方の透明基板１０２よりも平面寸法が大きく形成されており、この大きく形成された透明基板１０３の縁部１０３ａには、透明電極１０９の端子部１０９ａが形成されている。また、両透明電極１０８，１０９上には、所定のラビング処理が施された配向膜１１１，１１２が形成されており、この配向膜１１１，１１２によって液晶分子の初期配向が規制されるようになっている。さらに、両透明電極１０８，１０９の外側には、一対の偏光板１１８，１１９が配設されており、これら両偏光板１１８，１１９によってバックライト等の光源１２０からの透過光の振動方向が規制されるようになっている。   Of the two transparent substrates 102 and 103, one transparent substrate 103 is formed to have a larger planar dimension than the other transparent substrate 102, and the transparent electrode 109 is formed on the edge 103a of the transparent substrate 103 formed to be large. Terminal portion 109a is formed. Further, alignment films 111 and 112 subjected to a predetermined rubbing process are formed on both transparent electrodes 108 and 109, and the initial alignment of liquid crystal molecules is regulated by the alignment films 111 and 112. ing. Further, a pair of polarizing plates 118 and 119 are disposed outside the transparent electrodes 108 and 109, and the vibration direction of transmitted light from the light source 120 such as a backlight is regulated by the polarizing plates 118 and 119. It has come to be.

端子部１０９ａ上には、異方性導電フィルム１１４を介して液晶駆動用ＩＣ１１５が熱圧着されている。異方性導電フィルム１１４は、熱硬化型のバインダー樹脂に導電性粒子を混ぜ込んでフィルム状としたもので、２つの導体間で加熱圧着されることにより導電粒子で導体間の電気的導通がとられ、バインダー樹脂にて導体間の機械的接続が保持される。液晶駆動用ＩＣ１１５は、画素に対して液晶駆動電圧を選択的に印加することにより、液晶の配向を部分的に変化させて所定の液晶表示を行うことができるようになっている。なお、異方性導電フィルム１１４を構成する接着剤としては、通常、最も信頼性の高い熱硬化性の接着剤を用いるようになっている。   On the terminal portion 109a, a liquid crystal driving IC 115 is thermocompression bonded via an anisotropic conductive film 114. The anisotropic conductive film 114 is a film formed by mixing conductive particles in a thermosetting binder resin, and heat conduction is performed between the two conductors so that the electrical conduction between the conductors is achieved by the conductive particles. And the mechanical connection between the conductors is maintained by the binder resin. The liquid crystal driving IC 115 can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying a liquid crystal driving voltage to the pixels. In addition, as the adhesive constituting the anisotropic conductive film 114, the most reliable thermosetting adhesive is usually used.

このような異方性導電フィルム１１４を介して液晶駆動用ＩＣ１１５を端子部１０９ａへ接続する場合は、先ず、透明電極１０９の端子部１０９ａ上に異方性導電フィルム１１４を図示しない仮圧着手段によって仮圧着する。続いて、異方性導電フィルム１１４上に液晶駆動用ＩＣ１１５を載置した後、図９に示すように熱圧着ヘッド等の熱圧着手段１２１によって液晶駆動用ＩＣ１１５を異方性導電フィルム１１４とともに端子部１０９ａ側へ押圧しつつ熱圧着手段１２１を発熱させる。この熱圧着手段１２１による発熱によって、異方性導電フィルム１１４は熱硬化反応を起こし、これにより、異方性導電フィルム１１４を介して液晶駆動用ＩＣ１１５が端子部１０９ａ上に接着される。   When the liquid crystal driving IC 115 is connected to the terminal portion 109a through such an anisotropic conductive film 114, first, the anisotropic conductive film 114 is attached to the terminal portion 109a of the transparent electrode 109 by a temporary crimping means (not shown). Temporarily crimp. Subsequently, after the liquid crystal driving IC 115 is mounted on the anisotropic conductive film 114, the liquid crystal driving IC 115 is connected to the terminal together with the anisotropic conductive film 114 by thermocompression bonding means 121 such as a thermocompression bonding head as shown in FIG. The thermocompression bonding means 121 is caused to generate heat while being pressed toward the portion 109a. Due to the heat generated by the thermocompression bonding means 121, the anisotropic conductive film 114 undergoes a thermosetting reaction, whereby the liquid crystal driving IC 115 is bonded onto the terminal portion 109a via the anisotropic conductive film 114.

しかし、このような異方性導電フィルムを用いた接続方法においては、熱加圧温度が高く、液晶駆動用ＩＣ１１５等の電子部品や透明基板１０３に対する熱衝撃が大きくなる。加えて、異方性導電フィルムが接続された後、常温まで温度が低下する際に、その温度差に起因して、バインダーが収縮し、透明基板１０３の端子部１０９ａに反りが生じうる。そのため、液晶駆動用ＩＣ１１５の接続不良を引き起こし、表示ムラ等の不具合を引き起こすおそれがあった。   However, in such a connection method using an anisotropic conductive film, the heat pressing temperature is high, and the thermal shock to the electronic components such as the liquid crystal driving IC 115 and the transparent substrate 103 is increased. In addition, after the anisotropic conductive film is connected, when the temperature decreases to room temperature, the binder contracts due to the temperature difference, and the terminal portion 109a of the transparent substrate 103 may be warped. For this reason, the connection failure of the liquid crystal driving IC 115 may be caused, and there may be a problem such as display unevenness.

そこで、このような熱硬化型の接着剤を用いた異方性導電フィルム１１４に代えて、紫外線硬化型の接着剤を用いた接続方法も提案されている。紫外線硬化型の接着剤を用いる接続方法においては、接着剤が熱によって軟化流動し、透明電極１０９の端子部１０９ａと液晶駆動用ＩＣ１１５の電極間に導電性粒子を捕捉するのに十分な温度まで加熱するに止め、紫外線照射によって接着剤を硬化させる。   Therefore, a connection method using an ultraviolet curable adhesive instead of the anisotropic conductive film 114 using such a thermosetting adhesive has been proposed. In the connection method using an ultraviolet curable adhesive, the adhesive softens and flows due to heat, and the temperature is sufficient to capture the conductive particles between the terminal portion 109a of the transparent electrode 109 and the electrode of the liquid crystal driving IC 115. Stop heating and cure the adhesive by UV irradiation.

しかし、かかる紫外線硬化型の接着剤を用いる接続方法においても、紫外線照射による硬化に伴って接着剤の収縮が起きる。そのため、当該収縮に起因して、透明基板１０３のＩＣ接続部に反りが生じ、そのため、液晶駆動用ＩＣ１１５の接続不良を引き起こし、表示ムラ等の不具合を引き起こすおそれは、依然として残る。   However, even in such a connection method using an ultraviolet curable adhesive, the adhesive shrinks as it is cured by ultraviolet irradiation. Therefore, due to the shrinkage, the IC connection portion of the transparent substrate 103 is warped, so that there is still a possibility that the connection failure of the liquid crystal driving IC 115 is caused, causing a problem such as display unevenness.

特開２００８−２５２０９８号公報JP 2008-252098 A

そこで、本発明は、上述した課題を解決するものであり、紫外線硬化型の接着剤を用いることで低温で電子部品の接続を行うと共に、接着剤の硬化収縮を抑え、電子部品の接続不良を改善する接続体の製造方法、及び接続方法を提供することを目的とする。   Therefore, the present invention solves the above-described problems, and uses an ultraviolet curable adhesive to connect electronic components at a low temperature, suppresses curing shrinkage of the adhesive, and prevents poor connection of electronic components. It is an object of the present invention to provide a method for manufacturing a connection body and a connection method to be improved.

上述した課題を解決するために、本発明に係る接続体の製造方法は、導電性粒子を含有する光硬化型の接着剤を介して、基板上に電子部品を配置する工程と、上記電子部品の上から加熱するとともに加圧する工程と、加熱を停止し、加圧を続行する工程と、加圧を続行しながら、上記接着剤に光を段階的又は連続的に照度が増加するように照射して硬化させる工程とを有するものである。 In order to solve the above-described problems, a method for manufacturing a connection body according to the present invention includes a step of arranging an electronic component on a substrate via a photo-curing adhesive containing conductive particles, and the electronic component. The process of heating and pressurizing from above, the process of stopping heating and continuing the pressurization, and irradiating the adhesive with light so as to increase the illuminance stepwise or continuously while continuing the pressurization And a step of curing.

また、本発明に係る接続方法は、導電性粒子を含有する光硬化型の接着剤を介して、基板上に電子部品を配置する工程と、上記電子部品の上から加熱するとともに加圧する工程と、加熱を停止し、加圧を続行する工程と、加圧を続行しながら、上記接着剤に光を段階的又は連続的に照度が増加するように照射して硬化させる工程とを有するものである。 In addition, the connection method according to the present invention includes a step of placing an electronic component on a substrate via a photocurable adhesive containing conductive particles, and a step of heating and pressurizing the electronic component from above. , Having a step of stopping heating and continuing the pressurization, and a step of curing the adhesive by irradiating the adhesive with light in a stepwise or continuous manner while continuing the pressurization. is there.

本発明によれば、加熱加圧工程において、導電性粒子を含有する接着剤が流動性を示す温度まで加熱し、基板と電子部品の各電極間で導電性粒子を押し潰し、この状態で加熱を停止して、加圧を続行しながら紫外線を照射し、この紫外線照射によって接着剤を硬化する。   According to the present invention, in the heating and pressurizing step, the adhesive containing conductive particles is heated to a temperature at which fluidity is exhibited, and the conductive particles are crushed between the electrodes of the substrate and the electronic component, and heated in this state. Is stopped, and ultraviolet rays are irradiated while continuing the pressurization, and the adhesive is cured by the ultraviolet irradiation.

このような本発明によれば、接着剤を溶融させるのに必要な温度まで加熱し、溶融後は加熱を停止するため、接着剤の温度を下げながら硬化させることで、常温まで温度が低下する際の温度差を小さく抑えることができる。したがって、本発明によれば、加熱温度と常温との温度差に起因する基板の反りを抑えることができ、電子部品との接続不良や、これに起因する表示ムラ等の不具合を防止することができる。   According to the present invention, the adhesive is heated to a temperature necessary for melting, and after the melting, the heating is stopped. Therefore, the temperature is lowered to room temperature by curing while lowering the temperature of the adhesive. The temperature difference at the time can be kept small. Therefore, according to the present invention, it is possible to suppress the warpage of the substrate due to the temperature difference between the heating temperature and the normal temperature, and it is possible to prevent problems such as poor connection with electronic components and display unevenness due to this. it can.

本発明が適用された実装工程を示す断面図である。It is sectional drawing which shows the mounting process to which this invention was applied. 異方性導電フィルムを示す断面図である。It is sectional drawing which shows an anisotropic conductive film. ホースからエアーを噴出して冷却する工程を示す断面図である。It is sectional drawing which shows the process of ejecting air from a hose and cooling. 実施例及び比較例に係るガラス基板の反りの測定方法を説明するための図である。It is a figure for demonstrating the measuring method of the curvature of the glass substrate which concerns on an Example and a comparative example. 実施例及び比較例に係る導通抵抗の測定方法を説明するための図である。It is a figure for demonstrating the measuring method of the conduction resistance which concerns on an Example and a comparative example. 実施例及び比較例に係る加熱押圧ヘッドの温度と圧着時間との関係を示すグラフである。It is a graph which shows the relationship between the temperature of the heat press head which concerns on an Example and a comparative example, and crimping | compression-bonding time. 実施例及び比較例に係る溶融粘度と圧着時間との関係を示すグラフである。It is a graph which shows the relationship between the melt viscosity which concerns on an Example and a comparative example, and crimping | compression-bonding time. 従来の液晶表示パネルを示す断面図である。It is sectional drawing which shows the conventional liquid crystal display panel. 従来の液晶表示パネルのＣＯＧ実装工程を示す断面図である。It is sectional drawing which shows the COG mounting process of the conventional liquid crystal display panel.

以下、本発明が適用された接続体の製造方法及び接続方法について、図面を参照しながら詳細に説明する。なお、本発明は、以下の実施形態のみに限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更が可能であることは勿論である。また、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることがある。具体的な寸法等は以下の説明を参酌して判断すべきものである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。   Hereinafter, a manufacturing method and a connecting method of a connection body to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

以下では、接続対象物及び被接続対象物として、電子部品を接続する場合を例に説明するが、本技術は、電子部品の接続以外にも適用することができる。例えば、液晶表示パネルのガラス基板に液晶駆動用のＩＣチップを実装するいわゆるＣＯＧ（chip on glass）実装を行う。この液晶表示パネル１０は、図１に示すように、ガラス基板等からなる二枚の透明基板１１，１２が対向配置され、これら透明基板１１，１２が枠状のシール１３によって互いに貼り合わされている。そして、液晶表示パネル１０は、透明基板１１，１２によって囲繞された空間内に液晶１４が封入されることによりパネル表示部１５が形成されている。   Hereinafter, a case where an electronic component is connected as an object to be connected and an object to be connected will be described as an example. However, the present technology can be applied to other than the connection of the electronic component. For example, so-called COG (chip on glass) mounting is performed in which an IC chip for driving a liquid crystal is mounted on a glass substrate of a liquid crystal display panel. As shown in FIG. 1, the liquid crystal display panel 10 includes two transparent substrates 11 and 12 made of a glass substrate and the like, and the transparent substrates 11 and 12 are bonded to each other by a frame-shaped seal 13. . In the liquid crystal display panel 10, the liquid crystal 14 is sealed in a space surrounded by the transparent substrates 11 and 12 to form a panel display unit 15.

透明基板１１，１２は、互いに対向する両内側表面に、ＩＴＯ（酸化インジウムスズ）等からなる縞状の一対の透明電極１６，１７が、互いに交差するように形成されている。そして、両透明電極１６，１７は、これら両透明電極１６，１７の当該交差部位によって液晶表示の最小単位としての画素が構成されるようになっている。   The transparent substrates 11 and 12 have a pair of striped transparent electrodes 16 and 17 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent electrodes 16 and 17 are configured such that a pixel as a minimum unit of liquid crystal display is configured by the intersection of the transparent electrodes 16 and 17.

両透明基板１１，１２のうち、一方の透明基板１２は、他方の透明基板１１よりも平面寸法が大きく形成されており、この大きく形成された透明基板１２の縁部１２ａには、液晶駆動用ＩＣ等の電子部品１８が実装されるＣＯＧ実装部２０が設けられ、またＣＯＧ実装部２０の外側近傍には、液晶駆動回路が形成されたフレキシブル基板２１が実装されるＦＯＧ実装部２２が設けられている。   Of the transparent substrates 11 and 12, one transparent substrate 12 is formed to have a larger planar dimension than the other transparent substrate 11, and a liquid crystal driving edge is formed on the edge 12a of the formed transparent substrate 12. A COG mounting unit 20 on which an electronic component 18 such as an IC is mounted is provided, and an FOG mounting unit 22 on which a flexible substrate 21 on which a liquid crystal driving circuit is formed is mounted near the outside of the COG mounting unit 20. ing.

なお、液晶駆動用ＩＣや液晶駆動回路は、画素に対して液晶駆動電圧を選択的に印加することにより、液晶の配向を部分的に変化させて所定の液晶表示を行うことができるようになっている。   Note that the liquid crystal driving IC and the liquid crystal driving circuit can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying the liquid crystal driving voltage to the pixels. ing.

各実装部２０，２２には、透明電極１７の端子部１７ａが形成されている。端子部１７ａ上には、導電性の接着剤として異方性導電フィルム１を用いて液晶駆動用ＩＣ等の電子部品１８やフレキシブル基板２１が接続される。異方性導電フィルム１は、導電性粒子４を含有しており、電子部品１８やフレキシブル基板２１の電極と透明基板１２の縁部１２ａに形成された透明電極１７の端子部１７ａとを、導電性粒子４を介して電気的に接続させるものである。この異方性導電フィルム１は、紫外線硬化型の接着剤であり、後述する加熱押圧ヘッド３０により熱圧着されることにより流動化して導電性粒子４が端子部１７ａと電子部品やフレキシブル基板２１の各電極との間で押し潰され、紫外線照射器３１により紫外線が照射されることにより、導電性粒子４が押し潰された状態で硬化する。これにより、異方性導電フィルム１は、透明基板１２と電子部品１８やフレキシブル基板２１とを電気的、機械的に接続する。   In each of the mounting portions 20 and 22, a terminal portion 17a of the transparent electrode 17 is formed. On the terminal portion 17a, an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 are connected using the anisotropic conductive film 1 as a conductive adhesive. The anisotropic conductive film 1 contains the conductive particles 4, and conducts the electrode of the electronic component 18 or the flexible substrate 21 and the terminal portion 17 a of the transparent electrode 17 formed on the edge portion 12 a of the transparent substrate 12. Electrically connected through the conductive particles 4. The anisotropic conductive film 1 is an ultraviolet curable adhesive, and is fluidized by being thermocompression bonded by a heating and pressing head 30 to be described later, so that the conductive particles 4 are bonded to the terminal portions 17 a and the electronic components or the flexible substrate 21. By being crushed between each electrode and being irradiated with ultraviolet rays by the ultraviolet irradiator 31, the conductive particles 4 are cured in a crushed state. Thereby, the anisotropic conductive film 1 electrically and mechanically connects the transparent substrate 12 to the electronic component 18 and the flexible substrate 21.

また、両透明電極１６，１７上には、所定のラビング処理が施された配向膜２４が形成されており、この配向膜２４によって液晶分子の初期配向が規制されるようになっている。さらに、両透明基板１１，１２の外側には、一対の偏光板２５，２６が配設されており、これら両偏光板２５，２６によってバックライト等の光源（図示せず）からの透過光の振動方向が規制されるようになっている。   Further, an alignment film 24 subjected to a predetermined rubbing process is formed on both the transparent electrodes 16 and 17, and the initial alignment of liquid crystal molecules is regulated by the alignment film 24. In addition, a pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12, and these polarizing plates 25 and 26 allow transmitted light from a light source (not shown) such as a backlight to be transmitted. The vibration direction is regulated.

［異方性導電フィルム］
異方性導電フィルム（ＡＣＦ）１は、図２に示すように、通常、基材となる剥離フィルム２上に導電性粒子含有層３が形成されたものである。異方性導電フィルム１は、図１に示すように、液晶表示パネル１０の透明基板１２に形成された透明電極１７と電子部品１８やフレキシブル基板２１との間に導電性粒子含有層３を介在させることで、液晶表示パネル１０と電子部品１８あるいはフレキシブル基板２１とを接続し、導通させるために用いられる。 [Anisotropic conductive film]
As shown in FIG. 2, the anisotropic conductive film (ACF) 1 is usually one in which a conductive particle-containing layer 3 is formed on a release film 2 serving as a base material. As shown in FIG. 1, the anisotropic conductive film 1 has a conductive particle-containing layer 3 interposed between a transparent electrode 17 formed on a transparent substrate 12 of the liquid crystal display panel 10 and an electronic component 18 or a flexible substrate 21. By doing so, the liquid crystal display panel 10 and the electronic component 18 or the flexible substrate 21 are connected and used for electrical connection.

剥離フィルム２としては、異方性導電フィルムにおいて一般に用いられている例えばポリエチレンテレフタレートフィルム等の基材を使用することができる。   As the release film 2, a base material such as a polyethylene terephthalate film generally used in anisotropic conductive films can be used.

導電性粒子含有層３は、バインダー中に導電性粒子４を分散してなるものである。バインダーは、膜形成樹脂、硬化性樹脂、硬化剤、シランカップリング剤等を含有するものであり、通常の異方性導電フィルムに用いられるバインダーと同様である。   The conductive particle-containing layer 3 is formed by dispersing conductive particles 4 in a binder. The binder contains a film-forming resin, a curable resin, a curing agent, a silane coupling agent, and the like, and is the same as the binder used for a normal anisotropic conductive film.

膜形成樹脂としては、平均分子量が１００００〜８００００程度の樹脂が好ましい。膜形成樹脂としては、フェノキシ樹脂、エポキシ樹脂、変形エポキシ樹脂、ウレタン樹脂、等の各種の樹脂が挙げられる。中でも、膜形成状態、接続信頼性等の観点からフェノキシ樹脂が特に好ましい。   As the film-forming resin, a resin having an average molecular weight of about 10,000 to 80,000 is preferable. Examples of the film forming resin include various resins such as a phenoxy resin, an epoxy resin, a modified epoxy resin, and a urethane resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

硬化性樹脂としては、特に限定されず、エポキシ樹脂、アクリル樹脂等が挙げられる。   It does not specifically limit as curable resin, An epoxy resin, an acrylic resin, etc. are mentioned.

エポキシ樹脂としては、特に制限はなく、目的に応じて適宜選択することができる。具体例として、例えば、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノール型エポキシ樹脂、スチルベン型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ナフトール型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂等が挙げられる。これらは単独でも、２種以上の組み合わせであってもよい。   There is no restriction | limiting in particular as an epoxy resin, According to the objective, it can select suitably. As specific examples, for example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin, naphthol type epoxy resin, A dicyclopentadiene type epoxy resin, a triphenylmethane type epoxy resin, etc. are mentioned. These may be used alone or in combination of two or more.

アクリル樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、具体例として、例えば、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エポキシアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、ジメチロールトリシクロデカンジアクリレート、テトラメチレングリコールテトラアクリレート、２−ヒドロキシ−１，３−ジアクリロキシプロパン、２，２−ビス［４−（アクリロキシメトキシ）フェニル］プロパン、２，２−ビス［４−（アクリロキシエトキシ）フェニル］プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス（アクリロキシエチル）イソシアヌレート、ウレタンアクリレート、エポキシアクリレート等が挙げられる。これらは単独でも、２種以上の組み合わせであってもよい。   There is no restriction | limiting in particular as an acrylic resin, According to the objective, it can select suitably, For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, for example , Trimethylolpropane triacrylate, dimethyloltricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) ) Isocyanurate, urethane acrylate, epoxy acrylate. These may be used alone or in combination of two or more.

硬化剤としては、光硬化型であれば特に制限はなく、目的に応じて適宜選択することができるが、硬化性樹脂がエポキシ樹脂の場合はカチオン系硬化剤が好ましく、硬化性樹脂がアクリル樹脂の場合はラジカル系硬化剤が好ましい。   The curing agent is not particularly limited as long as it is a photo-curing type, and can be appropriately selected according to the purpose. However, when the curable resin is an epoxy resin, a cationic curing agent is preferable, and the curable resin is an acrylic resin. In this case, a radical curing agent is preferable.

カチオン系硬化剤としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、スルホニウム塩、オニウム塩等を挙げることができ、これらの中でも、芳香族スルホニウム塩が好ましい。ラジカル系硬化剤としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、有機過酸化物を挙げることができる。   There is no restriction | limiting in particular as a cationic hardening | curing agent, According to the objective, it can select suitably, For example, a sulfonium salt, onium salt, etc. can be mentioned, Among these, an aromatic sulfonium salt is preferable. There is no restriction | limiting in particular as a radical type hardening | curing agent, According to the objective, it can select suitably, For example, an organic peroxide can be mentioned.

シランカップリング剤としては、エポキシ系、アミノ系、メルカプト・スルフィド系、ウレイド系等を挙げることができる。シランカップリング剤を添加することにより、有機材料と無機材料との界面における接着性が向上される。   Examples of the silane coupling agent include epoxy-based, amino-based, mercapto-sulfide-based, and ureido-based agents. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

導電性粒子４としては、異方性導電フィルムにおいて使用されている公知の何れの導電性粒子を挙げることができる。導電性粒子４としては、例えば、ニッケル、鉄、銅、アルミニウム、錫、鉛、クロム、コバルト、銀、金等の各種金属や金属合金の粒子、金属酸化物、カーボン、グラファイト、ガラス、セラミック、プラスチック等の粒子の表面に金属をコートしたもの、或いは、これらの粒子の表面に更に絶縁薄膜をコートしたもの等が挙げられる。樹脂粒子の表面に金属をコートしたものである場合、樹脂粒子としては、例えば、エポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン（ＡＳ）樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等の粒子を挙げることができる。   Examples of the conductive particles 4 include any known conductive particles used in anisotropic conductive films. Examples of the conductive particles 4 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

［製造方法］
次いで、異方性導電フィルム１を介して電子部品１８やフレキシブル基板２１が透明基板１２の透明電極１７上に接続された接続体の製造工程について説明する。先ず、異方性導電フィルム１を透明電極１７上に仮圧着する。異方性導電フィルム１を仮圧着する方法は、液晶表示パネル１０の透明基板１２の透明電極１７上に、導電性粒子含有層３が透明電極１７側となるように、異方性導電フィルム１を配置する。 [Production method]
Next, a manufacturing process of a connection body in which the electronic component 18 and the flexible substrate 21 are connected to the transparent electrode 17 of the transparent substrate 12 through the anisotropic conductive film 1 will be described. First, the anisotropic conductive film 1 is temporarily pressure-bonded onto the transparent electrode 17. The method for temporarily press-bonding the anisotropic conductive film 1 is such that the conductive particle-containing layer 3 is on the transparent electrode 17 side on the transparent electrode 17 of the transparent substrate 12 of the liquid crystal display panel 10. Place.

そして、導電性粒子含有層３を透明電極１７上に配置した後、剥離フィルム２側から導電性粒子含有層３を例えば加熱押圧ヘッド３０で加熱及び加圧し、加熱押圧ヘッド３０を剥離フィルム２から離し、剥離フィルム２を透明電極１７上の導電性粒子含有層３から剥離することによって、導電性粒子含有層３のみが透明電極１７上に仮圧着される。加熱押圧ヘッド３０による仮圧着は、剥離フィルム２の上面を僅かな圧力（例えば０．１ＭＰａ〜２ＭＰａ程度）で透明電極１７側に押圧しながら加熱する。ただし、加熱温度は、異方性導電フィルム１中のエポキシ樹脂やアクリル樹脂等の熱硬化性樹脂が硬化しない程度の温度（例えば７０〜１００℃程度）とする。   And after arrange | positioning the electroconductive particle content layer 3 on the transparent electrode 17, the electroconductive particle content layer 3 is heated and pressurized by the heating press head 30, for example from the peeling film 2 side, and the heating press head 30 is peeled from the peeling film 2. Release the release film 2 from the conductive particle-containing layer 3 on the transparent electrode 17, so that only the conductive particle-containing layer 3 is temporarily pressure-bonded onto the transparent electrode 17. Temporary pressure bonding by the heating and pressing head 30 heats the upper surface of the release film 2 while pressing it against the transparent electrode 17 side with a slight pressure (for example, about 0.1 MPa to 2 MPa). However, the heating temperature is set to such a temperature that the thermosetting resin such as epoxy resin or acrylic resin in the anisotropic conductive film 1 is not cured (for example, about 70 to 100 ° C.).

次に、透明基板１２の透明電極１７と電子部品１８の電極端子とが導電性粒子含有層３を介して対向するように、電子部品１８を配置する。   Next, the electronic component 18 is disposed so that the transparent electrode 17 of the transparent substrate 12 and the electrode terminal of the electronic component 18 face each other with the conductive particle-containing layer 3 interposed therebetween.

次に、電子部品１８の上面を所定の加熱温度に昇温された加熱押圧ヘッド３０により、所定の温度及び所定の圧力で熱加圧する。加熱押圧ヘッド３０による熱加圧温度は、硬化開始前に導電性粒子含有層３が溶融したときの粘度（最低溶融粘度）を示す所定の温度に対して±１０〜２０℃の温度（例えば１１０℃前後）に設定される。これにより、透明基板１２の反りを最小に抑え、また電子部品１８に熱による損傷を加えることもない。   Next, the upper surface of the electronic component 18 is hot-pressed at a predetermined temperature and a predetermined pressure by the heating and pressing head 30 that has been heated to a predetermined heating temperature. The heat pressing temperature by the heating and pressing head 30 is a temperature of ± 10 to 20 ° C. (for example, 110 ° C.) with respect to a predetermined temperature indicating a viscosity (minimum melt viscosity) when the conductive particle-containing layer 3 is melted before the start of curing. Around ℃). Thereby, the warp of the transparent substrate 12 is minimized, and the electronic component 18 is not damaged by heat.

加熱押圧ヘッド３０による加熱時間は、異方性導電フィルム１の導電性粒子含有層３が流動性を示し、透明電極１７の端子部１７ａと電子部品１８の電極端子との間からバインダー樹脂が流出し、透明電極１７の端子部１７ａ及び電子部品１８の電極端子の間で導電性粒子４が押し潰された状態となる所定の時間とする。   During the heating time by the heating and pressing head 30, the conductive particle-containing layer 3 of the anisotropic conductive film 1 exhibits fluidity, and the binder resin flows out between the terminal portion 17a of the transparent electrode 17 and the electrode terminal of the electronic component 18. In addition, the predetermined time when the conductive particles 4 are crushed between the terminal portion 17a of the transparent electrode 17 and the electrode terminal of the electronic component 18 is set.

本接続方法では、加熱押圧ヘッド３０は、導電性粒子４が透明電極１７の端子部１７ａ及び電子部品１８の電極端子の間で押し潰された状態となるまで加熱押圧されると、押圧を維持したまま、加熱を停止する。   In this connection method, the heating and pressing head 30 maintains the pressure when the conductive particles 4 are heated and pressed until the conductive particles 4 are crushed between the terminal portions 17a of the transparent electrode 17 and the electrode terminals of the electronic component 18. And stop heating.

次いで、加熱押圧ヘッド３０による加熱が停止された後、電子部品１８を押圧した状態を続行しながら、透明基板１２の裏側に設けられた紫外線照射器３１によって異方性導電フィルム１に紫外線を照射する。紫外線照射器３１より発光された紫外線は、透明基板１２を支持するガラス等の透明な支持台及びこの支持台に支持された透明基板１２を透過して導電性粒子含有層３へ照射される。この紫外線照射器３１としては、水銀ランプ、メタルハライドランプ、ＬＥＤランプ等を用いることができる。   Next, after the heating by the heating and pressing head 30 is stopped, the anisotropic conductive film 1 is irradiated with ultraviolet rays by the ultraviolet irradiator 31 provided on the back side of the transparent substrate 12 while continuing to press the electronic component 18. To do. The ultraviolet light emitted from the ultraviolet irradiator 31 passes through a transparent support base such as glass that supports the transparent substrate 12 and the transparent substrate 12 supported by the support base, and is irradiated to the conductive particle-containing layer 3. As the ultraviolet irradiator 31, a mercury lamp, a metal halide lamp, an LED lamp, or the like can be used.

この加熱押圧ヘッド３０による押圧及び紫外線照射器３１の紫外線による異方性導電フィルム１の硬化により、異方性導電フィルム１を介して電子部品１８が端子部１７ａ上に本圧着される。加熱押圧ヘッド３０による押圧及び紫外線照射器３１による紫外線照射は、同時に又は前後して終了する。   The electronic component 18 is finally pressure-bonded onto the terminal portion 17 a through the anisotropic conductive film 1 by the pressing by the heating and pressing head 30 and the curing of the anisotropic conductive film 1 by the ultraviolet rays of the ultraviolet irradiator 31. The pressing by the heating and pressing head 30 and the ultraviolet irradiation by the ultraviolet irradiator 31 are completed simultaneously or before and after.

［本発明の作用効果］
このように、本製造工程によれば、加熱押圧ヘッド３０による熱加圧工程において、異方性導電フィルム１の導電性粒子含有層３が流動性を示す温度まで加熱し、透明電極１７の端子部１７ａと電子部品１８の電極端子とで導電性粒子４を押し潰す。そして、本製造工程では、この状態で加熱押圧ヘッド３０による加熱を停止して、紫外線照射器３１によって紫外線を照射し、この紫外線照射によって導電性粒子含有層３を硬化する。 [Effects of the present invention]
Thus, according to this manufacturing process, in the heat-pressing process by the heating and pressing head 30, the conductive particle-containing layer 3 of the anisotropic conductive film 1 is heated to a temperature at which it exhibits fluidity, and the terminal of the transparent electrode 17 The conductive particles 4 are crushed by the portion 17a and the electrode terminals of the electronic component 18. And in this manufacturing process, the heating by the heating press head 30 is stopped in this state, ultraviolet rays are irradiated by the ultraviolet irradiator 31, and the conductive particle-containing layer 3 is cured by this ultraviolet irradiation.

このような本製造工程によれば、加熱押圧ヘッド３０は、導電性粒子含有層３を溶融させるのに必要な温度まで加熱し、溶融後は加熱を停止するため、導電性粒子含有層３の温度を下げながら硬化させることで、常温まで温度が低下する際の温度差を小さく抑えることができる。したがって、本製造工程によれば、加熱押圧ヘッド３０による加熱温度と常温との温度差に起因する透明基板１２の反りを抑えることができ、液晶駆動用ＩＣ等の電子部品１８と透明電極１７との接続不良や、これに起因する表示ムラ等の不具合を防止することができる。   According to such a manufacturing process, the heating / pressing head 30 heats the conductive particle-containing layer 3 to a temperature necessary for melting the conductive particle-containing layer 3 and stops heating after melting. By curing while lowering the temperature, the temperature difference when the temperature drops to room temperature can be kept small. Therefore, according to this manufacturing process, the warp of the transparent substrate 12 due to the temperature difference between the heating temperature by the heating and pressing head 30 and the normal temperature can be suppressed, and the electronic component 18 such as a liquid crystal driving IC and the transparent electrode 17 This can prevent problems such as poor connection and display unevenness due to this connection failure.

［押圧＋冷却＋ＵＶ照射］
また、本発明は、加熱押圧ヘッド３０による加熱の停止に加え、導電性粒子含有層３を冷却してもよい。導電性粒子含有層３を冷却することにより、常温との温度差をさらに小さくすることができ、常温まで温度が低下する際の温度差に起因する透明基板１２の反りをさらに抑えることができる。 [Press + cooling + UV irradiation]
In the present invention, the conductive particle-containing layer 3 may be cooled in addition to stopping the heating by the heating and pressing head 30. By cooling the conductive particle-containing layer 3, the temperature difference from the normal temperature can be further reduced, and the warp of the transparent substrate 12 due to the temperature difference when the temperature is lowered to the normal temperature can be further suppressed.

導電性粒子含有層３の冷却方法としては、例えば、図３に示すように、ＣＯＧ実装部２０に向けてエアーを噴射するホース３２を設ける方法や、電子部品１８を押圧する加熱押圧ヘッド３０を冷却する方法等を用いることができる。なお、ＣＯＧ実装部２０に向けてエアーを噴射する方法によれば、紫外線照射による硬化工程の短時間（数秒）の間でも、導電性粒子含有層３を冷却することができる。   As a method for cooling the conductive particle-containing layer 3, for example, as shown in FIG. 3, a method of providing a hose 32 that injects air toward the COG mounting portion 20, or a heating and pressing head 30 that presses the electronic component 18. A cooling method or the like can be used. In addition, according to the method which injects air toward the COG mounting part 20, the electroconductive particle content layer 3 can be cooled also during the short time (several seconds) of the hardening process by ultraviolet irradiation.

［ＵＶ多段階照射］
また、本製造工程では、加熱押圧ヘッド３０によって電子部品１８を押圧するとともに、紫外線照射器３１によって紫外線を照射する。このとき、紫外線照射器３１は、照度を一定としてもよいが、段階的に照度を上昇させていくことが好ましい。 [UV multi-step irradiation]
In the present manufacturing process, the electronic component 18 is pressed by the heating and pressing head 30, and ultraviolet rays are irradiated by the ultraviolet irradiator 31. At this time, the ultraviolet irradiator 31 may keep the illuminance constant, but it is preferable to increase the illuminance step by step.

紫外線照射器３１によって、段階的に照射量を上昇させることにより、紫外線照射の初期ではバインダー樹脂の硬化反応の進行が遅くされ、紫外線照射の後期でバインダー樹脂の硬化反応を急速に進行させる。これにより、透明電極１７の端子部１７ａと電子部品１８の電極端子とで導電性粒子４を押し潰す作用が一定となる、すなわち端子部１７ａと電極端子との間に捕捉された導電性粒子４が一様に押し潰される効果を奏する溶融粘度まで、確実に導電性粒子含有層３を溶融させ、かつ、当該粘度を保持し、導電性粒子４が押し潰された後、溶融粘度が上昇し、この状態で硬化させることができる。   By increasing the irradiation amount stepwise by the ultraviolet irradiator 31, the progress of the curing reaction of the binder resin is delayed at the initial stage of the ultraviolet irradiation, and the curing reaction of the binder resin is rapidly advanced at the later stage of the ultraviolet irradiation. As a result, the action of crushing the conductive particles 4 between the terminal portions 17a of the transparent electrode 17 and the electrode terminals of the electronic component 18 becomes constant, that is, the conductive particles 4 captured between the terminal portions 17a and the electrode terminals. After the conductive particle-containing layer 3 is reliably melted and maintained at the melt viscosity that exhibits the effect of being uniformly crushed and the conductive particles 4 are crushed, the melt viscosity increases. In this state, it can be cured.

また、紫外線照射器３１によって、段階的に照射量を上昇させることにより、紫外線照射の初期ではバインダー樹脂の硬化反応の進行が遅くされ、紫外線照射の後期でバインダー樹脂の硬化反応を急速に進行させ、これにより導電性粒子含有層３の硬化収縮を抑えるとともに、異方性導電フィルム１による接続信頼性を高めることができる。   Further, by gradually increasing the irradiation amount by the ultraviolet irradiator 31, the progress of the curing reaction of the binder resin is delayed at the initial stage of the ultraviolet irradiation, and the curing reaction of the binder resin is rapidly advanced at the later stage of the ultraviolet irradiation. Thus, curing shrinkage of the conductive particle-containing layer 3 can be suppressed, and connection reliability by the anisotropic conductive film 1 can be increased.

これは、紫外線硬化の反応は非常に早く、紫外線照射の初期から大きな照度で照射すると、導電性粒子含有層３に硬化ムラが生じ、これにより透明電極１７に反りが生じ、あるいは導電性粒子含有層３や透明電極１７に内在する応力が大きくなってしまうためである。そこで、紫外線照射の初期は比較的弱い照度で照射し、後期で照度を強めることにより、導電性粒子含有層３の硬化ムラを防止し、反りや内部応力の増大を防止することができる。   This is because the UV curing reaction is very fast, and when irradiated with a large illuminance from the initial stage of UV irradiation, the conductive particle-containing layer 3 is unevenly cured, thereby causing the transparent electrode 17 to be warped or containing conductive particles. This is because the stress inherent in the layer 3 and the transparent electrode 17 is increased. Therefore, by irradiating with a relatively weak illuminance at the initial stage of ultraviolet irradiation and increasing the illuminance at a later stage, uneven curing of the conductive particle-containing layer 3 can be prevented, and an increase in warpage and internal stress can be prevented.

さらに、紫外線照射器３１によって、段階的に照射量を上昇させることにより、紫外線照射の初期ではバインダー樹脂の硬化反応の進行が遅くされ、その間に加熱押圧ヘッド３０による加熱の停止、あるいは冷却によって常温との温度差が縮小される。したがって、紫外線の照度を段階的に増加することで、硬化収縮による歪み及び温度低下による歪みの両方を補正しつつ硬化させることができる。一方、紫外線照射の初期に強い照度で照射すると、これらの歪みを内在させた状態で硬化させてしまう。   Further, by gradually increasing the irradiation amount by the ultraviolet irradiator 31, the progress of the curing reaction of the binder resin is delayed at the initial stage of the ultraviolet irradiation, and during that time, the heating press head 30 stops heating or cools at room temperature. And the temperature difference is reduced. Therefore, by gradually increasing the illuminance of ultraviolet rays, it is possible to cure while correcting both distortion due to curing shrinkage and distortion due to temperature decrease. On the other hand, if irradiation is performed with a strong illuminance at the initial stage of ultraviolet irradiation, the distortion is cured in a state of being inherent.

またさらに、紫外線照射の初期から強い照度にすると、バインダー樹脂の反応開始点が多くなりすぎてしまい分子鎖の短い耐熱性に劣る硬化物となってしまう。そこで、紫外線照射の初期は比較的弱い照度で照射し、後期で照度を強めることにより、耐熱性に優れた硬化物とすることができ、実装温度の低温化を図りつつ、接続信頼性を高めることができる。   Furthermore, when the illuminance is high from the beginning of the ultraviolet irradiation, the reaction starting point of the binder resin is excessively increased, resulting in a cured product having a short molecular chain and inferior heat resistance. Therefore, by irradiating with a relatively weak illuminance at the initial stage of ultraviolet irradiation and increasing the illuminance at a later stage, a cured product with excellent heat resistance can be obtained, and the connection reliability is improved while lowering the mounting temperature. be able to.

紫外線照射器３１による照射時間や、照射段階及び照度、総照射量は、バインダー樹脂の組成や、加熱押圧ヘッド３０による熱加圧温度、圧力及び時間から、最もバインダーの硬化反応が効率よく進行する条件を設定する。また、照度は、段階的に上げてもよく、連続的に上昇させてもよい。   The irradiation time by the ultraviolet irradiator 31, the irradiation stage, the illuminance, and the total irradiation amount are determined most efficiently by the binder curing reaction from the composition of the binder resin and the heat-pressing temperature, pressure and time by the heating and pressing head 30. Set conditions. Further, the illuminance may be increased stepwise or may be increased continuously.

電子部品１８を透明基板１２の透明電極１７上に接続した後、同様にしてフレキシブル基板２１が透明基板１２の透明電極１７上に実装するいわゆるＦＯＧ（film on glass）実装が行われる。このときも、加熱押圧ヘッド３０による熱加圧工程の後、加熱を停止し、適宜冷却を行いながら押圧を続行し、紫外線照射を行う。また、紫外線照射器３１は、段階的に照射量を上昇させてもよい。   After the electronic component 18 is connected to the transparent electrode 17 of the transparent substrate 12, so-called FOG (film on glass) mounting is performed in which the flexible substrate 21 is mounted on the transparent electrode 17 of the transparent substrate 12 in the same manner. Also at this time, after the heating and pressing step by the heating and pressing head 30, heating is stopped, pressing is continued while appropriately cooling, and ultraviolet irradiation is performed. Further, the ultraviolet irradiator 31 may increase the irradiation amount in stages.

これにより、異方性導電フィルム１を介して透明基板１２と電子部品１８やフレキシブル基板２１とが接続された接続体を製造することができる。なお、これらＣＯＧ実装とＦＯＧ実装は、同時に行ってもよい。   Thereby, the connection body by which the transparent substrate 12, the electronic component 18, and the flexible substrate 21 were connected via the anisotropic conductive film 1 can be manufactured. Note that these COG mounting and FOG mounting may be performed simultaneously.

以上、液晶駆動用ＩＣを直接液晶表示パネルのガラス基板上に実装するＣＯＧ実装、及びフレキシブル基板を直接液晶表示パネルの基板上に実装するＦＯＧ実装を例に説明したが、本技術は、ＣＯＧ実装、ＦＯＧ実装以外のその他の各種接続に用いることができる。   As described above, the COG mounting in which the liquid crystal driving IC is directly mounted on the glass substrate of the liquid crystal display panel and the FOG mounting in which the flexible substrate is directly mounted on the substrate of the liquid crystal display panel have been described as examples. It can be used for other various connections other than the FOG mounting.

［その他］
また、本技術は、上述した紫外線硬化型の導電性接着剤を用いる他、例えば赤外光等の他の波長の光線によって硬化する光硬化型の導電性接着剤を用いることもできる。 [Others]
In addition to using the above-described ultraviolet curable conductive adhesive, the present technology can also use a photocurable conductive adhesive that is cured by light of another wavelength such as infrared light.

上記では、導電性の接着剤としてフィルム形状を有する異方性導電フィルム１について説明したが、ペースト状であっても問題は無い。本願では、導電性粒子４を含有する異方性導電フィルム１等のフィルム状の導電性接着フィルムまたはペースト状の導電性接着ペーストを「接着剤」と定義する。   In the above, the anisotropic conductive film 1 having a film shape as the conductive adhesive has been described. In the present application, a film-like conductive adhesive film such as the anisotropic conductive film 1 containing the conductive particles 4 or a paste-like conductive adhesive paste is defined as “adhesive”.

次いで、本技術の実施例について説明する。本実施例は、加熱押圧ヘッドの加熱条件、冷却の有無、及び紫外線の照射条件を異ならせて製造した基板とＩＣチップとの各接続体サンプルについて、ＩＣチップと基板との接続状態を導通抵抗値（Ω）によって評価し、表示ムラを基板の反り量（μｍ）を測定することで代替評価した。   Next, examples of the present technology will be described. In this example, the connection state between the IC chip and the substrate is determined as the conductive resistance for each connection body sample of the substrate and the IC chip manufactured by changing the heating conditions of the heating and pressing head, the presence or absence of cooling, and the irradiation conditions of ultraviolet rays. Evaluation was made based on the value (Ω), and display unevenness was evaluated by measuring the amount of warpage (μm) of the substrate.

接続に用いる異方性導電フィルムは、導電性粒子含有層（ＡＣＦ層）と絶縁性接着剤層（ＮＣＦ層）との積層フィルムを用いた。ＡＣＦ層は、
フェノキシ樹脂（ＹＰ−７０：新日鐵化学株式会社製）；２０質量部
液状エポキシ樹脂（ＥＰ−８２８：三菱化学株式会社製）；３０質量部
固形エポキシ樹脂（ＹＤ０１４：）新日鐵化学株式会社製）；２０質量部
導電性粒子；（ＡＵＬ７０４：積水化学工業株式会社製）：３０質量部
カチオン系硬化剤（ＳＩ−６０Ｌ：三新化学工業株式会社製）；５質量部
を酢酸エチル、トルエンにて固形分５０％になるように混合溶液を作成し、この混合溶液を厚さ５０μｍのＰＥＴフィルム上に塗布し、７０℃オーブンにて５分間乾燥し、フィルム状に成形した。 As the anisotropic conductive film used for connection, a laminated film of a conductive particle-containing layer (ACF layer) and an insulating adhesive layer (NCF layer) was used. The ACF layer is
Phenoxy resin (YP-70: manufactured by Nippon Steel Chemical Co., Ltd.); 20 parts by mass liquid epoxy resin (EP-828: manufactured by Mitsubishi Chemical Corporation); 30 parts by mass solid epoxy resin (YD014 :) Nippon Steel Chemical Co., Ltd. 20 mass parts conductive particles; (AUL 704: manufactured by Sekisui Chemical Co., Ltd.): 30 mass parts cationic curing agent (SI-60L: manufactured by Sanshin Chemical Industry Co., Ltd.); 5 mass parts of ethyl acetate and toluene A mixed solution was prepared so as to have a solid content of 50%, and this mixed solution was applied onto a PET film having a thickness of 50 μm, dried in an oven at 70 ° C. for 5 minutes, and formed into a film.

ＮＣＦ層は、
フェノキシ樹脂（ＹＰ−７０：新日鐵化学株式会社製）；２０質量部
液状エポキシ樹脂（ＥＰ−８２８：三菱化学株式会社製）；３０質量部
固形エポキシ樹脂（ＹＤ０１４：）新日鐵化学株式会社製）；２０質量部
カチオン系硬化剤（ＳＩ−６０Ｌ：三新化学工業株式会社製）；５質量部
を酢酸エチル、トルエンにて固形分５０％になるように混合溶液を作成し、この混合溶液を厚さ５０μｍのＰＥＴフィルム上に塗布し、７０℃オーブンにて５分間乾燥し、フィルム状に成形した。 The NCF layer is
Phenoxy resin (YP-70: manufactured by Nippon Steel Chemical Co., Ltd.); 20 parts by mass liquid epoxy resin (EP-828: manufactured by Mitsubishi Chemical Corporation); 30 parts by mass solid epoxy resin (YD014 :) Nippon Steel Chemical Co., Ltd. 20 parts by mass cationic curing agent (SI-60L: manufactured by Sanshin Chemical Industry Co., Ltd.); 5 parts by mass with ethyl acetate and toluene to prepare a mixed solution, and this mixture The solution was coated on a 50 μm thick PET film, dried in a 70 ° C. oven for 5 minutes, and formed into a film.

これらＡＣＦ及びＮＣＦを、厚さ１８μｍとなるように調整して積層ラミネートすることにより、実施例及び比較例に用いる異方性導電フィルムを得た。   These ACF and NCF were adjusted to have a thickness of 18 μm and laminated and laminated to obtain anisotropic conductive films used in Examples and Comparative Examples.

評価素子として、
外形；１．８ｍｍ×２０ｍｍ
厚さ；０．５ｍｍ
の評価用ＩＣを用いた。 As an evaluation element,
Outline: 1.8mm x 20mm
Thickness: 0.5mm
IC for evaluation was used.

評価用ＩＣが接続される評価基材として、ガラス厚０．５ｍｍの金属配線が形成されたガラス基板を用いた。   As an evaluation base material to which the evaluation IC is connected, a glass substrate on which a metal wiring having a glass thickness of 0.5 mm was formed was used.

このガラス基板に上記異方性導電フィルムを介して評価用ＩＣを配置し、加熱押圧ヘッドによる熱加圧及び紫外線照射によって接続することにより、接続体サンプルを形成した。加熱押圧ヘッドの温度はいずれも１１０℃、押圧条件はいずれも６０ＭＰａ、５秒であり、加熱押圧ヘッドの熱加圧面には厚さ５０μｍのフッ素樹脂加工が施されている。紫外線照射は、加熱加圧開始から２秒経過後に始め、加熱加圧開始から５秒までの３秒間行い、いずれも積算光量は約２０００ｍＪとした。   An evaluation IC was placed on the glass substrate through the anisotropic conductive film, and connected by thermal pressing with a heating press head and ultraviolet irradiation to form a connected body sample. The temperature of the heating and pressing head is 110 ° C., the pressing conditions are both 60 MPa and 5 seconds, and the hot pressing surface of the heating and pressing head is processed with a fluororesin having a thickness of 50 μm. The ultraviolet irradiation was started after 2 seconds from the start of heating and pressurization, and was performed for 3 seconds from the start of heating and pressurization for 5 seconds, and the total amount of light was about 2000 mJ.

実施例１では、紫外線照射と同時に、加熱押圧ヘッドの温度調節コントロールを切断することにより加熱を停止した。また、加熱加圧開始から２〜３秒間、３〜４秒間、４〜５秒間に亘って、紫外線の照度は６６６ｍＷ／ｃｍ２と一定にした。 In Example 1, the heating was stopped by cutting the temperature control of the heating and pressing head simultaneously with the ultraviolet irradiation. Further, the illuminance of the ultraviolet rays was kept constant at 666 mW / cm 2 over 2 to 3 seconds, 3 to 4 seconds, and 4 to 5 seconds from the start of heating and pressing.

実施例２では、加熱押圧ヘッド３０による加熱を停止するとともに、冷却を行う以外は実施例１と同様の条件とした。冷却は、評価用ＩＣの側方から、直径０．４ｍｍのホースから０．５ＭＰａでエアーを噴射することにより行った。エアーの噴射は紫外線照射中続けた。   In Example 2, the heating conditions were the same as in Example 1 except that heating by the heating and pressing head 30 was stopped and cooling was performed. Cooling was performed by injecting air at 0.5 MPa from a hose having a diameter of 0.4 mm from the side of the evaluation IC. Air spraying continued during UV irradiation.

実施例３では、紫外線の照度を、加熱加圧開始から２〜３秒間は３００ｍＷ／ｃｍ２、３〜４秒間は５００ｍＷ／ｃｍ２、４〜５秒間は１２００ｍＷ／ｃｍ２と、徐々に増加させていった。このほかの条件は実施例２と同様である。 In Example 3, the illuminance of ultraviolet rays, 2-3 seconds from the heating and pressurizing start 300 mW / cm 2, 3-4 seconds 500 mW / cm 2, is 4-5 seconds and 1200 mW / cm 2, is increased gradually I went. The other conditions are the same as in Example 2.

実施例４では、紫外線の照度を、加熱加圧開始から２〜３秒間は１００ｍＷ／ｃｍ２、３〜４秒間は２００ｍＷ／ｃｍ２、４〜５秒間は１７００ｍＷ／ｃｍ２と、紫外線照射初期では照度を低く抑え、最後の１秒で照度を大きくした。このほかの条件は実施例２と同様である。 In Example 4, the illuminance of ultraviolet rays, 2-3 seconds from the heating and pressurizing start 100 mW / cm 2, 3-4 seconds 200 mW / cm 2, is 4-5 seconds and 1700mW / cm 2, the ultraviolet irradiation Initial The illuminance was kept low and increased in the last second. The other conditions are the same as in Example 2.

比較例では、紫外線照射中も、加熱押圧ヘッド３０による加熱を続行した。紫外線の照度は、実施例１と同様の条件とした。   In the comparative example, heating by the heating and pressing head 30 was continued during the ultraviolet irradiation. The illuminance of the ultraviolet rays was the same as in Example 1.

以上の条件で加熱押圧及び紫外線照射を行って、評価用ＩＣがガラス基板に接続された接続体サンプルを形成し、各サンプルについて、反り（μｍ）の大きさ、及び導通抵抗値（Ω）を測定した。   Under the above conditions, heat pressing and ultraviolet irradiation are performed to form a connected body sample in which the IC for evaluation is connected to the glass substrate. For each sample, the size of the warp (μm) and the conduction resistance value (Ω) are set. It was measured.

反りの測定方法は、触針式表面粗度計（ＳＥ−３Ｈ：株式会社小阪研究所製）を用いて、図４に示すように、接合体サンプルのガラス基板４０下面から触針４１をスキャンし、評価用ＩＣの接続後のガラス基板面の反り量（μｍ）を測定した。   As shown in FIG. 4, the warp measurement method is performed by scanning the stylus 41 from the lower surface of the glass substrate 40 of the joined body sample using a stylus type surface roughness meter (SE-3H: manufactured by Kosaka Laboratory Ltd.). Then, the warpage amount (μm) of the glass substrate surface after connection of the evaluation IC was measured.

導通抵抗値の測定は、図５に示すように、評価用ＩＣのバンプ４２と接続されたガラス基板４０の金属配線４３に電流計Ａ、電圧計Ｖを接続し、いわゆる４端子法にて電流１ｍＡを流したときの導通抵抗値を測定した。結果を表１に示す。   As shown in FIG. 5, the continuity resistance value is measured by connecting an ammeter A and a voltmeter V to the metal wiring 43 of the glass substrate 40 connected to the bumps 42 of the evaluation IC. The conduction resistance value when 1 mA was passed was measured. The results are shown in Table 1.

Figure 0005836830
Figure 0005836830

表１に示すように、比較例においては、ガラス基板の反りが１５μｍであったのに対して、実施例１〜４においては、ガラス基板の反りが１２μｍ以下であった。また、実施例１では、ガラス基板の反りが１２μｍであったのに対して、実施例２〜４では８μｍであった。   As shown in Table 1, in the comparative example, the warp of the glass substrate was 15 μm, whereas in Examples 1 to 4, the warp of the glass substrate was 12 μm or less. In Example 1, the warpage of the glass substrate was 12 μm, whereas in Examples 2 to 4, it was 8 μm.

これは、図６に示すように、比較例では加熱押圧ヘッドの温度（約１１０℃）が維持されていたのに対し、実施例１〜４では、紫外線照射時に加熱を停止したことから、異方性導電フィルムの紫外線硬化時に温度が低下していき（実施例１：約１０５℃、実施例２〜４：約９５℃）、硬化後、常温まで温度が低下する際の温度差を小さく抑えることができたためである。また、紫外線照射時に加熱を停止した実施例１に対し、エアー噴射による冷却を行った実施例２〜４では、さらに基板の反りが抑えられた。これより、紫外線照射時に加熱を停止するとともに、冷却させることが有効であることが分かる。なお、図６では、異方性導電フィルムのバインダー温度に代えて加熱押圧ヘッドの温度を測定することにより、導電性粒子含有層の温度差による影響を考察した。   As shown in FIG. 6, the temperature of the heating and pressing head (about 110 ° C.) was maintained in the comparative example, whereas in Examples 1 to 4, the heating was stopped at the time of ultraviolet irradiation. When the anisotropic conductive film is cured with ultraviolet rays, the temperature is lowered (Example 1: about 105 ° C., Examples 2 to 4: about 95 ° C.), and the temperature difference when the temperature is lowered to room temperature after curing is kept small. Because it was possible. Moreover, in Example 2-4 which performed the cooling by air injection with respect to Example 1 which stopped heating at the time of ultraviolet irradiation, the curvature of the board | substrate was further suppressed. From this, it can be seen that it is effective to stop heating and cool down at the time of ultraviolet irradiation. In addition, in FIG. 6, it replaced with the binder temperature of the anisotropic conductive film, and considered the influence by the temperature difference of an electroconductive particle content layer by measuring the temperature of a heating press head.

また、冷却を併用する処理において、紫外線の照度を６６６ｍＷ／ｃｍ２と一定にした実施例２に対し、段階的に照度を上げた実施例３及び実施例４では、導通抵抗値が下がった。これにより、紫外線の照度を段階的に上昇させることが有効であることが分かる。さらに、実施例３及び実施例４より、紫外線の照度は、照射時間の最後に一気に上昇させて硬化させる方が導通抵抗値の上昇を抑える点で有効であった。 In addition, in the treatment using cooling together, in Example 3 and Example 4 in which the illuminance was increased stepwise, the conduction resistance value was lowered as compared with Example 2 in which the illuminance of ultraviolet rays was made constant at 666 mW / cm 2 . Thereby, it turns out that it is effective to raise the illumination intensity of an ultraviolet ray in steps. Furthermore, from Example 3 and Example 4, it was more effective to raise the illuminance of ultraviolet rays at a stroke at the end of the irradiation time and to cure the ultraviolet ray, thereby suppressing an increase in the conduction resistance value.

これは、図７に示すように、異方性導電フィルムの溶融粘度（Ｐａ・ｓ）と圧着時間（ｓｅｃ）との関係をみると、比較例では、紫外線照射を開始した直後（圧着開始後２秒）から溶融粘度が上昇するのに対し、実施例３では圧着開始後３秒まで溶融粘度が下がり続け、その後上昇し、実施例４では圧着開始後４秒まで溶融粘度が下がり続け、その後急激に上昇する。   As shown in FIG. 7, when the relationship between the melt viscosity (Pa · s) of the anisotropic conductive film and the pressure bonding time (sec) is seen, in the comparative example, immediately after the start of ultraviolet irradiation (after the pressure bonding starts) In Example 3, the melt viscosity continues to decrease until 3 seconds after the start of crimping, and then increases, and in Example 4, the melt viscosity continues to decrease until 4 seconds after the start of crimping. It rises rapidly.

このため、比較例では、溶融粘度が高く、導電性粒子がガラス基板と評価用ＩＣの両電極間に押し潰される作用が充分に奏する粘度Ｘまで下がる前に硬化に転じてしまい、導通抵抗が高くなる傾向がある。一方、実施例３では、硬化に転じるまでの時間が比較例に比してａの分長く、実施例４では、ａ＋ｂの分長い。その分、実施例３及び実施例４では、異方性導電フィルムの溶融粘度を導電性粒子が両電極間で押し潰されるに充分な粘度Ｘまで下げることができ、当該粘度で圧着させることができる。このため、実施例３及び実施例４では、導電性粒子を確実に両電極間で押し潰すことができ、この状態で硬化させることができるため、導通抵抗を低く抑えることができた。   For this reason, in the comparative example, the melt viscosity is high, and the conductive particles start to be cured before the viscosity is lowered to the viscosity X that sufficiently exerts the action of being crushed between both the glass substrate and the evaluation IC. Tend to be higher. On the other hand, in Example 3, the time until it starts to cure is longer by a as compared with the comparative example, and in Example 4, it is longer by a + b. Accordingly, in Example 3 and Example 4, the melt viscosity of the anisotropic conductive film can be lowered to a viscosity X sufficient for the conductive particles to be crushed between the two electrodes, and the adhesive can be pressure-bonded with the viscosity. it can. For this reason, in Example 3 and Example 4, since electroconductive particle can be reliably crushed between both electrodes and it can be made to harden | cure in this state, the conduction | electrical_connection resistance was able to be restrained low.

１ 異方性導電フィルム、２ 剥離フィルム、３ 導電性粒子含有層、４ 導電性粒子、１０ 液晶表示パネル、１１ 透明基板、１２ 透明基板、１３ シール、１４ 液晶、１５ パネル表示部、１６ 透明電極、１７ 透明電極、１７ａ 端子部、１８ 電子部品、２０ ＣＯＧ実装部、２１ フレキシブル基板、２２ ＦＯＧ実装部、２４ 配向膜、２５ 偏光板、２６ 偏光板、３０ 加熱押圧ヘッド、３１ 紫外線照射器、３２ ホース DESCRIPTION OF SYMBOLS 1 Anisotropic conductive film, 2 Release film, 3 Conductive particle content layer, 4 Conductive particle, 10 Liquid crystal display panel, 11 Transparent substrate, 12 Transparent substrate, 13 Seal, 14 Liquid crystal, 15 Panel display part, 16 Transparent electrode , 17 Transparent electrode, 17a terminal part, 18 electronic component, 20 COG mounting part, 21 flexible substrate, 22 FOG mounting part, 24 alignment film, 25 polarizing plate, 26 polarizing plate, 30 heating press head, 31 UV irradiator, 32 hose

Claims (4)

導電性粒子を含有する光硬化型の接着剤を介して、基板上に電子部品を配置する工程と、
上記電子部品の上から加熱するとともに加圧する工程と、
加熱を停止し、加圧を続行する工程と、
加圧を続行しながら、上記接着剤に光を段階的又は連続的に照度が増加するように照射して硬化させる工程とを有する、上記基板上に上記電子部品が接続された接続体の製造方法。 A step of arranging electronic components on a substrate via a photo-curing adhesive containing conductive particles;
Heating and pressing from above the electronic component;
Stopping heating and continuing pressurization;
A step of irradiating the adhesive with light so as to increase the illuminance stepwise or continuously while continuing to pressurize, and curing the connection body, wherein the electronic component is connected to the substrate. Method. 上記加熱を停止するとともに、冷却も行う請求項１に記載の接続体の製造方法。 The method for manufacturing a connection body according to claim 1, wherein the heating is stopped and the cooling is also performed. 上記光は紫外線である請求項１又は２に記載の接続体の製造方法。 The optical manufacturing method of the connecting body according to claim 1 or 2 is ultraviolet. 導電性粒子を含有する光硬化型の接着剤を介して、基板上に電子部品を配置する工程と、
上記電子部品の上から加熱するとともに加圧する工程と、
加熱を停止し、加圧を続行する工程と、
加圧を続行しながら、上記接着剤に光を段階的又は連続的に照度が増加するように照射して硬化させる工程とを有する、上記基板上に上記電子部品を接続する接続方法。 A step of arranging electronic components on a substrate via a photo-curing adhesive containing conductive particles;
Heating and pressing from above the electronic component;
Stopping heating and continuing pressurization;
And a step of irradiating the adhesive with light so as to increase the illuminance stepwise or continuously while continuing to pressurize, and curing the connection.
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