JP5782460B2 - 材料除去及びパターン転写の方法及びシステム - Google Patents
材料除去及びパターン転写の方法及びシステム Download PDFInfo
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- JP5782460B2 JP5782460B2 JP2012551279A JP2012551279A JP5782460B2 JP 5782460 B2 JP5782460 B2 JP 5782460B2 JP 2012551279 A JP2012551279 A JP 2012551279A JP 2012551279 A JP2012551279 A JP 2012551279A JP 5782460 B2 JP5782460 B2 JP 5782460B2
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
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- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
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- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
本出願は、2010年1月27日に出願された米国特許出願第61/298,734号、2010年1月28日に出願された米国特許出願第61/299,097号、及び2011年1月26日に出願された米国特許出願第13/014,508号の優先権を主張するものであり、これらの特許出願は引用により全体が本明細書に組み込まれる。
68b リザーバ
66 サブシステムコントローラ
70 サブシステムコントローラ
12 基板
72 基板ハンドラー
76 サブシステムコントローラ
Claims (14)
- 基板上の固化重合性材料を除去する方法であって、
(a)基板の少なくとも一部の上にパターンの特徴と残留層を有するパターン化層を形成するステップであって、前記パターンの特徴と前記残留層とは前記固化重合性材料から構成される、ステップと、
(b)真空紫外(VUV)放射線源を提供するステップと、
(c)前記残留層を有する前記基板の少なくとも一部が前記真空紫外(VUV)放射線源と位置合わせされるように前記基板を位置決めするステップと、
(d)前記基板の少なくとも一部と前記真空紫外(VUV)放射線源との間に酸素が21%未満のガス組成物を提供するステップと、
(e)前記ガス組成物の存在下で、前記基板を前記真空紫外(VUV)放射線で照射し、パターンの特徴の質を保つ間前記基板の一部から前記残留層を除去するステップと、を含む方法。 - 前記真空紫外(VUV)放射線源が、露出アパーチャを有するチャンバ内に密閉され、前記基板の位置決めステップが、前記基板部分を前記露出アパーチャと位置合わせして位置決めするステップを更に含む、請求項1に記載の方法。
- 前記ガス組成物を前記チャンバに提供するステップを更に含む、請求項2に記載の方法。
- 前記真空紫外(VUV)放射線が140〜190nmの波長で提供される、請求項1〜3のいずれかに記載の方法。
- 前記真空紫外(VUV)放射線が、ピーク強度が約172nmでスペクトルバンド幅が約15nmFWHMで提供される、請求項1〜3のいずれかに記載の方法。
- 前記提供されるガス組成物が10%未満の酸素を含有する、請求項1〜5のいずれかに記載の方法。
- 前記提供されるガス組成物が5%未満の酸素を含有する、請求項1〜5のいずれかに記載の方法。
- 前記提供されるガス組成物は2%未満の酸素の窒素濃縮環境を含む、請求項1〜5のいずれかに記載の方法。
- ハードマスク層又は基板上にパターンを転写する方法であって、
(a)前記ハードマスク上に形成される前記パターンの基板上にハードマスクを形成するステップと、
(b)バッチ処理ステップを用いて前記パターンを前記ハードマスクに転写し、前記ハードマスクの一部分を除去するステップと、を含む請求項1〜8のいずれかに記載の方法。 - 前記バッチ処理ステップがフッ化水素酸を用いる、請求項9に記載の方法。
- 前記パターン化層を除去するステップを更に含む、請求項9または10に記載の方法。
- バッチ処理ステップを用いて前記パターンを前記基板に転写し、前記基板の一部を除去するステップを更に含む、請求項11に記載の方法。
- 前記バッチ処理ステップが、前記基板を選択的にエッチングする、請求項12に記載の方法。
- 前記基板がケイ素であり、前記ハードマスクが酸化ケイ素であり、前記バッチ処理ステップにおいて水酸化カリウムが使用される、請求項13に記載の方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29873410P | 2010-01-27 | 2010-01-27 | |
US61/298,734 | 2010-01-27 | ||
US29909710P | 2010-01-28 | 2010-01-28 | |
US61/299,097 | 2010-01-28 | ||
US13/014,508 US8980751B2 (en) | 2010-01-27 | 2011-01-26 | Methods and systems of material removal and pattern transfer |
US13/014,508 | 2011-01-26 | ||
PCT/US2011/022679 WO2011094383A2 (en) | 2010-01-27 | 2011-01-27 | Methods and systems of material removal and pattern transfer |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013518446A JP2013518446A (ja) | 2013-05-20 |
JP2013518446A5 JP2013518446A5 (ja) | 2014-02-20 |
JP5782460B2 true JP5782460B2 (ja) | 2015-09-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012551279A Active JP5782460B2 (ja) | 2010-01-27 | 2011-01-27 | 材料除去及びパターン転写の方法及びシステム |
Country Status (7)
Country | Link |
---|---|
US (1) | US8980751B2 (ja) |
JP (1) | JP5782460B2 (ja) |
KR (1) | KR101947524B1 (ja) |
CN (1) | CN102859436B (ja) |
SG (1) | SG181560A1 (ja) |
TW (1) | TWI551386B (ja) |
WO (1) | WO2011094383A2 (ja) |
Families Citing this family (5)
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US20110048518A1 (en) * | 2009-08-26 | 2011-03-03 | Molecular Imprints, Inc. | Nanostructured thin film inorganic solar cells |
WO2011143327A2 (en) | 2010-05-11 | 2011-11-17 | Molecular Imprints, Inc. | Nanostructured solar cell |
JP5634313B2 (ja) * | 2011-03-29 | 2014-12-03 | 富士フイルム株式会社 | レジストパターン形成方法およびそれを用いたパターン化基板の製造方法 |
US9616614B2 (en) | 2012-02-22 | 2017-04-11 | Canon Nanotechnologies, Inc. | Large area imprint lithography |
WO2018027069A1 (en) * | 2016-08-03 | 2018-02-08 | Board Of Regents, The University Of Texas System | Roll-to-roll programmable film imprint lithography |
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JP2003337432A (ja) | 2002-05-20 | 2003-11-28 | Tsukuba Semi Technology:Kk | 機能水を使ったレジスト除去方法、およびその装置 |
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2011
- 2011-01-26 US US13/014,508 patent/US8980751B2/en active Active
- 2011-01-27 CN CN201180007625.5A patent/CN102859436B/zh active Active
- 2011-01-27 SG SG2012041901A patent/SG181560A1/en unknown
- 2011-01-27 WO PCT/US2011/022679 patent/WO2011094383A2/en active Application Filing
- 2011-01-27 JP JP2012551279A patent/JP5782460B2/ja active Active
- 2011-01-27 TW TW100103075A patent/TWI551386B/zh active
- 2011-01-27 KR KR1020127021126A patent/KR101947524B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101947524B1 (ko) | 2019-02-13 |
WO2011094383A3 (en) | 2011-09-29 |
CN102859436B (zh) | 2015-07-15 |
SG181560A1 (en) | 2012-07-30 |
JP2013518446A (ja) | 2013-05-20 |
WO2011094383A2 (en) | 2011-08-04 |
US8980751B2 (en) | 2015-03-17 |
CN102859436A (zh) | 2013-01-02 |
KR20120125297A (ko) | 2012-11-14 |
US20110183521A1 (en) | 2011-07-28 |
TW201139032A (en) | 2011-11-16 |
TWI551386B (zh) | 2016-10-01 |
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