JP5750589B2 - Loudspeaker - Google Patents

Loudspeaker Download PDF

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JP5750589B2
JP5750589B2 JP2010282094A JP2010282094A JP5750589B2 JP 5750589 B2 JP5750589 B2 JP 5750589B2 JP 2010282094 A JP2010282094 A JP 2010282094A JP 2010282094 A JP2010282094 A JP 2010282094A JP 5750589 B2 JP5750589 B2 JP 5750589B2
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speaker
circuit board
housing
frequency
panel
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JP2012129941A (en
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恵一 ▲吉▼田
恵一 ▲吉▼田
吉川　啓介
啓介 吉川
哲平 鷲
哲平 鷲
克彦 木村
克彦 木村
前田　一成
一成 前田
守雄 中村
守雄 中村
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Panasonic Intellectual Property Management Co Ltd
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  • Interconnected Communication Systems, Intercoms, And Interphones (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
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Description

本発明は、インターホンシステムなどに用いられる拡声通話装置に関する。   The present invention relates to a loudspeaker device used in an interphone system or the like.

スピーカおよびマイクロホンを備えた拡声通話装置では、拡声通話装置の筐体の前方において、所定の音質および音量を確保する必要がある。しかしながら、スピーカの前方への放射音とスピーカの後方への放射音とが逆位相の関係にあるため、双方の放射音がスピーカの周辺で干渉して打ち消される虞がある。そのために一般的な拡声通話装置では、スピーカをねじで筐体に固定することにより、筐体を仕切り箱(エンクロージャ)とし、スピーカの前気室と後気室を分離して放射音が打ち消し合うことを防いでいる。   In a loudspeaker having a speaker and a microphone, it is necessary to ensure a predetermined sound quality and volume in front of the housing of the loudspeaker. However, since the sound radiated to the front of the speaker and the sound radiated to the rear of the speaker are in an opposite phase relationship, both radiated sounds may interfere with each other around the speaker and cancel out. Therefore, in a general loudspeaker, the speaker is fixed to the housing with a screw, so that the housing becomes a partition box (enclosure), and the radiated sound cancels out by separating the front air chamber and the rear air chamber of the speaker. It prevents that.

上記のような構造において、後気室が密閉形で容量が極端に小さい場合、空気のスティフネス分によって振動板の動きが抑えられるため、スピーカ前方への放射音圧が低下する。さらには、スピーカシステム(スピーカ＋筐体)の最低共振周波数focはスピーカの最低共振周波数foよりも高くなり、低音域の再生帯域が制限されることになる。そのために従来の拡声通話装置においては、スピーカの背面に回路基板が配置される場合、十分な容積の後気室を確保するために回路基板に貫通孔が設けられていた(例えば、特許文献１参照)。   In the structure as described above, when the rear air chamber is sealed and the capacity is extremely small, the movement of the diaphragm is suppressed by the amount of air stiffness, so that the radiated sound pressure to the front of the speaker is reduced. Furthermore, the lowest resonance frequency foc of the speaker system (speaker + housing) is higher than the lowest resonance frequency fo of the speaker, and the reproduction band in the low sound range is limited. Therefore, in the conventional loudspeaker device, when the circuit board is disposed on the back surface of the speaker, a through hole is provided in the circuit board in order to secure a sufficient rear air chamber (for example, Patent Document 1). reference).

しかしながら、エンクロージャ内部において、回路基板の貫通孔によるスピーカ後方の放射音の回折効果により、エンクロージャ内部に音場の乱れが発生する虞がある。さらに、拡声通話装置の筐体の奥行き寸法とスピーカの放射音の波長がほぼ一致してしまうために、スピーカ後方への放射音と筐体後面での１次反射音が合成されて定常波(共鳴・共振現象)が発生し、特定の周波数成分およびその周辺成分が筐体前方に放射されなくなり、拡声通話装置に必要な音質および音量を損ねてしまうという問題があった。   However, the sound field may be disturbed inside the enclosure due to the diffraction effect of the radiated sound behind the speaker due to the through hole in the circuit board. Furthermore, since the depth dimension of the housing of the loudspeaker device and the wavelength of the sound emitted from the speaker are almost the same, the sound emitted from the rear of the speaker and the primary reflected sound from the rear surface of the housing are combined to generate a standing wave (resonance). (Resonance phenomenon) occurs, and a specific frequency component and its peripheral components are not radiated to the front of the housing, which impairs the sound quality and sound volume required for the loudspeaker.

一方、本出願人は、一端が閉塞し他端が開口した音響管を後気室内に設けることにより、後気室の容量が極端に小さくても最低共振周波数focの低下を抑えることができるとともに、筐体内部の音場の乱れや定常波の影響を受け難い、薄型かつ小型の拡声通話装置を提案している(特許文献２参照)。   On the other hand, the present applicant can suppress a decrease in the minimum resonance frequency foc even if the capacity of the rear air chamber is extremely small by providing an acoustic tube having one end closed and the other end opened in the rear air chamber. Have proposed a thin and small loudspeaker device that is not easily affected by the disturbance of the sound field inside the housing or the standing wave (see Patent Document 2).

特許第３９５３３７５号公報Japanese Patent No. 3953375 特許第３９７６０７９号公報Japanese Patent No. 3976079

特許文献１記載の従来例では、後面が開口した箱形の前部筐体に、平板状の絶縁薄板が後方からねじ止めされて筐体が組み立てられるとともに、前部筐体と絶縁薄板を固定するねじによって回路基板が前部筐体に固定されるようになっている。したがって、前部筐体と絶縁薄板が簡単に分離できない構造であるため、配線作業が非常に行い難いという問題があった。   In the conventional example described in Patent Document 1, a flat insulating sheet is screwed from behind to a box-shaped front casing having an open rear surface, and the casing is assembled, and the front casing and the insulating thin plate are fixed. The circuit board is fixed to the front housing by the screw to be used. Therefore, since the front housing and the insulating thin plate cannot be easily separated, there is a problem that wiring work is very difficult.

また、特許文献２記載の従来例では、スピーカが専用のハウジングで囲まれているため、ハウジングの厚みが邪魔をしてスピーカの後方に回路基板が設置できない場合がある。そして、スピーカの後方に回路基板が設置できない場合、回路基板を収納するために別のハウジングが必要になったり、スピーカを収納するハウジングを大型化して回路基板を収納しなければならないためにコストアップや大型化を招くという問題があった。   In the conventional example described in Patent Document 2, since the speaker is surrounded by a dedicated housing, the thickness of the housing interferes with the circuit board in some cases. If the circuit board cannot be installed behind the speaker, a separate housing is required to store the circuit board, or the housing for storing the speaker must be enlarged to store the circuit board. There was a problem of incurring large size.

本発明は、上記課題に鑑みて為されたものであり、低コスト且つ省施工でありながら高音質及び高音量が得られる拡声通話装置を提供することを目的とする。   The present invention has been made in view of the above problems, and an object thereof is to provide a loudspeaker device capable of obtaining high sound quality and high sound volume while being low-cost and saving construction.

本発明の拡声通話装置は、前面が開口する箱形の筐体ベースと当該筐体ベースの前面開口を閉塞する筐体パネルとからなる筐体内にスピーカ及び回路基板が収納され、当該回路基板が前記筐体パネルの背面に固定され、前記筐体ベースの側壁と前記筐体パネルと前記回路基板で後気室が前記スピーカの後方に形成され、前記筐体パネルは、前方から前記筐体ベース前面に着脱自在に取り付けられることを特徴とする。 The loudspeaker device according to the present invention includes a speaker and a circuit board housed in a housing composed of a box-shaped housing base whose front surface is open and a housing panel which closes the front opening of the housing base. A rear air chamber is formed behind the speaker by a side wall of the casing base, the casing panel, and the circuit board , and is fixed to the rear surface of the casing panel. It is characterized by being detachably attached to the front surface.

この拡声通話装置において、前記スピーカの高域共振周波数を補正するためのフィルタが前記回路基板に実装されることが好ましい。   In this loudspeaker device, it is preferable that a filter for correcting a high frequency resonance frequency of the speaker is mounted on the circuit board.

この拡声通話装置において、前記スピーカの低域共振周波数を補正するためのフィルタが前記回路基板に実装されることが好ましい。   In this loudspeaker device, it is preferable that a filter for correcting a low-frequency resonance frequency of the speaker is mounted on the circuit board.

この拡声通話装置において、前記スピーカと前記筐体からなるスピーカシステムの最低共振周波数以下の周波数帯域を補正する補正回路が前記回路基板に実装されることが好ましい。   In this loudspeaker, it is preferable that a correction circuit for correcting a frequency band equal to or lower than the lowest resonance frequency of a speaker system including the speaker and the housing is mounted on the circuit board.

この拡声通話装置において、信号処理によって欠落した音声信号の高域成分を補完する補完回路が前記回路基板に実装されることが好ましい。   In this loudspeaker apparatus, it is preferable that a complementary circuit that complements a high frequency component of the voice signal that is lost by signal processing is mounted on the circuit board.

本発明の拡声通話装置は、低コスト且つ省施工でありながら高音質及び高音量が得られるという効果がある。   The loudspeaker apparatus according to the present invention has an effect that high sound quality and high sound volume can be obtained while being low-cost and saving construction.

実施形態の拡声通話装置を示し、(ａ)は正面図、(ｂ)は同図(ａ)の分解断面図、(ｃ)は同図(ａ)のＡ−Ａ線断面矢視図である。1 shows a loudspeaker device according to an embodiment, where (a) is a front view, (b) is an exploded sectional view of FIG. (A), and (c) is a sectional view taken along line AA of FIG. . 同上における筐体パネル及び回路基板の背面図である。It is a rear view of a housing panel and a circuit board in the same as the above. 同上における筐体ベースを示し、(ａ)は正面図、(ｂ)は同図(ａ)のＡ−Ａ線断面矢視図、(ｃ)は背面図である。The housing | casing base in the same as the above is shown, (a) is a front view, (b) is a cross-sectional view taken along the line AA of (a), and (c) is a rear view. 同上の一部省略したブロック図である。It is a block diagram with a part omitted. 同上の周波数特性を説明するための説明図である。It is explanatory drawing for demonstrating the frequency characteristic same as the above. 同上におけるフィルタの周波数特性を説明するための説明図である。It is explanatory drawing for demonstrating the frequency characteristic of the filter in the same as the above. 同上の補完された周波数特性を説明するための説明図である。It is explanatory drawing for demonstrating the frequency characteristic supplemented same as the above.

以下、集合住宅用インターホンシステムにおいて集合住宅の共用玄関に設置される拡声通話装置(ロビーインターホン)に本発明の技術思想を適用した実施形態について説明する。但し、本発明の技術思想が適用可能な拡声通話装置はロビーインターホンに限定されるものではない。   Hereinafter, an embodiment in which the technical idea of the present invention is applied to a loudspeaker communication apparatus (lobby interphone) installed at a common entrance of an apartment house in an apartment phone intercom system will be described. However, the voice communication device to which the technical idea of the present invention can be applied is not limited to the lobby intercom.

本実施形態の拡声通話装置は、図１に示すように筐体ベース２と筐体パネル３からなる箱形の筐体１内にスピーカ４やマイクロホン５、液晶ディスプレイ７、回路基板６などが収納されて構成される。   As shown in FIG. 1, the loudspeaker according to the present embodiment accommodates a speaker 4, a microphone 5, a liquid crystal display 7, a circuit board 6 and the like in a box-shaped casing 1 composed of a casing base 2 and a casing panel 3. Configured.

筐体ベース２は、前面が開口する矩形箱形の合成樹脂成形体からなり、図３に示すように前端部分には外側に突出するフランジ部20が全周に渡って形成されている。そして、筐体ベース２は、壁などの造営材に設けられる取付孔(図示せず)に、フランジ部20よりも後方の部位が埋め込まれるようにして設置される。なお、図示は省略するが、筐体ベース２内には回路基板６とは別の回路基板が収納される。この回路基板は、音声信号や制御信号の伝送処理及び信号処理などを行う回路が実装されており、筐体ベース２内に設けられる端子台(図示せず)を介して外部の伝送線や給電線と接続される。   The housing base 2 is formed of a rectangular box-shaped synthetic resin molded body having an open front surface. As shown in FIG. 3, a flange portion 20 protruding outward is formed on the entire front end portion. The housing base 2 is installed such that a portion behind the flange portion 20 is embedded in an attachment hole (not shown) provided in a construction material such as a wall. Although not shown, a circuit board different from the circuit board 6 is accommodated in the housing base 2. This circuit board is mounted with a circuit that performs transmission processing and signal processing of audio signals and control signals, and is connected to an external transmission line or supply via a terminal block (not shown) provided in the housing base 2. Connected with electric wires.

筐体パネル３は、矩形平板状の合成樹脂成形体からなり、前方からフランジ部20に固定されることで筐体ベース２の前面開口を塞ぐものである。すなわち、筐体ベース２が取付孔に埋込設置され、上述した端子台に伝送線や給電線が接続される配線作業が完了した後、筐体ベース２の前面開口が筐体パネル３によって閉塞されるので、特許文献１記載の従来例と比較して配線作業の作業性が向上(省施工化)している。なお、図示は省略するが、筐体パネル３とフランジ部20とはねじ止めや嵌合、係合などの着脱可能な周知の構造で固定される。   The housing panel 3 is made of a synthetic resin molded body having a rectangular flat plate shape, and closes the front opening of the housing base 2 by being fixed to the flange portion 20 from the front. That is, the housing base 2 is embedded in the mounting hole, and after the wiring work for connecting the transmission line and the feeder to the terminal block is completed, the front opening of the housing base 2 is closed by the housing panel 3. Therefore, the workability of the wiring work is improved (saving work) as compared with the conventional example described in Patent Document 1. In addition, although illustration is abbreviate | omitted, the housing | casing panel 3 and the flange part 20 are fixed by the detachable well-known structure, such as screwing, fitting, and engagement.

筐体パネル３の背面にスピーカ４、マイクロホン５、液晶ディスプレイ７、回路基板６が取り付けられる。回路基板６は、図２に示すように長方形型のプリント配線板に、図４に示す信号処理回路10、D/A変換器11、A/D変換器12、スピーカアンプ13、マイクロホンアンプ14などが実装されて構成されている。また、回路基板６は下側の左右両端にねじ挿通孔(図示せず)が形成されている。一方、筐体パネル３の背面側には左右一対のボス30が突設されており、ねじ挿通孔に挿通された固定ねじ８がボス30に締め付けられることで回路基板６が筐体パネル３の背面側に固定される(図１及び図２参照)。さらに、筐体パネル３背面の上部には鈎形の係止片31が突設されており、回路基板６の上部に係止片31が係止される。   A speaker 4, a microphone 5, a liquid crystal display 7, and a circuit board 6 are attached to the back surface of the housing panel 3. The circuit board 6 is formed on a rectangular printed wiring board as shown in FIG. 2, the signal processing circuit 10, the D / A converter 11, the A / D converter 12, the speaker amplifier 13, the microphone amplifier 14 and the like shown in FIG. Is implemented and configured. Further, the circuit board 6 has screw insertion holes (not shown) formed at the left and right ends thereof. On the other hand, a pair of left and right bosses 30 project from the rear side of the housing panel 3, and the circuit board 6 is attached to the housing panel 3 by fastening the fixing screws 8 inserted through the screw insertion holes to the boss 30. It is fixed to the back side (see FIGS. 1 and 2). Further, a hook-shaped locking piece 31 projects from the upper part of the rear surface of the housing panel 3, and the locking piece 31 is locked to the upper part of the circuit board 6.

マイクロホン５は筐体パネル３の背面に取り付けられ、回路基板６に実装されているマイクロホンアンプ15と電線(図示せず)で接続されている。なお、筐体パネル３にはマイクロホン５の取付位置に円形のマイク用孔32が設けられている。また、液晶ディスプレイ７も筐体パネル３の背面中央に取り付けられ、回路基板６に実装されている液晶駆動回路(図示せず)とケーブル(図示せず)で接続されている。なお、筐体パネル３の中央部分には矩形の窓孔33が開口しており、液晶ディスプレイ７の前面(表示面)が窓孔33を通して筐体パネル３の前面側に露出する。   The microphone 5 is attached to the back surface of the housing panel 3 and connected to a microphone amplifier 15 mounted on the circuit board 6 by an electric wire (not shown). The casing panel 3 is provided with a circular microphone hole 32 at the mounting position of the microphone 5. The liquid crystal display 7 is also attached to the center of the back surface of the housing panel 3 and is connected to a liquid crystal driving circuit (not shown) mounted on the circuit board 6 by a cable (not shown). In addition, a rectangular window hole 33 is opened in the central portion of the housing panel 3, and the front surface (display surface) of the liquid crystal display 7 is exposed to the front surface side of the housing panel 3 through the window hole 33.

スピーカ４は厚みが数ミリメートルの圧電スピーカからなり、筐体パネル３の背面に取り付けられる。スピーカ４の背面には弾性材料からなるスピーカ押さえ９が配置されている。このスピーカ押さえ９は、圧縮された状態でスピーカ４と回路基板６との間に介装されており、その復元力(弾性力)によってスピーカ４を筐体パネル３の背面に押し付けている(図１(ｃ)参照)。なお、筐体パネル３にはスピーカ４の放射音を前方へ放射するための多数のスピーカ用孔34が形成されている(図１(ａ)参照)。   The speaker 4 is a piezoelectric speaker having a thickness of several millimeters, and is attached to the back surface of the housing panel 3. A speaker retainer 9 made of an elastic material is disposed on the back surface of the speaker 4. The speaker holder 9 is interposed between the speaker 4 and the circuit board 6 in a compressed state, and presses the speaker 4 against the back surface of the housing panel 3 by its restoring force (elastic force) (see FIG. 1 (c)). The housing panel 3 is formed with a large number of speaker holes 34 for radiating the sound emitted from the speaker 4 forward (see FIG. 1A).

筐体ベース２と筐体パネル３が結合されて筐体１が組み立てられると、図１(ｃ)に示すように筐体ベース２の左右両側の側壁と筐体パネル３と回路基板６で固まれた後気室Ｓがスピーカ４の後方に形成される。ここで、スピーカ４の前面と筐体パネル３の背面との間には、スピーカ押さえ９によってスピーカ４の前面が筐体パネル３の背面と密着しているために殆ど隙間が生じず、後気室Ｓが密閉されることになる。したがって、密閉された後気室Ｓがスピーカ４の後方に形成されているため、スピーカ４の前方への放射音と、当該放射音と逆位相であるスピーカ４の後方への放射音との干渉を抑制することができる。しかも、後気室Ｓを形成する回路基板６には、特許文献１記載の従来例のような貫通孔が設けられていないので、当該貫通孔の回折効果によって後気室Ｓ内の音場に乱れが発生することがない。   When the housing 1 is assembled by combining the housing base 2 and the housing panel 3, the left and right side walls of the housing base 2, the housing panel 3, and the circuit board 6 are fixed as shown in FIG. A rear air chamber S is formed behind the speaker 4. Here, there is almost no gap between the front surface of the speaker 4 and the back surface of the housing panel 3 because the front surface of the speaker 4 is in close contact with the back surface of the housing panel 3 by the speaker presser 9. Chamber S will be sealed. Therefore, since the sealed rear air chamber S is formed behind the speaker 4, the interference between the sound emitted forward of the speaker 4 and the sound emitted backward of the speaker 4 having a phase opposite to that of the sound emitted. Can be suppressed. Moreover, since the circuit board 6 that forms the rear air chamber S is not provided with a through hole as in the conventional example described in Patent Document 1, the sound field in the rear air chamber S is generated by the diffraction effect of the through hole. Disturbance does not occur.

また、本実施形態における後気室Ｓは、前後方向の奥行き寸法(図１(ｃ)における左右方向の幅寸法)ｄが10ミリメートル以下である。したがって、スピーカ４から後気室Ｓ内に放射される音波と、回路基板６で１次反射する音波とが合成されて定常波が生じた場合、その定常波の周波数が、一般的な音声の周波数帯域よりも高い周波数(17キロヘルツ以上)となる。故に、特定の周波数成分およびその周辺成分が筐体１の前方に放射されなくなって音質および音量を損ねてしまう虞は無い。さらに、後気室Ｓは奥行き寸法が10ミリメートル以下であるが、縦横の寸法が筐体パネル３と同程度の寸法であるから、拡声通話装置に必要とされる高音質且つ高音量の音声の放射に必要充分な容積が確保できる。   Further, the rear air chamber S in this embodiment has a depth dimension in the front-rear direction (width dimension in the left-right direction in FIG. 1C) d of 10 millimeters or less. Therefore, when a sound wave radiated from the speaker 4 into the rear air chamber S and a sound wave primarily reflected by the circuit board 6 are combined to generate a standing wave, the frequency of the standing wave is a general sound frequency band. Higher frequency (above 17 kHz). Therefore, there is no possibility that the specific frequency component and its peripheral components are not radiated to the front of the housing 1 to deteriorate the sound quality and the sound volume. Further, the rear air chamber S has a depth dimension of 10 mm or less, but the vertical and horizontal dimensions are the same as those of the housing panel 3, so that the high sound quality and high volume sound required for the loudspeaker apparatus can be obtained. A sufficient volume necessary for radiation can be secured.

また、後気室Ｓが筐体１と回路基板６のみで形成されるため、特許文献２記載の従来例のように後気室の形成だけを目的とした専用の構造が不要となって低コスト化を図ることができる。   In addition, since the rear air chamber S is formed by only the housing 1 and the circuit board 6, a dedicated structure only for the purpose of forming the rear air chamber is not required as in the conventional example described in Patent Document 2, and the lower air chamber S is low. Cost can be reduced.

ところで、本実施形態の拡声通話装置では、高音質化を図るためにスピーカ４から放射される通話音声の周波数特性を補正している。ここで、通話音声の低域又は高域の何れか一方のみが強調された場合、人によっては違和感や不快感を感じることがある。したがって、違和感や不快感を感じる人をできるだけ少なくするためには、低域から高域に渡って平坦(フラット)な周波数特性であることが望ましいと考えられる。   By the way, in the loudspeaker device according to the present embodiment, the frequency characteristic of the call voice radiated from the speaker 4 is corrected in order to improve the sound quality. Here, when only one of the low frequency and high frequency of the call voice is emphasized, some people may feel uncomfortable or uncomfortable. Therefore, in order to reduce the number of people who feel uncomfortable or uncomfortable as much as possible, it is desirable that the frequency characteristics be flat (flat) from low to high.

図５における実線Ｙは、筐体１とスピーカ４からなるスピーカシステムの周波数特性を示し、同図における実線Ｘは、スピーカ４の高域共振周波数fh及び低域共振周波数(最低共振周波数foc)を信号処理回路10で補正した後の周波数特性を示している。つまり、実線Ｙの周波数特性(補正前の周波数特性)に比べて、実線Ｘの周波数特性(補正後の周波数特性)が平坦化されている。   A solid line Y in FIG. 5 indicates the frequency characteristics of the speaker system including the housing 1 and the speaker 4, and a solid line X in FIG. 5 indicates the high frequency resonance frequency fh and low frequency resonance frequency (minimum resonance frequency foc) of the speaker 4. The frequency characteristics after correction by the signal processing circuit 10 are shown. That is, compared with the frequency characteristic of the solid line Y (frequency characteristic before correction), the frequency characteristic of the solid line X (frequency characteristic after correction) is flattened.

ここで、信号処理回路10には図６に実線で示す周波数特性を有するフィルタが搭載されている。つまり、相手側の通話装置(例えば、集合住宅の各住戸に設置された住戸機)から伝送されてくる音声(受話音声)が前記フィルタでフィルタリングされることにより、受話音声の周波数特性が図５の実線Ｘで示す周波数特性に補正される。信号処理回路10は、例えば、ディジタル・シグナル・プロセッサ(DSP)からなり、高域共振周波数fh及び最低共振周波数focを各別に含む狭い範囲で信号レベルを僅かに低下させる周波数特性(図６の実線参照)を有したフィルタをIIR型のディジタルフィルタで実現している。このようなディジタルフィルタは、従来周知である２次のバイカッド・フィルタが３個直列に接続された６次のフィルタとして形成可能である。   Here, the signal processing circuit 10 is equipped with a filter having frequency characteristics indicated by a solid line in FIG. That is, the frequency characteristic of the received voice is shown in FIG. 5 by filtering the voice (received voice) transmitted from the other party's call device (for example, a dwelling unit installed in each dwelling unit of the apartment house) with the filter. The frequency characteristics indicated by the solid line X are corrected. The signal processing circuit 10 is composed of, for example, a digital signal processor (DSP), and has a frequency characteristic (solid line in FIG. 6) that slightly lowers the signal level in a narrow range including the high-band resonance frequency fh and the minimum resonance frequency foc. The filter having the reference) is realized by an IIR type digital filter. Such a digital filter can be formed as a sixth-order filter in which three well-known second-order biquad filters are connected in series.

また、補正後の周波数特性において不足している低域(スピーカシステムの最低共振周波数foc以下の周波数帯域)については、信号処理回路10に搭載される補正回路で補正することが好ましい。本実施形態における補正回路は倍音発生器からなり、スピーカ４の放射音に含まれない低音(例えば、100ヘルツと200ヘルツの音)の倍音(例えば、300ヘルツ、400ヘルツ、500ヘルツなどの音)を生成してスピーカ４から放射させる。つまり、基本周波数(100ヘルツや200ヘルツ)の音(基音)が存在しなくても、その倍音(300ヘルツ、400ヘルツ、500ヘルツなどの音)が聞こえていれば、基音が聞こえていると人が錯覚することを利用して、低域を補正することができる。   Further, it is preferable to correct a low frequency (frequency band below the lowest resonance frequency foc of the speaker system) that is insufficient in the frequency characteristics after correction by a correction circuit mounted on the signal processing circuit 10. The correction circuit according to the present embodiment is composed of a harmonic generator, and is a harmonic of a low tone (for example, 100 Hz and 200 Hz) that is not included in the radiated sound of the speaker 4 (for example, 300 Hz, 400 Hz, 500 Hz). ) Is generated and emitted from the speaker 4. In other words, even if there is no sound (fundamental sound) with a fundamental frequency (100 Hz or 200 Hz), if you can hear its harmonics (300 Hz, 400 Hz, 500 Hz, etc.), you can hear the fundamental sound. The low range can be corrected by utilizing the illusion of human beings.

ところで、音声信号がディジタル伝送される場合、通常、伝送効率を向上するために音声情報(音声データ)が圧縮されるのであるが、非可逆音声圧縮では人の耳に聞こえ難い高域の音が削除されてしまう。そこで、信号処理(圧縮処理)によって欠落した音声信号の高域成分を補完する補完回路を信号処理回路10に搭載することが好ましい。補完回路は、例えば、受話音声の音声データから欠落した高域成分をリアルタイムに解析し、当該音声データに含まれる中域の倍音成分を複製することで高域成分を生成するとともに、生成した高域成分を滑らかに繋ぐ処理を行う。このように補完回路によって受話音声の高域成分を補完すれば(図７の斜線部分Ｚ参照)、圧縮によって欠落した高音を再現してスピーカ４から放射させることができる。   By the way, when audio signals are transmitted digitally, audio information (audio data) is usually compressed in order to improve transmission efficiency, but high-frequency sounds that are difficult to hear by human ears with irreversible audio compression. It will be deleted. In view of this, it is preferable that the signal processing circuit 10 is equipped with a complementary circuit that complements the high frequency component of the audio signal that has been lost due to signal processing (compression processing). The complementary circuit, for example, analyzes the high frequency component missing from the voice data of the received voice in real time, and generates the high frequency component by replicating the mid frequency harmonic component included in the audio data, and generates the generated high frequency component. Performs processing to smoothly connect band components. In this way, if the high frequency component of the received voice is complemented by the complementary circuit (see the hatched portion Z in FIG. 7), the high tone missing by the compression can be reproduced and radiated from the speaker 4.

１ 筐体
２ 筐体ベース
３ 筐体パネル
４ スピーカ
６ 回路基板
Ｓ 後気室 DESCRIPTION OF SYMBOLS 1 Case 2 Case base 3 Case panel 4 Speaker 6 Circuit board S Rear air chamber

Claims (5)

前面が開口する箱形の筐体ベースと当該筐体ベースの前面開口を閉塞する筐体パネルとからなる筐体内にスピーカ及び回路基板が収納され、当該回路基板が前記筐体パネルの背面に固定され、前記筐体ベースの側壁と前記筐体パネルと前記回路基板で後気室が前記スピーカの後方に形成され、前記筐体パネルは、前方から前記筐体ベース前面に着脱自在に取り付けられることを特徴とする拡声通話装置。 A speaker and a circuit board are housed in a housing composed of a box-shaped housing base having a front opening and a housing panel closing the front opening of the housing base, and the circuit board is fixed to the rear surface of the housing panel. A rear air chamber is formed behind the speaker by the side wall of the casing base, the casing panel, and the circuit board , and the casing panel is detachably attached to the front surface of the casing base from the front. A voice communication device characterized by the above. 前記スピーカの高域共振周波数を補正するためのフィルタが前記回路基板に実装されることを特徴とする請求項１記載の拡声通話装置。   The loudspeaker apparatus according to claim 1, wherein a filter for correcting a high frequency resonance frequency of the speaker is mounted on the circuit board. 前記スピーカの低域共振周波数を補正するためのフィルタが前記回路基板に実装されることを特徴とする請求項２記載の拡声通話装置。   The loudspeaker apparatus according to claim 2, wherein a filter for correcting a low-frequency resonance frequency of the speaker is mounted on the circuit board. 前記スピーカと前記筐体からなるスピーカシステムの最低共振周波数以下の周波数帯域を補正する補正回路が前記回路基板に実装されることを特徴とする請求項１〜３の何れか１項に記載の拡声通話装置。   The loudspeaker according to any one of claims 1 to 3, wherein a correction circuit for correcting a frequency band equal to or lower than a lowest resonance frequency of a speaker system including the speaker and the housing is mounted on the circuit board. Telephone device. 信号処理によって欠落した音声信号の高域成分を補完する補完回路が前記回路基板に実装されることを特徴とする請求項１〜４の何れか１項に記載の拡声通話装置。   The loudspeaker apparatus according to any one of claims 1 to 4, wherein a complementary circuit that complements a high frequency component of a voice signal that is lost by signal processing is mounted on the circuit board.
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