JP5744643B2 - Method for manufacturing light emitting device - Google Patents

Method for manufacturing light emitting device Download PDF

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JP5744643B2
JP5744643B2 JP2011143410A JP2011143410A JP5744643B2 JP 5744643 B2 JP5744643 B2 JP 5744643B2 JP 2011143410 A JP2011143410 A JP 2011143410A JP 2011143410 A JP2011143410 A JP 2011143410A JP 5744643 B2 JP5744643 B2 JP 5744643B2
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light emitting
emitting device
led light
white member
circuit board
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JP2013012544A (en
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孝一 深沢
孝一 深沢
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Description

本発明はＬＥＤ素子等の発光素子を備えた発光装置およびその製造方法に関するものであり、詳しくはフリップチップ実装された発光素子の発光面上に、前記発光素子より形状の大きい蛍光体板を透明接着剤にて接着し、前記発光素子の側面と前記蛍光体板の下面とを反射性の白色部材で充填封止することで、発光素子の発光を効率良く上方向に行わせる構成の発光装置の製造方法に関する。 The present invention relates to a light emitting device including a light emitting element such as an LED element and a method for manufacturing the same, and more specifically, a phosphor plate having a shape larger than that of the light emitting element is transparently formed on a light emitting surface of a light emitting element mounted in a flip chip. A light emitting device having a configuration in which light emission of the light emitting element is efficiently performed upward by bonding with an adhesive and filling and sealing the side surface of the light emitting element and the lower surface of the phosphor plate with a reflective white member. The present invention relates to a manufacturing method of a device.

近年、発光素子としてのＬＥＤ素子（以下ＬＥＤと略記する）は半導体素子であるため、長寿命で優れた駆動特性を有し、さらに小型で発光効率が良く、鮮やかな発光色を有することから、カラー表示装置のバックライトや照明等に広く利用されるようになってきた。本発明の実施形態においても発光装置としてＬＥＤ発光装置を事例として説明する。   In recent years, an LED element as a light emitting element (hereinafter abbreviated as LED) is a semiconductor element, and thus has a long life and excellent driving characteristics, and further has a small size, good luminous efficiency, and a bright emission color. It has come to be widely used for backlights and lighting of color display devices. In the embodiment of the present invention, an LED light emitting device will be described as an example of the light emitting device.

特に近年、ＬＥＤの周囲を反射性の白色部材で被覆し、ＬＥＤの側方への発光を上方に反射せることで、上方向への発光を効率良く行わせる白色部材被覆型のＬＥＤ発光装置の構成が提案されている。（例えば特許文献１、特許文献２）   Particularly in recent years, a white member-covered LED light-emitting device that efficiently emits light in the upward direction by covering the periphery of the LED with a reflective white member and reflecting the light emitted to the side of the LED upward. A configuration is proposed. (For example, Patent Document 1 and Patent Document 2)

以下従来の白色部材被覆型のＬＥＤ発光装置に付いて説明する。なお、理解し易いように発明の趣旨を外さない範囲において図面を一部簡略化し、また部品名称も本願にそろえている。図８は特許文献１におけるＬＥＤ発光装置１００の製造工程を示す各断面図であり、（ａ）は基板１０７に導電部材１０６ａ、１０６ｂによってフリップチップ実装されたＬＥＤ１０１の周囲に、枠体１０９を用いて光反射性の第１の白色部材１０４を充填被覆した状態を示している。（ｂ）はＬＥＤ１０１の上面に透明接着剤１０３を塗って、ＬＥＤ１０１からの出射光を通過して外部に放出する透光性部材１０２（透明部材または蛍光部材）を接着する工程を示している。（ｃ）は（ｂ）の工程によって透光性部材１０２の接着が行われた状態を示している。（ｄ）は滴下装置１０８により、第２の白色部材１０５を滴下して透光性部材１０２の側面を含む全体を第２の白色部材１０５で被覆することによって、白色部材被覆型のＬＥＤ発光装置１００が完成する。   A conventional white member-covered LED light emitting device will be described below. For ease of understanding, the drawings are partially simplified within the scope not departing from the spirit of the invention, and component names are also included in the present application. FIG. 8 is a cross-sectional view showing the manufacturing process of the LED light emitting device 100 in Patent Document 1. FIG. 8A shows a frame 109 around the LED 101 flip-chip mounted on the substrate 107 by the conductive members 106a and 106b. A state in which the light-reflective first white member 104 is filled and covered is shown. (B) shows the process of apply | coating the transparent adhesive 103 on the upper surface of LED101, and adhere | attaching the translucent member 102 (transparent member or fluorescent member) which passes the emitted light from LED101, and discharge | releases outside. (C) has shown the state by which the translucent member 102 was adhere | attached by the process of (b). FIG. 4D shows a white-member-covered LED light-emitting device by dropping the second white member 105 by the dropping device 108 and covering the entire surface including the side surface of the translucent member 102 with the second white member 105. 100 is completed.

図９は特許文献２におけるＬＥＤ発光装置２００の断面図を示している。
図９において光取り出し側に開口を有するケース２０３と、ケース２０３内のＬＥＤ搭載面上に設けられた配線電極２０５ａに、導電部材２０６ａ、２０６ｂによってフリップチップ実装されたＬＥＤ２０１の周囲に、ケース２０３を用いて光反射性の白色部材２０４を充填被覆し、この状態においてＬＥＤ２０１の光取り出し面上にシート状の蛍光体層２０２が貼着されている。 FIG. 9 shows a cross-sectional view of the LED light emitting device 200 in Patent Document 2.
In FIG. 9, a case 203 having an opening on the light extraction side, and a wiring electrode 205a provided on the LED mounting surface in the case 203, the case 203 is placed around the LED 201 flip-chip mounted by conductive members 206a and 206b. The light-reflecting white member 204 is filled and covered, and in this state, a sheet-like phosphor layer 202 is stuck on the light extraction surface of the LED 201.

なお、特許文献１及び特許文献２においては、白色部材の役目としてはＬＥＤの側面側から発光された出射光を反射させて、出射面側に戻し出射効率を高める機能を有するものであり、その構成としてはシリコーン樹脂、エポキシ樹脂、アクリル樹脂等のコーティング材に反射性のフィラーとして酸化チタン、二酸化ケイ素、二酸化ジルコニューム、アルミナ、窒化ホウ素等の粒子を混入したものを用いており、充填方法としては滴下装置や注入装置を用いている。   In Patent Document 1 and Patent Document 2, the role of the white member is to reflect the emitted light emitted from the side surface side of the LED and return it to the emission surface side to increase the emission efficiency. The composition uses a coating material such as silicone resin, epoxy resin, acrylic resin, etc. mixed with particles such as titanium oxide, silicon dioxide, zirconium dioxide, alumina, boron nitride as a reflective filler. A dripping device or an injection device is used.

特開２０１０−１９２６２９号公報JP 2010-192629 A 特開２００７−１９０９６号公報JP 2007-19096 A

しかし、特許文献１及び特許文献２に記載された従来の白色部材被覆型のＬＥＤ発光装置の製造工程では、回路基板上またはケース上に実装したＬＥＤの発光面を露出させた状態で、ＬＥＤの側面側に白色部材を充填し、白色部材を硬化させた後にＬＥＤの発光面に透光性部材や蛍光体層を接着している。しかし、この工程順では特許文献２の段落００２６に「コーティング材の充填は、ＬＥＤの光取出面を除く部位を覆うように行う。ここで、ＬＥＤの光取出面にコーティング材が付着することがあるが、この場合には研磨によって光取出面のコーティング材を取り除き光取出面を露出させる」の記載がある如く、ＬＥＤの光取出面に対するコーティング材の付着が発生する危険性があり、研磨除去のような余分な工程が必要になる場合があり、生産上の問題となる。   However, in the manufacturing process of the conventional white member-covered LED light emitting device described in Patent Document 1 and Patent Document 2, the LED light emitting surface mounted on the circuit board or the case is exposed, and the LED light emitting device is exposed. After the white member is filled on the side surface and the white member is cured, a translucent member or a phosphor layer is bonded to the light emitting surface of the LED. However, in this process order, in paragraph 0026 of Patent Document 2, “The coating material is filled so as to cover the portion other than the light extraction surface of the LED. Here, the coating material may adhere to the light extraction surface of the LED. However, in this case, there is a risk that the coating material adheres to the light extraction surface of the LED, as described in `` Removing the coating material on the light extraction surface by polishing to expose the light extraction surface ''. Such an extra process may be required, which is a production problem.

そこで本発明の目的は、上記問題点を解決しようとするものであり、白色部材被覆型のＬＥＤ発光装置において、白色部材の充填、硬化時に、ＬＥＤの光取出面に対するコーティング材の付着が発生する危険性がなく、またＬＥＤに対するアンダーフィル効果を有するＬＥＤ発光装置およびその製造方法を提供することである。   Accordingly, an object of the present invention is to solve the above-mentioned problems, and in a white member-covered LED light emitting device, the coating material adheres to the light extraction surface of the LED when the white member is filled and cured. It is an object to provide an LED light-emitting device that has no danger and has an underfill effect on the LED, and a manufacturing method thereof.

上記目的を達成するため本発明における発光装置の製造方法は下記の通りである。
大判の蛍光体板を用意する大判蛍光体板工程と、バンプ実装された複数の発光素子を所定の間隔を有して、前記大判蛍光体板に透明接着材にて接着する発光素子接着工程と、前記大判蛍光体板に接着された複数の発光素子間を反射性の白色部材にて充填する白色部材充填工程と、各発光素子の側面に白色部材の層を形成する大きさで、白色部材および蛍光体板を切断分離して発光素子チップを形成するチップ化工程と、配線電極を有する回路基板に発光素子チップをフリップチップ実装する実装工程と、発光素子の下面と回路基板間に第２白色部材を充填する第２白色部材充填工程を有する発光装置の製造方法であって、前記回路基板は大判の回路基板であり、前記大判の回路基板には前記発光素子チップを実装するための、複数の実装領域が設けられ、各実装領域は配線電極と実装領域を取り囲む封止枠が設けられており、前記配線電極にフリップチップ実装された発光素子チップに、前記封止枠により第２白色部材充填工程を行うことを特徴とする。 In order to achieve the above object, a method for manufacturing a light emitting device according to the present invention is as follows.
A large-sized phosphor plate process for preparing a large-sized phosphor plate, and a light-emitting element bonding step for bonding a plurality of bump-mounted light-emitting elements to the large-sized phosphor plate with a transparent adhesive at a predetermined interval; A white member filling step of filling a space between a plurality of light emitting elements bonded to the large-sized phosphor plate with a reflective white member, and a size of forming a white member layer on a side surface of each light emitting element. And a step of forming the light emitting element chip by cutting and separating the phosphor plate, a mounting process of flip chip mounting the light emitting element chip on the circuit board having the wiring electrodes, and a second step between the lower surface of the light emitting element and the circuit board. A method of manufacturing a light emitting device having a second white member filling step of filling a white member , wherein the circuit board is a large circuit board, and the light emitting element chip is mounted on the large circuit board. Multiple mounting areas Provided, each mounting area is sealing frame is provided to surround the mounting region and the wiring electrodes, the light emitting device chip that is flip-chip mounted on the wiring electrode, a second white member filling step by said sealing frame It is characterized by that.

上記製造方法によれば、大判の蛍光体板をベース基板として複数のＬＥＤを透明接着剤にて接着し、大判の蛍光体板上の複数のＬＥＤの側面が被覆されるように第１白色部材を全体に充填し、これを切断分離することによって、ＬＥＤの発光面側にコーティング材の付着が生じることのない、複数の発光素子チップを作成することができる。   According to the above manufacturing method, the first white member is formed such that a plurality of LEDs are bonded with a transparent adhesive using a large phosphor plate as a base substrate and the side surfaces of the plurality of LEDs on the large phosphor plate are covered. Are cut and separated into a plurality of light emitting element chips that do not cause the coating material to adhere to the light emitting surface side of the LED.

上記製造方法によれば、所定の配線電極を設けた大判の回路基板に複数の発光素子チップを実装した後に第２白色部材充填工程を行うことによって、大判の回路基板単位で、多数個発光素子による大型発光装置として使用することもできるし、また大判の回路基板を発光素子チップ単位に切断分離して複数の小型発光装置として使用することもできる。   According to the above manufacturing method, a plurality of light emitting elements are mounted on a large circuit board unit by performing the second white member filling step after mounting a plurality of light emitting element chips on a large circuit board provided with predetermined wiring electrodes. Can be used as a large-sized light-emitting device, or a large circuit board can be cut and separated into light-emitting element chip units to be used as a plurality of small-sized light-emitting devices.

上記の如く本発明によれば、蛍光体板をベース基板として発光素子チップ（以後ＬＥＤ発光チップとする）を作成することで、ＬＥＤ発光面へのコーティング材の付着がなく、ＬＥＤ発光チップを容易に製造することができる。またＬＥＤ発光チップの下面側も第２白色部材で被覆することによって、ＬＥＤの発光面以外を反射性の白色部材で封止することにより、上方への出射光率を高める効果を有する。   As described above, according to the present invention, a light-emitting element chip (hereinafter referred to as an LED light-emitting chip) is prepared using a phosphor plate as a base substrate. Can be manufactured. Further, the lower surface side of the LED light-emitting chip is also covered with the second white member, and by sealing the portion other than the light-emitting surface of the LED with a reflective white member, there is an effect of increasing the outgoing light rate upward.

本発明の第１実施形態におけるＬＥＤ発光装置の断面図である。It is sectional drawing of the LED light-emitting device in 1st Embodiment of this invention. 図１に示す第１実施形態におけるＬＥＤ発光装置の上面図である。It is a top view of the LED light-emitting device in 1st Embodiment shown in FIG. 図１に示すＬＥＤ発光装置の製造方法の各断面を示す工程図である。It is process drawing which shows each cross section of the manufacturing method of the LED light-emitting device shown in FIG. 本発明の第２実施形態におけるＬＥＤ発光装置の製造方法を示す工程図であり、（ａ）はＬＥＤ接着工程、（ｂ）は第１白色部材充填工程、（ｃ）は切断分離工程である。It is process drawing which shows the manufacturing method of the LED light-emitting device in 2nd Embodiment of this invention, (a) is a LED adhesion process, (b) is a 1st white member filling process, (c) is a cutting | disconnection separation process. 本発明の第２実施形態におけるＬＥＤ発光装置の製造方法を示す工程図であり、（ｄ）は大判回路基板工程、（ｅ）（ｆ）はＬＥＤ発光チップの実装工程である。It is process drawing which shows the manufacturing method of the LED light-emitting device in 2nd Embodiment of this invention, (d) is a large format circuit board process, (e) (f) is a mounting process of a LED light-emitting chip. 本発明の第２実施形態におけるＬＥＤ発光装置の製造方法を示す工程図であり、（ｇ）（ｈ）は第２白色部材充填工程である。It is process drawing which shows the manufacturing method of the LED light-emitting device in 2nd Embodiment of this invention, (g) (h) is a 2nd white member filling process. 本発明の第３実施形態におけるＬＥＤ発光装置の平面図であるIt is a top view of the LED light-emitting device in 3rd Embodiment of this invention. 従来のＬＥＤ発光装置の製造方法の各断面を示す工程図である。It is process drawing which shows each cross section of the manufacturing method of the conventional LED light-emitting device. 従来のＬＥＤ発光装置の断面図である。It is sectional drawing of the conventional LED light-emitting device.

（第１実施形態）
以下図面により、本発明の実施形態を説明する。図１〜図３は本発明の第１実施形態におけるＬＥＤ発光装置を示し、図１は本発明の第１実施形態におけるＬＥＤ発光装置１０の断面図、図２は図１に示すＬＥＤ発光装置１０の上面図、図３はＬＥＤ発光装置１０の製造工程を示す工程図であり、各要素の断面図を示している。 (First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show an LED light emitting device according to a first embodiment of the present invention, FIG. 1 is a sectional view of the LED light emitting device 10 according to the first embodiment of the present invention, and FIG. 2 shows an LED light emitting device 10 shown in FIG. FIG. 3 is a process diagram showing a manufacturing process of the LED light emitting device 10 and shows a cross-sectional view of each element.

図１に示すＬＥＤ発光装置１０の断面図及び、図２に示す上面図において、回路基板７の上面には配線電極５ａが設けられ、スルーホール電極５ｃを通して回路基板７の裏面側の電源電極５ｂに接続されている。またＬＥＤ１の発光面にはＬＥＤ１の発光面より形状の大きな蛍光体板２が透明接着剤３により接着され、ＬＥＤ１の側面および蛍光体板２の下面を第１の白色部材４で被覆したＬＥＤ発光チップ１Ａが構成されている。そして回路基板７の配線電極５ａにはＬＥＤ発光チップ１Ａが導電部材６ａ、６ｂによりＦＣ実装されており、さらに回路基板７上に形成された印刷枠９によりＬＥＤ発光チップ１Ａの底面と回路基板７の間には第２白色部材８が充填封止されている。なお第２白色部材８は注入器等を用いて印刷枠９の内部に注入されることにより、導電部材６ａ、６ｂの間を含むＬＥＤ発光チップ１Ａの下面と回路基板７の間に充填されてＬＥＤ１の下面を保持するアンダーフィル効果と、ＬＥＤ１からの下面側への発光及び反射光を上方に反射させる効果を有する。   In the cross-sectional view of the LED light emitting device 10 shown in FIG. 1 and the top view shown in FIG. 2, a wiring electrode 5a is provided on the upper surface of the circuit board 7, and the power supply electrode 5b on the back side of the circuit board 7 through the through-hole electrode 5c. It is connected to the. Further, a phosphor plate 2 having a shape larger than that of the light emitting surface of the LED 1 is adhered to the light emitting surface of the LED 1 with a transparent adhesive 3, and the LED light emission in which the side surface of the LED 1 and the lower surface of the phosphor plate 2 are covered with the first white member 4. Chip 1A is configured. The LED light emitting chip 1A is FC-mounted on the wiring electrodes 5a of the circuit board 7 by the conductive members 6a and 6b, and the bottom surface of the LED light emitting chip 1A and the circuit board 7 are formed by the printing frame 9 formed on the circuit board 7. The second white member 8 is filled and sealed in between. The second white member 8 is injected between the lower surface of the LED light emitting chip 1A including the space between the conductive members 6a and 6b and the circuit board 7 by being injected into the printing frame 9 using an injector or the like. It has an underfill effect for holding the lower surface of the LED 1 and an effect of reflecting light emitted from the LED 1 toward the lower surface side and reflected light upward.

次にＬＥＤ発光装置１０の製造工程を図３により説明する。図３における工程（ａ）はＬＥＤ接着工程であり、バンプ電極としての導電部材６ａ、６ｂを形成した複数のＬＥＤ１を、大判蛍光体板２Ａ上に所定の間隔をあけて、ＬＥＤ１の発光面側を透明接着剤３によって接着する工程である。工程（ｂ）は第１白色部材充填工程であり、大判蛍光体板２Ａ上に所定の間隔をあけて接着されたＬＥＤ１の間に白色部材４を充填する工程であり、白色部材４の充填高さはＬＥＤ１の底面の高さと同じである。工程（ｃ）は切断分離工程であり、充填された白色部材４の中間の位置で切断分離することにより、個々のＬＥＤ発光チップ１Ａを完成させる。このＬＥＤ発光チップ１ＡはＬＥＤ１の発光面に接着された蛍光体板２の底面と、ＬＥＤ１の側面とが白色部材４で被覆された状態となり、ＬＥＤ１の底面に導電部材６ａ、６ｂが設けられた状態となっている。   Next, the manufacturing process of the LED light emitting device 10 will be described with reference to FIG. Step (a) in FIG. 3 is an LED adhering step, in which a plurality of LEDs 1 formed with conductive members 6a and 6b as bump electrodes are arranged on the large phosphor plate 2A at a predetermined interval with the light emitting surface side of the LEDs 1 Is a step of adhering with the transparent adhesive 3. The step (b) is a first white member filling step, which is a step of filling the white member 4 between the LEDs 1 bonded at a predetermined interval on the large-format phosphor plate 2A. The height is the same as the height of the bottom surface of the LED 1. Step (c) is a cutting / separating step, and the individual LED light-emitting chips 1A are completed by cutting and separating at an intermediate position of the filled white member 4. In this LED light emitting chip 1A, the bottom surface of the phosphor plate 2 bonded to the light emitting surface of the LED 1 and the side surface of the LED 1 are covered with the white member 4, and the conductive members 6a and 6b are provided on the bottom surface of the LED 1. It is in a state.

工程（ｄ）はＬＥＤ発光チップ１Ａの実装工程であり、配線電極５ａ、スルーホール電極５ｃ、電源電極５ｂ及び印刷枠９が形成された回路基板７にＬＥＤ発光チップ１ＡがＦＣ実装された実装工程である。工程（ｅ）は第２白色部材充填工程であり、滴下装置等を用いて第２白色部材８をＬＥＤ発光チップ１Ａの下面と回路基板７の間に注入する。この第２白色部材充填工程においては回路基板２上の印刷枠９によって横幅が規制され、また２個の導電部材６ａ、６ｂ間にも第２白色部材８が充填されることにより、ＬＥＤ１に対するアンダーフィル効果が発生すると共にＬＥＤ１の下面側への出射光及び反射光は全て上方の蛍光樹脂２へ入力される。すなわち、この第２白色部材充填工程によって図１に示したＬＥＤ発光装置１０が完成する。   Step (d) is a mounting process of the LED light-emitting chip 1A. The mounting process in which the LED light-emitting chip 1A is FC-mounted on the circuit board 7 on which the wiring electrode 5a, the through-hole electrode 5c, the power supply electrode 5b, and the printing frame 9 are formed. It is. Step (e) is a second white member filling step, in which the second white member 8 is injected between the lower surface of the LED light emitting chip 1A and the circuit board 7 using a dropping device or the like. In this second white member filling step, the width is regulated by the printing frame 9 on the circuit board 2, and the second white member 8 is filled between the two conductive members 6a and 6b, so that the LED 1 is undercoated. The fill effect is generated, and the emitted light and the reflected light to the lower surface side of the LED 1 are all input to the fluorescent resin 2 above. That is, the LED light emitting device 10 shown in FIG. 1 is completed by this second white member filling step.

なお、本製造方法における大判蛍光体板２Ａとしては２個のＬＥＤ発光チップ１Ａに対応する２個分の大きさを例示したが、もっと大きな大判蛍光体板２Ａを用いて多数のＬＥＤ発光チップ１Ａを製造出来ることは当然である。また本実施形態における第１白色部材４と第２白色部材８とは同じ材料でも良いし、また異なる樹脂またはセラミックを使用しても良い。いずれにしても第１白色部材４と第２白色部材８とは反射性に優れた部材で有れば良い。   In addition, although the size corresponding to two LED light emitting chips 1A is illustrated as the large-sized phosphor plate 2A in the present manufacturing method, a large number of LED light-emitting chips 1A are used by using a larger large-sized phosphor plate 2A. Of course, it can be manufactured. Further, the first white member 4 and the second white member 8 in the present embodiment may be made of the same material, or different resins or ceramics may be used. Anyway, the 1st white member 4 and the 2nd white member 8 should just be members excellent in reflectivity.

（第２実施形態）
次に図４〜図６により本発明の第２実施形態におけるＬＥＤ発光装置の構成及び製造方法を説明する。図４は本発明の第２実施形態におけるＬＥＤ発光装置２０の製造工程を示す工程図であり、図３に示す第１実施形態のＬＥＤ発光装置１０の製造工程と同じ工程、及び同じ要素には同じ番号を付し重複する説明は省略する。 (Second Embodiment)
Next, the configuration and manufacturing method of the LED light emitting device according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a process diagram showing a manufacturing process of the LED light emitting device 20 according to the second embodiment of the present invention. In the same process as the manufacturing process of the LED light emitting device 10 of the first embodiment shown in FIG. The same numbers are assigned and duplicate descriptions are omitted.

第２実施形態におけるＬＥＤ発光装置２０の製造方法と第１実施形態におけるＬＥＤ発光装置１０の製造方法で異なるところは、ＬＥＤ発光装置１０は蛍光体板のみ大判蛍光体板２Ａを使用していたが、第２実施形態におけるＬＥＤ発光装置２０の製造方法では回路基板７にも大判回路基板７Ａを用いていることである。   The difference between the manufacturing method of the LED light emitting device 20 in the second embodiment and the manufacturing method of the LED light emitting device 10 in the first embodiment is that the LED light emitting device 10 uses the large-sized phosphor plate 2A only for the phosphor plate. In the manufacturing method of the LED light emitting device 20 in the second embodiment, the large circuit board 7A is also used for the circuit board 7.

図４は第２実施形態におけるＬＥＤ発光装置２０の製造方法を示す工程図であるが、工程（ａ）〜（ｃ）までのＬＥＤ接着工程、第１白色部材充填工程、切断分離工程は、図３に示す第１実施形態におけるＬＥＤ発光装置１０の製造方法を示す工程図とおなじであり、重複する説明を省略する。図５も第２実施形態におけるＬＥＤ発光装置２０の製造方法を示す工程図の続きであり、工程（ｄ）は大判回路基板工程であり、本実施形態においては大判回路基板７Ａとして、複数のＬＥＤ発光チップ１Ａを直列に実装するための複数の実装領域７ａが設けられた長方形の大判回路基板７Ａを例示しており、各実装領域７ａには配線電極５ａと実装領域７ａを取り囲む封止枠としての印刷枠９が設けられている。そして大判回路基板７Ａの端部には電源電極５ｄが設けられ、さらに各実装領域７ａに設けられた配線電極５ａ間は、全て接続電極５ｅで直列接続されている。   FIG. 4 is a process diagram showing a manufacturing method of the LED light emitting device 20 in the second embodiment, but the LED bonding process, the first white member filling process, and the cutting and separating process from process (a) to (c) are shown in FIG. 3, which is the same as the process diagram illustrating the method for manufacturing the LED light emitting device 10 according to the first embodiment shown in FIG. FIG. 5 is also a continuation of the process diagram showing the manufacturing method of the LED light emitting device 20 in the second embodiment, and the process (d) is a large circuit board process. In this embodiment, a plurality of LEDs are used as the large circuit board 7A. A rectangular large-sized circuit board 7A provided with a plurality of mounting regions 7a for mounting the light emitting chip 1A in series is illustrated, and each mounting region 7a has a sealing frame surrounding the wiring electrode 5a and the mounting region 7a. Printing frame 9 is provided. A power electrode 5d is provided at the end of the large circuit board 7A, and the wiring electrodes 5a provided in the mounting regions 7a are all connected in series by the connection electrodes 5e.

工程（ｅ）（ｆ）はＬＥＤ発光チップ１Ａの実装工程であり、各実装領域７ａの配線電極５ａに各々ＬＥＤ発光チップ１ＡをＦＣ実装する実装工程である。なお工程（ｅ）は断面図を示し、工程（ｆ）は上面からみた平面図を示している。図６も第２実施形態におけるＬＥＤ発光装置２０の製造方法を示す工程図の続きである。工程（ｇ）（ｈ）は第２白色部材充填工程であり、滴下装置等を用いて第２白色部材８をＬＥＤ発光チップ１Ａの下面と回路基板７Ａの間に注入する。この第２白色部材充填工程においては、大判回路基板７Ａ上の各実装領域７ａにおける印刷枠９によって注入された第２白色部材８の横幅が規制され、また２個の導電部材６ａ、６ｂ間にも第２白色部材８が充填されることにより、ＬＥＤ１に対するアンダーフィル効果が発生すると共にＬＥＤ１の下面側への出射光及び反射光は全て上方の蛍光体板２へ入力される。なお工程（ｇ）は断面図を示し、工程（ｈ）は上面からみた平面図を示している。   Steps (e) and (f) are mounting steps of the LED light emitting chip 1A, and are mounting steps in which the LED light emitting chips 1A are FC-mounted on the wiring electrodes 5a in the mounting regions 7a. Step (e) shows a cross-sectional view, and step (f) shows a plan view seen from above. FIG. 6 is also a continuation of the process diagram illustrating the method for manufacturing the LED light emitting device 20 in the second embodiment. Steps (g) and (h) are second white member filling steps, in which the second white member 8 is injected between the lower surface of the LED light emitting chip 1A and the circuit board 7A using a dropping device or the like. In this second white member filling step, the width of the second white member 8 injected by the printing frame 9 in each mounting area 7a on the large circuit board 7A is regulated, and between the two conductive members 6a and 6b. In addition, when the second white member 8 is filled, an underfill effect is generated on the LED 1 and all emitted light and reflected light on the lower surface side of the LED 1 are input to the upper phosphor plate 2. In addition, the process (g) shows sectional drawing, and the process (h) has shown the top view seen from the upper surface.

上記製造工程によって大判のＬＥＤ発光装置２０が完成する。第１実施形態におけるＬＥＤ発光装置１０と第２実施形態におけるＬＥＤ発光装置２０の違いは、ＬＥＤ発光装置１０が単個であったのに対し、ＬＥＤ発光装置２０は大判のＬＥＤ発光装置である。すなわち第２実施形態におけるＬＥＤ発光装置２０は、大型回路基板７Ａに実装された４個のＬＥＤ発光チップ１Ａを切断分離せずに、全体として４個のＬＥＤ発光チップ１Ａを用いたライン状のＬＥＤ発光装置２０として構成したものである。   The large-sized LED light emitting device 20 is completed by the above manufacturing process. The difference between the LED light emitting device 10 in the first embodiment and the LED light emitting device 20 in the second embodiment is that the LED light emitting device 10 is a single unit, whereas the LED light emitting device 20 is a large LED light emitting device. That is, the LED light emitting device 20 in the second embodiment is a line-shaped LED using four LED light emitting chips 1A as a whole without cutting and separating the four LED light emitting chips 1A mounted on the large circuit board 7A. The light emitting device 20 is configured.

次にＬＥＤ発光装置２０の動作に付いて説明する。ＬＥＤ発光装置２０の構成は図６（ｇ）（ｈ）に示す如く大判回路基板７Ａ上に実装された４個のＬＥＤ発光チップ１Ａは、大判回路基板７Ａの両端部に形成された電源電極５ｄに対して、接続電極５ｅにより直列接続されている。従って大判回路基板７Ａの両端部に形成された電源電極５ｄにＬＥＤ発光チップ１Ａの４個分の電圧、すなわちＬＥＤ発光装置１０に供給する電圧の４倍の電圧を供給することによって、４倍の長さを有するライン光源として使用することができる。   Next, the operation of the LED light emitting device 20 will be described. As shown in FIGS. 6G and 6H, the LED light emitting device 20 has four LED light emitting chips 1A mounted on the large circuit board 7A. The power electrodes 5d are formed at both ends of the large circuit board 7A. In contrast, the connection electrodes 5e are connected in series. Accordingly, by supplying the power supply electrodes 5d formed at both ends of the large circuit board 7A with four voltages of the LED light emitting chip 1A, that is, four times the voltage supplied to the LED light emitting device 10, the quadruple voltage is supplied. It can be used as a line light source having a length.

（第３実施形態）
次に図７により本発明の第３実施形態におけるＬＥＤ発光装置の構成を説明する。図７に示すＬＥＤ発光装置３０は大判回路基板７Ａの大きさを図６（ｈ）に示すＬＥＤ発光装置２０の２倍の幅に形成し、ＬＥＤ発光装置２０を２列に配設している。すなわちＬＥＤ発光チップ１Ａのラインと、ＬＥＤ発光チップ１Ｂのラインとを並列に実装配置し、大判回路基板７Ａの両端に形成した電源電極５ｄの幅も２倍にすることによって、ＬＥＤ発光チップ１Ａのラインと、ＬＥＤ発光チップ１Ｂのラインとを電気的に並列接続している。 (Third embodiment)
Next, the structure of the LED light-emitting device in 3rd Embodiment of this invention is demonstrated with FIG. The LED light emitting device 30 shown in FIG. 7 has a large circuit board 7A that is twice as large as the LED light emitting device 20 shown in FIG. 6H, and the LED light emitting devices 20 are arranged in two rows. . That is, the LED light-emitting chip 1A line and the LED light-emitting chip 1B line are mounted and arranged in parallel, and the width of the power supply electrode 5d formed on both ends of the large circuit board 7A is doubled. The line and the line of the LED light emitting chip 1B are electrically connected in parallel.

次にＬＥＤ発光装置３０の動作に付いて説明する。ＬＥＤ発光装置３０におけるＬＥＤ発光チップ１Ａのラインと、ＬＥＤ発光チップ１Ｂのラインとは電気的に並列接続されているため、ＬＥＤ発光装置２０と同様に大判回路基板７Ａの両端部に形成された電源電極５ｄにＬＥＤ発光チップ１Ａの４個分の電圧、すなわちＬＥＤ発光装置２０に供給する電圧を供給することによって、４倍の長さで、２倍の幅の面光源として使用することができる。   Next, the operation of the LED light emitting device 30 will be described. Since the LED light emitting chip 1A line and the LED light emitting chip 1B line in the LED light emitting device 30 are electrically connected in parallel, the power sources formed at both ends of the large circuit board 7A as in the LED light emitting device 20 By supplying the electrode 5d with a voltage corresponding to four LEDs of the LED light emitting chip 1A, that is, a voltage supplied to the LED light emitting device 20, it can be used as a surface light source that is four times longer and twice as wide.

上記の如く、本発明の構成においては大判回路基板７Ａの大きさを任意に変更して、１ライン光源を構成するＬＥＤ発光チップの数や、並列接続するライン光源の数を変更することによって、任意の長さのライン光源及び任意の面積の面光源を構成することができる。   As described above, in the configuration of the present invention, by arbitrarily changing the size of the large circuit board 7A, by changing the number of LED light emitting chips constituting one line light source or the number of line light sources connected in parallel, A line light source having an arbitrary length and a surface light source having an arbitrary area can be formed.

１、１０１，２０１ ＬＥＤ
１Ａ ，１Ｂ ＬＥＤ発光チップ
２ 蛍光体板
２Ａ 大判蛍光体板
３、１０３ 透明接着剤
４，１０４，２０４ 白色部材
５ａ、２０５ａ 配線電極
５ｂ，５ｄ、２０５ｂ 電源電極
５ｃ、２０５ｃ スルーホール電極
６ａ，６ｂ、１０６ａ、１０６ｂ 導電部材
２０６ａ、２０６ｂ 導電部材
７，１０７ 回路基板
７ａ 実装領域
７Ａ 大判回路基板
８、１０５ 第２白色部材
９ 印刷枠
１０、２０、３０，１００、２００ ＬＥＤ発光装置
１０２ 透明性部材
１０８ 滴下装置
１０９ 枠体
２０２ 蛍光体層
２０３ ケース
1, 101, 201 LED
1A, 1B LED light emitting chip 2 Phosphor plate 2A Large format phosphor plate 3, 103 Transparent adhesive 4, 104, 204 White member 5a, 205a Wiring electrode 5b, 5d, 205b Power supply electrode 5c, 205c Through-hole electrode 6a, 6b, 106a, 106b Conductive member 206a, 206b Conductive member 7, 107 Circuit board 7a Mounting area 7A Large format circuit board 8, 105 Second white member 9 Printing frame 10, 20, 30, 100, 200 LED light emitting device 102 Transparency member 108 Dropping Device 109 Frame 202 Phosphor layer 203 Case

Claims (1)

大判の蛍光体板を用意する大判蛍光体板工程と、バンプ実装された複数の発光素子を所定の間隔を有して、前記大判蛍光体板に透明接着材にて接着する発光素子接着工程と、前記大判蛍光体板に接着された複数の発光素子間を反射性の白色部材にて充填する白色部材充填工程と、各発光素子の側面に白色部材の層を形成する大きさで、白色部材および蛍光体板を切断分離して発光素子チップを形成するチップ化工程と、配線電極を有する回路基板に発光素子チップをフリップチップ実装する実装工程と、発光素子の下面と回路基板間に第２白色部材を充填する第２白色部材充填工程を有する発光装置の製造方法であって、前記回路基板は大判の回路基板であり、前記大判の回路基板には前記発光素子チップを実装するための、複数の実装領域が設けられ、各実装領域は配線電極と実装領域を取り囲む封止枠が設けられており、前記配線電極にフリップチップ実装された発光素子チップに、前記封止枠により第２白色部材充填工程を行うことを特徴とする発光装置の製造方法。 A large-sized phosphor plate process for preparing a large-sized phosphor plate, and a light-emitting element bonding step for bonding a plurality of bump-mounted light-emitting elements to the large-sized phosphor plate with a transparent adhesive at a predetermined interval; A white member filling step of filling a space between a plurality of light emitting elements bonded to the large-sized phosphor plate with a reflective white member, and a size of forming a white member layer on a side surface of each light emitting element. And a step of forming the light emitting element chip by cutting and separating the phosphor plate, a mounting process of flip chip mounting the light emitting element chip on the circuit board having the wiring electrodes, and a second step between the lower surface of the light emitting element and the circuit board. A method of manufacturing a light emitting device having a second white member filling step of filling a white member, wherein the circuit board is a large circuit board, and the light emitting element chip is mounted on the large circuit board. Multiple mounting areas Provided, each mounting area is sealing frame is provided to surround the mounting region and the wiring electrodes, the light emitting device chip that is flip-chip mounted on the wiring electrode, a second white member filling step by said sealing frame A method for manufacturing a light-emitting device.
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