JP5730872B2 - 固体薄膜コンデンサ - Google Patents
固体薄膜コンデンサ Download PDFInfo
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- JP5730872B2 JP5730872B2 JP2012521852A JP2012521852A JP5730872B2 JP 5730872 B2 JP5730872 B2 JP 5730872B2 JP 2012521852 A JP2012521852 A JP 2012521852A JP 2012521852 A JP2012521852 A JP 2012521852A JP 5730872 B2 JP5730872 B2 JP 5730872B2
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- electrode layer
- thin film
- layer
- film capacitor
- capacitor
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Description
上に要約されたように、本発明は、陰極アークで生成される容量性構造を含む埋込可能な医療装置等の半導体装置を提供する。埋込可能な医療装置とは、生体上又は生体内に配置されるように設定される装置を意味し、ある実施形態では、埋込可能な医療装置は、生体内に埋め込まれるように設定される。埋込可能な装置のある態様は、体内に見られる高濃度の塩、高湿度の環境を含む生理環境中で、2日以上にわたり、例えば、約1週間以上、約4週間以上、約6ヶ月以上、約1年以上、例えば、約5年以上にわたり、機能性を維持するように設定される。ある実施形態では、埋込可能な装置は、生理部位に埋め込まれた場合、約1年〜約80年の範囲又はそれ以上、例えば、約5〜約70年又はそれ以上の期間にわたり、約10〜約50年の範囲又はそれ以上の期間にわたり、機能性を維持するように設定される。本発明の埋込可能な医療装置の寸法は、変化してもよい。しかしながら、埋込可能な医療装置は埋め込むことができるので、本装置のある態様の寸法は、その装置を成人のヒトの中に配置することができない程には大きくない。例えば、埋込可能な医療装置は、ヒトの血管内に適合するように寸法が定められ得る。
直前に要約されたように、本発明の方法のある用途では、陰極アークで作製される構造体は、層構造体であり、層構造体とは、層構造を有し、従って、それらの長さと幅が、高さよりも十分に、例えば、5倍以上、例えば、50倍以上大きく、100倍以上を含むことを意味する。層構造体の目的に応じて、層は、様々な異なる構造を有し得る。
ある態様では、1つ以上の層構造体が、装置外部環境から、装置の内部容積を密閉する役割をする。そのような密閉層は、装置の単一表面上に、又は装置の1を超える表面上に存在し得る。例えば、密閉層は、装置のあらゆる表面に存在し得る。ある態様では、陰極アーク蒸着構造は、「埋込可能な密封構造体」と題し、WO2006/069323として公表されたPCT/US2005/046815、及び、2007年4月12日に出願された「空隙のない埋込可能な密封構造体」と題するPCT/US2007/09270で記載される密閉層であり、その開示内容は、本明細書に参照として組み込まれている。それらの層は、装置全体を包み込み、例えば、その装置全体を、即ち、装置の全表面を取り囲む密閉層を与えてもよく、2007年4月12日に出願され、その開示内容が本発明に参照として組み込まれている、「空隙のない埋込可能な密封構造体」と題するPCT出願整理番号第PCT/US2007/09270号に記載されるように、装置の一部分を包み込んでもよい。
上記に要約されたように、陰極アーク蒸着構造体は、細密褶曲層であってもよく、図3に見られるように細密褶曲表面300を表す。そのような層は、様々な異なる用途に利用される。例えば、埋込材上に細密褶曲表面を与えることは、骨結合が望まれる用途に利用される。細密褶曲層は、堆積金属(例えば、Pt)と金属化合物(例えば、TiO2)の両方の中に作製することができる。細密褶曲層は、様々な骨埋込装置上に堆積することができる。埋込装置は、金属埋込材であっても、高分子、例えば、PEEK及びPEKK埋込材であってもよい。関心のある骨埋込装置として、股関節埋込材、骨接合ねじ、歯科用埋込材、板、保持棒等が挙げられるが、これらに限定されない。
陰極アークで堆積された多孔質層にも関心がある。陰極アークで堆積された多孔質層は、様々な異なる医療装置部品に利用され、例えば、電極、埋込材被膜等であるが、これらに限定されない。陰極アークで作製される多孔質層が利用される対象の、関心のある1種類の部品は、高表面領域電極部品であり、そのような部品は、様々な異なる埋込可能な装置に、例えば、作動体(センサ又は刺激装置)として、電源部品等として利用される。
ある態様では、陰極アーク蒸着構造体は、医療装置の層ではない3次元部品であり、そのような部品は、構造及び機能が幅広く変化し得る。より詳しく以下に記載される、本対象の堆積所定動作を利用して作製され得る関心のある3次元部品として、導線素子、例えば、埋込可能な医療装置内に見られる層間導通穴又は他の導電線、通信素子、例えば、アンテナ、識別部品、例えば、装置上の識別標識、指向部品、例えば、装置を撮像下に仕向けるのに用いられる表面素子、組織相互作用素子等の作動体、例えば、電極等が挙げられるが、これらに限定されない。
ある態様では、陰極アーク蒸着構造体は、前記装置の3次元導線素子である。ある態様では、導線素子は、前記装置の2つの異なる構造体を導通させる役割を果たす。ある態様では、導線素子は、層間導通穴であり、その層間導通穴は、前記装置の高アスペクト比の通路内に存在し得る。高アスペクト比の通路とは、高さ対幅の比率が約100まで又はそれ以上、例えば、約1〜約50である、通路を意味する。
上記に考察されたように、関心のある陰極アークで作製される構造体は、アンテナ構造体を含む。陰極アーク蒸着プロセスの特性のために、今まで実現することができなかったアンテナ構造体を、ここで容易に作製することができる。アンテナ構造体は、直線であっても、直線でなくてもよく、所望により、2次元又は3次元構造である。
陰極アークで作製される構造体を含む埋込可能な医療装置を製造する方法も提供され、その方法は、陰極アーク蒸着の所定動作を利用して、構造体を作製することを含む。
陰極アークで作製される構造体を含む移植可能な医療装置を作製する本対象の方法を実施する際に用いられ得る、陰極アーク蒸着システムも提供される。本対象のシステムの態様は、陰極アークプラズマ源と基板装着部とを含む。陰極アークプラズマ源(即ち、プラズマ発生源)は、変わり得るが、ある態様では、陰極、1つ以上の陽極、及び、プラズマ発生中に陰極からイオン化された陰極材料を作り出すのに十分な電弧を生成するための陰極と陽極との間の電力源を含む。プラズマ発生源は、陰極ターゲットからの正帯電イオンを含むDC又はパルス化プラズマビーム104を生成する。基板装着部は、構造体が堆積される基板108を保持するように設定される。ある態様では、基板装着部は、その装着部上にある基板108の温度を制御するための、例えば、装着部上の基板108の温度を所望の値に上昇又は下降させるための温度調節器を含むものである。いずれかの便利な温度調節器は、冷却素子、加熱素子等のような装着部に動作可能に接続され得る。ある態様では、温度センサは、装着部上にある基板108の温度を測定するためにあり得る。ある態様では、システムは、基板108装着部と陰極との間の距離が調節され得るように設定される。言い換えれば、システムは、基板装着部と陰極が互いに対して移動し得るように設定される。ある態様では、システムは、基板装着部と陰極との間の距離が要望に応じて増加又は減少し得るように、基板装着部が陰極に対して移動することができるように設定される。ある態様では、システムは、陰極と基板装着部との間の距離が要望に応じて増加又は減少し得るように、陰極が基板装着部に対して移動することができるように設定される。要望に応じて、システムは、1つ以上の入力パラメータ、例えば、陰極材料、エネルギー、基板仕様、堆積雰囲気を考慮して、基板装着部と陰極とを互いに対して配置するための適切な距離を測定する素子を含み、例えば、上記で考察されたように、基板108の引張力により堆積材料内にあるいずれの圧縮力も相殺されることを確保することにより、応力のない厚い産物層を作製し得る。ある態様では、陰極アークプラズマ生成素子及び基板108は、制御された環境、例えば、真空又は制御された雰囲気を与える密閉チャンバ内にあり、システムの2つの部品は、同じチャンバ内にあっても、陰極から基板108へイオンを移動させるイオン搬送構造体により相互に接続された異なるチャンバ内にあってもよい。
本発明により陰極アークで作製された素子を含む1つ以上の埋込可能な医療装置を含むシステムも提供される。例えば、上記のような貼付アンテナ等の、陰極アークで作製されたアンテナを有する埋込可能な装置を含むシステムが、提供される。本発明のそのようなシステムは、被験体、例えば、ヒトの体内に情報を送るシステムと見なされてよく、そのシステムは、情報を伝送するように設定された無線機を含む第1の埋込可能な医療装置と、情報を伝送するように設定された無線機を含む第2の装置との両方を含み、第1の装置及び第2の装置のうちの少なくとも1つは、例えば、上記のような、本発明による微細縞型アンテナを含む。本発明の一態様は、図8に示され、そのシステムは、埋込可能な医療装置、例えば、IPGと外部プログラミングユニットとを含む。図8は、本発明による、外部プログラム書込装置802と埋め込まれた医療装置、例えば、心臓ペースメーカーIPG800との間の双方向遠隔計測通信の簡略化された概略図である。IPG800は、患者804の中に、患者の皮膚又は筋肉の下に埋め込まれ、通常、皮膚表面に向けられている。IPG800は、少なくとも1つの心臓調速導線808の調速/感受電極及び導線を介して、患者804の心臓806に電気的に結合される。IPG800は、プログラムされた動作モード及び電源に従って、感受及び調速機能の時間を調節するマイクロコンピュータ又はデジタル状態機械を用い得る操作システムを含む。IPG800は、心臓情報を検出する感受信号増幅器、患者活動センサ、又は、心臓の出力に必要な情報を感受する他の生理センサ、及び、先行技術で十分に知られている方法で操作システムを制御しながら心臓806の少なくとも1つの心房に調速パルスを伝送するパルス発生出力回路も含む。操作システムは、様々なプログラムに組み込まれた操作モードと操作システムにより利用されるパラメータ値とを保存する、メモリレジスタ又はRAMを含む。メモリレジスタ又はRAMは、感受された心臓活動から編集された及び/又は装置操作履歴に関連するデータ、又は、検索又は問い合わせ命令を受け取り次第出力される、感受された遠隔計測用生理パラメータを保存するのに利用され得る。これらの機能及び操作の全ては、当該分野で十分に知られており、その多くは、他のプログラム可能で埋込可能な医療装置内で用いられ、操作命令と、装置動作を制御するためのデータと、装置機能又は患者の容態を診断するために後に取り出すためのデータとを保存する。プログラム命令又はデータは、IPG800の表面内の又はその表面上のIPGRF遠隔計測アンテナ810と、外部のプログラム書込装置802に接続される外部RF遠隔計測アンテナ812との間で伝送される。外部RF遠隔計測アンテナ812は、患者804からある距離だけ離れた外部のプログラム書込装置の容器の上に配置することができる。例えば、外部プログラム書込装置802及び外部RF遠隔計測アンテナ812は、患者804から数メートル程度離れて立ってもよい。更に、患者は、動いてもよく、実時間ECG又は生理パラメータを上りリンク遠隔計測で問い合わせている間、トレッドミル等上で運動することができる。プログラム書込装置802は、従来のフェライトコアとワイヤコイルと先行技術のRF遠隔計測アンテナとを用い、従って、従来のプログラム書込装置RFヘッドとそのようなIPGで選択的に利用するための関連ソフトウェアとを更に有する、既存のIPGを遍くプログラムするようにも設計され得る。
本発明の固体薄膜コンデンサ1100は、様々な異なる用途に利用される。例えば、固体薄膜コンデンサ1100は、他の用途の中でも、電圧を制御するように設定された結合切離コンデンサ1100、回路中の雑音を削減し易くするように設定された結合切離コンデンサ1100、回路中の雑音を迂回させるように設定された迂回コンデンサ1100、及び、回路中のエネルギーを保存、放出するように設定されたエネルギー保存コンデンサ1100として利用され得る。ある事例では、コンデンサ1100は、電子回路に利用される。電子回路では、コンデンサ1100は、他の用途の中でも、回路中の雑音を削減し易くするように設定されたフィルタ、ある情報を安定的に生成するように設定された振動回路、ある情報を選択するように設定された調節回路、温度揺らぎを補償するように設定された迂回回路として利用され得る。
Claims (18)
- 固体薄膜コンデンサ装置において、
第1表面を有する半導体基板と、
第1電極層と絶縁層と第2電極層とを含む薄膜コンデンサとを備えており、
前記第1電極層は、前記第1表面上に配置されて、遷移金属を含み、
前記絶縁層は、前記第1電極層上に配置されて、遷移金属の酸化物を含み、
前記第2電極層は、前記絶縁層上に配置されて、金属酸化物を含み、
前記絶縁層が、前記第1電極層及び前記第2電極層の間に配置されており、
前記第1電極層及び前記第2電極層が前記絶縁層に接触し、各々の層の実表面が、前記半導体基板の前記第1表面の直交する長さ寸法及び幅寸法により確定される表面領域よりも少なくとも2倍大きく、
前記半導体基板内に位置し、前記半導体基板及び前記第1電極層により取り囲まれている電気回路素子を備え、
前記薄膜コンデンサが、前記半導体基板の前記第1表面から延び、前記電気回路素子が、前記薄膜コンデンサ及び前記半導体基板により取り囲まれており、
前記薄膜コンデンサの周りに配置される密封構造体を更に備え、前記半導体基板と組み合わせて前記薄膜コンデンサの密封を形成する
ことを特徴とする固体薄膜コンデンサ装置。 - 前記第1電極層の実表面領域が、前記半導体基板の前記第1表面の表面領域の50%よりも大きいことを特徴とする請求項1に記載の装置。
- 前記第1電極層、前記絶縁層及び前記第2電極層の各々の実表面領域が、前記半導体基板の前記第1表面の表面領域の50%よりも大きいことを特徴とする請求項1に記載の装置。
- 前記第1電極層の実表面領域が、前記半導体基板の前記第1表面の表面領域の50%よりも大きいことを特徴とする請求項1に記載の装置。
- 前記第1電極層、前記絶縁層及び前記第2電極層の各々の実表面領域が、前記半導体基板の前記第1表面の表面領域の90%よりも大きいことを特徴とする請求項1に記載の装置。
- 前記薄膜コンデンサの容量が、0.01マイクロファラッド〜0.5マイクロファラッドの範囲であることを特徴とする請求項1に記載の装置。
- 前記密封構造体が、前記半導体基板を更に取り囲むことを特徴とする請求項1に記載の装置。
- 前記第1電極層の平均厚が、0.1マイクロメートル〜10マイクロメートルの範囲であることを特徴とする請求項1に記載の装置。
- 前記絶縁層の平均厚が、0.05マイクロメータ〜1.0マイクロメータの範囲であることを特徴とする請求項1に記載の装置。
- 前記第2電極層の平均厚が、0.1マイクロメータ〜10マイクロメータの範囲であることを特徴とする請求項1に記載の装置。
- 前記遷移金属がタンタルであり、前記遷移金属の酸化物が酸化タンタルであり、前記金属酸化物が二酸化マンガンであることを特徴とする請求項1に記載の装置。
- 前記第1電極層及び前記第2電極層の各々の、前記絶縁層に接触する実表面が、前記半導体基板の前記第1表面の直交する長さ寸法及び幅寸法により確定される表面領域よりも大きいことを特徴とする請求項1に記載の装置。
- 第2薄膜コンデンサを更に備え、前記薄膜コンデンサと前記第2薄膜コンデンサとが直列に接触していることを特徴とする請求項1に記載の装置。
- 第2薄膜コンデンサを更に備え、前記薄膜コンデンサと前記第2薄膜コンデンサとが並列に接触していることを特徴とする請求項1に記載の装置。
- 埋込可能な作動装置内に含まれていることを特徴とする請求項1に記載の装置。
- 摂取可能な事象標識装置内に含まれていることを特徴とする請求項1に記載の装置。
- 前記第1電極層の表面が多孔質表面であることを特徴とする請求項1に記載の装置。
- 少なくとも1つの表面が表面細密褶曲を含むことを特徴とする請求項1に記載の装置。
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WO2011011736A2 (en) | 2011-01-27 |
JP2013500589A (ja) | 2013-01-07 |
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US8786049B2 (en) | 2014-07-22 |
US20120018844A1 (en) | 2012-01-26 |
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