JP5730089B2 - 導電材料、積層体および導電材料の製造方法 - Google Patents
導電材料、積層体および導電材料の製造方法 Download PDFInfo
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- 239000004020 conductor Substances 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000010410 layer Substances 0.000 claims description 82
- 239000000463 material Substances 0.000 claims description 66
- 229910052751 metal Inorganic materials 0.000 claims description 58
- 239000002184 metal Substances 0.000 claims description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 45
- 229910052802 copper Inorganic materials 0.000 claims description 45
- 239000010949 copper Substances 0.000 claims description 45
- 229910052782 aluminium Inorganic materials 0.000 claims description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 42
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- 239000000843 powder Substances 0.000 claims description 38
- 229910045601 alloy Inorganic materials 0.000 claims description 36
- 239000000956 alloy Substances 0.000 claims description 36
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 25
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 16
- 229910052755 nonmetal Inorganic materials 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 13
- 238000000137 annealing Methods 0.000 claims description 13
- 229910052804 chromium Inorganic materials 0.000 claims description 13
- 239000011651 chromium Substances 0.000 claims description 13
- 229910052732 germanium Inorganic materials 0.000 claims description 13
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 13
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 13
- 150000002739 metals Chemical class 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 229910052725 zinc Inorganic materials 0.000 claims description 13
- 239000011701 zinc Substances 0.000 claims description 13
- 239000011247 coating layer Substances 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- 238000007751 thermal spraying Methods 0.000 claims description 4
- 238000010288 cold spraying Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 32
- 239000007921 spray Substances 0.000 description 29
- 238000000034 method Methods 0.000 description 17
- 229910000765 intermetallic Inorganic materials 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 229910000881 Cu alloy Inorganic materials 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 230000007774 longterm Effects 0.000 description 7
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000003570 air Substances 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Description
アルミニウムからなる基材1に、メッキ法により銀またはニッケルの中間層2(厚さ:5μm)を形成し、コールドスプレー装置60により銅の金属皮膜3を中間層2の基材1と接する面と反対側の面に形成して(圧縮ガス温度:800℃、ガス圧力:5MPa)、積層体10を形成した。この積層体10を、真空中、400℃で、アニール処理を4時間行い、アルミニウムと銅との金属間化合物の形成について確認した。また、比較例として、アルミニウムからなる基材1に、所定の中間層2を形成しないで、コールドスプレー装置により銅の金属皮膜3を基材1表面に形成した積層体についても(圧縮ガス温度:800℃、ガス圧力:5MPa)、同様に、真空中、400℃で、アニール処理を4時間行い、金属間化合物の形成について確認した。
アルミニウムからなる基材1に、メッキ法によりニッケルの中間層2(厚さ:2μm)を形成し、コールドスプレー装置60により銅の金属皮膜3を中間層2の基材1と接する面と反対側の面に形成して(圧縮ガス温度:800℃、ガス圧力:5MPa)、積層体10を形成した。この積層体10を、大気中、250℃、300時間保持して、積層体10の使用環境下における長時間保持試験を行った。また、比較例として、アルミニウムからなる基材1に、所定の中間層2を形成しないで、コールドスプレー装置により銅の金属皮膜3を基材1表面に形成した積層体についても(圧縮ガス温度:800℃、ガス圧力:5MPa)、同様に、大気中、250℃、300時間保持して長時間保持試験を行った。
2 中間層
3 金属皮膜
10 積層体
60 コールドスプレー装置
61 ガス加熱器
62 スプレーガン
63 粉末供給装置
64 ガスノズル
Claims (11)
- アルミニウム又はアルミニウムを含む合金によって形成された基材と、
前記基材表面に、銀、金、クロム、鉄、ゲルマニウム、マンガン、ニッケル、ケイ素または亜鉛から選択されるいずれか1種の金属または非金属、あるいは前記いずれか1種の金属を含む合金から形成される中間層と、
前記中間層の表面に、銅または銅を含む合金の粉末材料を該粉末材料の融点より低い温度に加熱されたガスと共に加速し、前記中間層に固相状態のままで吹き付けて堆積させた皮膜層と、
を備え、前記皮膜層を形成後、所定温度で加熱処理されたことを特徴とする導電材料。 - 銅又は銅を含む合金によって形成された基材と、
前記基材表面に、銀、金、クロム、鉄、ゲルマニウム、マンガン、ニッケル、ケイ素または亜鉛から選択されるいずれか1種の金属または非金属、あるいは前記いずれか1種の金属を含む合金から形成される中間層と、
前記中間層の表面に、アルミニウムまたはアルミニウムを含む合金の粉末材料を該粉末材料の融点より低い温度に加熱されたガスと共に加速し、前記中間層に固相状態のままで吹き付けて堆積させた皮膜層と、
を備え、前記皮膜層を形成後、所定温度で加熱処理されることを特徴とする導電材料。 - 前記加熱処理温度は、300〜500℃であることを特徴とする請求項1または2に記載の導電材料。
- 前記中間層は、前記いずれか1種の金属または非金属、あるいは前記いずれか1種の金属を含む合金の多層積層体であることを特徴とする請求項1〜3のいずれか一つに記載の導電材料。
- 前記中間層の厚さは0.2〜20μmであることを特徴とする請求項1〜4のいずれか一つに記載の導電材料。
- 前記中間層は、溶射、コールドスプレー、メッキ、スパッタリングまたはCVDにより形成することを特徴とする請求項1〜5のいずれか一つに記載の導電材料。
- アルミニウム又はアルミニウムを含む合金によって形成された基材と、
前記基材表面に、銀、金、クロム、鉄、ゲルマニウム、マンガン、ニッケル、ケイ素または亜鉛から選択されるいずれか1種の金属または非金属、あるいは前記いずれか1種の金属を含む合金から形成される中間層と、
前記中間層の表面に、銅または銅を含む合金の粉末材料を該粉末材料の融点より低い温度に加熱され、圧力が1〜5MPaのガスと共に加速し、前記中間層に固相状態のままで吹き付けて堆積させた皮膜層と、
を備えることを特徴とする積層体。 - 銅又は銅を含む合金によって形成された基材と、
前記基材表面に、銀、金、クロム、鉄、ゲルマニウム、マンガン、ニッケル、ケイ素または亜鉛から選択されるいずれか1種の金属または非金属、あるいは前記いずれか1種の金属を含む合金から形成される厚さが0.2〜20μmである中間層と、
前記中間層の表面に、アルミニウムまたはアルミニウムを含む合金の粉末材料を該粉末材料の融点より低い温度に加熱され、圧力が1〜5MPaのガスと共に加速し、前記中間層に固相状態のままで吹き付けて堆積させた皮膜層と、
を備えることを特徴とする積層体。 - 前記積層体は、前記皮膜層を形成後、所定温度で加熱処理されたことを特徴とする請求項7または8に記載の積層体。
- アルミニウム又はアルミニウムを含む合金によって形成された基材の表面に、銀、金、クロム、鉄、ゲルマニウム、マンガン、ニッケル、ケイ素または亜鉛から選択されるいずれか1種の金属または非金属、あるいは前記いずれか1種の金属を含む合金から形成される中間層を形成する中間層形成ステップと、
前記中間層の表面に、銅または銅を含む合金の粉末材料を該粉末材料の融点より低い温度に加熱されたガスと共に加速し、前記中間層に固相状態のままで吹き付けて堆積させて皮膜層を形成する皮膜層形成ステップと、
所定温度で加熱処理するアニール処理ステップと、
を含むことを特徴とする導電材料の製造方法。 - 銅又は銅を含む合金によって形成された基材の表面に、銀、金、クロム、鉄、ゲルマニウム、マンガン、ニッケル、ケイ素または亜鉛から選択されるいずれか1種の金属または非金属、あるいは前記いずれか1種の金属を含む合金から形成される中間層を形成する中間層形成ステップと、
前記中間層の表面に、アルミニウムまたはアルミニウムを含む合金の粉末材料を該粉末材料の融点より低い温度に加熱されたガスと共に加速し、前記中間層に固相状態のままで吹き付けて堆積させて皮膜層を形成する皮膜層形成ステップと、
所定温度で加熱処理するアニール処理ステップと、
を含むことを特徴とする導電材料の製造方法。
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EP12760790.1A EP2690195A4 (en) | 2011-03-23 | 2012-03-22 | LAMINATE, CONDUCTIVE MATERIAL, AND METHOD FOR PRODUCING LAMINATE |
CN2012800135008A CN103459667A (zh) | 2011-03-23 | 2012-03-22 | 层叠体、导电材料及层叠体的制造方法 |
US14/006,425 US20140069700A1 (en) | 2011-03-23 | 2012-03-22 | Lamination, conductive material, and method for manufacturing lamination |
PCT/JP2012/057375 WO2012128327A1 (ja) | 2011-03-23 | 2012-03-22 | 積層体、導電材料および積層体の製造方法 |
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JP6868412B2 (ja) * | 2017-02-03 | 2021-05-12 | 日産自動車株式会社 | 摺動部材、内燃機関の摺動部材、及び摺動部材の製造方法 |
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