JP5711856B2 - 銅の電解エッチングを行うエッチング装置 - Google Patents
銅の電解エッチングを行うエッチング装置 Download PDFInfo
- Publication number
- JP5711856B2 JP5711856B2 JP2014533763A JP2014533763A JP5711856B2 JP 5711856 B2 JP5711856 B2 JP 5711856B2 JP 2014533763 A JP2014533763 A JP 2014533763A JP 2014533763 A JP2014533763 A JP 2014533763A JP 5711856 B2 JP5711856 B2 JP 5711856B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- gas
- solution
- etching
- outlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005530 etching Methods 0.000 title claims description 50
- 239000010949 copper Substances 0.000 title claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 17
- 229910052802 copper Inorganic materials 0.000 title claims description 17
- 238000000866 electrolytic etching Methods 0.000 title 1
- 238000002156 mixing Methods 0.000 claims description 54
- 239000000243 solution Substances 0.000 claims description 40
- 239000007788 liquid Substances 0.000 claims description 37
- 239000000203 mixture Substances 0.000 claims description 35
- 239000007789 gas Substances 0.000 claims description 26
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 17
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 15
- 239000008151 electrolyte solution Substances 0.000 claims description 14
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 11
- 230000002378 acidificating effect Effects 0.000 claims description 11
- 229910001882 dioxygen Inorganic materials 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 229910001431 copper ion Inorganic materials 0.000 claims description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 12
- -1 copper (I) ions Chemical class 0.000 description 10
- 239000003792 electrolyte Substances 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 239000012530 fluid Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000336 copper(I) sulfate Inorganic materials 0.000 description 3
- WIVXEZIMDUGYRW-UHFFFAOYSA-L copper(i) sulfate Chemical compound [Cu+].[Cu+].[O-]S([O-])(=O)=O WIVXEZIMDUGYRW-UHFFFAOYSA-L 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008929 regeneration Effects 0.000 description 3
- 238000011069 regeneration method Methods 0.000 description 3
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 208000031481 Pathologic Constriction Diseases 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 208000037804 stenosis Diseases 0.000 description 2
- 230000036262 stenosis Effects 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
- C25F7/02—Regeneration of process liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/20—Mixing gases with liquids
- B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
- B01F23/232—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids using flow-mixing means for introducing the gases, e.g. baffles
- B01F23/2323—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids using flow-mixing means for introducing the gases, e.g. baffles by circulating the flow in guiding constructions or conduits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/40—Mixing liquids with liquids; Emulsifying
- B01F23/45—Mixing liquids with liquids; Emulsifying using flow mixing
- B01F23/454—Mixing liquids with liquids; Emulsifying using flow mixing by injecting a mixture of liquid and gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/20—Jet mixers, i.e. mixers using high-speed fluid streams
- B01F25/21—Jet mixers, i.e. mixers using high-speed fluid streams with submerged injectors, e.g. nozzles, for injecting high-pressure jets into a large volume or into mixing chambers
- B01F25/211—Jet mixers, i.e. mixers using high-speed fluid streams with submerged injectors, e.g. nozzles, for injecting high-pressure jets into a large volume or into mixing chambers the injectors being surrounded by guiding tubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/30—Injector mixers
- B01F25/31—Injector mixers in conduits or tubes through which the main component flows
- B01F25/312—Injector mixers in conduits or tubes through which the main component flows with Venturi elements; Details thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/50—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
- B01F25/53—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle in which the mixture is discharged from and reintroduced into a receptacle through a recirculation tube, into which an additional component is introduced
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F33/00—Other mixers; Mixing plants; Combinations of mixers
- B01F33/80—Mixing plants; Combinations of mixers
- B01F33/82—Combinations of dissimilar mixers
- B01F33/821—Combinations of dissimilar mixers with consecutive receptacles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/20—Mixing gases with liquids
- B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
- B01F23/237—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media
- B01F23/2376—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media characterised by the gas being introduced
- B01F23/23761—Aerating, i.e. introducing oxygen containing gas in liquids
- B01F23/237612—Oxygen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/20—Mixing gases with liquids
- B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
- B01F23/237—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media
- B01F23/2376—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media characterised by the gas being introduced
- B01F23/23761—Aerating, i.e. introducing oxygen containing gas in liquids
- B01F23/237613—Ozone
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Description
・銅イオンを含有する酸性電解液及び酸素ガスまたはオゾンガスを収容し、第一の気液混合物を作成するための第一混合装置。該第一混合装置は、第一出口を有し、該第一の気液混合物は該第一出口から、該第一出口に連結されている接続管路へ送り出される。
・容器内溶液を収容する容器。
・該容器内に配置され、該容器内溶液に浸かっている第二混合装置。第二混合装置は、吸引口を有し、吸引口付近に存在する容器内溶液を吸引する。第二混合装置は、上記接続管路に接続されると共に狭窄区域を有し、接続管路からの第一の気液混合物と吸引口からの容器内溶液を該狭窄区域に送り出して、吸引された容器内溶液を第一の気液混合物と混合して第二の気液混合物を作成する。第二混合装置は、第二出口を有し、第二の気液混合物は該第二出口から流出して、第二出口付近に存在する容器内溶液と混合される。
・容器出口管路。容器出口管路は、管路内に存在する容器内溶液を、エッチングモジュール内のエッチング材料に供給する。
2 第一入口
3 電解液
4 第二入口
5 酸素ガスまたはオゾンガス
6 第一の気液混合物
7 第一出口
8 接続管路
10 第二混合装置
11 容器
12 容器内溶液
13 吸引口
14 吸引口付近の容器内溶液
15 狭窄区域
16 第二の気液混合物
17 第二出口
18 出口付近の容器内溶液
19 容器出口管路
30 エッチングモジュール
31 回路基板
32 戻り管路
33 ポンプ
100 エッチング装置
Claims (6)
- エッチング材料上の銅を電解エッチングするためのエッチング装置であって、
銅イオンを含有する酸性電解液及び酸素ガスまたはオゾンガスを収容し、第一の気液混合物を作成するための第一混合装置、該第一混合装置は、第一出口を有し、該第一の気液混合物は該第一出口から、該第一出口に連結されている接続管路へ送り出される、
容器内溶液を収容する容器、
該容器内に配置され、該容器内溶液に浸かっている第二混合装置、該第二混合装置は、吸引口を有し、吸引口付近に存在する容器内溶液を吸引し、第二混合装置は、上記接続管路に接続されると共に狭窄区域を有し、接続管路からの第一の気液混合物と吸引口からの容器内溶液を該狭窄区域に送り出して、吸引された容器内溶液を第一の気液混合物と混合して第二の気液混合物を作成し、第二混合装置は、第二出口を有し、第二の気液混合物は該第二出口から流出して、第二出口付近に存在する容器内溶液と混合される、及び
容器出口管路は、該管路内に存在する容器内溶液を、エッチングモジュール内のエッチング材料に供給する、を有するエッチング装置。 - 第一混合装置がベンチュリノズルまたは液体ジェットガス圧縮機であることを特徴とする、請求項1に記載のエッチング装置。
- 第二混合装置は容器の下半分の位置に配置され、容器出口管路は第二混合装置よりも高い位置に配置されることを特徴とする、請求項1または2に記載のエッチング装置。
- 容器出口管路と第二混合装置との間の距離が少なくとも1m以上であることを特徴とする、請求項1〜3のいずれかに記載のエッチング装置。
- 該容器が、少なくとも1.5m以上の高さを有し、容器内溶液を少なくとも400リットル収容できることを特徴とする、請求項1〜4のいずれかに記載のエッチング装置。
- 該第一混合装置が、1分間当たり少なくとも100リットルの酸性電解液と1分間当たり少なくとも50リットルの酸素ガスまたはオゾンガスを収容できることを特徴とする、請求項1〜5のいずれかに記載のエッチング装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/DE2011/001810 WO2013050008A1 (de) | 2011-10-08 | 2011-10-08 | Ätzvorrichtung zum elektrolytischen ätzen von kupfer |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014528516A JP2014528516A (ja) | 2014-10-27 |
JP5711856B2 true JP5711856B2 (ja) | 2015-05-07 |
Family
ID=45952807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014533763A Active JP5711856B2 (ja) | 2011-10-08 | 2011-10-08 | 銅の電解エッチングを行うエッチング装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20140251797A1 (ja) |
EP (1) | EP2764138B1 (ja) |
JP (1) | JP5711856B2 (ja) |
KR (1) | KR101587245B1 (ja) |
CN (1) | CN103975096B (ja) |
DE (1) | DE112011105722A5 (ja) |
SG (1) | SG11201401219WA (ja) |
WO (1) | WO2013050008A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5719468B1 (ja) * | 2014-06-20 | 2015-05-20 | 日本ガス開発株式会社 | 熱交換器 |
US9551083B2 (en) * | 2014-09-10 | 2017-01-24 | Invensas Corporation | Paddle for materials processing |
CN104947111B (zh) * | 2015-07-02 | 2017-09-22 | 深圳市洁驰科技有限公司 | 一种印刷电路板酸性蚀刻液亚铜离子氧化装置 |
CN107215140A (zh) * | 2017-07-27 | 2017-09-29 | 安徽省九华山法器有限公司 | 一种紫金蚀刻工艺 |
WO2020074541A1 (en) * | 2018-10-08 | 2020-04-16 | Degrémont Technologies Ag | Using ozone for manganese* oxidation in etching application |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE34781T1 (de) * | 1983-04-13 | 1988-06-15 | Kernforschungsanlage Juelich | Anlage zum regenerieren einer ammoniakalischen aetzloesung. |
JPS6388026A (ja) * | 1986-10-01 | 1988-04-19 | Mitsubishi Rayon Eng Co Ltd | 気液混合装置 |
JP2701444B2 (ja) * | 1989-04-07 | 1998-01-21 | 富士電機株式会社 | エッチング液再生装置 |
HU9202203D0 (en) * | 1990-01-29 | 1992-12-28 | Yasuyuki Sakurada | Apparatus for purifying sewage water |
DE4208582A1 (de) * | 1992-03-18 | 1993-09-23 | Hoellmueller Maschbau H | Verfahren zum regenerieren von kupferchloridaetz- und beizloesungen und vorrichtung zur durchfuehrung des verfahrens |
JPH07243062A (ja) * | 1994-03-03 | 1995-09-19 | Hitachi Chem Co Ltd | エッチング方法及びエッチング装置 |
JPH08302487A (ja) * | 1995-05-08 | 1996-11-19 | Fuji Electric Co Ltd | エッチング液再生装置 |
FR2762232B1 (fr) * | 1997-04-17 | 1999-05-28 | Degremont | Procede et dispositif pour la mise en contact de l'ozone dans des fluides a traiter, notamment de l'eau |
JP2000017462A (ja) * | 1998-07-03 | 2000-01-18 | Kenshin Ka | 銅エッチング方法及びその装置 |
DE10002000A1 (de) * | 2000-01-19 | 2001-08-09 | Bosch Gmbh Robert | Zerstäubungsanordnung |
JP3555557B2 (ja) * | 2000-06-16 | 2004-08-18 | 栗田工業株式会社 | 曝気装置 |
US6619318B2 (en) * | 2001-09-25 | 2003-09-16 | Hydro Systems Company | Multiple flow rate eductive dispenser |
EP1533398B1 (de) * | 2003-10-24 | 2011-08-31 | Siemens Aktiengesellschaft | Verfahren zur Erzeugung eines einsatzbereiten Elektrolyten aus metallionenhaltigen Abfallprodukte |
JP4559289B2 (ja) * | 2005-04-28 | 2010-10-06 | 株式会社荏原製作所 | 酸素溶解装置及び酸素溶解方法 |
JP5524453B2 (ja) * | 2008-05-15 | 2014-06-18 | Sumco Techxiv株式会社 | シリコンウェーハのエッチング方法及びエッチング装置 |
-
2011
- 2011-10-08 SG SG11201401219WA patent/SG11201401219WA/en unknown
- 2011-10-08 EP EP20110832088 patent/EP2764138B1/de active Active
- 2011-10-08 CN CN201180075364.0A patent/CN103975096B/zh active Active
- 2011-10-08 KR KR1020147010615A patent/KR101587245B1/ko active IP Right Grant
- 2011-10-08 WO PCT/DE2011/001810 patent/WO2013050008A1/de active Application Filing
- 2011-10-08 US US14/350,515 patent/US20140251797A1/en not_active Abandoned
- 2011-10-08 DE DE112011105722.9T patent/DE112011105722A5/de not_active Withdrawn
- 2011-10-08 JP JP2014533763A patent/JP5711856B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
SG11201401219WA (en) | 2014-07-30 |
DE112011105722A5 (de) | 2014-06-26 |
CN103975096B (zh) | 2016-08-17 |
WO2013050008A1 (de) | 2013-04-11 |
KR20140092817A (ko) | 2014-07-24 |
JP2014528516A (ja) | 2014-10-27 |
US20140251797A1 (en) | 2014-09-11 |
EP2764138B1 (de) | 2015-04-29 |
EP2764138A1 (de) | 2014-08-13 |
KR101587245B1 (ko) | 2016-01-20 |
CN103975096A (zh) | 2014-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5711856B2 (ja) | 銅の電解エッチングを行うエッチング装置 | |
US9920434B2 (en) | Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent | |
JP3664867B2 (ja) | Pcb分解反応容器 | |
JP6921503B2 (ja) | 水処理装置、水処理システム及び水処理方法 | |
JP5214996B2 (ja) | エッチング方法 | |
KR20110102149A (ko) | 기판 처리 장치, 기판 처리 방법 및 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 | |
JP2010162519A (ja) | 排ガス処理装置および排ガス処理方法 | |
JP5675175B2 (ja) | オゾン供給装置 | |
KR102377390B1 (ko) | 유기물 함유 배수의 처리 방법 및 장치 | |
TW200302881A (en) | Electrolytic regeneration processing apparatus | |
JP5393214B2 (ja) | 銅系素材の酸洗方法 | |
CN108786412B (zh) | 一种络合体系与射流联用氧化去除磷化氢的方法 | |
JPH02267288A (ja) | エッチング液再生装置 | |
JPWO2007123198A1 (ja) | 基板処理装置及び基板製造方法 | |
JP4235710B2 (ja) | ブラインドビアホールを有する基板のビアフィリングめっき方法およびその装置 | |
JP2017000940A (ja) | 地下水の処理方法および地下水の処理装置 | |
US20230249994A1 (en) | Controllable advanced decomposition equipment for industrial process-water containing non-biodegradable organics and in-organics | |
JP2005179736A (ja) | 電解銅めっき方法及び電解銅めっき装置 | |
JP4126381B2 (ja) | オゾン散気装置 | |
JP3418100B2 (ja) | エッチング方法 | |
JP2022185727A (ja) | 供給液体製造装置 | |
JP2003094076A (ja) | 水のオゾン処理方法 | |
JP2013049037A (ja) | スライムの洗浄方法 | |
JP2005307330A (ja) | 一時保管装置 | |
JP2009262028A (ja) | オゾン溶液の処理方法及びオゾン溶液の処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150226 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150303 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150306 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5711856 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |