JP5701768B2 - LED light source assembly with heat sink and thermally conductive glass cover - Google Patents
LED light source assembly with heat sink and thermally conductive glass cover Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims description 42
- 238000000034 method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000005357 flat glass Substances 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000004313 glare Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Description
本出願は、2008年11月18日に出願された米国仮特許出願第61/115790号に関するものであり、その仮特許出願の優先権日を主張する。さらに、本出願は、2008年12月14日に出願された米国仮特許出願第61/122379号に関する。 This application is related to US Provisional Patent Application No. 61/115790 filed on Nov. 18, 2008 and claims the priority date of the provisional patent application. Furthermore, this application is related to US Provisional Patent Application No. 61/122379 filed on Dec. 14, 2008.
本出願は、LED照明に関し、より詳細には、LED照明用の反射体とヒートシンクのアセンブリに関する。 The present application relates to LED lighting and, more particularly, to a reflector and heat sink assembly for LED lighting.
LED照明は、蛍光灯照明と同様に効率的になってきており、また、価格競争力もある。しかしながら、技術に対して固有で、変更することができないLED装置構成については技術的課題がある。 LED lighting is becoming as efficient as fluorescent lighting and is also price competitive. However, there is a technical problem with LED device configurations that are unique to the technology and cannot be changed.
従来技術として、丸い特徴(round nature)のLED本体に散光用レンズを組み込んだLEDをあげることができる。他にも、平坦な表面を備えた細長部にLEDを有するものもある。本発明は両方の技術に適用可能である。 As a prior art, an LED in which a diffuser lens is incorporated in an LED body having a round feature can be cited. Others have LEDs in the elongated section with a flat surface. The present invention is applicable to both techniques.
既知のLED装置の製造業者らは全て、持続的で効率的なLED照明を製造する場合、何らかの形態の強力な冷却を使用する必要がある。特にこれは、赤道から±30度前後の緯度の暑い国で使用する場合に当てはまる。 All known LED device manufacturers need to use some form of strong cooling when producing sustained and efficient LED lighting. This is especially true when used in hot countries with latitudes around ± 30 degrees from the equator.
本発明によると、熱放散を大幅に改善し、熱接合性能を向上することができる。 According to the present invention, heat dissipation can be greatly improved, and thermal bonding performance can be improved.
用語「LED」とは、1以上の発光ダイオードを含む光源部品、かかる光源部品を1以上含む照明モジュール、及び、かかる照明モジュールを複数含む照明システムを意味する。 The term “LED” means a light source component including one or more light emitting diodes, an illumination module including one or more such light source components, and an illumination system including a plurality of such illumination modules.
用語「LED光源」とは、1以上の発光ダイオード、及び、発光ダイオードと散光器の組み合わせを意味する。 The term “LED light source” means one or more light emitting diodes and a combination of light emitting diodes and diffusers.
用語「LEDアセンブリ」とは、ヒートシンクと伝導性ガラス製カバー部品と組み合わせた、1以上のLED光源部品を意味する。 The term “LED assembly” refers to one or more LED light source components combined with a heat sink and a conductive glass cover component.
用語「頂部」と「底部」とは、ヒートシンクをLED光源の下方とした時の上向きの方向性に対するものである。具体的には、アセンブリは、光が上方向に発せられるその上向きの方向性で使用してもよく、又は、天井照明固定具などの光が下方向に発せられる下向きの方向性で使用してもよく、又は、広告用掲示板照明などの水平を基準として角度を付けてアセンブリを設けた用途で使用してもよい。 The terms “top” and “bottom” are for upward orientation when the heat sink is below the LED light source. Specifically, the assembly may be used in its upward direction where light is emitted upwards, or used in a downward direction where light is emitted downwards, such as ceiling lighting fixtures. Alternatively, it may be used in an application in which an assembly is provided at an angle with respect to the horizontal, such as advertising billboard lighting.
本発明の一実施形態では、熱伝導性ガラスをLEDのためのカバープレートとして使用し、反射体ヒートシンクに機械的に固定して、LED冷却性能を向上し、発光面を増加させる。増加した発光面は、グレアを低減する。一例では、スプリングワイヤの1以上の部分を反射体の孔に挿入して、LEDに対して熱伝導性ガラスを保持するための圧縮力を提供する。 In one embodiment of the present invention, thermally conductive glass is used as a cover plate for an LED and mechanically secured to a reflector heat sink to improve LED cooling performance and increase the light emitting surface. The increased light emitting surface reduces glare. In one example, one or more portions of the spring wire are inserted into the holes in the reflector to provide a compressive force to hold the thermally conductive glass against the LED.
熱伝導性のガラス部品を使用することによって、いくつかの効果を達成することができる。その一例を以下に列挙する。
a)ガラスによって冷却ヒートシンクに対して個別のLED又はLEDのグループを押圧することができるので、最適な接合接触が可能となる。
b)耐食性材料を付加することができる。
c)接合抵抗を改善する材料を添加することができる(アルミニウム化学溶接(aluminum chemical weld))。
d)いくらかのヒートシンク機能がガラスによって追加される。
e)同時に、用途の要件に応じて、ガラスを使用してLEDが生成した光を分散することができる。
Several effects can be achieved by using thermally conductive glass parts. Some examples are listed below.
a) The individual LEDs or groups of LEDs can be pressed against the cooling heat sink by the glass, so that optimum bonding contact is possible.
b) A corrosion resistant material can be added.
c) Materials that improve the joint resistance can be added (aluminum chemical weld).
d) Some heat sink function is added by the glass.
e) At the same time, depending on the requirements of the application, the light produced by the LED can be dispersed using glass.
用途に応じて、必要とされるレンズ又は散光器の形状が異なることがある。 Depending on the application, the required lens or diffuser shape may vary.
LED光源を備えたヒートシンク反射体と、熱伝導性ガラス製カバープレート
図1A及び図1Bは、代表的な実施形態のヒートシンク反射体130と、LED光源120と、二つステンレス製スプリングワイヤ152を含む押下部材150によって所定の位置に保持されている熱伝導性ガラス製カバープレート140と、の上面斜視図と側面斜視図である。この例では、反射体であるヒートシンクは、第1と第2の上向きの側部132、134を含む。スプリングワイヤ部は、反射体ヒートシンクの側部の孔133、135に挿入される。ヒートシンクは、様々な厚さのLED光源又はカバープレートを許容できるように様々な孔を有してもよい。
Heat Sink Reflector with LED Light Source and Thermally Conductive Glass Cover Plate FIGS. 1A and 1B include a
この例では、LED光源は、単一のフラットファイン散光レンズ125によって覆われる1以上のダイオードを含む。熱伝導製ガラス製カバープレート140は、散光レンズの表面積より2〜5倍広い表面積を有する。
In this example, the LED light source includes one or more diodes covered by a single flat
平坦な熱伝導性ガラス部材140は、頂部表面と底部表面を有し、略1/16〜3/16インチ(1.6〜4.8mm)の範囲の厚さを有するIndustrex(商標名)ガラスでもよい。熱伝導性ガラス部材の頂部表面は、LED光源の散光器よりも略2〜10.5倍広い面積を有する。略1/8インチ(3.2mm)の厚さで、LED散光器の面積の5倍の面積を有する熱伝導性ガラス部材はよく機能した。
Flat thermally
押下部材として、径が0.032インチ(0.8mm)の20ゲージ、タイプ302のステンレス製スプリングワイヤ材料は効果的に機能した。他の例では、スプリングなどを押下部材を用いてもよい。 As a pressing member, a 20 gauge, type 302 stainless spring wire material with a diameter of 0.032 inch (0.8 mm) worked effectively. In another example, a pressing member such as a spring may be used.
図2Aは、他の代表的な実施形態のヒートシンク反射体130と、LED光源120と、複数のステンレス製スプリングワイヤによって所定の位置に保持されている熱伝導性ガラス製カバープレート140と、の上面斜視図である。図2Bは、図2Aの実施形態の上面図である。
FIG. 2A is a top view of another exemplary embodiment
LED光源と熱伝導性ガラス製カバープレートを有するヒートシンク反射体を有するLED照明固定具
図3は、ダイオード122と散光器124を有するLED光源120と、熱伝導性ガラス製カバープレート140と、散光レンズ82とを有する照明固定具80の一部の概略断面図である。
LED lighting fixture with heat sink reflector with LED light source and thermally conductive glass cover plate FIG. 3 shows
従来のLED光源は、通常、ダイオードと散光器を備えている。従来のLED照明固定器具は、通常、ヒートシンク反射体に装着した複数の比較的小型のLEDを備え、LED光源から離間した大型の散光レンズ82を備えている。複数のLEDを使用することにより、グレアの削減を助けている。 Conventional LED light sources typically include a diode and a diffuser. Conventional LED lighting fixtures typically include a plurality of relatively small LEDs mounted on a heat sink reflector and a large diffuser lens 82 spaced from the LED light source. The use of multiple LEDs helps reduce glare.
本発明の実施形態では、1以上のLEDをヒートシンク反射体に装着し、大型の散光レンズ82を設けている。LED散光器124の面積の2〜5倍の表面積を有する熱伝導性ガラス製カバープレート140によってさらなる光拡散を行っている。この大型カバープレートは、LED光源の点光源の「不快感(harshness)」を軽減し、オプションの固定具の散光レンズ82に到達する前に光の散光を助けている。熱伝導性ガラス製カバープレート140の頂部表面に散光パターンを設けることによって、さらに散光を促進することができる。いくつかの例では、カバープレートは、LED光源の側部から発せられる望ましくない黄色光を反射又はブロックし、LED光源用の頂部側部側のヒートシンクともなる。ある例では、カバープレートは、上向きに細かく散光するパターンを有した1/8インチのIndustrex(商標名)ガラスである。散光レンズ82は、LED光源を向いて細かく散光するパターンを有するIndustrex(商標名)ガラスでもよい。
In the embodiment of the present invention, one or more LEDs are mounted on a heat sink reflector, and a large diffuser lens 82 is provided. Further light diffusion is performed by a thermally conductive
本発明は、上述の個別の例及び実施形態に限定されない。 The invention is not limited to the individual examples and embodiments described above.
80 LED固定具
82 散光レンズ
100 LEDアセンブリ
120 LED光源
122 発光ダイオード
124 散光器
125 フラットファイン散光レンズ
126 「バルブ」散光器
130 ヒートシンク反射体
132、134 側壁
133、135 孔
140 伝導性ガラス製カバー部品
142 頂部表面
144 散光パターン144
146 底部表面
150 押下部材
152 スプリングワイヤ
80 LED fixture 82
Claims (10)
前記第1の側部と前記第2の側部の間に設けられた熱伝導性ガラス部材と、
前記ヒートシンクと前記熱伝導性ガラス部材との間に複数のダイオードを含む細長部が位置するように、前記複数のダイオードを前記第1の側部と前記第2の側部の間の前記基部の前記上部表面に配置したLED光源と、
前記第1の側部と前記第2の側部の間において、前記熱伝導性ガラス部材を前記LED光源に対して保持する圧縮力を前記細長部の長手方向の両側で提供し、前記LED光源を前記ヒートシンクに対して押圧する、少なくとも二つの押下部材と、
を備える、LEDアセンブリ。 A heat sink comprising a concave reflector with a base having an upper surface, a first side projecting upward from the base, and a second side projecting upward from the base ;
A thermally conductive glass member provided between the first side and the second side ;
The plurality of diodes are arranged on the base between the first side and the second side so that an elongated portion including a plurality of diodes is located between the heat sink and the thermally conductive glass member . An LED light source disposed on the upper surface ;
A compression force for holding the thermally conductive glass member against the LED light source between the first side portion and the second side portion is provided on both sides in the longitudinal direction of the elongated portion, and the LED light source At least two pressing members that press against the heat sink;
An LED assembly comprising:
前記ヒートシンクの前記第1の側部に設けられた第1の孔に挿入された第1のワイヤ部と、
前記ヒートシンクの前記第1の側部に設けられた第2の孔に挿入された第2のワイヤ部と、を有する、請求項2記載のLEDアセンブリ。 The wire is
A first wire portion inserted into a first hole provided in the first side of the heat sink;
The LED assembly according to claim 2 , further comprising: a second wire portion inserted into a second hole provided in the first side portion of the heat sink.
前記熱伝導性ガラス部材の頂部表面は、前記LED光源の前記散光器の表面積より2〜6倍広い面積を有する、請求項2記載のLEDアセンブリ。 The thermally conductive glass member is a flat glass member having a top surface and a bottom surface and having a thickness in the range of 1/16 to 3/16 inch (1.6 to 4.8 mm),
The LED assembly of claim 2 , wherein a top surface of the thermally conductive glass member has an area that is 2 to 6 times wider than a surface area of the diffuser of the LED light source.
上部表面を有する基部、前記基部から上方に突出した第1の側部、前記基部から上方に突出した第2の側部とにより凹形の反射性の上部表面を構成したヒートシンクを提供するステップと、
複数の発光ダイオードを含む細長部と散光器を含むLED光源を、前記第1の側部と前記第2の側部の間の前記基部の前記上部表面に配置するステップと、
頂部表面と底部表面を有し、1/16〜3/16インチ(1.6〜4.8mm)の範囲の厚さを有する平坦な熱伝導性ガラス部材であって、前記熱伝導性ガラス部材の前記頂部表面は、前記LED光源の前記散光器より5倍の面積を有する、熱伝導性ガラス部材を提供するステップと、
前記第1の側部と前記第2の側部の間において、前記熱伝導性ガラス部材を前記LED光源の上に配置して、前記LED光源からの光の散光を増加させるステップと、
前記ヒートシンクに二つの押下部材のそれぞれの第1の部分を取り付けるステップと、
前記二つの押下部材によって、前記細長部の長手方向の両側で前記LED光源に対して前記平坦な熱伝導性ガラス部材を押圧して、前記LED光源を前記ヒートシンクに押しつけ、前記LED光源から前記ヒートシンクと前記熱伝導性ガラス部材の両方への熱伝導を改善するステップとを、含む、方法。 A method for improving thermal control and diffused light properties of an LED assembly, the method comprising:
Providing a heat sink comprising a concave reflective upper surface with a base having an upper surface, a first side projecting upward from the base, and a second side projecting upward from the base ; ,
Disposing an elongated light source comprising a plurality of light emitting diodes and an LED light source comprising a diffuser on the upper surface of the base between the first side and the second side ;
A flat thermally conductive glass member having a top surface and a bottom surface and having a thickness in the range of 1/16 to 3/16 inch (1.6 to 4.8 mm), said thermally conductive glass member Providing a thermally conductive glass member, wherein the top surface of the LED light source has an area five times larger than the diffuser of the LED light source;
Between the first side and the second side , disposing the thermally conductive glass member on the LED light source to increase the scattering of light from the LED light source;
Attaching a first portion of each of two push members to the heat sink;
The two pressing members press the flat heat conductive glass member against the LED light source on both sides in the longitudinal direction of the elongated portion to press the LED light source against the heat sink, and from the LED light source to the heat sink And improving heat conduction to both of the thermally conductive glass members.
前記二つの押下部材のそれぞれに対し、前記LED光源の前記細長部の長手方向に直交する方向の一方の側部において、前記ヒートシンクの前記第1の側部に第1の孔を設けるステップと、
前記二つの押下部材のそれぞれに対し、前記LED光源の前記細長部の長手方向に直交する方向の第2の側部において、前記ヒートシンクの前記第2の側部に第2の孔を設けるステップと、
前記二つの押下部材のそれぞれの前記第1の孔と前記第2の孔にワイヤを貫通して、前記細長部の長手方向の両側で前記熱伝導性ガラス部材に前記LED光源に対する圧縮力を与えるステップと、をさらに含む、請求項7に記載の方法。 Attaching the first portion of the two pressing members to the heat sink, and pressing the flat thermally conductive glass member against the LED light source by the two pressing members;
For each of the two pressing members, the step of providing the Oite on one side in a direction perpendicular to the longitudinal direction of the elongated portion, the first hole in the first side of the heat sink of the LED light source When,
For each of the two pressing members, Oite the second side in a direction perpendicular to the longitudinal direction of the elongated portion of the LED light source, providing a second hole in the second side of the heat sink Steps,
A wire is passed through the first hole and the second hole of each of the two pressing members, and a compressive force to the LED light source is applied to the thermally conductive glass member on both longitudinal sides of the elongated portion. The method of claim 7 , further comprising:
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US11579008P | 2008-11-18 | 2008-11-18 | |
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PCT/US2009/065020 WO2010059748A1 (en) | 2008-11-18 | 2009-11-18 | Led light source assembly with heat sink and heat conductive glass cover |
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US4275433A (en) * | 1979-05-04 | 1981-06-23 | Dashglow Limited | Lighting fitting |
JP3965929B2 (en) * | 2001-04-02 | 2007-08-29 | 日亜化学工業株式会社 | LED lighting device |
KR100873068B1 (en) * | 2002-06-28 | 2008-12-11 | 삼성전자주식회사 | Back light assembly and liquid crystal display device using the same |
US6945674B2 (en) * | 2002-07-16 | 2005-09-20 | Ccs, Inc. | Light irradiating unit |
JP2004093623A (en) * | 2002-08-29 | 2004-03-25 | Olympus Corp | Illuminator and display device using the same |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
US20060091414A1 (en) * | 2004-10-29 | 2006-05-04 | Ouderkirk Andrew J | LED package with front surface heat extractor |
JP2006324199A (en) * | 2005-05-20 | 2006-11-30 | Toyota Industries Corp | Illumination device |
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JP2007134472A (en) * | 2005-11-10 | 2007-05-31 | Shinko Electric Ind Co Ltd | Heat radiating plate and semiconductor device |
US8704254B2 (en) * | 2006-12-22 | 2014-04-22 | Philips Lumileds Lighting Company, Llc | Light emitting device including a filter |
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