JP5689352B2 - Electrochemical devices - Google Patents

Electrochemical devices Download PDF

Info

Publication number
JP5689352B2
JP5689352B2 JP2011094944A JP2011094944A JP5689352B2 JP 5689352 B2 JP5689352 B2 JP 5689352B2 JP 2011094944 A JP2011094944 A JP 2011094944A JP 2011094944 A JP2011094944 A JP 2011094944A JP 5689352 B2 JP5689352 B2 JP 5689352B2
Authority
JP
Japan
Prior art keywords
lid
ring
peripheral surface
annular portion
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011094944A
Other languages
Japanese (ja)
Other versions
JP2012227418A (en
Inventor
裕樹 河井
裕樹 河井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP2011094944A priority Critical patent/JP5689352B2/en
Publication of JP2012227418A publication Critical patent/JP2012227418A/en
Application granted granted Critical
Publication of JP5689352B2 publication Critical patent/JP5689352B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Description

本発明は、充放電可能な蓄電素子を封入した電気化学デバイスに関する。   The present invention relates to an electrochemical device enclosing a chargeable / dischargeable power storage element.

携帯電話やノートパソコンやビデオカメラやデジタルカメラ等の電子機器には、メモリバックアップ等の用途に適した電源として、表面実装可能な電気化学デバイス、例えば、電気二重層キャパシタやリチウムイオンキャパシタ等が用いられている。   For electronic devices such as mobile phones, laptop computers, video cameras, and digital cameras, surface mountable electrochemical devices such as electric double layer capacitors and lithium ion capacitors are used as power sources suitable for memory backup applications. It has been.

この電気化学デバイスは、下記特許文献１〜４に開示されているように、凹部を有するケースと、ケースの上面に設けられたリッド溶接用のリングと、凹部を水密及び気密に閉塞するようにリングに溶接されたリッドと、リッドによって閉塞された凹部内に封入された充放電可能な蓄電素子及び電解液と、ケースの下面（実装面）に設けられた正極端子及び負極端子と、正極端子と蓄電素子の正極側とを電気的に接続するための正極配線と、負極端子と蓄電素子の負極側とを電気的に接続するための負極配線とを備えている。   As disclosed in Patent Documents 1 to 4 below, this electrochemical device has a case having a recess, a ring for lid welding provided on the upper surface of the case, and a recess that closes the recess in a watertight and airtight manner. A lid welded to the ring; a chargeable / dischargeable storage element and electrolyte enclosed in a recess closed by the lid; a positive electrode terminal and a negative electrode terminal provided on a lower surface (mounting surface) of the case; and a positive electrode terminal And a positive electrode wiring for electrically connecting the positive electrode side of the energy storage device and a negative electrode wiring for electrically connecting the negative electrode terminal and the negative electrode side of the energy storage device.

ところで、リングに対するリッドの溶接には、通常、シーム溶接やレーザ溶接が用いられているが、何れの溶接もリング及びリッドの一部を溶融させるステップを含むことから、該溶融ステップにおけるリッドの変位を原因として該リッドに位置ずれを生じることがある。この位置ずれ量が適正範囲内にあれば特段の問題は生じないが、位置ずれ量が該適正範囲を超えると、蓄電素子の態様異常に伴う充放電特性の低下や電解液の漏出に伴う機能障害等の問題を生じ得る。要するに、リッドがケースのリングに対して位置ずれ無く結合された電気化学デバイスが得られれば、リッドの位置ずれを原因として生じ得る諸問題を未然に防止できる。   Incidentally, seam welding or laser welding is usually used for welding the lid to the ring. However, since each welding includes a step of melting a part of the ring and the lid, the displacement of the lid in the melting step. As a result, the lid may be displaced. If this amount of misalignment is within the appropriate range, no particular problem will occur, but if the amount of misalignment exceeds this proper range, the function associated with the deterioration of charge / discharge characteristics accompanying the abnormal state of the storage element and the leakage of the electrolyte Problems such as obstacles can occur. In short, if an electrochemical device is obtained in which the lid is bonded to the ring of the case without displacement, problems that may occur due to displacement of the lid can be prevented.

特開２００９−２７８０６８号公報JP 2009-278068 A 特開２００６−２２２２２１号公報JP 2006-222221 A 特開２００６−２２２２２１号公報JP 2006-222221 A 特開２００６−２２２２２１号公報JP 2006-222221 A

本発明の目的は、ケースのリングに対してリッドが位置ずれ無く結合された電気化学デバイスを提供することにある。   An object of the present invention is to provide an electrochemical device in which a lid is bonded to a ring of a case without displacement.

前記目的を達成するため、本発明は、凹部を有するケースと、前記ケースの上面に設けられたリングと、前記凹部を水密及び気密に閉塞するように前記リングに結合されたリッドと、前記リッドによって閉塞された前記凹部内に封入された充放電可能な蓄電素子及び電解液とを備えた電気化学デバイスにおいて、前記リッドは該リッドに一体形成された環状部の内周面が前記リングの外周面に密着するように焼き嵌めされている、ことをその特徴とする。   To achieve the above object, the present invention provides a case having a recess, a ring provided on an upper surface of the case, a lid coupled to the ring so as to close the recess in a watertight and airtight manner, and the lid In the electrochemical device comprising a chargeable / dischargeable power storage element and an electrolyte solution enclosed in the recess closed by the inner surface of the ring, the inner peripheral surface of the annular portion formed integrally with the lid is the outer periphery of the ring It is characterized by being shrink-fitted so as to be in close contact with the surface.

本発明によれば、リッドは該リッドに一体形成された環状部の内周面がリングの外周面に密着するように焼き嵌めされており、環状部が位置決め手段として機能していることも相俟って該リッドがケースのリングに対して位置ずれ無く結合されているため、リッドの位置ずれを原因として生じ得る諸問題、例えば、蓄電素子の態様異常に伴う充放電特性の低下や電解液の漏出に伴う機能障害等の問題を未然に防止できる。   According to the present invention, the lid is shrink-fitted so that the inner peripheral surface of the annular portion integrally formed with the lid is in close contact with the outer peripheral surface of the ring, and the annular portion functions as positioning means. As a result, since the lid is coupled to the ring of the case without misalignment, various problems that may occur due to misalignment of the lid, for example, deterioration of charge / discharge characteristics due to abnormal state of the storage element, electrolyte solution It is possible to prevent problems such as functional failures due to leakage of the product.

本発明の前記目的とそれ以外の目的と、構成特徴と、作用効果は、以下の説明と添付図面によって明らかとなる。   The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

図１は、本発明を適用した電気化学デバイスの外観斜視図である。FIG. 1 is an external perspective view of an electrochemical device to which the present invention is applied. 図２は、図１に示した電気化学デバイスのＳ１１−Ｓ１１線に沿う拡大断面図である。FIG. 2 is an enlarged cross-sectional view taken along line S11-S11 of the electrochemical device shown in FIG. 図３は、図１に示したケースの拡大上面図である。FIG. 3 is an enlarged top view of the case shown in FIG. 図４（Ａ）は、図１に示したリッドの焼き嵌め前の拡大断面図、図４（Ｂ）は、図４（Ａ）に示したリッドの拡大下面図である。4A is an enlarged cross-sectional view of the lid shown in FIG. 1 before shrink fitting, and FIG. 4B is an enlarged bottom view of the lid shown in FIG. 4A. 図５は、図１に示したリッドの焼き嵌め手順の説明図である。FIG. 5 is an explanatory view of the lid shrink-fitting procedure shown in FIG. 図６（Ａ）及び図６（Ｂ）は、図４に示した焼き嵌め前のリッドの第１形状変形例を示すもので、図６（Ａ）は、焼き嵌め前のリッドの拡大断面図、図６（Ｂ）は、図６（Ａ）に示したリッドの拡大下面図である。6 (A) and 6 (B) show a first shape modification example of the lid before shrink fitting shown in FIG. 4, and FIG. 6 (A) is an enlarged sectional view of the lid before shrink fitting. 6 (B) is an enlarged bottom view of the lid shown in FIG. 6 (A). 図７（Ａ）及び図７（Ｂ）は、図４に示した焼き嵌め前のリッドの第２形状変形例を示すもので、図７（Ａ）は、焼き嵌め前のリッドの拡大断面図、図７（Ｂ）は、図７（Ａ）に示したリッドの拡大下面図である。7 (A) and 7 (B) show a second shape modification example of the lid before shrink fitting shown in FIG. 4, and FIG. 7 (A) is an enlarged sectional view of the lid before shrink fitting. 7 (B) is an enlarged bottom view of the lid shown in FIG. 7 (A).

《本発明を適用した電気化学デバイス１０》
図１及び図２は、本発明を適用した電気化学デバイスを示す。同図に示した電気化学デバイス１０は、ケース１１と、リッド１２と、蓄電素子１３と、正極端子１４と、負極端子１５と、正極配線１６と、負極配線１７と備えており、ケース１１には、正極端子１４と負極端子１５と正極配線１６と負極配線１７が設けられている他、リッド結合用リング１８と集電膜１９が設けられている。 << Electrochemical Device 10 Applying the Present Invention >>
1 and 2 show an electrochemical device to which the present invention is applied. The electrochemical device 10 shown in the figure includes a case 11, a lid 12, a power storage element 13, a positive electrode terminal 14, a negative electrode terminal 15, a positive electrode wiring 16, and a negative electrode wiring 17. In addition to the positive electrode terminal 14, the negative electrode terminal 15, the positive electrode wiring 16, and the negative electrode wiring 17, a lid coupling ring 18 and a current collecting film 19 are provided.

〈ケース１１の構成〉
ケース１１は、アルミナ等の絶縁性材料から、所定の長さ、幅及び高さを有する直方体形状を成すように形成されており、その下面が実装面として利用される。また、ケース１１には、矩形状の開口輪郭を有し、且つ、所定の深さを有する凹部１１ａが形成されている。さらに、ケース１１を上から見たときの４つの角部には、上面輪郭が略１／４円を成す切り欠き１１ｂが上下方向に形成されている。 <Configuration of case 11>
The case 11 is formed of an insulating material such as alumina so as to form a rectangular parallelepiped shape having a predetermined length, width, and height, and its lower surface is used as a mounting surface. In addition, the case 11 has a recess 11a having a rectangular opening contour and a predetermined depth. Further, at the four corners when the case 11 is viewed from above, cutouts 11b whose upper surface outline forms a substantially ¼ circle are formed in the vertical direction.

正極端子１４は、金等の導電性材料から、ケース１１の長さ方向の一端面の中央から下面に及ぶ断面Ｌ字形を成すように、且つ、所定の幅を有するように形成されている。負極端子１５は、金等の導電性材料から、ケース１１の長さ方向の他端面の中央から下面に及ぶ断面Ｌ字形を成すように、且つ、正極端子１４と略同じ幅を有するように形成されている。   The positive electrode terminal 14 is formed of a conductive material such as gold so as to form an L-shaped cross section extending from the center of the end surface in the length direction of the case 11 to the lower surface and having a predetermined width. The negative electrode terminal 15 is formed of a conductive material such as gold so as to form an L-shaped cross section extending from the center of the other end surface in the length direction of the case 11 to the lower surface, and has substantially the same width as the positive electrode terminal 14. Has been.

図示を省略したが、ケース１１の材料等を原因として、該ケース１１の側面及び下面に正極端子１４及び負極端子１５を直接形成しても十分な密着力が得られない場合には、該密着力を高めるための密着補助層（例えば、ケース１１側から順にタングステン膜とニッケル膜とが並ぶもの等）を予めケース１１の側面及び下面の端子形成位置に形成しておくと良い。   Although not shown in the drawings, if sufficient adhesion cannot be obtained even if the positive electrode terminal 14 and the negative electrode terminal 15 are directly formed on the side surface and the lower surface of the case 11 due to the material of the case 11 or the like, the adhesion A close adhesion auxiliary layer (for example, a film in which a tungsten film and a nickel film are arranged in order from the case 11 side) for increasing the force may be formed in advance at the terminal formation positions on the side surface and the lower surface of the case 11.

正極配線１６は、タングステン等の導電性材料から、ケース１１の長さ方向の一端面の中央から集電膜１９の下面に至るように該ケース１１の内部に形成されている。詳しくは、図３に示したように、正極配線１６は、正極端子１４と略同じ幅を有する矩形状部（符号無し）と、該矩形状部から内側に延びる計３本の帯状部１６ａと、各帯状部１６ａの端から集電膜１９に向かって延びる計３個の柱状部１６ｂとを有している。また、各柱状部１６ｂの位置は、ケース１１の凹部１１ａの底面１１ａ１において異なっている。さらに、矩形状部におけるケース１１の長さ方向の一端面から露出する部分は、正極端子１４の側面部分に電気的に接続されており、各柱状部１６ｂの上端は、集電膜１９の下面に電気的に接続されている。   The positive electrode wiring 16 is formed inside the case 11 from a conductive material such as tungsten so as to reach the lower surface of the current collecting film 19 from the center of one end surface in the length direction of the case 11. Specifically, as shown in FIG. 3, the positive electrode wiring 16 includes a rectangular portion (no reference) having substantially the same width as the positive electrode terminal 14, and a total of three strip portions 16 a extending inward from the rectangular portion. And a total of three columnar portions 16b extending from the end of each band-shaped portion 16a toward the current collecting film 19. Further, the positions of the columnar portions 16 b are different on the bottom surface 11 a 1 of the recess 11 a of the case 11. Furthermore, a portion of the rectangular portion exposed from one end surface in the length direction of the case 11 is electrically connected to a side surface portion of the positive electrode terminal 14, and the upper end of each columnar portion 16 b is the lower surface of the current collector film 19. Is electrically connected.

図示を省略したが、正極配線１６の各柱状部１６ｂの材料等を原因として、該各柱状部１６ｂの上端と集電膜１９の下面とに十分な導通性が得られない場合には、該導通性を高めるための導通補助層（例えば、各柱状部１６ｂの上端側から順にニッケル膜と金膜が並ぶもの等）を予め各柱状部１６ｂの上端に形成しておくと良い。   Although not shown in the drawings, due to the material of each columnar portion 16b of the positive electrode wiring 16 and the like, when sufficient conductivity is not obtained between the upper end of each columnar portion 16b and the lower surface of the current collector film 19, A conduction auxiliary layer (for example, a nickel film and a gold film arranged in order from the upper end side of each columnar portion 16b) for improving conductivity may be formed in advance on the upper end of each columnar portion 16b.

負極配線１７は、タングステン等の導電性材料から、ケース１１の長さ方向の他端面の中央から該ケース１１の上面に至るようにその一部がケース１１の内部に形成され他部がケース１１の側面及び上面に形成されている。詳しくは、図３に示したように、負極配線１７は、負極端子１５と略同じ幅を有しケース１１内に位置する矩形状部（符号無し）と、該矩形状部から外側に延びケース１１内に位置する計２本の帯状部１７ａと、各帯状部１７ａと連続してケース１１の２つの切り欠き１１ｃの内面上に位置する計２本の帯状部１７ｂと、各帯状部１７ｂと連続してケース１１の上面上に位置する計２個の扇状部１７ｃとを有している。また、矩形状部におけるケース１１の長さ方向の他端面から露出する部分は、負極端子１５の側面部分に電気的に接続され、各扇状部１７ｃの上面は、リング１８の下面に電気的に接続されている。   A part of the negative electrode wiring 17 is formed inside the case 11 from a conductive material such as tungsten to reach the upper surface of the case 11 from the center of the other end surface in the length direction of the case 11, and the other part is the case 11. Are formed on the side surface and the upper surface. Specifically, as shown in FIG. 3, the negative electrode wiring 17 has a rectangular portion (not indicated) having substantially the same width as the negative electrode terminal 15 and positioned in the case 11, and a case extending outward from the rectangular portion. 11, a total of two strips 17a located in the inner surface of the two notches 11c of the case 11 continuously with each strip 17a, and each strip 17b. It has a total of two fan-shaped parts 17c located on the upper surface of the case 11 continuously. Further, the portion of the rectangular portion exposed from the other end surface in the length direction of the case 11 is electrically connected to the side surface portion of the negative electrode terminal 15, and the upper surface of each fan-shaped portion 17 c is electrically connected to the lower surface of the ring 18. It is connected.

リング１８は、コバール（鉄−ニッケル−コバルト合金）等の導電性材料から、ケース１１の上面輪郭よりも小さな矩形状の上面輪郭を有するように形成されている。また、リング１８は矩形状の開口輪郭を有する内孔１８ａを有しており、該内孔１８ａの開口輪郭はケース１１の凹部１１ａの開口輪郭と略一致している。このリング１８は、内孔１８ａが凹部１１ａと略合致するようにその下面をケース１１の上面に接合材を介して接合されているため、該内孔１８ａは凹部１１ａの上部と利用されている（以下、リング１８の内孔１８ａを含めてケース１１の凹部１１ａと称する）。   The ring 18 is formed of a conductive material such as Kovar (iron-nickel-cobalt alloy) so as to have a rectangular upper surface contour smaller than the upper surface contour of the case 11. The ring 18 has an inner hole 18 a having a rectangular opening contour, and the opening contour of the inner hole 18 a substantially coincides with the opening contour of the recess 11 a of the case 11. Since the ring 18 has its lower surface joined to the upper surface of the case 11 via a bonding material so that the inner hole 18a substantially coincides with the recess 11a, the inner hole 18a is used as the upper part of the recess 11a. (Hereinafter referred to as the recess 11a of the case 11 including the inner hole 18a of the ring 18).

図示を省略したが、ケース１１の材料等を原因として、該ケース１１の上面にリング１８の下面を接合材、例えば、金−銅合金等のロウ材を用いて直接接合しても十分な接合力が得られない場合には、該接合力を高めるための接合補助層（例えば、ケース１１の上面側から順にタングステン膜とニッケル膜とが順に並ぶもの等）を予めケース１１の上面のリング接合位置に形成しておくと良い。また、リング１８が電解液に対する耐食性が低い材料から成る場合には、該耐食性を高めるための耐食性膜（例えば、リング１８の表面側からニッケル膜と金膜が順に並ぶものや、この金膜を白金や銀やパラジウム等の他の金属膜に変えたもの等）を予めリング１８の表面（少なくとも上下面と内孔１８ａの内周面）に形成しておくと良い。   Although not shown, sufficient bonding is possible even if the lower surface of the ring 18 is directly bonded to the upper surface of the case 11 using a bonding material, for example, a brazing material such as a gold-copper alloy, due to the material of the case 11 or the like. When a force cannot be obtained, a bonding auxiliary layer for increasing the bonding force (for example, a tungsten film and a nickel film arranged in order from the upper surface side of the case 11) is previously ring-bonded to the upper surface of the case 11. It is good to form in position. Further, when the ring 18 is made of a material having low corrosion resistance to the electrolytic solution, a corrosion resistant film for improving the corrosion resistance (for example, a nickel film and a gold film arranged in order from the surface side of the ring 18, It is preferable to form in advance the surface of the ring 18 (at least the upper and lower surfaces and the inner peripheral surface of the inner hole 18a).

集電膜１９は、アルミニウム等の導電性材料から、ケース１１の凹部１１ａの底面１１ａ１に形成されており、その矩形状の上面輪郭は後記第１電極シート１３ａの下面輪郭と略一致している。この集電膜１９の形成には、該集電膜１９の材料やケース１１の材料等に応じて、溶射等の厚膜形成手法の他、ＣＶＤ等の薄膜形成手法を利用できる。   The current collecting film 19 is formed of a conductive material such as aluminum on the bottom surface 11a1 of the recess 11a of the case 11, and the rectangular upper surface contour thereof substantially coincides with the lower surface contour of the first electrode sheet 13a described later. . For the formation of the current collecting film 19, a thin film forming technique such as CVD can be used in addition to a thick film forming technique such as thermal spraying according to the material of the current collecting film 19 and the material of the case 11.

図示を省略したが、集電膜１９の上面輪郭は、後記第１電極シート１３ａの下面輪郭よりも小さくても大きくても良い。また、集電膜１９の上面輪郭は矩形状に限らず、矩形の４つの角に丸みがある形状や楕円または楕円に近い形状等であっても良い。   Although not shown, the upper surface contour of the current collector film 19 may be smaller or larger than the lower surface contour of the first electrode sheet 13a described later. Further, the upper surface contour of the current collecting film 19 is not limited to a rectangular shape, and may be a shape with rounded corners, an ellipse, or a shape close to an ellipse.

〈リッド１２の構成〉
リッド１２は、コバール（鉄−ニッケル−コバルト合金）等の導電体材料から、好ましくは、コバール母材の上下面にニッケル膜を有するクラッド材やコバール母材の下面にニッケル膜を有するクラッド材や、これらのニッケル膜を白金や銀や金やパラジウム等の金属膜に変えたクラッド材等から、リング１８の上面輪郭よりも大きな矩形状の上面輪郭を有するように形成されている。また、リッド１２の下面外周部分には、矩形状の下面輪郭を有する環状部１２ａが一体に形成されていて、該環状部１２ａの内周面１２ａ１は後記焼き嵌めによってリング１８の外周面１８ｂに密着しており、該密着によってリッド１２はリング１８に電気的に接続されている。図面には、リッド１２の上面中央部分が矩形状に盛り上がったものを示してあるが、平板状のものを該リッド１２として用いても良い。 <Configuration of lid 12>
The lid 12 is made of a conductive material such as Kovar (iron-nickel-cobalt alloy), preferably a clad material having a nickel film on the upper and lower surfaces of the Kovar base material, a clad material having a nickel film on the lower surface of the Kovar base material, The nickel film is formed of a clad material obtained by changing the nickel film into a metal film such as platinum, silver, gold, or palladium so as to have a rectangular upper surface contour larger than the upper surface contour of the ring 18. An annular portion 12a having a rectangular lower surface contour is integrally formed on the outer peripheral portion of the lower surface of the lid 12. The inner peripheral surface 12a1 of the annular portion 12a is formed on the outer peripheral surface 18b of the ring 18 by shrink fitting described later. The lid 12 is electrically connected to the ring 18 by the contact. In the drawing, the central portion of the upper surface of the lid 12 is shown to be raised in a rectangular shape, but a flat plate may be used as the lid 12.

ここで、焼き嵌め前のリッド１２’の環状部１２ａの内周面１２ａ１の寸法等を、リング１８の外周面１８ｂの寸法等と交えて説明する。   Here, the dimensions and the like of the inner peripheral surface 12a1 of the annular portion 12a of the lid 12 'before shrink fitting will be described together with the dimensions and the like of the outer peripheral surface 18b of the ring 18.

図２及び図３に示したように、リング１８の外周面１８ｂは所定の高さＨ１８ｂと長さＬ１８ｂと幅Ｗ１８ｂとを有しており、外周面１８ｂと上面とが成す角度θ１８ｂは略９０度である。リング１８の内周面１８ｂの高さＨ１８ｂと、リング１８の太さ（外周面１８ｂと内孔１８ａの内周面との間の寸法を指す）は、後記焼き嵌めに強度的に耐え得る範囲であれば特段の制限は無い。   2 and 3, the outer peripheral surface 18b of the ring 18 has a predetermined height H18b, length L18b, and width W18b, and an angle θ18b formed by the outer peripheral surface 18b and the upper surface is approximately 90. Degree. The height H18b of the inner peripheral surface 18b of the ring 18 and the thickness of the ring 18 (which refers to the dimension between the outer peripheral surface 18b and the inner peripheral surface of the inner hole 18a) are within a range that can withstand shrink fitting as described later. If so, there is no particular limitation.

一方、図４（Ａ）及び図４（Ｂ）に示したように、焼き嵌め前のリッド１２’の環状部１２ａの内周面１２ａ１は、リング１８の外周面１８ｂの高さＨ１８ｂと略一致した高さＨ１２ａ１と、リング１８の外周面１８ｂの長さＬ１８ｂよりも僅かに小さな長さＬ１２ａ１と、リング１８の外周面１８ｂの幅Ｗ１８ｂよりも僅かに小さな幅Ｗ１２ａ１とを有しており、内周面１２ａ１とリング１８の上面と向き合う面とが成す角度θ１２ａ１は略９０度である。焼き嵌め前のリッド１２’の環状部１２ａの内周面１２ａ１の高さＨ１２ａ１と、環状部１２ａを含むリッド１２の厚さは、後記焼き嵌めに伴う膨張及び収縮が実現できる範囲であれば特段の制限は無い。   On the other hand, as shown in FIGS. 4 (A) and 4 (B), the inner peripheral surface 12a1 of the annular portion 12a of the lid 12 ′ before shrink fitting is substantially coincident with the height H18b of the outer peripheral surface 18b of the ring 18. The height H12a1, the length L12a1 slightly smaller than the length L18b of the outer peripheral surface 18b of the ring 18, and the width W12a1 slightly smaller than the width W18b of the outer peripheral surface 18b of the ring 18. An angle θ12a1 formed by the surface 12a1 and the surface facing the upper surface of the ring 18 is approximately 90 degrees. The height H12a1 of the inner peripheral surface 12a1 of the annular portion 12a of the lid 12 ′ before shrink fitting and the thickness of the lid 12 including the annular portion 12a are special if they are within a range where expansion and contraction associated with shrink fitting described later can be realized. There is no limit.

〈蓄電素子１３の構成〉
蓄電素子１３は、矩形状の第１電極シート１３ａと、矩形状の第２電極シート１３ｂと、両電極シート１３ａ及び１３ｂの間に介装された矩形状のセパレートシート１３ｃと、から構成されている。 <Configuration of power storage element 13>
The power storage element 13 includes a rectangular first electrode sheet 13a, a rectangular second electrode sheet 13b, and a rectangular separate sheet 13c interposed between the electrode sheets 13a and 13b. Yes.

第１電極シート１３ａの下面輪郭は、ケース１１の凹部１１ａの上面輪郭よりも小さい。第２電極シート１３ｂの上面輪郭は、ケース１１の凹部１１ａの上面輪郭よりも小さく、且つ、第１電極シート１３ａの下面輪郭と略一致している。セパレートシート１３ｃの上面輪郭は、ケース１１の凹部１１ａの上面輪郭よりも僅かに小さく、且つ、第１電極シート１３ａの下面輪郭及び第２電極シート１３ｂの上面輪郭よりも僅かに大きい。   The lower surface contour of the first electrode sheet 13 a is smaller than the upper surface contour of the recess 11 a of the case 11. The upper surface contour of the second electrode sheet 13b is smaller than the upper surface contour of the concave portion 11a of the case 11, and substantially coincides with the lower surface contour of the first electrode sheet 13a. The upper surface contour of the separate sheet 13c is slightly smaller than the upper surface contour of the recess 11a of the case 11, and is slightly larger than the lower surface contour of the first electrode sheet 13a and the upper surface contour of the second electrode sheet 13b.

また、第１電極シート１３ａ及び第２電極シート１３ｂは活性炭や黒鉛（グラファイト）やＰＡＳ（ポリアセン系半導体）等の活物質から成り、セパレートシート１３ｃはガラス繊維やセルロース繊維やプラチック繊維等を主材料とした多孔質シートから成る。因みに、第１電極シート１３ａと第２電極シート１３ｂの材料は電気化学デバイス１０の種類によって同じ場合と異なる場合とがあり、例えば、電気化学デバイス１０が電気二重層キャパシタの場合は第１電極シート１３ａと第２電極シート１３ｂの材料は同じで、電気化学デバイス１０がリチウムイオンキャパシタの場合は第１電極シート１３ａと第２電極シート１３ｂの材料は異なる。   The first electrode sheet 13a and the second electrode sheet 13b are made of an active material such as activated carbon, graphite, or PAS (polyacenic semiconductor), and the separate sheet 13c is mainly made of glass fiber, cellulose fiber, plastic fiber, or the like. It consists of a porous sheet. Incidentally, the materials of the first electrode sheet 13a and the second electrode sheet 13b may be the same or different depending on the type of the electrochemical device 10, for example, the first electrode sheet when the electrochemical device 10 is an electric double layer capacitor. The material of 13a and the 2nd electrode sheet 13b is the same, and when the electrochemical device 10 is a lithium ion capacitor, the material of the 1st electrode sheet 13a and the 2nd electrode sheet 13b differs.

この蓄電素子１３は、リッド１２によって閉塞されたケース１１の凹部１１ａの内側に、図示省略の電解液と一緒に封入されている。因みに、電解液の組成は電気化学デバイス１０の種類によって異なり、例えば、電気化学デバイス１０が電気二重層キャパシタの場合は電解質塩が溶媒に溶解した電解液が用いられ、電気化学デバイス１０がリチウムイオンキャパシタの場合はリチウム塩が溶媒に溶解した電解液が用いられる。   The electricity storage element 13 is enclosed together with an electrolyte solution (not shown) inside the recess 11 a of the case 11 closed by the lid 12. Incidentally, the composition of the electrolytic solution varies depending on the type of the electrochemical device 10. For example, when the electrochemical device 10 is an electric double layer capacitor, an electrolytic solution in which an electrolyte salt is dissolved in a solvent is used. In the case of a capacitor, an electrolytic solution in which a lithium salt is dissolved in a solvent is used.

蓄電素子１３を構成する第１電極シート１３ａと第２電極シート１３ｂに使用時の極性が定まっていない場合（例えば、電気化学デバイス１０が電気二重層キャパシタの場合）、即ち、第１電極シート１３ａを正極と負極の一方として選択的に使用でき、且つ、第２電極シート１３ｂを正極と負極の他方として選択的に使用できる場合には、ケース１１の凹部１１ａの内側に蓄電素子１３を配置するときにその挿入順序を気にする必要は無い。   When the polarity at the time of use is not fixed to the 1st electrode sheet 13a and the 2nd electrode sheet 13b which comprise electrical storage element 13, (for example, when electrochemical device 10 is an electric double layer capacitor), ie, 1st electrode sheet 13a Can be selectively used as one of the positive electrode and the negative electrode, and the second electrode sheet 13b can be selectively used as the other of the positive electrode and the negative electrode, the storage element 13 is disposed inside the recess 11a of the case 11. Sometimes you don't have to worry about the order of insertion.

一方、蓄電素子１３を構成する第１電極シート１３ａと第２電極シート１３ｂに使用時の極性が予め定まっている場合（例えば、電気化学デバイス１０がリチウムイオンキャパシタの場合）は、ケース１１の凹部１１ａの内側に蓄電素子１３を配置するときにその挿入順序に注意する。例えば、第１電極シート１３ａの極性が正極に定められ、且つ、第２電極シート１３ｂの極性が負極に定められている場合には、正極側の第１電極シート１３ａが集電膜１９の上面と向き合い、且つ、負極側の第２電極シート１３ｂがリッド１２の下面と向き合うようにする。   On the other hand, when the polarity at the time of use is predetermined in the 1st electrode sheet 13a and the 2nd electrode sheet 13b which comprise the electrical storage element 13, (for example, when the electrochemical device 10 is a lithium ion capacitor), it is a recessed part of case 11 Attention should be paid to the insertion order when the storage element 13 is arranged inside 11a. For example, when the polarity of the first electrode sheet 13 a is set to the positive electrode and the polarity of the second electrode sheet 13 b is set to the negative electrode, the first electrode sheet 13 a on the positive electrode side is the upper surface of the current collector film 19. And the second electrode sheet 13b on the negative electrode side faces the lower surface of the lid 12.

図２から分かるように、蓄電素子１３の第１電極シート１３ａの下面は、第１導電性接着層２０を介して集電膜１９の上面に電気的に接続されている。一方、蓄電素子１３の第２電極シート１３ｂの上面は、第２導電性接着層２１を介して該リッド１２の下面に電気的に接続されている。第１導電性接着層２０及び第２導電性接着層２１は導電性接着剤の硬化物であり、該導電性接着剤には、好ましくは、導電性粒子を含有した熱硬化性接着剤、例えば、炭素粒子（カーボンブラック）や黒鉛粒子（グラファイト粒子）等を含有したエポキシ系接着剤等が利用できる。   As can be seen from FIG. 2, the lower surface of the first electrode sheet 13 a of the electricity storage element 13 is electrically connected to the upper surface of the current collector film 19 via the first conductive adhesive layer 20. On the other hand, the upper surface of the second electrode sheet 13 b of the electric storage element 13 is electrically connected to the lower surface of the lid 12 through the second conductive adhesive layer 21. The first conductive adhesive layer 20 and the second conductive adhesive layer 21 are cured products of a conductive adhesive, and the conductive adhesive preferably includes a thermosetting adhesive containing conductive particles, for example, Epoxy adhesives containing carbon particles (carbon black), graphite particles (graphite particles), and the like can be used.

〈電気化学デバイス１０の組立方法〉
以下、ケース１１のリング１８とリッド１２がコバール（鉄−ニッケル−コバルト合金）で、第１導電性接着層２０と第２導電性接着層２１が炭素粒子（カーボンブラック）を含有したエポキシ系接着剤の硬化物である場合を例に挙げて、図１及び図２に示した電気化学デバイス１０の組み立て方法について説明する。 <Assembly method of electrochemical device 10>
Hereinafter, the epoxy adhesive in which the ring 18 and the lid 12 of the case 11 are made of Kovar (iron-nickel-cobalt alloy), and the first conductive adhesive layer 20 and the second conductive adhesive layer 21 contain carbon particles (carbon black). A method for assembling the electrochemical device 10 shown in FIG. 1 and FIG.

図１及び図２に示した電気化学デバイス１０を組み立てるときには、図３に示したケース１１と、蓄電素子１３を構成する第１電極シート１３ａ、第２電極シート１３ｂ及びセパレートシート１３ｃと、図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’を用意する。   When assembling the electrochemical device 10 shown in FIGS. 1 and 2, the case 11 shown in FIG. 3, the first electrode sheet 13 a, the second electrode sheet 13 b, and the separate sheet 13 c constituting the power storage element 13, and FIG. 4. A lid 12 'before shrink fitting shown in (A) and FIG. 4 (B) is prepared.

そして、ケース１１の集電膜１９の上面に導電性接着剤を所定厚さで塗布し、該導電性接着剤に第１電極シート１３ａの下面を相対的に押し当てて密着させ、その後に第１電極シート１３ａを乾燥させ、且つ、導電性接着剤を硬化させる。そして、第１電極シート１３ａの上面にセパレートシート１３ｃを載置する。これに前後して、焼き嵌め前のリッド１２’の下面中央に前記と同じ導電性接着剤を所定厚さで塗布し、該導電性接着剤に第２電極シート１３ｂの上面を相対的に押し当てて密着させ、その後に第２電極シート１３ｂを乾燥させ、且つ、導電性接着剤を硬化させる。因みに、電解液の注入は、リッド１２がリング１８に結合される前の適当なタイミングで行われる。   Then, a conductive adhesive is applied to the upper surface of the current collecting film 19 of the case 11 with a predetermined thickness, the lower surface of the first electrode sheet 13a is relatively pressed against the conductive adhesive, and then the first adhesive sheet 19 The 1 electrode sheet 13a is dried and the conductive adhesive is cured. Then, a separate sheet 13c is placed on the upper surface of the first electrode sheet 13a. Before and after this, the same conductive adhesive as described above was applied to the center of the lower surface of the lid 12 ′ before shrink fitting to a predetermined thickness, and the upper surface of the second electrode sheet 13b was relatively pressed against the conductive adhesive. Then, the second electrode sheet 13b is dried and the conductive adhesive is cured. Incidentally, the injection of the electrolytic solution is performed at an appropriate timing before the lid 12 is coupled to the ring 18.

そして、図５に示したように、窒素雰囲気等の非酸化性雰囲気下で、第２電極シート１３ｂが接着されたリッド１２’を略３００℃に加熱して該リッド１２’を膨張させる。この膨張により、環状部１２ａの内周面１２ａ１の長さ（Ｌ１２ａ１）及び幅（Ｗ１２ｂ１）が図４に示した長さＬ１２ａ１及び幅Ｗ１２ｂ１よりも僅かに拡大し、該拡大に基づく嵌め代ＦＭが膨張状態のリッド１２”に確保される。ここでは加熱温度を略３００℃としたが、図５に示した嵌め代ＦＭが確保できるのであれば加熱温度は３００℃よりも低くても良い。   Then, as shown in FIG. 5, the lid 12 ′ to which the second electrode sheet 13 b is bonded is heated to about 300 ° C. in a non-oxidizing atmosphere such as a nitrogen atmosphere to expand the lid 12 ′. Due to this expansion, the length (L12a1) and the width (W12b1) of the inner peripheral surface 12a1 of the annular portion 12a are slightly larger than the length L12a1 and the width W12b1 shown in FIG. 4, and the fitting allowance FM based on the expansion is increased. In the expanded state, the lid 12 ″ is secured. Here, the heating temperature is set to about 300 ° C. However, the heating temperature may be lower than 300 ° C. as long as the fitting allowance FM shown in FIG.

そして、図５に示したように、前記同様の非酸化性雰囲気下で、環状部１２ａがリング１８の外側に位置するように膨張状態のリッド１２”をリング１８上に載置し、該リッド１２”を常温まで冷却する。この冷却は自然冷却でも構わないが、冷風吹き付け等の強制冷却を行えば冷却時間の短縮を図れる。この冷却により、環状部１２ａの内周面１２ａ１の長さ（Ｌ１２ａ１）及び幅（Ｗ１２ｂ１）が図４に示した長さＬ１２ａ１及び幅Ｗ１２ｂ１に復帰して焼き嵌めが行われ、環状部１２ａの内周面１２ａ１の略全てがリング１８の外周面１８ｂに強く押し付けられて密着し、該密着によってリッド１２がリング１８に電気的に接続される。   Then, as shown in FIG. 5, in the same non-oxidizing atmosphere as described above, the inflated lid 12 ″ is placed on the ring 18 so that the annular portion 12a is positioned outside the ring 18, and the lid Cool 12 "to room temperature. Although this cooling may be natural cooling, the cooling time can be shortened by performing forced cooling such as blowing cold air. By this cooling, the length (L12a1) and the width (W12b1) of the inner peripheral surface 12a1 of the annular portion 12a are restored to the length L12a1 and the width W12b1 shown in FIG. 4, and shrink fitting is performed. Almost all of the peripheral surface 12a1 is strongly pressed against and closely contacts the outer peripheral surface 18b of the ring 18, and the lid 12 is electrically connected to the ring 18 by the close contact.

膨張状態のリッド１２”の環状部１２ａの内周面１２ａ１の高さ（Ｈ１２ａ１）がリング１８の外周面１８ｂの高さＨ１８ｂと一致している場合、または、リング１８の外周面１８ｂの高さＨ１８ｂよりも僅かに小さい場合には、先に述べた載置ステップにおいてリッド１２のリング１８の上面と向き合う面はリング１８の上面に接触するため、焼き嵌め後のリッド１２のリング１８の上面と向き合う面とリング１８の上面との間に隙間が形成されることは無い。勿論、膨張状態のリッド１２”の環状部１２ａの内周面１２ａ１の高さ（Ｈ１２ａ１）がリング１８の外周面１８ｂの高さＨ１８ｂよりも僅かに大きい場合でも、先に述べた冷却ステップにおける環状部１２ａの内周面１２ａ１の高さ（Ｈ１２ａ１）の減少に伴ってリッド１２全体が自重により降下するため、焼き嵌め後のリッド１２のリング１８の上面と向き合う面とリング１８の上面との間に隙間が形成されることは無い。   When the height (H12a1) of the inner peripheral surface 12a1 of the annular portion 12a of the lid 12 ″ in the expanded state coincides with the height H18b of the outer peripheral surface 18b of the ring 18, or the height of the outer peripheral surface 18b of the ring 18 If it is slightly smaller than H18b, the surface facing the upper surface of the ring 18 of the lid 12 in contact with the upper surface of the ring 18 in the mounting step described above comes into contact with the upper surface of the ring 18 of the lid 12 after shrink fitting. There is no gap formed between the facing surface and the upper surface of the ring 18. Of course, the height (H12a1) of the inner peripheral surface 12a1 of the annular portion 12a of the inflated lid 12 ″ is the outer peripheral surface 18b of the ring 18. Even when the height H18b is slightly larger than the height H18b, the lid 12 is completely removed as the height (H12a1) of the inner peripheral surface 12a1 of the annular portion 12a decreases in the cooling step described above. There to drop by its own weight, no gap is formed between the upper surface of the surface and the ring 18 facing the top surface of the ring 18 of the lid 12 after the shrink fitting.

また、先に述べた加熱ステップでは、リッド１２’に加えて第２電極シート１３ｂ及び第２導電性接着層２１も略同一温度に加熱されるが、該加熱を非酸化性雰囲気下で行っているため、リング１８に対するリッド１２の電気的接続に支障を生じるような酸化膜が該リッド１２に生成されることは無い。一方、活性炭等から成る第２電極シート１３ｂは耐熱性に富むため、充放電特性に影響を及ぼす変質が該第２電極シート１３ｂに生じることは無い。他方、エポキシ樹脂を主成分とした第２導電性接着層２１は加熱によって軟化するものの、先に述べた冷却ステップで再び硬化状態に戻るため、充放電特性に影響を及ぼす位置ずれ、例えば、蓄電素子１３に態様異常をもたらすような位置ずれを生じることは無い。   In the heating step described above, in addition to the lid 12 ′, the second electrode sheet 13b and the second conductive adhesive layer 21 are also heated to substantially the same temperature, but the heating is performed in a non-oxidizing atmosphere. Therefore, no oxide film is generated on the lid 12 so as to hinder the electrical connection of the lid 12 to the ring 18. On the other hand, since the second electrode sheet 13b made of activated carbon or the like is rich in heat resistance, the second electrode sheet 13b does not undergo alteration that affects the charge / discharge characteristics. On the other hand, although the second conductive adhesive layer 21 mainly composed of epoxy resin is softened by heating, the second conductive adhesive layer 21 returns to the cured state again by the cooling step described above, and therefore, a positional shift that affects charge / discharge characteristics, for example, power storage There is no misalignment that causes an abnormal state of the element 13.

加えて、図１及び図２に示した電気化学デバイス１０をリフローハンダ付けによって回路基板等に表面実装するとき、ハンダが鉛フリーハンダの場合で該電気化学デバイス１０は２５０℃前後に加熱されるが、該加熱によってリッド１２のみならずケース１１やリング１８等も膨張するため、リフローハンダ付け過程で焼き嵌めされたリッド１２が外れることは無いし、リッド１２とリング１８との結合力が低下することも無い。   In addition, when the electrochemical device 10 shown in FIGS. 1 and 2 is surface-mounted on a circuit board or the like by reflow soldering, the electrochemical device 10 is heated to around 250 ° C. when the solder is lead-free solder. However, since not only the lid 12 but also the case 11 and the ring 18 are expanded by the heating, the lid 12 that has been shrink-fitted in the reflow soldering process does not come off, and the bonding force between the lid 12 and the ring 18 is reduced. There is nothing to do.

〈電気化学デバイス１０によって得られる効果〉
前記電気化学デバイス１０によれば、以下の効果１及び効果２を得ることができる。 <Effect obtained by electrochemical device 10>
According to the electrochemical device 10, the following effects 1 and 2 can be obtained.

（効果１）リッド１２は該リッド１２に一体形成された環状部１２ａの内周面１２ａ１がリング１８の外周面１８ｂに密着するように焼き嵌めされており、環状部１２ａが位置決め手段として機能していることも相俟って該リッド１２がケース１１のリング１８に対して位置ずれ無く結合されているため、リッド１２の位置ずれを原因として生じ得る諸問題、例えば、蓄電素子１３の態様異常に伴う充放電特性の低下や電解液の漏出に伴う機能障害等の問題を未然に防止できる。   (Effect 1) The lid 12 is shrink-fitted so that the inner peripheral surface 12a1 of the annular portion 12a integrally formed with the lid 12 is in close contact with the outer peripheral surface 18b of the ring 18, and the annular portion 12a functions as positioning means. Since the lid 12 is coupled to the ring 18 of the case 11 without misalignment, various problems that may occur due to misalignment of the lid 12, such as abnormal state of the storage element 13 Thus, it is possible to prevent problems such as deterioration in charge / discharge characteristics and functional failure due to electrolyte leakage.

（効果２）リッド１２の環状部１２ａの内周面１２ａ１の高さＨ１２ａ１はリング１８の外周面１８ｂの高さＨ１８ｂと略一致しており、焼き嵌めによって環状部１２ａの内周面１２ａ１の略全てがリング１８の外周面１８ｂに強く押し付けられて密着しているため、リッド１２とリング１８とに十分な結合力を確保できると共に、両者の電気的接続を的確に行える。   (Effect 2) The height H12a1 of the inner peripheral surface 12a1 of the annular portion 12a of the lid 12 is substantially coincident with the height H18b of the outer peripheral surface 18b of the ring 18, and is substantially the same as the inner peripheral surface 12a1 of the annular portion 12a by shrink fitting. Since everything is strongly pressed against and closely contacted with the outer peripheral surface 18b of the ring 18, a sufficient coupling force can be secured between the lid 12 and the ring 18, and electrical connection between them can be performed accurately.

《焼き嵌め前のリッド１２’の第１形状変形例》
図６（Ａ）及び図６（Ｂ）は、図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’に変えて使用可能な焼き嵌め前のリッド２２’を示す。同図に示した焼き嵌め前のリッド２２’の環状部２２ａの内周面２２ａ１は、リング１８の外周面１８ｂの高さＨ１８ｂと略一致した高さＨ２２ａ１と、リング１８の外周面１８ｂの長さＬ１８ｂよりも僅かに小さな長さＬ２２ａ１と、リング１８の外周面１８ｂの幅Ｗ１８ｂよりも僅かに小さな幅Ｗ２２ａ１とを有しており、内周面２２ａ１とリング１８の上面と向き合う面とが成す角度θ２２ａ１は略８５度である。 << First shape modification of lid 12 'before shrink fitting >>
6 (A) and 6 (B) show a lid 22 'before shrink fitting that can be used in place of the lid 12' before shrink fitting shown in FIGS. 4 (A) and 4 (B). The inner peripheral surface 22a1 of the annular portion 22a of the lid 22 'before shrink fitting shown in the figure has a height H22a1 substantially equal to the height H18b of the outer peripheral surface 18b of the ring 18, and the length of the outer peripheral surface 18b of the ring 18. The length L22a1 is slightly smaller than the length L18b, and the width W22a1 is slightly smaller than the width W18b of the outer peripheral surface 18b of the ring 18. The inner peripheral surface 22a1 and the surface facing the upper surface of the ring 18 are formed. The angle θ22a1 is approximately 85 degrees.

要するに、図６（Ａ）及び図６（Ｂ）に示した焼き嵌め前のリッド２２’は、環状部２２ａが内側に向かって傾いている点において、図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’と形状を異にする。   In short, the lid 22 ′ before shrink fitting shown in FIGS. 6 (A) and 6 (B) is similar to FIGS. 4 (A) and 4 (B) in that the annular portion 22a is inclined inward. The shape is different from the lid 12 ′ before shrink fitting shown in FIG.

この焼き嵌め前のリッド２２’を図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’に変えて使用した場合の電気化学デバイスの組立方法は、前記〈電気化学デバイス１０の組立方法〉で説明した組立方法と基本的に同じであるが、先に述べた冷却ステップで環状部２２ａの内周面２２ａ１がリング１８の外周面１８ｂに密着する挙動が若干異なる。   The method for assembling an electrochemical device when the lid 22 'before shrink fitting is used in place of the lid 12' before shrink fitting shown in FIGS. 4 (A) and 4 (B) is as described above. 10 is basically the same as the assembly method described above, but the behavior in which the inner peripheral surface 22a1 of the annular portion 22a is in close contact with the outer peripheral surface 18b of the ring 18 in the cooling step described above is slightly different.

即ち、焼き嵌め前のリッド２２’の環状部２２ａが内側に向かって傾いているため、冷却ステップで環状部２２ａの内周面２２ａ１がリング１８の外周面１８ｂに密着するときに、該環状部２２ａの内周面２２ａ１はその端縁（符号無し）がリング１８の外周面１８ｂに食い込むようにして密着する。   That is, since the annular portion 22a of the lid 22 'before shrink fitting is inclined inward, when the inner peripheral surface 22a1 of the annular portion 22a comes into close contact with the outer peripheral surface 18b of the ring 18 in the cooling step, the annular portion The inner peripheral surface 22a1 of 22a is in close contact so that the end edge (not shown) bites into the outer peripheral surface 18b of the ring 18.

環状部２２ａの厚さ及び弾性にもよるが、該環状部２２ａの内周面２２ａ１とリング１８の上面と向き合う面とが成す角度θ２２ａ１をあまり小さくすると、例えば、略４５度とすると、先に述べた冷却ステップで環状部１２ａの内周面１２ａ１の略全てをリング１８の外周面１８ｂに密着させることが難しくなるため、密着面積を十分に確保したい場合には環状部２２ａの内周面２２ａ１とリング１８の上面と向き合う面とが成す角度θ２２ａ１は略７５度〜９０度未満の範囲内、好ましくはリング１８の外周面１８ｂに引っ掛かりが得られる程度で９０度に近い値に設定することが望ましい。   Although depending on the thickness and elasticity of the annular portion 22a, if the angle θ22a1 formed by the inner peripheral surface 22a1 of the annular portion 22a and the surface facing the upper surface of the ring 18 is made too small, for example, approximately 45 degrees, In the cooling step described above, it is difficult to bring substantially all of the inner peripheral surface 12a1 of the annular portion 12a into close contact with the outer peripheral surface 18b of the ring 18, and therefore, when it is desired to secure a sufficient contact area, the inner peripheral surface 22a1 of the annular portion 22a. The angle θ22a1 formed by the surface facing the upper surface of the ring 18 is set to a value close to 90 ° within a range of approximately 75 ° to less than 90 °, preferably such that the outer peripheral surface 18b of the ring 18 is caught. desirable.

図６（Ａ）及び図６（Ｂ）に示した焼き嵌め前のリッド２２’を図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’に変えて使用した電気化学デバイスによれば、前記効果１に加えて、以下の効果３を得ることができる。   Electrochemistry used in place of the lid 22 'before shrink fitting shown in FIGS. 6 (A) and 6 (B) to the lid 12' before shrink fitting shown in FIGS. 4 (A) and 4 (B). According to the device, in addition to the effect 1, the following effect 3 can be obtained.

（効果３）リッド２２の環状部２２ａの内周面２２ａ１の端縁がリング１８の外周面１８ｂに食い込んでいるため、該食い込みによってリッド２２とリング１８との結合をより強化できると共に、両者の電気的接続をより的確に行える。   (Effect 3) Since the edge of the inner peripheral surface 22a1 of the annular portion 22a of the lid 22 bites into the outer peripheral surface 18b of the ring 18, the biting can further strengthen the coupling between the lid 22 and the ring 18, and Electrical connection can be made more accurately.

勿論、環状部２２ａの内周面２２ａ１とリング１８の上面と向き合う面とが成す角度θ２２ａ１を９０度に近い値に設定して、環状部２２ａの内周面２２ａ１の略全てがリング１８の外周面１８ｂに密着するようにすれば、前記効果２を併せて得られる。   Of course, the angle θ22a1 formed by the inner peripheral surface 22a1 of the annular portion 22a and the surface facing the upper surface of the ring 18 is set to a value close to 90 degrees, and almost all of the inner peripheral surface 22a1 of the annular portion 22a is the outer periphery of the ring 18. The effect 2 can also be obtained by closely contacting the surface 18b.

《焼き嵌め前のリッド１２’の第２形状変形例》
図７（Ａ）及び図７（Ｂ）は、図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’に変えて使用可能な焼き嵌め前のリッド３２’を示す。同図に示した焼き嵌め前のリッド３２’の環状部３２ａの内周面３２ａ１は、リング１８の外周面１８ｂの高さＨ１８ｂと略一致した高さＨ３２ａ１と、リング１８の外周面１８ｂの長さＬ１８ｂよりも僅かに小さな長さＬ３２ａ１と、リング１８の外周面１８ｂの幅Ｗ１８ｂよりも僅かに小さな幅Ｗ３２ａ１とを有しており、内周面３２ａ１とリング１８の上面と向き合う面とが成す角度θ３２ａ１は略９０度である。また、環状部３２ａの内周面３２ａ１の略高さ方向中央には、複数の凸部３２ａ２が長さ方向及び幅方向に間隔をおいて形成されている。 << Second shape modification of lid 12 'before shrink fitting >>
FIGS. 7A and 7B show a lid 32 ′ before shrink fitting that can be used in place of the lid 12 ′ before shrink fitting shown in FIGS. 4A and 4B. The inner peripheral surface 32a1 of the annular portion 32a of the lid 32 'before shrink fitting shown in the figure has a height H32a1 substantially equal to the height H18b of the outer peripheral surface 18b of the ring 18 and the length of the outer peripheral surface 18b of the ring 18. The length L32a1 is slightly smaller than the length L18b, and the width W32a1 is slightly smaller than the width W18b of the outer peripheral surface 18b of the ring 18. The inner peripheral surface 32a1 and the surface facing the upper surface of the ring 18 are formed. The angle θ32a1 is approximately 90 degrees. In addition, a plurality of convex portions 32a2 are formed in the center in the height direction of the inner peripheral surface 32a1 of the annular portion 32a at intervals in the length direction and the width direction.

要するに、図７（Ａ）及び図７（Ｂ）に示した焼き嵌め前のリッド３２’は、環状部３２ａの内周面３２ａ１に複数の凸部３２ａ２が形成されている点において、図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’と形状を異にする。   In short, the lid 32 ′ before shrink fitting shown in FIGS. 7 (A) and 7 (B) is different from FIG. 4 (A) in that a plurality of convex portions 32a2 are formed on the inner peripheral surface 32a1 of the annular portion 32a. The shape is different from the lid 12 ′ before shrink fitting shown in A) and FIG.

この焼き嵌め前のリッド３２’を図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’に変えて使用した場合の電気化学デバイスの組立方法は、前記〈電気化学デバイス１０の組立方法〉で説明した組立方法と基本的に同じであるが、先に述べた冷却ステップで環状部３２ａの内周面３２ａ１がリング１８の外周面１８ｂに密着する挙動が若干異なる。   The method of assembling an electrochemical device when the lid 32 ′ before shrink fitting is used instead of the lid 12 ′ before shrink fitting shown in FIGS. 10 is basically the same as the assembly method described above, but the behavior in which the inner peripheral surface 32a1 of the annular portion 32a is in close contact with the outer peripheral surface 18b of the ring 18 in the cooling step described above is slightly different.

即ち、焼き嵌め前のリッド３２’の環状部３２ａの内周面３２ａ１に複数の凸部３２ａ２が形成されているため、冷却ステップで環状部３２ａの内周面３２ａ１がリング１８の外周面１８ｂに密着するときに、該環状部３２ａの内周面３２ａ１はその凸部３２ａ２がリング１８の外周面１８ｂに食い込むようにして密着する。   That is, since the plurality of convex portions 32a2 are formed on the inner peripheral surface 32a1 of the annular portion 32a of the lid 32 ′ before shrink fitting, the inner peripheral surface 32a1 of the annular portion 32a is formed on the outer peripheral surface 18b of the ring 18 in the cooling step. When closely contacting, the inner peripheral surface 32a1 of the annular portion 32a is in close contact such that the convex portion 32a2 bites into the outer peripheral surface 18b of the ring 18.

環状部２２ａ及びリング１８の硬度にもよるが、該環状部３２ａの内周面３２ａ１に形成した凸部３２ａ２の突出高さをあまり大きくすると、例えば、環状部３２ａの厚さの略１／２とすると、先に述べた冷却ステップで環状部１２ａの内周面１２ａ１の略全てをリング１８の外周面１８ｂに密着させることが難しくなるため、密着面積を十分に確保したい場合には各凸部３２ａ２の突出高さは環状部３２ａの厚さの略１／４０〜略１／５の範囲内、好ましくはリング１８の外周面１８ｂに引っ掛かりが得られる程度で極力小さな値に設定することが望ましく、また、各凸部３２ａ２の断面積も極力小さな値とすることが望ましい。   Although depending on the hardness of the annular portion 22a and the ring 18, if the protruding height of the convex portion 32a2 formed on the inner peripheral surface 32a1 of the annular portion 32a is too large, for example, approximately 1/2 of the thickness of the annular portion 32a. Then, in the cooling step described above, it becomes difficult to bring almost all of the inner peripheral surface 12a1 of the annular portion 12a into close contact with the outer peripheral surface 18b of the ring 18. It is desirable that the protrusion height of 32a2 be set to a value as small as possible within a range of approximately 1/40 to approximately 1/5 of the thickness of the annular portion 32a, preferably such that the outer peripheral surface 18b of the ring 18 is caught. Moreover, it is desirable that the cross-sectional area of each convex portion 32a2 be as small as possible.

図７（Ａ）及び図７（Ｂ）に示した焼き嵌め前のリッド３２’を図４（Ａ）及び図４（Ｂ）に示した焼き嵌め前のリッド１２’に変えて使用した電気化学デバイスによれば、前記効果１に加えて、以下の効果４を得ることができる。   Electrochemistry used by replacing the lid 32 ′ before shrink fitting shown in FIGS. 7A and 7B with the lid 12 ′ before shrink fitting shown in FIGS. 4A and 4B. According to the device, in addition to the effect 1, the following effect 4 can be obtained.

（効果４）リッド３２の環状部３２ａの内周面３２ａ１に形成された凸部３２ａ２がリング１８の外周面１８ｂに食い込んでいるため、該食い込みによってリッド３２とリング１８との結合をより強化できると共に、両者の電気的接続をより的確に行える。   (Effect 4) Since the convex part 32a2 formed in the inner peripheral surface 32a1 of the annular part 32a of the lid 32 bites into the outer peripheral face 18b of the ring 18, the coupling between the lid 32 and the ring 18 can be further strengthened by the bite. At the same time, the electrical connection between the two can be performed more accurately.

勿論、各凸部３２ａ２の突出高さ及び断面積を極力小さな値に設定して、環状部２２ａの内周面２２ａ１の略全てがリング１８の外周面１８ｂに密着するようにすれば、前記効果２を併せて得られる。   Of course, if the protrusion height and the cross-sectional area of each convex portion 32a2 are set to be as small as possible so that substantially all of the inner peripheral surface 22a1 of the annular portion 22a is in close contact with the outer peripheral surface 18b of the ring 18, the effect described above is achieved. 2 is obtained together.

本発明は、電気二重層キャパシタやリチウムイオンキャパシタに限らず、充放電可能な蓄電素子を用いた他の電気化学デバイス、例えば、レドックスキャパシタやリチウムイオン電池等に広く適用でき、該適用によって前記［発明を解決しようとする課題］に記した目的を達成できる。   The present invention is not limited to electric double layer capacitors and lithium ion capacitors, but can be widely applied to other electrochemical devices using chargeable / dischargeable storage elements, such as redox capacitors and lithium ion batteries. The object described in [Problems to be solved by the invention] can be achieved.

１０…電気化学デバイス、１１…ケース、１１ａ…凹部、１２…リッド（焼き嵌め後のリッド）、１２’，２２’，３２’…焼き嵌め前のリッド、１２”…膨張状態のリッド、１２ａ，２２ａ，３２ａ…リッドの環状部、１２ａ１，２２ａ１，３２ａ１…環状部の内周面、３２ａ２…環状部の内周面の凸部、１３…蓄電素子、１８…リング、１８ｂ…リングの外周面。   DESCRIPTION OF SYMBOLS 10 ... Electrochemical device, 11 ... Case, 11a ... Recess, 12 ... Lid (lid after shrink fitting), 12 ', 22', 32 '... Lid before shrink fitting, 12 "... Lid in an expanded state, 12a, 22a, 32a ... an annular portion of the lid, 12a1, 22a1, 32a1 ... an inner peripheral surface of the annular portion, 32a2 ... a convex portion of an inner peripheral surface of the annular portion, 13 ... an electricity storage element, 18 ... a ring, 18b ... an outer peripheral surface of the ring.

Claims (4)

凹部を有するケースと、前記ケースの上面に設けられたリングと、前記凹部を水密及び気密に閉塞するように前記リングに結合されたリッドと、前記リッドによって閉塞された前記凹部内に封入された充放電可能な蓄電素子及び電解液とを備えた電気化学デバイスにおいて、
前記リッドは該リッドに一体形成された環状部の内周面が前記リングの外周面に密着するように焼き嵌めされている、
ことを特徴とする電気化学デバイス。 A case having a recess, a ring provided on the upper surface of the case, a lid coupled to the ring so as to close the recess in a water-tight and air-tight manner, and enclosed in the recess closed by the lid In an electrochemical device comprising a chargeable / dischargeable storage element and an electrolyte,
The lid is shrink-fitted so that the inner peripheral surface of the annular portion formed integrally with the lid is in close contact with the outer peripheral surface of the ring.
An electrochemical device characterized by that. 前記リッドの環状部の内周面の高さは前記リングの外周面の高さと略一致している、
ことを特徴とする請求項１に記載の電気化学デバイス。 The height of the inner peripheral surface of the annular portion of the lid is substantially the same as the height of the outer peripheral surface of the ring,
The electrochemical device according to claim 1. 前記リッドの環状部の内周面の端縁が前記リングの外周面に食い込んでいる、
ことを特徴とする請求項１または２に記載の電気化学デバイス。 The edge of the inner peripheral surface of the annular portion of the lid bites into the outer peripheral surface of the ring,
The electrochemical device according to claim 1 or 2, characterized in that 前記リッドの環状部の内周面に形成された凸部が前記リングの外周面に食い込んでいる、
ことを特徴とする請求項１または２に記載の電気化学デバイス。 The convex portion formed on the inner peripheral surface of the annular portion of the lid bites into the outer peripheral surface of the ring,
The electrochemical device according to claim 1 or 2, characterized in that
JP2011094944A 2011-04-21 2011-04-21 Electrochemical devices Expired - Fee Related JP5689352B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011094944A JP5689352B2 (en) 2011-04-21 2011-04-21 Electrochemical devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011094944A JP5689352B2 (en) 2011-04-21 2011-04-21 Electrochemical devices

Publications (2)

Publication Number Publication Date
JP2012227418A JP2012227418A (en) 2012-11-15
JP5689352B2 true JP5689352B2 (en) 2015-03-25

Family

ID=47277235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011094944A Expired - Fee Related JP5689352B2 (en) 2011-04-21 2011-04-21 Electrochemical devices

Country Status (1)

Country Link
JP (1) JP5689352B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11830672B2 (en) 2016-11-23 2023-11-28 KYOCERA AVX Components Corporation Ultracapacitor for use in a solder reflow process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101436426B1 (en) 2013-04-05 2014-09-01 신재영 Chip type Electrical double-layer capacitor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595558A (en) * 1982-06-30 1984-01-12 Nec Home Electronics Ltd Battery
JP4606066B2 (en) * 2003-07-28 2011-01-05 京セラ株式会社 Battery case and battery
JP2007201382A (en) * 2006-01-30 2007-08-09 Sanyo Electric Co Ltd Power accumulation device
JP2007201383A (en) * 2006-01-30 2007-08-09 Sanyo Electric Co Ltd Power accumulation device
JP2007234827A (en) * 2006-02-28 2007-09-13 Sanyo Electric Co Ltd Electric double layer capacitor and its method for manufacturing
JP5435638B2 (en) * 2009-01-21 2014-03-05 セイコーインスツル株式会社 Electrochemical cell and method for producing electrochemical cell
US20110102972A1 (en) * 2009-11-05 2011-05-05 Samsung Elctro-Mechanics Co., Ltd. Chip-type electric double layer capacitor cell and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11830672B2 (en) 2016-11-23 2023-11-28 KYOCERA AVX Components Corporation Ultracapacitor for use in a solder reflow process

Also Published As

Publication number Publication date
JP2012227418A (en) 2012-11-15

Similar Documents

Publication Publication Date Title
JP5112885B2 (en) Container for power storage unit, battery and electric double layer capacitor using the same
JP4749130B2 (en) Secondary battery and method for forming the same
US20180108496A1 (en) Method of Assembly of Electrochemical Cells for High Temperature Applications
US20040126656A1 (en) Secondary battery and method of manufacturing same
JP5155488B2 (en) Electrochemical devices
JP2006049289A (en) Case for battery, battery, case for electric double layer capacitor, and electric double layer capacitor
US20110281140A1 (en) Battery pack
JP5689352B2 (en) Electrochemical devices
JP5733823B2 (en) Electronic component, electronic device, and method of manufacturing electronic component
JP5588539B2 (en) Electrochemical cell
JPWO2003030281A1 (en) Electrochemical cell with terminal
WO2015133340A1 (en) Electrochemical device
TWI261274B (en) Battery cell for surface packaging
JP2010186690A (en) Button type electrochemical cell for surface mounting
JP5050519B2 (en) Surface mount square storage cell
JP2016129095A (en) Flat type battery
JP2015106517A (en) Electrochemical device
JP2019057473A (en) Electrochemical cell
KR101310441B1 (en) Electrochemical capacitor
JP2017134961A (en) Laminate type power storage device, and method for mounting laminate type power storage device
KR101312428B1 (en) Connecting structure for PCB and secondary battery utilizing the same
JP6705702B2 (en) Electrochemical cell
JP2012134299A (en) Electrochemical device
JP2005129366A (en) Secondary battery, and its manufacturing method and device
JP5813821B2 (en) Electrochemical cell

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20140221

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140410

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141205

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150115

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150128

R150 Certificate of patent or registration of utility model

Ref document number: 5689352

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees