JP5686883B2 - ダイと集積回路素子とを備える駆動可能デバイス - Google Patents
ダイと集積回路素子とを備える駆動可能デバイス Download PDFInfo
- Publication number
- JP5686883B2 JP5686883B2 JP2013260347A JP2013260347A JP5686883B2 JP 5686883 B2 JP5686883 B2 JP 5686883B2 JP 2013260347 A JP2013260347 A JP 2013260347A JP 2013260347 A JP2013260347 A JP 2013260347A JP 5686883 B2 JP5686883 B2 JP 5686883B2
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- interposer
- die
- integrated circuit
- fluid ejection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000012530 fluid Substances 0.000 claims description 229
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 238000004891 communication Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002318 adhesion promoter Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BFXRJTDKPLPXSK-UHFFFAOYSA-N [SiH4].CO[Si](CCCS)(OC)OC Chemical compound [SiH4].CO[Si](CCCS)(OC)OC BFXRJTDKPLPXSK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14362—Assembling elements of heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14459—Matrix arrangement of the pressure chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet (AREA)
Description
Claims (7)
- 流体吐出素子と、第1の複数の流体路であって、各々が、アクチュエータが駆動されると流体を吐出するノズルを有する第1の複数の流体路と、を備える流体吐出モジュールと、
前記流体吐出モジュールと電気的に連通している集積回路素子と、
第2の複数の流体路であって、前記第1の複数の流体路に接続される第2の複数の流体路、を有する下部インターポーザであって、前記流体吐出素子と前記集積回路素子とを、前記流体吐出モジュールに送り込まれる流体から保護するように構成された下部インターポーザと、
前記下部インターポーザに隣接する上部インターポーザと、
を備え、
前記下部インターポーザが、前記流体吐出モジュールと前記上部インターポーザとの間にあり、前記上部インターポーザの短辺が、前記下部インターポーザの短辺より長い、
流体吐出装置。 - 前記下部インターポーザが、前記上部インターポーザの流体入口及び流体出口と流体連通している流体入口及び流体出口を有する、請求項1に記載の流体吐出装置。
- 流体吐出素子と、第1の複数の流体路であって、各々が、アクチュエータが駆動されると流体を吐出するノズルを有する第1の複数の流体路と、を備える流体吐出モジュールと、
前記流体吐出モジュールと電気的に連通している集積回路素子と、
第2の複数の流体路であって、前記第1の複数の流体路に接続される第2の複数の流体路、を有する下部インターポーザであって、前記流体吐出素子と前記集積回路素子とを、前記流体吐出モジュールに送り込まれる流体から保護するように構成された下部インターポーザと、
前記下部インターポーザに隣接する上部インターポーザと、
を備え、
前記下部インターポーザが、前記上部インターポーザの流体入口及び流体出口と流体連通している流体入口及び流体出口を有する、
流体吐出装置。 - 前記上部インターポーザの前記流体入口及び前記流体出口から前記上部インターポーザの中心までが、前記下部インターポーザの前記流体入口及び前記流体出口から前記下部インターポーザの中心までより近い、請求項2又は3に記載の流体吐出装置。
- 前記流体吐出モジュールの第1側面と前記下部インターポーザの第1側面とが接着剤で接着される、請求項1乃至4のいずれか一項に記載の流体吐出装置。
- 前記下部インターポーザが接着領域を有し、前記接着領域の表面積が、流体入口を取り囲み、かつ前記下部インターポーザの前記第1側面の面積より小さい、請求項5に記載の流体吐出装置。
- 前記下部インターポーザと前記上部インターポーザとが接着剤で接着される、請求項1乃至6のいずれか一項に記載の流体吐出装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5545808P | 2008-05-22 | 2008-05-22 | |
US61/055,458 | 2008-05-22 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011510604A Division JP2011520670A (ja) | 2008-05-22 | 2009-05-15 | ダイと集積回路素子とを備える駆動可能デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014065313A JP2014065313A (ja) | 2014-04-17 |
JP5686883B2 true JP5686883B2 (ja) | 2015-03-18 |
Family
ID=41340492
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011510604A Abandoned JP2011520670A (ja) | 2008-05-22 | 2009-05-15 | ダイと集積回路素子とを備える駆動可能デバイス |
JP2013260347A Active JP5686883B2 (ja) | 2008-05-22 | 2013-12-17 | ダイと集積回路素子とを備える駆動可能デバイス |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011510604A Abandoned JP2011520670A (ja) | 2008-05-22 | 2009-05-15 | ダイと集積回路素子とを備える駆動可能デバイス |
Country Status (7)
Country | Link |
---|---|
US (2) | US8579412B2 (ja) |
EP (1) | EP2296897B1 (ja) |
JP (2) | JP2011520670A (ja) |
KR (1) | KR101256855B1 (ja) |
CN (2) | CN103552379B (ja) |
BR (1) | BRPI0912158A2 (ja) |
WO (1) | WO2009143025A1 (ja) |
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JP2011520670A (ja) | 2008-05-22 | 2011-07-21 | 富士フイルム株式会社 | ダイと集積回路素子とを備える駆動可能デバイス |
US8573750B2 (en) * | 2008-10-30 | 2013-11-05 | Fujifilm Corporation | Short circuit protection for inkjet printhead |
US8157352B2 (en) | 2009-02-26 | 2012-04-17 | Fujifilm Corporation | Fluid ejecting with centrally formed inlets and outlets |
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US9193161B2 (en) | 2012-04-19 | 2015-11-24 | Hewlett-Packard Development Company, L.P. | Fluid circulation within chamber |
EP2828086B1 (en) * | 2012-05-31 | 2019-09-11 | Hewlett-Packard Development Company, L.P. | Printheads with conductor traces across slots |
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US9314930B2 (en) * | 2012-12-14 | 2016-04-19 | LuxVue Technology Corporation | Micro pick up array with integrated pivot mount |
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JP6068684B2 (ja) | 2013-02-28 | 2017-01-25 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 流体流れ構造の成形 |
US9902162B2 (en) * | 2013-02-28 | 2018-02-27 | Hewlett-Packard Development Company, L.P. | Molded print bar |
CN105189122B (zh) | 2013-03-20 | 2017-05-10 | 惠普发展公司,有限责任合伙企业 | 具有暴露的前表面和后表面的模制芯片条 |
JP6463034B2 (ja) * | 2013-09-24 | 2019-01-30 | キヤノン株式会社 | 液体吐出ヘッド |
JP6381355B2 (ja) * | 2013-09-24 | 2018-08-29 | キヤノン株式会社 | 液体吐出ヘッド |
US9855746B2 (en) | 2014-04-30 | 2018-01-02 | Hewlett-Packard Development Company, L.P. | Piezoelectric printhead assembly |
JP6410528B2 (ja) * | 2014-08-29 | 2018-10-24 | キヤノン株式会社 | 液体吐出ヘッドとそれを用いたヘッドユニット |
CN107531052B (zh) * | 2015-05-15 | 2019-10-11 | 惠普发展公司有限责任合伙企业 | 流体喷射设备 |
JP6730432B2 (ja) * | 2016-02-24 | 2020-07-29 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 集積回路を含む流体吐出デバイス |
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US10141215B2 (en) * | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
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JP2007331137A (ja) * | 2006-06-12 | 2007-12-27 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP4806617B2 (ja) | 2006-09-29 | 2011-11-02 | 富士フイルム株式会社 | インクジェット記録装置 |
JP5184869B2 (ja) * | 2006-12-05 | 2013-04-17 | キヤノン株式会社 | ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置 |
JP2011520670A (ja) | 2008-05-22 | 2011-07-21 | 富士フイルム株式会社 | ダイと集積回路素子とを備える駆動可能デバイス |
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- 2009-05-15 CN CN201310470503.0A patent/CN103552379B/zh active Active
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US8579412B2 (en) | 2013-11-12 |
WO2009143025A1 (en) | 2009-11-26 |
JP2011520670A (ja) | 2011-07-21 |
JP2014065313A (ja) | 2014-04-17 |
CN103552379B (zh) | 2015-09-02 |
KR101256855B1 (ko) | 2013-04-22 |
CN103552379A (zh) | 2014-02-05 |
US8789924B2 (en) | 2014-07-29 |
US20140055528A1 (en) | 2014-02-27 |
CN102036825A (zh) | 2011-04-27 |
US20110115852A1 (en) | 2011-05-19 |
CN102036825B (zh) | 2013-11-06 |
BRPI0912158A2 (pt) | 2015-10-13 |
KR20110009717A (ko) | 2011-01-28 |
EP2296897B1 (en) | 2022-05-04 |
EP2296897A1 (en) | 2011-03-23 |
EP2296897A4 (en) | 2018-02-28 |
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