JP5682937B1 - 電気製品の製造方法 - Google Patents
電気製品の製造方法 Download PDFInfo
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- JP5682937B1 JP5682937B1 JP2014547604A JP2014547604A JP5682937B1 JP 5682937 B1 JP5682937 B1 JP 5682937B1 JP 2014547604 A JP2014547604 A JP 2014547604A JP 2014547604 A JP2014547604 A JP 2014547604A JP 5682937 B1 JP5682937 B1 JP 5682937B1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1445—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface heating both sides of the joint
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Description
成形体とフレキシブルシートとが組み立てられて電気製品が製造される方法であって、
前記成形体は、融点が300℃以下の熱可塑性樹脂が用いられて構成され、
前記フレキシブルシートは、前記成形体の構成樹脂よりも耐熱性に優れた樹脂が用いられて構成され、
前記成形体には、少なくとも、所定パターンの配線と、前記配線の幅よりも広い幅の接続用端子とが設けられてなり、
前記フレキシブルシートには、少なくとも、所定パターンの配線と、前記配線の幅よりも広い幅の接続用端子とが設けられてなり、
前記方法は、
前記成形体の前記接続用端子と、前記フレキシブルシートの前記接続用端子とが、対向配置される配置工程と、
前記配置工程の後、電磁誘導加熱が行われる電磁誘導加熱工程
とを具備してなり、
前記成形体の接続用端子と前記フレキシブルシートの接続用端子との間に設けられたハンダが、前記電磁誘導加熱によって、溶融し、前記成形体の前記接続用端子と前記フレキシブルシートの前記接続用端子とが接合される
ことを特徴とする電気製品の製造方法を提案する。
前記電気製品の製造方法であって、
前記成形体は、
前記配線および前記接続用端子が、前記熱可塑性樹脂製のシートに、設けられる配線パターン形成工程と、
前記配線パターン形成工程後、前記シートが、加熱され、所定形状に成形される成形工程と
を経て得られたものである
ことを特徴とする電気製品の製造方法を提案する。
成形体とフレキシブルシートとが組み立てられて電気製品が製造される方法であって、
所定パターンの配線および前記配線の幅よりも幅広な接続用端子が、融点が300℃以下の熱可塑性樹脂製のシートに、設けられる配線パターン形成工程と、
前記配線パターン形成工程後、前記シートが、加熱され、所定形状に成形される成形工程と
所定パターンの配線および前記配線の幅よりも幅広な接続用端子が、前記成形体の構成樹脂よりも耐熱性に優れた樹脂製のフレキシブルシートに、設けられる配線パターン形成工程と、
前記成形体の前記接続用端子と、前記フレキシブルシートの前記接続用端子とが、対向配置される配置工程と、
前記配置工程の後、電磁誘導加熱が行われる電磁誘導加熱工程
とを具備してなり、
前記成形体の接続用端子と前記フレキシブルシートの接続用端子との間に設けられたハンダが、前記電磁誘導加熱によって、溶融し、前記成形体の前記接続用端子と前記フレキシブルシートの前記接続用端子とが接合される
ことを特徴とする電気製品の製造方法を提案する。
前記電気製品の製造方法であって、
前記成形体は、
その厚さが0.5〜2mm、
前記配線幅a1が5〜100μm、
前記接続用端子の幅a2が100〜500μm、
a2>a1
であり、
前記フレキシブルシートは、
その厚さが25〜300μm、
前記配線幅b1が50〜100μm、
前記接続用端子の幅b2が150〜500μm
である
ことを特徴とする電気製品の製造方法を提案する。
前記電気製品の製造方法であって、
前記成形体における前記接続用端子の1個当たりの面積は0.3mm2以上であり、
前記フレキシブルシートにおける前記接続用端子の1個当たりの面積は0.3mm2以上である
ことを特徴とする電気製品の製造方法を提案する。
前記電気製品の製造方法であって、
前記成形体は、オレフィン系樹脂、アクリル系樹脂、ポリエステル系樹脂、アミド系樹脂、スチレン系樹脂、AS樹脂、ABS樹脂、塩化ビニル系樹脂、アセタール系樹脂、ポリカーボネート系樹脂の群の中から選ばれる何れかの熱可塑性樹脂が用いられて構成され、
前記フレキシブルシートは、イミド系樹脂の群の中から選ばれる何れかの樹脂が用いられて構成されてなる
ことを特徴とする電気製品の製造方法を提案する。
2 外部接続用端子
3 成形体
4 フレキシブルシート
5,6 外部接続用端子
Claims (4)
- 成形体とフレキシブルシートとが組み立てられて電気製品が製造される方法であって、
前記成形体は、融点が300℃以下の熱可塑性樹脂が用いられて構成され、
前記フレキシブルシートは、前記成形体の構成樹脂よりも耐熱性に優れた樹脂が用いられて構成され、
前記成形体には、少なくとも、所定パターンの配線と、前記配線の幅a1よりも広い幅a2の接続用端子とが設けられてなり、
前記フレキシブルシートには、少なくとも、所定パターンの配線と、前記配線の幅b1よりも広い幅b2の接続用端子とが設けられてなり、
前記成形体は、
その厚さが0.5〜2mm、
前記配線の幅a1が5〜100μm、
前記接続用端子の幅a2が100〜500μm
a2>a1
であり、
前記フレキシブルシートは、
その厚さが25〜300μm、
前記配線の幅b1が50〜100μm、
前記接続用端子の幅b2が150〜500μm
であり、
前記方法は、
前記成形体の前記接続用端子と、前記フレキシブルシートの前記接続用端子とが、対向配置される配置工程と、
前記配置工程の後、電磁誘導加熱が行われる電磁誘導加熱工程
とを具備してなり、
前記成形体の接続用端子と前記フレキシブルシートの接続用端子との間に設けられたハンダが、前記電磁誘導加熱によって、溶融し、前記成形体の前記接続用端子と前記フレキシブルシートの前記接続用端子とが接合される
ことを特徴とする電気製品の製造方法。 - 前記成形体における前記接続用端子の1個当たりの面積は0.3〜1.5mm2であり、
前記フレキシブルシートにおける前記接続用端子の1個当たりの面積は0.3〜1.5mm2である
ことを特徴とする請求項1の電気製品の製造方法。 - 前記成形体は、
前記配線および前記接続用端子が、前記熱可塑性樹脂製のシートに、設けられる配線パターン形成工程と、
前記配線パターン形成工程後、前記シートが、加熱され、所定形状に成形される成形工程と
を経て得られたものである
ことを特徴とする請求項1又は請求項2の電気製品の製造方法。 - 前記成形体は、オレフィン系樹脂、アクリル系樹脂、ポリエステル系樹脂、アミド系樹脂、スチレン系樹脂、AS樹脂、ABS樹脂、塩化ビニル系樹脂、アセタール系樹脂、ポリカーボネート系樹脂の群の中から選ばれる何れかの熱可塑性樹脂が用いられて構成され、
前記フレキシブルシートは、イミド系樹脂の群の中から選ばれる何れかの樹脂が用いられて構成されてなる
ことを特徴とする請求項1〜請求項3いずれかの電気製品の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/080927 WO2015072019A1 (ja) | 2013-11-15 | 2013-11-15 | 電気製品の製造方法 |
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JP5682937B1 true JP5682937B1 (ja) | 2015-03-11 |
JPWO2015072019A1 JPWO2015072019A1 (ja) | 2017-03-09 |
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JP2014547604A Active JP5682937B1 (ja) | 2013-11-15 | 2013-11-15 | 電気製品の製造方法 |
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Country | Link |
---|---|
US (1) | US9949375B2 (ja) |
EP (1) | EP3001782B1 (ja) |
JP (1) | JP5682937B1 (ja) |
KR (1) | KR101635442B1 (ja) |
CN (1) | CN105557076B (ja) |
TW (1) | TWI544848B (ja) |
WO (1) | WO2015072019A1 (ja) |
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JP6481085B2 (ja) * | 2016-09-16 | 2019-03-13 | 株式会社ワンダーフューチャーコーポレーション | はんだ接合方法及びはんだ接合装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3451122A (en) * | 1964-06-11 | 1969-06-24 | Western Electric Co | Methods of making soldered connections |
FR2088990A5 (ja) * | 1970-03-27 | 1972-01-07 | Owens Illinois Inc | |
JPS61166197A (ja) * | 1985-01-18 | 1986-07-26 | 松下電器産業株式会社 | 半田付け方法 |
JPH0693536B2 (ja) * | 1989-04-17 | 1994-11-16 | 愛知電機 株式会社 | 立体配線回路基板の製造方法 |
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TW201540153A (zh) | 2015-10-16 |
EP3001782A1 (en) | 2016-03-30 |
US9949375B2 (en) | 2018-04-17 |
EP3001782B1 (en) | 2018-09-05 |
CN105557076B (zh) | 2017-03-08 |
CN105557076A (zh) | 2016-05-04 |
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