JP5664986B2 - 遮断部材を備えるエアナイフチャンバー - Google Patents
遮断部材を備えるエアナイフチャンバー Download PDFInfo
- Publication number
- JP5664986B2 JP5664986B2 JP2013519602A JP2013519602A JP5664986B2 JP 5664986 B2 JP5664986 B2 JP 5664986B2 JP 2013519602 A JP2013519602 A JP 2013519602A JP 2013519602 A JP2013519602 A JP 2013519602A JP 5664986 B2 JP5664986 B2 JP 5664986B2
- Authority
- JP
- Japan
- Prior art keywords
- blocking member
- substrate
- air knife
- water
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000000903 blocking effect Effects 0.000 title claims description 71
- 239000000758 substrate Substances 0.000 claims description 55
- 238000005192 partition Methods 0.000 claims description 42
- 239000007788 liquid Substances 0.000 claims description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 57
- 238000004140 cleaning Methods 0.000 description 39
- 238000009434 installation Methods 0.000 description 13
- 239000002245 particle Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 239000011261 inert gas Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 231100001261 hazardous Toxicity 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Working Measures On Existing Buildindgs (AREA)
- Drying Of Solid Materials (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
Claims (2)
- 基板が流入する流入口と、基板が排出される排出口とが形成されたチャンバー本体、
前記チャンバー本体の内部で前記流入口と前記排出口との間に設けられ、前記チャンバー本体の内部を前記流入口側の前方部と、前記排出口側の後方部とに分け、基板が通過可能なスリットが形成された隔壁、
前記スリットの上側で前記隔壁に設けられた遮断部材、及び
基板にある液体を除去するために高圧気体を噴射するエアナイフを含み、
前記エアナイフは、前記高圧気体をスリットを通じて前記前方部側に噴射可能であるように、前記隔壁の後方で前記スリットに近接して設けられ、
前記遮断部材は、先端が前記基板の面に向かって下方に傾斜して設けられ、
前記隔壁に沿って流れた液体が前記遮断部材に沿って流れ、前記スリットよりも前方側に落ち、
前記遮断部材は、前記基板の面と平行な水平線に対して下方に20度以上35度以下に傾斜し、
前記遮断部材は、基板から9cm以上11cm以下の位置に設けられ、その長さ(L)は9cm以上13cm以下であることを特徴とするエアナイフチャンバー。 - 前記隔壁と前記エアナイフとは、前記基板の面に平行な断面で見たときに前記基板の移動方向に対して傾斜して設けられたことを特徴とする請求項1に記載のエアナイフチャンバー。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100067948 | 2010-07-14 | ||
KR10-2010-0067948 | 2010-07-14 | ||
KR1020110069965A KR101227079B1 (ko) | 2010-07-14 | 2011-07-14 | 차단부재를 구비하는 에어 나이프 챔버 |
KR10-2011-0069965 | 2011-07-14 | ||
PCT/KR2011/005204 WO2012008783A2 (ko) | 2010-07-14 | 2011-07-14 | 차단부재를 구비하는 에어 나이프 챔버 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013531900A JP2013531900A (ja) | 2013-08-08 |
JP5664986B2 true JP5664986B2 (ja) | 2015-02-04 |
Family
ID=45612797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013519602A Active JP5664986B2 (ja) | 2010-07-14 | 2011-07-14 | 遮断部材を備えるエアナイフチャンバー |
Country Status (6)
Country | Link |
---|---|
US (1) | US8667704B2 (ja) |
EP (1) | EP2595178B1 (ja) |
JP (1) | JP5664986B2 (ja) |
KR (1) | KR101227079B1 (ja) |
CN (1) | CN103003922B (ja) |
WO (1) | WO2012008783A2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012008783A2 (ko) * | 2010-07-14 | 2012-01-19 | 주식회사 엘지화학 | 차단부재를 구비하는 에어 나이프 챔버 |
CN104588351A (zh) * | 2014-12-02 | 2015-05-06 | 深圳市华星光电技术有限公司 | 基板清洗装置和使用其清洗基板的方法 |
CN108022864B (zh) * | 2016-10-28 | 2020-06-30 | 盟立自动化股份有限公司 | 湿式制程装置 |
CN106738400A (zh) * | 2016-12-12 | 2017-05-31 | 惠科股份有限公司 | 玻璃碎屑清洁结构及搬运机 |
CN107065433B (zh) * | 2017-05-08 | 2021-01-26 | 京东方科技集团股份有限公司 | 干燥装置 |
CN108847398B (zh) * | 2018-05-16 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | 用于干燥基板的风刀装置 |
CN112939109B (zh) * | 2021-01-28 | 2022-08-30 | 重庆海纳川环保科技有限公司 | 一种污水处理用格栅除渣装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5379784A (en) * | 1993-01-23 | 1995-01-10 | Tokyo Electron Limited | Apparatus for cleaning conveyor chuck |
JP3070511B2 (ja) * | 1997-03-31 | 2000-07-31 | 日本電気株式会社 | 基板乾燥装置 |
JPH11204489A (ja) * | 1998-01-12 | 1999-07-30 | Dainippon Screen Mfg Co Ltd | 基板乾燥装置及び基板乾燥方法 |
US6128830A (en) * | 1999-05-15 | 2000-10-10 | Dean Bettcher | Apparatus and method for drying solid articles |
US6282812B1 (en) * | 1999-12-20 | 2001-09-04 | St Assembly Test Services Pte Ltd. | Multi air-knife box and method of use |
US6421932B2 (en) * | 2000-02-14 | 2002-07-23 | Hitachi Electronics Engineering Co., Ltd. | Method and apparatus for drying substrate plates |
US20030045098A1 (en) * | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
JP3754905B2 (ja) * | 2001-09-10 | 2006-03-15 | 東京エレクトロン株式会社 | 基板乾燥装置 |
JP4579268B2 (ja) * | 2001-11-12 | 2010-11-10 | 東京エレクトロン株式会社 | 基板処理装置 |
US20040031167A1 (en) * | 2002-06-13 | 2004-02-19 | Stein Nathan D. | Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife |
JP3993048B2 (ja) * | 2002-08-30 | 2007-10-17 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR20060027597A (ko) * | 2004-09-23 | 2006-03-28 | 주식회사 케이씨텍 | 기판세정장치 및 기판세정방법 |
KR20060073079A (ko) * | 2004-12-24 | 2006-06-28 | 주식회사 케이씨텍 | 기판건조장치 |
JP2006247541A (ja) * | 2005-03-11 | 2006-09-21 | Toray Ind Inc | 液体除去装置 |
JP4642639B2 (ja) * | 2005-11-15 | 2011-03-02 | 三菱電機株式会社 | 基板乾燥装置及び基板処理方法 |
JP4859242B2 (ja) * | 2006-07-27 | 2012-01-25 | 芝浦メカトロニクス株式会社 | 基板の処理装置 |
JP4774004B2 (ja) * | 2007-03-30 | 2011-09-14 | 富士フイルム株式会社 | ウエブ状被洗浄物の洗浄方法及び装置 |
KR20080090070A (ko) * | 2007-04-04 | 2008-10-08 | 삼성전자주식회사 | 에어나이프 및 이를 포함하는 기판 건조 장치 |
JP2009088442A (ja) * | 2007-10-03 | 2009-04-23 | Hitachi High-Technologies Corp | 基板乾燥装置、フラットパネルディスプレイの製造装置及びフラットパネルディスプレイ |
KR100870838B1 (ko) * | 2008-03-04 | 2008-11-28 | 한국철강 주식회사 | 투명전극이 코팅된 기판의 수분 제거방법 |
US8410712B2 (en) * | 2008-07-09 | 2013-04-02 | Ncc Nano, Llc | Method and apparatus for curing thin films on low-temperature substrates at high speeds |
BR112012015373A2 (pt) * | 2009-12-22 | 2020-09-15 | 3M Innovative Properties Company | aparelhos e métodos para impactar fluidos contra subtratos |
WO2012008783A2 (ko) * | 2010-07-14 | 2012-01-19 | 주식회사 엘지화학 | 차단부재를 구비하는 에어 나이프 챔버 |
-
2011
- 2011-07-14 WO PCT/KR2011/005204 patent/WO2012008783A2/ko active Application Filing
- 2011-07-14 JP JP2013519602A patent/JP5664986B2/ja active Active
- 2011-07-14 CN CN201180034690.7A patent/CN103003922B/zh active Active
- 2011-07-14 KR KR1020110069965A patent/KR101227079B1/ko active IP Right Grant
- 2011-07-14 EP EP11807068.9A patent/EP2595178B1/en active Active
-
2013
- 2013-01-07 US US13/735,625 patent/US8667704B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2012008783A3 (ko) | 2012-05-03 |
KR101227079B1 (ko) | 2013-01-28 |
US20130180079A1 (en) | 2013-07-18 |
KR20120007470A (ko) | 2012-01-20 |
JP2013531900A (ja) | 2013-08-08 |
EP2595178A4 (en) | 2017-05-03 |
CN103003922B (zh) | 2016-11-02 |
EP2595178A2 (en) | 2013-05-22 |
CN103003922A (zh) | 2013-03-27 |
US8667704B2 (en) | 2014-03-11 |
WO2012008783A2 (ko) | 2012-01-19 |
EP2595178B1 (en) | 2019-09-04 |
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