JP5608545B2 - Thermocompression bonding head, mounting apparatus and mounting method - Google Patents

Thermocompression bonding head, mounting apparatus and mounting method Download PDF

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Publication number
JP5608545B2
JP5608545B2 JP2010288320A JP2010288320A JP5608545B2 JP 5608545 B2 JP5608545 B2 JP 5608545B2 JP 2010288320 A JP2010288320 A JP 2010288320A JP 2010288320 A JP2010288320 A JP 2010288320A JP 5608545 B2 JP5608545 B2 JP 5608545B2
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Prior art keywords
mounting
thermocompression bonding
peltier element
bonding head
heat
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JP2012138410A (en
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芳人 田中
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Dexerials Corp
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Dexerials Corp
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Priority to JP2010288320A priority Critical patent/JP5608545B2/en
Priority to CN201180052534.3A priority patent/CN103168349B/en
Priority to PCT/JP2011/079855 priority patent/WO2012086771A1/en
Priority to KR1020137010708A priority patent/KR20130141495A/en
Priority to TW100148174A priority patent/TW201236093A/en
Publication of JP2012138410A publication Critical patent/JP2012138410A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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Description

本発明は、基板やパネルの実装部に熱硬化性の接着剤を介して実装部品を加熱圧着することにより接合させる熱圧着ヘッド、実装装置及び実装方法に関する。 The present invention, thermocompression bonding head for bonding by heating bonding a mounting component via the thermosetting adhesive to the mounting portion of the substrate or panel, on implementing device and mounting how.

従来から、テレビやＰＣモニタ、携帯電話、タブレットパソコン、携帯型ゲーム機あるいは車載用モニタ等の各種表示手段として、液晶表示装置が多く用いられている。近年、このような液晶表示装置においては、ファインピッチ化、軽量薄型化等の観点から、液晶駆動用ＩＣを直接液晶表示パネルの基板上に実装するいわゆるＣＯＧ（chip on glass）や、液晶駆動回路が形成されたフレキシブル基板を直接液晶表示パネルの基板上に実装するいわゆるＦＯＧ（film on glass）が採用されている。   2. Description of the Related Art Conventionally, liquid crystal display devices are often used as various display means such as a television, a PC monitor, a mobile phone, a tablet personal computer, a portable game machine, or an in-vehicle monitor. In recent years, in such liquid crystal display devices, so-called COG (chip on glass) in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel or a liquid crystal driving circuit from the viewpoints of fine pitch, light weight, and thinning. A so-called FOG (film on glass) that directly mounts the flexible substrate on which the substrate is formed on the substrate of the liquid crystal display panel is employed.

例えばＣＯＧ実装方式が採用された液晶表示装置１００は、図９に示すように、液晶表示のための主機能を果たす液晶表示パネル１０４を有しており、この液晶表示パネル１０４は、ガラス基板等からなる互いに対向する二枚の透明基板１０２，１０３を有している。そして、液晶表示パネル１０４は、これら両透明基板１０２，１０３が枠状のシール１０５によって互いに貼り合わされるとともに、両透明基板１０２，１０３およびシール１０５によって囲繞された空間内に液晶１０６が封入されたパネル表示部１０７が設けられている。   For example, a liquid crystal display device 100 employing a COG mounting system has a liquid crystal display panel 104 that performs a main function for liquid crystal display, as shown in FIG. 9, and the liquid crystal display panel 104 is a glass substrate or the like. And two transparent substrates 102 and 103 facing each other. In the liquid crystal display panel 104, the transparent substrates 102 and 103 are bonded to each other by a frame-shaped seal 105, and the liquid crystal 106 is sealed in a space surrounded by the transparent substrates 102 and 103 and the seal 105. A panel display unit 107 is provided.

透明基板１０２，１０３は、互いに対向する両内側表面に、ＩＴＯ（酸化インジウムスズ）等からなる縞状の一対の透明電極１０８，１０９が、互いに交差するように形成されている。そして、両透明基板１０２，１０３は、これら両透明電極１０８，１０９の当該交差部位によって液晶表示の最小単位としての画素が構成されるようになっている。   The transparent substrates 102 and 103 have a pair of striped transparent electrodes 108 and 109 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent substrates 102 and 103 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 108 and 109.

両透明基板１０２，１０３のうち、一方の透明基板１０３は、他方の透明基板１０２よりも平面寸法が大きく形成されており、この大きく形成された透明基板１０３の縁部１０３ａには、透明電極１０９の端子部１０９ａが形成されている。また、両透明電極１０８，１０９上には、所定のラビング処理が施された配向膜１１１，１１２が形成されており、この配向膜１１１，１１２によって液晶分子の初期配向が規制されるようになっている。さらに、両透明基板１０８，１０９の外側には、一対の偏光板１１８，１１９が配設されており、これら両偏光板１１８，１１９によってバックライト等の光源１２０からの透過光の振動方向が規制されるようになっている。   Of the two transparent substrates 102 and 103, one transparent substrate 103 is formed to have a larger planar dimension than the other transparent substrate 102, and the transparent electrode 109 is formed on the edge 103a of the transparent substrate 103 formed to be large. Terminal portion 109a is formed. Further, alignment films 111 and 112 subjected to a predetermined rubbing process are formed on both transparent electrodes 108 and 109, and the initial alignment of liquid crystal molecules is regulated by the alignment films 111 and 112. ing. Further, a pair of polarizing plates 118 and 119 are disposed outside both the transparent substrates 108 and 109, and the vibration direction of transmitted light from the light source 120 such as a backlight is regulated by both the polarizing plates 118 and 119. It has come to be.

端子部１０９ａ上には、異方性導電フィルム１１４を介して液晶駆動用ＩＣ１１５が熱圧着されている。異方性導電フィルム１１４は、熱硬化型のバインダー樹脂に導電性粒子を混ぜ込んでフィルム状としたもので、２つの導体間で加熱圧着されることにより導電粒子で導体間の電気的導通がとられ、バインダー樹脂にて導体間の機械的接続が保持される。液晶駆動用ＩＣ１１５は、画素に対して液晶駆動電圧を選択的に印加することにより、液晶の配向を部分的に変化させて所定の液晶表示を行うことができるようになっている。なお、異方性導電フィルム１１４を構成する接着剤としては、通常、最も信頼性の高い熱硬化性の接着剤を用いるようになっている。   On the terminal portion 109a, a liquid crystal driving IC 115 is thermocompression bonded via an anisotropic conductive film 114. The anisotropic conductive film 114 is a film formed by mixing conductive particles in a thermosetting binder resin, and heat conduction is performed between the two conductors so that the electrical conduction between the conductors is achieved by the conductive particles. And the mechanical connection between the conductors is maintained by the binder resin. The liquid crystal driving IC 115 can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying a liquid crystal driving voltage to the pixels. In addition, as the adhesive constituting the anisotropic conductive film 114, the most reliable thermosetting adhesive is usually used.

このような異方性導電フィルム１１４を介して液晶駆動用ＩＣ１１５を端子部１０９ａへ接続する場合は、先ず、透明電極１０９の端子部１０９ａ上に異方性導電フィルム１１４を図示しない仮圧着手段によって仮圧着する。続いて、異方性導電フィルム１１４上に液晶駆動用ＩＣ１１５を載置した後、図１０に示すように熱圧着ヘッド等の熱圧着手段１２１によって液晶駆動用ＩＣ１１５を異方性導電フィルム１１４とともに端子部１０９ａ側へ押圧しつつ熱圧着手段１２１を発熱させる。この熱圧着手段１２１による発熱によって、異方性導電フィルム１１４は熱硬化反応を起こし、これにより、異方性導電フィルム１１４を介して液晶駆動用ＩＣ１１５が端子部１０９ａ上に接着される。   When the liquid crystal driving IC 115 is connected to the terminal portion 109a through such an anisotropic conductive film 114, first, the anisotropic conductive film 114 is attached to the terminal portion 109a of the transparent electrode 109 by a temporary crimping means (not shown). Temporarily crimp. Subsequently, after the liquid crystal driving IC 115 is mounted on the anisotropic conductive film 114, the liquid crystal driving IC 115 is connected to the terminal together with the anisotropic conductive film 114 by thermocompression bonding means 121 such as a thermocompression bonding head as shown in FIG. The thermocompression bonding means 121 is caused to generate heat while being pressed toward the portion 109a. Due to the heat generated by the thermocompression bonding means 121, the anisotropic conductive film 114 undergoes a thermosetting reaction, whereby the liquid crystal driving IC 115 is bonded onto the terminal portion 109a via the anisotropic conductive film 114.

ところで、最近では表示装置の薄型・軽量化の傾向に伴って、液晶表示装置１００自体も小型・軽量化が図られる一方で、液晶表示装置１００の表示領域をできるだけ確保することが要請され、端子部１０９ａが設けられる縁部１０３ａをできるだけ小さくすることが要求されている。   By the way, recently, along with the trend toward thin and light display devices, the liquid crystal display device 100 itself has been reduced in size and weight, while it has been required to secure the display area of the liquid crystal display device 100 as much as possible. It is required to make the edge 103a provided with the portion 109a as small as possible.

これに伴って、熱圧着手段１２１によって熱加圧される端子部１０９ａとパネル表示部１０７との距離がますます短くなり、しかも熱圧着手段１２１の小型化に伴って加熱温度も高くなる傾向にあるため、その熱によって液晶表示パネル１０４に貼着されている偏光板１１８，１１９や、透明基板１０２，１０３相互を封止しているシール１０５が変質を来してしまうという問題があった。   Along with this, the distance between the terminal portion 109a thermally pressed by the thermocompression bonding means 121 and the panel display portion 107 becomes shorter, and the heating temperature tends to increase with the miniaturization of the thermocompression bonding means 121. Therefore, there is a problem that the polarizing plates 118 and 119 attached to the liquid crystal display panel 104 and the seal 105 sealing the transparent substrates 102 and 103 are deteriorated by the heat.

また、図１１に示すように、液晶パネルの端子部１０９ａにベアチップ実装された液晶駆動用ＩＣ１１５の近傍に、液晶駆動回路が形成されたフレキシブル基板１２２がＦＯＧ実装される場合には、熱圧着手段１２１からの熱により液晶駆動用ＩＣ１１５に熱衝撃が加わり、また、端子部１０９ａへの搭載状態が不安定になるという問題もある。   As shown in FIG. 11, when a flexible substrate 122 on which a liquid crystal driving circuit is formed is mounted near the liquid crystal driving IC 115 that is bare-chip mounted on the terminal portion 109a of the liquid crystal panel, thermocompression bonding means There is also a problem that a thermal shock is applied to the liquid crystal driving IC 115 due to the heat from 121, and the mounting state on the terminal portion 109a becomes unstable.

特開２００３−１９５３３５号公報JP 2003-195335 A

そこで、本発明は、狭小化された端子部へ実装部品を異方性導電フィルムを介して熱加圧することにより実装する実装装置及び実装方法において、パネル表示部や他の電子部品といった他の構成部品に対する熱衝撃を緩和させることができる熱圧着ヘッド、実装装置及び実装方法を提供することを目的とする。 Therefore, the present invention provides a mounting apparatus and mounting method for mounting a mounting component on a narrowed terminal portion by applying heat and pressure via an anisotropic conductive film, and other configurations such as a panel display unit and other electronic components. thermocompression bonding head can alleviate heat shock to components, and an object thereof is to provide a mounting apparatus and a mounting how.

上述した課題を解決するために、本発明に係る熱圧着ヘッドは、熱硬化性の接着剤層を介して実装部品を熱加圧することにより実装部に上記実装部品を接続する熱圧着ヘッドにおいて、上記熱圧着ヘッドは、ペルチェ素子を有し、上記ペルチェ素子は、上記実装部品を熱加圧する際に、上記実装部近傍に設けられた上記他の構成部品と対峙する面側を冷却部とするものである。   In order to solve the above-described problem, the thermocompression bonding head according to the present invention is a thermocompression bonding head that connects the mounting component to the mounting part by heat-pressing the mounting component via a thermosetting adhesive layer. The thermocompression bonding head includes a Peltier element, and the Peltier element has a cooling part on a surface side facing the other component parts provided in the vicinity of the mounting part when the mounting part is thermally pressurized. Is.

また、本発明に係る実装装置は、熱硬化性の接着剤層を介して実装部品を熱加圧することにより実装部に上記実装部品を接続する熱圧着ヘッドと、上記熱圧着ヘッドを実装部品が接続される上記実装部に対峙させ、該実装部と近接離間させるヘッド駆動機構とを備え、上記熱圧着ヘッドは、ペルチェ素子を有し、上記ペルチェ素子は、上記実装部品を熱加圧する際に、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とするものである。   Further, the mounting device according to the present invention includes a thermocompression bonding head that connects the mounting component to the mounting part by heat-pressing the mounting component through a thermosetting adhesive layer, and the mounting component includes the thermocompression bonding head. A head drive mechanism that opposes the mounting part to be connected and moves the head close to and away from the mounting part, the thermocompression bonding head has a Peltier element, and the Peltier element is used when heat-pressing the mounting component. The surface facing the other component parts provided in the vicinity of the mounting part is the cooling part.

また、本発明に係る実装方法は、実装部上に熱硬化性の接着剤層を介して実装部品を載置する工程と、ペルチェ素子を有する熱圧着ヘッドによって上記実装部品を上記実装部上に熱加圧する工程とを有し、上記熱加圧工程において、上記ペルチェ素子は、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とするものである。   Further, the mounting method according to the present invention includes a step of placing the mounting component on the mounting portion via a thermosetting adhesive layer, and the mounting component on the mounting portion by a thermocompression bonding head having a Peltier element. A step of heat-pressing, and in the heat-pressing step, the Peltier element has a cooling portion on a surface facing the other components provided in the vicinity of the mounting portion.

本発明によれば、熱圧着ヘッドは、ペルチェ素子を有し、このペルチェ素子に所定方向の電流を流すことにより他の構成部品に面する側を冷却部としているため、熱が他の構成部品に伝達することを防止できる。   According to the present invention, the thermocompression bonding head has a Peltier element, and a current flowing in a predetermined direction through the Peltier element is used as a cooling part on the side facing the other component part. Can be prevented from being transmitted.

本発明が適用された実装装置を示す側面図である。It is a side view which shows the mounting apparatus with which this invention was applied. 他の液晶表示パネルに本発明が適用された実装装置を用いる状態を示す断面図である。It is sectional drawing which shows the state which uses the mounting apparatus with which this invention was applied to the other liquid crystal display panel. 複数のペルチェ素子が重畳して取り付けられている構成を示す側面図である。It is a side view which shows the structure by which the several Peltier element is overlapped and attached. ペルチェ素子によっても実装部品を熱加圧する構成を示す側面図である。It is a side view which shows the structure which heat-presses mounting components also by a Peltier device. ペルチェ素子を介して複数の熱圧着ヘッドを備える構成を示す側面図である。It is a side view showing composition provided with a plurality of thermocompression-bonding heads via a Peltier device. ヘッド本体の周囲にペルチェ素子を設けた構成を示す断面図である。It is sectional drawing which shows the structure which provided the Peltier element around the head main body. ヒーターを内蔵せず、ペルチェ素子によって加熱される熱圧着ヘッドを示す断面図である。It is sectional drawing which shows the thermocompression-bonding head heated by a Peltier device without incorporating a heater. ペルチェ素子からなる熱圧着ヘッドを示す側面図である。It is a side view which shows the thermocompression-bonding head which consists of a Peltier device. 従来の液晶表示パネルを示す断面図である。It is sectional drawing which shows the conventional liquid crystal display panel. 従来の液晶表示パネルのＣＯＧ実装工程を示す断面図である。It is sectional drawing which shows the COG mounting process of the conventional liquid crystal display panel. 従来の液晶表示パネルのＦＯＧ実装工程を示す断面図である。It is sectional drawing which shows the FOG mounting process of the conventional liquid crystal display panel.

以下、本発明が適用された熱圧着ヘッド、実装装置、実装方法及び接合体について、図面を参照しながら詳細に説明する。本発明が適用された実装装置１は、熱圧着ヘッド３を備え、液晶駆動用ＩＣを直接液晶表示パネルの基板上に実装するいわゆるＣＯＧ（chip on glass）実装や、液晶駆動回路が形成されたフレキシブル基板を直接液晶表示パネルの基板上に実装するいわゆるＦＯＧ（film on glass）実装等に好適に用いることができる。   Hereinafter, a thermocompression bonding head, a mounting apparatus, a mounting method, and a joined body to which the present invention is applied will be described in detail with reference to the drawings. The mounting apparatus 1 to which the present invention is applied includes a thermocompression bonding head 3, and a so-called COG (chip on glass) mounting in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel, or a liquid crystal driving circuit is formed. It can be suitably used for so-called FOG (film on glass) mounting or the like in which a flexible substrate is directly mounted on a substrate of a liquid crystal display panel.

実装装置１の説明に先立って、実装装置１によって液晶駆動用ＩＣや液晶駆動回路が形成されたフレキシブル基板が実装される液晶表示パネル１０について、図１を参照しながら説明する。液晶表示パネル１０は、上記液晶表示パネル１０４と同様に、ガラス基板等からなる二枚の透明基板１１，１２が対向配置され、これら透明基板１１，１２が枠状のシール１３によって互いに貼り合わされている。そして、液晶表示パネル１０は、透明基板１１，１２によって囲繞された空間内に液晶１４が封入されることによりパネル表示部１５が形成されている。   Prior to the description of the mounting apparatus 1, a liquid crystal display panel 10 on which a flexible substrate on which a liquid crystal driving IC and a liquid crystal driving circuit are formed by the mounting apparatus 1 is mounted will be described with reference to FIG. In the liquid crystal display panel 10, similarly to the liquid crystal display panel 104, two transparent substrates 11 and 12 made of a glass substrate or the like are arranged to face each other, and the transparent substrates 11 and 12 are bonded to each other by a frame-shaped seal 13. Yes. In the liquid crystal display panel 10, the liquid crystal 14 is sealed in a space surrounded by the transparent substrates 11 and 12 to form a panel display unit 15.

透明基板１１，１２は、互いに対向する両内側表面に、ＩＴＯ（酸化インジウムスズ）等からなる縞状の一対の透明電極１６，１７が、互いに交差するように形成されている。そして、両透明基板１６，１７は、これら両透明電極１６，１７の当該交差部位によって液晶表示の最小単位としての画素が構成されるようになっている。   The transparent substrates 11 and 12 have a pair of striped transparent electrodes 16 and 17 made of ITO (indium tin oxide) or the like on both inner surfaces facing each other so as to intersect each other. The transparent substrates 16 and 17 are configured such that a pixel as a minimum unit of liquid crystal display is constituted by the intersection of the transparent electrodes 16 and 17.

両透明基板１１，１２のうち、一方の透明基板１２は、他方の透明基板１１よりも平面寸法が大きく形成されており、この大きく形成された透明基板１２の縁部１２ａには、液晶駆動用ＩＣ等の電子部品１８が実装されるＣＯＧ実装部２０が設けられ、またＣＯＧ実装部２０の外側近傍には、液晶駆動回路が形成されたフレキシブル基板２１が実装されるＦＯＧ実装部２２が設けられている。   Of the transparent substrates 11 and 12, one transparent substrate 12 is formed to have a larger planar dimension than the other transparent substrate 11, and a liquid crystal driving edge is formed on the edge 12a of the formed transparent substrate 12. A COG mounting unit 20 on which an electronic component 18 such as an IC is mounted is provided, and an FOG mounting unit 22 on which a flexible substrate 21 on which a liquid crystal driving circuit is formed is mounted near the outside of the COG mounting unit 20. ing.

なお、液晶駆動用ＩＣや液晶駆動回路は、画素に対して液晶駆動電圧を選択的に印加することにより、液晶の配向を部分的に変化させて所定の液晶表示を行うことができるようになっている。   Note that the liquid crystal driving IC and the liquid crystal driving circuit can perform predetermined liquid crystal display by selectively changing the alignment of the liquid crystal by selectively applying the liquid crystal driving voltage to the pixels. ing.

各実装部２０，２２には、透明電極１７の端子部１７ａが形成されている。端子部１７ａ上には、異方性導電フィルム２３を介して液晶駆動用ＩＣ等の電子部品１８やフレキシブル基板２１が熱圧着される。異方性導電フィルム２３は、導電性粒子を含有しており、電子部品１８やフレキシブル基板２１の電極と透明基板１２の縁部１２ａに形成された透明電極１７の端子部１７ａとを、導電性粒子を介して電気的に接続させるものである。この異方性導電フィルム２３は、熱硬化型接着剤であり、後述する熱圧着ヘッド３により熱圧着されることにより、導電性粒子が透明電極１７の端子部１７ａと電子部品１８やフレキシブル基板２１の各電極との間で押し潰された状態で硬化し、透明基板１２と電子部品１８やフレキシブル基板２１とを電気的、機械的に接続させる。   In each of the mounting portions 20 and 22, a terminal portion 17a of the transparent electrode 17 is formed. On the terminal portion 17a, an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 are thermocompression bonded via an anisotropic conductive film 23. The anisotropic conductive film 23 contains conductive particles, and the electrode of the electronic component 18 or the flexible substrate 21 and the terminal portion 17a of the transparent electrode 17 formed on the edge portion 12a of the transparent substrate 12 are electrically conductive. Electrical connection is made through particles. The anisotropic conductive film 23 is a thermosetting adhesive, and is thermally bonded by a thermocompression bonding head 3 to be described later, so that the conductive particles become the terminal portions 17a of the transparent electrode 17, the electronic component 18, and the flexible substrate 21. It hardens | cures in the state crushed between each of these electrodes, and connects the transparent substrate 12, the electronic component 18, and the flexible substrate 21 electrically and mechanically.

具体的に、異方性導電フィルム２３は、有機樹脂バインダーに導電性粒子が含有された組成であり、有機樹脂バインダーは膜形成材料、液状硬化成分、シランカップリング剤、硬化剤等から構成される。膜形成材料としては、フェノキシ樹脂、固形エポキシ樹脂等、膜形成能を有する有機樹脂であれば適宜使用することができる。液状硬化成分は、液状エポキシ樹脂、液状アクリレートなど熱硬化性を有する化合物を適宜使用することができる。液状エポキシ樹脂を使用した場合における硬化剤としては、アミン系硬化剤、イミダゾール類、スルホニウム塩、オニウム塩等を好ましく使用することができる。液状アクリレートを使用した場合における硬化剤としては、有機過酸化物などの熱ラジカル発生剤を好ましく使用することができる。更に無機フィラー、各種添加剤を用いてもよい。   Specifically, the anisotropic conductive film 23 has a composition in which conductive particles are contained in an organic resin binder, and the organic resin binder includes a film forming material, a liquid curing component, a silane coupling agent, a curing agent, and the like. The As the film forming material, any organic resin having film forming ability such as phenoxy resin and solid epoxy resin can be used as appropriate. As the liquid curing component, a thermosetting compound such as a liquid epoxy resin or liquid acrylate can be appropriately used. As a curing agent when a liquid epoxy resin is used, an amine-based curing agent, imidazoles, sulfonium salts, onium salts and the like can be preferably used. As a curing agent when a liquid acrylate is used, a thermal radical generator such as an organic peroxide can be preferably used. Furthermore, you may use an inorganic filler and various additives.

導電性粒子としては、異方性導電フィルム２３において使用されている公知の何れの導電性粒子を挙げることができ、例えば、ニッケル、鉄、銅、アルミニウム、錫、鉛、クロム、コバルト、銀、金等の各種金属や金属合金の粒子、金属酸化物、カーボン、グラファイト、ガラス、セラミック、プラスチック等の粒子の表面に金属をコートしたもの、或いは、これらの粒子の表面に更に絶縁薄膜をコートしたもの等が挙げられる。樹脂粒子の表面に金属をコートしたものである場合、樹脂粒子としては、例えば、エポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン（ＡＳ）樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等の粒子を挙げることができる。   Examples of the conductive particles include any known conductive particles used in the anisotropic conductive film 23. For example, nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, Particles of various metals such as gold and metal alloys, metal oxides, carbon, graphite, glass, ceramics, plastics and other particles coated with metal, or the surface of these particles further coated with an insulating thin film And the like. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

このような異方性導電フィルム２３を介して電子部品１８やフレキシブル基板２１を端子部１７ａへ接続する場合は、先ず、透明電極１７の端子部１７ａ上に異方性導電フィルム２３を図示しない仮圧着手段によって仮圧着する。続いて、異方性導電フィルム２３上に電子部品１８やフレキシブル基板２１を載置した後、熱圧着ヘッド３によって電子部品１８やフレキシブル基板２１を異方性導電フィルム２３とともに端子部１７ａ側へ押圧しつつ熱圧着ヘッド３を発熱させる。この熱圧着ヘッド３による発熱によって、異方性導電フィルム２３は熱硬化反応を起こし、これにより、異方性導電フィルム２３を介して電子部品１８やフレキシブル基板２１が端子部１７ａ上に接着される。   When the electronic component 18 or the flexible substrate 21 is connected to the terminal portion 17a through such an anisotropic conductive film 23, first, the anisotropic conductive film 23 is not illustrated on the terminal portion 17a of the transparent electrode 17. Temporary pressure bonding is performed by a pressure bonding means. Subsequently, after placing the electronic component 18 and the flexible substrate 21 on the anisotropic conductive film 23, the thermocompression bonding head 3 presses the electronic component 18 and the flexible substrate 21 together with the anisotropic conductive film 23 toward the terminal portion 17 a side. While doing so, the thermocompression bonding head 3 generates heat. Due to the heat generated by the thermocompression bonding head 3, the anisotropic conductive film 23 undergoes a thermosetting reaction, whereby the electronic component 18 and the flexible substrate 21 are bonded onto the terminal portion 17a via the anisotropic conductive film 23. .

なお、本実施の形態では、異方性導電フィルム２３に変えて、バインダーのみからなる絶縁性接着フィルム（ＮＣＦ（Non Conductive Film））を用いてもよい。この場合、電子部品１８やフレキシブル基板２１と透明電極１７の端子部１７ａとは、直接接触することにより導通が図られる。この場合、電子部品１８のバンプとしてはスタッドバンプ等が好適に使用できる。   In this embodiment, instead of the anisotropic conductive film 23, an insulating adhesive film (NCF (Non Conductive Film)) made of only a binder may be used. In this case, the electronic component 18 or the flexible substrate 21 and the terminal portion 17a of the transparent electrode 17 are electrically connected by direct contact. In this case, stud bumps or the like can be suitably used as the bumps of the electronic component 18.

なお、異方性導電フィルム２３は、取り扱いの容易さ、保存安定性等の見地から、剥離処理が施されたＰＥＴ等の剥離フィルム上に塗布形成されている。また、異方性導電フィルム２３の形状は、特に限定されないが、例えば、プラスチック等からなる巻取リールに巻回可能な長尺テープ形状とし、実装に用いる際に、所定の長さだけカットして使用することができる。   The anisotropic conductive film 23 is applied and formed on a release film such as PET that has been subjected to a release treatment from the standpoint of ease of handling and storage stability. The shape of the anisotropic conductive film 23 is not particularly limited. For example, the anisotropic conductive film 23 has a long tape shape that can be wound around a take-up reel made of plastic or the like, and is cut by a predetermined length when used for mounting. Can be used.

両透明電極１６，１７上には、所定のラビング処理が施された配向膜２４が形成されており、この配向膜２４によって液晶分子の初期配向が規制されるようになっている。さらに、両透明基板１１，１２の外側には、一対の偏光板２５，２６が配設されており、これら両偏光板２５，２６によってバックライト等の光源（図示せず）からの透過光の振動方向が規制されるようになっている。   An alignment film 24 subjected to a predetermined rubbing process is formed on both transparent electrodes 16 and 17, and the initial alignment of liquid crystal molecules is regulated by the alignment film 24. In addition, a pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12, and these polarizing plates 25 and 26 allow transmitted light from a light source (not shown) such as a backlight to be transmitted. The vibration direction is regulated.

［実装装置１］
実装装置１は、このような液晶表示パネル１０のＣＯＧ実装部２０に電子部品１８を実装し、またＦＯＧ実装部２２にフレキシブル基板２１を実装するものであり、図１に示すように、液晶表示パネル１０が載置されるステージ２と、ステージ２に載置された液晶表示パネル１０の各実装部２０，２２に液晶駆動用ＩＣ等の電子部品１８やフレキシブル基板２１を実装する熱圧着ヘッド３と、熱圧着ヘッド３を各実装部２０，２２に近接離間させるヘッド駆動機構４とを備える。 [Mounting device 1]
The mounting apparatus 1 mounts the electronic component 18 on the COG mounting portion 20 of the liquid crystal display panel 10 and also mounts the flexible substrate 21 on the FOG mounting portion 22. As shown in FIG. A stage 2 on which the panel 10 is mounted, and a thermocompression bonding head 3 for mounting an electronic component 18 such as a liquid crystal driving IC and a flexible substrate 21 on the mounting parts 20 and 22 of the liquid crystal display panel 10 mounted on the stage 2. And a head driving mechanism 4 that moves the thermocompression bonding head 3 close to and away from the mounting portions 20 and 22.

ステージ２は、液晶表示パネル１０を載置するのに十分な大きさを有し、液晶表示パネル１０が位置決めされて載置される。ステージ２は、液晶表示パネル１０が位置決めされて載置されたときに、透明基板１２の縁部１２ａに設けられたＣＯＧ実装部２０やＦＯＧ実装部２２に対向して熱圧着ヘッド３が設けられている。   The stage 2 has a sufficient size for mounting the liquid crystal display panel 10, and the liquid crystal display panel 10 is positioned and mounted. When the liquid crystal display panel 10 is positioned and placed on the stage 2, the thermocompression bonding head 3 is provided so as to face the COG mounting part 20 and the FOG mounting part 22 provided on the edge part 12 a of the transparent substrate 12. ing.

熱圧着ヘッド３は、電子部品１８やフレキシブル基板２１を押圧する押圧面３ａと、ヒーターが内蔵されるとともにペルチェ素子５が取り付けられるヘッド本体３ｂとを有する。熱圧着ヘッド３は、所定の温度に加熱された押圧面３ａを所定の圧力、時間で、電子部品１８やフレキシブル基板２１に押し当てることにより、異方性導電フィルム２３を、導電性粒子が押し潰された状態で硬化させる。   The thermocompression bonding head 3 has a pressing surface 3a for pressing the electronic component 18 and the flexible substrate 21, and a head main body 3b in which a heater is built and a Peltier element 5 is attached. The thermocompression bonding head 3 presses the anisotropic conductive film 23 with conductive particles by pressing the pressing surface 3a heated to a predetermined temperature against the electronic component 18 and the flexible substrate 21 with a predetermined pressure and time. Cure in the crushed state.

熱圧着ヘッド３は、ヘッド本体３ｂにペルチェ素子５が設けられている。ペルチェ素子５は、異種金属または異種半導体の接触面を通電したとき熱が発生または吸収される現象を利用した板状の素子で、冷却部６と加熱部７を備える。ペルチェ素子５は、直流電流を流す方向を逆にすることにより、熱の移動方向も逆になるので、冷却部６と加熱部７を逆転することが可能である。このためペルチェ素子５は、加熱にも冷却にも利用することができ、高精度の温度制御に適している。実装装置１は、このペルチェ素子５を用いて、ヘッド本体３ｂの熱が電子部品１８やパネル表示部１５といった透明基板１２上の構成部品に伝達することを防止するものである。   The thermocompression bonding head 3 is provided with a Peltier element 5 on a head body 3b. The Peltier element 5 is a plate-like element that utilizes a phenomenon in which heat is generated or absorbed when a contact surface of a dissimilar metal or semiconductor is energized, and includes a cooling unit 6 and a heating unit 7. The Peltier element 5 can reverse the cooling direction 6 and the heating part 7 because the direction of heat transfer is reversed by reversing the direction in which the direct current flows. Therefore, the Peltier element 5 can be used for both heating and cooling, and is suitable for highly accurate temperature control. The mounting apparatus 1 uses the Peltier element 5 to prevent the heat of the head main body 3b from being transmitted to the components on the transparent substrate 12 such as the electronic component 18 and the panel display unit 15.

ペルチェ素子５は、ヘッド本体３ｂの少なくとも電子部品１８やパネル表示部１５と面する側面に形成され、構成部品に面する側を冷却部６とする。これは、液晶表示パネル１０は、パネル表示部１５を形成した後、電子部品１８をＣＯＧ実装し、次いでフレキシブル基板２１をＦＯＧ実装することから、各実装工程において、ヘッド本体３ｂに隣接するパネル表示部１５や電子部品１８にヘッド本体３ｂの熱が伝達することを防止するためである。   The Peltier element 5 is formed on at least a side surface of the head main body 3b facing the electronic component 18 and the panel display unit 15, and the side facing the component is a cooling unit 6. This is because the liquid crystal display panel 10 forms the panel display unit 15, mounts the electronic component 18 by COG, and then mounts the flexible substrate 21 by FOG. This is to prevent the heat of the head body 3b from being transmitted to the portion 15 and the electronic component 18.

［ヘッド駆動機構］
このような熱圧着ヘッド３を駆動するヘッド駆動機構４は、熱圧着ヘッド３をＣＯＧ実装部２０やＦＯＧ実装部２２に近接離間するように昇降自在に支持するとともに、ヘッド本体３ｂの昇降動作及びヘッド本体３ｂに内蔵されたヒーターの駆動を制御する。そして、ヘッド駆動機構４は、電子部品１８やフレキシブル基板２１の実装時には、ヘッド本体３ｂ内のヒーターを駆動して所定温度に加熱するとともに、熱圧着ヘッド３を所定時間、所定の圧力で電子部品１８やフレキシブル基板２１を押圧するように駆動する。 [Head drive mechanism]
The head driving mechanism 4 for driving the thermocompression bonding head 3 supports the thermocompression bonding head 3 so as to be movable up and down so as to be close to and away from the COG mounting portion 20 and the FOG mounting portion 22, The drive of the heater built in the head main body 3b is controlled. The head driving mechanism 4 drives the heater in the head main body 3b to heat it to a predetermined temperature when mounting the electronic component 18 and the flexible substrate 21, and also heats the thermocompression bonding head 3 with a predetermined pressure for a predetermined time. 18 and the flexible substrate 21 are driven to be pressed.

［実装方法］
次いで、かかる実装装置１を用いて液晶表示パネル１０にＣＯＧ実装及びＦＯＧ実装を行う工程について説明する。図１に示すように、実装装置１は、ステージ２上に、液晶表示パネル１０が位置決めされて載置される。このとき、液晶表示パネル１０は、透明基板１１，１２がシール１３によって貼り合わされ、内部空間に液晶が封入されている。また、液晶表示パネル１０は、相対向する内側表面に透明電極１６，１７が設けられ、透明基板１２の縁部には、それぞれ透明電極１７の端子部１７ａが形成されたＣＯＧ実装部２０及びＦＯＧ実装部２２が設けられている。さらに、液晶表示パネル１０は、透明電極１６，１７上には、所定のラビング処理が施された配向膜２４が形成されている。また、透明基板１１，１２の外側には一対の偏光板２５，２６が配設されている。 [Mounting method]
Next, a process of performing COG mounting and FOG mounting on the liquid crystal display panel 10 using the mounting apparatus 1 will be described. As shown in FIG. 1, the mounting apparatus 1 has a liquid crystal display panel 10 positioned and placed on a stage 2. At this time, in the liquid crystal display panel 10, the transparent substrates 11 and 12 are bonded together by the seal 13, and the liquid crystal is sealed in the internal space. Further, the liquid crystal display panel 10 is provided with transparent electrodes 16 and 17 on the inner surfaces facing each other, and the edge of the transparent substrate 12 is provided with the COG mounting portion 20 and the FOG in which the terminal portions 17a of the transparent electrodes 17 are formed, respectively. A mounting portion 22 is provided. Further, in the liquid crystal display panel 10, an alignment film 24 subjected to a predetermined rubbing process is formed on the transparent electrodes 16 and 17. A pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12.

先ず、ＣＯＧ実装部２０の端子部１７ａに異方性導電フィルム２３が配置される。このとき、熱圧着ヘッド３は、ヘッド駆動機構４によって、ＣＯＧ実装部２０の上方に支持されている。次いで、異方性導電フィルム２３上に液晶駆動用ＩＣ等の電子部品１８が配置される。そして、熱圧着ヘッド３は、ヘッド駆動機構４によってヘッド本体３ｂが所定温度に加熱され、押圧面３ａが電子部品１８を押圧するように下降するとともに、所定の圧力、時間だけ押圧するように制御される。これにより、異方性導電フィルム２３は、導電性粒子が押し潰された状態で硬化し、電子部品１８と端子部１７ａとを導電接続する。   First, the anisotropic conductive film 23 is disposed on the terminal portion 17 a of the COG mounting portion 20. At this time, the thermocompression bonding head 3 is supported above the COG mounting portion 20 by the head driving mechanism 4. Next, an electronic component 18 such as a liquid crystal driving IC is disposed on the anisotropic conductive film 23. The thermocompression bonding head 3 is controlled so that the head main body 3b is heated to a predetermined temperature by the head driving mechanism 4 and the pressing surface 3a is lowered so as to press the electronic component 18 and is pressed for a predetermined pressure and time. Is done. Thereby, the anisotropic conductive film 23 hardens | cures in the state by which the electroconductive particle was crushed, and electrically connects the electronic component 18 and the terminal part 17a.

このとき、熱圧着ヘッド３は、ヘッド本体３ｂのパネル表示部１５と面する側面にペルチェ素子５が設けられ、このペルチェ素子５に所定方向の電流を流すことによりパネル表示部１５に面する側を冷却部６としているため、ヘッド本体３ｂの熱がパネル表示部１５の偏光板やシール１３等に伝達することを防止できる。したがって、パネル表示部１５とＣＯＧ実装部２０との距離が狭小化され、ヘッド本体３ｂがパネル表示部１５に近接する場合にも、パネル表示部１５の各部に熱衝撃が加わることによる変質、破損等を防止することができる。   At this time, the thermocompression bonding head 3 is provided with a Peltier element 5 on a side surface facing the panel display unit 15 of the head main body 3b, and a side facing the panel display unit 15 by passing a current in a predetermined direction through the Peltier element 5. Therefore, the heat of the head main body 3b can be prevented from being transmitted to the polarizing plate, the seal 13 and the like of the panel display unit 15. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 is narrowed and the head main body 3b is close to the panel display unit 15, deterioration or damage caused by thermal shock applied to each part of the panel display unit 15 Etc. can be prevented.

ＣＯＧ実装に次いで、ＦＯＧ実装が行われる。先ず、ＦＯＧ実装部２２の端子部１７ａに異方性導電フィルム２３が仮配置される。このときも、熱圧着ヘッド３は、ヘッド駆動機構４によって、ＦＯＧ実装部２２の上方に支持されている。次いで、異方性導電フィルム２３上に液晶駆動回路等が形成されたフレキシブル基板２１の端子部が配置される。そして、図２に示すように、熱圧着ヘッド３は、ヘッド駆動機構４によってヘッド本体３ｂが所定温度に加熱され、押圧面３ａがフレキシブル基板２１の端子部を押圧するように下降するとともに、所定の圧力、時間だけ押圧するように制御される。これにより、異方性導電フィルム２３は、導電性粒子が押し潰された状態で硬化し、フレキシブル基板２１と端子部１７ａとを導電接続する。   Following the COG implementation, FOG implementation is performed. First, the anisotropic conductive film 23 is temporarily disposed on the terminal portion 17 a of the FOG mounting portion 22. Also at this time, the thermocompression bonding head 3 is supported above the FOG mounting portion 22 by the head driving mechanism 4. Subsequently, the terminal part of the flexible substrate 21 in which a liquid crystal driving circuit or the like is formed on the anisotropic conductive film 23 is disposed. As shown in FIG. 2, the thermocompression bonding head 3 is such that the head main body 3 b is heated to a predetermined temperature by the head driving mechanism 4, and the pressing surface 3 a is lowered so as to press the terminal portion of the flexible substrate 21. The pressure is controlled so as to be pressed only for the time. Thereby, the anisotropic conductive film 23 hardens | cures in the state by which the electroconductive particle was crushed, and electrically connects the flexible substrate 21 and the terminal part 17a.

このときも、熱圧着ヘッド３は、ヘッド本体３ｂのパネル表示部１５及び先にＣＯＧ実装された電子部品１８と面する側面にペルチェ素子５が設けられ、このペルチェ素子５に所定方向の電流を流すことにより電子部品１８やパネル表示部１５に面する側を冷却部６としているため、ヘッド本体３ｂの熱がパネル表示部１５の偏光板２５，２６やシール１３、電子部品１８等に伝達することを防止できる。したがって、パネル表示部１５及びＣＯＧ実装部２０とＦＯＧ実装部２２との距離が狭小化され、ヘッド本体３ｂが電子部品１８やパネル表示部１５に近接する場合にも、電子部品１８やパネル表示部１５の各部に熱衝撃が加わることによる変質、破損等を防止することができ、また電子部品１８のＣＯＧ実装部２０への接続が不安定になることもない。   Also at this time, the thermocompression bonding head 3 is provided with the Peltier element 5 on the side surface facing the panel display unit 15 of the head main body 3b and the electronic component 18 previously mounted with COG, and a current in a predetermined direction is supplied to the Peltier element 5. Since the cooling unit 6 is the side facing the electronic component 18 and the panel display unit 15 by flowing, the heat of the head main body 3b is transmitted to the polarizing plates 25 and 26 of the panel display unit 15, the seal 13, the electronic component 18 and the like. Can be prevented. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 and the FOG mounting unit 22 is reduced and the head body 3b is close to the electronic component 18 or the panel display unit 15, the electronic component 18 or the panel display unit 15 can be prevented from being altered or damaged due to a thermal shock applied thereto, and the connection of the electronic component 18 to the COG mounting portion 20 does not become unstable.

このようにして、液晶表示パネル１０に電子部品１８がＣＯＧ実装され、フレキシブル基板２１がＦＯＧ実装された液晶表示パネル１０が製造される。実装が終了した後、熱圧着ヘッド３は、ヘッド駆動機構４によって上昇され、次の実装工程に備える。   In this way, the liquid crystal display panel 10 in which the electronic component 18 is COG mounted on the liquid crystal display panel 10 and the flexible substrate 21 is FOG mounted is manufactured. After the mounting is completed, the thermocompression bonding head 3 is raised by the head driving mechanism 4 to prepare for the next mounting process.

上記においては、液晶表示パネル１０に電子部品１８、フレキシブル基板２１を実装する場合について述べたが、液晶表示パネル１０を配線基板に置き換えた場合でも、同様に実装することができる。また、先にＣＯＧ実装部が存在するパネルにフレキシブル基板２１を実装することについて記載したが、先に実装された実装部分はＣＯＧに限定されない。   In the above description, the case where the electronic component 18 and the flexible substrate 21 are mounted on the liquid crystal display panel 10 has been described. However, even when the liquid crystal display panel 10 is replaced with a wiring substrate, it can be similarly mounted. Moreover, although it described about mounting the flexible substrate 21 in the panel in which the COG mounting part exists previously, the mounting part mounted previously is not limited to COG.

［第２の実施例］
次いで、本発明が適用された熱圧着ヘッドの変形例について説明する。この熱圧着ヘッド３０は、図３に示すように、ヘッド本体３０ａに複数のペルチェ素子５ａ、５ｂ、５ｃ・・・が重畳して取り付けられている。各ペルチェ素子５は、冷却部６と加熱部７との温度差、及び使用可能な温度範囲といった温度特性が異なるものが用いられる。 [Second Embodiment]
Next, modifications of the thermocompression bonding head to which the present invention is applied will be described. As shown in FIG. 3, the thermocompression bonding head 30 has a plurality of Peltier elements 5a, 5b, 5c,. Each Peltier element 5 has different temperature characteristics such as a temperature difference between the cooling unit 6 and the heating unit 7 and a usable temperature range.

熱圧着ヘッド３０は、使用可能な温度範囲の上限がヘッド本体３０ａの加熱温度に近い第１のペルチェ素子５ａを取り付ける。そして、熱圧着ヘッド３０は、第１のペルチェ素子５ａに、使用可能な温度範囲の上限が第１のペルチェ素子５ａの冷却部６の温度に近い第２のペルチェ素子５ｂを取り付ける。第２のペルチェ素子５ｂには、使用可能な温度範囲の上限が第２のペルチェ素子５ｂの冷却部６の温度に近い第３のペルチェ素子５ｃを取り付ける。   The thermocompression bonding head 30 is attached with the first Peltier element 5a whose upper limit of the usable temperature range is close to the heating temperature of the head body 30a. Then, the thermocompression bonding head 30 attaches the second Peltier element 5b whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the first Peltier element 5a to the first Peltier element 5a. A third Peltier element 5c whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the second Peltier element 5b is attached to the second Peltier element 5b.

このように、熱圧着ヘッド３０は、使用可能な温度範囲の上限が、先に取り付けられているペルチェ素子５の冷却部６の温度に近い他のペルチェ素子５を、順次取り付けることにより、複数のペルチェ素子が重畳される。   As described above, the thermocompression bonding head 30 has a plurality of other Peltier elements 5 whose upper limit of the usable temperature range is close to the temperature of the cooling unit 6 of the Peltier element 5 that has been previously attached. Peltier elements are superimposed.

かかる熱圧着ヘッド３０によれば、各ペルチェ素子５の温度を外側に向かうにつれて漸次下げていくことができ、パネル表示部１５や電子部品１８といった透明基板１２に実装されている構成部品に面するペルチェ素子５の冷却部６を、これら構成部品に影響を与えない温度、例えば室温程度とすることができる。   According to the thermocompression bonding head 30, the temperature of each Peltier element 5 can be gradually lowered toward the outside, and faces the components mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18. The cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.

［第３の実施例］
また、本発明が適用された実装装置１は、この熱圧着ヘッド３０に重畳されたペルチェ素子５によっても、電子部品１８やフレキシブル基板２１等の実装部品を加熱押圧しても良い。実装装置１は、熱圧着する実装部品や異方性導電フィルム２３の種類によって熱圧着ヘッドの加熱温度が変わる。したがって、図４に示すように、種類の異なる複数の実装部品が配列され、それぞれ加熱押圧の温度が異なる場合に、熱圧着ヘッド３０は、重畳されたペルチェ素子５によって温度が異なることから、各実装部品に最適な温度を有するペルチェ素子５を配して加熱押圧することができる。これにより、実装装置１は、加熱押圧の温度が異なる複数の実装部品を一括して実装することができる。 [Third embodiment]
In addition, the mounting apparatus 1 to which the present invention is applied may heat-press the mounting components such as the electronic component 18 and the flexible substrate 21 with the Peltier element 5 superimposed on the thermocompression bonding head 30. In the mounting apparatus 1, the heating temperature of the thermocompression bonding head varies depending on the mounting component to be thermocompression bonded and the type of the anisotropic conductive film 23. Therefore, as shown in FIG. 4, when a plurality of different types of mounting parts are arranged and the temperature of the heating press is different, the thermocompression bonding head 30 has a different temperature depending on the superimposed Peltier element 5. The Peltier element 5 having the optimum temperature for the mounted component can be arranged and heated and pressed. As a result, the mounting apparatus 1 can collectively mount a plurality of mounting components having different heating pressure temperatures.

［第４の実施例］
また、図５に示すように、本発明が適用された熱圧着ヘッドは、第１の熱圧着ヘッド４０に、一又は複数のペルチェ素子５を介して加熱温度の異なる第２の熱圧着ヘッド４１を取り付けるようにしてもよい。第２の熱圧着ヘッド４１が第１の熱圧着ヘッド４０よりも加熱温度が低い場合、第２の熱圧着ヘッド４１には、第１の熱圧着ヘッド４０との間に、冷却部６の温度が第２の熱圧着ヘッド４１の熱加圧温度に近くなるようなペルチェ素子５が取り付けられる。 [Fourth embodiment]
As shown in FIG. 5, the thermocompression bonding head to which the present invention is applied is connected to the first thermocompression bonding head 40 with a second thermocompression bonding head 41 having a different heating temperature via one or a plurality of Peltier elements 5. May be attached. When the heating temperature of the second thermocompression bonding head 41 is lower than that of the first thermocompression bonding head 40, the temperature of the cooling unit 6 is between the second thermocompression bonding head 41 and the first thermocompression bonding head 40. Is attached to the Peltier element 5 so as to be close to the heat pressing temperature of the second thermocompression bonding head 41.

例えば、図５に示すように、第１の熱圧着ヘッド４０の加熱温度が２００℃、第２の熱圧着ヘッド４１の加熱温度が１３０℃とした場合、第２の熱圧着ヘッド４１は、第１の熱圧着ヘッド４０との間に複数のペルチェ素子５を介在させて漸次温度を下げ、冷却部６の温度が１３０℃程度であるペルチェ素子５に取り付けられる。また、第２の熱圧着ヘッド４１には、ヘッド本体４１ａに複数のペルチェ素子５が取り付けられ、最外層のペルチェ素子５は、冷却部６が、他の構成部品に影響を与えない温度、例えば１０℃とする。   For example, as shown in FIG. 5, when the heating temperature of the first thermocompression bonding head 40 is 200 ° C. and the heating temperature of the second thermocompression bonding head 41 is 130 ° C., the second thermocompression bonding head 41 A plurality of Peltier elements 5 are interposed between one thermocompression bonding head 40 and the temperature is gradually lowered, and the cooling unit 6 is attached to the Peltier element 5 having a temperature of about 130 ° C. The second thermocompression bonding head 41 has a plurality of Peltier elements 5 attached to the head body 41a. The outermost Peltier element 5 has a temperature at which the cooling unit 6 does not affect other components, for example, Set to 10 ° C.

このような熱圧着ヘッドによっても、最適な加熱温度が異なる複数の実装部品を、第１の熱圧着ヘッド４０及び第２の熱圧着ヘッド４１によって、一括して実装することができる。   Even with such a thermocompression bonding head, a plurality of mounting components having different optimum heating temperatures can be collectively mounted by the first thermocompression bonding head 40 and the second thermocompression bonding head 41.

［第５の実施例］
また、本発明が適用された熱圧着ヘッドは、図６に示すように、ペルチェ素子５をヘッド本体５０ａの電子部品１８やパネル表示部１５と面する側面を含む他の側面や全周囲に亘って形成された熱圧着ヘッド５０としてもよい。この熱圧着ヘッド５０は、ヘッド本体５０ａの熱が周囲に拡散することを防止することができ、周囲の実装部位に対する熱による影響を抑えることができる。 [Fifth embodiment]
Further, as shown in FIG. 6, the thermocompression bonding head to which the present invention is applied covers other side surfaces including the side surface of the Peltier element 5 facing the electronic component 18 and the panel display unit 15 of the head main body 50a and the entire periphery. It is good also as the thermocompression-bonding head 50 formed in this way. The thermocompression bonding head 50 can prevent the heat of the head main body 50a from diffusing to the surroundings, and can suppress the influence of the heat on the surrounding mounting parts.

また、熱圧着ヘッド５０は、上述した熱圧着ヘッド３０のように、ヘッド本体５０ａに複数のペルチェ素子５を重畳して取り付けてもよい。これにより、熱圧着ヘッド５０は、各ペルチェ素子５の温度を外側に向かうにつれて漸次下げていくことができ、パネル表示部１５や電子部品１８といった透明基板１２に実装されている構成部品に面するペルチェ素子５の冷却部６を、これら構成部品に影響を与えない温度、例えば室温程度とすることができる。   Moreover, the thermocompression-bonding head 50 may be attached by superimposing a plurality of Peltier elements 5 on the head body 50a, like the thermocompression-bonding head 30 described above. Thus, the thermocompression bonding head 50 can gradually lower the temperature of each Peltier element 5 as it goes outward, and faces the component parts mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18. The cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.

また、熱圧着ヘッド５０は、上述した熱圧着ヘッド４０のように、ヘッド本体５０ａの電子部品１８やパネル表示部１５と面する側面を含む他の側面や全周囲に一又は複数のペルチェ素子５を介して加熱温度の異なる第２の熱圧着ヘッドを取り付けてもよい。これにより、熱圧着ヘッド５０は、最適な加熱温度が異なる複数の実装部品を、第２の熱圧着ヘッドとともに、一括して実装することができる。   Further, the thermocompression bonding head 50, like the thermocompression bonding head 40 described above, has one or a plurality of Peltier elements 5 on the other side including the side facing the electronic component 18 and the panel display unit 15 of the head main body 50a and the entire periphery. You may attach the 2nd thermocompression-bonding head from which heating temperature differs through this. Thus, the thermocompression bonding head 50 can collectively mount a plurality of mounting components having different optimum heating temperatures together with the second thermocompression bonding head.

［第６の実施例］
また、本発明が適用された熱圧着ヘッドは、図７に示すように、ヘッド本体６０ａ内にヒーターを内蔵せず、ヘッド本体６０ａの周囲に取り付けたペルチェ素子５によって所定の温度に加熱される熱圧着ヘッド６０としてもよい。この熱圧着ヘッド６０は、加熱部７の温度が実装部品の加熱温度となるペルチェ素子５を用い、当該ペルチェ素子５のヘッド本体６０ａに取り付けられた面を加熱部７として放熱させ、ヘッド本体６０ａを加熱する。 [Sixth embodiment]
Further, as shown in FIG. 7, the thermocompression bonding head to which the present invention is applied does not include a heater in the head body 60a, and is heated to a predetermined temperature by the Peltier element 5 attached around the head body 60a. The thermocompression bonding head 60 may be used. The thermocompression bonding head 60 uses the Peltier element 5 in which the temperature of the heating unit 7 becomes the heating temperature of the mounted component, and the surface attached to the head main body 60a of the Peltier element 5 dissipates heat as the heating unit 7, thereby Heat.

これにより、熱圧着ヘッド６０は、ヒーターを内蔵させることなく、所定の温度に加熱することができる。また、熱圧着ヘッド６０は、ペルチェ素子５を用いることにより、容易に温度制御を行うことができる。なお、熱圧着ヘッド６０は、ヘッド本体６０ａの全周囲にペルチェ素子５を取り付けることにより、ムラ無く加熱することができる。   Thereby, the thermocompression bonding head 60 can be heated to a predetermined temperature without incorporating a heater. The thermocompression bonding head 60 can easily control the temperature by using the Peltier element 5. The thermocompression bonding head 60 can be heated uniformly by attaching the Peltier element 5 to the entire periphery of the head body 60a.

また、熱圧着ヘッド６０は、上述した熱圧着ヘッド３０のように、ヘッド本体６０ａに複数のペルチェ素子５を重畳して取り付けてもよい。これにより、熱圧着ヘッド６０は、各ペルチェ素子５の温度を外側に向かうにつれて漸次下げていくことができ、パネル表示部１５や電子部品１８といった透明基板１２に実装されている構成部品に面するペルチェ素子５の冷却部６を、これら構成部品に影響を与えない温度、例えば室温程度とすることができる。   Further, the thermocompression bonding head 60 may be attached by superimposing a plurality of Peltier elements 5 on the head main body 60a, like the thermocompression bonding head 30 described above. Thereby, the thermocompression bonding head 60 can gradually lower the temperature of each Peltier element 5 as it goes outward, and faces the component parts mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18. The cooling unit 6 of the Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.

また、熱圧着ヘッド６０は、上述した熱圧着ヘッド４０のように、ヘッド本体６０ａの電子部品１８やパネル表示部１５と面する側面を含む他の側面や全周囲に一又は複数のペルチェ素子５を介して加熱温度の異なる第２の熱圧着ヘッドを取り付けてもよい。第２の熱圧着ヘッドもヒーターを内蔵せずペルチェ素子５によって所定の温度に加熱される。また、第２の熱圧着ヘッドもヘッド本体の全周囲にペルチェ素子５を取り付けることでムラ無く加熱することができる。これにより、熱圧着ヘッド６０は、最適な加熱温度が異なる複数の実装部品を、第２の熱圧着ヘッドとともに、一括して実装することができる。   In addition, the thermocompression bonding head 60, like the thermocompression bonding head 40 described above, has one or a plurality of Peltier elements 5 on other side surfaces including the side surface facing the electronic component 18 and the panel display unit 15 of the head main body 60a and the entire periphery. You may attach the 2nd thermocompression-bonding head from which heating temperature differs through this. The second thermocompression bonding head is also heated to a predetermined temperature by the Peltier element 5 without incorporating a heater. Further, the second thermocompression bonding head can also be heated uniformly by attaching the Peltier element 5 to the entire periphery of the head body. Thereby, the thermocompression bonding head 60 can collectively mount a plurality of mounting components having different optimum heating temperatures together with the second thermocompression bonding head.

［第７の実施例］
また、本発明が適用された熱圧着ヘッド３、５０、６０は、実装部品の実装が終了した後に、ヘッド本体３ｂ、５０ａ、６０ａをペルチェ素子５によって冷却してもよい。上述したように、ペルチェ素子５は、直流電流を流す方向を逆にすることにより、熱の移動方向も逆になるので、冷却部６と加熱部７を入れ替えることが可能である。したがって、熱圧着ヘッド３、５０、６０は、電子部品１８やフレキシブル基板２１の実装が終了した後、ヘッド駆動機構４によって上昇され、ペルチェ素子５の電流の方向を逆にして流す。 [Seventh embodiment]
In the thermocompression bonding heads 3, 50, 60 to which the present invention is applied, the head main bodies 3 b, 50 a, 60 a may be cooled by the Peltier element 5 after the mounting of the mounted components is completed. As described above, since the Peltier element 5 reverses the direction in which the direct current flows, the heat transfer direction is also reversed, so that the cooling unit 6 and the heating unit 7 can be interchanged. Therefore, the thermocompression bonding heads 3, 50, 60 are raised by the head driving mechanism 4 after the mounting of the electronic component 18 and the flexible substrate 21 is finished, and flow the current of the Peltier element 5 in the reverse direction.

これにより、ペルチェ素子５は、ヘッド本体３ｂ、５０ａ、６０ａに向けた面が冷却部６となる。これにより、熱圧着ヘッド３、５０、６０は、ヘッド本体３ｂ、５０ａ、６０ａを冷却することができる。なお、このとき熱圧着ヘッド３、５０、６０は、ペルチェ素子５の加熱部７が外側となるが、ヘッド駆動機構４によって上昇され液晶表示パネル１０から離間しているため、放熱による影響はない。   Thus, the surface of the Peltier element 5 facing the head main bodies 3b, 50a, 60a becomes the cooling unit 6. Thereby, the thermocompression bonding heads 3, 50, 60 can cool the head main bodies 3b, 50a, 60a. At this time, in the thermocompression bonding heads 3, 50, 60, the heating unit 7 of the Peltier element 5 is on the outside. However, since the head driving mechanism 4 is raised and separated from the liquid crystal display panel 10, there is no influence of heat dissipation. .

ペルチェ素子５は、再度、実装部品を加熱押圧する場合には、流す電流の方向を元に戻すことにより、ヘッド本体３ｂ、５０ａ、６０ａ側を加熱部７とし、パネル表示部１５や電子部品１８等の構成部品側を冷却部６とすることができる。   When the Peltier element 5 again heats and presses the mounting component, the head main body 3b, 50a, 60a side is changed to the heating unit 7 by returning the direction of the current to flow, and the panel display unit 15 or the electronic component 18 is restored. The component side such as the above can be used as the cooling unit 6.

［第８の実施例］
また、本発明は、図８（ａ）に示すように、熱圧着ヘッドをペルチェ素子５のみで構成してもよい。この熱圧着ヘッド７０は、ペルチェ素子５の加熱部７の電子部品１８やフレキシブル基板２１と対峙する下面を押圧面とする。 [Eighth embodiment]
Further, in the present invention, as shown in FIG. 8A, the thermocompression bonding head may be composed of only the Peltier element 5. The thermocompression bonding head 70 uses the lower surface facing the electronic component 18 and the flexible substrate 21 of the heating unit 7 of the Peltier element 5 as a pressing surface.

また、本発明は、図８（ｂ）に示すように、一対のペルチェ素子５を接続して構成してもよい。この熱圧着ヘッド８０は、各ペルチェ素子５の接続面側を加熱部７とし、これら加熱部７の電子部品１８やフレキシブル基板２１と対峙する下面を押圧面とする。   Further, the present invention may be configured by connecting a pair of Peltier elements 5 as shown in FIG. In the thermocompression bonding head 80, the connection surface side of each Peltier element 5 is the heating unit 7, and the lower surface of the heating unit 7 facing the electronic component 18 and the flexible substrate 21 is the pressing surface.

熱圧着ヘッド７０，８０は、いずれも、電子部品１８やフレキシブル基板２１等の構成部品側を冷却部６としているため、加熱部７の熱が伝達することを防止できる。したがって、パネル表示部１５とＣＯＧ実装部２０との距離やＣＯＧ実装部２０とＦＯＧ実装部との距離が狭小化され、加熱部７がパネル表示部１５や電子部品１８に近接する場合にも、パネル表示部１５の各部に熱衝撃が加わることによる変質、破損等を防止することができる。   Since both the thermocompression bonding heads 70 and 80 use the component parts such as the electronic component 18 and the flexible substrate 21 as the cooling unit 6, the heat of the heating unit 7 can be prevented from being transmitted. Therefore, even when the distance between the panel display unit 15 and the COG mounting unit 20 or the distance between the COG mounting unit 20 and the FOG mounting unit is reduced and the heating unit 7 is close to the panel display unit 15 or the electronic component 18, Alteration, breakage, and the like due to thermal shock applied to each part of the panel display unit 15 can be prevented.

なお、熱圧着ヘッド７０，８０においても、上述した熱圧着ヘッド３０のように複数のペルチェ素子５を重畳して取り付けてもよい。これにより、熱圧着ヘッド７０，８０は、各ペルチェ素子５の温度を外側に向かうにつれて漸次下げていくことができ、パネル表示部１５や電子部品１８といった透明基板１２に実装されている構成部品に面するペルチェ素子５の冷却部６を、これら構成部品に影響を与えない温度、例えば室温程度とすることができる。   Note that, in the thermocompression bonding heads 70 and 80, a plurality of Peltier elements 5 may be attached in a superimposed manner as in the thermocompression bonding head 30 described above. As a result, the thermocompression bonding heads 70 and 80 can gradually lower the temperature of each Peltier element 5 as it goes outward, so that the components mounted on the transparent substrate 12 such as the panel display unit 15 and the electronic component 18 can be reduced. The cooling part 6 of the facing Peltier element 5 can be set to a temperature that does not affect these components, for example, about room temperature.

１ 実装装置、２ ステージ、３ 熱圧着ヘッド、３ａ 押圧面、３ｂ ヘッド本体、４ ヘッド駆動機構、１０ 液晶表示パネル、１１，１２ 透明基板、１２ａ 縁部、１３ シール、１４ 液晶、１５ パネル表示部、１６，１７ 透明電極、１８ 電子部品、２０ ＣＯＧ実装部、２１ フレキシブル基板、２２ ＦＯＧ実装部、２３ 異方性導電フィルム、２４ 配向膜、２５，２６ 偏光板 DESCRIPTION OF SYMBOLS 1 Mounting apparatus, 2 stages, 3 thermocompression-bonding head, 3a press surface, 3b head main body, 4 head drive mechanism, 10 liquid crystal display panel, 11, 12 transparent substrate, 12a edge, 13 seal, 14 liquid crystal, 15 panel display part 16, 17 Transparent electrode, 18 Electronic component, 20 COG mounting part, 21 Flexible substrate, 22 FOG mounting part, 23 Anisotropic conductive film, 24 Alignment film, 25, 26 Polarizing plate

Claims (19)

熱硬化性の接着剤層を介して実装部品を熱加圧することにより実装部に上記実装部品を接続する熱圧着ヘッドにおいて、
上記熱圧着ヘッドは、ペルチェ素子を有し、
上記ペルチェ素子は、上記実装部品を熱加圧する際に、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする熱圧着ヘッド。 In the thermocompression bonding head for connecting the mounting component to the mounting part by heat-pressing the mounting component through a thermosetting adhesive layer,
The thermocompression bonding head has a Peltier element,
The Peltier element is a thermocompression bonding head having a cooling portion on a surface facing the other components provided in the vicinity of the mounting portion when the mounting component is heat-pressed. 上記ペルチェ素子は、少なくともヘッド本体の上記実装部近傍に設けられた他の構成部品に面する側に設けられ、
上記実装部品を熱加圧する際に、上記ペルチェ素子は上記ヘッド本体と対峙する面側を加熱部とする請求項１記載の熱圧着ヘッド。 The Peltier element is provided on the side facing at least another component provided near the mounting portion of the head body,
2. The thermocompression bonding head according to claim 1, wherein when the mounting component is heat-pressed, the surface of the Peltier element facing the head body is a heating unit. 複数の上記ペルチェ素子が重畳され、上記ヘッド本体と接触する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項２に記載の熱圧着ヘッド。   A plurality of the Peltier elements are superposed, the heating part of the Peltier element that comes into contact with the head body is set to the heat-pressing temperature of the mounting component, and the cooling part of the Peltier element facing the other components is the other The thermocompression bonding head according to claim 2, wherein the thermocompression bonding head has a temperature that does not affect the components. 上記ペルチェ素子で上記実装部品を熱加圧する請求項１〜請求項３のいずれか１項に記載の熱圧着ヘッド。   The thermocompression bonding head according to any one of claims 1 to 3, wherein the mounting component is heat-pressed by the Peltier element. 上記ペルチェ素子が上記ヘッド本体の全周囲に設けられている請求項２〜請求項４のいずれか１項に記載の熱圧着ヘッド。   The thermocompression bonding head according to any one of claims 2 to 4, wherein the Peltier element is provided all around the head body. 上記実装部品を熱加圧する際に、上記ヘッド本体が上記ペルチェ素子によって加熱される請求項２〜請求項５のいずれか１項に記載の熱圧着ヘッド。   The thermocompression bonding head according to any one of claims 2 to 5, wherein the head main body is heated by the Peltier element when the mounting component is hot-pressed. 上記実装部品を熱加圧した後、上記ヘッド本体が上記ペルチェ素子によって冷却される請求項６記載の熱圧着ヘッド。   The thermocompression bonding head according to claim 6, wherein the head main body is cooled by the Peltier element after the mounting component is heat-pressed. 上記ペルチェ素子のみからなる請求項１に記載の熱圧着ヘッド。   The thermocompression bonding head according to claim 1, comprising only the Peltier element. 複数の上記ペルチェ素子が重畳され、上記実装部品を熱加圧する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項８に記載の熱圧着ヘッド。   A plurality of the Peltier elements are superposed, the heating part of the Peltier element that heat-presses the mounting part is set to the heat-pressing temperature of the mounting part, and the cooling part of the Peltier element facing the other component parts is the above-mentioned The thermocompression bonding head according to claim 8, wherein the thermocompression bonding head is at a temperature that does not affect other components. 熱硬化性の接着剤層を介して実装部品を熱加圧することにより実装部に上記実装部品を接続する熱圧着ヘッドと、
上記熱圧着ヘッドを実装部品が接続される上記実装部に対峙させ、該実装部と近接離間させるヘッド駆動機構とを備え、
上記熱圧着ヘッドは、ペルチェ素子を有し、
上記ペルチェ素子は、上記実装部品を熱加圧する際に、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする実装装置。 A thermocompression bonding head for connecting the mounting component to the mounting part by heat-pressing the mounting component through a thermosetting adhesive layer;
A head drive mechanism that opposes the thermocompression bonding head to the mounting part to which a mounting component is connected, and that moves close to and away from the mounting part;
The thermocompression bonding head has a Peltier element,
The Peltier element is a mounting apparatus in which a surface facing the other component provided near the mounting portion is a cooling portion when the mounting component is heat-pressed. 実装部上に熱硬化性の接着剤層を介して実装部品を載置する工程と、
ペルチェ素子を有する熱圧着ヘッドによって上記実装部品を上記実装部上に熱加圧する熱加圧工程とを有し、
上記熱加圧工程において、上記ペルチェ素子は、上記実装部近傍に設けられた他の構成部品と対峙する面側を冷却部とする実装方法。 Placing the mounting component on the mounting portion via a thermosetting adhesive layer;
A heat pressurizing step of heat-pressing the mounting component on the mounting portion by a thermocompression bonding head having a Peltier element;
In the thermal pressurizing step, the Peltier element is a mounting method in which a surface facing the other component parts provided in the vicinity of the mounting part is a cooling part. 上記ペルチェ素子は、少なくともヘッド本体の上記実装部近傍に設けられた他の構成部品に面する側に設けられ、
上記実装部品を熱加圧する際に、上記ペルチェ素子は上記ヘッド本体と対峙する面側を加熱部とする請求項１１に記載の実装方法。 The Peltier element is provided on the side facing at least another component provided near the mounting portion of the head body,
The mounting method according to claim 11, wherein when the mounting component is heat-pressed, the surface of the Peltier element facing the head body is a heating unit. 複数の上記ペルチェ素子が重畳され、上記熱圧着ヘッドと接触する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項１２に記載の実装方法。   A plurality of the Peltier elements are superposed, the heating part of the Peltier element that comes into contact with the thermocompression bonding head is set to the heat-pressing temperature of the mounting component, and the cooling part of the Peltier element facing the other component is the above The mounting method according to claim 12, wherein the temperature is set so as not to affect other components. 上記ペルチェ素子が上記ヘッド本体の全周囲に設けられている請求項１２又は請求項１３に記載の実装方法。   The mounting method according to claim 12, wherein the Peltier element is provided around the entire circumference of the head body. 上記熱圧着ヘッドは、上記実装部品を熱加圧する際に、上記ヘッド本体が上記ペルチェ素子によって加熱される請求項１２〜請求項１４のいずれか１項に記載の実装方法。   The mounting method according to any one of claims 12 to 14, wherein the thermocompression bonding head heats the head body by the Peltier element when the mounting component is heat-pressed. 上記熱圧着ヘッドは、上記実装部品を熱加圧した後、上記ヘッド本体が上記ペルチェ素子によって冷却される請求項１５に記載の実装方法。   The mounting method according to claim 15, wherein the thermocompression bonding head heat-presses the mounting component, and then the head main body is cooled by the Peltier element. 上記熱圧着ヘッドは、上記ペルチェ素子のみからなる請求項１１に記載の実装方法。 The mounting method according to claim 11, wherein the thermocompression bonding head includes only the Peltier element. 複数の上記ペルチェ素子が重畳され、上記実装部品を熱加圧する上記ペルチェ素子の加熱部は上記実装部品の熱加圧温度とされ、上記他の構成部品に面する上記ペルチェ素子の冷却部は上記他の構成部品に影響を与えない温度とされている請求項１７に記載の実装方法。   A plurality of the Peltier elements are superposed, the heating part of the Peltier element that heat-presses the mounting part is set to the heat-pressing temperature of the mounting part, and the cooling part of the Peltier element facing the other component parts is the above-mentioned The mounting method according to claim 17, wherein the temperature is set so as not to affect other components. 上記熱硬化性の接着剤層は、異方導電性接着フィルムまたは絶縁性接着フィルムである請求項１１〜請求項１８のいずれか１項に記載の実装方法。   The mounting method according to claim 11, wherein the thermosetting adhesive layer is an anisotropic conductive adhesive film or an insulating adhesive film.
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