JP5577585B2 - Substrate holding member, bonding apparatus, and bonding method - Google Patents

Substrate holding member, bonding apparatus, and bonding method Download PDF

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JP5577585B2
JP5577585B2 JP2008290406A JP2008290406A JP5577585B2 JP 5577585 B2 JP5577585 B2 JP 5577585B2 JP 2008290406 A JP2008290406 A JP 2008290406A JP 2008290406 A JP2008290406 A JP 2008290406A JP 5577585 B2 JP5577585 B2 JP 5577585B2
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substrate
holding
pressure receiving
receiving member
pressure
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功 菅谷
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Nikon Corp
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Description

本発明は、基板保持部材および接合装置に関する。   The present invention relates to a substrate holding member and a bonding apparatus.

半導体装置の実効的な実装密度を向上させる技術のひとつとして、複数のダイを積層して形成される積層型半導体装置がある。積層型半導体装置の製造においては、相互に位置合わせされたダイまたはウエハを接合した後、圧力を加えて接合を安定化させる。特許文献１には、基板保持部材に保持させた基板を熱間で加圧する加圧装置が記載される。
特開２００７−１１５９７８号公報 One technique for improving the effective mounting density of semiconductor devices is a stacked semiconductor device formed by stacking a plurality of dies. In the manufacture of a stacked semiconductor device, after bonding dies or wafers aligned with each other, pressure is applied to stabilize the bonding. Patent Document 1 describes a pressurizing apparatus that pressurizes hot a substrate held by a substrate holding member.
JP 2007-115978 A

ウエハは脆い材料なので加圧した場合に応力分布が生じることは好ましくない。そこで、加圧装置は、加圧部または基板保持部材の表面を高度に平坦にして、ウエハにかかる圧力を均一にしている。しかしながら、加圧された基板の外周縁部には依然として高い圧力がかかる場合があった。また、その反動で、高い圧力がかかる領域に隣接して、圧力が低下する領域が生じるので、基板全面を漏れなく接合するには、よりも高い圧力をかけることが求められる場合があった。   Since a wafer is a brittle material, it is not preferable that stress distribution occurs when it is pressurized. Therefore, the pressurizing device makes the surface of the pressurizing unit or the substrate holding member highly flat to make the pressure applied to the wafer uniform. However, high pressure may still be applied to the outer peripheral edge of the pressurized substrate. In addition, the reaction causes a region where the pressure decreases adjacent to a region where high pressure is applied. Therefore, in order to join the entire substrate without leakage, it may be required to apply higher pressure.

上記課題を解決すべく、本発明の第１の態様として、基板に接して当該基板を保持する保持面を有する板状部材と、保持面において基板を保持する保持領域の外周に沿って配され、保持面から突出する受圧部材とを備える基板保持部材が提供される。   In order to solve the above-mentioned problem, as a first aspect of the present invention, a plate-like member having a holding surface for holding the substrate in contact with the substrate and an outer periphery of the holding region for holding the substrate on the holding surface are arranged. A substrate holding member provided with a pressure receiving member protruding from the holding surface is provided.

また、本発明の第２の態様として、一対の上記基板保持部材と、一対の基板保持部材に各々保持されて一対の基板保持部材の間に挟まれた一対の基板に、板状部材を介して圧力を加える加圧部とを備え、当該一対の基板を圧着させる接合装置が提供される。   Further, as a second aspect of the present invention, a pair of substrate holding members and a pair of substrates respectively held between the pair of substrate holding members and sandwiched between the pair of substrate holding members via a plate-like member. And a pressurizing unit that applies pressure, and a bonding apparatus that crimps the pair of substrates is provided.

更に、本発明の第３の態様として、基板と、当該基板の厚さと等しい厚さを有して当該基板の周囲に配された受圧部材とに接して当該基板を加圧する加圧面を備えた接合装置が提供される。   Furthermore, as a third aspect of the present invention, there is provided a pressing surface that pressurizes the substrate in contact with a substrate and a pressure receiving member that has a thickness equal to the thickness of the substrate and is arranged around the substrate. A joining device is provided.

図１は、接合装置１００全体の構造を模式的に示す図である。接合装置１００は、基盤１１０と、基盤１１０の上に搭載された下部組立体１２０および計測部１４０と、下部組立体１２０の上に更に搭載された上部組立体１３０とを有する。また、接合装置１００には、それぞれが基板２２０を保持した一対の基板ホルダ２１０と、基板ホルダ２１０に基板２２０と共に保持された受圧部材２３０とが装填される。   FIG. 1 is a diagram schematically illustrating the entire structure of the bonding apparatus 100. The joining apparatus 100 includes a base 110, a lower assembly 120 and a measurement unit 140 mounted on the base 110, and an upper assembly 130 further mounted on the lower assembly 120. The bonding apparatus 100 is loaded with a pair of substrate holders 210 each holding a substrate 220 and a pressure receiving member 230 held together with the substrate 220 on the substrate holder 210.

下部組立体１２０は、支柱１２２、下部フレーム１２４、ロードセル１２６および圧力伝達部１２８を有する。支柱１２２は、基盤１１０に下端を支持され、基盤１１０から垂直に起立する。   The lower assembly 120 includes a column 122, a lower frame 124, a load cell 126, and a pressure transmission unit 128. The support 122 is supported at the lower end by the base 110 and stands upright from the base 110.

下部フレーム１２４は、支柱１２２の上端に両側端を支持される。下部フレーム１２４の略中央にはロードセル１２６が搭載され、更に、その上に圧力伝達部１２８が搭載される。これにより、ロードセル１２６は、圧力伝達部１２８に鉛直に加わった圧力の大きさを検出する。   The lower frame 124 is supported at both ends by the upper end of the column 122. A load cell 126 is mounted substantially at the center of the lower frame 124, and a pressure transmission unit 128 is mounted thereon. Thereby, the load cell 126 detects the magnitude of the pressure applied to the pressure transmission unit 128 vertically.

また、下部フレーム１２４は、互いに対向する内側端面の上端近傍にベアリング１２３を備える。ベアリング１２３は、側方から圧力伝達部１２８に接して、下部フレーム１２４に対する圧力伝達部１２８の位置を安定させつつ、圧力伝達部１２８の円滑な昇降を許す。   Further, the lower frame 124 includes a bearing 123 in the vicinity of the upper end of the inner end surfaces facing each other. The bearing 123 is in contact with the pressure transmission unit 128 from the side, and allows the pressure transmission unit 128 to smoothly move up and down while stabilizing the position of the pressure transmission unit 128 with respect to the lower frame 124.

圧力伝達部１２８は、上面近傍にヒータユニット１２１を埋設される。ヒータユニット１２１は、圧力伝達部１２８の上面に搭載された基板ホルダ２１０を介して基板２２０を加熱する。なお、ヒータユニット１２１は、独立した部材として、圧力伝達部１２８の上に搭載され、更に、基板ホルダ２１０が積層して搭載される場合もある。   The pressure transmission unit 128 has a heater unit 121 embedded in the vicinity of the upper surface. The heater unit 121 heats the substrate 220 via the substrate holder 210 mounted on the upper surface of the pressure transmission unit 128. The heater unit 121 may be mounted on the pressure transmission unit 128 as an independent member, and the substrate holder 210 may be stacked and mounted.

上部組立体１３０は、支柱１３２、上部フレーム１３４、シリンダ１３６および圧力伝達部１３８を有する。シリンダ１３６および支柱１３２は、下部フレーム１２４の上端面に支持され、それぞれ垂直に起立する。   The upper assembly 130 includes a column 132, an upper frame 134, a cylinder 136, and a pressure transmission unit 138. The cylinder 136 and the support column 132 are supported on the upper end surface of the lower frame 124, and stand vertically.

上部フレーム１３４は、ベアリング１３３を介して、支柱１３２により側方から位置決めされる。これにより、シリンダ１３６に作動流体が供給または排出された場合に、上部フレーム１３４は鉛直に円滑に昇降する。   The upper frame 134 is positioned from the side by the support 132 through the bearing 133. Thereby, when the working fluid is supplied to or discharged from the cylinder 136, the upper frame 134 moves up and down smoothly and vertically.

また、上部フレーム１３４は、下端をシリンダ１３６に支持されて、下部フレーム１２４よりも上方に延在する。上部フレーム１３４の略中央には圧力伝達部１３８が懸架される。更に、圧力伝達部１３８の下面近傍にヒータユニット１３１が埋設される。   The upper frame 134 is supported at the lower end by the cylinder 136 and extends upward from the lower frame 124. A pressure transmission unit 138 is suspended substantially at the center of the upper frame 134. Further, a heater unit 131 is embedded in the vicinity of the lower surface of the pressure transmission unit 138.

なお、ヒータユニット１２１、１３１としては、セラミックヒータ、カートリッジヒータ等を使用できる。また、圧力伝達部１２８、１３８の内部に流路を設け、加熱した媒体を流通させて加熱する構造としてもよい。更に、ヒータユニット１２１、１３１に温度センサを設けて加熱温度を管理してもよい。   As the heater units 121 and 131, a ceramic heater, a cartridge heater, or the like can be used. Moreover, it is good also as a structure which provides a flow path inside the pressure transmission parts 128 and 138, distribute | circulates the heated medium, and heats it. Further, the heater units 121 and 131 may be provided with temperature sensors to control the heating temperature.

基板ホルダ２１０の各々は、静電吸着等により基板２２０および受圧部材２３０を保持して、基板２２０と一体的に取り扱うことができる。これにより、多くの場合は脆い基板２２０の取り扱いを容易且つ安全にする。基板２２０としては、Ｓｉウエハ、化合物半導体基板、ガラス基板を例示できるが、これらに限定されるわけではない。   Each of the substrate holders 210 can hold the substrate 220 and the pressure receiving member 230 by electrostatic adsorption or the like and can be handled integrally with the substrate 220. This makes handling of the fragile substrate 220 easy and safe in many cases. Examples of the substrate 220 include a Si wafer, a compound semiconductor substrate, and a glass substrate, but are not limited thereto.

接合装置１００においては、下部組立体１２０の圧力伝達部１２８の上面に一方の基板ホルダ２１０が保持される。また、上部組立体１３０の圧力伝達部１３８の下上面に他方の基板ホルダ２１０が保持される。圧力伝達部１２８、１３８による基板ホルダ２１０の保持は、静電吸着、負圧吸着等による。一対の基板ホルダ２１０は、それぞれ基板２２０および受圧部材２３０を保持する。   In the bonding apparatus 100, one substrate holder 210 is held on the upper surface of the pressure transmission unit 128 of the lower assembly 120. Further, the other substrate holder 210 is held on the lower upper surface of the pressure transmitting portion 138 of the upper assembly 130. The substrate holder 210 is held by the pressure transmission units 128 and 138 by electrostatic adsorption, negative pressure adsorption, or the like. The pair of substrate holders 210 hold the substrate 220 and the pressure receiving member 230, respectively.

計測部１４０は、例えばレーザ干渉計等の精密な測定機器を有し、接合装置１００において接合される基板２２０の状態を計測する。ここでいう状態とは、接合される基板２２０の間隔、傾き、表面性状等を意味する。計測部１４０による計測結果に応じて、例えば、シリンダ１３６へ供給され、また、シリンダ１３６から排出される作動流体が制御される。また、基板２２０の極端に大きな傾き等が検出された場合に接合装置１００を停止させる安全装置の一部としても使用される。   The measurement unit 140 includes a precise measurement device such as a laser interferometer, and measures the state of the substrate 220 to be bonded in the bonding apparatus 100. The state here means the interval, inclination, surface properties, and the like of the substrates 220 to be bonded. For example, the working fluid supplied to the cylinder 136 and discharged from the cylinder 136 is controlled according to the measurement result by the measuring unit 140. Further, it is also used as a part of a safety device that stops the bonding apparatus 100 when an extremely large inclination or the like of the substrate 220 is detected.

図２は、接合装置１００の動作を示す図であり、図１に対照して描かれる。シリンダ１３６から作動流体が排出された場合、上部フレーム１３４は、シリンダ１３６に引きつけられて降下する。これにより、圧力伝達部１３８および基板ホルダ２１０も降下して、基板２２０に上方から圧力を加える。これにより、一対の基板２２０が、受圧部材２３０と共に圧接される。   FIG. 2 is a diagram illustrating the operation of the bonding apparatus 100 and is depicted in contrast to FIG. When the working fluid is discharged from the cylinder 136, the upper frame 134 is attracted to the cylinder 136 and descends. As a result, the pressure transmission unit 138 and the substrate holder 210 are also lowered to apply pressure to the substrate 220 from above. As a result, the pair of substrates 220 are pressed together with the pressure receiving member 230.

また、上記の動作と並行してヒータユニット１２１、１３１が動作する。これにより、基板ホルダ２１０を介して基板２２０が加熱される。こうして、一対の基板２２０は恒久的に接合される。   In addition, the heater units 121 and 131 operate in parallel with the above operation. Thereby, the substrate 220 is heated via the substrate holder 210. Thus, the pair of substrates 220 is permanently bonded.

なお、基板２２０に加わる圧力はロードセル１２６により検出される。これにより、所要の圧力を正確に加えて基板２２０を接合できる。また、計測部１４０により、基板２２０の間隔、傾き等を監視しつつ接合できるので、接合により形成される積層型半導体装置の歩留りを向上させることができる。   The pressure applied to the substrate 220 is detected by the load cell 126. Thus, the substrate 220 can be bonded by accurately applying a required pressure. In addition, since the measurement unit 140 can perform bonding while monitoring the interval, inclination, and the like of the substrate 220, the yield of the stacked semiconductor device formed by bonding can be improved.

図３は、基板２２０および受圧部材２３０を保持する基板ホルダ２１０の形状を示す斜視図である。基板ホルダ２１０は、全体として円板状をなす。基板ホルダ２１０は、基板２２０と、後述する受圧部材２３０とを保持する保持面２１２と、保持面２１２の径方向外側に向かって延在するフランジ部２１４とを有する。   FIG. 3 is a perspective view showing the shape of the substrate holder 210 that holds the substrate 220 and the pressure receiving member 230. The substrate holder 210 has a disk shape as a whole. The substrate holder 210 includes a holding surface 212 that holds the substrate 220 and a pressure receiving member 230 described later, and a flange portion 214 that extends outward in the radial direction of the holding surface 212.

保持面２１２は平坦に仕上げられている。また、図示されていないが、保持面２１２においては、基板ホルダ２１０の内部に、基板２２０および受圧部材２３０を静電吸着する場合に電圧を印加する電極が埋設されている。   The holding surface 212 is finished flat. Although not shown, on the holding surface 212, an electrode for applying a voltage when electrostatically adsorbing the substrate 220 and the pressure receiving member 230 is embedded in the substrate holder 210.

フランジ部２１４は、保持面２１２と同じ厚さを有し、挿通穴２１６、基準標識２１７、バーコード２１８等を有する。挿通穴２１６は、基板２２０を接合した後で基板ホルダ２１０を取り外す場合に工具を挿通する。基準標識２１７は、位置決めの基準となる記号を記した透明基板が埋め込まれる。記号は、基板ホルダ２１０の位置合わせ、基板ホルダ２１０に対する基板２２０の相対位置の計測等の場合に参照される。バーコード２１８は、基板ホルダ２１０の個体を識別する場合に読み取られる。   The flange portion 214 has the same thickness as the holding surface 212 and includes an insertion hole 216, a reference mark 217, a barcode 218, and the like. The insertion hole 216 allows a tool to be inserted when the substrate holder 210 is removed after the substrates 220 are joined. The reference mark 217 is embedded with a transparent substrate on which a symbol serving as a positioning reference is written. The symbols are referred to when positioning the substrate holder 210, measuring the relative position of the substrate 220 with respect to the substrate holder 210, or the like. The barcode 218 is read when the individual substrate holder 210 is identified.

これら挿通穴２１６、基準標識２１７、バーコード２１８等は、接合装置１００の仕様に応じて取捨選択される。また、更に他の部材がフランジ部２１４に設けられる場合もある。更に、フランジ部２１４自体も、基板２２０を搭載した状態で基板ホルダ２１０を搬送する場合に把持する手がかりとして使用される場合がある。   The insertion hole 216, the reference mark 217, the barcode 218, and the like are selected according to the specifications of the joining apparatus 100. Further, other members may be provided on the flange portion 214. Further, the flange portion 214 itself may be used as a clue for gripping when the substrate holder 210 is transported with the substrate 220 mounted thereon.

このように、フランジ部２１４は、単なる基板２２０の保持の他に、様々な機能を与えて利用される。なお、保持面２１２およびフランジ部２１４は、例えば絶縁性のセラミックス材等により、全体として一体的に成形される。   As described above, the flange portion 214 is used by providing various functions in addition to simply holding the substrate 220. The holding surface 212 and the flange portion 214 are integrally formed as a whole, for example, with an insulating ceramic material or the like.

受圧部材２３０は、薄い環状の形態を有する。受圧部材２３０の内側の形状は、接合する基板２２０の外形に倣った形状を有する。このため、基板ホルダ２１０の保持面２１２上に、基板２２０と共に受圧部材２３０を載せた場合、基板ホルダ２１０および受圧部材２３０の間の間隙は小さい。   The pressure receiving member 230 has a thin annular shape. The inner shape of the pressure receiving member 230 has a shape that follows the outer shape of the substrate 220 to be joined. Therefore, when the pressure receiving member 230 is placed together with the substrate 220 on the holding surface 212 of the substrate holder 210, the gap between the substrate holder 210 and the pressure receiving member 230 is small.

また、受圧部材２３０の外形は、基板ホルダ２１０の保持面２１２と略等しい大きさと形状を有する。なお、この実施形態では、基板２２０のオリエンテーションフラットに沿った部分に限って、受圧部材２３０の形状は直線状になるが、受圧部材２３０の外形は、基板２２０の外形に倣った形状に限定されるわけではない。更に、受圧部材２３０は、対応する基板２２０と同じ厚さを有するが、この点については後述する。   In addition, the outer shape of the pressure receiving member 230 has substantially the same size and shape as the holding surface 212 of the substrate holder 210. In this embodiment, the shape of the pressure receiving member 230 is linear only in a portion along the orientation flat of the substrate 220, but the outer shape of the pressure receiving member 230 is limited to a shape that follows the outer shape of the substrate 220. I don't mean. Further, the pressure receiving member 230 has the same thickness as the corresponding substrate 220, which will be described later.

図４は、図３に示した部材を積層して接合装置１００に装入した状態を示す断面図である。基板２２０および受圧部材２３０は、それぞれ基板ホルダ２１０に保持され、更に、基板２２０および受圧部材２３０が相互に対向するように、一対の基板ホルダ２１０が対向して積層される。   4 is a cross-sectional view showing a state in which the members shown in FIG. The substrate 220 and the pressure receiving member 230 are respectively held by the substrate holder 210, and the pair of substrate holders 210 are stacked so as to face each other so that the substrate 220 and the pressure receiving member 230 face each other.

受圧部材２３０の各々は、それぞれが包囲する基板２２０と同じ厚さを有する。換言すれば、受圧部材２３０は、基板ホルダ２１０の保持面２１２から、基板２２０の厚さと同じ高さまで突出している。   Each of the pressure receiving members 230 has the same thickness as the substrate 220 that surrounds each of the pressure receiving members 230. In other words, the pressure receiving member 230 protrudes from the holding surface 212 of the substrate holder 210 to the same height as the thickness of the substrate 220.

基板２２０は保持面２１２の中央に保持される。受圧部材２３０は、基板２２０の外側直近に、基板２２０と共に保持面２１２に保持される。一対の基板ホルダ２１０は、互いに積層されたそれぞれ一対の基板２２０および受圧部材２３０を挟む。接合装置１００の圧力伝達部１２８、１３８は、これら基板２２０、受圧部材２３０および基板ホルダ２１０を更に挟んで、後述するように加圧する。   The substrate 220 is held at the center of the holding surface 212. The pressure receiving member 230 is held on the holding surface 212 together with the substrate 220 in the immediate vicinity of the outside of the substrate 220. The pair of substrate holders 210 sandwich the pair of substrates 220 and the pressure receiving member 230 that are stacked on each other. The pressure transmission units 128 and 138 of the bonding apparatus 100 further pressurize the substrate 220, the pressure receiving member 230, and the substrate holder 210 as will be described later.

ここで、基板ホルダ２１０は、保持面２１２の外側にフランジ部２１４を有する。このため、フランジ部２１４は、受圧部材２３０の外側まで延在する。なお、圧力伝達部１２８、１３８は、基板ホルダ２１０の外径よりも更に大きな径を有する。このため、接合装置１００が動作した場合、基板ホルダ２１０の背面は、全面にわたって加圧される。   Here, the substrate holder 210 has a flange portion 214 outside the holding surface 212. For this reason, the flange portion 214 extends to the outside of the pressure receiving member 230. Note that the pressure transmission units 128 and 138 have a diameter larger than the outer diameter of the substrate holder 210. For this reason, when the joining apparatus 100 operates, the back surface of the substrate holder 210 is pressurized over the entire surface.

図５は、図４の一部を拡大して示す図である。即ち、図５は、図４における受圧部材２３０近傍を拡大して示す図である。接合装置１００の圧力伝達部１２８、１３８は、基板２２０および受圧部材２３０を挟んだ基板ホルダ２１０を加圧しているものとする。   FIG. 5 is an enlarged view showing a part of FIG. That is, FIG. 5 is an enlarged view showing the vicinity of the pressure receiving member 230 in FIG. It is assumed that the pressure transmitting units 128 and 138 of the bonding apparatus 100 pressurize the substrate holder 210 that sandwiches the substrate 220 and the pressure receiving member 230.

図示のように、下側の圧力伝達部１２８は、基板２２０および受圧部材２３０を保持した基板ホルダ２１０の背面に当接している。また、上側の圧力伝達部１３８は、基板２２０および受圧部材２３０を下面に保持した基板ホルダ２１０の背面に当接している。一対の基板ホルダ２１０の間には、積層された一対の基板２２０が挟まれている。圧力伝達部１２８、１３８は相互に接近する方向に圧力を加えており、基板ホルダ２１０の各部には応力Ｐ０が生じている。 As shown in the drawing, the lower pressure transmission unit 128 is in contact with the back surface of the substrate holder 210 holding the substrate 220 and the pressure receiving member 230. The upper pressure transmission unit 138 is in contact with the back surface of the substrate holder 210 that holds the substrate 220 and the pressure receiving member 230 on the lower surface. A pair of stacked substrates 220 is sandwiched between the pair of substrate holders 210. The pressure transmitting portions 128 and 138 apply pressure in a direction approaching each other, and stress P 0 is generated in each portion of the substrate holder 210.

上記の応力Ｐ０は、基板ホルダ２１０を介して、基板２２０および受圧部材２３０に圧力として作用する。しかしながら、基板ホルダ２１０は、基板２２０および受圧部材２３０よりも径が大きいので、受圧部材２３０外側のフランジ部２１４においては、基板ホルダ２１０の間が空いている。この間隙は、接合された基板２２０から基板ホルダ２１０を取り外す場合の手がかりとなる。 The stress P 0 acts as a pressure on the substrate 220 and the pressure receiving member 230 via the substrate holder 210. However, since the substrate holder 210 has a larger diameter than the substrate 220 and the pressure receiving member 230, a space between the substrate holders 210 is vacant in the flange portion 214 outside the pressure receiving member 230. This gap is a clue when removing the substrate holder 210 from the bonded substrate 220.

圧力伝達部１２８、１３８は、基板ホルダ２１０の背面全体に圧力を加えている。保持面２１２においては、基板２２０および受圧部材２３０からの反力を受けて、基板ホルダ２１０は厚さ方向に圧縮変形する。これに対して、間に間隙を有するフランジ部２１４では、加えられた圧力Ｐ０が、基板ホルダ２１０を曲げ変形させる。このため、図中で点線Ａで囲った領域では、圧縮変形する保持面２１２と曲げ変形するフランジ部２１４との境界において、基板ホルダ２１０に応力分布が生じる。 The pressure transmission units 128 and 138 apply pressure to the entire back surface of the substrate holder 210. In the holding surface 212, the substrate holder 210 is compressed and deformed in the thickness direction under the reaction force from the substrate 220 and the pressure receiving member 230. On the other hand, in the flange portion 214 having a gap therebetween, the applied pressure P 0 causes the substrate holder 210 to bend and deform. For this reason, in the region surrounded by the dotted line A in the drawing, a stress distribution is generated in the substrate holder 210 at the boundary between the holding surface 212 that is compressively deformed and the flange portion 214 that is bent and deformed.

図６は、接合装置１００において加圧された部材の縁部に生じる圧力分布を示すグラフである。ここでは、半径１００ｍｍの基板２２０加圧した場合に生じる圧力分布を示す。グラフの横軸は、円板の中心からの距離を表す。   FIG. 6 is a graph showing a pressure distribution generated at an edge portion of a member pressed in the bonding apparatus 100. Here, the pressure distribution generated when the substrate 220 having a radius of 100 mm is pressed is shown. The horizontal axis of the graph represents the distance from the center of the disk.

図示のように、基板２２０の周縁部直近では、外縁に向かって上昇する大きな応力が生じていることが判る。また、外縁における応力集中と引き換えに、外縁に続く半径９０ｍｍ以上の領域においては応力が減少している。   As shown in the drawing, it can be seen that a large stress rising toward the outer edge is generated in the vicinity of the peripheral edge of the substrate 220. Further, in exchange for the stress concentration at the outer edge, the stress is reduced in a region having a radius of 90 mm or more following the outer edge.

このような応力分布が生じた場合、大きな応力が生じる外縁部においては、基板２２０に割れ等が生じる場合がある。従って、外縁部における基板２２０の割れを避けるには、接合装置１００が加える圧力を低くすればよい。   When such a stress distribution occurs, a crack or the like may occur in the substrate 220 at the outer edge where a large stress is generated. Therefore, in order to avoid the crack of the substrate 220 at the outer edge, the pressure applied by the bonding apparatus 100 may be lowered.

しかしながら、応力が小さくなる外縁に続く９０ｍｍ以上の領域では、基板２２０に加わる圧力が低下する。このため、基板２２０が十分に接合されない場合がある。従って、接合不良を回避するには、接合装置１００が加える圧力を高くしなければならない。   However, in the region of 90 mm or more following the outer edge where the stress is reduced, the pressure applied to the substrate 220 is reduced. For this reason, the substrate 220 may not be sufficiently bonded. Therefore, in order to avoid poor bonding, the pressure applied by the bonding apparatus 100 must be increased.

なお、半径９０ｍｍから内側の領域では、基板２２０に生じる圧力は概ね均一になり、大きな応力分布は生じない。このように、基板２２０の接合不良は、基板２２０の外縁部と、それに続く領域に発生し易い。   Note that, in the region inside the radius of 90 mm, the pressure generated on the substrate 220 is substantially uniform, and a large stress distribution does not occur. As described above, the bonding failure of the substrate 220 is likely to occur in the outer edge portion of the substrate 220 and the subsequent region.

このように、フランジ部２１４を有する基板ホルダ２１０を用いた場合、接合装置１００で加圧した場合に、基板２２０の周縁部では特異な応力分布が生じる。このため、基板２２０の損傷を避けつつ接合不良を回避して歩留りを向上させるには、加圧する場合の圧力の設定が難しくなる。   As described above, when the substrate holder 210 having the flange portion 214 is used, when the pressure is applied by the bonding apparatus 100, a unique stress distribution is generated at the peripheral portion of the substrate 220. For this reason, in order to improve the yield by avoiding the bonding failure while avoiding the damage of the substrate 220, it is difficult to set the pressure when pressurizing.

しかしながら、再び図５を参照すると、基板２２０の外側には受圧部材２３０が配される。従って、基板ホルダ２１０の曲げ変形に起因する応力分布は、受圧部材２３０に作用する。これにより、基板２２０には均一な圧力が作用するので、部分的な接合不良を配慮することなく、適切な圧力を設定して接合することができる。   However, referring to FIG. 5 again, the pressure receiving member 230 is disposed outside the substrate 220. Therefore, the stress distribution resulting from the bending deformation of the substrate holder 210 acts on the pressure receiving member 230. Thereby, since a uniform pressure acts on the substrate 220, it is possible to set and bond an appropriate pressure without considering a partial bonding failure.

このように、受圧部材２３０を併用した基板ホルダ２１０は、加圧された場合に生じる応力分布が基板２２０に作用することを防止して、基板２２０全体を良好に接合させることができる。このような、受圧部材２３０は、基板ホルダ２１０と共に繰り返し使用することができる。   As described above, the substrate holder 210 combined with the pressure receiving member 230 can prevent the stress distribution generated when the pressure is applied from acting on the substrate 220 and can satisfactorily bond the entire substrate 220. Such a pressure receiving member 230 can be used repeatedly with the substrate holder 210.

なお、図中に点線Ｂで囲った、基板２２０および受圧部材２３０の間には、不可避に間隙が生じる。この間隙の中でも、一対の基板ホルダ２１０の間に間隙が生じることは避けられない。しかしながら、基板２２０および受圧部材２３０の間の間隙は狭いので、基板ホルダ２１０の曲げ変形が生じた場合も変形量は小さい。従って、曲げ変形の反力として生じる応力分布も僅かなので無視できる。   In addition, a gap is inevitably generated between the substrate 220 and the pressure receiving member 230 surrounded by a dotted line B in the drawing. Among the gaps, it is inevitable that a gap is generated between the pair of substrate holders 210. However, since the gap between the substrate 220 and the pressure receiving member 230 is narrow, the amount of deformation is small even when the substrate holder 210 is bent. Therefore, the stress distribution generated as a reaction force of bending deformation is negligible and can be ignored.

受圧部材２３０は、基板ホルダ２１０に挟まれる基板２２０と同じ厚さを有していれば、任意の材料により形成し得る。しかしながら、接合装置１００において加圧された場合に、保持面２１２全体で応力分布を均一にすることを目指す場合は、例えば、基板２２０と等しい弾性係数を有する材料を選択することが好ましい。このような観点からは、基板２２０の材料そのものにより形成することが有利になる。   The pressure receiving member 230 can be formed of any material as long as it has the same thickness as the substrate 220 sandwiched between the substrate holders 210. However, when it is desired to make the stress distribution uniform over the entire holding surface 212 when pressed in the bonding apparatus 100, it is preferable to select a material having an elastic modulus equal to that of the substrate 220, for example. From this point of view, it is advantageous to form the substrate 220 with the material itself.

一方、受圧部材２３０は、寸法に対して細く薄い形状を有する部材なので、強度が低くなりがちになる。そこで、受圧部材２３０の強度および耐久性を向上させて取り扱いを容易にすることを考慮すると、弾性係数を基板２２０の材料に合わせて調整した金属、樹脂等により形成することが好ましい。   On the other hand, since the pressure receiving member 230 is a member having a thin and thin shape with respect to the dimensions, the strength tends to be low. Therefore, in consideration of improving the strength and durability of the pressure-receiving member 230 and facilitating handling, it is preferable that the elastic member be formed of a metal, a resin, or the like whose elastic coefficient is adjusted according to the material of the substrate 220.

また、同じ寸法の大量の基板２２０を繰り返し接合する場合は、受圧部材２３０を基板ホルダ２３０の保持面に保持させたまま、基板２２０を順次交換する作業手順としてもよい。一方、寸法、形状等が異なる基板２２０の接合をする場合は、受圧部材２３０も、基板２２０の形状および寸法に合わせて交換すべきことはいうまでもない。   In addition, when a large number of substrates 220 having the same dimensions are to be joined repeatedly, a work procedure in which the substrates 220 are sequentially replaced while the pressure receiving member 230 is held on the holding surface of the substrate holder 230 may be employed. On the other hand, when joining the substrates 220 having different dimensions, shapes, etc., it goes without saying that the pressure receiving member 230 should also be replaced in accordance with the shape and dimensions of the substrate 220.

図７は、受圧部材２３０の他の態様を示す断面図である。なお、図７は、図４に対照して描かれており、図４と共通の要素には同じ参照番号を付して重複する説明を省く。   FIG. 7 is a cross-sectional view showing another aspect of the pressure receiving member 230. Note that FIG. 7 is drawn in contrast to FIG. 4, and the same reference numerals are assigned to elements common to FIG. 4, and redundant description is omitted.

図示のように、この形態においては、受圧部材２３０の外径が増して、基板ホルダ２１０の外径と等しくなっている。これにより、圧力伝達部１２８、１３８が基板ホルダ２１０を加圧した場合に、基板ホルダ２１０の間に間隙が生じないので、基板ホルダ２１０の曲げ変形に起因する外縁部の応力集中が生じない。従って、基板ホルダ２１０の弾性変形による劣化が軽減され、寿命を延ばすことができる。   As shown in the figure, in this embodiment, the outer diameter of the pressure receiving member 230 is increased to be equal to the outer diameter of the substrate holder 210. Thereby, when the pressure transmission parts 128 and 138 pressurize the substrate holder 210, no gap is generated between the substrate holders 210, so that stress concentration at the outer edge due to bending deformation of the substrate holder 210 does not occur. Therefore, deterioration due to elastic deformation of the substrate holder 210 is reduced, and the life can be extended.

ただし、基板ホルダ２１０と同じ外径の受圧部材２３０を挟んだ場合、一対の基板ホルダ２１０相互の間に手がかりがなくなる。このため、接合後に基板２２０から基板ホルダ２１０を取り外す場合等に、基板ホルダ２１０を側端面で操作しなければならない。   However, when the pressure receiving member 230 having the same outer diameter as the substrate holder 210 is sandwiched, there is no clue between the pair of substrate holders 210. For this reason, when removing the substrate holder 210 from the substrate 220 after bonding, the substrate holder 210 must be operated on the side end surface.

図８は、受圧部材２３０のまた他の形態を示す断面図である。図８も図４に対照して描かれており、図４と共通の要素には同じ参照番号を付して重複する説明を省く。   FIG. 8 is a cross-sectional view showing still another form of the pressure receiving member 230. FIG. 8 is also illustrated in contrast to FIG. 4, and the same reference numerals are given to the same elements as those in FIG.

図示のように、圧力伝達部１２８、１３８の間には、積層された一対の基板２２０と共に、単一の受圧部材２３０が挟まれる。受圧部材２３０の厚さは、一対の基板２２０の厚さを合わせた厚さに等しい。このような受圧部材２３０を用いた場合も、基板２２０毎に配した一対の受圧部材２３０を用いた場合と同様の効果が得られる。   As shown in the figure, a single pressure receiving member 230 is sandwiched between the pressure transmission units 128 and 138 together with the pair of stacked substrates 220. The thickness of the pressure receiving member 230 is equal to the total thickness of the pair of substrates 220. Even when such a pressure receiving member 230 is used, the same effect as that obtained when a pair of pressure receiving members 230 arranged for each substrate 220 is used can be obtained.

また、受圧部材２３０が単一なので、接合装置１００に基板２２０を装入する場合に、基板ホルダ２１０に受圧部材２３０を保持させる手順をひとつ省くことができる。更に、厚くすることができるので、受圧部材２３０自体の強度を高くすることができる。   Further, since the pressure receiving member 230 is single, when the substrate 220 is inserted into the bonding apparatus 100, one procedure for holding the pressure receiving member 230 on the substrate holder 210 can be omitted. Further, since the thickness can be increased, the strength of the pressure receiving member 230 itself can be increased.

をただし、一対の基板ホルダ２１０に一対の基板２２０を挟む場合に、基板２２０の接合面を側方から観察することができない。このため、基板２２０の表面を観察することなく、基板２２０相互を位置合わせする方法を選ばなければならない。   However, when the pair of substrates 220 is sandwiched between the pair of substrate holders 210, the bonding surface of the substrate 220 cannot be observed from the side. For this reason, a method of aligning the substrates 220 without observing the surface of the substrates 220 must be selected.

図９は、受圧部材２３０の更に他の形態を示す断面図である。図９も図４に対照して描かれており、図４と共通の要素には同じ参照番号を付して重複する説明を省く。   FIG. 9 is a cross-sectional view showing still another form of the pressure receiving member 230. FIG. 9 is also drawn in contrast to FIG. 4, and the same reference numerals are assigned to the same elements as those in FIG.

受圧部材２３０は、基材層２３２および圧電材料層２３４の複数の層を含む。基材層２３２は、他の例で説明した受圧部材２３０と同様に、金属、樹脂、Ｓｉ基板等により形成される。これに対して、圧電材料層２３４は、ＰＺＴ等の圧電材料により形成される。   The pressure receiving member 230 includes a plurality of layers of a base material layer 232 and a piezoelectric material layer 234. The base material layer 232 is formed of a metal, resin, Si substrate, or the like, similarly to the pressure receiving member 230 described in the other examples. On the other hand, the piezoelectric material layer 234 is formed of a piezoelectric material such as PZT.

更に、圧電材料層２３４は可変電圧源２３６に結合される。可変電圧源２３６は、印加電圧を設定する制御部２３８の制御の下に、圧電材料層２３４に印加する電圧を変化させる。   Further, the piezoelectric material layer 234 is coupled to a variable voltage source 236. The variable voltage source 236 changes the voltage applied to the piezoelectric material layer 234 under the control of the control unit 238 that sets the applied voltage.

上記のような構造を有する受圧部材２３０は、圧電材料層２３４に印加する電圧の増減に応じて厚さを増減させることができる。従って、基板２２０の厚さのばらつきに起因する基板２２０および受圧部材２３０の厚さの差を調整して、基板２２０および受圧部材２３０から基板ホルダ２１０にかかる反力が等しくなるように調整できる。これにより、基板２２０および受圧部材２３０の微細な厚さの差により基板２２０の外縁部近傍に生じる圧力分布を更に低減できる。   The pressure receiving member 230 having the above structure can increase or decrease the thickness in accordance with increase or decrease of the voltage applied to the piezoelectric material layer 234. Therefore, the difference in thickness between the substrate 220 and the pressure receiving member 230 due to the variation in the thickness of the substrate 220 can be adjusted so that the reaction force applied from the substrate 220 and the pressure receiving member 230 to the substrate holder 210 becomes equal. As a result, the pressure distribution generated in the vicinity of the outer edge portion of the substrate 220 due to the minute difference in thickness between the substrate 220 and the pressure receiving member 230 can be further reduced.

以上、実施の形態を用いて本発明を説明したが、本発明の技術的範囲は上記実施の形態に記載の範囲には限定されない。上記実施の形態に、多様な変更または改良を加え得ることが当業者に明らかである。その様な変更または改良を加えた形態も本発明の技術的範囲に含まれ得ることが、特許請求の範囲の記載から明らかである。   As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

特許請求の範囲、明細書、および図面中において示した装置、システム、プログラム、および方法における動作、手順、ステップ、および段階等の各処理の実行順序は、特段「より前に」、「先立って」等と明示しておらず、また、前の処理の出力を後の処理で用いるのでない限り、任意の順序で実現しうることに留意すべきである。特許請求の範囲、明細書、および図面中の動作フローに関して、便宜上「まず」、「次に」等を用いて説明したとしても、この順で実施することが必須であることを意味するものではない。   The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it does not mean that it is essential to carry out in this order. Absent.

接合装置１００の構造を模式的に示す断面図である。2 is a cross-sectional view schematically showing the structure of the bonding apparatus 100. FIG. 接合装置１００の動作を示す図である。It is a figure which shows operation | movement of the joining apparatus. 基板ホルダ２１０の外観を示す斜視図である。It is a perspective view which shows the external appearance of the substrate holder 210. FIG. 基板２２０を保持して積層された基板ホルダ２１０の断面図である。It is sectional drawing of the substrate holder 210 laminated | stacked holding the board | substrate 220. FIG. 図４の部分拡大図である。It is the elements on larger scale of FIG. 基板２２０の周縁部における応力分布を示すグラフである。6 is a graph showing a stress distribution in a peripheral portion of a substrate 220. 受圧部材２３０の他の形態を示す断面図である。6 is a cross-sectional view showing another form of the pressure receiving member 230. FIG. 受圧部材２３０のまた他の形態を示す断面図である。6 is a cross-sectional view showing still another form of the pressure receiving member 230. FIG. 受圧部材２３０の更に他の形態を示す断面図である。FIG. 11 is a cross-sectional view showing still another form of the pressure receiving member 230.

符号の説明Explanation of symbols

１００ 接合装置、１１０ 基盤、１２０ 下部組立体、１２１、１３１ ヒータユニット、１２２、１３２ 支柱、１２３、１３３ ベアリング、１２４ 下部フレーム、１２６ ロードセル、１２８、１３８ 圧力伝達部、１３０ 上部組立体、１３４ 上部フレーム、１３６ シリンダ、１４０ 計測部、２１０ 基板ホルダ、２１２ 保持面、２１４ フランジ部、２１６ 挿通穴、２１７ 基準標識、２１８ バーコード、２２０ 基板、２３０ 受圧部材、２３２ 基材層、２３４ 圧電材料層、２３６ 可変電圧源、２３８ 制御部 100 Joining device, 110 Base, 120 Lower assembly, 121, 131 Heater unit, 122, 132 Post, 123, 133 Bearing, 124 Lower frame, 126 Load cell, 128, 138 Pressure transmission unit, 130 Upper assembly, 134 Upper frame 136 Cylinder, 140 Measuring unit, 210 Substrate holder, 212 Holding surface, 214 Flange unit, 216 Insertion hole, 217 Reference mark, 218 Bar code, 220 Substrate, 230 Pressure receiving member, 232 Base material layer, 234 Piezoelectric material layer, 236 Variable voltage source, 238 controller

Claims (18)

加圧により他の基板に接合される基板を保持する保持領域を有する板状部材と、
前記板状部材を介して前記基板が加圧されたときに前記基板の周縁部に生じる応力集中を緩和する応力緩和部とを備え、
前記応力緩和部は、前記保持領域の外側かつ前記他の基板の外側に配され、前記保持領域に保持された基板の厚さと等しい突出量を有し、前記基板の加圧時に前記板状部材から加圧力を受ける受圧部材を有する基板保持部材。 A plate-like member having a holding region for holding a substrate bonded to another substrate by pressurization;
A stress relieving part that relieves stress concentration generated in the peripheral part of the substrate when the substrate is pressurized via the plate-like member;
The stress relieving part is disposed outside the holding region and outside the other substrate, and has a protruding amount equal to the thickness of the substrate held in the holding region, and the plate-like member when the substrate is pressed A substrate holding member having a pressure receiving member that receives pressure from the substrate. 前記受圧部材は、前記板状部材の前記保持領域を含む保持面から突出するように前記保持面上に配される請求項１に記載の基板保持部材。   The substrate holding member according to claim 1, wherein the pressure receiving member is disposed on the holding surface so as to protrude from a holding surface including the holding region of the plate-like member. 前記受圧部材は、前記基板に対して前記板状部材から加えられる圧力が低い領域において前記板状部材に保持される請求項１または２に記載の基板保持部材。   The board | substrate holding member of Claim 1 or 2 with which the said pressure receiving member is hold | maintained at the said plate-shaped member in the area | region where the pressure applied from the said plate-shaped member with respect to the said board | substrate is low. 前記受圧部材は、前記保持領域を包囲する環状部材である請求項１から３のいずれか一項に記載の基板保持部材。   4. The substrate holding member according to claim 1, wherein the pressure receiving member is an annular member surrounding the holding region. 5. 前記環状部材は、前記保持面に保持した前記基板の外形に略等しい内側形状を有する請求項４に記載の基板保持部材。   The substrate holding member according to claim 4, wherein the annular member has an inner shape substantially equal to an outer shape of the substrate held on the holding surface. 前記受圧部材は、前記板状部材の外形と等しい外形を有する請求項１または２に記載の基板保持部材。   The substrate holding member according to claim 1, wherein the pressure receiving member has an outer shape equal to an outer shape of the plate-like member. 前記受圧部材は、前記基板の材料と同一の材料で形成されている請求項１から６のいずれか一項に記載の基板保持部材。   The substrate holding member according to claim 1, wherein the pressure receiving member is formed of the same material as that of the substrate. 前記受圧部材は、前記基板の弾性係数と等しい弾性係数を有する材料で形成されている請求項１から７のいずれか一項に記載の基板保持部材。   The substrate holding member according to claim 1, wherein the pressure receiving member is formed of a material having an elastic coefficient equal to an elastic coefficient of the substrate. 前記受圧部材は、前記保持面からの突出量が可変である請求項１から８のいずれか一項に記載の基板保持部材。   The substrate holding member according to any one of claims 1 to 8, wherein the pressure receiving member has a variable protrusion amount from the holding surface. 前記受圧部材は、印加される電圧の増減に応じて伸縮する電気機械変換材料を有する請求項９に記載の基板保持部材。   The substrate holding member according to claim 9, wherein the pressure receiving member includes an electromechanical conversion material that expands and contracts in accordance with an increase or decrease in applied voltage. 前記板状部材は、前記板状部材の前記基板を保持する保持面において前記受圧部材の外側まで延在するフランジ部を更に有する請求項１から１０のいずれか一項に記載の基板保持部材。   11. The substrate holding member according to claim 1, wherein the plate-like member further includes a flange portion that extends to the outside of the pressure-receiving member on a holding surface that holds the substrate of the plate-like member. 請求項１から請求項１１のいずれか一項に記載された前記基板保持部材に保持された前記基板と前記他の基板とに、前記板状部材を介して圧力を加える加圧面を有する加圧部を備える接合装置。   The pressurization which has a pressurization surface which applies pressure via the plate-like member to the substrate held by the substrate holding member according to any one of claims 1 to 11, and the other substrate. Joining apparatus provided with a section. 請求項１から請求項１１のいずれか一項に記載された一対の前記基板保持部材と、
前記一対の基板保持部材に各々保持されて前記一対の基板保持部材の間に挟まれた一対の基板に、前記板状部材を介して圧力を加える加圧部とを備え、当該一対の基板を圧着させる接合装置。 A pair of said board | substrate holding members as described in any one of Claims 1-11,
A pressurizing unit that applies pressure to the pair of substrates held between the pair of substrate holding members and sandwiched between the pair of substrate holding members via the plate-like member; Bonding device for crimping. 基板と当該基板の厚さと等しい厚さを有して当該基板の外側に配された受圧部材とに接して当該基板を加圧する加圧面を備えた接合装置。   A bonding apparatus including a pressure surface that pressurizes a substrate in contact with a pressure receiving member disposed on the outside of the substrate and having a thickness equal to the thickness of the substrate. 一対の基板を互いに位置合わせする位置合わせ工程と、
前記一対の基板の厚さと等しい突出量を有する受圧部材を、加圧面上における前記一対の基板の外側に配置する配置工程と、
前記受圧部材が配置された状態で前記一対の基板を一対の加圧面の間で加圧する加圧工程と
を有する接合方法。 An alignment step of aligning the pair of substrates with each other;
An arrangement step of disposing a pressure receiving member having a protruding amount equal to the thickness of the pair of substrates on the outer side of the pair of substrates on the pressing surface;
Bonding method with <br/> pressurizing pressurizing step and between the pair of the substrates a pair of pressing surface in a state where the pressure receiving member is disposed. 一方の加圧面からの前記受圧部材の突出量を前記基板の厚さに応じて調整する調整工程を有する請求項１５に記載の接合方法。 The bonding method according to claim 15, further comprising an adjusting step of adjusting a protruding amount of the pressure receiving member from one pressure surface according to a thickness of the substrate. 互いに厚さが異なる複数の受圧部材から前記基板の厚さと等しい厚さを有する前記受圧部材を選択する選択工程を有する請求項１６に記載の接合方法。   The bonding method according to claim 16, further comprising a selection step of selecting the pressure receiving member having a thickness equal to the thickness of the substrate from a plurality of pressure receiving members having different thicknesses. 加圧により他の基板に接合される基板を保持する保持領域を有する板状部材と、A plate-like member having a holding region for holding a substrate bonded to another substrate by pressurization;
前記板状部材を介して前記基板が加圧されたときに前記基板の周縁部に生じる応力集中を緩和する応力緩和部とを備え、A stress relieving part that relieves stress concentration generated in the peripheral part of the substrate when the substrate is pressurized via the plate-like member;
前記応力緩和部は、前記保持領域の外側に配され、前記保持領域に保持された基板の厚さと前記他の基板の厚さとの和に等しい突出量を有し、前記基板の加圧時に前記板状部材から加圧力を受ける受圧部材を有する基板保持部材。The stress relieving part is disposed outside the holding region, has a protruding amount equal to the sum of the thickness of the substrate held in the holding region and the thickness of the other substrate, and when the substrate is pressed A substrate holding member having a pressure receiving member that receives pressure from a plate member.
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