JP5573027B2 - Container for storing electronic circuit and electronic device - Google Patents

Container for storing electronic circuit and electronic device Download PDF

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JP5573027B2
JP5573027B2 JP2009162491A JP2009162491A JP5573027B2 JP 5573027 B2 JP5573027 B2 JP 5573027B2 JP 2009162491 A JP2009162491 A JP 2009162491A JP 2009162491 A JP2009162491 A JP 2009162491A JP 5573027 B2 JP5573027 B2 JP 5573027B2
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electronic circuit
case
current
lid
ebg structure
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大介 井口
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Fujifilm Business Innovation Corp
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Fuji Xerox Co Ltd
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Description

本発明は、電子回路を収容する容器及び電子装置に関する。   The present invention relates to a container for housing an electronic circuit and an electronic device.

高周波回路から発生する電磁波が他の機器に影響を与えないよう、高周波回路を金属からなる筐体に収容することが一般に行われている（特許文献１参照）。   In general, the high frequency circuit is housed in a metal casing so that electromagnetic waves generated from the high frequency circuit do not affect other devices (see Patent Document 1).

特許文献１には、高周波回路を収容し、この高周波回路の動作周波数に基づく電磁波の表面伝搬を阻止する高インピーダンス板を供えた金属からなる筐体が記載されている。   Patent Document 1 describes a metal casing that houses a high-frequency circuit and is provided with a high-impedance plate that prevents surface propagation of electromagnetic waves based on the operating frequency of the high-frequency circuit.

特開２００４−２２５８７号公報Japanese Patent Laid-Open No. 2004-22587

本発明は、収容部の共振により収容部に流れる電流を抑制可能な電子回路を収容する容器及び電子装置を提供することを目的とする。   An object of this invention is to provide the container and electronic device which accommodate the electronic circuit which can suppress the electric current which flows into an accommodating part by resonance of an accommodating part.

本発明の一態様は、上記目的を達成するために、以下の電子回路を収容する容器及び電子装置を提供する。   In order to achieve the above object, one embodiment of the present invention provides a container and an electronic device that house the following electronic circuit.

［１］電子回路を内部空間に収容する導電性材料の収容部と、前記電子回路の動作により前記収容部に流れる電流の電流路に設けられ、前記収容部の共振周波数を有する電流を抑制する抑制部材とを備え、前記抑制部材は、前記収容部の内面に互い交差して連続して一周するように帯状に配置された一対の抑制部材を有する電子回路を収容する容器。 [1] A conductive material accommodating portion that accommodates an electronic circuit in an internal space, and a current path of a current that flows through the accommodating portion by the operation of the electronic circuit, and suppresses a current having a resonance frequency of the accommodating portion. A container for housing an electronic circuit having a pair of restraining members arranged in a belt shape so as to cross the inner surface of the housing portion and continuously make a round .

［２］電子回路と、前記電子回路を内部空間に収容する導電性材料の収容部と、前記電子回路の動作により前記収容部に流れる電流の電流路に設けられ、前記収容部の共振周波数を有する電流を抑制する抑制部材とを備え、前記抑制部材は、前記収容部の内面に互い交差して連続して一周するように帯状に配置された一対の抑制部材を有する電子装置。 [ 2 ] Provided in an electronic circuit, an accommodating portion of a conductive material that accommodates the electronic circuit in an internal space, and a current path of a current that flows through the accommodating portion by the operation of the electronic circuit, and the resonance frequency of the accommodating portion is An electronic device including a pair of suppression members arranged in a belt shape so as to continuously cross the inner surface of the housing portion and continuously make a round .

請求項１、２に記載の発明によれば、抑制部材が収容部の内面を一周しない場合に比べて、収容する電子回路の動作によって発生する収容部の共振周波数の電流を抑制できる。 According to the invention described in claim 1, as compared with the case where suppression member is not around the inner surface of the housing portion, the current in the resonant frequency of the housing portion generated by the operation of the electronic circuit for receiving can be suppressed.

図１は、本発明の参考例１に係る電子回路及び電子回路を収容する容器を有する電子装置を示す外観図である。FIG. 1 is an external view showing an electronic device according to Reference Example 1 of the present invention, which has an electronic circuit and a container that houses the electronic circuit. 図２は、本発明の参考例１に係る電子装置を示す一部断面図である。FIG. 2 is a partial cross-sectional view showing an electronic device according to Reference Example 1 of the present invention. 図３（ａ）〜（ｃ）は、本発明の参考例１に係るＥＢＧ構造体を示す説明図である。3A to 3C are explanatory views showing an EBG structure according to Reference Example 1 of the present invention. 図４（ａ）〜（ｃ）は、本発明の参考例２に係る第１及び第２のＥＢＧ構造体を示す説明図である。4 (a) to 4 (c) are explanatory views showing first and second EBG structures according to Reference Example 2 of the present invention. 図５（ａ）及び（ｂ）は、本発明の参考例３に係る筐体を示す外観図及び展開図である。5A and 5B are an external view and a developed view showing a housing according to Reference Example 3 of the present invention. 図６は、本発明の実施の形態に係る筐体の内面を示す展開図である。Figure 6 is a developed view showing the inner surface of the housing according to the implementation of the embodiment of the present invention.

［参考例１]
図１は、本発明の参考例１に係る電子回路を収容する容器及び電子回路を有する電子装置の外観を示す。この電子装置１００は、例えばプリンタ機能やコピー機能等を備えた画像処理装置の制御装置として使用される。 [ Reference Example 1 ]
FIG. 1 shows the external appearance of a container for housing an electronic circuit and an electronic device having the electronic circuit according to Reference Example 1 of the present invention. The electronic device 100 is used as a control device for an image processing apparatus having a printer function, a copy function, and the like, for example.

電子回路を収容する容器の一例としての筐体１は、ケース本体１１と蓋１２からなるケース１０を有している。ケース本体１１及び蓋１２は、鉄やアルミ等の導電性材料からなり、ケース本体１１と蓋１２はボルト締め等の公知の手段により電気的に接続された状態で一体に結合される。ケース本体１１は、その長方形状の底面１１０から側面１１１，１１２，１１３，１１４がそれぞれ垂直に形成されている。ケース１０は全体として直方体状であり、図示のようにケース本体１１の幅寸法をａ、奥行き寸法をｂで表す。   A housing 1 as an example of a container that houses an electronic circuit includes a case 10 including a case body 11 and a lid 12. The case body 11 and the lid 12 are made of a conductive material such as iron or aluminum, and the case body 11 and the lid 12 are integrally coupled in a state where they are electrically connected by a known means such as bolting. The case body 11 has side surfaces 111, 112, 113, and 114 formed vertically from the rectangular bottom surface 110, respectively. The case 10 has a rectangular parallelepiped shape as a whole, and the width dimension of the case body 11 is represented by a and the depth dimension is represented by b as illustrated.

電子回路２は、回路パターンが形成されたプリント基板２０の表面に複数の電子部品２１が実装されている。電子部品２１としては、ＣＰＵ（Central Processing Unit；中央演算処理装置）や各種メモリ、ゲート素子、コンデンサや抵抗器等が含まれる。各電子部品２１は、プリント基板２０に形成された回路パターンにより接続され、電子回路として機能する。   In the electronic circuit 2, a plurality of electronic components 21 are mounted on the surface of the printed circuit board 20 on which a circuit pattern is formed. The electronic component 21 includes a CPU (Central Processing Unit), various memories, gate elements, capacitors, resistors, and the like. Each electronic component 21 is connected by a circuit pattern formed on the printed circuit board 20 and functions as an electronic circuit.

プリント基板２０の端部にはコネクタ２２が装着されており、コネクタ２２を介して電子回路２への電源供給及び電気信号の送受信が行われる。コネクタ２２は、ケース本体１１に形成された開口部１１ａからその一端が外部に突き出し、相手側のコネクタに接続される。   A connector 22 is attached to the end of the printed circuit board 20, and power is supplied to the electronic circuit 2 and electrical signals are transmitted and received via the connector 22. One end of the connector 22 protrudes from the opening 11a formed in the case main body 11 and is connected to the mating connector.

プリント基板２０の四隅には取付孔２０ａが形成されており、プリント基板２０は各取付孔２０ａに対応する４つの導電性のスペーサ４を介してケース１０の底面１１０に取り付けられる。プリント基板２０の底面１１０側に面した側にはグランドパターンが形成されており、このグランドパターンがスペーサ４を介してケース本体１１に電気的に接続される。ケース本体１１には、一端が接地された導線５２の他端が端子５１を介して接続されている。   Attachment holes 20a are formed at the four corners of the printed circuit board 20, and the printed circuit board 20 is attached to the bottom surface 110 of the case 10 via four conductive spacers 4 corresponding to the attachment holes 20a. A ground pattern is formed on the side facing the bottom surface 110 of the printed circuit board 20, and this ground pattern is electrically connected to the case body 11 via the spacer 4. The other end of the conducting wire 52 whose one end is grounded is connected to the case body 11 via a terminal 51.

筐体１はまた、蓋１２の電子回路２に面した裏側（ケース１０の内側）に形成された、抑制部材の一例としてのＥＢＧ（Electromagnetic Band Gap）構造体３を有している。ＥＢＧ構造体３は、内部空間の幅方向の全体に亘って帯状に配置されている。ＥＢＧ構造体３は、蓋１２に流れる特定の周波数帯の電流を抑制する機能を有しており、その詳細については後述する。   The housing 1 also has an EBG (Electromagnetic Band Gap) structure 3 as an example of a suppressing member formed on the back side (inside the case 10) facing the electronic circuit 2 of the lid 12. The EBG structure 3 is disposed in a strip shape over the entire width of the internal space. The EBG structure 3 has a function of suppressing a current in a specific frequency band flowing through the lid 12, and details thereof will be described later.

図２は、ケース本体１１に電子回路２及び蓋１２が組み付けられた状態の電子装置１００を、ケース本体１１の側面１１１の付近で切断して示す。ケース本体１１及び蓋１２によって形成された収容空間Ｓに電子回路２が収容されている。ケース本体１１の高さと蓋１２の厚みを合わせたケース１０の高さ寸法をｃで表す。   FIG. 2 shows the electronic device 100 in a state where the electronic circuit 2 and the lid 12 are assembled to the case body 11, cut off in the vicinity of the side surface 111 of the case body 11. The electronic circuit 2 is housed in the housing space S formed by the case body 11 and the lid 12. The height dimension of the case 10 that combines the height of the case body 11 and the thickness of the lid 12 is represented by c.

ＥＢＧ構造体３は、蓋１２の裏側に密着して張りつけられた誘電体３１と、誘電体３１の蓋１２とは反対側に密着して張りつけられた金属メッシュ３２とを有している。   The EBG structure 3 includes a dielectric 31 attached in close contact with the back side of the lid 12 and a metal mesh 32 attached in close contact with the opposite side of the cover 31 of the dielectric 31.

図３（ａ）は、ＥＢＧ構造体３の一部をケース１０の内側から見た図である。金属メッシュ３２は、多数の正方形状の金属小片３２０を平面状に等間隔で並べたメタルパッチ構造を備えている。   FIG. 3A is a view of a part of the EBG structure 3 as viewed from the inside of the case 10. The metal mesh 32 has a metal patch structure in which a large number of square metal pieces 320 are arranged at regular intervals in a planar shape.

図３（ｂ）は、金属メッシュ３２を構成する１つの金属小片３２０を、その周辺部を含めて拡大して示す。１つの金属小片３２０は、隣接する４つの金属小片３２０と接続片３２１ａ，３２１ｂ，３２１ｃ，３２１ｄを介して接続されている。接続片３２１ａ及び接続片３２１ｂは、金属小片３２０の一角部に設けられており、接続片３２１ｃは金属小片３２０の一辺を挟んで接続片３２１ａの反対側の角部に設けられている。また、接続片３２１ｄは金属小片３２０の一辺を挟んで接続片３２１ｂの反対側の角部に設けられている。残る一つの角部には接続片が設けられていない。   FIG. 3B shows one metal piece 320 constituting the metal mesh 32 in an enlarged manner including its peripheral part. One metal piece 320 is connected to four adjacent metal pieces 320 via connection pieces 321a, 321b, 321c, and 321d. The connection piece 321a and the connection piece 321b are provided at one corner of the metal piece 320, and the connection piece 321c is provided at a corner opposite to the connection piece 321a across one side of the metal piece 320. The connection piece 321d is provided at a corner on the opposite side of the connection piece 321b across one side of the metal piece 320. The remaining one corner is not provided with a connection piece.

図３（ｃ）は、図３（ｂ）に示した金属小片３２０及び接続片３２１ａ〜３２１ｄの２次元等価回路を示す。この２次元等価回路は、直列に接続されたインダクタＬ１，Ｌ２の間にキャパシタＣを接続して構成されている。   FIG. 3C shows a two-dimensional equivalent circuit of the metal piece 320 and the connection pieces 321a to 321d shown in FIG. This two-dimensional equivalent circuit is configured by connecting a capacitor C between inductors L1 and L2 connected in series.

金属小片３２０のキャパシタンスをＣpatch、金属小片３２０のインダクタンスをＬpatch、各接続片３２１ａ〜３２１ｄのインダクタンスをＬbranchとすると、上記２次元等価回路のキャパシタＣの静電容量はＣpatch、インダクタＬ１，Ｌ２のインダクタンスは（Ｌpatch＋Ｌbranch）／２で表される。また、ＥＢＧ構造体３のカットオフ周波数ｆcutoffは式１で表される。

Figure 0005573027
If the capacitance of the metal piece 320 is Cpatch, the inductance of the metal piece 320 is Lpatch, and the inductance of each of the connection pieces 321a to 321d is Lbranch, the capacitance of the capacitor C of the two-dimensional equivalent circuit is Cpatch and the inductances of the inductors L1 and L2. Is represented by (Lpatch + Lbranch) / 2. Further, the cutoff frequency fcutoff of the EBG structure 3 is expressed by Expression 1.
Figure 0005573027

例えば、Ｃpatchを１３．３Ｆ、Ｌpatchを１ｎＨ、Ｌbranchを１ｎＨとした場合には、カットオフ周波数ｆcutoffは１．９５ＧＨｚとなる。   For example, when Cpatch is 13.3F, Lpatch is 1 nH, and Lbranch is 1 nH, the cutoff frequency fcutoff is 1.95 GHz.

一方、ケース１０固有の共振周波数ｆmnqは、幅方向のモード次数をｍ、奥行き方向のモード次数をｎ、高さ方向のモード次数をｑ、光速をＣｏとすると、式２で表される。

Figure 0005573027
On the other hand, the resonance frequency fmnq peculiar to the case 10 is expressed by Expression 2 where m is the mode order in the width direction, n is the mode order in the depth direction, q is the mode order in the height direction, and Co is the speed of light.
Figure 0005573027

ＥＢＧ構造体３がこのｆmnqの周波数の電流を抑制する特性を有するように、金属小片３２０及び各接続片３２１ａ〜３２１ｄの形状を設定し、Ｃpatch，Ｌpatch及びＬbranchを調整してカットオフ周波数ｆcutoffをｆmnqに近づける。このように、電子回路２の動作によりケース１０が共振して流れる電流を抑制し、この電流によって引き起こされる電磁放射が電子回路２を誤動作させることを抑制する。ＥＢＧ構造体３は、ケース１０に流れる電流を４０ｄＢ以上減衰させるように構成することが望ましい。   The shape of the metal piece 320 and each of the connection pieces 321a to 321d is set so that the EBG structure 3 has a characteristic of suppressing the current at the frequency of fmnq, and the cutoff frequency fcutoff is adjusted by adjusting Cpatch, Lpatch and Lbranch. Move closer to fmnq. In this way, the current flowing when the case 10 resonates due to the operation of the electronic circuit 2 is suppressed, and the electromagnetic radiation caused by this current is prevented from causing the electronic circuit 2 to malfunction. The EBG structure 3 is desirably configured to attenuate the current flowing through the case 10 by 40 dB or more.

例えば、ケース１０の幅方向の寸法ａを２００ｍｍ、モード次数ｍを１とし、奥行き方向の寸法ｂを１５０ｍｍ、モード次数ｎを１とし、高さ方向の寸法ｃを１００ｍｍ、モード次数ｑを１とした場合には、共振周波数ｆmnqは１．９５ＧＨｚとなる。   For example, the width direction dimension a of the case 10 is 200 mm, the mode order m is 1, the depth direction dimension b is 150 mm, the mode order n is 1, the height dimension c is 100 mm, and the mode order q is 1. In this case, the resonance frequency fmnq is 1.95 GHz.

本参考例１では、蓋１２の内側にＥＢＧ構造体３を配置したので、蓋１２，ケース本体１１の側面１１３，底面１１０，側面１１１を環状に流れる電流が抑制される。 In the first reference example , since the EBG structure 3 is arranged inside the lid 12, the current flowing in an annular manner through the lid 12, the side surface 113, the bottom surface 110, and the side surface 111 of the case body 11 is suppressed.

誘電体３１としては、常磁性体粒子を分散して大きな負の誘電率を有する誘電体を適用することができる。このような誘電体は実効比誘電率の絶対値が１０を超えるようにすることが可能であり、これによって金属小片３２０の大きさを小さくすることができ、ケース１０に流れる電流をより大きく減衰させることが可能となる。   As the dielectric 31, a dielectric having a large negative dielectric constant by dispersing paramagnetic particles can be used. Such a dielectric can have an absolute value of an effective relative dielectric constant exceeding 10. This can reduce the size of the metal piece 320 and attenuate the current flowing through the case 10 more greatly. It becomes possible to make it.

［参考例２］
次に、本発明の参考例２につき、図４を用いて説明する。参考例２では、蓋１２の内側に第１及び第２のＥＢＧ構造体を配置した点が参考例１とは異なり、他の部分は共通するので、共通する部分については説明を省略する。 [ Reference Example 2 ]
Next, Reference Example 2 of the present invention will be described with reference to FIG. Reference Example 2 is different from Reference Example 1 in that the first and second EBG structures are arranged on the inner side of the lid 12, and other parts are common, and thus description of common parts is omitted.

図４（ａ）は、蓋１２をケース１０の内側から見た状態を示す。この図に示すように、参考例２では、蓋１２に第１のＥＢＧ構造体３３と、第２のＥＢＧ構造体３４とが平行して配置されている。蓋１２がケース本体１１に組み付けられた状態では、ＥＢＧ構造体３３及び第２のＥＢＧ構造体３４がケース１０の内面の幅方向の両端部に達している。 FIG. 4A shows a state in which the lid 12 is viewed from the inside of the case 10. As shown in this figure, in the reference example 2 , the first EBG structure 33 and the second EBG structure 34 are arranged in parallel on the lid 12. In a state where the lid 12 is assembled to the case main body 11, the EBG structure 33 and the second EBG structure 34 reach both ends of the inner surface of the case 10 in the width direction.

図４（ｂ）に示すように、第１のＥＢＧ構造体３３は、参考例１のＥＢＧ構造体３と同様、誘電体３１の表面に多数の第１の金属小片３３０が２次元的に等間隔に配置されており、第１の金属小片３３０のそれぞれが、４箇所に形成された接続片３３１ａ，３３１ｂ，３３１ｃ，３３１ｄで隣接する他の金属小片３３０と接続されている。 As shown in FIG. 4B, the first EBG structure 33 has a large number of first metal pieces 330 two-dimensionally on the surface of the dielectric 31 like the EBG structure 3 of Reference Example 1. The first metal pieces 330 are arranged at intervals, and each of the first metal pieces 330 is connected to the other adjacent metal pieces 330 by connecting pieces 331a, 331b, 331c, and 331d formed at four locations.

図４（ｃ）に示すように、第２のＥＢＧ構造体３４も多数の第２の金属小片３４０が接続片３４１ａ，３４１ｂ，３４１ｃ，３４１ｄで隣接する他の金属小片３４０と接続されているが、第２の金属小片３４０は、第１の金属小片３３０よりも大きさが小さい。これにより、図３（ｃ）に示した等価回路のインダクタンス及びキャパシタンスが異なり、カットオフ周波数も異なっている。   As shown in FIG. 4C, the second EBG structure 34 also has a large number of second metal pieces 340 connected to other adjacent metal pieces 340 by connecting pieces 341a, 341b, 341c, 341d. The second metal piece 340 is smaller in size than the first metal piece 330. As a result, the inductance and capacitance of the equivalent circuit shown in FIG. 3C are different, and the cutoff frequency is also different.

第１のＥＢＧ構造体３３のカットオフ周波数ｆcutoff１と第２のＥＢＧ構造体３３のカットオフ周波数ｆcutoff２は、式２におけるモード次数ｍ，ｎ，ｑが異なる２つの共振周波数ｆmnqに対応して設定されている。これにより、１つのＥＢＧ構造体のみを配置した場合よりも広い帯域でケース１０に流れる電流が抑制される。   The cut-off frequency fcutoff1 of the first EBG structure 33 and the cut-off frequency fcutoff2 of the second EBG structure 33 are set corresponding to two resonance frequencies fmnq in which the mode orders m, n, and q in Equation 2 are different. ing. Thereby, the electric current which flows into case 10 in the zone | band wider than the case where only one EBG structure is arrange | positioned is suppressed.

［参考例３］
次に、参考例３につき、図５を用いて説明する。
図５（ａ）は、電子回路２を省略し、筐体１の内部を破線で示す筐体１の外観図である。また、図５（ｂ）は、説明のために収容空間Ｓを直方体に見立ててその展開図を示したものである。これら図面に示すように、ＥＢＧ構造体３５は、ケース本体１１の側面１１４，底面１１０，側面１１２，及び蓋１２にまたがって、ケース１０の収容空間Ｓの内面を一周する輪となった帯状に配置されている。 [ Reference Example 3 ]
Next, Reference Example 3 will be described with reference to FIG.
FIG. 5A is an external view of the housing 1 in which the electronic circuit 2 is omitted and the inside of the housing 1 is indicated by a broken line. FIG. 5B is a development view of the accommodation space S as a rectangular parallelepiped for the sake of explanation. As shown in these drawings, the EBG structure 35 is formed in a belt-like shape that extends over the side surface 114, the bottom surface 110, the side surface 112, and the lid 12 of the case body 11 and makes a circle around the inner surface of the housing space S of the case 10. Has been placed.

本参考例３では、ケース本体１１の側面１１３，底面１１０，側面１１１，蓋１２を環状に流れる電流路Ｉ１の電流のみならず、ケース本体１１の側面１１１，１１２，１１３，１１４を環状に流れる電流路Ｉ２の電流も抑制される。 In the present reference example 3 , not only the current in the current path I1 that flows through the side surface 113, the bottom surface 110, the side surface 111, and the lid 12 of the case main body 11 but also the side surfaces 111, 112, 113, and 114 of the case main body 11 flows circularly. The current in the current path I2 is also suppressed.

［実施の形態］
次に、本発明の実施の形態につき、図６を用いて説明する。
図６は、参考例３の図５（ｂ）に相当する、収容空間Ｓを直方体に見立てた展開図である。この図に示すように、ＥＢＧ構造体３６は、ケース本体１１の側面１１１，１１２，１１３，１１４及び底面１１０並びに蓋１２の内面を２方向に横断するように配置されている。本実施の形態では、図５（ｂ）に示した電流路Ｉ１，Ｉ２（図６では図示を省略）の電流に加え、蓋１２，ケース本体１１の側面１１２，底面１１０，側面１１４を環状に流れる電流路Ｉ３の電流も抑制される。 [Implementation of the form]
Next, an embodiment of the present invention will be described with reference to FIG.
Figure 6 corresponds to Figure 5 of Reference Example 3 (b), the housing space S is a development view likened to rectangular. As shown in this figure, the EBG structure 36 is disposed so as to cross the side surfaces 111, 112, 113, 114 and the bottom surface 110 of the case main body 11 and the inner surface of the lid 12 in two directions. In the present embodiment, in addition to the currents in the current paths I1 and I2 (not shown in FIG. 6) shown in FIG. 5B, the lid 12, the side surface 112, the bottom surface 110, and the side surface 114 of the case body 11 are annularly formed. The current in the flowing current path I3 is also suppressed.

以上、本発明の筐体及び電子装置を上記の参考例及び実施の形態に基づいて説明したが、本発明は上記の参考例及び実施の形態に限定されるものではなく、その要旨を逸脱しない範囲で種々の態様において実施することが可能であり、例えば次に示すような変形も可能である。 While the housing and the electronic apparatus of the present invention is not limited to these reference examples and embodiments described above, the present invention is not limited to the above-mentioned reference examples and embodiment, without departing from the gist The present invention can be implemented in various modes within the scope, and for example, the following modifications are possible.

（１）上記各参考例及び実施の形態では、ケース１０を導電性材料からなるケース本体１１及び蓋１２からなる直方体状としたが、これに限らず、蓋１２を無くし、若しくは蓋１２を樹脂等の非導電性材料で形成してもよい。この場合には、ＥＢＧ構造体をケース本体１１の内面
に配置する。 (1) In each of the above reference examples and embodiments, the case 10 has a rectangular parallelepiped shape including the case main body 11 and the lid 12 made of a conductive material. However, the present invention is not limited to this, and the lid 12 is eliminated or the lid 12 is made of resin. You may form with nonelectroconductive materials, such as. In this case, the EBG structure is disposed on the inner surface of the case main body 11.

（２）電子回路２を収容するケースの形状は、直方体状に限らず、円筒状や他の多角柱である三角柱状、六角柱状あるいは、直方体の角を落とした形状でもよい。このような形状のケースでも、その共振周波数の電流の電流路にＥＢＧ構造体を配置することで、その電流を抑制することができる。 (2) The shape of the case that accommodates the electronic circuit 2 is not limited to a rectangular parallelepiped shape, but may be a cylindrical shape, a triangular prism shape that is another polygonal column, a hexagonal column shape, or a shape with a corner of the rectangular parallelepiped dropped. Even in such a case, the current can be suppressed by arranging the EBG structure in the current path of the current of the resonance frequency.

（３）ＥＢＧ構造体の具体的な構造としては、上記各参考例及び実施の形態のものに限らず、ケース１０固有の共振周波数の電流を抑制できる構造である限り、例えば特許文献１に記載された構造のものに置き換えてもよい。 (3) The specific structure of the EBG structure is not limited to that of each of the reference examples and embodiments described above, and is described in, for example, Patent Document 1 as long as the structure can suppress the current at the resonance frequency unique to the case 10. It may be replaced with one having the structure described above.

（４）電子回路２は、スペーサ４を介することなく、その裏面をケース本体１１の底面１１０に直接接触させて配置してもよい。 (4) The electronic circuit 2 may be arranged such that the back surface thereof is in direct contact with the bottom surface 110 of the case body 11 without the spacer 4 interposed therebetween.

（５）１つ、あるいは２つのＥＢＴ構造体を配置した参考例及び実施の形態に限らず、更にＥＢＴ構造体を加えてもよい。また、複数のＥＢＴ構造体を１つの帯状としてもよい。 (5) Not limited to the reference example and the embodiment in which one or two EBT structures are arranged, an EBT structure may be further added. Further, a plurality of EBT structures may be formed in one band shape.

１００・・・電子装置、２・・・電子回路、３・・・ＥＢＧ構造体、４・・・スペーサ、１・・・筐体、１０・・・ケース、１１・・・ケース本体、１１ａ・・・開口部、１２・・・蓋、２０・・・プリント基板、２０ａ・・・取付孔、２１・・・電子部品、２２・・・コネクタ、３１・・・誘電体、３２・・・金属メッシュ、３３・・・第１のＥＢＧ構造体、３４・・・第２のＥＢＧ構造体、３５・・・ＥＢＧ構造体、３６・・・ＥＢＧ構造体、５１・・・端子、５２・・・導線、１１０・・・底面、１１１，１１２，１１３，１１４・・・側面、３２０・・・金属小片、３２１ａ，３２１ｂ，３２１ｃ，３２１ｄ・・・接続片、３３０・・・金属小片、３３１ａ，３３１ｂ，３３１ｃ，３３１ｄ・・・接続片、３４０・・・金属小片、３４１ａ，３４１ｂ，３４１ｃ，３４１ｄ・・・接続片、Ｃ・・・キャパシタ、Ｉ１，Ｉ２，Ｉ３・・・電流路、Ｌ１，Ｌ２・・・インダクタ、ｍ，ｎ，ｑ・・・モード次数、Ｓ・・・収容空間 DESCRIPTION OF SYMBOLS 100 ... Electronic device, 2 ... Electronic circuit, 3 ... EBG structure, 4 ... Spacer, 1 ... Housing, 10 ... Case, 11 ... Case main body, 11a ..Opening portion, 12 ... lid, 20 ... printed circuit board, 20a ... mounting hole, 21 ... electronic component, 22 ... connector, 31 ... dielectric, 32 ... metal Mesh, 33 ... first EBG structure, 34 ... second EBG structure, 35 ... EBG structure, 36 ... EBG structure, 51 ... terminal, 52 ... Conductor wire 110 ... bottom surface 111,112,113,114 ... side surface 320 ... metal piece, 321a, 321b, 321c, 321d ... connection piece, 330 ... metal piece, 331a, 331b , 331c, 331d ... connection piece, 340 ... metal piece, 3 1a, 341b, 341c, 341d ... connection piece, C ... capacitor, I1, I2, I3 ... current path, L1, L2 ... inductor, m, n, q ... mode order, S ... Containment space

Claims (2)

電子回路を内部空間に収容する導電性材料の収容部と、
前記電子回路の動作により前記収容部に流れる電流の電流路に設けられ、前記収容部の共振周波数を有する電流を抑制する抑制部材とを備え、
前記抑制部材は、前記収容部の内面に互い交差して連続して一周するように帯状に配置された一対の抑制部材である電子回路を収容する容器。 An accommodating portion of a conductive material that accommodates an electronic circuit in the internal space;
A suppression member that is provided in a current path of a current flowing through the housing portion by the operation of the electronic circuit and suppresses a current having a resonance frequency of the housing portion ;
The said suppression member is a container which accommodates the electronic circuit which is a pair of suppression member arrange | positioned so that it may mutually cross | intersect the inner surface of the said accommodating part, and may make a round . 電子回路と、
前記電子回路を内部空間に収容する導電性材料の収容部と、
前記電子回路の動作により前記収容部に流れる電流の電流路に設けられ、前記収容部の共振周波数を有する電流を抑制する抑制部材とを備え、
前記抑制部材は、前記収容部の内面に互い交差して連続して一周するように帯状に配置された一対の抑制部材である電子装置。 Electronic circuit,
A housing portion of a conductive material for housing the electronic circuit in an internal space;
A suppression member that is provided in a current path of a current flowing through the housing portion by the operation of the electronic circuit and suppresses a current having a resonance frequency of the housing portion ;
The suppression device is an electronic device that is a pair of suppression members that are arranged in a belt shape so as to continuously cross the inner surface of the housing portion .
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