JP5566258B2 - Solar cell module and manufacturing apparatus thereof - Google Patents
Solar cell module and manufacturing apparatus thereof Download PDFInfo
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- JP5566258B2 JP5566258B2 JP2010243031A JP2010243031A JP5566258B2 JP 5566258 B2 JP5566258 B2 JP 5566258B2 JP 2010243031 A JP2010243031 A JP 2010243031A JP 2010243031 A JP2010243031 A JP 2010243031A JP 5566258 B2 JP5566258 B2 JP 5566258B2
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Description
本発明は太陽電池モジュール及びその製造装置に関する。 The present invention relates to a solar cell module and an apparatus for manufacturing the same.
太陽電池モジュールは、単結晶シリコン基板や多結晶シリコン基板に電極を備えた複数の太陽電池素子を配線材で接続することにより構成されている。配線材としては、一般に銅箔等の母材を半田で被覆したものが用いられる。このような配線材同士の半田付けの方法としては、配線材同士の重ね合わせ部を半田こてで押圧することによって行われている（例えば、特許文献１参照）。 The solar cell module is configured by connecting a plurality of solar cell elements each provided with an electrode to a single crystal silicon substrate or a polycrystalline silicon substrate with a wiring material. As the wiring material, a material in which a base material such as a copper foil is coated with solder is generally used. As a method of soldering such wiring materials, it is performed by pressing the overlapping part of wiring materials with a soldering iron (for example, refer patent document 1).
ところで半田付けにおいては、母材である金属と半田層との間に形成される金属間化合物層の厚みで、接合強度が左右される。金属間化合物層とは、例えば母材にＣｕを、半田層にＳｎ−Ｐｂを用いた場合、その接合面で加熱時にＳｎとＣｕの相互の拡散により形成された化合物層であり、ε層のＣｕ３Ｓｎやη層のＣｕ６Ｓｎ５などが知られている。このような金属間化合物層の形成は、半田付けの温度と、配線材の表面を被覆する半田のぬれ性との関係が重要である。 Incidentally, in soldering, the bonding strength depends on the thickness of the intermetallic compound layer formed between the base metal and the solder layer. The intermetallic compound layer is, for example, a compound layer formed by mutual diffusion of Sn and Cu when heated at the joint surface when Cu is used for the base material and Sn—Pb is used for the solder layer. Cu 3 Sn, η layer Cu 6 Sn 5 and the like are known. In forming such an intermetallic compound layer, the relationship between the soldering temperature and the wettability of the solder covering the surface of the wiring material is important.
しかし、特許文献１に開示されている半田付け方法では、半田の厚さの管理のみに着目され、配線材の重ね合わせ部の形状や変形の具合によって熱伝導が変わることにより、接合具合が変わってしまうことまで管理することが容易ではない。 However, in the soldering method disclosed in Patent Document 1, attention is paid only to the management of the thickness of the solder, and the heat transfer changes depending on the shape of the overlapping portion of the wiring material and the degree of deformation. It's not easy to manage everything.
本発明はこのような問題点に鑑みてなされたものであり、太陽電池モジュールにおける複数の配線材同士を半田付けする太陽電池モジュールの製造装置であって、前記複数の配線材の一部を重ね合わせた重ね合わせ部の上面および下面を挟持する上面当接部と下面当接部を有する挟持手段と、前記重ね合わせ部を加熱する加熱手段とを備え、前記上面当接部および前記下面当接部の少なくとも一方が複数の棒状部材であり、前記加熱手段は、発熱体と、該発熱体からの熱を前記重ね合わせ部に伝えるこて先とを有しており、前記重ね合わせ部は前記こて先と前記複数の棒状部材とで挟持される。
The present invention has been made in view of such problems, and is a solar cell module manufacturing apparatus for soldering a plurality of wiring members in a solar cell module, and a part of the plurality of wiring members is overlapped. The upper surface abutting portion and the lower surface abutting portion, comprising: an upper surface abutting portion for sandwiching the upper surface and the lower surface of the combined overlapping portion; a sandwiching means having a lower surface abutting portion; and a heating means for heating the overlapping portion. at least one of the plurality of bar-like members der parts is, the heating means includes a heating element, and the heat from the heat generating body and a tip for transmitting to said overlapping portions, the overlapping portions are Ru is sandwiched between said plurality of bar-like member and the tip.
さらに本発明の太陽電池モジュールは、前記太陽電池モジュールの製造装置を用いて配線材同士を接合したものである。 Furthermore, the solar cell module of this invention joins wiring materials using the manufacturing apparatus of the said solar cell module.
本発明の太陽電池モジュールの製造装置によれば、少なくとも一方側から棒状部材によって重ね合わせ部を挟持する状態となるので、配線材の重ね合わせ部の面が凹凸に歪んでいても密着した状態で接合することが容易となる。したがって、接合に際して良好に熱を伝達することが可能である。 According to the solar cell module manufacturing apparatus of the present invention, since the overlapping portion is sandwiched by the rod-shaped member from at least one side, the surface of the overlapping portion of the wiring material is in close contact with the uneven surface. It becomes easy to join. Therefore, it is possible to transfer heat well during bonding.
さらに、配線材の重ね合わせ部から熱がヒートシンクしていくことを低減できるので、加熱不足による半田付け不良が低減される。すなわち、放熱の経路を削減して温度管理の精度を向上でき、適切な厚さの金属間化合物層を形成して半田付け部の接合強度の信頼性を高めることができる。 Furthermore, since it is possible to reduce the heat sinking from the overlapping portion of the wiring material, soldering failure due to insufficient heating is reduced. That is, it is possible to improve the temperature management accuracy by reducing the heat dissipation path, and to form an intermetallic compound layer having an appropriate thickness to increase the reliability of the bonding strength of the soldered portion.
さらに、外気温の変化に対して、フラックスの蒸発および半田のぬれ性を安定化し、半田付け部の剥離等を低減することができる。 Furthermore, it is possible to stabilize the evaporation of the flux and the wettability of the solder against changes in the outside air temperature, and to reduce the peeling of the soldered portion.
まず本発明の太陽電池モジュールの製造装置を用いて製造される太陽電池モジュール１の基本的な構造について説明する。 First, the basic structure of the solar cell module 1 manufactured using the solar cell module manufacturing apparatus of the present invention will be described.
太陽電池モジュール１は、図１に示すように、複数の太陽電池素子２が配線材３で電気的に接続された集合体を有している。そして、この集合体は、透光性基板４と、太陽電池素子２の裏面を保護する裏面保護材５との間に、充填材６で封入された状態で配置され、太陽電池モジュール１が構成される。太陽電池モジュール１はまた、裏面保護材５の太陽電池素子２とは反対側である裏面側に端子ボックス７が配置されている。 As shown in FIG. 1, the solar cell module 1 has an assembly in which a plurality of solar cell elements 2 are electrically connected by a wiring material 3. And this aggregate | assembly is arrange | positioned in the state enclosed with the filler 6 between the translucent board | substrate 4 and the back surface protection material 5 which protects the back surface of the solar cell element 2, and the solar cell module 1 comprises Is done. In the solar cell module 1, a terminal box 7 is disposed on the back surface side opposite to the solar cell element 2 of the back surface protection material 5.
太陽電池素子２は、光電変換の機能を有するものであり、例えば、単結晶シリコン、多結晶シリコン、アモルファスシリコン等の薄膜、ＣＩＧＳ、ＣｄＴｅ等の材料で形成されている。例えば、太陽電池素子２を単結晶シリコンや多結晶シリコンで形成する場合、１５ｃｍ角程度の大きさにしたシリコン基板の表面及び裏面に電極を形成する。そして、これらのシリコン基板を略一直線上に配列し、隣接する一方のシリコン基板の表面の電極と、他方のシリコン基板の裏面の電極とが、配線材３を用いて電気的に接続されている。 The solar cell element 2 has a photoelectric conversion function, and is formed of, for example, a thin film such as single crystal silicon, polycrystalline silicon, or amorphous silicon, or a material such as CIGS or CdTe. For example, when the solar cell element 2 is formed of single crystal silicon or polycrystalline silicon, electrodes are formed on the front and back surfaces of a silicon substrate having a size of about 15 cm square. These silicon substrates are arranged in a substantially straight line, and the electrode on the surface of one adjacent silicon substrate and the electrode on the back surface of the other silicon substrate are electrically connected using the wiring material 3. .
配線材３は、例えば、銅箔等の母材３ａを半田被覆層３ｂで被覆して形成される。 The wiring member 3 is formed, for example, by covering a base material 3a such as a copper foil with a solder coating layer 3b.
透光性基板４は、太陽電池素子２へ光を入射させることができる部材であれば特に限定されない。例えば、白板ガラス、強化ガラス、熱線反射ガラスなどのガラスやポリカーボネート樹脂などからなる光透過率の高い基板が用いられる具体的には、例えば厚さ３ｍｍ〜５ｍｍ程度の白板強化ガラス、厚さ５ｍｍ程度の合成樹脂基板（ポリカーボネート樹脂などからなる）などが用いられる。 The translucent substrate 4 is not particularly limited as long as it is a member that allows light to enter the solar cell element 2. For example, a substrate having high light transmittance made of glass such as white plate glass, tempered glass, heat ray reflective glass or polycarbonate resin is used. Specifically, for example, white plate tempered glass having a thickness of about 3 mm to 5 mm, thickness of about 5 mm. A synthetic resin substrate (made of polycarbonate resin or the like) is used.
裏面保護材５は、充填材６や太陽電池素子２を保護する機能を有し、例えば、ＰＶＦ（ポリビニルフルオライド）、ＰＥＴ（ポリエチレンテレフタレート）ＰＥＮ（ポリエチレンナフタレート）、或いはこれらを積層したものを用いることができる。 The back surface protective material 5 has a function of protecting the filler 6 and the solar cell element 2, for example, PVF (polyvinyl fluoride), PET (polyethylene terephthalate) PEN (polyethylene naphthalate), or a laminate of these. Can be used.
充填材６は、太陽電池素子２を封止する機能を有し、例えば、熱硬化性樹脂もしくは、熱可塑性樹脂に架橋剤を含有して熱硬化の特性を持たせた樹脂などが挙げられる。熱硬化性樹脂としては、例えば、エチレン酢酸ビニル共重合体（ＥＶＡ）、ポリビニルブチラール（ＰＶＢ）、アクリル樹脂、シリコーン樹脂、エポキシ樹脂やＥＥＡ（エチレン−アクリル酸エチル共重合体）などが挙げられる。架橋剤としては、例えば、７０〜１８０℃の温度で分解してラジカルを発生する有機過酸化物を用いることができる。有機過酸化物としては、例えば、２、５−ジメチル−２、５−ビス（ｔ−ブチルパーオキシ）ヘキサンやｔｅｒｔ−ヘキシルパーオキシピバレートなどが挙げられ、ＥＶＡ１００質量部に対し１質量部程度の割合で含有させることが好ましい。充填剤は、例えば、熱硬化性樹脂を主成分とし、厚さ０．４〜１ｍｍ程度のシート状に成形されたものを所定の寸法に切断して用いられる。 The filler 6 has a function of sealing the solar cell element 2, and examples thereof include a thermosetting resin or a resin containing a thermosetting property by containing a crosslinking agent in a thermoplastic resin. Examples of the thermosetting resin include ethylene vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), acrylic resin, silicone resin, epoxy resin and EEA (ethylene-ethyl acrylate copolymer). As a crosslinking agent, the organic peroxide which decomposes | disassembles at the temperature of 70-180 degreeC and generate | occur | produces a radical can be used, for example. Examples of the organic peroxide include 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane and tert-hexylperoxypivalate, and about 1 part by mass with respect to 100 parts by mass of EVA. It is preferable to make it contain in the ratio. The filler is, for example, used by cutting a sheet having a thermosetting resin as a main component and having a thickness of about 0.4 to 1 mm into a predetermined dimension.
（太陽電池モジュールの製造装置）
本発明の一実施形態に係る太陽電池モジュールの製造装置は、太陽電池モジュールにおける複数の配線材同士を半田付けする太陽電池モジュールの製造装置であって、複数の配線材の一部を重ね合わせた重ね合わせ部の上面および下面を挟持する上面当接部と下面当接部を有する挟持手段と、重ね合わせ部を加熱する加熱手段とを備え、前記上面当接部および前記下面当接部の少なくとも一方が複数の棒状部材である。
(Solar cell module manufacturing equipment)
A solar cell module manufacturing apparatus according to an embodiment of the present invention is a solar cell module manufacturing apparatus that solders a plurality of wiring members in a solar cell module, and a part of the plurality of wiring members is overlapped. An upper surface abutting portion for sandwiching the upper surface and the lower surface of the overlapping portion; a sandwiching means having a lower surface abutting portion; and a heating means for heating the overlapping portion, wherein at least the upper surface abutting portion and the lower surface abutting portion One is a plurality of rod-shaped members.
これにより、少なくとも一方側から棒状部材によって重ね合わせ部を挟持する状態となるので、配線材の重ね合わせ部の面が凹凸に歪んでいても密着した状態で接合することが容易となる。よって、このような棒状部材は、このような重ね合わせ部の凹凸に対して均一に接することが出来るように、特定の圧力で突き出し長が短くなる構造であることが好ましい。すなわち、凹部に対しては長く突き出て当接し、凸部に対しては短く引っ込んで当接する構造である。このような構造は棒状部材の一端を弾性部材の伸縮方向に合わせて取り付けるなどすればよい。 Accordingly, since the overlapping portion is sandwiched by the rod-shaped member from at least one side, it is easy to join the wiring member in a closely contacted state even when the surface of the overlapping portion of the wiring material is distorted to be uneven. Therefore, it is preferable that such a rod-shaped member has a structure in which the protruding length is shortened by a specific pressure so that the rod-shaped member can be in uniform contact with the unevenness of the overlapping portion. That is, it has a structure in which it protrudes long and comes into contact with the concave portion and comes into short contact with the convex portion. In such a structure, one end of the rod-shaped member may be attached in accordance with the expansion / contraction direction of the elastic member.
以下に、本発明に係る太陽電池モジュールの製造装置の第１の実施形態および第２の実施形態を示す。 Below, 1st Embodiment and 2nd Embodiment of the manufacturing apparatus of the solar cell module concerning this invention are shown.
＜第１の実施形態＞
本発明の第１の実施形態に係る太陽電池モジュールの製造装置１０は、発熱体１１とこて先１２よりなる加熱手段（半田こて）１３と、挟持手段とを備える。本実施形態においては、挟持手段としてこて先１２と棒状部材１５が採用されている。すなわちこて先１２が配線材３同士の重ね合わせ部の上面と当接する上面当接部に相当し、棒状部材１５が重ね合わせ部の下面と当接する下面当接部に相当する。棒状部材１５は、こて先１２の当接部１２ｂに対向したベース面１４から出入り可能に配設されている。太陽電池モジュールの製造装置１０で、半田で被覆した配線材３同士の半田付けを行う。
<First Embodiment>
The solar cell module manufacturing apparatus 10 according to the first embodiment of the present invention includes a heating means (soldering iron) 13 including a heating element 11 and a tip 12, and a clamping means. In this embodiment, the tip 12 and the rod-shaped member 15 are employ | adopted as a clamping means. That is, the tip 12 corresponds to the upper surface contact portion that contacts the upper surface of the overlapping portion of the wiring members 3, and the bar-shaped member 15 corresponds to the lower surface contact portion that contacts the lower surface of the overlapping portion. The rod-shaped member 15 is disposed so as to be able to enter and exit from the base surface 14 facing the contact portion 12 b of the tip 12. The solar cell module manufacturing apparatus 10 solders the wiring members 3 covered with solder.
配線材の重ね合わせ部３は、例えば太陽電池モジュールの製造装置のベース面１４と半田こて１３との間に配置する。 The wiring material overlapping portion 3 is disposed, for example, between the base surface 14 and the soldering iron 13 of the solar cell module manufacturing apparatus.
上下動可能な複数の棒状部材１５は、重ね合わせ部３の上側または下側に配設されたものであり、上下動して重ね合わせ部３に最小面積で当接する。複数の棒状部材１５が重ね合わせ部３に当接して、この重ね合わせ部３を挟持する状態となれば、配線材３が密着して接合し易くなる。また、重ね合わせ部３から棒状部材１５へのヒートシンクを低減できるので、加熱不足による半田付け不良が低減される。例えば下側に配設された下側棒状部材１５ｂであれば、半田こて１３と下側棒状部材１５ｂとで挟持することになる。 The plurality of rod-like members 15 that can move up and down are disposed on the upper side or the lower side of the overlapping portion 3 and move up and down to contact the overlapping portion 3 with a minimum area. If the plurality of rod-shaped members 15 come into contact with the overlapping portion 3 and sandwich the overlapping portion 3, the wiring members 3 are in close contact and easily joined. Further, since the heat sink from the overlapping portion 3 to the rod-like member 15 can be reduced, poor soldering due to insufficient heating is reduced. For example, in the case of the lower bar-like member 15b disposed on the lower side, the soldering iron 13 and the lower bar-like member 15b are sandwiched.
発熱体１１には例えば、電熱式のセラミックヒーターやニクロム線ヒーターを用いることができ、こて先１２は、この発熱体１１と接して熱量を供給される基体部１２ａと、基体部１２ａの一部を盛り上げて形成した当接部１２ｂを有する。 For example, an electrothermal ceramic heater or a nichrome wire heater can be used as the heating element 11, and the tip 12 is in contact with the heating element 11 and supplied with an amount of heat, and a base part 12a. The contact portion 12b is formed by raising the portion.
図３に示すように、半田付けの信頼性を高めるための重要な点は、銅箔など金属である母材３ａと半田層８との間に、適切な厚みの金属間化合物層９を形成することである。例えば、母材３ａに銅（Ｃｕ）、半田層８に半田（Ｓｎ−Ｐｂ）を用いて半田付けする場合、銅と半田の界面に３〜９μmの金属間化合物層９を形成することで、強固で信頼性の高い半田付けができることが知られている。そのためには、こて先１２に半田付けで使用されるフラックスが焼き付かないようにしつつ、活性化する温度に保つとともに、配線材３を半田の濡れ性が高まる温度まで加温して、接合時に母材３ａと半田が濡れる状態とすることが重要である。なお、半田の溶融温度はＳｎ−Ａｇでは２２１℃、Ｓｎ−Ｐｂで１８３℃であり、実用上はタクトタイムを短縮する観点から、半田の溶融温度よりも５０℃〜１００℃高い温度で半田付けを行うことが好ましい。またフラックスは約７５℃から活性を呈し始めて、３００℃でフラックスの主成分であるアビエチン酸が不活性なネオアビエチン酸に変質してフラックスの効果を失う。このことから、例えば半田がＳｎ−Ａｇの場合、半田およびフラックスがＳｎ−Ａｇ系半田の溶融温度、すなわち２７１℃〜３００℃に加温されるようにこて先１２の温度を調整することが必要になる。 As shown in FIG. 3, an important point for improving the reliability of soldering is to form an intermetallic compound layer 9 having an appropriate thickness between a base material 3a which is a metal such as a copper foil and a solder layer 8. It is to be. For example, when soldering using copper (Cu) as the base material 3a and solder (Sn—Pb) as the solder layer 8, by forming an intermetallic compound layer 9 of 3 to 9 μm at the interface between copper and solder, It is known that strong and reliable soldering can be performed. For this purpose, the soldering flux is prevented from being burned onto the tip 12 while being kept at an activation temperature and the wiring material 3 is heated to a temperature at which the solder wettability is increased. Sometimes it is important that the base material 3a and the solder get wet. The melting temperature of the solder is 221 ° C. for Sn-Ag and 183 ° C. for Sn—Pb. From the viewpoint of shortening the tact time in practice, soldering is performed at a temperature 50 ° C. to 100 ° C. higher than the melting temperature of the solder. It is preferable to carry out. The flux begins to exhibit activity at about 75 ° C., and at 300 ° C., the abietic acid, which is the main component of the flux, is transformed into inactive neoabietic acid and loses the effect of the flux. From this, for example, when the solder is Sn-Ag, the temperature of the tip 12 can be adjusted so that the solder and flux are heated to the melting temperature of the Sn-Ag solder, that is, 271 ° C to 300 ° C. I need it.
太陽電池モジュール１の量産において、こて先１２は短い間隔で繰り返し半田付けを行うことから、半田付けにより失った熱量を短時間で発熱体１１から受ける必要があり、本発明の第1の実施形態に係る太陽電池モジュールの製造装置の一部を構成するこて先１２では、当接部１２ｂは基体部１２ａの一部を盛り上げて形成したことから、こて先１２の熱容量が大きく、蓄積できる熱量が大きい。これにより複数回の半田付けを連続して行っても、一回毎のこて先１２の温度低下を小さくして、こて先１２の温度の振れ幅を小さくし、温度の精度を高めることができる。こて先１２には、ＳＵＳや銅などの金属や酸化アルミニウムなどのセラミックス、金属の表面をセラミックスで被覆したものなどを用いることができる。 In mass production of the solar cell module 1, since the tip 12 is repeatedly soldered at a short interval, it is necessary to receive the amount of heat lost by the soldering from the heating element 11 in a short time. In the tip 12 that constitutes a part of the solar cell module manufacturing apparatus according to the embodiment, the contact portion 12b is formed by raising a part of the base portion 12a, so that the heat capacity of the tip 12 is large and accumulated. The amount of heat that can be generated is large. As a result, even if soldering is performed a plurality of times continuously, the temperature drop of the tip 12 is reduced every time, the temperature fluctuation of the tip 12 is reduced, and the temperature accuracy is increased. Can do. The tip 12 may be a metal such as SUS or copper, a ceramic such as aluminum oxide, or a metal whose surface is coated with ceramic.
棒状部材１５は図２に示すように、ベース面１４より出入り可能な機構を有し、棒状部材１５の先はこて先１２の当接部１２ｂと対向して配置され、この棒状部材１５が配線材３をベース面１４から持ち上げて当接部１２ｂに押し付けて、配線材３が棒状部材１５と当接部１２ｂのみに接触した状態で、半田付けをするものである。さらに棒状部材１５からの放熱を低減するために、棒状部材１５に加熱装置を設けて予熱を行っても良い。棒状部材の材質、形状は、φ０．５ｍｍ〜２ｍｍのステンレス鋼や銅などの金属や、酸化アルミニウムなどのセラミックス、または金属の表面をセラミックスで被覆したものなどを用いることができる。なお、棒状部材１５の本数は配線材３を最小の接触面積で持ち上げることができればよく、３本以上が好ましい。このような棒状部材１５により配線材３の接合部２０に点状の凹凸を形成することができる。 As shown in FIG. 2, the rod-shaped member 15 has a mechanism capable of entering and exiting from the base surface 14, and the tip of the rod-shaped member 15 is disposed to face the contact portion 12 b of the tip 12. The wiring member 3 is lifted from the base surface 14 and pressed against the contact portion 12b, and soldering is performed in a state where the wiring member 3 is in contact with only the rod-shaped member 15 and the contact portion 12b. Further, in order to reduce heat radiation from the rod-shaped member 15, a heating device may be provided on the rod-shaped member 15 to perform preheating. As the material and shape of the rod-shaped member, a metal such as stainless steel or copper having a diameter of 0.5 mm to 2 mm, a ceramic such as aluminum oxide, or a metal whose surface is coated with ceramic can be used. In addition, the number of the rod-shaped members 15 should just be able to lift the wiring material 3 with the minimum contact area, and 3 or more are preferable. With such a rod-like member 15, dot-like irregularities can be formed in the joint portion 20 of the wiring member 3.
これによりベース面１４への放熱、すなわちヒートシンクを低減し、外気温の変化によるベース面１４の温度の上下に左右されず半田付けを行うことができ、複数の半田付け箇所で均一な金属間化合物層９を形成して、半田付けの品質を一定に保ち信頼性を高めることができる。 As a result, heat dissipation to the base surface 14, that is, a heat sink, can be reduced, and soldering can be performed without being influenced by the temperature of the base surface 14 due to changes in the outside air temperature. The layer 9 can be formed to keep the soldering quality constant and improve the reliability.
さらに本実施形態に係る太陽電池モジュールの製造装置は、前記こて先は、さらに前記上面当接部と前記ベース面との間隔を規定するスペーサー部を有しているとともに、前記スペーサー部と前記ベース面とが当接することで前記間隔を規定している。 Furthermore, in the solar cell module manufacturing apparatus according to the present embodiment, the tip further includes a spacer portion that defines a distance between the upper surface contact portion and the base surface, and the spacer portion and the The said space | interval is prescribed | regulated by abutting with a base surface.
以下、本実施形態に係る太陽電池モジュールの製造装置１０について、図４を用いて説明する。図４の実施形態では、当接部１２ｂの当接面と棒状部材１５の先との距離を規定するスペーサー部１６を当接部１２ｂの周囲に配置した点で図２の実施形態と相違する。 Hereinafter, the manufacturing apparatus 10 of the solar cell module which concerns on this embodiment is demonstrated using FIG. The embodiment of FIG. 4 is different from the embodiment of FIG. 2 in that a spacer portion 16 that defines the distance between the contact surface of the contact portion 12b and the tip of the rod-like member 15 is disposed around the contact portion 12b. .
スペーサー部１６は例えば、こて先１２の基体部１２ａの一部を盛り上げて形成され、基体部１２ａからのスペーサー部１６の高さは、配線材３の間の半田層８が１０〜３００μｍとなるようにすることが好ましい。スペーサー部１６とベース面１４とが衝合することですることにより、配線材３を当接部１２ｂと棒状部材１５の間で押圧した際に、半田層８が全てはみ出して母材３ａ同士が直接接触し、半田付けの接合強度が不足するのを低減することができる。なお図４では、基体部１２ａの一部を盛り上げたスペーサー部１６を示したが、当接部１２ｂの当接面と棒状部材１５の先との距離を規定できればよく、別体であってもよい。 The spacer portion 16 is formed, for example, by raising a part of the base portion 12a of the tip 12, and the height of the spacer portion 16 from the base portion 12a is 10 to 300 μm in the solder layer 8 between the wiring members 3. It is preferable to do so. Since the spacer portion 16 and the base surface 14 collide with each other, when the wiring member 3 is pressed between the contact portion 12b and the rod-like member 15, the solder layer 8 is completely protruded and the base materials 3a are It is possible to reduce direct contact and insufficient soldering joint strength. In FIG. 4, the spacer portion 16 is shown in which a part of the base portion 12 a is raised. However, the distance between the contact surface of the contact portion 12 b and the tip of the rod-shaped member 15 may be defined. Good.
さらに本実施形態に係る太陽電池モジュールの製造装置は、当接部と摺動する研磨面を有した研磨治具を備えたことが好ましい。以下、本実施形態に係る太陽電池モジュール１の製造装置１０について、図５を用いて説明する。本実施形態に係る太陽電池モジュールの製造装置は、当接部１２ｂの表面に付着した半田を削剥する研磨治具１７を備えている。 Furthermore, the solar cell module manufacturing apparatus according to the present embodiment preferably includes a polishing jig having a polishing surface that slides with the contact portion. Hereinafter, the manufacturing apparatus 10 of the solar cell module 1 according to the present embodiment will be described with reference to FIG. The solar cell module manufacturing apparatus according to the present embodiment includes a polishing jig 17 for scraping off the solder attached to the surface of the contact portion 12b.
本実施形態に係る太陽電池モジュールの製造装置は、繰り返し配線材３の半田付けを行うことで、当接部１２ｂにフラックスの残渣が焼き付き酸化被膜１８を生じる。この酸化被膜１８を生じた当接部１２ｂは、半田との濡れ性が悪くなり、真実接触面積が小さくなることから、こて先１２から配線材３への十分な熱量の供給ができなくなり、半田不良を生じやすくなる。そこで図５に示すような、当接部１２ｂの表面と摺動する研磨治具１７で、当接部１２ｂ表面の酸化被膜１８を清掃するとよい。 The apparatus for manufacturing a solar cell module according to the present embodiment repeatedly solders the wiring member 3 so that the residue of the flux is baked on the contact portion 12b to form the oxide film 18. The contact portion 12b on which the oxide film 18 is formed has poor wettability with the solder, and the actual contact area is reduced, so that a sufficient amount of heat cannot be supplied from the tip 12 to the wiring member 3, Solder defects are likely to occur. Therefore, the oxide film 18 on the surface of the contact portion 12b may be cleaned with a polishing jig 17 that slides on the surface of the contact portion 12b as shown in FIG.
さらに本実施形態に係る太陽電池モジュールの製造装置は、研磨治具は偏心して回転することで当接部と摺動することが好ましい。 Furthermore, in the solar cell module manufacturing apparatus according to this embodiment, it is preferable that the polishing jig slide with the contact portion by rotating eccentrically.
研磨治具１７を回動可能とするとともに、回転を偏心させることで、研磨面１７ａの全体を利用して、当接部１２ｂの酸化被膜１８を清掃することができ、適切な厚さの金属間化合物層９の形成し、半田接合強度の信頼性を高めることができる。研磨治具１７は、酸化アルミニウムなどのセラミックスや、金属の表面をセラミックスで被覆したものなどを用いることができる。 By making the polishing jig 17 rotatable and decentering the rotation, the oxide film 18 of the contact portion 12b can be cleaned using the entire polishing surface 17a, and a metal having an appropriate thickness can be obtained. Formation of the intermetallic compound layer 9 can increase the reliability of the solder joint strength. As the polishing jig 17, ceramics such as aluminum oxide, or a metal surface coated with ceramics can be used.
さらに本実施形態に係る太陽電池モジュールの製造装置は、研研磨面は凹凸面であることが好ましい。 Furthermore, in the solar cell module manufacturing apparatus according to this embodiment, the polished surface is preferably an uneven surface.
研磨治具１７が凹凸を持つ研磨面１７ａを備えることにより、こて先１２の表面に残留している半田の酸化被膜１８をスムースに削除することができる。 By providing the polishing surface 17a with unevenness on the polishing jig 17, the solder oxide film 18 remaining on the surface of the tip 12 can be removed smoothly.
そして、本発明の一実施形態に係る太陽電池モジュールは、太陽電池モジュールの製造装置を用いて配線材同士を接合したものである。 And the solar cell module which concerns on one Embodiment of this invention joins wiring materials using the manufacturing apparatus of a solar cell module.
これにより、適切な厚さの金属間化合物層９を形成して、当接部１２ｂにおける接合強度の信頼性を高めた太陽電池モジュール１を得ることができる。 Thereby, the solar cell module 1 which formed the intermetallic compound layer 9 of appropriate thickness and improved the reliability of the joining strength in the contact part 12b can be obtained.
なお、本実施形態に係る太陽電池モジュールの製造装置は、他にも例えば、ガラスパッケージ構造や、サブストレート構造の太陽電池モジュールにも利用可能である。 In addition, the manufacturing apparatus of the solar cell module according to the present embodiment can be used for, for example, a solar cell module having a glass package structure or a substrate structure.
＜第２の実施形態＞
本発明の第２の実施形態に係る太陽電池モジュールの製造装置は、前記加熱手段は、発熱体と、該発熱体を備えた筒状部材の端部から加熱した気体を噴出するガス噴出機構とを備えている。
<Second Embodiment>
In the solar cell module manufacturing apparatus according to the second embodiment of the present invention, the heating means includes a heating element and a gas ejection mechanism that ejects heated gas from an end of a cylindrical member provided with the heating element. It has.
ここで、図６のように筒状部材２１ａとともに上側棒状部材１５ａを上下させる場合と、図７のように上側棒状部材１５ａだけ上下させる場合とがある。 Here, there are a case where the upper bar member 15a is moved up and down together with the cylindrical member 21a as shown in FIG. 6, and a case where the upper bar member 15a is moved up and down as shown in FIG.
配線材の重ね合わせ部３は、例えば太陽電池モジュールの製造装置のベース面１４とガス噴出機構２１との間に配置されている。 The wiring material overlapping portion 3 is disposed, for example, between the base surface 14 of the solar cell module manufacturing apparatus and the gas ejection mechanism 21.
上下動可能な複数の棒状部材１５は、重ね合わせ部３の上側および下側に配設されたものであり、上下動して重ね合わせ部３に最小面積で当接する。例えば上側に配設された上側棒状部材１５ａと下側に配設された下側棒状部材１５ｂで挟持することになる。 The plurality of bar-like members 15 that can move up and down are arranged on the upper side and the lower side of the overlapping portion 3 and move up and down to contact the overlapping portion 3 with a minimum area. For example, the upper bar-shaped member 15a disposed on the upper side and the lower bar-shaped member 15b disposed on the lower side are sandwiched.
このように複数の棒状部材１５が重ね合わせ部３に当接して、この重ね合わせ部３を挟持する状態となれば、密着した接合が可能となる。また、重ね合わせ部３から棒状部材１５へのヒートシンクを低減できるので、加熱不足による半田付け不良が低減される。 Thus, if the several rod-shaped member 15 contact | abuts on the superimposition part 3 and will be in the state which clamps this superimposition part 3, close_contact | adherence joining will be attained. Further, since the heat sink from the overlapping portion 3 to the rod-like member 15 can be reduced, poor soldering due to insufficient heating is reduced.
外気温の変化により半田こて１３および重ね合わせ部３からの放熱量を一定に管理でき、フラックスの蒸発を安定化し、配線材３同士の剥離等を低減することが出来る。例えば図６、７では、発熱体２２を筒状部材２１ａに内蔵しており、この発熱体２２を通り端部２１ｂから加熱された気体が噴出するようにしたガス噴出機構２１が示されている。 The amount of heat dissipated from the soldering iron 13 and the overlapping portion 3 can be controlled to be constant according to the change in the outside temperature, the evaporation of the flux can be stabilized, and the peeling of the wiring members 3 can be reduced. For example, FIGS. 6 and 7 show a gas ejection mechanism 21 in which a heating element 22 is built in a cylindrical member 21a and heated gas is ejected from the end 21b through the heating element 22. .
本実施形態に係る太陽電池モジュールの製造装置は、前記上面当接部および前記下面当接部は、それぞれ前記複数の棒状部材である。 In the solar cell module manufacturing apparatus according to this embodiment, the upper surface contact portion and the lower surface contact portion are the plurality of rod-shaped members, respectively.
本実施形態に係る太陽電池モジュールの製造装置は、前記ガス噴出機構の筒状部材は、前記重ね合わせ部の加熱位置を囲む。 In the solar cell module manufacturing apparatus according to this embodiment, the cylindrical member of the gas ejection mechanism surrounds the heating position of the overlapping portion.
例えば特に、図６（ｂ）の場合であれば、加熱位置を筒状部材２１ａで囲んだ状態で、加熱した気体（窒素や不活性ガス）を噴出できるため、空気中の酸素や水分を筒状部材２１ａから外へ追い出すことができ、重ね合わせ部３の半田接合における半田の酸化を低減することができる点で好ましい。 For example, particularly in the case of FIG. 6B, heated gas (nitrogen or inert gas) can be ejected with the heating position surrounded by the cylindrical member 21a. This is preferable in that it can be driven out of the member 21a and the oxidation of the solder in the solder joint of the overlapping portion 3 can be reduced.
本実施形態に係る太陽電池モジュールの製造装置は、複数の棒状部材はそれぞれ筒状部材の端部から出入りする。 In the solar cell module manufacturing apparatus according to this embodiment, the plurality of rod-shaped members enter and exit from the ends of the cylindrical members.
これにより、加熱位置の直上から加熱された気体で重ね合わせ部３を直接加熱しつつ、棒状部材１５自体も気体で加熱されるので、加熱位置から棒状部材１５にヒートシンクすることが可能となる。 Accordingly, the bar-shaped member 15 itself is also heated with the gas while directly heating the overlapping portion 3 with the gas heated from directly above the heating position, so that it is possible to heat-sink the bar-shaped member 15 from the heating position.
さらに本実施形態によれば、複数の棒状部材は、重ね合わせ部の上面に当接する部分の長さが短い複数の上側棒状部材と、配線材の被加熱部以外に当接する長さが長い複数の上側棒状部材と、ガス噴出機構の端部に対向するベース面から出入り可能に配設される複数の下側棒状部材とを備えるとともに、重ね合わせ部を上側棒状部材と下側棒状部材とで挟持する。 Furthermore, according to the present embodiment, the plurality of bar-shaped members are a plurality of upper bar-shaped members having a short length of the portion that abuts on the upper surface of the overlapping portion, and a plurality of lengths of the abutting portions other than the heated portion of the wiring member. And a plurality of lower bar members arranged so as to be able to enter and exit from the base surface facing the end of the gas ejection mechanism, and the overlapping portion is composed of the upper bar member and the lower bar member. Hold it.
重ね合わせ部３の上側から出入り可能に配設され、重ね合わせ部３に当接する部分の長さが短い複数の上側棒状部材１５ａ１と、ガス噴出機構２１の端部２１ｂに対向するベース面１４から出入り可能に配設される複数の下側棒状部材１５ａ２とを備えるとともに、重ね合わせ部３を上側棒状部材１５ａと下側棒状部材１５ｂとで挟持するものである。 A plurality of upper bar-shaped members 15a1 that are arranged so as to be able to enter and exit from the upper side of the overlapping portion 3 and have a short length in contact with the overlapping portion 3, and a base surface 14 that faces the end portion 21b of the gas ejection mechanism 21. A plurality of lower bar members 15a2 arranged to be able to enter and exit are provided, and the overlapping portion 3 is sandwiched between the upper bar member 15a and the lower bar member 15b.
これにより、重ね合わせ部３同士が密着した状態で接合するとともに、ベース面１４にヒートシンクして接合不良を起こすこともない。 As a result, the superposed portions 3 are joined together while being in close contact with each other, and the base surface 14 is heat-sinked to cause no joint failure.
さらに本実施形態によれば、上側棒状部材または下側棒状部材は発熱可能である。 Furthermore, according to the present embodiment, the upper bar member or the lower bar member can generate heat.
例えば棒状部材１５に電熱線をつなげる、または、棒状部材１５自体を電熱体にしておけば、半田接合に必要な熱が棒状部材１５自体にヒートシンクしない点で好ましい。 For example, connecting a heating wire to the rod-shaped member 15 or making the rod-shaped member 15 itself an electric heating body is preferable in that heat necessary for soldering does not heat sink to the rod-shaped member 15 itself.
（太陽電池モジュール）
また、本発明の一実施形態に係る太陽電池モジュールは、相互に半田接合された配線材を有した太陽電池モジュールにおいて、配線材の接合部の少なくとも一方面に、半田によって形成された凹凸部を有するものである。
(Solar cell module)
Moreover, the solar cell module according to one embodiment of the present invention is a solar cell module having wiring members soldered to each other, and an uneven portion formed by solder is provided on at least one surface of the bonding portion of the wiring material. It is what you have.
この凹凸部１９は太陽電池モジュールの製造装置１０のこて先１２などから転写されたものであり、この凹凸部１９の高低差や径の大きさを一定範囲内に管理することで、半田の接合強度を管理することも可能である。 The concavo-convex portion 19 is transferred from the tip 12 of the solar cell module manufacturing apparatus 10. By controlling the height difference and diameter of the concavo-convex portion 19 within a certain range, It is also possible to manage the bonding strength.
さらに、本発明の一実施形態に係る太陽電池モジュールは、凹凸部は点状であることが好ましい。 Furthermore, as for the solar cell module which concerns on one Embodiment of this invention, it is preferable that an uneven | corrugated | grooved part is dot shape.
これは特に太陽電池モジュールの製造装置１０を用いた場合であって、図８（ａ）は、波紋状の凹凸部１９ｂは研磨冶具１７で研磨された半田こて１３の面が配線材３の表面の半田に転写されたものであり、図８（ｂ）は、この点状の凹凸部１９は前述の複数の棒状部材１５が配線材３の表面の半田に転写されたものである。 This is particularly the case when the solar cell module manufacturing apparatus 10 is used. In FIG. 8A, the ripple-shaped uneven portion 19 b is the surface of the soldering iron 13 polished by the polishing jig 17. FIG. 8B shows the dot-shaped uneven portion 19 in which the plurality of rod-shaped members 15 are transferred to the solder on the surface of the wiring member 3.
ここで図８（ｂ）の点状の凹凸部１９の一実施例について詳述する。例えば図９は、配線材３の接合部２０における上面の点状の凹凸部１９ａの一例を示す写真であり、下側棒状部材１５ｂの跡が配線材３の表面に凹部形状となって転写されていることがわかる。また例えば図１０は、配線材３の接合部２０における下面の点状の凹凸部１９ａの一例を示す写真であり、下側棒状部材１５ｂの跡が配線材３の接合部２０の反対面である上面側に凸部形状となって浮き出ていることがわかる。このような凹凸形状が、配線材３同士の接合を楔効果で強固なものとしている。 Here, an example of the dot-shaped uneven portion 19 of FIG. 8B will be described in detail. For example, FIG. 9 is a photograph showing an example of the dot-shaped uneven portion 19 a on the upper surface of the joint portion 20 of the wiring material 3, and the trace of the lower bar-shaped member 15 b is transferred to the surface of the wiring material 3 as a concave shape. You can see that Further, for example, FIG. 10 is a photograph showing an example of a dot-shaped uneven portion 19 a on the lower surface of the joint portion 20 of the wiring member 3, and the trace of the lower bar-like member 15 b is the opposite surface of the joint portion 20 of the wiring member 3. It can be seen that the convex shape is raised on the upper surface side. Such an uneven shape makes the connection between the wiring members 3 strong by the wedge effect.
複数の棒状部材１５による点状の凹凸１９ａの高低差や大きさを一定範囲内に管理することで、配線材３同士の接合圧力を管理することができ好ましい。例えば、点状の凹凸１９ａが大き過ぎれば、配線材３同士の接合圧力が高すぎることを示し、点状の凹凸１９ａが小さ過ぎれば配線材３同士の接合圧力が低すぎることを示しているものである。 By managing the height difference and size of the dot-shaped unevenness 19a by the plurality of rod-shaped members 15 within a certain range, it is preferable that the bonding pressure between the wiring members 3 can be managed. For example, if the dot-like unevenness 19a is too large, it indicates that the bonding pressure between the wiring members 3 is too high, and if the dot-like unevenness 19a is too small, it indicates that the bonding pressure between the wiring members 3 is too low. Is.
１：太陽電池モジュール
２：太陽電池素子
３：配線材（およびその重ね合わせ部）
３ａ：母材
３ｂ：半田被覆層
４：透光性基板
５：裏面保護材
６：充填材
７：端子ボックス
８：半田層
９： 金属間化合物層
１０：太陽電池モジュールの製造装置
１１：発熱体
１２：こて先
１２ａ：基体部
１２ｂ：上面当接部
１３：加熱手段（半田こて）
１４：ベース面
１５：棒状部材
１５ａ：上側棒状部材
１５ａ１：長さが短い上側棒状部材
１５ａ２：長さが長い上側棒状部材
１５ｂ：下側棒状部材
１６：スペーサー
１７：研磨治具
１７ａ：研磨面
１８：酸化被膜
１９：凹凸部
１９ａ：点状の凹凸部
１９ｂ：波紋状の凹凸部
２０：接合部
２１：ガス噴出機構（加熱手段）
２１ａ：筒状部材
２１ｂ：端部
２２：発熱体
1: Solar cell module 2: Solar cell element 3: Wiring material (and its overlapping portion)
3a: Base material 3b: Solder coating layer 4: Translucent substrate 5: Back surface protective material 6: Filler 7: Terminal box
8: Solder layer 9: Intermetallic compound layer 10: Solar cell module manufacturing apparatus 11: Heating element 12: Tip 12a: Base part 12b: Upper surface contact part 13: Heating means (soldering iron)
14: Base surface 15: Bar-shaped member 15a: Upper bar-shaped member 15a1: Upper bar-shaped member having a short length 15a2: Upper bar-shaped member having a long length 15b: Lower bar-shaped member 16: Spacer 17: Polishing jig 17a: Polishing surface 18 : Oxide film 19: Uneven portion 19a: Dot-like uneven portion 19b: Rippled uneven portion 20: Joint portion 21: Gas ejection mechanism (heating means)
21a: cylindrical member 21b: end 22: heating element
Claims (8)
前記複数の配線材の一部を重ね合わせた重ね合わせ部の上面および下面を挟持する上面当接部と下面当接部を有する挟持手段と、
前記重ね合わせ部を加熱する加熱手段とを備え、
前記上面当接部および前記下面当接部の少なくとも一方が複数の棒状部材であり、
前記加熱手段は、発熱体と、該発熱体からの熱を前記重ね合わせ部に伝えるこて先とを有しており、
前記重ね合わせ部は前記こて先と前記複数の棒状部材とで挟持される太陽電池モジュールの製造装置。 A solar cell module manufacturing apparatus for soldering a plurality of wiring members in a solar cell module,
A clamping means having an upper surface abutting portion and a lower surface abutting portion for sandwiching the upper surface and the lower surface of the overlapping portion obtained by overlapping a part of the plurality of wiring members;
Heating means for heating the overlapping portion,
Ri at least one of the plurality of bar-like members der of the upper surface abutment portion and the lower surface abutting portion,
The heating means includes a heating element and a tip that transfers heat from the heating element to the overlapping portion.
The superimposition unit manufacturing apparatus of a solar cell module that will be held between the plurality of bar-like member and the tip.
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