JP5536344B2 - レーザー加工装置 - Google Patents

レーザー加工装置 Download PDF

Info

Publication number
JP5536344B2
JP5536344B2 JP2009003571A JP2009003571A JP5536344B2 JP 5536344 B2 JP5536344 B2 JP 5536344B2 JP 2009003571 A JP2009003571 A JP 2009003571A JP 2009003571 A JP2009003571 A JP 2009003571A JP 5536344 B2 JP5536344 B2 JP 5536344B2
Authority
JP
Japan
Prior art keywords
laser beam
axis direction
lens
chuck table
adjusting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009003571A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010158710A (ja
Inventor
龍吾 大庭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2009003571A priority Critical patent/JP5536344B2/ja
Priority to KR1020090132342A priority patent/KR101530390B1/ko
Publication of JP2010158710A publication Critical patent/JP2010158710A/ja
Application granted granted Critical
Publication of JP5536344B2 publication Critical patent/JP5536344B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626Energy control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0461Welding tables

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2009003571A 2009-01-09 2009-01-09 レーザー加工装置 Active JP5536344B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009003571A JP5536344B2 (ja) 2009-01-09 2009-01-09 レーザー加工装置
KR1020090132342A KR101530390B1 (ko) 2009-01-09 2009-12-29 레이저 가공 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009003571A JP5536344B2 (ja) 2009-01-09 2009-01-09 レーザー加工装置

Publications (2)

Publication Number Publication Date
JP2010158710A JP2010158710A (ja) 2010-07-22
JP5536344B2 true JP5536344B2 (ja) 2014-07-02

Family

ID=42576274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009003571A Active JP5536344B2 (ja) 2009-01-09 2009-01-09 レーザー加工装置

Country Status (2)

Country Link
JP (1) JP5536344B2 (ko)
KR (1) KR101530390B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6234312B2 (ja) * 2014-04-11 2017-11-22 株式会社ディスコ 積層基板の加工方法
JP6860429B2 (ja) * 2017-06-07 2021-04-14 株式会社ディスコ レーザ加工方法及びレーザ加工装置
JP2019111542A (ja) 2017-12-21 2019-07-11 株式会社ディスコ レーザ加工装置
JP7269088B2 (ja) * 2019-05-07 2023-05-08 株式会社ディスコ レーザー加工装置
JP7353171B2 (ja) 2019-12-26 2023-09-29 株式会社ディスコ レーザー加工装置
JP2023037219A (ja) 2021-09-03 2023-03-15 株式会社ディスコ レーザー加工装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6293095A (ja) * 1985-10-18 1987-04-28 Matsushita Electric Ind Co Ltd レ−ザ加工装置
JPH0220681A (ja) * 1988-07-05 1990-01-24 Fujitsu Ltd レーザビームの集束方法
JP4663047B2 (ja) * 1998-07-13 2011-03-30 株式会社半導体エネルギー研究所 レーザー照射装置及び半導体装置の作製方法
JP3439179B2 (ja) * 2000-07-28 2003-08-25 三菱重工業株式会社 レーザーエッチング方法
JP2005072174A (ja) * 2003-08-22 2005-03-17 Disco Abrasive Syst Ltd 基板とその表面に積層された積層体から構成された被加工物の分割方法
JP4646690B2 (ja) * 2005-05-10 2011-03-09 ミヤチテクノス株式会社 金メッキ剥離装置
JP2007184421A (ja) * 2006-01-06 2007-07-19 Mitsubishi Heavy Ind Ltd 太陽電池モジュールの製造方法及び太陽電池モジュール
JP2007275962A (ja) * 2006-04-10 2007-10-25 Disco Abrasive Syst Ltd レーザー加工装置
JP5021258B2 (ja) * 2006-09-08 2012-09-05 日立造船株式会社 レーザによる溝加工方法
JP2008207210A (ja) * 2007-02-26 2008-09-11 Disco Abrasive Syst Ltd レーザー光線照射装置およびレーザー加工機

Also Published As

Publication number Publication date
KR101530390B1 (ko) 2015-06-19
KR20100082711A (ko) 2010-07-19
JP2010158710A (ja) 2010-07-22

Similar Documents

Publication Publication Date Title
JP4599243B2 (ja) レーザー加工装置
JP6022223B2 (ja) レーザー加工装置
JP4422463B2 (ja) 半導体ウエーハの分割方法
JP2009021476A (ja) ウエーハの分割方法
JP2006187783A (ja) レーザー加工装置
JP6178077B2 (ja) ウエーハの加工方法
JP2014104484A (ja) レーザー加工装置
JP2004160483A (ja) レーザー加工方法およびレーザー加工装置
JP5940906B2 (ja) レーザー加工装置
JP2008028113A (ja) ウエーハのレーザー加工方法
JP2005101416A (ja) レーザー加工方法およびレーザー加工装置
JP2006190779A (ja) ウエーハの分割方法
JP2008296254A (ja) レーザー加工装置
JP2006032419A (ja) ウエーハのレーザー加工方法
JP2005209719A (ja) 半導体ウエーハの加工方法
JP5536344B2 (ja) レーザー加工装置
US9087914B2 (en) Wafer processing method
JP4917361B2 (ja) ビアホールの加工方法
JP6430836B2 (ja) ウエーハの加工方法
JP2013197108A (ja) ウエーハのレーザー加工方法
JP2010158691A (ja) レーザー加工装置
JP4648044B2 (ja) レーザー加工装置
JP2004179302A (ja) 半導体ウエーハの分割方法
JP2006289388A (ja) レーザー加工装置
JP2010194584A (ja) レーザー加工装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130319

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130322

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130516

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131001

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131129

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140401

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140424

R150 Certificate of patent or registration of utility model

Ref document number: 5536344

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250