JP5505886B2 - 金属材およびその製造方法、並びに該金属材を使用したダイ - Google Patents
金属材およびその製造方法、並びに該金属材を使用したダイ Download PDFInfo
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- JP5505886B2 JP5505886B2 JP2011119751A JP2011119751A JP5505886B2 JP 5505886 B2 JP5505886 B2 JP 5505886B2 JP 2011119751 A JP2011119751 A JP 2011119751A JP 2011119751 A JP2011119751 A JP 2011119751A JP 5505886 B2 JP5505886 B2 JP 5505886B2
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- Japan
- Prior art keywords
- plating layer
- die
- metal material
- chromium plating
- chromium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007769 metal material Substances 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 87
- 238000007747 plating Methods 0.000 claims description 82
- 229910052804 chromium Inorganic materials 0.000 claims description 75
- 239000011651 chromium Substances 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 35
- 238000003756 stirring Methods 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000010410 layer Substances 0.000 description 77
- 239000010408 film Substances 0.000 description 17
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 230000007547 defect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001339 C alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019589 Cr—Fe Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 150000001844 chromium Chemical class 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Coating Apparatus (AREA)
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Electroplating Methods And Accessories (AREA)
Description
実施例1
SS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させた後、クロムめっき層表面に摩擦攪拌プロセスを施した。図4に摩擦攪拌プロセスを施した後のSS400材のクロムめっき層表面の写真を示す。表面にクラックが観察されないクロムめっき層が形成されていることが確認できる。
SS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させた。図6にクロムめっき層表面の写真を示す。表面に多数のクラックが生じていることが確認できる。
SS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させた後、該クロムめっき層表面に摩擦攪拌プロセスを施した。その後、該SS400板材を使用して、該クロムめっき層がリップランド部およびリップエッジ部となるようにTダイを作製した。図8に該Tダイのリップエッジ部近傍の写真を示す。リップエッジ部に割れや欠けがないことが確認できる。
SS400板材の表面に硬質クロムめっき処理を施し、厚さ約300μmのクロムめっき層を形成させた。該SS400板材を使用して、該クロムめっき層がリップランド部およびリップエッジ部となるようにTダイを作製した。図9に該Tダイのリップエッジ部近傍の写真を示す。リップエッジ部に割れが確認できる。
12…クロムめっき層
20…改質領域
30…摩擦攪拌プロセス用ツール
40…Tダイ
42…リップランド部
44…リップエッジ部
Claims (5)
- 金属母材表面にクロムめっき層を形成し、該クロムめっき層表面に摩擦攪拌プロセスを施すことにより得られる、クラック密度が最大20/cm以下であるクロムめっき層を表面に有する金属材。
- 金属母材表面にクロムめっき層を形成し、該クロムめっき層表面に摩擦攪拌プロセスを施すことを特徴とする請求項1に記載の金属材の製造方法。
- 請求項1に記載の金属材を使用したダイ。
- 請求項1に記載の金属材をリップランド部またはリップエッジ部に使用したTダイ。
- 請求項1に記載の金属材をリップランド部またはリップエッジ部に使用したコーティングダイ。
Priority Applications (1)
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---|---|---|---|
JP2011119751A JP5505886B2 (ja) | 2011-05-27 | 2011-05-27 | 金属材およびその製造方法、並びに該金属材を使用したダイ |
Applications Claiming Priority (1)
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---|---|---|---|
JP2011119751A JP5505886B2 (ja) | 2011-05-27 | 2011-05-27 | 金属材およびその製造方法、並びに該金属材を使用したダイ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012246539A JP2012246539A (ja) | 2012-12-13 |
JP5505886B2 true JP5505886B2 (ja) | 2014-05-28 |
Family
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JP2011119751A Expired - Fee Related JP5505886B2 (ja) | 2011-05-27 | 2011-05-27 | 金属材およびその製造方法、並びに該金属材を使用したダイ |
Country Status (1)
Country | Link |
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JP (1) | JP5505886B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6930509B2 (ja) * | 2018-09-06 | 2021-09-01 | 株式会社デンソー | めっき品の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006224462A (ja) * | 2005-02-17 | 2006-08-31 | Sekisui Chem Co Ltd | Tダイ及びそれを用いた熱可塑性樹脂フィルムの製造方法 |
JP2006289888A (ja) * | 2005-04-14 | 2006-10-26 | Sumitomo Chemical Co Ltd | プロピレン系フィルムの製造方法 |
JP4841924B2 (ja) * | 2005-10-07 | 2011-12-21 | 積水化学工業株式会社 | 光学フィルム成形用金型及び光学用熱可塑性樹脂フィルムの製造方法 |
DE102008017270B3 (de) * | 2008-04-04 | 2009-06-04 | Federal-Mogul Burscheid Gmbh | Strukturierte Chrom-Feststoffpartikel-Schicht und Verfahren zu deren Herstellung sowie beschichtetes Maschinenelement |
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- 2011-05-27 JP JP2011119751A patent/JP5505886B2/ja not_active Expired - Fee Related
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