JP5502066B2 - ガウス形状パルスを用いてレーザ穴開けする方法および装置 - Google Patents
ガウス形状パルスを用いてレーザ穴開けする方法および装置 Download PDFInfo
- Publication number
- JP5502066B2 JP5502066B2 JP2011501928A JP2011501928A JP5502066B2 JP 5502066 B2 JP5502066 B2 JP 5502066B2 JP 2011501928 A JP2011501928 A JP 2011501928A JP 2011501928 A JP2011501928 A JP 2011501928A JP 5502066 B2 JP5502066 B2 JP 5502066B2
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- Prior art keywords
- diameter
- laser
- workpiece
- hole
- pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
Claims (6)
- 加工対象物にスルーホールを形成する改善手法であって、
レーザを用いてレーザパルスを生成するステップと、
前記レーザパルスを光学素子で変更するステップと、
前記レーザパルスを前記加工対象物に当てるように方向付けするステップと、
を有し、
前記スルーホールは、先細り形状、仕上がり面、射出直径を有しており、
前記加工対象物は、金属材質を含み、上面とアブレーション閾値を有しており、
前記レーザパルスは、スポットサイズ、パルス幅、ピークパワーを有しており、
さらに、
前記レーザを用いて、前記加工対象物の前記アブレーション閾値よりも大きい前記ピークパワーを有する前記レーザパルスを生成するステップと、
前記光学素子を用いて、前記加工対象物の前記上面において前記スルーホールの前記射出直径よりも大きい1/e2直径の前記スポットサイズを有するように前記レーザパルスを変更するステップと、
前記変更したレーザパルスの少なくとも1つを、前記加工対象物の対象部分から材質を除去し、前記射出直径、前記仕上がり面、前記先細り形状を有する前記スルーホールを生成するように方向付けるステップと、
を有することを特徴とする方法。 - 前記スポットサイズの前記1/e2直径は、前記射出直径の2倍から5倍の間である
ことを特徴とする請求項1記載の方法。 - 前記スポットサイズの前記1/e2直径は、前記射出直径の約2.5倍である
ことを特徴とする請求項1記載の方法。 - 少なくとも1つのレーザパルスを用いて加工対象物にスルーホールを形成する改善システムであって、
コントローラと、レーザと、光学素子とを備え、
前記スルーホールは、先細り形状、仕上がり面、射出直径を有しており、
前記加工対象物は、金属材質を含み、上面とアブレーション閾値を有しており、
前記レーザパルスは、スポットサイズ、パルス幅、ピークパワーを有しており、
さらに、
前記コントローラは、前記レーザと前記光学素子に接続され、前記加工対象物の前記アブレーション閾値よりも大きい前記ピークパワーを有する少なくとも1つのレーザパルスを生成し、
前記スポットサイズは、前記加工対象物の前記上面において前記スルーホールの前記射出直径よりも大きい1/e2直径を有し、
前記コントローラは、前記レーザパルスを前記加工対象物に対して方向付けし、前記先細り形状、前記仕上がり面、前記射出直径を有する前記スルーホールを生成する
ことを特徴とするシステム。 - 前記スポットサイズの前記1/e2直径は、前記射出直径の2倍から5倍の間である
ことを特徴とする請求項4記載のシステム。 - 前記スポットサイズの前記1/e2直径は、前記射出直径の約2.5倍である
ことを特徴とする請求項4記載のシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/056,824 | 2008-03-27 | ||
US12/056,824 US8237080B2 (en) | 2008-03-27 | 2008-03-27 | Method and apparatus for laser drilling holes with Gaussian pulses |
PCT/US2009/037720 WO2009120585A2 (en) | 2008-03-27 | 2009-03-19 | Method and apparatus for laser drilling holes with gaussian pulses |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011515228A JP2011515228A (ja) | 2011-05-19 |
JP5502066B2 true JP5502066B2 (ja) | 2014-05-28 |
Family
ID=41114601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011501928A Expired - Fee Related JP5502066B2 (ja) | 2008-03-27 | 2009-03-19 | ガウス形状パルスを用いてレーザ穴開けする方法および装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8237080B2 (ja) |
JP (1) | JP5502066B2 (ja) |
KR (1) | KR101567384B1 (ja) |
CN (1) | CN102015195B (ja) |
TW (1) | TWI460043B (ja) |
WO (1) | WO2009120585A2 (ja) |
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-
2008
- 2008-03-27 US US12/056,824 patent/US8237080B2/en active Active
-
2009
- 2009-03-19 KR KR1020107021514A patent/KR101567384B1/ko active IP Right Grant
- 2009-03-19 JP JP2011501928A patent/JP5502066B2/ja not_active Expired - Fee Related
- 2009-03-19 CN CN200980110990.1A patent/CN102015195B/zh not_active Expired - Fee Related
- 2009-03-19 WO PCT/US2009/037720 patent/WO2009120585A2/en active Application Filing
- 2009-03-25 TW TW098109703A patent/TWI460043B/zh not_active IP Right Cessation
-
2012
- 2012-07-02 US US13/539,991 patent/US8866043B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20120267350A1 (en) | 2012-10-25 |
WO2009120585A3 (en) | 2009-12-17 |
KR20100136473A (ko) | 2010-12-28 |
TWI460043B (zh) | 2014-11-11 |
US20090242528A1 (en) | 2009-10-01 |
JP2011515228A (ja) | 2011-05-19 |
KR101567384B1 (ko) | 2015-11-09 |
TW200950918A (en) | 2009-12-16 |
US8866043B2 (en) | 2014-10-21 |
CN102015195B (zh) | 2014-12-10 |
WO2009120585A2 (en) | 2009-10-01 |
US8237080B2 (en) | 2012-08-07 |
CN102015195A (zh) | 2011-04-13 |
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