JP5498161B2 - 半導体ナノワイヤの製造方法 - Google Patents
半導体ナノワイヤの製造方法 Download PDFInfo
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- JP5498161B2 JP5498161B2 JP2009517723A JP2009517723A JP5498161B2 JP 5498161 B2 JP5498161 B2 JP 5498161B2 JP 2009517723 A JP2009517723 A JP 2009517723A JP 2009517723 A JP2009517723 A JP 2009517723A JP 5498161 B2 JP5498161 B2 JP 5498161B2
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- nanowire
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- semiconductor nanowire
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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Description
以下、図2(a)から図3(c)を参照しながら、本発明による半導体ナノワイヤの製造方法の第1の実施形態を説明する。本実施形態では、p-i-p構造にドーピングされたSiナノワイヤを形成する。
以下、図11(a)から(d)を参照しながら、本発明による半導体ナノワイヤの製造方法の第2の実施形態を説明する。本実施形態では、GaAsとGaAsPのヘテロ構造を有するナノワイヤ(以下、GaAs/GaAsPナノワイヤと呼ぶ。)を形成する。ナノワイヤは公知の方法であるVLS成長機構によって成長させることができる。
以下、本発明による半導体装置の実施形態を説明する。本実施形態の半導体装置は、第1の実施形態のSiナノワイヤ(以下、プロファイルSiナノワイヤと呼ぶ。)を有するトランジスタである。
以下、本発明による半導体ナノワイヤを有するナノワイヤ発光素子(LED)の実施形態を説明する。本実施形態の発光素子は、組成の異なる2つの領域を有するヘテロ構造ナノワイヤで構成される発光領域を備えている。本実施形態のヘテロナノワイヤは、例えば、第2の実施形態で示したGaAs/GaAsPからなるヘテロナノワイヤである。
102 基板
103 第一の材料の原料ガス
104 第一の材料のナノワイヤ
105 保護膜
106 第二の材料のナノワイヤ
107 第二の材料の原料ガス
170 Siナノワイヤ
171 Au粒子
172 BドープSiナノワイヤ
173 サイドウォール
174 ノンドープSiナノワイヤ
180 Siナノワイヤ
181 Au粒子
182 ノンドープSiナノワイヤ
183 サイドウォール
184 BドープSiナノワイヤ
201 Au粒子
202 シリコン基板
203 Si原料ガス、B原料ガス
204 BドープSiナノワイヤ
205 Si原料ガス
206 Siナノワイヤ
207 Siナノワイヤ
208 シリコン酸化膜
209 Siナノワイヤ
210 Siナノワイヤ
301 Au粒子
302 基板
303 GaAsの原料ガス
304 GaAsのナノワイヤ
305 保護膜
306 GaAsPのナノワイヤ
307 GaAsPの原料ガス
400 ナノワイヤトランジスタ
401 基板
402 ゲート電極
403 ゲート絶縁膜
404 ソース電極
405 ドレイン電極
406 p−i−p型Siナノワイヤ
407 p型にドープされた領域
408 ドープされていない領域
410 フレキシブル基板
411 Xドライバ
412 Yドライバ
413 X走査電極
414 Y走査電極
415 画素
416 スイッチ用トランジスタ
417 ドライバ用トランジスタ
500 GaAs/GaAsPヘテロナノワイヤ
501 GaAs層
502 GaAsP層
503 ナノワイヤ発光素子
504 基板
505 第一の電極
506 第二の電極
1001 触媒粒子
1002 基板
1003 原料ガス
1004 第一の材料のナノワイヤ
1005 第二の材料のナノワイヤ
Claims (13)
- 第一の領域および第二の領域を有する半導体ナノワイヤの製造方法であって、
基板上に触媒粒子を配置する工程(A)と、
VLS成長機構により、前記第一の領域を前記触媒粒子から成長させる工程(B)と、
前記工程(B)において成長させた前記第一の領域の側壁に保護膜を形成する工程(C)と、
前記工程(C)の後、VLS成長機構により、前記第二の領域を前記第一の領域上に成長させる工程(D)とを含む半導体ナノワイヤの製造方法。 - 前記第一の領域の導電型はN型およびP型のうちのいずれか一方であり、前記第二の領域の導電型はN型またはP型のうちの他方である、請求項1に記載の半導体ナノワイヤの製造方法。
- 前記第一の領域と前記第二の領域とは同じ導電型であり、前記第二の領域の導電率が前記第一の領域の導電率よりも低い、請求項1に記載の半導体ナノワイヤの製造方法。
- 前記触媒粒子は、金属又は金属と半導体の合金材料から構成されている、請求項1に記載の半導体ナノワイヤの製造方法。
- 前記第二の領域は、不純物元素がドープされた半導体材料から形成される、請求項1に記載の半導体ナノワイヤの製造方法。
- 前記第二の領域の成長温度において、前記触媒粒子に対する前記不純物元素の固溶度が1×1019atoms/cm3以下である、請求項5に記載の半導体ナノワイヤの製造方法。
- 前記第一の領域および前記第二の領域は、Si、Ge、Cから選ばれる少なくとも一つを含む半導体材料から形成される、請求項6に記載の半導体ナノワイヤの製造方法。
- 前記不純物元素は、B、P、As、Sbから選ばれる少なくとも1つである、請求項5に記載の半導体ナノワイヤの製造方法。
- 前記工程(D)において、前記第二の領域の構成元素は前記保護膜中を拡散して前記第一の領域に至らない、請求項1に記載の半導体ナノワイヤの製造方法。
- 前記保護膜は、シリコン酸化膜、シリコン酸窒化膜又はシリコン窒化膜から選ばれる少なくとも一つを含む、請求項9に記載の半導体ナノワイヤの製造方法。
- 前記第一の領域のバンドギャップと第二の領域のバンドギャップとは異なる、請求項1に記載の半導体ナノワイヤの製造方法。
- 前記第二の領域は2種類以上の元素から構成されており、前記第二の領域の成長温度において、前記触媒粒子に対する、前記第二の領域を構成する少なくとも1種類の元素の固溶度が1×1019atoms/cm3以下である、請求項11に記載の半導体ナノワイヤの製造方法。
- 前記保護膜は、前記第一の領域を熱酸化することにより形成される、請求項1に記載の半導体ナノワイヤの製造方法。
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JP2020198399A (ja) * | 2019-06-04 | 2020-12-10 | 国立大学法人 東京大学 | ナノワイヤ製造方法、ナノワイヤ製造装置、及びナノワイヤ |
JP7298822B2 (ja) | 2019-06-04 | 2023-06-27 | 国立大学法人 東京大学 | ナノワイヤ製造方法、及びナノワイヤ製造装置 |
KR102415405B1 (ko) * | 2021-03-30 | 2022-06-29 | 한양대학교 에리카산학협력단 | 나노와이어형 발광소자를 이용한 표시 장치 |
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