JP5467980B2 - Electronic equipment control device - Google Patents

Electronic equipment control device Download PDF

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JP5467980B2
JP5467980B2 JP2010211075A JP2010211075A JP5467980B2 JP 5467980 B2 JP5467980 B2 JP 5467980B2 JP 2010211075 A JP2010211075 A JP 2010211075A JP 2010211075 A JP2010211075 A JP 2010211075A JP 5467980 B2 JP5467980 B2 JP 5467980B2
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end surface
bus bar
surface side
bar assembly
boss
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JP2012069584A (en
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紘文 渡部
和彦 中野
大輔 安川
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Description

本発明は、樹脂モールドされた電子回路基板であるバスバー組立体を備えた電子機器制御装置に関する。   The present invention relates to an electronic device control apparatus including a bus bar assembly that is a resin-molded electronic circuit board.

周知のように、例えば車両などの電子機器制御装置には、樹脂モールドされた電子回路基板としてバスバー組立体が一般に使用されており、その一つとして以下の特許文献１に記載されたものが知られている。   As is well known, a bus bar assembly is generally used as a resin-molded electronic circuit board in an electronic device control apparatus such as a vehicle, for example, as described in Patent Document 1 below. It has been.

概略を説明すると、前記バスバー組立体は、樹脂材によって一体に設けられた基板本体と、該基板本体の上面に一体的に固定された金属導体である帯状のバスバーと、基板本体の下面側に保持されたリレー回路やコンデンサなどの複数の電子部品と、から主として構成されている。   In brief, the bus bar assembly includes a substrate body integrally provided with a resin material, a strip-shaped bus bar that is a metal conductor fixed integrally to the upper surface of the substrate body, and a lower surface side of the substrate body. It is mainly composed of a plurality of electronic components such as held relay circuits and capacitors.

そして、前記樹脂モールドのバスバー組立体は、通常、射出成形によって前記基板本体とバスバーが一体に成形されていると共に、前記基板本体と同じ樹脂材である電子部品収容部も同時に一体成形されるようになっている。   In the resin-molded bus bar assembly, the substrate main body and the bus bar are usually integrally formed by injection molding, and the electronic component housing portion that is the same resin material as the substrate main body is also integrally formed at the same time. It has become.

特開２００２−１３４９５６号公報Japanese Patent Laid-Open No. 2002-134956

ところで、前記バスバー組立体は、制御装置全体の薄肉化を図るために、一端面側に熱収縮率の少ない金属導体である複数のバスバーを配置することによって該バスバーの量が支配的になっている一方、他端面側は、電子部品を実装することから、熱収縮率の大きな樹脂材の量が支配的になっている。   By the way, in the bus bar assembly, the amount of the bus bar becomes dominant by arranging a plurality of bus bars which are metal conductors having a small heat shrinkage rate on one end surface side in order to reduce the thickness of the entire control device. On the other hand, on the other end surface side, an electronic component is mounted, so that the amount of the resin material having a large thermal contraction rate is dominant.

このため、バスバー組立体を成形した後に、金型から取り出すと上面側と下面側の熱収縮率の相違によって、バスバー組立体全体が、上面側が凸形状となる湾曲状に撓み変形（反り変形）してしまうおそれがある。   For this reason, when the bus bar assembly is molded and then removed from the mold, the entire bus bar assembly is bent and deformed into a curved shape with a convex shape on the upper surface side (warp deformation) due to the difference in thermal shrinkage between the upper surface side and the lower surface side. There is a risk of it.

本発明は、前記従来の電子機器制御装置におけるバスバー組立体の技術的課題に鑑みて案出されたもので、成形後におけるバスバー組立体全体の反り変形を抑制できるバスバー組立体を提供する。   The present invention has been devised in view of the technical problem of the bus bar assembly in the conventional electronic device control apparatus, and provides a bus bar assembly capable of suppressing warpage deformation of the entire bus bar assembly after molding.

本願請求項１に係る発明は、とりわけ、基板本体の一端面側の外周部に、ねじ挿通孔が貫通形成されたボス部を一体に設けると共に、該各ボス部の外側面に樹脂材の肉盛り部を一体に設け、該各肉盛り部の高さを前記ボス部の高さよりも低く形成する一方、
前記基板本体の他端面側に電子部品を収容保持する凹形状の収容部を形成すると共に、前記他端面側でかつ前記収容部の近傍に肉抜き部を形成したことを特徴としている。 In the invention according to claim 1 of the present invention, in particular, a boss portion having a screw insertion hole formed integrally therewith is provided on the outer peripheral portion on one end surface side of the substrate body, and a resin material is formed on the outer surface of each boss portion. While providing a raised portion integrally, the height of each of the raised portions is formed lower than the height of the boss portion,
A concave housing portion for housing and holding an electronic component is formed on the other end surface side of the substrate body, and a thinned portion is formed on the other end surface side and in the vicinity of the housing portion .

本願請求項２に係る発明は、前記一端面側の肉盛部を、前記ねじ挿通孔が貫通形成されたボス部に結合させた立ち上がり壁によって形成したことを特徴としている。 The invention according to claim 2 of the present application is characterized in that the built-up portion on the one end face side is formed by a rising wall joined to a boss portion through which the screw insertion hole is formed .

本発明によれば、基板本体の一端面側に設けられたボス部の外側面に肉盛り部を一体に設ける一方、基板本体の他端面側に電子部品を収容保持する収容部を形成すると共に、前記他端面側でかつ前記収容部の近傍に肉抜き部を形成したことによって、成形後における両端面側の熱収縮量の差を減少させて、バスバー組立体の反り変形を効果的に抑制することが可能になる。
特に、前記肉盛り部は、同じ樹脂材のボス部の外側面に結合されていることから、大きな収縮変形量を得ることができる。
しかも、前記肉盛り部を前記ボス部の高さよりも低く形成したことから、例えば、制御基板などの他の部材との干渉を抑制できる。
さらに、前記各肉抜き部を、他端面側でかつ前記収容部の近傍に形成したことから、各収容部の収縮変形による影響を殆ど受けることがなくなり、収容部自体の変形も抑制できるので、前記電子部品の収容作業も容易になると共に、該電子部品に対する圧接などによる電気的影響も回避できる。 According to the present invention, while integrally provided with a padding portion on the outer surface of the ball scan portion provided on one end surface side of the substrate main body to form an accommodating portion for accommodating holding the electronic component on the other end face side of the substrate main body In addition, by forming the thinned portion on the other end surface side and in the vicinity of the accommodating portion, the difference in thermal shrinkage between the both end surface sides after molding is reduced, and the warp deformation of the bus bar assembly is effectively performed. It becomes possible to suppress.
In particular, since the build-up portion is coupled to the outer surface of the boss portion of the same resin material, a large amount of contraction deformation can be obtained.
And since the said build-up part was formed lower than the height of the said boss | hub part, interference with other members, such as a control board, can be suppressed, for example.
Furthermore, since each said thinning part was formed in the other end side and the vicinity of the above-mentioned storage part, it is almost not influenced by contraction deformation of each storage part, and can also control deformation of the storage part itself, The electronic component can be accommodated easily, and electrical influences caused by pressure contact with the electronic component can be avoided.

本発明に係る電子機器制御装置を示す分解斜視図である。It is a disassembled perspective view which shows the electronic device control apparatus which concerns on this invention. 本実施形態に供されるバスバー組立体を示す俯瞰図である。It is an overhead view which shows the bus-bar assembly provided to this embodiment. 同バスバー組立体の平面図である。It is a top view of the bus bar assembly. 図３のＡ−Ａ線断面図である。FIG. 4 is a sectional view taken along line AA in FIG. 3. 図４のＢ部拡大断面図である。It is the B section expanded sectional view of Drawing 4. 本実施形態のバスバー組立体を断面して示す模式図である。It is a mimetic diagram showing the bus bar assembly of this embodiment in section. 従来のバスバー組立体を断面して示す模式図である。It is a schematic diagram which shows the conventional bus-bar assembly in cross section. 従来のバスバー組立体の反り変形を示す模式図である。It is a schematic diagram which shows the curvature deformation of the conventional bus-bar assembly.

以下、本発明に係る電子機器制御装置を、例えば、自動車のブレーキ系の電子制御装置に適用した場合の実施形態を図面に基づいて詳述する。   Hereinafter, an embodiment in which an electronic device control device according to the present invention is applied to, for example, an electronic control device for an automobile brake system will be described in detail with reference to the drawings.

ブレーキ系の電子制御装置は、全体の具体的な図示は省略するが、エンジンルームと車室とを仕切る隔壁に一端が固定されて、他端にタンデム型のシリンダであるマスターシリンダが設けられた駆動機構と、該駆動機構の上端部に一体的に設けられて、駆動機構に有する電動アクチュエータを制御する電子機器制御装置（ＥＣＵ）と、を備えている。   Although the brake system electronic control device is not specifically illustrated as a whole, one end is fixed to a partition wall that partitions the engine room and the passenger compartment, and a master cylinder that is a tandem cylinder is provided at the other end. A drive mechanism; and an electronic device control unit (ECU) that is provided integrally with an upper end portion of the drive mechanism and controls an electric actuator included in the drive mechanism.

前記ＥＣＵ１は、図１に示すように、ＥＣＵケーシング０１とカバー０２との間に収容された電子回路２を備えている。   The ECU 1 includes an electronic circuit 2 housed between an ECU casing 01 and a cover 02, as shown in FIG.

前記ＥＣＵケーシング１０は、アルミ合金材によって上端が開口した有底状のボックス状に形成され、外周部上端に上端開口を、シール部材０３を介して閉塞する前記カバー０２が複数のビス０４によって固定されるようになっている。また、前記ＥＣＵケーシング０１の一側部開口端には、一端部がバッテリー電源に接続される雌コネクタ９がシール部材０５を介して取り付けられていると共に、他側部に形成された円形孔０６には呼吸フィルタ０７が嵌着固定されている。   The ECU casing 10 is formed in a bottomed box shape with an upper end opened by an aluminum alloy material, and the cover 02 that closes the upper end opening at the upper end of the outer periphery via a seal member 03 is fixed by a plurality of screws 04. It has come to be. A female connector 9 having one end connected to a battery power source is attached to one end of the ECU casing 01 via a seal member 05, and a circular hole 06 formed on the other side. A breathing filter 07 is fitted and fixed to the.

前記電子回路２は、電動モータのステータに電力を供給するためのパワー基板３と、通電ノイズを除去するためのフィルタ電子回路を有する支持体であるフィルタ組立体（バスバー組立体）４と、電動モータの駆動を制御するための回路基板である制御基板５と、を備えている。   The electronic circuit 2 includes a power board 3 for supplying electric power to the stator of the electric motor, a filter assembly (bus bar assembly) 4 that is a support having a filter electronic circuit for removing energization noise, And a control board 5 which is a circuit board for controlling the driving of the motor.

前記パワー基板３は、合成樹脂材によってほぼ長方形状の薄板状に形成され、電子部品である複数の半導体素子や複数の直流出力端子ピン、交流入力端子、３つのモータ三相端子６ａ〜６ｃの他に、上方に突設されたリードフレーム７などから構成されている。   The power board 3 is formed in a substantially rectangular thin plate shape by a synthetic resin material, and includes a plurality of semiconductor elements which are electronic components, a plurality of DC output terminal pins, an AC input terminal, and three motor three-phase terminals 6a to 6c. In addition, the lead frame 7 is provided so as to project upward.

前記バスバー組立体４は、射出成形によって一体的に樹脂モールドされており、図２〜図４に示すように、合成樹脂材によってほぼ板状一体に形成された支持体である基板本体１０と、該基板本体１０の一端面（図中上面１０ａ）側に一体的に配設固定された金属導体である複数のバスバー１１と、前記基板本体１０の他端面（図中下面１０ｂ）側に形成されて、電子部品を実装保持する保持部である収容部１２などから構成されている。   The bus bar assembly 4 is integrally resin-molded by injection molding, and as shown in FIGS. 2 to 4, a substrate body 10 that is a substantially monolithic support formed of a synthetic resin material, A plurality of bus bars 11 which are metal conductors integrally disposed and fixed on one end surface (upper surface 10a in the figure) side of the substrate body 10 and the other end surface (lower surface 10b in the figure) side of the substrate body 10 are formed. The housing portion 12 is a holding portion for mounting and holding electronic components.

前記基板本体１０は、異形な矩形状に形成され、外周部１０ｃの角部６箇所に後述する固定用ビス２０が挿通されるねじ挿通孔１３ａを上下方向に貫通形成された円筒状のボス部１３が一体に設けられていると共に、所定位置には、複数の端子ピン１４などが上方に突設されている。   The substrate body 10 is formed in an irregular rectangular shape, and is a cylindrical boss portion that is vertically formed through a screw insertion hole 13a through which a fixing screw 20 described later is inserted at six corners of the outer peripheral portion 10c. 13 are integrally provided, and a plurality of terminal pins 14 and the like are provided so as to protrude upward at predetermined positions.

また、前記基板本体１０の上面１０ａ側の外周部には、該外周部に沿って延長された肉盛部１５が一体に設けられている。   Further, a built-up portion 15 extending along the outer peripheral portion is integrally provided on the outer peripheral portion on the upper surface 10 a side of the substrate body 10.

この肉盛部１５は、図２〜図４に示すように、前記基板本体１０と一体の樹脂材によって立ち上がり壁板状に形成され、その高さは前記制御基板５と干渉しないように前記各ボス部１３よりも低く形成されている。また、肉盛部１５の長手方向の一端部１５ａが、いずれかのボス部１３の外周面に結合されていると共に、他端部が適宜、端子ピン１４などの接続に支障を来さないように所定長さに設定されている。   As shown in FIGS. 2 to 4, the build-up portion 15 is formed in a rising wall plate shape by a resin material integral with the substrate body 10, and the height thereof does not interfere with the control substrate 5. It is formed lower than the boss part 13. Further, one end portion 15a in the longitudinal direction of the built-up portion 15 is coupled to the outer peripheral surface of one of the boss portions 13, and the other end portion appropriately prevents the connection of the terminal pin 14 or the like. Is set to a predetermined length.

また、図５に示すように、前記各バスバー１１間に配置された隔壁１０ｄの上端部に一体に別異の肉盛部１６が設けられており、この肉盛部１６は、横断面ほぼＬ字形状あるいは横断面が単純な矩形状になっている。   Further, as shown in FIG. 5, a different built-up portion 16 is integrally provided at the upper end portion of the partition wall 10d disposed between the bus bars 11, and this built-up portion 16 has a transverse cross section of approximately L. The character shape or the cross section is a simple rectangular shape.

前記バスバー１１は、それぞれ一定幅の帯状に形成されて、基板本体１０の上面１０ａ上に蛇行状あるいは矩形状に配設されていると共に、それぞれの上面が露出している。   The bus bars 11 are each formed in a band shape having a constant width, and are disposed in a meandering or rectangular shape on the upper surface 10a of the substrate body 10, and the upper surfaces of the bus bars 11 are exposed.

前記各収容部１２は、図４及び他の部位を模式的に示す図６に示すように、フィルタ電子回路の構成部品であるリレー回路やコモンモールドコイル、ノーマルモードコイル、さらには大小複数のコンデンサ等の電子部品１７を収容保持するように凹形状に形成されている。   As shown in FIG. 4 and FIG. 6 schematically showing other parts, each of the accommodating portions 12 includes a relay circuit, a common mold coil, a normal mode coil, and a plurality of large and small capacitors as components of the filter electronic circuit. It is formed in a concave shape so as to accommodate and hold the electronic component 17 such as.

なお、前記基板本体１０の外周部の３箇所には、組付時に前記制御基板５やパワー基板３に係止する係止爪部１９、２３が上下面１０ａ、１０ｂから上下方向へそれぞれ突設されている。   In addition, locking claw portions 19 and 23 for locking to the control board 5 and the power board 3 at the time of assembly are provided at three locations on the outer peripheral portion of the board body 10 respectively in the vertical direction from the upper and lower surfaces 10a and 10b. Has been.

また、前記基板本体１０の下面１０ｂ側には、図４及び図６に示すように、前記収容部１２の近傍、つまり収容部１２の側部に肉抜き部１８が切欠形成されている。この肉抜き部１８は、図７に示す従来では樹脂材が存在していた部位である、例えば前記ボス部１３の下部位置や収容部１２間の肉厚な隔壁１２ａの一部などを切欠して形成されている。   Further, as shown in FIGS. 4 and 6, a cutout portion 18 is formed in the vicinity of the accommodating portion 12, that is, on the side portion of the accommodating portion 12, on the lower surface 10 b side of the substrate body 10. 7 is a portion where the resin material is present in the prior art as shown in FIG. 7, for example, the lower position of the boss portion 13 or a part of the thick partition wall 12a between the accommodating portions 12. Is formed.

前記制御基板５は、図１に示すように、合成樹脂材によって平面ほぼＬ字形状の薄板状に形成され、隅部に形成された各ビス挿通孔に挿通する４本の固定用ビス２０によって前記バスバー組立体４の上部に所定の隙間をもって固定されている。   As shown in FIG. 1, the control board 5 is formed by a synthetic resin material into a thin plate shape having a substantially L-shaped plane, and is formed by four fixing screws 20 that are inserted through the screw insertion holes formed at the corners. The bus bar assembly 4 is fixed to the upper part with a predetermined gap.

この制御基板５には、コンピュータを含む制御回路が取り付けられており、電動モータの駆動回路であるインバータ（半導体素子）の駆動を制御するための制御信号がこの基板で作られる。   A control circuit including a computer is attached to the control board 5, and a control signal for controlling driving of an inverter (semiconductor element) that is a drive circuit of the electric motor is generated by this board.

前記制御基板５の一側部に有する複数の小孔群２１、２２に、前記パワー基板３の前記リードフレーム７や前記コネクタ９の端子群９ａに設けられた複数の端子ピンが半田によって接続されている。   A plurality of terminal pins provided on the lead frame 7 of the power board 3 and the terminal group 9a of the connector 9 are connected to a plurality of small hole groups 21 and 22 provided on one side of the control board 5 by solder. ing.

以下、本実施形態における電子機器制御装置の作用について説明すると、まず、射出成形された前記バスバー組立体４を金型から取り出すと、基板本体１０のバスバー１１が配設された上面１０ａ側では、各肉盛部１５、１６によって樹脂材の量が従来のものに比較して多くなっていることから、熱収縮率が大きくなる。一方、前記基板本体１０の下面１０ｂ側では、前記各肉抜き部１８によって樹脂材の量が従来のものに比較して少なくなっていることから、熱収縮率が小さくなる。   Hereinafter, the operation of the electronic device control apparatus according to the present embodiment will be described. First, when the injection-molded bus bar assembly 4 is taken out from the mold, on the upper surface 10a side of the board body 10 on which the bus bar 11 is disposed, Since the amount of the resin material is increased by the respective built-up portions 15 and 16 as compared with the conventional one, the thermal contraction rate is increased. On the other hand, on the lower surface 10b side of the substrate body 10, since the amount of the resin material is reduced by the respective cutout portions 18 as compared with the conventional one, the thermal contraction rate is reduced.

すなわち、従来技術では、図８の模式図に示すように、基板本体１０の多くのバスバー１１が設けられた上面１０ａ側では、バスバー１１によって収縮量が少なく逆に、樹脂材の多い下面１０ｂ側では熱収縮量が多くなることから、上面１０ａ側が凸形状となる反り変形が大きくなり、全体として約４ｍｍ以上の反り変形量になる。   That is, in the prior art, as shown in the schematic diagram of FIG. 8, on the upper surface 10 a side of the substrate body 10 on which many bus bars 11 are provided, the bus bar 11 reduces the amount of shrinkage, and conversely, on the lower surface 10 b side where there are many resin materials Then, since the amount of heat shrinkage increases, the warpage deformation in which the upper surface 10a side is convex increases, and the warpage deformation amount is about 4 mm or more as a whole.

これに対して、本実施形態では、上面１０ａ側に多くの肉盛部１５，１６を設ける一方、下面１０ｂ側に多くの肉抜き部１８を形成したことから、上面１０ａ側と下面１０ｂ側ではその熱収縮量がほぼ同一になる。このため、前記上面１０ａ側の凸形状の反り変形量と下面１０ｂ側の凹形状の反り変形量が小さくなって、前記バスバー組立体４全体の反り変形が十分に抑制されて約２ｍｍ以内の反り変形量に抑えられる。   On the other hand, in the present embodiment, a large number of the overlaid portions 15 and 16 are provided on the upper surface 10a side, while a large number of the hollow portions 18 are formed on the lower surface 10b side. The amount of heat shrinkage is almost the same. Therefore, the convex warpage deformation amount on the upper surface 10a side and the concave warpage deformation amount on the lower surface 10b side are reduced, and the warpage deformation of the entire bus bar assembly 4 is sufficiently suppressed, and the warpage is within about 2 mm. The amount of deformation can be suppressed.

この結果、前記ＥＣＵケーシング０１に、前記パワー基板３とバスバー組立体４及び制御基板５とを組み付ける際に、これら全体の位置ずれが抑制されて、例えば、前記基板本体１０の端子群の端子ピン１４と制御基板５の端子孔との位置決めが簡単になる。これよって、各構成部品の組み付け作業や端子接続作業が容易になると共に、これらの作業コストの低減化が図れる。   As a result, when the power board 3, the bus bar assembly 4, and the control board 5 are assembled to the ECU casing 01, the overall positional shift is suppressed, for example, the terminal pins of the terminal group of the board body 10. 14 and the terminal hole of the control board 5 are easily positioned. As a result, the assembling work of each component and the terminal connecting work are facilitated, and the work cost can be reduced.

また、本実施形態では、一方の肉盛部１５は、同じ樹脂材の各ボス部１３に結合されていることから、大きな収縮変形量を得ることが可能になる。また、この各肉盛部１５を基板本体１０の上面１０ａの外周部１０ｃに設けると共に、各ボス部１３の高さよりも低く形成したため、例えば前記制御基板５など他の部材との干渉を防止できると共に、上面１０ａ側の熱収縮性を効率良く得ることができる。   Moreover, in this embodiment, since one build-up part 15 is couple | bonded with each boss | hub part 13 of the same resin material, it becomes possible to obtain a big shrinkage deformation amount. In addition, since each of the built-up portions 15 is provided on the outer peripheral portion 10c of the upper surface 10a of the substrate body 10 and is formed lower than the height of each boss portion 13, interference with other members such as the control substrate 5 can be prevented. At the same time, the heat shrinkability on the upper surface 10a side can be obtained efficiently.

さらに、他方の肉盛部１６は、各バスバー１１の隔壁１０ｄの上端部に形成されていることから、デッドスペースを有効に利用することが可能になると共に、収縮変形によるバスバー１１への影響も回避できる。具体的には、前述した基板本体１０の反り変形によるバスバー１１の位置ずれやバスバー１１に応力が掛かるのを抑制できる。   Further, since the other built-up portion 16 is formed at the upper end portion of the partition wall 10d of each bus bar 11, it is possible to effectively use the dead space and also the influence on the bus bar 11 due to shrinkage deformation. Can be avoided. Specifically, it is possible to suppress the displacement of the bus bar 11 due to the warp deformation of the substrate body 10 and the stress applied to the bus bar 11.

前記各肉抜き部１８は、各収容部１２の近傍に形成されていることから、各収容部１２が収縮変形による影響を殆ど受けることがなくなり、収容部１２自体の変形も抑制されるので、前記電子部品１７の収容作業も容易になると共に、該電子部品１７に対する圧接などによる電気的な影響も回避できる。また、下面１０ｂ外周側の肉抜き部１８によって下面１０ｂ側の熱収縮性を効果的に抑制できる。   Since each of the lightening portions 18 is formed in the vicinity of each housing portion 12, each housing portion 12 is hardly affected by shrinkage deformation, and deformation of the housing portion 12 itself is also suppressed. The electronic component 17 can be accommodated easily, and electrical influences caused by pressure contact with the electronic component 17 can be avoided. Further, the heat shrinkability on the lower surface 10b side can be effectively suppressed by the thinned portion 18 on the outer peripheral side of the lower surface 10b.

本発明は、前記各実施形態の構成に限定されるものではなく、例えば、バスバー組立体４の適用対象としては、前記自動車のブレーキ系以外の電子機器制御装置に適用することも可能である。   The present invention is not limited to the configuration of each of the embodiments described above. For example, the bus bar assembly 4 can be applied to an electronic device control device other than the brake system of the automobile.

また、前記バスバー１１の形成位置が、基板本体１０の上面１０ａ側ではなく下面１０ｂ側である場合は、前記肉盛り部１４，１５と肉抜き部１８をそれぞれ反対側に形成して、全体の反り変形を抑制することもできる。   When the bus bar 11 is formed on the lower surface 10b side instead of the upper surface 10a side of the substrate body 10, the build-up portions 14 and 15 and the thinned portion 18 are formed on the opposite sides, respectively. Warpage deformation can also be suppressed.

さらに、前記肉盛部１５，１６と肉抜き部１８を、基板本体１０のいずれの箇所に形成するかは基本的に任意であるが、前述したように、肉盛部１５，１６を少なくとも前記各ボス部１３に結合させた場合には、ボス部１３も樹脂材であるから大きな収縮量を得ることができる。   Further, it is basically arbitrary to form the build-up portions 15 and 16 and the light-extracted portion 18 in the substrate body 10, but as described above, the build-up portions 15 and 16 are at least described above. When coupled to each boss portion 13, the boss portion 13 is also a resin material, so that a large amount of contraction can be obtained.

なお、前記バスバー組立体４の反り変形量は、該バスバー組立体４の全体の大きさや厚さなどによって変化するが、どの場合でも前記各肉盛部１５，１６や肉抜き部１８の存在によって反り変形量が十分に抑制される。   The amount of warp deformation of the bus bar assembly 4 varies depending on the overall size and thickness of the bus bar assembly 4. In any case, the warp deformation amount depends on the presence of the respective built-up portions 15, 16 and the lightening portions 18. The amount of warp deformation is sufficiently suppressed.

０１…ＥＣＵケーシング
０２…カバー
１…電子機器制御装置
２…電子回路
３…パワー基板
４…バスバー組立体（樹脂モールド）
５…制御基板
１０…基板本体（支持体）
１１…バスバー
１２…収容部（保持部）
１３…ボス部
１５・１６…肉盛部
１７…電子部品
１８…肉抜き部 DESCRIPTION OF SYMBOLS 01 ... ECU casing 02 ... Cover 1 ... Electronic device control apparatus 2 ... Electronic circuit 3 ... Power board 4 ... Bus-bar assembly (resin mold)
5 ... Control board 10 ... Board body (support)
11 ... Bus bar 12 ... Accommodating part (holding part)
13 ... Boss part 15 · 16 ... Overlay part 17 ... Electronic component 18 ... Meat removal part

Claims (2)

樹脂モールドされた基板本体の一端面側に、複数の導体バスバーが一体的に配設固定され、他端面側に、複数の電子部品を実装してなるバスバー組立体を備えた電子機器制御装置であって、
前記基板本体の一端面側の外周部に、ねじ挿通孔が貫通形成されたボス部を一体に設けると共に、該各ボス部の外側面に樹脂材の肉盛り部を一体に設け、該各肉盛り部の高さを前記ボス部の高さよりも低く形成する一方、
前記基板本体の他端面側に電子部品を収容保持する凹形状の収容部を形成すると共に、前記他端面側でかつ前記収容部の近傍に肉抜き部を形成したことを特徴とする電子機器制御装置。 An electronic device control apparatus comprising a bus bar assembly in which a plurality of conductor bus bars are integrally disposed and fixed on one end surface side of a resin-molded board body and a plurality of electronic components are mounted on the other end surface side. There,
A boss part having a screw insertion hole formed integrally therewith is provided on the outer peripheral part of the one end surface side of the substrate body, and a resin material build-up part is integrally provided on the outer surface of each boss part. While forming the height of the raised portion lower than the height of the boss portion,
An electronic device control characterized in that a concave housing portion for housing and holding an electronic component is formed on the other end surface side of the substrate body, and a lightening portion is formed on the other end surface side and in the vicinity of the housing portion. apparatus. 前記一端面側の肉盛部を、前記ねじ挿通孔が貫通形成されたボス部に結合させた立ち上がり壁によって形成したことを特徴とする請求項１に記載の電子機器制御装置。 2. The electronic device control device according to claim 1, wherein the build-up portion on the one end surface side is formed by a rising wall coupled to a boss portion through which the screw insertion hole is formed .
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