JP5453385B2 - ソルダペースト - Google Patents
ソルダペースト Download PDFInfo
- Publication number
- JP5453385B2 JP5453385B2 JP2011283761A JP2011283761A JP5453385B2 JP 5453385 B2 JP5453385 B2 JP 5453385B2 JP 2011283761 A JP2011283761 A JP 2011283761A JP 2011283761 A JP2011283761 A JP 2011283761A JP 5453385 B2 JP5453385 B2 JP 5453385B2
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- Prior art keywords
- solder paste
- flux
- solder
- discharge
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 title claims description 188
- 230000004907 flux Effects 0.000 claims description 119
- 239000000843 powder Substances 0.000 claims description 37
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims description 34
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 18
- 229940037312 stearamide Drugs 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 5
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 claims description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 2
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 claims description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 description 48
- 238000005476 soldering Methods 0.000 description 34
- 239000000203 mixture Substances 0.000 description 33
- 238000010438 heat treatment Methods 0.000 description 15
- 238000000926 separation method Methods 0.000 description 15
- 239000002245 particle Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 12
- 238000007650 screen-printing Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 230000008569 process Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004034 viscosity adjusting agent Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000010405 reoxidation reaction Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
ソルダペーストが塗布された基板等にチップ部品を搭載し、リフロー工程ではんだを溶解して電気的な接続を行うSMT工法(Surface Mount Technology:表面実装技術)において、電子基板や電子デバイスを組み立てるための接合工程の第一段階は、はんだ粉末とフラックスを混合して作成されるソルダペーストを接合部に適量供給することに始まる。
はんだ付を行うためのフラックスが持つ基本特性は、金属酸化物の除去、はんだ溶融時の再酸化の防止、はんだの表面張力の低下等の性能が必要である。このようなフラックスがソルダペーストに使用される場合は、比重の大きなはんだ粉末とフラックスを混合分散させた後、重力によるはんだ粉末の沈降を抑制する特性をフラックスが兼ね備えている必要がある。これをフラックスの分離抑制効果と言う。
ソルダペーストに使用されるフラックスの成分には、はんだ付けの加熱によって分解、蒸発しない成分が含まれ、はんだ付け後にフラックス残渣としてはんだ付け部の周辺に残留する。フラックス残渣が腐食性を持った場合、はんだ付け部を徐々に侵食し、マイグレーションによる短絡や、腐食によるはんだ付け部の脱落が発生する。
以下の表1に示す組成で組成1〜組成3のフラックスを調合した。フラックスの含有量が10%、11%、12%となるように、組成1〜組成3の各々のフラックスと、はんだ粉末(Sn-3Ag-0.5Cu 粒度25〜36μm)を混合して、表2に示すA〜Iの9種類のソルダペーストを作製した。そして、ソルダペーストが吐出法で使用される場合において、フラックスの含有量と、ソルダペーストの吐出量の関係について比較した。
ノズル :内径0.72mmφ
吐出圧 :0.2MPa.s
吐出時間 :0.5sec
インターバル:0.5sec
以下の表3に示す組成で組成4〜組成7のフラックスを調合し、上述した検討結果からフラックスの含有量が11%となるように、組成4〜組成7の各々のフラックスと、はんだ粉末(Sn-3Ag-0.5Cu 粒度25〜36μm)を混合して、表4に示すJ〜Mの4種類のソルダペーストを作製した。そして、上述した条件で吐出試験を実施して、ソルダペーストが吐出法で使用される場合において、フラックスの組成と、ソルダペーストの吐出量の関係について比較した。
以上の結果から、ソルダペーストの吐出量が最も多い条件となるポリアルキルメタクリレートの含有量を1%、ステアリン酸アミドの含有量を10%とした組成4のフラックスを、以下の表5に示す含有量とし、はんだ粉末(Sn-3Ag-0.5Cu)の粒径を、以下の表5に示す粒径としたN〜Vの9種類のソルダペーストを作製した。そして、上述した条件で吐出試験を実施して、ソルダペーストが吐出法で使用される場合において、フラックスの含有量及びはんだ粉末の粒径と、ソルダペーストの吐出量の関係について比較した。
Claims (2)
- はんだ粉末とフラックスが混合されて生成されたソルダペーストにおいて、
前記フラックスは、揮発性増粘材と、トリメチロールプロパンと、1,2,6-ヘキサントリオールと、オクタンジオールと、ポリアルキルメタクリレートと、ステアリン酸アミドのみから構成され、
ポリアルキルメタクリレートを1.0質量%以上〜2.0質量%未満で含むと共に、ステアリン酸アミドを5.0質量%以上〜15.0質量%未満で含み、
粘度を50〜150Pa.sとした
ことを特徴とするソルダペースト。 - 前記フラックスの含有量を、11質量%以上〜13質量%未満とした
ことを特徴とする請求項1記載のソルダペースト。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011283761A JP5453385B2 (ja) | 2011-12-26 | 2011-12-26 | ソルダペースト |
US14/368,760 US20150027589A1 (en) | 2011-12-26 | 2012-12-25 | Solder Paste |
PCT/JP2012/083444 WO2013099853A1 (ja) | 2011-12-26 | 2012-12-25 | ソルダペースト |
DE112012005672.8T DE112012005672B4 (de) | 2011-12-26 | 2012-12-25 | Lötpaste |
CN201280064828.2A CN104023904B (zh) | 2011-12-26 | 2012-12-25 | 焊膏 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011283761A JP5453385B2 (ja) | 2011-12-26 | 2011-12-26 | ソルダペースト |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013132654A JP2013132654A (ja) | 2013-07-08 |
JP5453385B2 true JP5453385B2 (ja) | 2014-03-26 |
Family
ID=48697338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011283761A Active JP5453385B2 (ja) | 2011-12-26 | 2011-12-26 | ソルダペースト |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150027589A1 (ja) |
JP (1) | JP5453385B2 (ja) |
CN (1) | CN104023904B (ja) |
DE (1) | DE112012005672B4 (ja) |
WO (1) | WO2013099853A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104625461B (zh) * | 2014-12-30 | 2016-03-23 | 株洲南车时代电气股份有限公司 | 一种高性能预成型焊片及其焊接方法 |
PL3357629T3 (pl) * | 2015-09-30 | 2021-10-25 | Origin Company, Limited | Pasta lutownicza do gazu redukującego i sposób wytwarzania produktu lutowanego |
MY176643A (en) * | 2016-11-22 | 2020-08-19 | Senju Metal Industry Co | Soldering method |
JP6337349B1 (ja) | 2017-08-28 | 2018-06-06 | 株式会社弘輝 | フラックス、ソルダペースト及び電子回路基板の製造方法 |
DE102021110298A1 (de) * | 2021-04-22 | 2022-10-27 | Infineon Technologies Ag | Bleifreies lotmaterial, schichtstruktur, verfahren zur herstellung eines lotmaterials und verfahren zur herstellung einer schichtstruktur |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02290693A (ja) * | 1989-04-27 | 1990-11-30 | Matsushita Electric Ind Co Ltd | はんだペーストおよびそれを用いた印刷配線板のはんだ付け方法 |
KR100254927B1 (ko) * | 1994-12-07 | 2000-05-01 | 오까베 히로시 | 납땜용 플럭스, 땜납 페이스트 및 이것을 사용한 납땜 방법 |
WO1999052672A1 (fr) * | 1998-04-14 | 1999-10-21 | Harima Chemicals, Inc. | Liant a base d'eau pour le brasage de materiau en aluminium, composition de brasage, et procede de brasage via cette composition |
US20020046627A1 (en) * | 1998-06-10 | 2002-04-25 | Hitoshi Amita | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product |
JP4343354B2 (ja) * | 1999-11-02 | 2009-10-14 | Agcセイミケミカル株式会社 | 半田用フラックス這い上がり防止剤組成物とその用途 |
JP2003264367A (ja) * | 2002-03-11 | 2003-09-19 | Tamura Kaken Co Ltd | リフローはんだ付用ソルダーペースト組成物及び回路基板 |
US6887319B2 (en) * | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
JP4079026B2 (ja) * | 2002-04-16 | 2008-04-23 | 唯知 須賀 | 無残渣ソルダペースト |
JP4757070B2 (ja) * | 2006-03-27 | 2011-08-24 | 富士通株式会社 | 半田付け用フラックス及び半導体素子の接合方法 |
US7767032B2 (en) * | 2006-06-30 | 2010-08-03 | W.C. Heraeus Holding GmbH | No-clean low-residue solder paste for semiconductor device applications |
JP5152727B2 (ja) * | 2007-12-21 | 2013-02-27 | ハリマ化成株式会社 | アルミニウムろう付け用ペースト組成物 |
JPWO2012118076A1 (ja) * | 2011-03-02 | 2014-07-07 | 千住金属工業株式会社 | 無残渣フラックス |
EP2682221B1 (en) * | 2011-03-02 | 2015-12-30 | Senju Metal Industry Co., Ltd | Flux |
-
2011
- 2011-12-26 JP JP2011283761A patent/JP5453385B2/ja active Active
-
2012
- 2012-12-25 WO PCT/JP2012/083444 patent/WO2013099853A1/ja active Application Filing
- 2012-12-25 CN CN201280064828.2A patent/CN104023904B/zh active Active
- 2012-12-25 US US14/368,760 patent/US20150027589A1/en not_active Abandoned
- 2012-12-25 DE DE112012005672.8T patent/DE112012005672B4/de active Active
Also Published As
Publication number | Publication date |
---|---|
WO2013099853A1 (ja) | 2013-07-04 |
DE112012005672B4 (de) | 2019-11-14 |
DE112012005672T5 (de) | 2014-10-09 |
CN104023904A (zh) | 2014-09-03 |
CN104023904B (zh) | 2016-01-20 |
JP2013132654A (ja) | 2013-07-08 |
US20150027589A1 (en) | 2015-01-29 |
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