JP5422653B2 - 薬液移送装置 - Google Patents
薬液移送装置 Download PDFInfo
- Publication number
- JP5422653B2 JP5422653B2 JP2011524877A JP2011524877A JP5422653B2 JP 5422653 B2 JP5422653 B2 JP 5422653B2 JP 2011524877 A JP2011524877 A JP 2011524877A JP 2011524877 A JP2011524877 A JP 2011524877A JP 5422653 B2 JP5422653 B2 JP 5422653B2
- Authority
- JP
- Japan
- Prior art keywords
- pump
- pumps
- discharge
- transfer device
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000126 substance Substances 0.000 title claims description 78
- 238000012546 transfer Methods 0.000 title claims description 52
- 239000007788 liquid Substances 0.000 title description 21
- 239000000243 solution Substances 0.000 claims description 36
- 239000008155 medical solution Substances 0.000 claims description 11
- 230000005484 gravity Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000010349 pulsation Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/0009—Special features
- F04B43/0054—Special features particularities of the flexible members
- F04B43/0063—Special features particularities of the flexible members bell-shaped flexible members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/0009—Special features
- F04B43/0045—Special features with a number of independent working chambers which are actuated successively by one mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/86131—Plural
- Y10T137/86139—Serial
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Reciprocating Pumps (AREA)
- Details Of Reciprocating Pumps (AREA)
Description
従来の薬液移送装置200は、対向する二つのベローズ又は隔膜(ダイアフラム)ポンプから構成される。従って、従来の薬液移送装置200は移送流量を増加させるためにはベローズ又は隔膜のサイズを大きくしなければならないが、構造上、又は費用上、実現することが難しい。
従来の薬液移送装置200はベローズポンプ210,212が横たわった状態で設けられるため、ポンプ210,212の内部(特に、ベローズポンプで伸張及び圧縮されるシワ部分)に多量の薬液300が常に残るようになる。ところで、一般的に薬液300は人体に危険なものが殆どであり、ポンプの交換のために連結具を着脱する際に薬品漏れによる人体損傷の危険が大きい。また、半導体のウエハーを洗浄又は洗滌するための微細な研磨剤が含まれている場合、ポンプ210,212内に残存して、ポンプ210,212の主要部品(ベローズポンプのシワ部分や隔膜ポンプの隔膜)を磨耗させる可能性が大きい。
従来の薬液移送装置200は、先に述べたように、2つのベローズポンプ210,212が互いに対称される吸入及び排出行程時点を有するように作動するため、大体均一に薬液を供給することができる。
102 ハウジング
104 吸入管
106 排出管
10,20,30,40ポンプ
12 吸入口
14 排出口
50 逆流防止弁
60 制御装置
70 空圧又は油圧機構
Claims (2)
- 互いに異なる吸入行程時点と排出行程時点を有する3つ以上のポンプを直列に配置し、
前記ポンプはベローズポンプであり、
前記ポンプの吸入口を統合連結する吸入管と、前記ポンプの排出口を統合連結する排出管とを含み、
前記ポンプは、ポンプ内部を流動する全ての薬液を残留させることなく排出できるよう、ポンプの吸入口及び排出口が重力方向を向くように設けられ、
前記ポンプの吸入行程及び排出行程の順序は、前記ポンプの配列順序と関係なくなされ、
前記ポンプは容量の順に並べて配置することを特徴とする、薬液移送装置。 - 前記ポンプの吸入行程及び排出行程の順序を制御する制御手段をさらに含むことを特徴とする請求項1に記載の薬液移送装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0084893 | 2008-08-29 | ||
KR1020080084893A KR100998602B1 (ko) | 2008-08-29 | 2008-08-29 | 약액 이송장치 |
PCT/KR2008/005329 WO2010024488A1 (en) | 2008-08-29 | 2008-09-10 | Chemical liquid feeding device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012501399A JP2012501399A (ja) | 2012-01-19 |
JP5422653B2 true JP5422653B2 (ja) | 2014-02-19 |
Family
ID=41721638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011524877A Active JP5422653B2 (ja) | 2008-08-29 | 2008-09-10 | 薬液移送装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8616865B2 (ja) |
JP (1) | JP5422653B2 (ja) |
KR (1) | KR100998602B1 (ja) |
CN (1) | CN102105968B (ja) |
WO (1) | WO2010024488A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106139471A (zh) * | 2015-04-21 | 2016-11-23 | 王治清 | 消防车及其消防设备 |
CN106151026A (zh) * | 2015-04-21 | 2016-11-23 | 王治清 | 一种揉动式增压泵 |
US11598331B2 (en) * | 2021-02-24 | 2023-03-07 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electroactive polymer actuator for multi-stage pump |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4302163A (en) * | 1979-10-30 | 1981-11-24 | Hope Henry F | Adjustable output pump for liquids |
JPS59105977A (ja) * | 1982-12-08 | 1984-06-19 | Hitachi Ltd | 直動型往復動ポンプ装置 |
JPS63106379A (ja) * | 1986-10-23 | 1988-05-11 | Sunstar Giken Kk | 流体圧送用ポンプシステム |
US4869397A (en) * | 1987-06-24 | 1989-09-26 | Liquipak International, Inc. | Adjustable fill motor assembly |
JPH0457324U (ja) * | 1990-09-27 | 1992-05-18 | ||
JP2001107872A (ja) * | 1999-10-13 | 2001-04-17 | Ebara Udylite Kk | 送液システムおよびこれにもちいるポンプユニット |
KR20020029976A (ko) | 2000-10-16 | 2002-04-22 | 박종섭 | 반도체 제조용 약액 공급펌프 |
JP3853641B2 (ja) | 2001-11-15 | 2006-12-06 | 株式会社コガネイ | 薬液供給装置およびその製造方法 |
KR20030048515A (ko) | 2001-12-12 | 2003-06-25 | 가부시키가이샤 고가네이 | 약액공급장치 |
EP1602830A1 (en) * | 2004-06-02 | 2005-12-07 | Ailand Corporation S.A. | Hydraulically driven multicylinder pumping machine |
JP2008002335A (ja) * | 2006-06-21 | 2008-01-10 | Kimoto Denshi Kogyo Kk | 送液ポンプ |
JP4547369B2 (ja) * | 2006-11-29 | 2010-09-22 | 株式会社コガネイ | 薬液供給装置 |
-
2008
- 2008-08-29 KR KR1020080084893A patent/KR100998602B1/ko active IP Right Grant
- 2008-09-10 CN CN200880130658.7A patent/CN102105968B/zh active Active
- 2008-09-10 US US13/056,574 patent/US8616865B2/en active Active
- 2008-09-10 JP JP2011524877A patent/JP5422653B2/ja active Active
- 2008-09-10 WO PCT/KR2008/005329 patent/WO2010024488A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US8616865B2 (en) | 2013-12-31 |
KR20100026064A (ko) | 2010-03-10 |
CN102105968A (zh) | 2011-06-22 |
CN102105968B (zh) | 2014-04-30 |
WO2010024488A1 (en) | 2010-03-04 |
JP2012501399A (ja) | 2012-01-19 |
US20110174400A1 (en) | 2011-07-21 |
KR100998602B1 (ko) | 2010-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5422653B2 (ja) | 薬液移送装置 | |
TWI513903B (zh) | 螺旋真空泵 | |
EP3805561B1 (en) | Diaphragm pump | |
JP2006049756A (ja) | 薬液供給システム | |
JP2007303402A (ja) | チューブフラムポンプ | |
KR101341653B1 (ko) | 진공흡입기능이 구비된 에어컴프레서 | |
EP2662574A2 (en) | Quick-release vacuum pump | |
KR101356579B1 (ko) | 컴팩트형 감압장치 | |
CN102233312A (zh) | 基板处理装置 | |
KR101066634B1 (ko) | 가스 흐름을 이용한 감압모듈 및 반도체 제조용 진공장치 | |
KR20200068037A (ko) | 기판 처리 장치 | |
JP2739083B2 (ja) | プランジヤーポンプ | |
JP2008014278A (ja) | 増圧可能なエア駆動による往復動ポンプ | |
WO2023042538A1 (ja) | 正負圧力切替回路 | |
JP6396274B2 (ja) | 液体供給装置および液体供給方法 | |
KR20100073338A (ko) | 반도체 공정챔버의 진공펌프 시스템 | |
JP6927927B2 (ja) | 酸素供給装置 | |
KR101328371B1 (ko) | 웨이퍼 포토레지스트 디스펜서 | |
CN106764435A (zh) | 一种充氧设备 | |
JP2014134110A (ja) | エゼクタ式真空ポンプ | |
JP4301975B2 (ja) | ダイヤフラムポンプ | |
KR20060072884A (ko) | 미니멈 플로우 라인을 가지는 유체 펌핑 시스템 | |
KR101471808B1 (ko) | 와류방지 기능이 구비되는 수중펌프 | |
JP2008150994A (ja) | ダイヤフラムポンプ | |
JP2016211441A (ja) | 真空ポンプの消費電力抑制装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121114 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121127 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130820 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130920 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131105 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131125 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5422653 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |