JP5408733B2 - ランプアセンブリー - Google Patents
ランプアセンブリー Download PDFInfo
- Publication number
- JP5408733B2 JP5408733B2 JP2010211677A JP2010211677A JP5408733B2 JP 5408733 B2 JP5408733 B2 JP 5408733B2 JP 2010211677 A JP2010211677 A JP 2010211677A JP 2010211677 A JP2010211677 A JP 2010211677A JP 5408733 B2 JP5408733 B2 JP 5408733B2
- Authority
- JP
- Japan
- Prior art keywords
- heat conducting
- conducting member
- fins
- lamp assembly
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 claims description 21
- 238000004512 die casting Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 238000001125 extrusion Methods 0.000 claims description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
20 接続部材
201 放熱フィン
202 穿孔
30 放熱モジュール
31 第一熱伝導部材
311 第一フィン
312 開孔
32 第二熱伝導部材
321 第二フィン
322 基板
323 結合部
324 台座(ペデスタル)
40 シールド
50 発光素子
H スルーホール
Claims (9)
- ランプアセンブリーであって、
第一熱伝導部材と、第二熱伝導部材とを有し、前記第一熱伝導部材及び第二熱伝導部材はダイカストプロセスによって作製され、前記第一熱伝導部材は複数の第一フィンを有し、前記第二熱伝導部材は複数の第二フィンと、基板と台座を有し、前記複数の第二フィンと前記台座は前記基板の反対側にそれぞれ位置し、前記複数の第二フィンは基板上に設置し、且つ前記複数の第一フィンの夫々が二つの前記第二フィンの間に配置され、前記複数の第一フィンは前記基板と接触し、前記複数の第二フィンは前記第一熱伝導部材と接触している放熱モジュールと、
前記第二熱伝導部材の前記台座上に設置される発光素子と、
前記発光素子に電気接続されるアダプターと、
前記第一熱伝導部材を突き抜けて前記第二熱伝導部材と前記アダプターとを接続し、金属押出プロセスによって作製され、且つ複数の放熱フィンを有する接続部材と、
を含むランプアセンブリー。 - 前記基板は複数のスルーホールを有する請求項1に記載のランプアセンブリー。
- 前記複数のスルーホールは前記台座の周りに分布される請求項2に記載のランプアセンブリー。
- 前記第一熱伝導部材及び第二熱伝導部材はアルミニウムダイカストプロセスによって作製される請求項1に記載のランプアセンブリー。
- 前記接続部材はアルミニウム押出法によって作製される請求項1に記載のランプアセンブリー。
- 前記複数の第一フィンは前記第一熱伝導部材上に、前記複数の第二フィンは前記第二熱伝導部材上に、それぞれ、放射状に配置される請求項1に記載のランプアセンブリー。
- 前記発光素子は発光ダイオードである請求項1に記載のランプアセンブリー。
- 前記アダプターはE27アダプターである請求項1に記載のランプアセンブリー。
- 前記第二熱伝導部材に接続され、且つ前記発光素子を覆うシールドを更に含む請求項1に記載のランプアセンブリー。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099112125 | 2010-04-19 | ||
TW099112125A TW201137276A (en) | 2010-04-19 | 2010-04-19 | Lamp assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011228253A JP2011228253A (ja) | 2011-11-10 |
JP5408733B2 true JP5408733B2 (ja) | 2014-02-05 |
Family
ID=44465368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010211677A Active JP5408733B2 (ja) | 2010-04-19 | 2010-09-22 | ランプアセンブリー |
Country Status (4)
Country | Link |
---|---|
US (1) | US8164236B2 (ja) |
EP (1) | EP2378184B1 (ja) |
JP (1) | JP5408733B2 (ja) |
TW (1) | TW201137276A (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI407049B (zh) | 2010-04-19 | 2013-09-01 | Ind Tech Res Inst | 燈具結構 |
CN102679292A (zh) * | 2011-03-11 | 2012-09-19 | 马士科技有限公司 | 用于灯具的散热装置及包括该散热装置的led灯具 |
KR101399750B1 (ko) * | 2012-05-15 | 2014-05-27 | 주식회사 포스코엘이디 | 광 반도체 기반 조명장치 |
EP2728249A4 (en) | 2011-07-01 | 2015-06-24 | Posco Led Co Ltd | OPTICAL LIGHTING APPARATUS BASED ON SEMICONDUCTORS |
JP6052573B2 (ja) * | 2012-04-11 | 2016-12-27 | 東芝ライテック株式会社 | 光半導体光源及び車両用照明装置 |
JP5988135B2 (ja) * | 2012-04-11 | 2016-09-07 | 東芝ライテック株式会社 | 光半導体光源及び車両用照明装置 |
WO2013153938A1 (ja) * | 2012-04-11 | 2013-10-17 | 東芝ライテック株式会社 | 光半導体光源及び車両用照明装置 |
CN104321589A (zh) * | 2012-05-23 | 2015-01-28 | 普司科Led股份有限公司 | 光学半导体照明装置 |
GB201209256D0 (en) * | 2012-05-25 | 2012-07-04 | Jcc Lighting Products Ltd | Light fittings |
US20140104858A1 (en) * | 2012-10-17 | 2014-04-17 | Lighting Science Group Corporation | Lighting device with integrally molded base and associated methods |
JP5435680B1 (ja) * | 2013-02-04 | 2014-03-05 | 和彦 田村 | ヒートシンクおよび排熱装置 |
US10030819B2 (en) * | 2014-01-30 | 2018-07-24 | Cree, Inc. | LED lamp and heat sink |
CN104197287B (zh) * | 2014-08-07 | 2017-11-17 | 深圳市金曼斯光电科技有限公司 | 一种散热组件 |
US10260718B2 (en) * | 2015-04-30 | 2019-04-16 | Hubbell Incorporated | Area luminaire |
US11134618B2 (en) * | 2016-08-30 | 2021-10-05 | Current Lighting Solutions, Llc | Luminaire including a heat dissipation structure |
USD989359S1 (en) * | 2021-07-21 | 2023-06-13 | Shanghai Sansi Electronic Engineering Co. Ltd. | Bulb |
USD1014816S1 (en) * | 2023-04-26 | 2024-02-13 | Shenzhen Adub Technology Co., Ltd | Work light |
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JPH0662547U (ja) * | 1993-02-15 | 1994-09-02 | 昭和アルミニウム株式会社 | 放熱器 |
US6787999B2 (en) | 2002-10-03 | 2004-09-07 | Gelcore, Llc | LED-based modular lamp |
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US7144140B2 (en) * | 2005-02-25 | 2006-12-05 | Tsung-Ting Sun | Heat dissipating apparatus for lighting utility |
TWM278059U (en) | 2005-04-14 | 2005-10-11 | Shian-Rung Huang | Heat sink of light emmiting diode lamp |
JP4515391B2 (ja) * | 2006-01-17 | 2010-07-28 | 古河電気工業株式会社 | 車両用前照灯 |
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CN101836042B (zh) * | 2007-09-21 | 2014-11-05 | 库帕技术公司 | 发光二极管凹入式灯具 |
CN101424394B (zh) | 2007-11-02 | 2010-09-08 | 富准精密工业(深圳)有限公司 | 散热装置及其应用的发光二极管灯具 |
TWM330426U (en) | 2007-11-05 | 2008-04-11 | Unity Opto Technology Co Ltd | Heat dissipation structure of lamp |
US7637635B2 (en) * | 2007-11-21 | 2009-12-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp with a heat sink |
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TWM332793U (en) * | 2007-11-28 | 2008-05-21 | Cooler Master Co Ltd | Heat radiating structure and the lighting apparatus |
CN101451694B (zh) * | 2007-12-07 | 2012-10-10 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
CN101457913B (zh) | 2007-12-12 | 2011-09-28 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
JP4945433B2 (ja) * | 2007-12-28 | 2012-06-06 | シャープ株式会社 | 照明装置 |
US8382329B2 (en) * | 2008-05-15 | 2013-02-26 | Innovx Group Llc | Adjustable beam lamp |
US7824077B2 (en) * | 2008-06-30 | 2010-11-02 | Che-Kai Chen | Lamp structure |
US7575346B1 (en) | 2008-07-22 | 2009-08-18 | Sunonwealth Electric Machine Industry Co., Ltd. | Lamp |
JP2010086713A (ja) * | 2008-09-30 | 2010-04-15 | Toshiba Lighting & Technology Corp | 電球形ランプ |
TWM353309U (en) | 2008-09-12 | 2009-03-21 | Shi-Ming Chen | Improved tight fitting structure for annular heat dissipating device |
JP3148247U (ja) * | 2008-10-20 | 2009-02-12 | 光碁科技股▲ふん▼有限公司 | 灯筒無しの組立て式嵌設灯 |
-
2010
- 2010-04-19 TW TW099112125A patent/TW201137276A/zh unknown
- 2010-07-08 EP EP10007057.2A patent/EP2378184B1/en active Active
- 2010-07-12 US US12/834,843 patent/US8164236B2/en active Active
- 2010-09-22 JP JP2010211677A patent/JP5408733B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW201137276A (en) | 2011-11-01 |
US20110254425A1 (en) | 2011-10-20 |
US8164236B2 (en) | 2012-04-24 |
JP2011228253A (ja) | 2011-11-10 |
EP2378184A3 (en) | 2014-12-10 |
EP2378184A2 (en) | 2011-10-19 |
EP2378184B1 (en) | 2015-08-26 |
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