JP5375223B2 - Circuit structure and electrical junction box - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit structure where a warp is suppressed, and an electrical junction box using this circuit structure. <P>SOLUTION: The circuit structure 12 includes a circuit board 17 and a first conductive member 22, which consists of a metallic plate material and is stacked on the rear 21 of the circuit board 17. A through hole 25 on the board side is created in the circuit board 17, and a through hole 26 on the conductive member side is created on the first conductive member 22 in a position that corresponds to the through hole 25 on the board side in a state of being stacked on the circuit board 17. In the through hole 25 on the board side and the through hole 26 on the conductive member side, the first insulator 23, which assembles the circuit board 17 and the first conductive member 22 in their lamination states, is arranged through the through hole 25 on the board side and the though hole 26 on the conductive member side. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は、回路構成体、及び電気接続箱に関する。   The present invention relates to a circuit structure and an electrical junction box.

従来、車両に搭載されて、ホーン、ランプ等の車載電装品のスイッチングを実行する電気接続箱が知られている。このものは、ケース内に回路構成体を収容してなる。このような電気接続箱として、例えば特許文献１に記載のものが挙げられる。   2. Description of the Related Art Conventionally, an electrical junction box that is mounted on a vehicle and performs switching of in-vehicle electrical components such as a horn and a lamp is known. In this case, a circuit structure is accommodated in a case. As such an electrical junction box, the thing of patent document 1 is mentioned, for example.

特開２００４−２３８７０号公報Japanese Patent Laid-Open No. 2004-23870

上記の回路構成体として、例えば、表面にプリント配線技術により導電路が形成された回路基板の裏面に、バスバーを積層してなるものが考えられる。これにより、回路基板の配線密度を向上させることができる。   As said circuit structure, what laminated | stacked a bus-bar on the back surface of the circuit board by which the conductive path was formed in the surface by the printed wiring technique is considered, for example. Thereby, the wiring density of a circuit board can be improved.

しかしながら上記の構成によると、回路基板を構成する材料（合成樹脂等）と、バスバーを構成する金属材料とは、線膨張率が異なる。このため、電気接続箱の周囲の温度が変化することにより回路基板及びバスバーが延びると、回路基板の長さ寸法と、バスバーの長さ寸法とが異なってしまう。この結果、回路構成体が反ることが懸念される。   However, according to the above configuration, the linear expansion coefficient is different between the material (synthetic resin or the like) constituting the circuit board and the metal material constituting the bus bar. For this reason, when the circuit board and the bus bar extend due to a change in the temperature around the electrical junction box, the length dimension of the circuit board and the length dimension of the bus bar are different. As a result, there is a concern that the circuit structure is warped.

本発明は上記のような事情に基づいて完成されたものであって、反りが抑制された回路構成体、及びこの回路構成体を用いた電気接続箱を提供することを目的とする。   This invention is completed based on the above situations, Comprising: It aims at providing the circuit structure body by which curvature was suppressed, and the electrical junction box using this circuit structure body.

本発明は、回路基板と、金属板材からなると共に前記回路基板の一方の面に積層された導電部材と、を備えた回路構成体であって、前記回路基板には基板側貫通孔が形成されており、前記導電部材には前記回路基板に積層された状態で前記基板側貫通孔に対応する位置に導電部材側貫通孔が形成されており、前記基板側貫通孔及び前記導電部材側貫通孔の内部には前記基板側貫通孔及び前記導電部材側貫通孔を貫通して前記回路基板と前記導電部材とを積層状態で組み付ける合成樹脂部材が配されていることを特徴とする。   The present invention is a circuit structure including a circuit board and a conductive member made of a metal plate and laminated on one surface of the circuit board, wherein the circuit board has a substrate-side through hole formed therein. A conductive member side through hole is formed in the conductive member at a position corresponding to the substrate side through hole in a state where the conductive member is laminated on the circuit board, the substrate side through hole and the conductive member side through hole Is provided with a synthetic resin member that passes through the substrate side through hole and the conductive member side through hole and assembles the circuit board and the conductive member in a stacked state.

また、本発明は、ケース内に、前記回路構成体を収容してなることを特徴とする。   Further, the present invention is characterized in that the circuit structure is housed in a case.

本発明によれば、回路基板と、導電部材とは、基板側貫通孔及び導電部材側貫通孔において、その内部に配された合成樹脂材によって、積層状態で組み付けられる。これにより、回路基板と、導電部材とは、両部材が全面に亘って固定されている場合に比べて、その板面に平行な方向について、相対的に変位可能になっている。このため、周囲の温度変化によって、回路基板及び導電部材が、その板面に平行な方向について延びても、回路基板の延びた方向についての長さ寸法と、導電部材の延びた方向についての長さ寸法との差を、回路基板及び導電部材の板面に平行な方向に逃がすことができる。この結果、回路構成体が反ることを抑制できる。   According to the present invention, the circuit board and the conductive member are assembled in a laminated state by the synthetic resin material disposed in the board side through hole and the conductive member side through hole. Thereby, compared with the case where both members are being fixed over the whole surface, the circuit board and the conductive member are relatively displaceable in a direction parallel to the plate surface. For this reason, even if the circuit board and the conductive member extend in the direction parallel to the plate surface due to a change in ambient temperature, the length dimension in the direction in which the circuit board extends and the length in the direction in which the conductive member extends. The difference from the height dimension can be released in a direction parallel to the plate surface of the circuit board and the conductive member. As a result, it is possible to suppress the circuit structure from warping.

本発明の実施態様としては以下の態様が好ましい。
前記合成樹脂部材は、前記回路構成体と前記導電部材とを積層した状態でモールド成形してなることが好ましい。 As embodiments of the present invention, the following embodiments are preferable.
The synthetic resin member is preferably molded by laminating the circuit component and the conductive member.

上記の態様によれば、モールド成形という簡易な手法により回路構成体と導電部材とを積層状態で固定できる。   According to said aspect, a circuit structure body and an electrically-conductive member can be fixed in a lamination | stacking state with the simple method of molding.

前記合成樹脂部材は、前記基板側貫通孔及び前記導電部材側貫通孔の内部に挿通された樹脂ピンであることが好ましい。   It is preferable that the synthetic resin member is a resin pin inserted into the substrate side through hole and the conductive member side through hole.

上記の態様によれば、樹脂ピンを基板側貫通孔及び導電部材側貫通孔の内部に挿通するという簡易な手法により、回路構成体と導電部材とを積層状態で固定できる。   According to the above aspect, the circuit component and the conductive member can be fixed in a laminated state by a simple method of inserting the resin pin into the substrate side through hole and the conductive member side through hole.

本発明によれば、回路構成体が反ることを抑制できる。   ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a circuit structure body warps.

本発明の実施形態１に係る電気接続箱を示す全体斜視図1 is an overall perspective view showing an electrical junction box according to Embodiment 1 of the present invention. 電気接続箱を示す分解斜視図Exploded perspective view showing electrical junction box 電気接続箱を示す正面図Front view showing the electrical junction box 図３におけるＩＶ−ＩＶ線断面図IV-IV line sectional view in FIG. 図３におけるＶ−Ｖ線断面図VV line sectional view in FIG. 回路基板に第１導電部材及び第２導電部材を組み付けた状態を示す正面図The front view which shows the state which assembled | attached the 1st conductive member and the 2nd conductive member to the circuit board. 図６におけるＶＩＩ−ＶＩＩ線断面図VII-VII line sectional view in FIG. 図６におけるＶＩＩＩ−ＶＩＩＩ線断面図VIII-VIII sectional view taken on the line in FIG. 図６におけるＩＸ−ＩＸ線断面図IX-IX line sectional view in FIG. 第１導電部材と、第２導電部材との組み付け状態を示す斜視図The perspective view which shows the assembly | attachment state of a 1st conductive member and a 2nd conductive member 回路基板と、第１導電部材及び第２導電部材との組み付け状態を示す斜視図The perspective view which shows the assembly | attachment state of a circuit board, a 1st conductive member, and a 2nd conductive member. 回路基板と、第１導電部材及び第２導電部材とを組み付けた状態を示す斜視図The perspective view which shows the state which assembled | attached the circuit board, the 1st conductive member, and the 2nd conductive member. 下型に第１導電部材を載置する状態を示す断面図Sectional drawing which shows the state which mounts the 1st electroconductive member in a lower mold | type 第１導電部材に第２導電部材を載置する状態を示す断面図Sectional drawing which shows the state which mounts a 2nd conductive member in a 1st conductive member 第１導電部材及び第２導電部材を上型及び下型内に収容した状態を示す断面図Sectional drawing which shows the state which accommodated the 1st conductive member and the 2nd conductive member in the upper mold | type and the lower mold | type. 回路基板と、第１導電部材及び第２導電部材との組み付け状態を示す断面図Sectional drawing which shows the assembly | attachment state of a circuit board, a 1st conductive member, and a 2nd conductive member 回路基板と、第１導電部材及び第２導電部材とを組み付けた状態を示す断面図Sectional drawing which shows the state which assembled | attached the circuit board, the 1st conductive member, and the 2nd conductive member. 本発明の実施形態２に係る回路構成体において、第１導電部材と第２導電部材を組み付けた状態を示す断面図Sectional drawing which shows the state which assembled | attached the 1st conductive member and the 2nd conductive member in the circuit structure based on Embodiment 2 of this invention.

＜実施形態１＞
本発明の実施形態１を、図１ないし図１７を参照しつつ説明する。本実施形態は、車載用の電気接続箱１０であって、電源（図示せず）と、ランプ、ホーン等の車載電装品（図示せず）との間に配設されて、車載電装品のスイッチングを実行する。この電気接続箱１０は、合成樹脂製のケース１１内に回路構成体１２を収容してなる。なお、以下の説明においては、図４における左側を表側とし、右側を裏側として説明する。 <Embodiment 1>
Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 17. The present embodiment is an on-vehicle electrical junction box 10, which is disposed between a power source (not shown) and on-vehicle electrical components (not shown) such as a lamp and a horn. Perform switching. The electrical junction box 10 is configured by housing a circuit component 12 in a case 11 made of synthetic resin. In the following description, the left side in FIG. 4 is described as the front side, and the right side is described as the back side.

（ケース１１）
図４に示すように、ケース１１は、表側（図４における左側）に開口するケース本体１３と、このケース本体１３の開口を表側から塞ぐカバー１４と、を備える。図２に示すように、ケース本体１３は、表裏方向（図２における上下方向）から見て略五角形状をなしている。 (Case 11)
As shown in FIG. 4, the case 11 includes a case main body 13 that opens to the front side (left side in FIG. 4), and a cover 14 that closes the opening of the case main body 13 from the front side. As shown in FIG. 2, the case body 13 has a substantially pentagonal shape when viewed from the front and back directions (vertical direction in FIG. 2).

図４に示すように、カバー１４には、図４における上端部寄りの位置に、図４における下方に開口すると共に、図示しない相手側コネクタが嵌合可能なコネクタ部１５が形成されている。コネクタ部１５にはコネクタ端子１６がコネクタ部１５と一体にモールド成形されている。図２に示すように、カバー１４には、複数のコネクタ部１５がカバー１４と一体に形成されている。   As shown in FIG. 4, the cover 14 is formed with a connector portion 15 that opens downward in FIG. 4 and can be fitted with a mating connector (not shown) at a position near the upper end portion in FIG. Connector terminals 16 are molded integrally with the connector portion 15 in the connector portion 15. As shown in FIG. 2, the cover 14 has a plurality of connector portions 15 formed integrally with the cover 14.

図４に示すように、ケース本体１３の側壁の端縁と、カバー１４の側壁の端縁とは、互いに当接された状態で超音波溶着によって接合されている。これにより、ケース本体１３とカバー１４とは一体に組み付けられる。   As shown in FIG. 4, the end edge of the side wall of the case body 13 and the end edge of the side wall of the cover 14 are joined by ultrasonic welding while being in contact with each other. Thereby, the case main body 13 and the cover 14 are assembled | attached integrally.

（回路構成体１２）
図２に示すように、回路構成体１２は、回路基板１７と、回路基板１７の表面１８に実装された半導体リレー１９と、を有する。回路基板１７の表面１８には、プリント配線技術により導電路（図示せず）が形成されている。回路基板１７は、表裏方向（図２における上下方向）から見て、略矩形状をなしている。 (Circuit structure 12)
As shown in FIG. 2, the circuit structure 12 includes a circuit board 17 and a semiconductor relay 19 mounted on the surface 18 of the circuit board 17. A conductive path (not shown) is formed on the surface 18 of the circuit board 17 by a printed wiring technique. The circuit board 17 has a substantially rectangular shape when viewed from the front and back direction (vertical direction in FIG. 2).

図４に示すように、回路基板１７の導電路には、半導体リレー１９の側縁から外方（本実施形態では図４における下方）に突出するゲート端子２０が、半田付け等の公知の手法により電気的に接続されている。   As shown in FIG. 4, a gate terminal 20 that protrudes outward (downward in FIG. 4 in this embodiment) from the side edge of the semiconductor relay 19 is provided in the conductive path of the circuit board 17 in a known method such as soldering. Are electrically connected.

（第１導電部材２２）
図４に示すように、回路基板１７の裏面（特許請求の範囲に記載の一方の面に相当）２１には、金属板材からなる第１導電部材（特許請求の範囲に記載の導電部材に相当）２２が積層されている。第１導電部材２２は、銅、銅合金等の金属板材に鍛造、鋳造、プレス加工、切削加工、圧延加工等を実行することにより所定の形状に形成される。なお、回路基板１７の線膨張率と、第１導電部材２２の線膨張率とは異なっている。 (First conductive member 22)
As shown in FIG. 4, a first conductive member (corresponding to the conductive member described in the claims) made of a metal plate is formed on the back surface (corresponding to one surface described in the claims) 21 of the circuit board 17. ) 22 is laminated. The first conductive member 22 is formed in a predetermined shape by performing forging, casting, pressing, cutting, rolling, or the like on a metal plate material such as copper or a copper alloy. The linear expansion coefficient of the circuit board 17 and the linear expansion coefficient of the first conductive member 22 are different.

図４に示すように、第１導電部材２２は、回路基板１７のうち図４における上端部寄りの位置に配設されている。回路基板１７のうち図４における上端部寄りの位置には開口部２４が回路基板１７を貫通して形成されている。第１導電部材２２は、開口部２４を裏側（図４における右側）から塞ぐように配設されており、開口部２４内には第１導電部材２２の少なくとも一部が配されている。   As shown in FIG. 4, the first conductive member 22 is disposed at a position near the upper end portion in FIG. 4 of the circuit board 17. An opening 24 is formed through the circuit board 17 at a position near the upper end in FIG. The first conductive member 22 is disposed so as to close the opening 24 from the back side (the right side in FIG. 4), and at least a part of the first conductive member 22 is disposed in the opening 24.

図６に示すように、回路基板１７には、図６における開口部２４の上方及び下方に、回路基板１７を貫通する複数（本実施形態では８つ）の基板側貫通孔２５が形成されている。基板側貫通孔２５の断面形状は円形状をなしている。   As shown in FIG. 6, the circuit board 17 has a plurality of (eight in this embodiment) board-side through holes 25 penetrating the circuit board 17 above and below the opening 24 in FIG. Yes. The cross-sectional shape of the substrate side through hole 25 is circular.

また、図１１に示すように、第１導電部材２２には、回路基板１７の正規位置に第１導電部材２２を組み付けた状態で、回路基板１７の基板側貫通孔２５に対応する位置に、複数（本実施形態では８つ）の導電部材側貫通孔２６が形成されている。導電部材側貫通孔２６の断面形状は円形状をなしている。基板側貫通孔２５の内径寸法と、導電部材側貫通孔２６の内径寸法とは、実質的に同じ寸法に設定されている。   In addition, as shown in FIG. 11, the first conductive member 22 is positioned at a position corresponding to the board-side through hole 25 of the circuit board 17 in a state where the first conductive member 22 is assembled to the regular position of the circuit board 17. A plurality (eight in this embodiment) of conductive member side through holes 26 are formed. The cross-sectional shape of the conductive member side through hole 26 is circular. The inner diameter dimension of the substrate side through hole 25 and the inner diameter dimension of the conductive member side through hole 26 are set to substantially the same dimension.

図１７に示すように、基板側貫通孔２５、及び導電部材側貫通孔２６の双方には、モールド成形により第１絶縁部２３（特許請求の範囲に記載の合成樹脂部材に相当）を構成する合成樹脂材が充填されている。第１絶縁部２３は、基板側貫通孔２５の内周面及び導電部材側貫通孔２６の内周面の双方に密着している。この第１絶縁部２３により、回路基板１７と第１導電部材２２とが積層された状態で組み付けられるようになっている。回路基板１７と、第１導電部材２２とは、基板側貫通孔２５及び導電部材側貫通孔２６とは異なる位置においては、その板面に平行な方向について、相対的に変位可能になっている。   As shown in FIG. 17, the first insulating portion 23 (corresponding to the synthetic resin member described in the claims) is formed in both the substrate side through hole 25 and the conductive member side through hole 26 by molding. Filled with synthetic resin material. The first insulating portion 23 is in close contact with both the inner peripheral surface of the substrate side through hole 25 and the inner peripheral surface of the conductive member side through hole 26. By the first insulating portion 23, the circuit board 17 and the first conductive member 22 are assembled in a stacked state. The circuit board 17 and the first conductive member 22 are relatively displaceable in a direction parallel to the plate surface at a position different from the board side through hole 25 and the conductive member side through hole 26. .

図４に示すように、回路基板１７の開口部２４に対応する位置には、表側（図４における左側）に突出する凸部２７が形成されている。凸部２７のうち、第１導電部材２２の板面から立ち上がる側面２８は、第１導電部材２２の板面から実質的に垂直に突出している。実質的に垂直とは、凸部２７の側面２８と第１導電部材２２の板面とが垂直である場合を含むと共に、垂直でなくとも、略垂直であると認められる場合を含む。   As shown in FIG. 4, a convex portion 27 protruding to the front side (left side in FIG. 4) is formed at a position corresponding to the opening 24 of the circuit board 17. Of the convex portion 27, the side surface 28 rising from the plate surface of the first conductive member 22 protrudes substantially vertically from the plate surface of the first conductive member 22. The term “substantially vertical” includes the case where the side surface 28 of the convex portion 27 and the plate surface of the first conductive member 22 are vertical, and includes the case where it is recognized that the side surface 28 is substantially vertical.

図６に示すように、凸部２７は、図６における左右方向に細長く延びて形成されている。開口部２４の口縁は、凸部２７の端縁に倣った形状に形成されている。   As shown in FIG. 6, the convex portion 27 is formed to be elongated in the left-right direction in FIG. The lip of the opening 24 is formed in a shape that follows the end edge of the convex portion 27.

図４に示すように、凸部２７の突出端面２９（図４における左端面）は、回路基板１７の表面１８と実質的に同じ高さ位置に配されている。   As shown in FIG. 4, the protruding end surface 29 (left end surface in FIG. 4) of the convex portion 27 is disposed at the substantially same height as the surface 18 of the circuit board 17.

図４に示すように、凸部２７の突出端面２９には、半導体リレー１９の裏面（図４における右側面）に形成されたソース端子３０が半田付け等の公知の手法により電気的に接続されている。   As shown in FIG. 4, a source terminal 30 formed on the back surface (right side surface in FIG. 4) of the semiconductor relay 19 is electrically connected to the projecting end surface 29 of the convex portion 27 by a known method such as soldering. ing.

なお、図１５に示すように、第１導電部材２２には、後述する第２導電部材３２とのモールド成形時に金型が挿通される金型挿通孔３１が、第１導電部材２２を貫通して形成されている。   As shown in FIG. 15, the first conductive member 22 has a mold insertion hole 31 through which the mold is inserted when molding with the second conductive member 32 described later. Is formed.

（第２導電部材３２）
図４に示すように、第１導電部材２２のうち回路基板１７の開口部２４に対応する位置には、第１導電部部材の表面（回路基板１７側の面であって、図４における左側面）に、金属板材からなる第２導電部材３２が積層されている。第２導電部材３２は、銅、銅合金等の金属板材に鍛造、鋳造、プレス加工、切削加工、圧延加工等を実行することにより所定の形状に形成される。第１導電部材２２と第２導電部材３２との間には、絶縁性の合成樹脂材からなる第２絶縁部３３が介されている。第２絶縁部３３は、第１導電部材２２と第２導電部材３２とをモールド成形することにより形成される。 (Second conductive member 32)
As shown in FIG. 4, a position corresponding to the opening 24 of the circuit board 17 in the first conductive member 22 is located on the surface of the first conductive member (the surface on the circuit board 17 side, the left side in FIG. 4). The second conductive member 32 made of a metal plate is laminated on the surface). The second conductive member 32 is formed into a predetermined shape by performing forging, casting, pressing, cutting, rolling, or the like on a metal plate material such as copper or copper alloy. A second insulating portion 33 made of an insulating synthetic resin material is interposed between the first conductive member 22 and the second conductive member 32. The second insulating portion 33 is formed by molding the first conductive member 22 and the second conductive member 32.

図６に示すように、１つの第１導電部材２２に、複数（本実施形態においては５つ）の第２導電部材３２が積層されている。各第２導電部材３２は図６における左右方向に間隔を空けて並んで配されている。各第２導電部材３２の隙間には、第２絶縁部３３を構成する合成樹脂材が充填されている。また、回路基板１７に形成された開口部２４の口縁は、第２導電部材３２の端縁に倣った形状に形成されている。   As shown in FIG. 6, a plurality of (in the present embodiment, five) second conductive members 32 are stacked on one first conductive member 22. The second conductive members 32 are arranged side by side in the left-right direction in FIG. A gap between each second conductive member 32 is filled with a synthetic resin material constituting the second insulating portion 33. Further, the edge of the opening 24 formed in the circuit board 17 is formed in a shape following the edge of the second conductive member 32.

図４に示すように、第２導電部材３２の表面（図４における左側面）には、半導体リレー１９の側縁から外方（本実施形態では図４における上方）に突出するドレイン端子３４が、半田付け等の公知の手法により電気的に接続されている。第２導電部材３２の表面は、ドレイン端子３４が接続される接続面３５とされる。この接続面３５は、回路基板１７の表面１８（図４における右側面）と、実質的に同じ高さに配されている。また、隣り合う第２導電部材３２の隙間に充填された第２絶縁部３３の表面（図４における右側面）も、回路基板１７の表面１８と実質的に同じ高さに配されている。なお、実質的に同じ高さとは、第２導電部材３２の接続面３５、および第２絶縁部３３材の表面と、回路基板１７の表面１８とが、同じ高さである場合を含むと共に、同じ高さでなくとも、略同じと認められる程度である場合を含む。   As shown in FIG. 4, a drain terminal 34 protruding outward (upward in FIG. 4 in this embodiment) from the side edge of the semiconductor relay 19 is formed on the surface (left side surface in FIG. 4) of the second conductive member 32. They are electrically connected by a known method such as soldering. The surface of the second conductive member 32 is a connection surface 35 to which the drain terminal 34 is connected. The connection surface 35 is disposed at substantially the same height as the surface 18 of the circuit board 17 (the right side surface in FIG. 4). Further, the surface of the second insulating portion 33 (the right side surface in FIG. 4) filled in the gap between the adjacent second conductive members 32 is also disposed at substantially the same height as the surface 18 of the circuit board 17. The substantially the same height includes the case where the connection surface 35 of the second conductive member 32 and the surface of the second insulating portion 33 material and the surface 18 of the circuit board 17 have the same height, Including the case where the height is almost the same even if it is not the same height.

図８及び図９には、回路基板１７、第１導電部材２２、第２導電部材３２、及び第２絶縁部３３が積層された積層体の断面図を示す。本実施形態においては、回路基板１７の表面１８、第１導電部材２２に形成された凸部２７の突出端面２９、第２絶縁部３３の表面、及び第２絶縁部３３の接続面３５は、実質的に面一に配されている。   8 and 9 are cross-sectional views of a stacked body in which the circuit board 17, the first conductive member 22, the second conductive member 32, and the second insulating portion 33 are stacked. In the present embodiment, the surface 18 of the circuit board 17, the protruding end surface 29 of the convex portion 27 formed on the first conductive member 22, the surface of the second insulating portion 33, and the connection surface 35 of the second insulating portion 33 are: It is virtually flush.

（コネクタ端子１６の接続構造）
上述したように、コネクタ部１５にはコネクタ端子１６がコネクタ部１５と一体にモールド成形されており、コネクタ端子１６の一方の端部はコネクタ部１５内に位置して配されている。図４に示すように、コネクタ端子１６の他方の端部は、裏側（図４における右側）に向けて曲げ形成されると共に裏側に向けてコネクタ部１５から突出している。 (Connector terminal 16 connection structure)
As described above, the connector terminal 16 is molded integrally with the connector part 15 in the connector part 15, and one end part of the connector terminal 16 is disposed in the connector part 15. As shown in FIG. 4, the other end portion of the connector terminal 16 is bent toward the back side (right side in FIG. 4) and protrudes from the connector portion 15 toward the back side.

図４に示すように、複数のコネクタ端子１６の一部については、コネクタ端子１６の他方の端部に対応する位置に、第２導電部材３２が配されている。この第２導電部材３２には、コネクタ端子１６の他方の端部に対応する位置に、コネクタ端子１６の他方の端部が挿通される第２端子接続孔３６が、第２導電部材３２を貫通して形成されている。コネクタ端子１６の他方の端部は、第２端子接続孔３６内に挿通されて、半田付け等の公知の手法により、第２導電部材３２と電気的に接続されている。   As shown in FIG. 4, for a part of the plurality of connector terminals 16, the second conductive member 32 is disposed at a position corresponding to the other end of the connector terminal 16. In the second conductive member 32, a second terminal connection hole 36 through which the other end of the connector terminal 16 is inserted penetrates the second conductive member 32 at a position corresponding to the other end of the connector terminal 16. Is formed. The other end of the connector terminal 16 is inserted into the second terminal connection hole 36 and is electrically connected to the second conductive member 32 by a known method such as soldering.

また、図５に示すように、コネクタ端子１６の他の一部については、コネクタ端子１６の他方の端部に対応する位置に、回路基板１７が位置している。この回路基板１７には、コネクタ端子１６の他方の端部に対応する位置に、コネクタ端子１６の他方の端部が挿通される端子挿通孔３７が形成されている。さらに、コネクタ端子１６の他方の端部に対応する位置には、第１導電部材２２が配されている。この第１導電部材２２には、コネクタ端子１６の他方の端部に対応する位置に、第１端子接続孔３８が、第１導電部材２２を貫通して形成されている。コネクタ端子１６の他方の端部は、端子挿通孔３７及び第１端子接続孔３８内に挿通されて、半田付け等の公知の手法により、第１導電部材２２と電気的に接続されている。   As shown in FIG. 5, the circuit board 17 is located at a position corresponding to the other end of the connector terminal 16 for the other part of the connector terminal 16. A terminal insertion hole 37 through which the other end of the connector terminal 16 is inserted is formed in the circuit board 17 at a position corresponding to the other end of the connector terminal 16. Further, the first conductive member 22 is disposed at a position corresponding to the other end of the connector terminal 16. A first terminal connection hole 38 is formed in the first conductive member 22 so as to penetrate the first conductive member 22 at a position corresponding to the other end of the connector terminal 16. The other end of the connector terminal 16 is inserted into the terminal insertion hole 37 and the first terminal connection hole 38, and is electrically connected to the first conductive member 22 by a known technique such as soldering.

また、図６に示すように、開口部２４は、回路基板１７のうち図６における上端部寄りの位置であって、且つ図６における左右方向について略右半分の位置に、形成されている。回路基板１７のうち、開口部２４の左方の位置には、複数の基板側端子接続孔３９が回路基板１７を貫通して形成されている。この基板側端子接続孔３９には、詳細には図示しないが、コネクタ端子１６の他方の端部が挿通されて、半田付け等の公知の手法により、回路基板１７に形成された導電路と、電気的に接続される。   Further, as shown in FIG. 6, the opening 24 is formed at a position near the upper end portion in FIG. 6 of the circuit board 17 and at a substantially right half position in the left-right direction in FIG. 6. A plurality of board-side terminal connection holes 39 are formed through the circuit board 17 at a position on the left side of the opening 24 in the circuit board 17. Although not shown in detail in this board side terminal connection hole 39, the other end of the connector terminal 16 is inserted, and a conductive path formed in the circuit board 17 by a known method such as soldering, Electrically connected.

（製造工程）
続いて、本実施形態の製造工程の一例について説明する。まず、金属板材を鍛造、鋳造、プレス加工等、任意の手法により加工して、第１導電部材２２を形成する（図１０参照）。次いで、図１３に示すように、図１３の下側に位置する金型４０（以下、下型４０と記載する。）の上面（図１３における上面）に、第１導電部材２２を載置する。下型４０の上面には、第１導電部材２２を収容するためのキャビティ４１が形成されている。また、キャビティ４１の底面には、上方（図１３における上方）に突出する突出台４２が形成されている。この突出台４２の上面には、上方に突出する位置決め突起４３が形成されている。 (Manufacturing process)
Then, an example of the manufacturing process of this embodiment is demonstrated. First, the metal plate material is processed by an arbitrary method such as forging, casting, or pressing to form the first conductive member 22 (see FIG. 10). Next, as shown in FIG. 13, the first conductive member 22 is placed on the upper surface (the upper surface in FIG. 13) of the mold 40 (hereinafter referred to as the lower mold 40) located on the lower side of FIG. 13. . A cavity 41 for accommodating the first conductive member 22 is formed on the upper surface of the lower mold 40. Further, a projecting base 42 that projects upward (upward in FIG. 13) is formed on the bottom surface of the cavity 41. On the upper surface of the protruding base 42, a positioning protrusion 43 protruding upward is formed.

図１４に示すように、第１導電部材２２を、凸部２７を上方（図１４における上方）に向けた姿勢で、且つ金型挿通孔３１内に突出台４２が挿通された状態で、下型４０のキャビティ４１内に収容する。第１導電部材２２と、下型４０とは、突出台４２の外周面と、金型挿通孔３１の内周面とが当接することにより位置決めされてもよいし、また、第１導電部材２２の外縁と、キャビティ４１の内面とが当接することにより位置決めされてもよい。   As shown in FIG. 14, the first conductive member 22 is placed with the projection 27 facing upward (upward in FIG. 14) and with the protruding base 42 inserted into the mold insertion hole 31. It is accommodated in the cavity 41 of the mold 40. The first conductive member 22 and the lower mold 40 may be positioned by abutting the outer peripheral surface of the protruding base 42 and the inner peripheral surface of the mold insertion hole 31, or the first conductive member 22. The outer edge of the cavity 41 and the inner surface of the cavity 41 may be in contact with each other.

その後、第２導電部材３２を、図１４の矢線で示す方向から第１導電部材２２の上面に積層する。図１０には、第１導電部材２２と第２導電部材３２の積層状態を斜視図で示す。このとき、第２導電部材３２の第２端子接続孔３６内に、下型４０の位置決め突起４３を挿通する。これにより、第１導電部材２２と、第２導電部材３２との相対的な位置決めを行う。   Thereafter, the second conductive member 32 is laminated on the upper surface of the first conductive member 22 from the direction indicated by the arrow in FIG. FIG. 10 is a perspective view showing a stacked state of the first conductive member 22 and the second conductive member 32. At this time, the positioning protrusion 43 of the lower mold 40 is inserted into the second terminal connection hole 36 of the second conductive member 32. As a result, the first conductive member 22 and the second conductive member 32 are relatively positioned.

図１５に示すように、第２導電部材３２の上方（図１５における上方）から、上側に位置する金型４４（以下、上型４４と記載する。）を重ねる。これにより、下型４０と、上型４４との間に、第１導電部材２２及び第２導電部材３２が位置決めされた状態で挟まれる。その後、キャビティ４１内に絶縁性の合成樹脂材を充填してモールド成形を行う。これにより、第１導電部材２２と、第２導電部材３２とが、第２絶縁部３３を介して積層される。   As shown in FIG. 15, a mold 44 (hereinafter referred to as an upper mold 44) located on the upper side is stacked from above the second conductive member 32 (upper in FIG. 15). Thus, the first conductive member 22 and the second conductive member 32 are sandwiched between the lower mold 40 and the upper mold 44. Thereafter, the cavity 41 is filled with an insulating synthetic resin material and molded. Thereby, the first conductive member 22 and the second conductive member 32 are stacked via the second insulating portion 33.

図１１及び図１６に示すように、回路基板１７の裏面２１側から（図１１及び図１６において矢線で示す方向）、回路基板１７の開口部２４を塞ぐようにして、第１導電部材２２と第２導電部材３２とを積層したものを重ねる。その後、図示しない一対の金型内に収容して、絶縁性の合成樹脂材でモールド成形を行う。すると、基板側貫通孔２５及び導電部材側貫通孔２６の双方に、第１絶縁部２３が充填される。これにより、図１７に示すように、第１導電部材２２と第２導電部材３２とを積層したものと、回路基板１７とが積層された状態に組み付けられる。   As shown in FIGS. 11 and 16, from the back surface 21 side of the circuit board 17 (in the direction indicated by the arrow in FIGS. 11 and 16), the first conductive member 22 is closed so as to close the opening 24 of the circuit board 17. And the second conductive member 32 are stacked. After that, it is housed in a pair of molds (not shown) and molded with an insulating synthetic resin material. Then, both the substrate side through hole 25 and the conductive member side through hole 26 are filled with the first insulating portion 23. As a result, as shown in FIG. 17, the first conductive member 22 and the second conductive member 32 are laminated and the circuit board 17 is assembled.

その後、回路基板１７の表面１８に半導体リレー１９等を載置して、公知のリフロー半田付けを実行する。これにより、半導体リレー１９が回路基板１７に実装されて、回路構成体１２が完成する。   Thereafter, a semiconductor relay 19 or the like is placed on the surface 18 of the circuit board 17 and known reflow soldering is performed. Thereby, the semiconductor relay 19 is mounted on the circuit board 17, and the circuit structure 12 is completed.

一方、コネクタ端子１６を所定の形状に曲げ形成した後、合成樹脂材でモールド成形することにより、カバー１４を製造する。その後、カバー１４の裏面から回路構成体１２を積層し、コネクタ端子１６の端部を、それぞれ、基板側端子接続孔３９、第１端子接続孔３８、及び第２端子接続孔３６内に挿通する。ついで、公知のフロー半田付けにより、コネクタ端子１６と、回路基板１７、第１導電部材２２、及び第２導電部材３２とを電気的に接続する。   On the other hand, the cover 14 is manufactured by bending the connector terminal 16 into a predetermined shape and then molding the connector terminal 16 with a synthetic resin material. Thereafter, the circuit components 12 are stacked from the back surface of the cover 14, and the end portions of the connector terminals 16 are inserted into the board-side terminal connection holes 39, the first terminal connection holes 38, and the second terminal connection holes 36, respectively. . Next, the connector terminal 16 is electrically connected to the circuit board 17, the first conductive member 22, and the second conductive member 32 by known flow soldering.

その後、ケース本体１３の開口内に回路構成体１２を収容すると共に、ケース本体１３の側壁の端縁と、カバー１４の側壁の端縁とを、互いに当接された状態で超音波溶着によって接合する。これにより、ケース本体１３とカバー１４とは一体に組み付けられる。以上により、電気接続箱１０が完成する。   Thereafter, the circuit structural body 12 is accommodated in the opening of the case body 13 and the edge of the side wall of the case body 13 and the edge of the side wall of the cover 14 are joined by ultrasonic welding in a state of being in contact with each other. To do. Thereby, the case main body 13 and the cover 14 are assembled | attached integrally. Thus, the electrical junction box 10 is completed.

（作用、効果）
続いて、本実施形態の作用、効果について説明する。本実施形態によれば、回路基板１７と、第１導電部材２２とは、基板側貫通孔２５及び導電部材側貫通孔２６において、その内部に配された第１絶縁部２３によって、積層状態で組み付けられる。これにより、回路基板１７と、第１導電部材２２とは、両部材１７，２２が全面に亘って固定されている場合に比べて、その板面に平行な方向について、相対的に変位可能になっている。このため、周囲の温度変化によって、回路基板１７及び第１導電部材２２が、その板面に平行な方向について延びても、回路基板１７の延びた方向についての長さ寸法と、第１導電部材２２の延びた方向についての長さ寸法との差を、回路基板１７及び第１導電部材２２の板面に平行な方向に逃がすことができる。この結果、回路構成体１２が反ることを抑制できる。 (Function, effect)
Then, the effect | action and effect of this embodiment are demonstrated. According to the present embodiment, the circuit board 17 and the first conductive member 22 are stacked in the substrate-side through hole 25 and the conductive member-side through hole 26 by the first insulating portion 23 disposed therein. Assembled. Thereby, the circuit board 17 and the first conductive member 22 can be relatively displaced in the direction parallel to the plate surface as compared with the case where both the members 17 and 22 are fixed over the entire surface. It has become. Therefore, even if the circuit board 17 and the first conductive member 22 extend in the direction parallel to the plate surface due to a change in ambient temperature, the length dimension in the extending direction of the circuit board 17 and the first conductive member The difference from the length dimension in the extending direction of 22 can be released in a direction parallel to the circuit board 17 and the plate surface of the first conductive member 22. As a result, it is possible to suppress the circuit configuration body 12 from warping.

また、本実施形態によれば、モールド成形という簡易な手法により回路基板１７と第１導電部材２２とを積層状態で固定できる。   Further, according to the present embodiment, the circuit board 17 and the first conductive member 22 can be fixed in a stacked state by a simple technique called molding.

＜実施形態２＞
次に、本発明の実施形態２を、図１８を参照しつつ説明する。本実施形態においては、回路基板１７には基板側貫通孔５０が形成されている。基板側貫通孔５０の表側（図１８における左側）の開口部はやや径大に形成されている。また、第１導電部材２２には、基板側貫通孔５０に整合する位置に、導電部材側貫通孔５１が形成されている。導電部材側貫通孔５１の裏側（図１８における右側）の開口部はやや径大に形成されている。 <Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG. In the present embodiment, a substrate-side through hole 50 is formed in the circuit board 17. The opening on the front side (left side in FIG. 18) of the substrate side through hole 50 is formed with a slightly larger diameter. The first conductive member 22 has a conductive member side through hole 51 at a position aligned with the substrate side through hole 50. The opening on the back side (right side in FIG. 18) of the conductive member side through hole 51 is formed with a slightly larger diameter.

基板側貫通孔５０及び導電部材側貫通孔５１内には、合成樹脂製の樹脂ピン５２が貫通されている。そして、樹脂ピン５２の両端部は、加熱、加圧されることで圧潰されている。これにより、回路基板１７と、第１導電部材２２とは、隙間を有して積層された状態に保持されている。   In the substrate side through hole 50 and the conductive member side through hole 51, resin pins 52 made of synthetic resin are penetrated. The both ends of the resin pin 52 are crushed by being heated and pressurized. Thereby, the circuit board 17 and the first conductive member 22 are held in a stacked state with a gap.

上記以外の構成については、実施形態１と略同様なので、同一部材については同一符号を付し、重複する説明を省略する。   Since the configuration other than the above is substantially the same as that of the first embodiment, the same members are denoted by the same reference numerals, and redundant description is omitted.

本実施形態によれば、回路基板１７と第２導電部材３２とは隙間を有して積層されている。この結果、回路基板１７と第２導電部材３２との間には空気層５３が存在する。本実施形態においては、この空気層５３が第２絶縁部３３とされる。   According to the present embodiment, the circuit board 17 and the second conductive member 32 are stacked with a gap. As a result, an air layer 53 exists between the circuit board 17 and the second conductive member 32. In the present embodiment, the air layer 53 serves as the second insulating portion 33.

上記の態様によれば、樹脂ピン５２を基板側貫通孔５０及び導電部材側貫通孔５１の内部に挿通して圧潰するという簡易な手法により、回路基板１７と第１導電部材２２とを積層状態で固定できる。   According to the above aspect, the circuit board 17 and the first conductive member 22 are laminated by a simple method in which the resin pins 52 are inserted into the substrate side through holes 50 and the conductive member side through holes 51 and crushed. It can be fixed with.

また、上記の構成によれば、通電時に第１導電部材２２、及び第２導電部材３２で発生した熱は、比較的に熱伝導率の低い空気層５３によって遮断されて、回路基板１７に伝達することが抑制される。これより、回路基板１７に実装された電子部品が熱により不具合を生じることが抑制される。   Further, according to the above configuration, the heat generated in the first conductive member 22 and the second conductive member 32 during energization is blocked by the air layer 53 having a relatively low thermal conductivity and transmitted to the circuit board 17. Is suppressed. As a result, the electronic component mounted on the circuit board 17 is prevented from being defective due to heat.

＜他の実施形態＞
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
（１）第２導電部材３２は省略してもよい。
（２）基板側貫通孔２５及び導電部材側貫通孔２６の断面形状は、円形状に限らず、三角形状、長方形状等の多角形状としてもよく、また、長円形状、楕円形状等、必要に応じて任意の形状とすることができる。
（３）本実施形態においては、基板側貫通孔２５の内径と、導電部材側貫通孔２６の内径とは実質的に同じ寸法とされたが、これに限られず、異なる寸法としてもよい。
（４）第２絶縁部３３としては、絶縁性の接着剤、絶縁性の接着シート、絶縁性の粘着シート等、必要に応じて任意の絶縁性の材料を用いることができる。
（５）本実施形態においては、１つの第１導電部材２２が回路基板１７に組み付けられる構成としたが、これに限られず、複数の第１導電部材２２が回路基板１７に組み付けられる構成としてもよい。
（６）本実施形態においては、電子部品として半導体リレー１９を用いたが、これに限られず、機械式リレー、抵抗、コンデンサ等、必要に応じて任意の素子を用いることができる。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) The second conductive member 32 may be omitted.
(2) The cross-sectional shapes of the substrate-side through-hole 25 and the conductive member-side through-hole 26 are not limited to a circular shape, and may be a polygonal shape such as a triangular shape or a rectangular shape. It can be made into an arbitrary shape according to.
(3) In the present embodiment, the inner diameter of the substrate-side through hole 25 and the inner diameter of the conductive member-side through hole 26 are substantially the same, but the present invention is not limited to this, and may be different dimensions.
(4) As the 2nd insulating part 33, arbitrary insulating materials, such as an insulating adhesive agent, an insulating adhesive sheet, an insulating adhesive sheet, can be used as needed.
(5) In the present embodiment, one first conductive member 22 is assembled to the circuit board 17. However, the present invention is not limited to this, and a plurality of first conductive members 22 may be assembled to the circuit board 17. Good.
(6) Although the semiconductor relay 19 is used as an electronic component in the present embodiment, the present invention is not limited to this, and any element such as a mechanical relay, a resistor, a capacitor, or the like can be used as necessary.

１０…電気接続箱
１１…ケース
１２…回路構成体
１７…回路基板
２２…第１導電部材（導電部材）
２３…第１絶縁部（合成樹脂部材）
２５，５０…基板側貫通孔
２６，５１…導電部材側貫通孔
５２…樹脂ピン
DESCRIPTION OF SYMBOLS 10 ... Electrical junction box 11 ... Case 12 ... Circuit structure 17 ... Circuit board 22 ... 1st electroconductive member (conductive member)
23 ... 1st insulation part (synthetic resin member)
25, 50 ... Substrate side through hole 26, 51 ... Conductive member side through hole 52 ... Resin pin

Claims (3)

回路基板と、金属板材からなると共に前記回路基板の一方の面に積層された導電部材と、を備えた回路構成体であって、
前記回路基板には基板側貫通孔が形成されており、前記導電部材には前記回路基板に積層された状態で前記基板側貫通孔に対応する位置に導電部材側貫通孔が形成されており、前記基板側貫通孔及び前記導電部材側貫通孔の内部には前記基板側貫通孔及び前記導電部材側貫通孔を貫通して前記回路基板と前記導電部材とを積層状態で組み付ける合成樹脂部材が配されており、
前記合成樹脂部材は、前記回路構成体と前記導電部材とを積層した状態でモールド成形してなり、
前記回路基板には開口部が貫通して形成されており、前記導電部材は前記開口部を塞ぐように配設されており、前記開口部内には前記導電部材の少なくとも一部が配されていることを特徴とする回路構成体。 A circuit structure comprising a circuit board and a conductive member made of a metal plate and laminated on one surface of the circuit board,
A board side through hole is formed in the circuit board, and a conductive member side through hole is formed at a position corresponding to the board side through hole in the state where the conductive member is stacked on the circuit board, Inside the substrate side through hole and the conductive member side through hole is a synthetic resin member that penetrates the substrate side through hole and the conductive member side through hole and assembles the circuit board and the conductive member in a stacked state. Has been
The synthetic resin member is molded in a state where the circuit component and the conductive member are laminated,
An opening is formed through the circuit board, the conductive member is disposed so as to close the opening, and at least a part of the conductive member is disposed in the opening. A circuit structure characterized by that. 回路基板と、金属板材からなると共に前記回路基板の一方の面に積層された導電部材と、を備えた回路構成体であって、A circuit structure comprising a circuit board and a conductive member made of a metal plate and laminated on one surface of the circuit board,
前記回路基板には基板側貫通孔が形成されており、前記導電部材には前記回路基板に積層された状態で前記基板側貫通孔に対応する位置に導電部材側貫通孔が形成されており、前記基板側貫通孔及び前記導電部材側貫通孔の内部には前記基板側貫通孔及び前記導電部材側貫通孔を貫通して前記回路基板と前記導電部材とを積層状態で組み付ける合成樹脂部材が配されており、  A board side through hole is formed in the circuit board, and a conductive member side through hole is formed at a position corresponding to the board side through hole in the state where the conductive member is stacked on the circuit board, Inside the substrate side through hole and the conductive member side through hole is a synthetic resin member that penetrates the substrate side through hole and the conductive member side through hole and assembles the circuit board and the conductive member in a stacked state. Has been
前記合成樹脂部材は、前記基板側貫通孔及び前記導電部材側貫通孔の内部に挿通された樹脂ピンであり、  The synthetic resin member is a resin pin inserted through the substrate side through hole and the conductive member side through hole,
前記回路基板には開口部が貫通して形成されており、前記導電部材は前記開口部を塞ぐように配設されており、前記開口部内には前記導電部材の少なくとも一部が配されていることを特徴とする回路構成体。  An opening is formed through the circuit board, the conductive member is disposed so as to close the opening, and at least a part of the conductive member is disposed in the opening. A circuit structure characterized by that. ケース内に、請求項１または請求項２に記載の回路構成体を収容してなることを特徴とする電気接続箱。An electrical junction box, wherein the circuit structure according to claim 1 or 2 is accommodated in a case.

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